WO2020088452A1 - 一种芯片散热装置及投影设备 - Google Patents

一种芯片散热装置及投影设备 Download PDF

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Publication number
WO2020088452A1
WO2020088452A1 PCT/CN2019/114013 CN2019114013W WO2020088452A1 WO 2020088452 A1 WO2020088452 A1 WO 2020088452A1 CN 2019114013 W CN2019114013 W CN 2019114013W WO 2020088452 A1 WO2020088452 A1 WO 2020088452A1
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WIPO (PCT)
Prior art keywords
heat
groove
plate
chip
heat conduction
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PCT/CN2019/114013
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English (en)
French (fr)
Inventor
李龙
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苏州乐梦光电科技有限公司
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Publication of WO2020088452A1 publication Critical patent/WO2020088452A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/16—Cooling; Preventing overheating

Definitions

  • the present application relates to the field of chip heat dissipation technology, for example, to a chip heat dissipation device and projection equipment.
  • DMD chips are generally used in high-lumen laser projection equipment above 7000, and the heat dissipation method generally adopts the traditional air cooling or water drainage method. Under high or low ambient temperature conditions, the two heat dissipation methods are greatly affected by the environment.
  • the heat dissipation method of the related technology causes the temperature of the DMD chip to rise with a high environment, which greatly reduces its service life.
  • the ambient temperature is low, the activity of the liquid molecules in the condensation section of the heat dissipation device is greatly reduced or even crystallized, and the heat dissipation effect is lost.
  • the air-cooling and water-cooling methods used in the related art need to be equipped with multiple fans or multiple water-cooling circuits, which increases the volume of the projection device.
  • the present application provides a chip heat dissipation device, so as to solve to a certain extent the problems in the related art that the heat dissipation effect is greatly affected by the environment and the heat dissipation system is large.
  • the chip heat dissipation device provided by the present application is less affected by the environment and has a smaller volume.
  • the application also provides a projection device, the chip of the projection device has good heat dissipation, and the volume of the heat dissipation system is small.
  • a chip heat dissipation device includes a heat conduction component, a semiconductor cooling sheet, and a heat dissipation component.
  • the heat conduction component includes a first heat conduction plate and a second heat conduction plate; a first surface of the first heat conduction plate facing the second heat conduction plate A first groove is recessed, and a second surface of the second heat conducting plate facing the first heat conducting plate is recessed with a second groove, and the first groove and the second groove are located oppositely Forming a mounting cavity;
  • the semiconductor cooling chip is installed in the mounting cavity, the semiconductor cooling chip has oppositely arranged cold and hot surfaces, the hot surface of the semiconductor cooling chip and the bottom surface of the first groove may be Thermally conductively connected, the cold surface of the semiconductor cooling sheet and the bottom surface of the second groove can be thermally connected;
  • the surface of the second thermally conductive plate away from the first thermally conductive plate is provided with a chip mounting portion, the chip The position of the mounting portion corresponds to the position of the second groove; the heat diss
  • the present application also provides another chip heat dissipation device.
  • the chip heat dissipation device includes a heat conduction component, a semiconductor cooling sheet, and a heat dissipation component.
  • the heat conduction component includes a first heat conduction plate and a second heat conduction plate;
  • the first surface of the second thermally conductive plate is concavely provided with a first groove, the second surface of the second thermally conductive plate facing the first thermally conductive plate is flat, and the first groove and the second surface are formed A mounting cavity;
  • the semiconductor cooling plate is installed in the mounting cavity, the semiconductor cooling plate has oppositely arranged cold and hot surfaces, the thermal surface of the semiconductor cooling plate and the bottom surface of the first groove can conduct heat Ground connection, the cold surface of the semiconductor cooling sheet and the second surface are thermally conductively connected;
  • the surface of the second heat conduction plate away from the first heat conduction plate is provided with a chip mounting portion;
  • the heat dissipation component and the The first thermally conductive plate can be
  • the present application also provides a projection device including a housing, a chip, and the chip heat dissipation device according to any one of the above, the chip is directly thermally conductively connected to the chip mounting portion, the chip and the device The chip heat dissipation devices are all disposed in the housing.
  • FIG. 1 is a schematic structural diagram of a chip heat dissipation device provided by an embodiment of the present invention
  • FIG. 2 is an exploded view of the chip heat dissipation device according to an embodiment of the present invention from a first perspective;
  • FIG. 3 is a schematic structural diagram of a second heat conduction plate in a chip heat dissipation device according to an embodiment of the present invention
  • FIG. 4 is a first schematic structural view of the first heat conduction plate in a second perspective from the chip heat dissipation device provided by an embodiment of the present invention
  • FIG. 5 is a schematic structural view of a first heat-conducting plate in a chip heat dissipation device according to an embodiment of the present invention from a third perspective;
  • FIG. 6 is a schematic structural diagram of a heat pipe assembly in a chip heat dissipation device according to an embodiment of the present invention
  • FIG. 7 is an exploded view of the chip heat dissipation device according to an embodiment of the present invention from a fourth perspective.
  • Icon 100-chip heat sink; 110-heat sink assembly; 111-heat sink; 120-heat pipe assembly; 121-U-shaped pipe; 1211-first branch pipe; 1212-second branch pipe; 1213-connecting pipe; 122-L Type tube; 1221-first type tube; 1222-second type tube; 130-heat conduction component; 131-first heat conduction plate; 1311-first groove; 1312-third groove; 1313-first recessed groove; 1314-second recessed groove; 132-semiconductor cooling plate; 133-second heat conduction plate; 1331-second groove; 1332-bump; 140-first temperature sensor; 150-second temperature sensor.
  • the chip heat dissipation device 100 includes a heat conduction component 130, a semiconductor cooling chip 132 and a heat dissipation component.
  • the heat conduction component 130 includes a first heat conduction plate 131 and a second heat conduction plate 133.
  • the first surface of the first heat conduction plate 131 facing the second heat conduction plate 133 is concavely provided with a first groove 1311
  • the second surface of the second heat conduction plate 133 facing the first heat conduction plate 131 is concavely provided with a second groove 1331
  • the first groove 1311 and the second groove 1331 are opposite to each other and form a mounting cavity.
  • the semiconductor cooling chip 132 is installed in the installation cavity.
  • the semiconductor cooling plate 132 has a cold surface and a hot surface that are oppositely arranged.
  • the hot surface of the semiconductor cooling plate 132 is thermally conductively connected to the bottom surface of the first groove 1311, and the cold surface of the semiconductor cooling plate 132 is thermally conductively connected to the bottom surface of the second groove 1331.
  • a chip mounting portion is provided on the surface of the second heat conductive plate 133 away from the first heat conductive plate 131. The position of the chip mounting portion corresponds to the position of the second groove 1331.
  • the heat dissipation component and the first heat conducting plate 131 can be thermally connected.
