WO2018218801A1 - 换热器及投影设备 - Google Patents

换热器及投影设备 Download PDF

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Publication number
WO2018218801A1
WO2018218801A1 PCT/CN2017/100574 CN2017100574W WO2018218801A1 WO 2018218801 A1 WO2018218801 A1 WO 2018218801A1 CN 2017100574 W CN2017100574 W CN 2017100574W WO 2018218801 A1 WO2018218801 A1 WO 2018218801A1
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WO
WIPO (PCT)
Prior art keywords
heat
tec
screw
heat exchanger
connecting member
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Application number
PCT/CN2017/100574
Other languages
English (en)
French (fr)
Inventor
邓高飞
刘宪
王则钦
周正平
李屹
Original Assignee
深圳市光峰光电技术有限公司
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Application filed by 深圳市光峰光电技术有限公司 filed Critical 深圳市光峰光电技术有限公司
Publication of WO2018218801A1 publication Critical patent/WO2018218801A1/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/16—Cooling; Preventing overheating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors

Definitions

  • the present invention relates to the field of optical heat dissipation technologies, and in particular, to a heat exchanger and a projection apparatus including the heat exchanger.
  • the substrate temperature needs to be lower than the ambient temperature to achieve heat dissipation. Therefore, the substrate temperature is sometimes required to be maintained at about 20 °C.
  • Semiconductor cooler Thermal Energy Converter, TEC.
  • the entire heat dissipation module is divided into two parts by the TEC: the low temperature component in contact with the cold surface of the TEC, and the high temperature component in contact with the hot surface of the TEC, and the low temperature component and the high temperature must be used as much as possible in the heat dissipation design.
  • the components are isolated and cannot be shorted by heat or cold, so that the TEC can work efficiently.
  • the two power supply lines of the TEC need to be internally led out, and a sufficiently large through-hole hole must be designed to lead the power supply line, and when the power supply line passes through, there is a gap between the through-hole and the power supply line.
  • the surrounding hot air will penetrate into the interior. Since the substrate temperature of these components is lower than the ambient temperature, when the air humidity is high, condensed water may be generated inside the module, and the condensed water may damage these devices and the TEC. It is especially important to do the sealing and anti-condensation design of the module.
  • the technical problem to be solved by the present invention is to provide a heat exchanger and a projection device to solve the short circuit problem between the hot and cold components of the heat exchanger in the prior art, and at the same time have good sealing dustproof and anti-condensation capability. .
  • a technical solution adopted by the present invention is to provide a heat exchanger including a housing having a receiving space, a heat source housed in the housing, a cooling module, and the cooling module and the a connector of the housing, the cooling module includes a heat dissipation plate and a TEC chip for realizing heat transfer, the TEC chip is connected to the heat dissipation plate at one end, and the other end is connected to the heat source, and one end of the connection member Connected to the housing, one end is abutted against the heat dissipation plate, and the connecting member is provided with a step extending toward the TEC chip, the step portion abutting the TEC chip, and the heat source and/or the heat dissipation plate Interval setting.
  • the connecting member extends toward a side of the heat dissipation plate toward the TEC chip to form the step portion, and the step portion abuts the TEC chip on a side close to the heat dissipation plate, and The heat source is spaced apart.
  • the connecting member extends toward a side of the heat source toward the TEC chip to form the step portion, and the step portion abuts the TEC chip on a side close to the heat source, and is Heat sink spacing settings.
  • the connecting member extends toward the TEC chip to form the step portion, and the step portion abuts against a center of the TEC chip and is spaced apart from the heat source and the heat dissipation plate.
  • the TEC chip includes a relatively disposed hot surface and a cold surface, the cold surface is abutted against the heat source, the hot surface is abutted against the heat dissipation plate, and the heat dissipation plate and the TEC chip are A thermal interface material is disposed between the hot faces.
  • the heat dissipation plate is a cold plate
  • the heat source is a light source housed in the receiving space, and the light source is suspended upside down on the connecting member.
