WO2014146437A1 - 大功率液体散热led灯 - Google Patents

大功率液体散热led灯 Download PDF

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Publication number
WO2014146437A1
WO2014146437A1 PCT/CN2013/086966 CN2013086966W WO2014146437A1 WO 2014146437 A1 WO2014146437 A1 WO 2014146437A1 CN 2013086966 W CN2013086966 W CN 2013086966W WO 2014146437 A1 WO2014146437 A1 WO 2014146437A1
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Prior art keywords
heat
heat dissipation
led
column
dissipating
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PCT/CN2013/086966
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English (en)
French (fr)
Inventor
冯林
Original Assignee
Feng Lin
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Application filed by Feng Lin filed Critical Feng Lin
Priority to CN201380005909.XA priority Critical patent/CN105283708B/zh
Publication of WO2014146437A1 publication Critical patent/WO2014146437A1/zh

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0272Adaptations for fluid transport, e.g. channels, holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06Thermal details
    • H05K2201/064Fluid cooling, e.g. by integral pipes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]

Definitions

  • the invention relates to an LED lamp, in particular to a high-power liquid heat-dissipating LED lamp. Background technique
  • the existing high-power LED lamp, the copper layer of the LED lamp and the aluminum substrate are provided with an insulating layer. Due to the low thermal conductivity of the insulating layer, the heat dissipation of the PN junction of the LED lamp is hindered, and the heat dissipation of the LED lamp is reduced. The effect affects the service life of the LED lamp. Summary of the invention
  • the object of the present invention is to overcome the deficiencies of the prior art and provide a high-power liquid heat-dissipating LED lamp for improving the thermal conductivity of the LED lamp insulation layer and improving the heat dissipation effect of the LED lamp.
  • a high-power liquid heat-dissipating LED lamp comprising a bracket, an LED and a heat sink, the LED is mounted on the bracket, the LED is connected with the heat sink, and an insulating heat-dissipating column is arranged between the LED and the heat sink to dissipate heat.
  • the column is in contact with the heat source of the LED and the heat sink, the heat sink is provided with a liquid guiding hole, the liquid guiding hole is provided with an insulating heat conduction oil, the heat conducting oil is in contact with the heat source position of the LED and the heat sink, and the heat of the LED heat source is passed through the heat dissipation column and The heat transfer oil is transferred to the heat dissipation plate, and the heat is radiated from the heat dissipation plate in the space to improve the heat dissipation efficiency of the LED; the insulation resistance of the heat dissipation column and the heat conduction oil is greater than or equal to the insulation resistance of the insulation layer.
  • the LED comprises a PN junction, a base, an electrode, a silica gel ball, a barrier layer, a copper layer, an insulating layer and an aluminum substrate, and a thermal conductive silicone pad is arranged between the aluminum substrate of the LED and the heat dissipation plate;
  • the PN junction is connected with the base, and the base is
  • the copper layer is connected, the copper layer is connected with the insulating layer, the insulating layer is connected with the aluminum substrate, the copper layer, the insulating layer and the aluminum substrate are integrally connected;
  • the heat conducting cavity is provided between the copper layer and the heat sink, and the heat conducting cavity is
  • the heat dissipation plate is disposed through the insulating layer, the aluminum substrate and the thermal conductive silicone pad;
  • the heat dissipation plate is provided with a heat dissipation channel, the liquid guiding hole is connected with the heat dissipation channel, the heat dissipation column is disposed in the heat conduction cavity, the liquid guiding