  • first surface of the first heat conduction plate 131 facing the second heat conduction plate 133 may also be a flat surface, and the second surface of the second heat conduction plate 133 facing the first heat conduction plate 131 is concavely provided with a second groove 1331
  • the first surface and the second groove 1331 form a mounting cavity. At this time, the hot surface of the conductor cooling plate and the first surface can be thermally connected, and the cold surface of the semiconductor cooling plate 132 and the bottom surface of the second groove 1331 can be thermally connected.
  • the first surface of the first heat conduction plate 131 facing the second heat conduction plate 133 is concavely provided with a first groove 1311
  • the second surface of the second heat conduction plate 133 facing the first heat conduction plate 131 is a flat surface
  • the first groove 1311 and the second surface form an installation cavity.
  • the hot surface of the semiconductor cooling sheet 132 and the bottom surface of the first groove 1311 may be thermally connected
  • the cold surface of the semiconductor cooling sheet 132 and the second surface may be thermally connected.
  • the semiconductor cooling plate 132 is also called a thermoelectric cooling plate, and its principle is the Peltier effect. Its advantage is that there are no sliding parts, and it is used in places where space is limited, reliability requirements are high, and there is no refrigerant pollution.
  • Using the Peltier effect of semiconductor materials when direct current passes through a galvanic couple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the galvanic couple respectively, which can achieve the purpose of cooling. It is a refrigeration technology that produces negative thermal resistance. It is characterized by no moving parts and high reliability. Through the control of the input current, high-precision temperature control can be achieved, and the cooling chip can reach the maximum temperature difference within one minute of energization.
  • the cold surface of the semiconductor cooling plate 132 is used for heat dissipation. Since the cooling effect of the semiconductor cooling plate 132 is controlled by the magnitude of the current, it is less affected by the environment.
  • the semiconductor cooling sheet 132 can be protected in the installation cavity.
  • the first groove 1311 and the second groove 1331 are provided to ensure the strength of the first heat conduction plate 131 and the second heat conduction plate 133 while shortening the distance between the semiconductor cooling plate 132 and the chip, thereby improving the heat dissipation effect.
  • Opening the first groove 1311 and the second groove 1331 can also enable the cold surface of the semiconductor cooling sheet 132 to expand the heat dissipation area through the second heat conducting plate 133. Moreover, the first groove 1311 and the second groove 1331 can reduce the volume of the entire chip heat dissipation device 100 to a certain extent.
  • the heat on the first heat conduction plate 131 is directly transferred to the second heat conduction plate, so that the temperature of the second heat conduction plate 133 rises, and the cooling effect is reduced.
  • a gap is left between the first surface and the second surface or filled with thermal insulation material.
  • the bottom surface of the first groove 1311 directly contacts the hot surface or a thermal paste is filled between the bottom surface of the first groove 1311 and the hot surface, and the bottom surface of the second groove 1331 directly contacts the cold surface Or a thermal paste is filled between the bottom surface of the second groove 1331 and the cold surface.
  • the sum of the depth of the first groove 1311 and the depth of the second groove 1331 is smaller than the semiconductor cooling plate 132 thickness of.
  • a thermal paste is filled between the bottom surface of the first groove 1311 and the hot surface
  • a thermal paste is filled between the bottom surface of the second groove 1331 and the thermal surface, or both are filled with thermal paste,
  • the sum of the depth and the depth of the second groove 1331 may be less than or equal to the thickness of the semiconductor cooling plate 132.
  • the heat dissipation component may be an air-cooled component.
  • the air-cooled component includes a heat sink assembly 110 and a heat pipe assembly 120.
  • the heat sink assembly 110 is connected to the heat pipe assembly 120.
  • the heat conducting component 130, the heat pipe component 120 and the heat sink component 110 are sequentially installed from the direction close to the chip to the distance away from the chip, so as to dissipate the chip and make the chip work at a constant temperature.
  • the cold and heat assembly 130 includes a first heat-conducting plate 131 and a second heat-conducting plate 133
  • the semiconductor cooling plate 132 is disposed between the first heat-conducting plate 131 and the second heat-conducting plate 133
  • the second heat-conducting plate 133 is far away
  • One side of the first heat conducting plate 131 is in contact with the chip, and the side of the first heat conducting plate 131 remote from the second heat conducting plate 133 is connected to the heat dissipation component.
  • the side of the first heat conducting plate 131 remote from the second heat conducting plate 133 is connected to the heat pipe assembly 120, and the heat sink assembly 110 is disposed on the heat pipe assembly 120.
  • the chip is a DMD chip, a single chip microcomputer chip, a relay control chip, etc.
  • the chips that can dissipate heat through the chip heat dissipation device 100 all belong to the protection scope of this embodiment.
  • the semiconductor cooling plate 132 When the semiconductor cooling plate 132 is energized, the cold surface of the semiconductor cooling plate 132 will quickly cool down, and the second heat-conducting plate 133 attached to the semiconductor cooling plate 132 will cool down synchronously, and the second heat-conducting plate 133 is in contact with the chip to make the chip achieve the heat dissipation effect.
  • the first heat conducting plate 131 is bonded to the hot surface of the semiconductor cooling sheet 132 to conduct the heat of the hot surface of the semiconductor cooling sheet 132 to the heat pipe assembly 120 and the heat sink assembly 110, and finally discharged through a fan or natural convection, so that the heat dissipation effect of the chip is very high it is good.
  • a side of the first heat conducting plate 131 near the second heat conducting plate 133 is provided with a first groove 1311, and a side of the second heat conducting plate 133 near the first heat conducting plate 131
  • a second groove 1331 is provided on one side, and both sides of the semiconductor cooling plate 132 are respectively disposed in the first groove 1311 and the second groove 1331.
  • the semiconductor cooling plate 132 is locked in the first groove 1311 and the second groove 1331, the first groove 1311 and the second groove 1331 are oppositely arranged to form a rectangular parallelepiped cavity, and the semiconductor cooling plate 132 is arranged in the cavity Inside, the cavity communicates with the outside world through two strip-shaped grooves.
  • the two strip-shaped grooves are used to set wires that communicate with the semiconductor refrigeration sheet 132 to facilitate the installation of the semiconductor refrigeration sheet 132.
  • the second heat conduction plate 133, the semiconductor cooling plate 132 and the first heat conduction plate 131 are bonded together, and the second heat conduction plate 133 and the first heat conduction plate 131 are fixed together by screws to install the semiconductor cooling plate 132.
  • the first heat conduction plate 131 and the second heat conduction plate 133 are both copper plates, that is, the first heat conduction plate 131 is a hot surface copper plate, and the second heat conduction plate 133 is a cold surface copper plate, which makes the heat transfer effect better, and The cost is lower.
  • the second heat conducting plate 133 is provided with a bump 1332 for mounting a chip on the side away from the semiconductor cooling sheet 132. By mounting the back of the chip on the bump 1332, the heat generated by the chip can be quickly transferred to the cold copper plate to dissipate heat.