  • the connecting member is provided with a protruding stud, and the light source is fixed on the stud by a step screw, the step screw comprises a first screw and a second screw protruding from the first screw The diameter of the second screw is smaller than the diameter of the first screw, and the thread of the step screw is disposed on the second screw.
  • a heat insulating gasket is disposed between the step screw and the stud, and the heat insulating gasket surrounds the second screw and abuts against the first screw.
  • the connecting member and the housing form a heat insulating cavity
  • the heat exchanger comprises a first PCB board and a second PCB board inside the heat insulating cavity for electrically connecting the TEC chip and an external power source. And an adapter connecting the first PCB board and the second PCB board.
  • a sealing layer of a high temperature curing layer is disposed at a mounting gap of the adapter and the connecting member, and a sealing ring is disposed between the housing and the connecting member.
  • the present invention also provides a technical solution of providing a projection apparatus including the heat exchanger as described above.
  • the invention has the beneficial effects that the heat exchanger is provided on the heat exchanger, and the step portion is disposed on the side of the TEC chip to resist the TEC chip, and is different from the prior art.
  • the heat source and/or the heat sink are disposed at intervals, so that the step portion contacts the cold surface and the hot surface of the TEC chip at different times, which can effectively avoid the short circuit phenomenon of the TEC hot and cold surface, improve the cooling efficiency of the TEC, and have a good user experience.
  • Figure 1 is a schematic exploded view of the heat exchanger of the present invention
  • Figure 2 is a cross-sectional view of the heat exchanger of the present invention.
  • Figure 3 is a cross-sectional view of another angle of the heat exchanger of the present invention.
  • FIG. 4 is a schematic view showing the structure of a heat conducting member of the heat exchanger of the present invention.
  • the invention provides a heat exchanger and a projection device using the heat exchanger, so as to solve the short circuit problem between the hot and cold parts of the heat exchanger in the prior art, and at the same time have good sealing dustproof and anti-condensation ability. .
  • the heat exchanger of the present invention comprises a housing 1, a heat source 2, a connecting member 3, a refrigeration module 4, and a conductive member 5.
  • the housing 1 has a receiving space, and the connecting member 3 is used for connecting the housing 1 and the cooling module 4 such that the cooling module 4 is fixed to the housing 1.
  • the connecting member 3 and the housing 1 together form a heat insulating cavity, and the heat source 2 is housed in the heat insulating cavity and abuts against the cooling module 4 to exchange heat with the outside through the refrigeration module 4.
  • the housing 1 includes a metal cover 11 that is hollow at the top and a cover glass 12 that is attached to the hollow portion of the metal cover 11.
  • the metal cover 11 is an aluminum cover.
  • a cover plate of other materials such as a copper cover or stainless steel may be used.
  • the heat source 2 is a light source that is suspended upside down on the connector 3.
  • a component whose heat source is a relatively large amount of heat such as a DMD chip.
  • the connector 3 is made of aluminum, and in another alternative embodiment, it may be made of copper, stainless steel, or PU (polyurethane).
  • the cooling module 4 includes a TEC chip 401 for realizing heat transfer and a heat dissipation plate 402 for dissipating heat.
  • One end of the TEC chip 401 is in contact with the heat dissipation plate 402, and the other end is in contact with the heat source 2.
  • the heat sink 402 is a cold plate, and in other alternative embodiments, other heat sinks may be used.
  • a heat conducting interface material that promotes heat conduction is disposed between the heat sink 402 and the hot surface of the TEC chip 401.
  • the cold surface 4012 is disposed toward the heat source 2 to absorb the heat generated by the heat source 2 and transmitted to the hot surface; the hot surface 4011 is disposed toward the heat sink 402, thereby receiving the heat transferred by the cold surface 4012 and radiating through the heat sink 402.
  • a heat dissipation channel for the heat source 2 is formed.
  • a sealing ring 6 is further disposed between the connecting member 3 and the housing 1 and the connecting member 3 and the refrigerating module 4 to form a relatively sealed environment inside the heat exchanger to prevent external gas from entering the inside. Condensation into moisture affects the performance of the product.