  • the working principle of high-power liquid heat-dissipating LED lamp is: LED of high-power liquid heat-dissipating LED lamp An insulating heat dissipating column is arranged between the heat dissipating plate, the liquid guiding hole of the heat dissipating post and the heat dissipating channel of the heat dissipating plate are filled with heat conducting oil, and the heat dissipating column directly contacts the copper layer of the LED and the heat dissipating plate; the PN junction of the LED is transmitted to The heat of the copper layer is directly transferred from the heat dissipation column to the heat dissipation plate.
  • the heat conduction oil is contacted with the copper layer and the heat dissipation plate, and the heat of the LED is transmitted to the heat dissipation plate through the heat conduction oil of the heat dissipation column and the heat dissipation oil of the heat dissipation plate of the heat dissipation plate; Insulating heat-dissipating column and heat-conducting oil instead of insulating layer, insulating and insulating the copper-clad layer from the aluminum substrate, and insulating and insulating the aluminum substrate from the heat-dissipating plate by using the heat-dissipating heat-dissipating column and the heat-conducting oil instead of the heat-dissipating silicone pad, thereby solving the low thermal conductivity of the insulating layer And the problem of poor heat dissipation, and does not reduce the insulation properties of the insulating layer.
  • the high-power liquid heat-dissipating LED lamp has three heat-dissipating paths: First, the heat generated by the PN junction of the LED passes through the base ⁇ copper layer ⁇ heat sink column ⁇ heat sink plate ⁇ atmosphere; second: the heat generated by the PN junction of the LED passes through the base ⁇ Copper layer ⁇ heat transfer oil ⁇ heat sink ⁇ atmosphere; Third: the heat generated by the PN junction of the LED through the base ⁇ copper layer ⁇ insulation layer ⁇ aluminum substrate ⁇ thermal silica gel pad ⁇ heat sink ⁇ atmosphere.
  • the beneficial effects of the invention are: the high-power liquid heat-dissipating LED lamp is provided with a heat-dissipating column and a heat-conducting oil, the heat-dissipating column and the heat-conducting oil are directly in contact with the copper-clad layer of the LED and the heat-dissipating plate, and most of the heat of the PN junction is applied to the copper layer and the heat dissipation The heat transfer oil of the column and the heat dissipation column is directly transmitted to the heat dissipation plate.
  • the thermal conductivity of the heat dissipation column and the heat conduction oil is greater than the thermal conductivity of the insulation layer, thereby improving the LED.
  • the insulation resistance of the heat dissipation column and the heat transfer oil is greater than or equal to the insulation resistance of the insulation layer, which ensures the insulation requirement between the copper plate and the aluminum substrate.
  • Figure 1 is a schematic view showing the structure of a high-power liquid heat-dissipating LED lamp. detailed description
  • FIG. 1 is a schematic view showing the structure of a high-power liquid heat-dissipating LED lamp, including a high-power liquid heat-dissipating LED lamp, including a bracket 1, an LED 2, and a heat sink 3.
  • the LED 2 is mounted on the bracket 1, the LED 2 is connected to the heat sink 3, and the LED 2 and the heat sink are connected.
  • the board 3 is provided with an insulating heat dissipating column 4, the heat dissipating column 4 is in contact with the heat source position 5 of the LED 2 and the heat dissipating plate 3, the heat dissipating column 4 is provided with a liquid guiding hole 6, and the liquid guiding hole 6 is provided with an insulating heat conducting oil 8 and a heat conducting oil 8 is in contact with the heat source position 5 of the LED 2 and the heat sink 3, and the heat of the heat source position 5 of the LED 2 is transmitted to the heat sink 3 through the heat dissipation column 4 and the heat transfer oil 8, and the heat is dissipated.