  • the convex block 1332 is provided with a wire groove, and the wire groove extends through the second heat conducting plate 133 to the outside of the second heat conducting plate 133.
  • the second heat-conducting plate 133 is also provided with a groove which is convenient for the chip to be connected and opened at one end.
  • the second heat conducting plate 133 is provided with a plurality of through holes for connecting with the first heat conducting plate 131 and the chip on the side away from the semiconductor cooling plate 132.
  • the bump 1332 is disposed opposite to the second groove 1331, that is, the bump 1332 and the second groove 1331 are located on both sides of the second heat conducting plate 133, respectively, and the heat emitted by the chip connected to the bump 1332 can be directly
  • the semiconductor cooling sheet 132 is transferred to the first heat-conducting plate 131 to improve heat dissipation efficiency.
  • the chip heat dissipation device 100 further includes a heat pipe assembly 120 and a heat sink assembly 110.
  • the side of the first heat conducting plate 131 away from the second heat conducting plate 133 is provided with a plurality of third In the groove 1312, one end of the heat pipe assembly 120 is disposed in the third groove 1312, and the other end is connected to the heat sink assembly 110.
  • the heat pipe assembly 120 is installed on the first heat conduction plate 131, so that the heat on the first heat conduction plate 131 can be quickly transferred to the heat pipe assembly 120 and the heat pipe assembly 120 to the heat sink assembly 110, And discharged through the fan or natural convection.
  • the first groove 1311 and the third groove 1312 are provided correspondingly. That is, the first groove 1311 and the third groove 1312 are respectively located on both sides of the first heat conduction plate 131, and the heat transferred by the semiconductor cooling plate 132 can be directly transmitted to the heat pipe assembly 120 through the first heat conduction plate 131, thereby improving heat dissipation efficiency.
  • the heat pipe assembly 120 includes a plurality of pipe pieces
  • the third groove 1312 includes a plurality
  • one pipe piece is disposed in the third groove 1312 to install the heat pipe assembly 120.
  • four countersunk holes and two through holes are formed on the first heat conducting plate 131, and the four countersunk holes are respectively arranged above, below, and around the first heat conducting plate 131, and the two through holes are distributed in The protrusion on the left side of the first heat conducting plate 131.
  • the heat pipe assembly 120 includes a plurality of U-shaped tubes 121 and a plurality of L-shaped tubes 122, and each U-shaped tube 121 includes a first branch tube 1211, a second branch tube 1212, and a first branch tube 1211 connected to The connecting pipe 1213 of the second branch pipe 1212, each L-shaped pipe 122 includes a first-shaped pipe 1221 and a second-shaped pipe 1222 connected to the first-shaped pipe 1221.
  • the connecting tube 1213 of each U-shaped tube 121 is disposed in a third groove 1312
  • the first-shaped tube 1221 of each L-shaped tube 122 is disposed in a third groove 1312.
  • the first branch pipe 1211 and the second branch pipe 1212 are arranged in parallel.
  • the first branch pipe 1211 and the second branch pipe 1212 have the same shape and size.
  • the first branch pipe 1211 and the second branch pipe 1212 are respectively disposed at both ends of the connecting pipe 1213.
  • the first branch pipe 1211, the second branch pipe 1212 and the connecting pipe 1213 are circular pipes.
  • the connecting pipe 1213 is divided into a first straight pipe portion and two first arc pipe portions, and the two first arc pipe portions are located at both ends of the first straight pipe portion and are connected to the first straight pipe portion.
  • the first arc tube portion is in a quarter arc shape, and the first branch tube 1211 is connected to the first linear tube portion through the first arc tube portion, so that the first branch tube 1211 and the first linear tube portion are in a vertical relationship .
  • the second branch pipe 1212 is connected to the first straight pipe portion through the first arc-shaped pipe portion, so that the second branch pipe 1212 and the first straight pipe portion have a vertical relationship.
  • the first type tube 1221 is made into a flat tube shape to increase the contact area with the third groove 1312 to facilitate heat conduction.
  • the first type tube 1221 is close to one end of the second type tube 1222, and the flat tube-shaped first type tube 1221 gradually transitions into a round type tube.
  • the second type tube 1222 is a circular tube.
  • the second type tube 1222 includes a second arc tube portion and a second straight tube portion, the second arc tube portion is in a quarter arc shape, and the second straight tube portion passes through the second arc tube portion and the first
  • the profile tubes 1221 are connected so that the second straight tube portion and the first profile tube 1221 have a vertical relationship.
  • the first branch pipe 1211, the second branch pipe 1212 and the second straight pipe part have the same size and shape.
  • part of the third groove 1312 extends in the first direction and part of the third groove 1312 extends in the second direction, the first direction being perpendicular to the second direction.
  • the first direction is the inward direction
  • the second direction is the horizontal direction.
  • the first heat conducting plate 131 is provided with a first recessed groove 1313 for connecting to the first linear tube portion and a second recessed groove 1314 for connecting to the first type tube 1221. Both the first concave groove 1313 and the second concave groove 1314 belong to the third groove 1312.
  • the extending direction of the first concave groove 1313 is perpendicular to the extending direction of the second concave groove 1314, which is more convenient for the setting of the U-shaped tube 121 and the L-shaped tube 122.
  • the first concave groove 1313 is a through groove
  • the second concave groove 1314 is a groove open at one end.
  • the first concave groove 1313 and the second concave groove 1314 do not communicate with each other.
  • the first concave groove 1313 is an arc-shaped groove.
  • the first recessed groove 1313 can just accommodate half of the first straight pipe portion.
  • the second concave groove 1314 is a square groove.
  • the arcs on both sides of the flat first-shaped tube 1221 are just tangent to the two side walls of the second recessed groove 1314.
  • the second concave groove 1314 is just capable of accommodating the first type tube 1221.
  • the first branch pipe 1211 and the second straight pipe portion are in parallel relationship, and the first branch pipe 1211 and the second type pipe 1222 are on the same side of the first heat conduction plate 131.
  • the heat sink assembly 110 includes a plurality of heat sinks 111.
  • the heat sink 111 is disposed at an end of the heat pipe assembly 120 away from the first heat conducting plate 131.
  • a plurality of heat dissipation fins 111 are overlapped and arranged on the end of the U-shaped tube 121 away from the first heat conduction plate 131 and the L-shaped tube 122 away from the first heat conduction plate 131 to facilitate the arrangement of the heat dissipation fins 111 and between the heat pipe and the heat dissipation fins 111 The heat transfer effect is better.
  • the surface of the heat sink 111 is provided with a through hole for connecting with the first branch tube 1211, the second branch tube 1212 and the second type tube 1222.
  • the through holes connected to the first branch pipe 1211 and the second branch pipe 1212 are located on the left side of the heat sink 111, and are distributed in the vertical direction.