  • One end of the connecting member 3 is connected to the housing 1 , and one end thereof is abutted against the heat dissipation plate 402 .
  • a step portion 31 extending toward the TEC chip 401 is disposed, and the step portion 31 is adjacent to the heat dissipation plate 402 .
  • One side of the TEC chip 401 is abutted and spaced apart from the heat source to accurately position the TEC chip 401.
  • the step portion 31 abuts the TEC chip 401 at a position of the hot surface 4011 of the TEC chip 401, and the thickness of the step portion 31 is smaller than the thickness of the TEC chip 401, so that the connecting member 3 is fixed.
  • the step portion 31 of the TEC chip 401 is spaced apart from the cold surface 4012 and does not come into contact with the cold surface 4012, thereby avoiding short-circuiting of the cold and hot parts.
  • the cold surface 4012 and the hot surface 4011 of the TEC chip 401 are further provided with a heat insulating material and a sealant to prevent self-short-circuiting of the hot and cold surfaces around the TEC chip.
  • the connecting member 3 is provided with a stud 32 which is convexly disposed toward the heat source 2, and the heat source 2 is fixed to the stud 32 by a step screw 7.
  • the step screw 7 includes a first screw 71 and a second screw 72 projecting from the first screw 71, wherein the diameter of the first screw 71 is larger than the diameter of the second screw 72.
  • only the second screw 72 is provided with a thread, specifically an external thread, and the first screw 71 is inserted into the screw hole of the heat source 2 for fixing with the heat source 2, and the second screw 72 is inserted into the stud 32.
  • the heat source 2 and the connecting member 3 are fixed by fitting with the internal thread inside the stud.
  • a spring 8 is also disposed on the outer side of the first screw 71 for ensuring the reliability of the fixing and preventing the step screw from embossing the TEC chip.
  • a heat insulating gasket 9 is disposed between the step screw 7 and the stud 32, and the heat insulating gasket is made of rubber or plastic or other heat insulating material, and surrounds the second screw 72 and abuts against the top surface of the first screw 71. In this way, the contact area of the step screw 7 and the heat source 2 can be further reduced, the heat conduction between the hot and cold parts can be effectively blocked, and the light source can be effectively locked without crushing the TEC chip.
  • the heat source 2 of the heat exchanger of the present invention has a smaller outer dimension than the outer frame of the connecting member 3, so that sufficient air space can be left to block the heat conduction between the light source and the outer frame of the adapter.
  • the conductive member 5 includes a first PCB board 501, a second PCB board 503, and an adapter 502 that connects the first PCB board 501 and the second PCB board 503.
  • the power supply lines of the TEC chip 401 and the heat source 2 are soldered on the first PCB board 501, and the first PCB board 501 and the second PCB board 503 are respectively soldered and connected through the adapter 502.
  • a sealant layer is cured by using a high-temperature sealant, and at the same time, the sealant is also cured at a high temperature in other mounting gaps of the heat exchanger, so that the cavity 16 can be Completely block the ingress and egress of air to achieve good dust and condensation resistance.
  • This embodiment is substantially the same as the first embodiment except that in the present embodiment, the step portion is formed on the side of the connecting member close to the heat source, and is spaced apart from the heat radiating plate. Specifically, a side of the connecting member adjacent to the heat source extends toward the TEC chip to form the step portion, and the step portion abuts the TEC chip on a side close to the heat source, and is Heat sink spacing settings.
  • the step portion abuts the TEC chip at a position of the cold surface of the TEC chip, and the thickness of the step portion is smaller than the thickness of the TEC chip, so that the connecting member is used for fixing the step portion of the TEC chip and the TEC
  • the hot side of the chip is spaced apart from contact with the hot surface to avoid shorting of the hot and cold parts.
  • This embodiment is substantially the same as the first embodiment except that in the present embodiment, the step portion is formed on the connecting member and is spaced apart from both the heat source and the heat radiating plate.
