WO2017181840A1 - 一种igbt模块组件 - Google Patents

一种igbt模块组件 Download PDF

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Publication number
WO2017181840A1
WO2017181840A1 PCT/CN2017/079246 CN2017079246W WO2017181840A1 WO 2017181840 A1 WO2017181840 A1 WO 2017181840A1 CN 2017079246 W CN2017079246 W CN 2017079246W WO 2017181840 A1 WO2017181840 A1 WO 2017181840A1
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Prior art keywords
igbt module
cold plate
module assembly
assembly according
igbt
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PCT/CN2017/079246
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English (en)
French (fr)
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王京
蒋世用
张羽
刘克勤
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珠海格力电器股份有限公司
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Priority to ES17785325T priority Critical patent/ES2878154T3/es
Priority to EP17785325.6A priority patent/EP3447796B1/en
Priority to US16/095,651 priority patent/US10811333B2/en
Publication of WO2017181840A1 publication Critical patent/WO2017181840A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]

Definitions

  • the present invention relates to an electronic component, and more particularly to an IGBT module assembly.
  • the IGBT module is a modular semiconductor product that is packaged by IGBT (Insulated Gate Bipolar Transistor Chip) and FWD (Freewheeling Diode Chip) through a specific circuit bridge.
  • IGBT Insulated Gate Bipolar Transistor Chip
  • FWD Freewheeling Diode Chip
  • the two types of heat dissipation methods namely air-cooling heat dissipation and liquid-cooling heat dissipation, are mainly used to solve the heat dissipation problem of the IGBT module.
  • the air-cooling heat dissipation is to use a fan blower or a draft to dissipate heat for the IGBT module.
  • the method is simple in structure, low in price, safe and reliable, but The noise is large and the heat dissipation efficiency is not high, which is difficult to apply in high-power occasions where heat is severe.
  • the liquid cooling heat dissipation is a circulating cooling medium using a refrigerant liquid having a large heat capacity as a cold plate, and then the IGBT module 10 is mounted on the cold plate 20, and heat is transferred to the cold plate 20, and a refrigerant tube is disposed in the cold plate 20. 30, heat exchange through the refrigerant liquid in the refrigerant pipe 30 to achieve heat dissipation to the IGBT module, as shown in Figure 1, the method is high in efficiency and low in noise, and is very suitable for high-power applications where the IGBT module generates severe heat.
  • a large amount of condensed water is formed and accumulated on the cold plate 20, and the larger the working power, the more condensed water.
  • the condensed water With the continuous accumulation of condensed water and the vibration of the unit, the condensed water will form a disordered flow of water on the surface of the cold plate 20 and the surface of the IGBT module 10, which easily leads to the formation of a short circuit between the terminals of the IGBT module 10, resulting in an electrical safety accident. .
  • An IGBT module assembly includes a cold plate and an IGBT module fixed on the cold plate, wherein the IGBT module is provided with a connection terminal on an end surface away from the cold plate, and the IGBT module includes a side surface adjacent to the end surface, the side surface is cold
  • the plate is formed with a water guide.
  • the side surface is disposed obliquely to the center of the IGBT module near an end of the cold plate.
  • the side of the side surface adjacent to the cold plate is inclined at an angle of 30° to 60° toward the center of the IGBT module.
  • the side of the side surface adjacent to the cold plate is inclined at an angle of 45° toward the center of the IGBT module.
  • the side surface adjacent to the cold plate defines a semicircular opening groove, and the opening groove forms a water guiding groove with the surface of the cold plate.
  • the IGBT module is a multi-faceted frustum structure or a truncated cone structure.
  • the IGBT module is a four-sided frustum structure, and the side surface is provided as an isosceles trapezoid.
  • a plurality of refrigerant tubes are disposed in the cold plate, and a cold medium is circulated in the refrigerant tubes.
  • the cold plate is a metal plate, and a connecting hole through which the refrigerant pipe is wound is provided inside.
  • the IGBT module is provided with a plurality of mounting holes
  • the cold plate is provided with a threaded hole corresponding to the position of the mounting hole, and the threaded hole is disposed away from the connecting hole.
  • the invention has the beneficial effects that the water guiding groove is formed by the side surface and the cold plate, in particular, the side of the IGBT module is inclined toward the center of the IGBT module near the cold plate to form a water guiding groove, so that a large amount of condensed water accumulated on the cold plate can be
  • the water guide guides out and flows out, so that the condensed water does not flow to the end face of the IGBT module with the terminal, so as to avoid the occurrence of short circuit between the terminals on the IGBT module and prevent electrical safety accidents.
  • the IGBT module can work safely and efficiently in high-power heat dissipation, and expands the application field of the IGBT module.
  • FIG. 1 is a schematic view showing the assembly structure of an IGBT module and a cold plate in the prior art of the present invention