  • the through holes connected to the second type tube 1222 are distributed on the right side of the fins 111 at intervals.
  • the distance between the through holes connected to the first branch pipe 1211 and the second branch pipe 1212 is the same as the distance between the first branch pipe 1211 and the second branch pipe 1212.
  • the distance between the through holes connected to the second type tube 1222 is the same as the distance between the second type tube 1222.
  • the U-shaped tubes 121 are used in pairs, and the distance between the two U-shaped tubes 121 is 1-2 mm.
  • the L-shaped tubes 122 are used in pairs, and the distance between the two L-shaped tubes 122 is 1-2 mm.
  • the heat dissipation fin 111 has a square shape as a whole, and a square through hole is provided in the center of the square heat dissipation fin 111.
  • the square through hole and the first branch tube 1211 and the second branch tube 1212 Two square through holes are provided between the connected through holes at intervals up and down. Two square through holes are provided above and below the square through hole.
  • a square notch is formed on the left side of the heat sink 111. The opening positions of the five square through holes and a square notch exactly correspond to the positions of the four countersunk holes and the two through holes on the first heat conducting plate 131.
  • the position of the square notch corresponds to the position of the countersunk hole under the first heat conducting plate 131.
  • a plurality of heat sinks 111 overlap together to form a heat sink assembly 110. Referring to FIG. 7, after a plurality of heat sinks 111 are overlapped together, the heat sinks 111 are connected together by two sets of metal square plates provided on the upper and lower surfaces. Five square through holes and a square notch are connected to corresponding through holes on the first heat conducting plate 131. Strengthen the connection strength of the entire heat dissipation component. The through holes formed in the heat sink 111 are stacked together to form a connection channel.
  • the heat sink assembly 110 is connected to the first branch pipe 1211, the second branch pipe 1212, and the second type pipe 1222 through the connection channel. The thickness of the heat sink assembly 110 does not exceed the length of the first branch pipe 1211.
  • the heat sink assembly 110 is welded to the heat pipe assembly 120, and the heat pipe assembly 120 is welded to the first heat conducting plate 131 for installation.
  • the structures of the heat pipe assembly 120 and the heat sink assembly 110 can be adjusted to meet different heat dissipation requirements.
  • the hot and cold assembly 130 further includes a first temperature sensor 140 and a second temperature sensor 150.
  • the first temperature sensor 140 is disposed on the second thermally conductive plate 133
  • the second temperature sensor 150 is disposed on the first thermally conductive plate 131.
  • the temperature of the second heat-conducting plate 133 is monitored by the first temperature sensor 140
  • the temperature of the first heat-conducting plate 131 is monitored by the second temperature sensor 150, so as to regulate the heat dissipation of the chip in real time, the chip heat dissipation effect is better, and the chip operates at a constant temperature .
  • the first temperature sensor 140 is disposed on the second surface, and the second temperature sensor 150 is disposed on a side of the first heat conducting plate 131 away from the second heat conducting plate 133.
  • the temperature of the first heat-conducting plate 131 and the second heat-conducting plate 133 can be monitored more accurately, so as to better control the heat dissipation of the chip.
  • the second temperature sensor 150 is disposed at the end of the first heat conducting plate 131 away from the third groove 1312, to prevent the installation of the heat pipe from affecting the temperature monitoring of the first heat conducting plate 131, so that the Temperature monitoring is more accurate.
  • the first temperature sensor 140 is disposed on the upper end of the second thermally conductive plate 133, and the second temperature sensor 150 is disposed on the upper right corner of the first thermally conductive plate 131.
  • the chip heat dissipation device 100 further includes a control device, which is electrically connected to the semiconductor cooling plate 132, the first temperature sensor 140, and the second temperature sensor 150.
  • a fan is provided outside the heat sink assembly 110.
  • the control device includes a first shifting device, a second shifting device, and a control center.
  • the semiconductor cooling plate 132 is connected to the first shifting device, the fan is provided with a second shifting device, and the control center is electrically connected to the first shifting device, the second shifting device, the first temperature sensor 140 and the second temperature sensor 150 connection.
  • the heat dissipation component may also be a water cooling component.
  • the water cooling component includes a water pipe, and the first heat conducting plate 131 is installed on the outer wall of the water pipe. Both ends of the water pipe are a water inlet and a water outlet, respectively, to cool the first heat conducting plate 131 .
  • the working principle of the chip heat dissipation device 100 provided in this embodiment is as follows: the chip generates heat and causes the second heat conducting plate 133 to generate heat.
  • the first temperature sensor 140 monitors the high temperature temperature signal of the second heat conducting plate 133 and transmits the high temperature temperature signal to the
  • the control center the control center sends a first signal, the first signal controls the first shifting device to switch, so that the semiconductor cooling plate 132 works, during the operation of the semiconductor cooling plate 132, the cold surface of the semiconductor cooling plate 132 and the second heat conducting plate 133 Contact to cool the second heat-conducting plate 133 and dissipate heat to the chip.
  • the first temperature sensor 140 monitors the low-temperature temperature signal of the second heat-conducting plate 133 and transmits the low-temperature temperature signal to the control center, which sends a second signal.
  • the second signal controls the switching of the first shifting device, so that the current through the semiconductor cooling plate 132 is reduced or the semiconductor cooling plate 132 is not operated (reduced or inoperative is the temperature monitored by the first temperature sensor 140 and controlled by the control center
  • the normal temperature range set in the center is controlled by comparison) in order to adjust the heat dissipation of the chip body And so forth.
  • the hot surface of the semiconductor cooling plate 132 is in contact with the first heat conducting plate 131, and the heat generated by the chip is transferred to the first heat conducting plate 131 through the semiconductor cooling sheet 132, and the second sensor monitors the high temperature temperature signal of the first heat conducting plate 131 ,
  • the high-temperature temperature signal is transmitted to the control center, the control center sends a third signal, the third signal controls the second shifting device to switch, so that the fan works, so as to transfer heat through the heat sink 111 and the fan, and at the same time
  • the sensor 150 monitors the low-temperature temperature signal of the first heat-conducting plate 131, and transmits the low-temperature temperature signal to the control center, and the control center sends out a fourth signal, which controls the second shifting device to switch, so that the fan wind speed is reduced or the fan does not Work (reduction or non-operation is controlled by the control center comparing the temperature monitored by the second temperature sensor 150 with the normal temperature range set in the control center), so as to adjust the heat dissipation of
  • the present application also provides a projection device.
  • the projection device includes a housing, a chip, and the above-mentioned chip heat dissipation device 100.
  • the chip directly contacts and connects with the chip mounting area.
  • Both the chip and the chip heat dissipation device 100 are disposed in the casing. Integrating the above-mentioned chip heat dissipation device 100 in a projection device to dissipate heat for the projection device chip can reduce the volume of the projection device and make the heat dissipation effect of the chip less affected by the environment.