  • the connecting member extends toward the TEC chip to form the step portion, and the step portion abuts the TEC chip and is spaced apart from the heat source and the heat dissipation plate. Since the thickness of the step portion is smaller than the thickness of the TEC chip, the step portion of the connecting member for fixing the TEC chip is spaced apart from the hot surface and the cold surface of the TEC chip, and is not in contact with the hot surface and the cold surface. Thereby avoiding short circuiting of the hot and cold parts.
  • the step portion is formed on the connecting member and abuts a central position of the TEC chip.
  • the present invention provides a heat exchanger, the heat exchanger is provided with a step portion, the step portion abuts the TEC chip on one side of the TEC chip, and the step The thickness of the portion is smaller than the distance between the two end faces of the TEC chip, which can effectively avoid the short circuit phenomenon of the TEC hot and cold surface and improve the cooling efficiency of the TEC.
  • the input power of the TEC is lower, the heat generated by the TEC hot surface is less, and the heat load that the system needs to dissipate is less, which can save energy.
  • the invention can be sealed, dustproof and anti-condensing, can operate in a harsh environment with higher temperature and higher humidity, has a wide application range and has a good user experience.

Abstract

一种换热器及应用该换热器的投影设备，换热器上设置有台阶部（31），台阶部（31）在TEC芯片（401）的一侧抵持TEC芯片（401），且与热源（2）和/或散热器间隔设置，从而使得台阶部（31）与TEC芯片（401）的冷面（4022）和热面（4011）不同时接触，可以有效避免TEC冷热面的短路现象，提高TEC的制冷效率，同等制冷效果，TEC的输入功率更低，TEC热面产生的热量就更少，系统所需散发掉的热负荷也就更少，可以起到节能效果。

Description

换热器及投影设备 技术领域
本发明涉及光学散热技术领域，具体涉及一种换热器及包含该换热器的投影设备。
 背景技术