  • FIG. 2 is a perspective view showing an assembly structure of an IGBT module and a cold plate in Embodiment 1 of the present invention
  • FIG. 3 is a side view showing an assembly structure of an IGBT module and a cold plate in Embodiment 1 of the present invention
  • FIG. 4 is a perspective view showing the assembly structure of an IGBT module and a cold plate in Embodiment 2 of the present invention.
  • the present invention provides an IGBT module assembly.
  • the IGBT module assembly includes a cold plate 1 and an IGBT module 2 fixed to the cold plate 1.
  • the cold plate 1 has a rectangular parallelepiped structure and is wound therein.
  • a plurality of refrigerant tubes 11 are provided, and a cold medium is flowed in the refrigerant tubes 11 for dissipating heat to the IGBT module 2.
  • a connection hole (not shown) provided through the cold plate 1 is provided inside the cold plate 1, and the connection hole is for winding the refrigerant pipe 11.
  • the cold plate 1 On the surface of the cold plate 1 in contact with the IGBT module 2, a plurality of screw holes (not shown) are provided, which are arranged away from the above-mentioned connection holes.
  • the cold plate 1 is made of a metal plate material, and has better thermal conductivity, and can transfer heat radiated from the IGBT module 2 to the cold plate 1 and is performed by the cold medium in the refrigerant tube 11. The heat dissipation further improves the heat dissipation effect.
  • the IGBT module 2 includes an end surface 21 away from the cold plate 1 and a side surface 22 adjacent to the end surface 21, wherein a plurality of terminals 3 are provided on the end surface 21, and the terminal 3 can be electrically connected to the outside through a screw, and the side surface 22 is cold.
  • the plates 1 together form a water guide 4.
  • the IGBT module 2 is dispersed. When hot, a large amount of condensed water is collected, and the condensed water can be guided through the water guiding tank 4, so that the condensed water flows out from the water guiding tank 4 without flowing to the surface of the IGBT module 2 where the terminal 3 is provided, thereby avoiding the terminal block.
  • the occurrence of three short-circuits between the poles prevented the occurrence of electrical safety accidents.
  • the side surface 22 is inclined toward the center of the IGBT module 2 near the end of the cold plate 1, and the water guide 4 is formed by the inclined side surface 22 and the cold plate 1 to guide the condensed water out.
  • the inclination angle of the side 22 close to the end of the cold plate 1 to the center of the IGBT module 2 is set to 30°-60°, and the setting of the angle enables the water guide 4 to have better water guiding effect. And the process manufacturing and material saving have higher comprehensive benefits. More preferably, the present embodiment sets the above inclination angle to 45°.
  • the IGBT module 2 can be selected as a multi-faceted frustum structure or a truncated cone structure, and only one end of the side surface 22 close to the cold plate 1 is inclined toward the center of the IGBT module 2.
  • the IGBT module 2 has a four-sided frustum structure.
  • the side surface 22 has a trapezoidal structure, and one side of the contact with the cold plate 1 is an upper bottom side, that is, a shorter length side.
  • the structure of the water guide 4 can be formed.
  • the side surface 22 is an isosceles trapezoidal structure.
  • a plurality of mounting holes 23 corresponding to the threaded holes of the cold plate 1 are formed in the IGBT module 2, and the IGBT module 2 can be fixed to the cold plate 1 by bolts passing through the mounting holes 23 and screwed with the screw holes. .
  • the threaded hole of the cold plate 1 is disposed away from the connection hole, and it is possible to prevent the refrigerant tube 11 in the cold plate 1 from interfering with the assembly when the cold plate 1 and the IGBT module 2 are assembled, and also prevent the refrigerant tube 11 from being blocked. Squeeze deformation and damage.
  • the structure of the IGBT module assembly described above does not cause condensed water to flow to the side of the IGBT module 2 where the terminal 3 is provided, regardless of how the IGBT module assembly is placed.
  • condensed water is collected between the side 22 of the top of the IGBT module 2 and the cold plate 1, and the condensed water is guided to the cold plate 1 and the IGBT due to the tilting blocking effect of the side surface 22.
  • Module 2 On both sides, along the cold plate 1 and the water guide 4 formed on both sides of the IGBT module 2, the water flow is not formed on the end surface 21 where the IGBT module 2 is provided with the terminal 3, and the pole between the terminals 3 is avoided.
  • the IGBT module can be safely and efficiently operated in a high-power heat dissipation occasion, and the application field of the IGBT module is expanded.
  • This embodiment further improves the structure of the water guiding channel 4 on the basis of the embodiment 1.
  • the embodiment has a semicircular shape at one end of the side surface 22 of the IGBT module 2 near the cold plate 1.
  • the open groove 5 forms a water guide 4 together with the cold plate 1 through the open groove 5.
  • the condensed water can directly flow out of the IGBT module 2 through the above-described water guide 4.
  • the opening groove 5 when the IGBT module assembly is placed vertically, the condensed water flows into the water guiding groove 4 formed by the opening groove 5 and the cold plate 1 along the surface of the cold plate 1 and the side surface 22, and does not flow to the IGBT module 2

