WO2017076329A1 - 一种tec散热组件及投影装置 - Google Patents

一种tec散热组件及投影装置 Download PDF

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Publication number
WO2017076329A1
WO2017076329A1 PCT/CN2016/104595 CN2016104595W WO2017076329A1 WO 2017076329 A1 WO2017076329 A1 WO 2017076329A1 CN 2016104595 W CN2016104595 W CN 2016104595W WO 2017076329 A1 WO2017076329 A1 WO 2017076329A1
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WO
WIPO (PCT)
Prior art keywords
tec
heat
plate
cooling
chip
Prior art date
Application number
PCT/CN2016/104595
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English (en)
French (fr)
Inventor
邓高飞
林伟
李锦清
Original Assignee
深圳市光峰光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 深圳市光峰光电技术有限公司 filed Critical 深圳市光峰光电技术有限公司
Priority to JP2018522682A priority Critical patent/JP6592601B2/ja
Priority to US15/772,397 priority patent/US20180320937A1/en
Publication of WO2017076329A1 publication Critical patent/WO2017076329A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/0407—Liquid cooling, e.g. by water
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023—Mounting details thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0252—Removal of heat by liquids or two-phase fluids

Definitions

  • the present application relates to a heat dissipating device, and more particularly to a heat dissipating component and a projection device with a TEC as a core.
  • the core components of the heat sink are mostly TEC cooling chips.
  • the cooling condition of the TEC hot surface determines its cooling performance. The lower the hot surface temperature, the greater the cooling capacity. Therefore, it is especially important to make the heat dissipation design of the TEC hot surface.
  • the existing TEC refrigeration scheme as shown in FIG. 1, has two layers of thermal paste and a transfer mounting plate 303 between the hot surface of the TEC chip 302 and the water-cooled plate 304, and the thermal resistance of the installation is compared. Big. Moreover, the contact area between the adapter mounting plate 303 and the water-cooling plate 304 is relatively large, and the flatness of each of the adapter plates 303 is difficult to control, and the thick thermal grease is filled during the actual installation, resulting in a large thermal resistance of the interface. When the ambient temperature rises to a high temperature of 35 ° C, the device does not satisfy the heat dissipation requirement of the heat source substrate 2.
  • the utility model provides a TEC heat dissipating component and a projection device, which solves the problems of large thermal resistance and poor heat dissipation effect of the existing TEC heat dissipating component interface.
  • a TEC heat sink assembly comprising:
  • a TEC refrigeration module comprising: a TEC cooling chip, a mounting plate for fixing the TEC cooling chip, and a cold water plate for cooling the TEC cooling chip on a heating surface side of the TEC cooling chip;
  • a cover plate for covering the TEC refrigeration module and the heat source substrate
  • the surface of the mounting board is provided with a hollow window for matching the shape of the TEC cooling chip, and the heating surface of the TEC cooling chip is in contact with the cold water plate through the mounting plate, and the cooling chip is cooled.
  • the heat source substrate to be cooled is attached to the other side of the hollow window.
  • the surface of the heat source substrate is further provided with a temperature equalizing plate for uniformly radiating heat of the heat source substrate, wherein the temperature equalizing plate contacts one of the heat generating regions on the heat source substrate, and the other surface is adjacent to the TEC
  • the cooling surface of the chip is in contact, and the surface of the surface of the temperature equalizing plate is a plane that matches the cooling surface of the TEC cooling chip.
  • the TEC heat dissipating component wherein a heating surface of the TEC cooling chip and a surface of the cold water plate are contacted by a coating of a heat conductive material.
  • the TEC heat dissipating component wherein a side surface of the cooling surface of the TEC cooling chip is in contact with the surface of the temperature equalizing plate by a coating of a heat conductive material.
  • the TEC heat dissipating component wherein a coating of a heat conductive material is applied between the surface of the temperature equalizing plate and the surface of the heat source substrate.