红激光、数码微镜器件（Digital Micromirror Device，DMD）等很多光学器件在工作时，对散热条件要求非常高，其基板温度由于需要低于环境温度实现散热，因此基板温度有时会要求维持在20℃左右，换热器设计时需要使用半导体致冷器(Thermal Energy Converter, TEC)。此时，整个散热模组以TEC为界限，分为两部分：与TEC冷面接触的为低温部件，与TEC热面接触的则为高温部件，散热设计时必须尽可能的把低温部件和高温部件隔离开来，不能冷热短路，这样TEC才能高效率的工作。
技术问题
同时，现有技术中TEC的两根供电线需要内部引出，必须设计足够大的过线孔，才能使供电线引出，而当供电线穿出后，过线孔与供电线之间会有缝隙，周围的热空气会渗透到其内部，由于这些部件的基板温度低于周围环境温度，当空气湿度较大时，模组内部就可能会产生冷凝水，冷凝水会损坏这些器件和TEC，所以做好模组的密封防冷凝设计就显得尤为重要。
因此，实有必要提供一种新的换热器及投影设备以解决上述问题。
 技术解决方案
本发明主要解决的技术问题是提供一种换热器及投影设备，以解决现有技术中换热器冷热部件之间的短路问题，同时又能拥有很好的密封防尘和防冷凝能力。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种换热器，包括具有收容空间的壳体、收容在壳体内的热源、制冷模组以及连接所述制冷模组与所述壳体的连接件，所述制冷模组包括散热板和用于实现热量传递的TEC芯片，所述TEC芯片一端与所述散热板相连，另一端与所述热源相相连，所述连接件一端与壳体相连，一端与散热板抵持，所述连接件设置有朝向所述TEC芯片方向延伸的台阶部，所述台阶部抵持所述TEC芯片，且与所述热源和/或散热板间隔设置。
优选的，所述连接件靠近所述散热板的一侧朝向所述TEC芯片方向延伸形成所述台阶部，所述台阶部在靠近所述散热板的一侧抵持所述TEC芯片，且与所述热源间隔设置。
优选的，所述连接件靠近所述热源的一侧朝向所述TEC芯片方向延伸形成所述台阶部，所述台阶部在靠近所述热源的一侧抵持所述TEC芯片，且与所述散热板间隔设置。
优选的，所述连接件朝向所述TEC芯片方向延伸形成所述台阶部，所述台阶部抵持所述TEC芯片的中央，且与所述热源和散热板均间隔设置。
优选的，所述TEC芯片包括相对设置的热面和冷面，所述冷面与所述热源抵持，所述热面与所述散热板抵持，所述散热板与所述TEC芯片的热面之间设置有导热界面材料。
优选的，所述散热板为冷板，所述热源为收容在所述收容空间的光源，所述光源倒置悬挂在所述连接件上。
优选的，所述连接件上设置有凸起的螺柱，所述光源采用台阶螺钉固定在所述螺柱上，所述台阶螺钉包括第一螺杆和自所述第一螺杆突出的第二螺杆，所述第二螺杆的直径小于所述第一螺杆的直径，所述台阶螺钉的螺纹设置在所述第二螺杆上。
优选的，所述台阶螺钉与所述螺柱之间设置有绝热垫圈，所述绝热垫圈环绕所述第二螺杆并与所述第一螺杆相抵持。
优选的，所述连接件与所述壳体共同形成隔热腔，所述换热器包括位于隔热腔内部用于电连接所述TEC芯片和外部电源的第一PCB板、第二PCB板和连接所述第一PCB板与所述第二PCB板的转接件。
优选的，所述转接件与所述连接件的安装缝隙处设置有高温固化的密封胶层，述壳体与所述连接件之间设置有密封圈。
为解决上述技术问题，本发明还提供一个技术方案是：提供一种投影设备，其包括如上所述的换热器。
 有益效果
本发明的有益效果是：区别于现有技术的情况，本发明提供一种换热器，换热器上设置有台阶部，台阶部在靠TEC芯片的一侧抵持所述TEC芯片，且与热源和/或散热器间隔设置，从而使得台阶部于TEC芯片的冷面和热面不同时接触，可以有效避免TEC冷热面的短路现象，提高TEC的制冷效率，具有良好的用户体验。
 附图说明
图1是本发明换热器的分解结构示意图；
图2是本发明换热器的剖视图；
图3是本发明换热器另一个角度的剖视图；
图4是本发明换热器导电组件的结构示意图。
 本发明的最佳实施方式
应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
本发明提供一种换热器及应用该换热器的投影设备，以解决现有技术中换热器冷热部件之间的短路问题，同时又能拥有很好的密封防尘和防冷凝能力。
实施例一