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

本发明属于电子元件领域，公开了一种IGBT模块组件，包括冷板以及固接在冷板上的IGBT模块，IGBT模块远离冷板的端面上设有接线端子，所述IGBT模块包括与端面相邻的侧面，所述侧面与冷板形成有导水槽。本发明通过侧面与冷板形成导水槽，能够使冷板上聚集的大量冷凝水经导水槽导引流出，而不会使冷凝水流到IGBT模块设有接线端子的端面，避免出现IGBT模块上的接线端子间极间短路的情况，防止电气安全事故的发生。而且能够使IGBT模块在大功率散热场合安全高效的工作，拓展了IGBT模块的应用领域。

Description

一种IGBT模块组件 技术领域
本发明涉及一种电子元件，尤其涉及一种IGBT模块组件。
背景技术
IGBT模块是由IGBT(绝缘栅双极型晶体管芯片)与FWD(续流二极管芯片)通过特定的电路桥接封装而成的模块化半导体产品，IGBT模块的散热效率是制约其性能和可靠性的关键因素。
目前主要采用风冷散热和液冷散热这两种散热方式来解决IGBT模块的散热问题，其中风冷散热是使用风扇吹风或者抽风为IGBT模块散热，该方法结构简单、价格低廉、安全可靠，但是噪音较大且散热效率不高，在发热严重的大功率场合很难应用。
液冷散热是使用单位热容较大的冷媒液体作为冷板的循环冷却介质，随后将IGBT模块10安装在冷板20上，并向冷板20上传递热量，冷板20内设有冷媒管30，通过冷媒管30内的冷媒液体进行换热，以实现对IGBT模块的散热，如图1所示，该方法效率高、噪音小，非常适用于IGBT模块发热严重的大功率场合。但是，在使用液冷散热的过程中，冷板20上会形成并聚集大量的冷凝水，工作功率越大，冷凝水越多。随着冷凝水的不断聚集以及机组的震动，冷凝水会在冷板20表面及IGBT模块10表面形成无序的水流，极易导致IGBT模块10的接线端子间形成极间短路，造成电气安全事故。
发明内容
本发明的目的在于提供一种IGBT模块组件,以解决现有液冷散热方式中因冷凝水引起的IGBT模块上接线端子间的极间短路，造成电气安全事故的问题。
为达此目的，本发明采用以下技术方案：
一种IGBT模块组件，包括冷板以及固接在冷板上的IGBT模块，IGBT模块远离冷板的端面上设有接线端子，所述IGBT模块包括与端面相邻的侧面，所述侧面与冷板形成有导水槽。
作为优选，所述侧面靠近冷板的一端向IGBT模块的中心倾斜设置。
作为优选，所述侧面靠近冷板的一端向IGBT模块中心倾斜的角度为30°-60°。
作为优选，所述侧面靠近冷板的一端向IGBT模块中心倾斜的角度为45°。
作为优选，所述侧面靠近冷板的一端开设半圆形的开口槽，所述开口槽与冷板的表面形成所述导水槽。
作为优选，所述IGBT模块为多面锥台结构或者圆锥台结构。
作为优选，所述IGBT模块为四面锥台结构，所述侧面设置为等腰梯形。
作为优选，所述冷板内绕设有若干冷媒管，所述冷媒管内流通有冷媒介质。
作为优选，所述冷板为金属板，其内部贯穿设有供冷媒管绕设的连接孔。
作为优选，所述IGBT模块上开设有若干安装孔，所述冷板对应安装孔的位置设有螺纹孔，所述螺纹孔避开所述连接孔设置。
本发明的有益效果：通过侧面与冷板形成导水槽，具体是将IGBT模块的侧面靠近冷板的一端向IGBT模块的中心倾斜设置，形成导水槽，能够使冷板上聚集的大量冷凝水经导水槽导引流出，而不会使冷凝水流到IGBT模块设有接线端子的端面，避免出现IGBT模块上的接线端子间极间短路的情况，防止电气安全事故的发生。而且能够使IGBT模块在大功率散热场合安全高效的工作，拓展了IGBT模块的应用领域。
附图说明
图1是本发明现有技术中的IGBT模块与冷板的装配结构示意图；
图2是本发明实施例1中IGBT模块与冷板的装配结构的立体示意图；
图3是本发明实施例1中IGBT模块与冷板的装配结构的侧视图；
图4是本发明实施例2中IGBT模块与冷板的装配结构的立体示意图。
图中：
1、冷板；2、IGBT模块；3、接线端子；4、导水槽；5、开口槽；11、冷媒管；21、端面；22、侧面；23、安装孔；10、IGBT模块；20、冷板；30、冷媒管。
具体实施方式
下面结合附图并通过具体实施方式来进一步说明本发明的技术方案。