  • the TEC heat dissipating component wherein the heat source substrate is provided with a spring bolt, and the surface of the temperature equalizing plate is provided with a screw hole adapted to the spring bolt.
  • the TEC heat dissipating component wherein the TEC cooling chip is disposed on the surface of the mounting board.
  • the TEC heat dissipating component wherein the mounting plate surface is provided with a plurality of hollow windows corresponding to the TEC cooling chip.
  • a plurality of the temperature equalizing plates on the heat source substrate are corresponding to the TEC cooling chip.
  • the TEC heat dissipating component wherein a sealing ring is further disposed between the mounting plate and the cold water plate, and the mounting plate is further provided with a closing groove for mounting a sealing ring toward a side surface of the cold water plate.
  • a projection device comprising the TEC heat dissipation assembly described above.
  • the projection device wherein the heat source substrate comprises a laser light source.
  • the utility model provides a TEC heat dissipating component and a projection device, which adopts a structural design in which a TEC cooling chip directly contacts a water-cooled plate, shortens a heat conduction distance between the TEC cooling chip and the water-cooled plate, and reduces thermal resistance; A temperature equalizing plate is added between the cooling chip and the heat source substrate, which avoids the heat dissipation effect of the cooling surface of the TEC cooling chip due to uneven heating and cooling, and effectively prolongs the service life of the device.
  • FIG. 1 is a schematic structural view of a conventional TEC heat dissipating component
  • FIG. 2 is a schematic structural view of a TEC heat dissipation assembly according to an embodiment of the present invention.
  • the TEC heat dissipating component provided in this embodiment, as shown in FIG. 2, includes a TEC cooling module, and the TEC cooling module includes a TEC cooling chip 63 for fixing the mounting plate 62 of the TEC cooling chip 63, and a cold water plate 64 for cooling the TEC cooling chip 63 on the heating surface side of the TEC cooling chip 63, and a cover plate 4 provided with a cavity for accommodating the heat source substrate 51, the cover plate 4, the cold water plate 64 can be fixedly connected by bolts; the surface of the mounting plate 62 is provided with the outer shape of the TEC cooling chip 63, and the heat generating surface of the TEC cooling chip 63 is contacted with the cold water plate 64 through the mounting plate 62.
  • the cooling surface of the cooling chip 63 is adjacent to the heat source substrate 51 to be cooled on the other side of the hollow window 620.
  • the TEC cooling chip 63 can be embedded in the hollow window 620 such that its heat generating surface directly contacts the surface of the cold water plate 64.
  • the surface of the cold water plate 64 and the heat generating surface of the TEC cooling chip 63 are ensured in contact with the surface of the integral mounting plate 62 in contact with the cold water plate 64. The flatness between the two is easier to achieve.
  • the TEC cooling chip 63 directly contacts the cold water plate 64, which undoubtedly shortens the path of heat transfer, so that the heating surface of the TEC cooling chip can be quickly cooled down, and the cooling efficiency is improved.
  • the heat generating surface of the TEC cooling core 63 and the surface of the cold water plate 64 are contacted by a coating of a heat conductive material, such as a thermal grease.
  • a defect of the existing TEC heat dissipating component is that the cooling surface of the TEC cooling chip 63 is in direct contact with the heat source substrate 51, and the surface of the heat source substrate 51 has a groove, so that direct contact causes the cooling surface of the TEC cooling chip 63 to contact with the heat source substrate 51.
  • the temperature is low, and the temperature at which the contact is not high is high, which may cause the cooling performance of the TEC refrigeration chip 63 to decrease, resulting in poor heat dissipation of the device and reducing its service life.