  • the board 3 is distributed in the space to improve the heat dissipation efficiency of the LED 2.
  • the LED 2 includes a PN junction 9, a base 10, an electrode 11, a silicone ball 12, a barrier layer 13, a copper layer 14, an insulating layer 15, and an aluminum substrate 16, an aluminum substrate 16 of the LED 2 and A heat-dissipating silicone pad 17 is disposed between the heat dissipation plates 3; the PN junction 9 is connected to the base 10, the base 10 is connected to the copper-clad layer 14, the copper-clad layer 14 is connected to the insulating layer 15, and the insulating layer 15 is connected to the aluminum substrate 16, and copper is applied.
  • the layer 14, the insulating layer 15 and the aluminum substrate 16 are integrally connected; a heat-conducting cavity 18 is disposed between the copper-clad layer 14 and the heat-dissipating plate 3, and the heat-conducting cavity 18 is cooled by the insulating layer 15, the aluminum substrate 16, and the thermal conductive silicone pad 17.
  • the heat dissipation plate 3 is provided with a heat dissipation channel 7, and the liquid guiding hole 6 is connected with the heat dissipation channel 7.
  • the heat dissipation column 4 is disposed in the heat conduction cavity 18, and the liquid guiding hole 6 of the heat dissipation column 4 and the heat dissipation channel 7 of the heat dissipation plate 3 are filled.
  • the heat transfer oil 8, the heat transfer oil 8 is in contact with the copper layer 14; the heat of the PN junction 9 heat source position 5 of the LED 2 is transferred from the base 10 through the copper layer 14, the heat dissipation column 4 and the heat transfer oil 8 to the heat sink 3, and the heat is made of aluminum alloy
  • the heat sink 3 is formed in the air .
  • the heat dissipation column 4 is clamped in the heat conduction cavity 18 by the copper layer 14 of the LED 2 and the heat dissipation plate 3, the copper layer 14 of the heat dissipation column 4 and the LED 2, and the heat dissipation plate.
  • the heat conducting oil 8 is sealed in the liquid guiding hole 6 and the heat dissipation channel 7, preventing the heat conducting oil 8 of the liquid guiding hole 6 and the heat dissipation channel 7 from overflowing;
  • the height of the heat dissipation column 4 is larger than the fixing of the heat conduction cavity 18, the heat dissipation column 4
  • the outer diameter of the heat dissipation cavity 18 is larger than the inner diameter of the heat conduction cavity 18, and the heat dissipation column 4 is sealingly connected to the heat conduction cavity 18.
  • the thermal conductivity of the heat dissipation column 4 is greater than the thermal conductivity of the insulation layer 15
  • the thermal conductivity of the heat transfer oil 8 is greater than the thermal conductivity of the insulation layer 15
  • the insulation of the heat transfer oil 8 The electric resistance is greater than or equal to the insulation resistance of the insulating layer 15, and the heat dissipating post 4 is composed of an insulating thermal conductive rubber, and the heat conducting oil 8 includes an insulating heat conductive oil or transformer oil.
  • the heat dissipating plate 3 is provided with a refilling chamber 19, the replenishing chamber 19 is connected with the heat dissipating passage 7, and the replenishing chamber 19 is connected with the heat dissipating passage 7, and the liquid level of the refilling chamber 19 is higher than that of the heat dissipating column 4
  • the liquid level of the liquid hole 6 is such that the heat transfer oil 8 of the liquid guiding hole 6 of the heat radiating column 4 is kept in contact with the copper-clad layer 14, and also serves as a supplement to the heat-transfer oil 8 reduction.
  • the heat dissipation channel 7 is provided with a process sealing port 20, and the process sealing port 20 is provided with a process sealing plug 21;
  • the liquid replacement port 22 and the liquid replacement port 22 are provided with a fluid replacement sealing plug 23 for injecting the heat transfer oil 8 into the heat dissipation passage 7.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