本发明提供一种IGBT模块组件，如图2以及图3所示，该IGBT模块组件包括冷板1以及固接在冷板1上的IGBT模块2，其中冷板1为长方体结构，其内绕设有若干冷媒管11，在冷媒管11内流动有冷媒介质，用于对IGBT模块2散热。具体的，在冷板1的内部开设有贯穿冷板1设置的连接孔(图中未示出)，该连接孔用于绕设冷媒管11。在冷板1与IGBT模块2相接触的表面上设有若干螺纹孔(图中未示出)，该螺纹孔避开上述连接孔设置。本实施例中，优选的，冷板1采用金属板材制成，进而具有较好的导热性能，能够将IGBT模块2散发的热量传递到冷板1上，并由冷媒管11内的冷媒介质进行散热，进一步的提高了散热效果。
IGBT模块2包括远离冷板1的端面21以及与该端面21相邻的侧面22，其中在端面21上设有若干接线端子3，接线端子3可以通过螺钉与外界形成电气连接，侧面22与冷板1共同形成导水槽4。在冷板1开始对IGBT模块2进行散 热时，会聚集大量冷凝水，通过导水槽4，能够对冷凝水进行引导，使冷凝水从导水槽4流出，而不会流到IGBT模块2设置有接线端子3的表面，避免了接线端子3间极间短路的情况出现，阻止了电气安全事故的发生。
本实施例中，侧面22靠近冷板1的一端向IGBT模块2的中心倾斜设置，通过倾斜设置的侧面22与冷板1共同形成导水槽4，将冷凝水导引流出。
优选的，本实施例中，将侧面22靠近冷板1的一端向IGBT模块2中心的倾斜角度设置为30°-60°，该角度的设置，能够使得导水槽4具有更佳的导水效果，且工艺制造、材料节省方面有着更高的综合效益。更为优选的，本实施例将上述倾斜角度设置为45°。
上述IGBT模块2可以选用为多面锥台结构或者圆锥台结构，只需满足其侧面22靠近冷板1的一端是向IGBT模块2的中心倾斜即可。本实施例中，IGBT模块2为四面锥台结构，相对应的，侧面22则为梯形结构，且其与冷板1接触的一边为上底边，即长度较短的一边。进而能够形成导水槽4的结构。优选的，该侧面22为等腰梯形结构。
在IGBT模块2上开设有若干与冷板1的螺纹孔一一对应的安装孔23，通过螺栓穿过上述安装孔23，并与螺纹孔螺纹连接，能够将IGBT模块2固定在冷板1上。本实施例中，上述冷板1的螺纹孔避开连接孔设置，能够避免在组装冷板1和IGBT模块2时，冷板1内的冷媒管11对组装造成干涉，也防止冷媒管11被挤压变形，出现损坏。
本实施例通过上述IGBT模块组件的结构，无论该IGBT模块组件怎么放置，都不会出现冷凝水流到IGBT模块2设有接线端子3的一面。例如，在IGBT模块组件竖直放置情况下，冷凝水在IGBT模块2的顶部的侧面22与冷板1之间聚集，由于侧面22的倾斜阻挡作用，冷凝水会被引导至冷板1及IGBT模块2 的两侧，沿着冷板1与IGBT模块2两侧形成的导水槽4流下，不会在IGBT模块2设有接线端子3所在的端面21上形成水流，避免出现接线端子3之间的极间短路；在IGBT模块组件水平放置(冷板1在上，IGBT模块2在下)情况下，由于IGBT模块2的侧面22形成的伞状外形结构，冷凝水会沿着IGBT模块2的四个侧面22流下，进而保护接线端子3不会接触到冷凝水；在IGBT模块组件水平放置(IGBT模块2在上，冷板1在下)情况下，冷凝水在冷板1的表面及与IGBT模块2的接触面附近区域聚集冷凝水，由于重力影响，冷凝水不会流到IGBT模块2的端面21上，也就不会使接线端子3接触到冷凝水。
通过上述IGBT模块组件的结构，能够使IGBT模块在大功率散热场合安全高效的工作，拓展了IGBT模块的应用领域。
实施例2：
本实施例在实施例1的基础上，对导水槽4的结构进一步的改进，具体的，如图4所示，本实施例在IGBT模块2的侧面22靠近冷板1的一端开设半圆形的开口槽5，通过开口槽5与冷板1共同形成导水槽4，当冷凝水聚集时，可以通过上述导水槽4直接流出IGBT模块2外。通过设置开口槽5，能够在IGBT模块组件竖直放置时，冷凝水会沿冷板1表面以及侧面22流入开口槽5与冷板1形成的导水槽4内，不会流到IGBT模块2设有接线端子3所在的端面21上。
其余结构与实施例1均相同，在此不再赘述。
显然，本发明的上述实施例仅仅是为了清楚说明本发明所作的举例，而并非是对本发明的实施方式的限定。对于所属领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有 的实施方式予以穷举。凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明权利要求的保护范围之内。