  • the surface of the heat source substrate 51 is further provided with a temperature equalizing plate 510, and the temperature equalizing plate 510 contacts the heat generating region of the heat source substrate 51 to uniformly heat the heat source substrate 51. Conducted on the temperature equalizing plate 510, the other surface of the temperature equalizing plate 510 is in contact with the cooling surface of the TEC cooling chip 63, and the heat exchange between the cooling surface of the TEC cooling chip 63 and the temperature equalizing plate 510 serves to lower the temperature of the heat source substrate.
  • the surface of the temperature equalizing plate 510 is a plane that coincides with the surface of the TEC cooling chip 63.
  • a spring bolt 511 is disposed at each of the four corners of the heat source substrate 51, and a surface of the temperature equalizing plate 510 is provided with a screw hole 512 adapted to the spring bolt 511.
  • a coating of the heat conductive material is filled between the temperature equalizing plate 510 and the heat source substrate 51 such that the temperature of the surface of the heat source substrate 51 is uniformly conducted to the surface of the temperature equalizing plate 510.
  • the TEC cooling chip 63 may be correspondingly disposed on the surface of the mounting plate 62.
  • the surface of the mounting plate 62 and each TEC cooling chip are provided.
  • 63 respectively set a plurality of hollow windows 620.
  • a plurality of temperature equalizing plates 510 are provided on the surface of the heat source substrate 51 for each heat source. The position of the temperature equalizing plate 510, the hollow opening window 620, and the TEC cooling chip 63 are one-to-one correspondence.
  • a sealing ring 621 is further disposed between the mounting plate 62 and the cold water plate, and a sealing groove 622 for mounting the sealing ring 621 is further disposed on a surface of the mounting plate 62 facing the cold water plate 64.
  • mounting holes are provided at the edges of the cold water plate 64, the mounting plate 62, and the cover plate 4.
  • the sealing ring 621 is placed in the closing recess 622, and the heat-generating surface of the heating surface of the TEC cooling chip 63 is coated with the thermal grease, and embedded in the hollow window 620 of the mounting plate 62, and the mounting plate is placed.
  • the surface of the cold water plate 64 is such that the heat generating surface of the TEC cooling chip 63 and the surface of the cold water plate 64 are in good contact by the thermal grease.
  • a thermal grease is applied to the cooling surface of the TEC cooling chip 63, and the heat source substrate 51 on which the temperature equalizing plate 510 is assembled is placed on the other side of the mounting plate 62, so that the cooling surface of the TEC cooling chip 63 passes through the thermal grease and both.
  • the warm plate 510 is in good contact, and finally the cover plate 4 is closed, and the bolt is screwed, and the cover plate 4, the mounting plate 62 and the water-cooling plate 64 are fixedly connected to form a closed space, so that the internal components are not in direct contact with the outside air. To avoid the formation of condensed water.
  • the present invention further provides a projection device, which includes the TEC heat dissipating component given in the above embodiment, and the heat source for dissipating the heat dissipating component may be the laser source of the projector in this embodiment. It can also be other components.