大功率液体散热LED灯,设有散热柱(4)以及导热油(8)。散热柱以及导热油直接与LED(2)的敷铜层(14)以及散热板(3)接触,PN结(9)的大部分热量经敷铜层、散热柱以及散热柱的导热油直接传递到散热板。由于PN结的大部分热量不是经过绝缘层(15)传递到散热板,散热柱以及导热油的导热系数大于绝缘层的导热系数,因此,提高了LED的散热效果;同时,散热柱以及导热油的绝缘电阻大于或者等于绝缘层的绝缘电阻,保证了敷铜层与铝基板之间的绝缘要求。

Description

大功率液体散热 LED灯
技术领域
本发明涉及一种 LED灯, 特别是一种大功率液体散热 LED灯。 背景技术
现有的大功率 LED灯, LED灯的敷铜层与铝基板之间设有一层绝缘层, 由于绝缘层的导热系数较低, 阻碍了 LED灯 PN结热量的散发, 降低了 LED 灯的散热效果, 影响了 LED灯的使用寿命。 发明内容
本发明的目的是克服现有技术的不足, 提供一种大功率液体散热 LED 灯, 用于提高 LED灯绝缘层的导热系数, 提高 LED灯的散热效果。
本发明所采用的技术方案是: 大功率液体散热 LED灯, 包括有支架、 LED以及散热板, LED安装于支架, LED与散热板连接, LED与散热板之 间设有绝缘的散热柱, 散热柱与 LED的热源位置以及散热板接触, 散热柱 设有导液孔, 导液孔设有绝缘的导热油, 导热油与 LED的热源位置以及散 热板接触, LED 热源位置的热量经散热柱以及导热油传递到散热板, 热量 由散热板散发于空间, 提高 LED的散热效率; 散热柱以及导热油的绝缘电 阻大于或者等于绝缘层的绝缘电阻。
LED包括有 PN结、 底座、 电极、 硅胶球、 阻悍层、 敷铜层、 绝缘层 以及铝基板, LED的铝基板与散热板之间设有导热硅胶垫; PN结与底座连 接, 底座与敷铜层连接, 敷铜层与绝缘层连接, 绝缘层与铝基板连接, 敷 铜层、 绝缘层以及铝基板连接成为一体; 敷铜层与散热板之间设有导热型 腔, 导热型腔经过绝缘层、 铝基板以及导热硅胶垫进入散热板; 散热板设 有散热通道, 导液孔与散热通道连通, 散热柱设于导热型腔内, 散热柱的 导液孔以及散热板的散热通道充满导热油, 导热油与敷铜层接触; LED 的 PN结热源位置的热量由底座经敷铜层、 散热柱以及导热油传递到散热板, 热量由铝合金构成的散热板散发于空间。
大功率液体散热 LED灯的工作原理是: 大功率液体散热 LED灯的 LED 与散热板之间设有绝缘的散热柱, 散热柱的导液孔以及散热板的散热通道 充满有导热油, 散热柱直接与 LED的敷铜层以及散热板接触; LED的 PN结 的传递到敷铜层热量直接由散热柱传递到散热板, 同时, 利用导热油与敷 铜层以及散热板接触, LED 的热量经散热柱导液孔以及散热板散热通道的 导热油传递到散热板; 利用绝缘的散热柱以及导热油代替绝缘层, 将敷铜 层与铝基板绝缘隔离, 以及利用绝缘的散热柱以及导热油代替导热硅胶垫 将铝基板与散热板绝缘隔离, 解决了绝缘层导热系数低以及散热效果差的 问题, 以及不降低绝缘层的绝缘性能。
大功率液体散热 LED灯散热路径有三路: 其一: LED的 PN结发出的热 量经底座→敷铜层→散热柱→散热板→大气; 其二: LED的 PN结发出的热 量经底座→敷铜层→导热油→散热板→大气; 其三: LED的 PN结发出的热 量经底座→敷铜层→绝缘层→铝基板→导热硅胶垫→散热板→大气。
本发明的有益效果是:大功率液体散热 LED灯设有散热柱以及导热油, 散热柱以及导热油直接与 LED的敷铜层以及散热板接触, PN结的大部分热 量经敷铜层、 散热柱以及散热柱的导热油直接传递到散热板, 由于 PN结 的大部分热量不是经过绝缘层传递到散热板, 散热柱以及导热油的导热系 数大于绝缘层的导热系数, 因此, 提高了 LED的的散热效果; 同时, 散热 柱以及导热油的绝缘电阻大于或者等于绝缘层的绝缘电阻, 保证了敷铜板 与铝基板之间的绝缘要求。 附图说明