如图1和图2所示，本发明换热器包括壳体1、热源2、连接件3、制冷模组4和导电部件5。
壳体1具有收容空间，连接件3用于连接壳体1和制冷模组4，使得制冷模组4固定在壳体1上。连接件3与壳体1共同形成隔热腔，热源2收容在隔热腔内并与所述制冷模组4抵持从而通过制冷模组4与外界进行换热。
在本实施方式中，壳体1包括顶部中空的金属盖板11和盖接在金属盖板11的中空部位的玻璃盖板12。在其中金属盖板11为铝盖板，在可选择的其他实施方式中，还可以为铜盖板或不锈钢等其他材质的盖板。
热源2在本实施方式中为光源，该光源倒置悬挂在连接件3上。在可选择的其他实施方式中，还可以为用在热源为DMD芯片等发热量比较大的元器件上。
连接件3在本实施方式中为铝材质，在可选择的其他实施方式中，还可以为铜、不锈钢、PU（聚氨酯）等材质。
制冷模组4包括实现热量传递的TEC芯片401和起到散热作用散热板402， TEC芯片401一端和散热板402抵持，另一端与热源2抵持。在本实施方式中，散热板402为冷板，在可选择的其他实施方式中，也可以为其他散热器。优选的，散热板402与TEC芯片401的热面之间设置有促进热传导的导热界面材料。
如图2所示，TEC芯片401在通电的情况下，热量会从TEC芯片401的一面朝向另一面传输，从而形成相对设置的热面4011和冷面4012。在本实施方式中，冷面4012朝向热源2设置，从而吸收热源2产生的热量并传输至热面；热面4011朝向散热板402设置，从而接收冷面4012传输的热量并通过散热板402散发到外部环境中，进而形成针对热源2的散热通道。在本实施方式中，连接件3与壳体1、及连接件3与制冷模组4之间还设置有密封圈6，以在换热器内部形成相对密封的环境以防止外部气体进入在内部凝结成水汽而影响产品的性能。
连接件3一端与壳体1相连，一端与散热板402抵持，在靠近散热板2的一侧设置有朝向TEC芯片401方向延伸的台阶部31，台阶部31在靠近所述散热板402的一侧抵持所述TEC芯片401，且与所述热源间隔设置，从而精确定位TEC芯片401的位置。具体地，所述台阶部31在所述TEC芯片401热面4011的位置抵持所述TEC芯片401，而且台阶部31的厚度小于TEC芯片401的厚度，这样，就使得连接件3用于固定TEC芯片401的台阶部31与冷面4012间隔设置，不会与冷面4012接触，从而避免冷热部件短路。此外，TEC芯片401的冷面4012和热面4011之间进一步具有隔热材料和密封胶，避免自身在TEC芯片周围发生冷热面短路。
参照图3所示，连接件3上设置有朝向热源2凸起设置的螺柱32，热源2采用台阶螺钉7固定在螺柱32上。其中台阶螺钉7包括第一螺杆71和自第一螺杆71突出的第二螺杆72，其中第一螺杆71的直径大于第二螺杆72的直径。在本实施方式中，仅在第二螺杆72上设置有螺纹，具体为外螺纹，第一螺杆71插入热源2上的螺孔用于实现与热源2的固定，第二螺杆72插入螺柱32内，并与螺柱内部的内螺纹配合实现热源2和连接件3的固定。第一螺杆71外侧还套设有弹簧8，用于保证固定的可靠性，防止台阶螺钉压花TEC芯片。
进一步的，台阶螺钉7与螺柱32之间设置有绝热垫圈9，该绝热垫圈采用橡胶或塑料或其他隔热材料制成，其环绕第二螺杆72并与第一螺杆71的顶面相抵持，这样可以更进一步的减少台阶螺钉7与热源2的接触面积，有效阻隔冷热部件之间的导热，又能有效锁固光源而不至于压坏TEC芯片。
此外，本发明换热器的热源2外形尺寸比连接件3外框小，这样可以留足够空气间距，隔断光源与转接件外框的导热。
如图4所述，导电部件5包括第一PCB板501、第二PCB板503和连接所述第一PCB板501和第二PCB板503的转接件502。具体地，在隔热腔内部，TEC芯片401和热源2的供电线焊接在第一PCB板501上，通过转接件502把第一PCB板501和第二PCB板503分别一一焊接导通，最后在转接件502与连接件3的安装缝隙处使用密封胶高温固化设置一层密封胶层，同时也在换热器的其他安装缝隙处使用密封胶高温固化，这样腔体16就能完全阻隔空气的进出，达到很好的防尘和防冷凝效果。
实施例二
本实施方式与第一种实施方式大体相同，区别仅在于，在本实施方式中，台阶部形成于连接件靠近热源的一侧，并与所述散热板间隔设置。具体地，所述连接件靠近所述热源的一侧朝向所述TEC芯片方向延伸形成所述台阶部，所述台阶部在靠近所述热源的一侧抵持所述TEC芯片，且与所述散热板间隔设置。