  • the utility model provides a TEC heat dissipating component and a projection device, which adopts a structural design in which a TEC cooling chip directly contacts a water-cooled plate, shortens a heat conduction distance between the TEC cooling chip and the water-cooled plate, and reduces thermal resistance; A temperature equalizing plate is added between the cooling chip and the heat source substrate, which avoids the heat dissipation effect of the cooling surface of the TEC cooling chip due to uneven heating and cooling, and effectively prolongs the service life of the device.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Lasers (AREA)
  • Projection Apparatus (AREA)

Abstract

一种TEC散热组件，包括TEC制冷模组，TEC制冷模组包括TEC制冷芯片（63）、用于固定TEC制冷芯片（63）的安装板（62）、位于TEC制冷芯片（63）发热面一侧、用于冷却TEC制冷芯片（63）的冷水板（64），用于封盖TEC制冷模组与热源基板（51）的盖板（4）；安装板（62）表面设有与TEC制冷芯片（63）外形相契合、用于TEC制冷芯片（63）发热面透过安装板（62）与冷水板（64）接触的镂空开窗（620），制冷芯片（63）制冷面于镂空开窗（620）另一侧贴近需冷却的热源基板（51）。还提供一种包括TEC散热组件的投影装置。其中，缩短了TEC制冷芯片（63）与水冷板（64）之间的热传导距离，降低了热阻；避免了TEC制冷芯片（63）制冷面由于冷热不均导致的散热效果差，有效延长了使用寿命。

Description

一种TEC散热组件及投影装置 技术领域
本申请涉及一种散热装置，尤其涉及一种以TEC为核心的散热组件及投影装置。
背景技术
随着科技的提升，越来越多的高集成高精密的电子元器件被开发使用，例如激光器，该类元器件工作时对散热条件要求非常高，其基板温度有时会要求维持在20℃左右（一般低于环境温度），这种尺寸小，需要精确控制环境温度的电子产品，其散热装置核心部件绝大多数要使用TEC制冷芯片。而TEC热面的散热状况决定了其制冷性能，热面温度越低，其制冷量就越大，因此做好TEC热面的散热设计就显得尤为重要。
 技术问题
现有的TEC制冷方案，如图1所示，TEC芯片302热面与水冷板304之间有两层导热膏和一个转接安装板303，再加上安装热阻，其总热阻会比较大。并且转接安装板303与水冷板304接触面积比较大，各自的平面度不易控制，实际安装时会填充较厚导热膏，导致界面热阻较大。当环境温度上升至35℃高温时，该套装置就满足不了热源基板2的散热需求。
 技术解决方案
本实用新型提供一种TEC散热组件及投影装置，诣在解决现有TEC散热组件界面热阻大，散热效果差的问题。
一种TEC散热组件，包括：
TEC制冷模组，所述TEC制冷模组包括TEC制冷芯片，用于固定所述TEC制冷芯片的安装板，及位于TEC制冷芯片发热面一侧、用于冷却所述TEC制冷芯片的冷水板；
用于封盖所述TEC制冷模组与热源基板的盖板；
其中，所述安装板表面设有与所述TEC制冷芯片外形相契合、用于所述TEC制冷芯片发热面透过所述安装板与所述冷水板接触的镂空开窗，所述制冷芯片制冷面于所述镂空开窗另一侧贴近需冷却的热源基板。