  • the cold surface made of semiconductor cooling fins is used for heat dissipation. Since the cooling effect of the semiconductor cooling chip is controlled by the magnitude of the current, it is less affected by the environment.
  • the semiconductor cooling sheet can be protected in the installation cavity.
  • the opening of the first groove and the second groove can shorten the distance between the semiconductor cooling plate and the chip while ensuring the strength of the first heat conduction plate and the second heat conduction plate, thereby improving the heat dissipation effect. Opening the first groove and the second groove can also make the cold surface of the semiconductor cooling sheet expand the heat dissipation area through the second heat conducting plate. And the first groove and the second groove can reduce the volume of the entire chip heat dissipation device to a certain extent.
  • the projection device provided by the present application integrates the above-mentioned chip heat dissipation device into the projection device to dissipate the chip of the projection device, which can reduce the volume of the projection device and make the heat dissipation effect of the chip less affected by the environment.

Abstract

一种芯片散热装置(100)及投影设备。芯片散热装置(100)包括导热组件(130)、半导体制冷片(132)和散热组件。导热组件(130)包括第一导热板(131)和第二导热板(133)。第一导热板(131)凹设有第一凹槽(1311)。第二导热板(133)凹设有第二凹槽(1331)。第一凹槽(1311)和第二凹槽(1331)形成安装腔。半导体制冷片(132)安装于安装腔内，半导体制冷片(132)有冷表面和热表面。冷表面和热表面分别与第一凹槽(1311)的底面和第二凹槽(1331)的底面连接。第二导热板(133)远离第一导热板(131)的表面设置有芯片安装部。散热组件与第一导热板(131)可导热地连接。

Description

一种芯片散热装置及投影设备
本公开要求在2018年10月29日提交中国专利局、申请号为201811265535.6的中国专利申请的优先权，以上申请的全部内容通过引用结合在本公开中。
技术领域
本申请涉及芯片散热技术领域，例如涉及一种芯片散热装置及投影设备。
背景技术
相关技术中，DMD芯片在7000以上高流明激光投影设备中，散热方式普遍采用传统风冷或水排方式。在环境温度较高或较低的条件下，两种散热方式受到环境的影响较大。
相关技术的散热方式在环境较高的时候，导致DMD芯片的温度也随之升高，使其使用寿命大为降低。在环境温度较低的时候，散热装置冷凝段的液体分子活性大为降低甚至结晶，则失去了散热作用。相关技术所采用的风冷和水冷方式，要达到较好的散热效果，需要设置多个风扇或多条水冷回路，这样增大了投影设备的体积。
发明内容
本申请提供一种芯片散热装置，以便于在一定程度上解决相关技术中散热效果受环境影响较大，散热系统体积较大的问题。本申请所提供的芯片散热装置受环境影响小，体积小。
本申请还提供一种投影设备，该投影设备的芯片散热好，散热系统的体积小。
本申请是采用以下技术方案实现的：
一种芯片散热装置，包括导热组件、半导体制冷片和散热组件，所述导热组件包括第一导热板和第二导热板；所述第一导热板的面向所述第二导热板的第一表面凹设有第一凹槽，所述第二导热板的面向所述第一导热板的第二表面凹设有第二凹槽，所述第一凹槽和所述第二凹槽位置相对并形成安装腔；所述半导体制冷片安装于所述安装腔内，所述半导体制冷片具有相对设置的冷表面和热表面，所述半导体制冷片的热表面与所述第一凹槽的底面可导热地连接，所述半导体制冷片的冷表面与所述第二凹槽的底面可导热地连接；所述第二导热 板远离所述第一导热板的表面设置有芯片安装部，所述芯片安装部的位置与所述第二凹槽的位置相对应；所述散热组件与所述第一导热板可导热地连接。
本申请还提供了另一种芯片散热装置，该芯片散热装置包括导热组件、半导体制冷片和散热组件，所述导热组件包括第一导热板和第二导热板；所述第一导热板的面向所述第二导热板的第一表面凹设有第一凹槽，所述第二导热板的面向所述第一导热板的第二表面为平面，所述第一凹槽和第二表面形成安装腔；所述半导体制冷片安装于所述安装腔内，所述半导体制冷片具有相对设置的冷表面和热表面，所述半导体制冷片的热表面与所述第一凹槽的底面可导热地连接，所述半导体制冷片的冷表面与所述第二表面可导热地连接；所述第二导热板远离所述第一导热板的表面设置有芯片安装部；所述散热组件与所述第一导热板可导热地连接。
本申请还提供了一种投影设备，该投影设备包括壳体、芯片和上述任一项所述的芯片散热装置，所述芯片直接与所述芯片安装部可导热地连接，所述芯片和所述芯片散热装置均设置于所述壳体内。
附图说明
下面将对实施例中所需要使用的附图作简单地介绍，应当理解，以下附图仅示出了本申请的某些实施例，因此不应被看作是对范围的限定，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他相关的附图也属于本申请的保护范围。
图1为本发明实施例提供的芯片散热装置的结构示意图；
图2为本发明实施例提供的芯片散热装置在第一视角下的爆炸图；
图3为本发明实施例提供的芯片散热装置中第二导热板的结构示意图；
图4为本发明实施例提供的芯片散热装置中第一导热板在第二视角下的第一结构示意图；
图5为本发明实施例提供的芯片散热装置中第一导热板在第三视角下的结构示意图；
图6为本发明实施例提供的芯片散热装置中热管组件的结构示意图；