Claims (10)

  1. 一种IGBT模块组件，包括冷板(1)以及固接在冷板(1)上的IGBT模块(2)，IGBT模块(2)远离冷板(1)的端面(21)上设有接线端子(3)，所述IGBT模块(2)包括与端面(21)相邻的侧面(22)，所述侧面(22)与冷板(1)形成有导水槽(4)。
  2. 根据权利要求1所述的IGBT模块组件，其中，所述侧面(22)靠近冷板(1)的一端向IGBT模块(2)的中心倾斜设置。
  3. 根据权利要求2所述的IGBT模块组件，其中，所述侧面(22)靠近冷板(1)的一端向IGBT模块(2)中心倾斜的角度为30°-60°。
  4. 根据权利要求3所述的IGBT模块组件，其中，所述侧面(22)靠近冷板(1)的一端向IGBT模块(2)中心倾斜的角度为45°。
  5. 根据权利要求1所述的IGBT模块组件，其中，所述侧面(22)靠近冷板(1)的一端开设半圆形的开口槽(5)，所述开口槽(5)与冷板(1)的表面形成所述导水槽(4)。
  6. 根据权利要求1所述的IGBT模块组件，其中，所述IGBT模块(2)为多面锥台结构或者圆锥台结构。
  7. 根据权利要求6所述的IGBT模块组件，其中，所述IGBT模块(2)为四面锥台结构，所述侧面(21)设置为等腰梯形。
  8. 根据权利要求1所述的IGBT模块组件，其中，所述冷板(1)内绕设有若干冷媒管(11)，所述冷媒管(11)内流通有冷媒介质。
  9. 根据权利要求8所述的IGBT模块组件，其中，所述冷板(1)为金属板，其内部贯穿设有供冷媒管(11)绕设的连接孔。
  10. 根据权利要求9所述的IGBT模块组件，其中，所述IGBT模块(2)上开设有若干安装孔(23)，所述冷板(1)对应安装孔(23)的位置设有螺纹孔， 所述螺纹孔避开所述连接孔设置。
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