所述的TEC散热组件，其中，所述热源基板表面还设有一将热源基板热量均匀导出的均温板，所述均温板一面接触所述热源基板上的发热区，另一面于所述TEC芯片制冷面接触，并且所述均温板该面的表面为与所述TEC制冷芯片制冷面相契合的平面。
所述的TEC散热组件，其中，所述TEC制冷芯片发热面与所述冷水板表面之间通过导热材料涂层相接触。
所述的TEC散热组件，其中，所述TEC制冷芯片制冷面一侧表面通过导热材料涂层与所述均温板表面接触。
所述的TEC散热组件，其中，所述均温板表面与所述热源基板表面之间涂布导热材料涂层。
所述的TEC散热组件，其中，所述热源基板设有弹簧螺栓，所述均温板表面设有与所述弹簧螺栓相适配的螺孔。
所述的TEC散热组件，其中，所述TEC制冷芯片于所述安装板表面设置多个。
所述的TEC散热组件，其中，所述安装板表面与所述TEC制冷芯片相对应的设置多个镂空开窗。
所述的TEC散热组件，其中，所述热源基板上的均温板与所述TEC制冷芯片相对应的设置多个。
所述的TEC散热组件，其中，所述安装板与所述冷水板之间还设有密封圈，所述安装板朝向所述冷水板一侧表面还设有用于安装密封圈的封闭凹槽。
一种投影装置，所述投影装置包括以上所述的TEC散热组件。
所述的投影装置，其中，所述热源基板包括激光光源。
 有益效果
本实用新型所给出的一种TEC散热组件及投影装置，采用TEC制冷芯片与水冷板直接接触的结构设计，缩短了TEC制冷芯片与水冷板之间的热传导距离，降低了热阻；在TEC制冷芯片与热源基板之间增设均温板，避免了TEC制冷芯片制冷面由于冷热不均导致的散热效果差，并有效的延长了设备的使用寿命。
 附图说明
图1为现有TEC散热组件结构示意图；
图2为本实用新型实施例中TEC散热组件的结构示意图。
 本发明的最佳实施方式
下面通过具体实施方式结合附图对本申请作进一步详细说明。
本实施例所提供的TEC散热组件，如图2所示，包括，TEC制冷模组，所述TEC制冷模组包括TEC制冷芯片63，用于固定所述TEC制冷芯片63的安装板62，及位于TEC制冷芯片63发热面一侧、用于冷却所述TEC制冷芯片63的冷水板64；盖板4，所述盖板4设有用于收容所述热源基板51的空腔，所述盖板4与所述冷水板64可通过螺栓固定连接；安装板62表面设有与TEC制冷芯片63外形相契合、用于TEC制冷芯片63的发热面透过安装板62与冷水板64接触的镂空开窗620，制冷芯片63的制冷面于镂空开窗620另一侧贴近需冷却的热源基板51。采用这样的结构设计，TEC制冷芯片63可嵌入镂空开窗620中，使其发热面直接接触冷水板64表面。只要保证冷水板64表面与TEC制冷芯片63发热面表面之间的平整度即可，相对整块安装板62表面与冷水板64接触来说，保证冷水板64表面与TEC制冷芯片63发热面表面之间的平整度更容易实现。并且，TEC制冷芯片63直接接触冷水板64，无疑缩短了热传递的路径，使得TEC制冷芯片的发热面能够快速冷却下来，提高制冷效率。所述TEC制冷芯63的发热面与所述冷水板64的表面之间通过导热材料涂层相接触，如采用导热硅脂等。
进一步地，现有的TEC散热组件一个缺陷是TEC制冷芯片63制冷面与热源基板51直接接触，而热源基板51表面有沟槽，这样直接接触会造成TEC制冷芯片63制冷面与热源基板51接触处温度低，接触不到之处温度较高，会导致TEC制冷芯片63制冷性能下降，造成器件散热状况变差，缩减其使用寿命。为避免该问题的出现，本实施例中，所述热源基板51表面还设有一均温板510，所述均温板510一面接触热源基板51的发热区，将热源基板51上的热量均匀的传导到均温板510上，均温板510的另一面与TEC制冷芯片63的制冷面接触，通过TEC制冷芯片63的制冷面与均温板510之间的热交换，起到降低热源基板温度的作用。所述均温板510表面设为与TEC制冷芯片63表面相契合的平面。这样就保证了TEC制冷芯片63制冷面与均温板510表面完全接触，避免了因接触不均导致的冷热不均。具体地，所述热源基板51四个转角处均设有弹簧螺栓511，所述均温板510表面设有与所述弹簧螺栓511相适配的螺孔512。均温板510与热源基板51之间填充导热材料涂层，使得热源基板51表面的温度均匀传导到均温板510表面。