图7为本发明实施例提供的芯片散热装置在第四视角下的爆炸图。
图标：100-芯片散热装置；110-散热片组件；111-散热片；120-热管组件；121-U型管；1211-第一支管；1212-第二支管；1213-连接管；122-L型管；1221- 第一型管；1222-第二型管；130-导热组件；131-第一导热板；1311-第一凹槽；1312-第三凹槽；1313-第一凹陷槽；1314-第二凹陷槽；132-半导体制冷片；133-第二导热板；1331-第二凹槽；1332-凸块；140-第一温度传感器；150-第二温度传感器。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。通常在此处附图中描述和示出的本发明实施例的组件可以以各种不同的配置来布置和设计。因此，以下对在附图中提供的本申请的实施例的详细描述并非旨在限制要求保护的本申请的范围，而是仅仅表示本申请的选定实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步定义和解释。
实施例
请参阅图1和图2，芯片散热装置100包括导热组件130、半导体制冷片132和散热组件。导热组件130包括第一导热板131和第二导热板133。第一导热板131的面向第二导热板133的第一表面凹设有第一凹槽1311，第二导热板133的面向第一导热板131的第二表面凹设有第二凹槽1331，第一凹槽1311和第二凹槽1331位置相对并形成安装腔。半导体制冷片132安装于安装腔内。半导体制冷片132具有相对设置的冷表面和热表面。半导体制冷片132的热表面与第一凹槽1311的底面可导热地连接，半导体制冷片132的冷表面与第二凹槽1331的底面可导热地连接。第二导热板133远离第一导热板131的表面设置有芯片安装部。芯片安装部的位置与第二凹槽1331的位置相对应。散热组件与第一导热板131可导热地连接。
需要说明的是，第一导热板131的面向第二导热板133的第一表面也可以为平面，第二导热板133的面向第一导热板131的第二表面凹设有第二凹槽1331，第一表面和第二凹槽1331形成安装腔。此时导体制冷片的热表面与第一表面可导热地连接，半导体制冷片132的冷表面与第二凹槽1331的底面可导热地连接。或者，第一导热板131的面向第二导热板133的第一表面凹设有第一凹槽1311， 第二导热板133的面向第一导热板131的第二表面为平面，第一凹槽1311和第二表面形成安装腔。此时，半导体制冷片132的热表面与第一凹槽1311的底面可导热地连接，半导体制冷片132的冷表面与第二表面可导热地连接。
半导体制冷片132也叫热电制冷片，其原理是Peltier效应，它的优点是没有滑动部件，应用在一些空间受到限制，可靠性要求高，无制冷剂污染的场合。利用半导体材料的Peltier效应，当直流电通过两种不同半导体材料串联成的电偶时，在电偶的两端即可分别吸收热量和放出热量，可以实现制冷的目的。它是一种产生负热阻的制冷技术，其特点是无运动部件，可靠性也比较高。通过输入电流的控制，可实现高精度的温度控制，通电不到一分钟，制冷片就能达到最大温差。
通过半导体制冷版的制冷特性，将半导体制冷片132冷表面用于散热。由于半导体制冷片132的制冷效果由电流的大小控制，受到环境的影响较小。通过在第一导热板131和第二导热板133上开设第二凹槽1331和第一凹槽1311，能够将半导体制冷片132保护在安装腔内。并且开设第一凹槽1311和第二凹槽1331能够在保证第一导热板131和第二导热板133强度的同时，缩短半导体制冷片132与芯片之间的距离，从而提升散热效果。开设第一凹槽1311与第二凹槽1331还能够使得半导体制冷片132的冷表面通过第二导热板133扩大散热的面积。并且第一凹槽1311与第二凹槽1331能够在一定程度上缩小整个芯片散热装置100的体积。
为了防止第一导热板131和第二导热板133直接接触，造成第一导热板131上的热量直接向第二导热板转移，使第二导热板133的温度上升，降低冷却效果。在一些实施例中，在第一表面与第二表面之间留有间隙或者填充有隔热材料。为了获得较好的散热效果，第一凹槽1311的底面与热表面直接接触或者在第一凹槽1311的底面与热表面之间填充导热膏，第二凹槽1331的底面与冷表面直接接触或者在第二凹槽1331的底面与冷表面之间填充导热膏。当第一凹槽1311的底面与热表面直接接触，第二凹槽1331的底面与冷表面直接接触时，第一凹槽1311的深度与第二凹槽1331的深度之和小于半导体制冷片132的厚度。当第一凹槽1311的底面与热表面之间填充有导热膏、第二凹槽1331的底面与热表面之间填充有导热膏或者二者同时填充有导热膏时，第一凹槽1311的深度与第二凹槽1331的深度之和可能小于或等于半导体制冷片132的厚度。
本实施例中，散热组件可以是风冷组件，风冷组件包括散热片组件110和热管组件120，散热片组件110与热管组件120连接。导热组件130、热管组件120和散热片组件110依次从靠近芯片至远离芯片的方向进行安装设置，以便对芯片进行散热，使芯片在恒温状态下工作。
在一些实施例中，冷热组件130包括第一导热板131和第二导热板133，半导体制冷片132设置于第一导热板131和第二导热板133之间，第二导热板133的远离第一导热板131的一侧与芯片接触，第一导热板131的远离第二导热板133的一侧连接散热组件。可选地，第一导热板131的远离第二导热板133的一侧连接热管组件120，散热片组件110设置于热管组件120。
可选地，芯片为DMD芯片、单片机芯片、继电器控制芯片等，本实施例中，能够通过芯片散热装置100进行散热的芯片均属于本实施例的保护范围。
对半导体制冷片132通电，半导体制冷片132的冷面会迅速降温，与半导体制冷片132贴合的第二导热板133同步降温，而通过第二导热板133与芯片接触，使芯片达到散热效果。第一导热板131与半导体制冷片132的热面贴合，将半导体制冷片132的热面热量传导至热管组件120和散热片组件110，最后通过风扇或自然对流排出，使芯片的散热效果很好。
在一些实施例中，请参阅图3和图4，第一导热板131的靠近第二导热板133的一侧设置有第一凹槽1311，第二导热板133的靠近第一导热板131的一侧设置有第二凹槽1331，半导体制冷片132的两侧分别设置于第一凹槽1311和第二凹槽1331内。
将半导体制冷片132卡设在第一凹槽1311和第二凹槽1331内，第一凹槽1311和第二凹槽1331相对设置，形成一个长方体的空腔，半导体制冷片132设置在空腔内，空腔通过两个条形槽与外界连通，两个条形槽用于设置与半导体制冷片132连通的电线，方便半导体制冷片132的安装。
第二导热板133、半导体制冷片132和第一导热板131贴合，并通过螺丝将第二导热板133和第一导热板131固定在一起，进行半导体制冷片132的安装。
本实施例中，第一导热板131和第二导热板133均为铜板，即第一导热板131为热面铜板，第二导热板133为冷面铜板，使其传热效果更好，并且成本较低。