优选地，所述台阶部在所述TEC芯片冷面的位置抵持所述TEC芯片，而且台阶部的厚度小于TEC芯片的厚度，这样，就使得连接件用于固定TEC芯片的台阶部与TEC芯片的热面间隔设置，不会与热面接触，从而避免冷热部件短路。
实施例三
本实施方式与第一种实施方式大体相同，区别仅在于，在本实施方式中，台阶部形成于所述连接件上，且与所述热源和散热板均间隔设置。具体地，所述连接件朝向所述TEC芯片方向延伸形成所述台阶部，所述台阶部抵持所述TEC芯片，且与所述热源和散热板均间隔设置。由于所述台阶部的厚度小于TEC芯片的厚度，这样，就使得连接件用于固定TEC芯片的台阶部与TEC芯片的热面和冷面均间隔设置，不会与热面和冷面接触，从而避免冷热部件短路。
优选地，所述台阶部形成于所述连接件上，并抵持所述TEC芯片的中部位置。
本发明的有益效果是：区别于现有技术的情况，本发明提供一种换热器，换热器上设置有台阶部，台阶部在TEC芯片的一侧抵持所述TEC芯片，且台阶部的厚度小于TEC芯片两端面之间的距离，可以有效避免TEC冷热面的短路现象，提高TEC的制冷效率。同等制冷效果，TEC的输入功率更低，TEC热面产生的热量就更少，系统所需散发掉的热负荷也就更少，可以起到节能效果。同时本发明又能做到密封防尘和防冷凝，可以在更高温更高湿的恶劣环境中运行，应用面十分广泛，具有良好的用户体验。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (11)

1.一种换热器，包括具有收容空间的壳体、收容在壳体内的热源、制冷模组以及连接所述制冷模组与所述壳体的连接件，其特征在于，所述制冷模组包括散热板和用于实现热量传递的TEC芯片，所述TEC芯片一端与所述散热板抵持，另一端与所述热源抵持，所述连接件一端与壳体相连，一端与散热板抵持，所述连接件设置有朝向所述TEC芯片方向延伸的台阶部，所述台阶部抵持所述TEC芯片，且与所述热源和/或散热板间隔设置。
2.根据权利要求1所述的换热器，其特征在于，所述连接件靠近所述散热板的一侧朝向所述TEC芯片方向延伸形成所述台阶部，所述台阶部在靠近所述散热板的一侧抵持所述TEC芯片，且与所述热源间隔设置。
3.根据权利要求1所述的换热器，其特征在于，所述连接件靠近所述热源的一侧朝向所述TEC芯片方向延伸形成所述台阶部，所述台阶部在靠近所述热源的一侧抵持所述TEC芯片，且与所述散热板间隔设置。
4.根据权利要求1所述的换热器，其特征在于，所述连接件朝向所述TEC芯片方向延伸形成所述台阶部，所述台阶部抵持所述TEC芯片，且与所述热源和散热板均间隔设置。
5.如权利要求1所述的换热器，其特征在于，所述TEC芯片包括相对设置的热面和冷面，所述冷面与所述热源抵持，所述热面与所述散热板抵持，所述散热板与所述TEC芯片的热面之间设置有导热界面材料。
6.根据权利要求1所述的换热器，其特征在于，所述散热板为冷板，所述热源为收容在所述收容空间的光源，所述光源倒置悬挂在所述连接件上。
7.根据权利要求6所述的换热器，其特征在于，所述连接件上设置有凸起的螺柱，所述光源采用台阶螺钉固定在所述螺柱上，所述台阶螺钉包括第一螺杆和自所述第一螺杆突出的第二螺杆，所述第二螺杆的直径小于所述第一螺杆的直径，所述台阶螺钉的螺纹设置在所述第二螺杆上。
8.根据权利要求7所述的换热器，其特征在于，所述台阶螺钉与所述螺柱之间设置有绝热垫圈，所述绝热垫圈环绕所述第二螺杆并与所述第一螺杆相抵持。
9.根据权利要求4所述的换热器，其特征在于，所述连接件与所述壳体共同形成隔热腔，所述换热器包括位于隔热腔内部用于电连接所述TEC芯片和外部电源的第一PCB板、第二PCB板和连接所述第一PCB板与所述第二PCB板的转接件。
10.根据权利要求9所述的换热器，其特征在于，所述转接件与所述连接件的安装缝隙处设置有高温固化的密封胶层，所述壳体与所述连接件之间设置有密封圈。
11.一种投影装置，其特征在于，包括如权利要求1到10任意一项所述的换热器。
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