较佳地，当热源基板51上设有多个发热区域时，所述TEC制冷芯片63可以于所述安装板62表面对应地设置多个，同样的，安装板62表面与每个TEC制冷芯片63分别对应的设置多个镂空开窗620。并且对应每一个热源，在热源基板51表面设有多个均温板510。使得均温板510、镂空开窗620、以及TEC制冷芯片63位置一一对应。所述安装板62与所述冷水板之间还设有密封圈621，所述安装板62朝向所述冷水板64一侧表面还设有用于安装密封圈621的封闭凹槽622。采用这样的结构设计，由TEC制冷芯片63两侧的导热硅脂，以及密封圈621就使得TEC制冷芯片63在镂空开窗620内完全被密封。
进一步地，冷水板64、安装板62及盖板4的边缘处均设有安装孔。装配TEC制冷模组时，将密封圈621放入封闭凹槽622内，再将TEC制冷芯片63发热面涂布导热硅脂，并嵌入安装板62的镂空开窗620内，将安装板放置在冷水板64表面，使得TEC制冷芯片63的发热面与冷水板64的表面通过导热硅脂良好接触。再于TEC制冷芯片63的制冷面涂布导热硅脂，将装配好均温板510的热源基板51放置于安装板62的另一侧，使得TEC制冷芯片63的制冷面通过导热硅脂与均温板510接触良好，最后盖上盖板4，并旋拧螺栓，将盖板4、安装板62及水冷板64三者固定连接，构成一个密闭的空间，使得内部元件与外界空气不直接接触，避免冷凝水的形成。
基于上述实施例的描述，本实用新型还提出一种投影装置，该投影装置包以上实施例所给出的TEC散热组件，该散热组件进行散热的热源可以是本实施例中投影仪的激光光源，也可以是其他元器件。
本实用新型所给出的一种TEC散热组件及投影装置，采用TEC制冷芯片与水冷板直接接触的结构设计，缩短了TEC制冷芯片与水冷板之间的热传导距离，降低了热阻；在TEC制冷芯片与热源基板之间增设均温板，避免了TEC制冷芯片制冷面由于冷热不均导致的散热效果差，并有效的延长了设备的使用寿命。
以上内容是结合具体的实施方式对本申请所作的进一步详细说明，不能认定本申请的具体实施只局限于这些说明。对于本申请所属技术领域的普通技术人员来说，在不脱离本申请发明构思的前提下，还可以做出若干简单推演或替换。

Claims (9)

1. 一种TEC散热组件，包括：
TEC制冷模组，所述TEC制冷模组包括TEC制冷芯片，用于固定所述TEC制冷芯片的安装板，及位于TEC制冷芯片发热面一侧、用于冷却所述TEC制冷芯片的冷水板；
用于封盖所述TEC制冷模组与热源基板的盖板；
其特征在于，所述安装板表面设有与所述TEC制冷芯片外形相契合、用于所述TEC制冷芯片发热面透过所述安装板与所述冷水板接触的镂空开窗，所述制冷芯片制冷面于所述镂空开窗另一侧贴近需冷却的热源基板。
2. 如权利要求1所述的TEC散热组件，其特征在于，所述热源基板表面还设有一将热源基板热量均匀导出的均温板，所述均温板一面接触所述热源基板上的发热区，另一面于所述TEC芯片制冷面接触，并且所述均温板该面的表面为与所述TEC制冷芯片制冷面相契合的平面。
3. 如权利要求1或2所述的TEC散热组件，其特征在于，所述TEC制冷芯片发热面与所述冷水板表面之间通过导热材料涂层相接触。
4. 如权利要求2所述的TEC散热组件，其特征在于，所述TEC制冷芯片制冷面一侧表面与所述均温板表面之间和/或所述均温板表面与所述热源基板表面之间涂布有导热材料涂层。
5. 如权利要求2所述的TEC散热组件，其特征在于，所述热源基板设有弹簧螺栓，所述均温板表面设有与所述弹簧螺栓相适配的螺孔。
6. 如权利要求2所述的TEC散热组件，其特征在于，所述TEC制冷芯片、所述安装板表面的多个镂空开窗及所述均温板一一对应地设有多个。
7. 如权利要求4-6任意一项所述的TEC散热组件，其特征在于，所述安装板与所述冷水板之间还设有密封圈，所述安装板朝向所述冷水板一侧表面还设有用于安装密封圈的封闭凹槽。
8. 一种投影装置，其特征在于，所述投影装置包括权利要求1-7任意一项所述的TEC散热组件。
9. 如权利要求8所述的投影装置，其特征在于，所述热源基板包括激光光源。
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