第二导热板133的远离半导体制冷片132的一侧设置有用于安装芯片的凸块1332。将芯片的背面安装在凸块1332上，芯片工作产生的热量能够很快速地传 递给冷面铜板，从而进行散热。凸块1332上开设有导线槽，该导线槽通过第二导热板133一直延伸到第二导热板133外侧。第二导热板133上还开设有方便芯片连接的一端开口的凹槽。第二导热板133的远离半导体制冷片132的一侧设置有多个用于与第一导热板131和芯片连接的通孔。
本实施例中，凸块1332与第二凹槽1331相对设置，即凸块1332和第二凹槽1331分别位于第二导热板133的两侧，与凸块1332连接的芯片散发的热量可以直接通过半导体制冷片132传递给第一导热板131，提高散热效率。
请参阅图5和图6，在一些实施例中，芯片散热装置100还包括热管组件120和散热片组件110，第一导热板131的远离第二导热板133的一侧设置有多个第三凹槽1312，热管组件120的一端设置于第三凹槽1312内，另一端连接散热片组件110。
通过第三凹槽1312，将热管组件120安装在第一导热板131上，使第一导热板131上的热量能够很快传递给热管组件120，并通过热管组件120传递给散热片组件110，并通过风扇或自然对流排出。
可选地，第一凹槽1311与第三凹槽1312对应设置。即第一凹槽1311和第三凹槽1312分别位于第一导热板131的两侧，半导体制冷片132传递的热量可以直接通过第一导热板131传递给热管组件120，提高散热效率。
在一些实施例中，热管组件120包括多根管件，第三凹槽1312包括多个，一个管件设置于一个第三凹槽1312内，对热管组件120进行安装。
在一些实施例中，在第一导热板131上开设有四个沉头孔和两个通孔，四个沉头孔在第一导热板131的上下左右分别布置一个，两个通孔分布在第一导热板131左侧的凸起上。
可选地，请参照图7，热管组件120包括多根U型管121和多根L型管122，每根U型管121包括第一支管1211、第二支管1212和连接第一支管1211与第二支管1212的连接管1213，每根L型管122包括第一型管1221和与第一型管1221连接的第二型管1222。每根U型管121的连接管1213设置于一个第三凹槽1312内，每根L型管122的第一型管1221设置于一个第三凹槽1312内。第一支管1211与第二支管1212平行设置。第一支管1211与第二支管1212的形状和尺寸相同。第一支管1211与第二支管1212分别设置于连接管1213的两端。第一支管1211、第二支管1212和连接管1213均为圆形管。连接管1213分为第一直线管部和两个第一弧线管部，两个第一弧线管部分别位于第一直线管部的 两端并与第一直线管部连接。第一弧线管部呈四分之一的圆弧状，第一支管1211通过第一弧状管部与第一直线管部连接，使得第一支管1211与第一直线管部呈垂直关系。第二支管1212通过第一弧状管部与第一直线管部连接，使得第二支管1212与第一直线管部呈垂直关系。第一型管1221被制作为偏平的管状，以增大与第三凹槽1312的接触面积，便于导热。第一型管1221靠近第二型管1222的一端，扁平管状的第一型管1221逐渐过渡为圆型管。第二型管1222为圆形管。第二型管1222包括第二弧线管部和第二直线管部，第二弧线管部呈四分之一的圆弧状，第二直线管部通过第二弧线管部与第一型管1221连接，使得第二直线管部与第一型管1221呈垂直关系。第一支管1211、第二支管1212和第二直线管部的尺寸和形状相同。
为了同时使U型管121和L型管122与第一导热板131的连接效果更好。在一些实施例中，部分第三凹槽1312沿第一方向延伸且部分第三凹槽1312沿第二方向延伸，第一方向与第二方向垂直。在本实施例中，第一方向为向内侧的方向，第二方向为水平方向。在一些实施例中，在第一导热板131上设置有用于与第一直线管部连接的第一凹陷槽1313和用于与第一型管1221连接的第二凹陷槽1314。第一凹陷槽1313和第二凹陷槽1314均属于第三凹槽1312。第一凹陷槽1313的延伸方向与第二凹陷槽1314的延伸方向垂直，更加方便U型管121和L型管122的设置。在一些实施例中，第一凹陷槽1313为通槽，第二凹陷槽1314为一端开口的凹槽。第一凹陷槽1313与第二凹陷槽1314相互并不连通。第一凹陷槽1313为圆弧形凹槽。第一凹陷槽1313刚好能够容纳第一直线管部的一半。第二凹陷槽1314为方形凹槽。扁平状的第一型管1221两侧圆弧刚好与第二凹陷槽1314的两侧壁相切。第二凹陷槽1314刚好能够容纳第一型管1221。此时，第一支管1211与第二直线管部呈平行关系，且第一支管1211与第二型管1222在第一导热板131的同侧。
可选地，散热片组件110包括多个散热片111，散热片111设置于热管组件120的远离第一导热板131的一端。多个散热片111重叠设置于U型管121的远离第一导热板131和L型管122的远离第一导热板131的一端，方便散热片111进行设置，并使热管与散热片111之间的传热效果更好。请参照图7，散热片111的表面开设有用于与第一支管1211、第二支管1212和第二型管1222连接的通孔。其中与第一支管1211和第二支管1212连接的通孔均位于散热片111的左侧，并在上下方向分别分布。与第二型管1222连接的通孔间隔分布于散热 片111的右侧。与第一支管1211和第二支管1212连接的通孔之间的距离与第一支管1211和第二支管1212之间的距离相同。与第二型管1222连接的通孔之间的距离与第二型管1222之间的距离相同。需要说明的是，在本实施例中，U型管121成对地使用，两U型管121之间的距离为1-2mm。L型管122成对地使用，两L型管122之间的距离为1-2mm。
请参照图7，在一些实施例中，散热片111整体呈正方形状，在正方形状的散热片111中心设置有方形的通孔，在该方形通孔和与第一支管1211、第二支管1212连接的通孔之间上下间隔地设置有两个方形的通孔。在该方形通孔的上方上下间隔的设置有两个方形通孔。在散热片111的左侧开设有一个方形缺口。五个方形通孔与一个方形的缺口，其开设位置正好与第一导热板131上的四个沉头孔和两个通孔位置相对应。其中，方形缺口的位置与处于第一导热板131下方的沉头孔位置相对应。多个散热片111重叠在一起，形成散热片组件110。请参照图7，多个散热片111重叠在一起后，通过设置在上下表面的两组金属方板将散热片111连接在一起。通过五个方形通孔和一个方形缺口与第一导热板131上的相应通孔连接。加强整个散热组件的连接强度。散热片111上开设的通孔叠在一起后形成了一个连接通道。散热片组件110通过该连接通道与第一支管1211、第二支管1212和第二型管1222连接。散热片组件110的厚度不超过第一支管1211的长度。
本实施例中，散热片组件110焊接在热管组件120上，热管组件120焊接在第一导热板131上，以便进行安装。热管组件120和散热片组件110的结构可以进行调整，以满足不同的散热需求。
在一些实施例中，冷热组件130还包括第一温度传感器140和第二温度传感器150，第一温度传感器140设置于第二导热板133，第二温度传感器150设置于第一导热板131。通过第一温度传感器140监测第二导热板133的温度，第二温度传感器150监测第一导热板131的温度，以便实时调控芯片的散热情况，芯片散热效果更好，使芯片在恒温状态下工作。
在一些实施例中，第一温度传感器140设置于第二表面，第二温度传感器150设置于第一导热板131的远离第二导热板133的一侧。能够更加准确地监测第一导热板131和第二导热板133的温度，以便更好地控制芯片的散热。
在一些实施例中，第二温度传感器150设置于第一导热板131的远离第三凹槽1312的一端，避免热管的安装影响第一导热板131的温度的监测，使第一导热板131的温度监测更加准确。
在一些实施例中，请参照图7，第一温度传感器140设置于第二导热板133的上端，第二温度传感器150设置于第一导热板131的右上角凸起上。
本实施例中，芯片散热装置100还包括控制装置，控制装置与半导体制冷片132、第一温度传感器140和第二温度传感器150均电连接。散热片组件110外设置有风扇，可选地，控制装置包括第一换挡装置、第二换挡装置以及控制中心。半导体制冷片132与第一换挡装置连接，风扇上设置有第二换挡装置，控制中心与第一换挡装置、第二换挡装置、第一温度传感器140和第二温度传感器150均电连接。
本实施例中，散热组件还可以是水冷组件，水冷组件包括水管，第一导热板131安装于水管的外壁，水管的两端分别为进水口和出水口，以便对第一导热板131进行冷却。
本实施例提供的芯片散热装置100的工作原理为：芯片工作产生热量，使第二导热板133发热，第一温度传感器140监测到第二导热板133的高温温度信号，将高温温度信号传递给控制中心，控制中心发出第一信号，第一信号控制第一换挡装置切换，使半导体制冷片132工作，半导体制冷片132工作的过程中，半导体制冷片132的冷面与第二导热板133接触，使第二导热板133降温，对芯片进行散热，同时，第一温度传感器140监测到第二导热板133的低温温度信号，将低温温度信号传递给控制中心，控制中心发出第二信号，第二信号控制第一换挡装置切换，使通过半导体制冷片132的电流减小或半导体制冷片132不工作(减小或不工作是通过控制中心对第一温度传感器140监测到的温度与控制中心内设置的正常温度范围进行比对来控制的)，以便对芯片本体的散热情况进行调节，如此往复。
同理：半导体制冷片132的热面与第一导热板131接触，将芯片产生的热量通过半导体制冷片132传递给第一导热板131，第二传感器监测到第一导热板131的高温温度信号，则将高温温度信号传递给控制中心，控制中心发出第三信号，第三信号控制第二换挡装置切换，使风扇工作，以便通过散热片111和风扇将热量传递出去，同时，第二温度传感器150监测到第一导热板131的低温温度信号，将低温温度信号传递给控制中心，控制中心发出第四信号，第四信 号控制第二换挡装置切换，使风扇的风速减小或风扇不工作(减小或不工作是通过控制中心对第二温度传感器150监测到的温度与控制中心内设置的正常温度范围进行比对来控制的)，以便对热管和散热片111的散热情况进行调节，如此往复。
本申请还提供了一种投影设备，该投影设备包括壳体、芯片和上述的芯片散热装置100。芯片直接与芯片安装区域接触并连接。芯片和芯片散热装置100均设置于壳体内。将上述的芯片散热装置100整合在投影设备内，为投影设备芯片散热，能够减小投影设备的体积并使得芯片的散热效果受环境的影响小。
本申请的有益效果包括：
通过半导体制冷片的制冷特性，将半导体制冷片制的冷表面用于散热。由于半导体制冷片的制冷效果由电流的大小控制，受到环境的影响较小。通过在第一导热板和第二导热板上开设第一凹槽和第二凹槽，能够将半导体制冷片保护在安装腔内。并且开设第一凹槽和第二凹槽能够在保证第一导热板和第二导热板强度的同时，缩短半导体制冷片与芯片之间的距离，从而提升散热效果。开设第一凹槽与第二凹槽还能够使得半导体制冷片的冷表面通过第二导热板扩大散热的面积。并且第一凹槽与第二凹槽能够在一定程度上缩小整个芯片散热装置的体积。
本申请提供的投影设备将上述的芯片散热装置整合在投影设备内，为投影设备的芯片散热，能够减小投影设备的体积并使得芯片的散热效果受环境的影响小。

Claims (10)

  1. 一种芯片散热装置，包括：
    导热组件，所述导热组件包括第一导热板和第二导热板；所述第一导热板的面向所述第二导热板的第一表面凹设有第一凹槽，所述第二导热板的面向所述第一导热板的第二表面凹设有第二凹槽，所述第一凹槽和所述第二凹槽位置相对并形成安装腔；
    半导体制冷片，所述半导体制冷片安装于所述安装腔内，所述半导体制冷片具有相对设置的冷表面和热表面，所述半导体制冷片的热表面与所述第一凹槽的底面可导热地连接，所述半导体制冷片的冷表面与所述第二凹槽的底面可导热地连接；所述第二导热板远离所述第一导热板的表面设置有芯片安装部，所述芯片安装部的位置与所述第二凹槽的位置相对应；以及
    散热组件，所述散热组件与所述第一导热板可导热地连接。
  2. 根据权利要求1所述的芯片散热装置，其中，所述第一表面与所述第二表面之间留有间隙或者填充有隔热材料。
  3. 根据权利要求1或2所述的芯片散热装置，其中，所述第一凹槽的深度与所述第二凹槽的深度之和小于所述半导体制冷片的厚度。
  4. 根据权利要求1-3任一项所述的芯片散热装置，其中，所述第一凹槽的底面与所述热表面直接接触或者在所述第一凹槽的底面与所述热表面之间填充导热膏，所述第二凹槽的底面与所述冷表面直接接触或者在第二凹槽的底面与所述冷表面之间填充导热膏。
  5. 根据权利要求1所述的芯片散热装置，其中，所述导热组件还包括第一温度传感器和第二温度传感器，所述第一温度传感器设置于所述第二导热板，所述第二温度传感器设置于所述第一导热板。
  6. 根据权利要求5所述的芯片散热装置，其中，所述第一温度传感器设置于所述第二表面，所述第二温度传感器设置于所述第一导热板的远离所述第二导热板的一侧。
  7. 根据权利要求1所述的芯片散热装置，所述芯片散热装置还包括热管组件和散热片组件，所述第一导热板的远离所述第二导热板的一侧设置有多个第三凹槽，所述热管组件的一端设置于所述第三凹槽内，另一端连接所述散热片组件。
  8. 根据权利要求7所述的芯片散热装置，其中，所述散热组件为风冷组件，所述风冷组件包括散热片组件和热管组件，所述第一导热板的远离所述第二导热板的一侧连接所述热管组件，所述散热片组件设置于所述热管组件。
  9. 一种投影设备，包括壳体、芯片和根据权利要求1-8任一项所述的芯片散热装置，所述芯片直接与所述芯片安装部可导热地连接，所述芯片和所述芯片散热装置均设置于所述壳体内。
  10. 一种芯片散热装置，包括：
    导热组件，所述导热组件包括第一导热板和第二导热板；所述第一导热板的面向所述第二导热板的第一表面凹设有第一凹槽，所述第二导热板的面向所述第一导热板的第二表面为平面，所述第一凹槽和第二表面形成安装腔；
    半导体制冷片，所述半导体制冷片安装于所述安装腔内，所述半导体制冷片具有相对设置的冷表面和热表面，所述半导体制冷片的热表面与所述第一凹槽的底面可导热地连接，所述半导体制冷片的冷表面与所述第二表面可导热地连接；所述第二导热板远离所述第一导热板的表面设置有芯片安装部；以及
    散热组件，所述散热组件与所述第一导热板可导热地连接。
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