图 1是大功率液体散热 LED灯的结构示意图。 具体实施方式
下面结合附图对本发明进行进一步的说明:
图 1所示的大功率液体散热 LED灯的结构示意图,大功率液体散热 LED 灯, 包括有支架 1、 LED2以及散热板 3, LED2安装于支架 1, LED2与散热 板 3连接, LED2与散热板 3之间设有绝缘的散热柱 4, 散热柱 4与 LED2 的热源位置 5以及散热板 3接触, 散热柱 4设有导液孔 6, 导液孔 6设有 绝缘的导热油 8, 导热油 8与 LED2的热源位置 5以及散热板 3接触, LED2 热源位置 5的热量经散热柱 4以及导热油 8传递到散热板 3, 热量由散热 板 3散发于空间, 提高 LED2的散热效率。
为了实施通过 LED灯的散热效果, LED2包括有 PN结 9、 底座 10、 电 极 11、硅胶球 12、 阻悍层 13、敷铜层 14、绝缘层 15以及铝基板 16, LED2 的铝基板 16与散热板 3之间设有导热硅胶垫 17; PN结 9与底座 10连接, 底座 10与敷铜层 14连接, 敷铜层 14与绝缘层 15连接, 绝缘层 15与铝 基板 16连接, 敷铜层 14、 绝缘层 15以及铝基板 16连接成为一体; 敷铜 层 14与散热板 3之间设有导热型腔 18, 导热型腔 18经过绝缘层 15、 铝 基板 16以及导热硅胶垫 17进入散热板 3; 散热板 3设有散热通道 7, 导 液孔 6与散热通道 7连通, 散热柱 4设于导热型腔 18内, 散热柱 4的导 液孔 6以及散热板 3的散热通道 7充满导热油 8,导热油 8与敷铜层 14接 触; LED2的 PN结 9热源位置 5的热量由底座 10经敷铜层 14、 散热柱 4 以及导热油 8传递到散热板 3,热量由铝合金构成的散热板 3散发于空间。
为了实施散热柱 4与导热型腔 18的密封连接, 散热柱 4被 LED2的敷 铜层 14与散热板 3夹紧于导热型腔 18内, 散热柱 4与 LED2的敷铜层 14 以及散热板 3密封连接, 导热油 8密封于导液孔 6以及散热通道 7内, 防 止导液孔 6以及散热通道 7的导热油 8溢出; 散热柱 4的高度大于导热型 腔 18的固定, 散热柱 4的外径大于导热型腔 18的内径, 散热柱 4密封连 接于导热型腔 18内。
为了提高 LED2散热效果,同时也保证绝缘层 15的绝缘电阻不会降低, 散热柱 4的导热系数大于绝缘层 15导热系数, 导热油 8的导热系数大于 绝缘层 15导热系数; 导热油 8的绝缘电阻大于或者等于绝缘层 15的绝缘 电阻, 散热柱 4由绝缘的导热硅胶构成, 导热油 8包括有绝缘的导热油料 或者变压器油。
为了使导液孔 6充满导热油 8, 散热板 3设有补液腔 19, 补液腔 19 与散热通道 7通, 补液腔 19与散热通道 7连通, 补液腔 19的液位高于散 热柱 4导液孔 6的液位, 以保证散热柱 4导液孔 6的导热油 8保持与敷铜 层 14接触, 同时也作为导热油 8减少的补充。
为了方便于散热板 3制造出散热通道 7以及方便向散热通道 7注入以 及补充导热油 8, 散热通道 7设有工艺密封口 20, 工艺密封口 20设有工 艺密封塞 21 ; 补液腔 19设有补液口 22, 补液口 22设有补液密封塞 23, 用于向散热通道 7注入导热油 8。

Claims

权 利 要 求 书
1.大功率液体散热 LED灯,包括有支架(1 )、 LED (2)以及散热板(3), LED (2) 安装于支架 (1 ), LED (2) 与散热板 (3 ) 连接, 其特征在于: 所述的 LED (2) 与散热板 (3) 之间设有绝缘的散热柱 (4), 散热柱 (4) 与 LED (2) 的热源位置 (5) 以及散热板 (3) 接触, 散热柱 (4) 设有导 液孔 (6), 导液孔 (6) 设有绝缘的导热油 (8), 导热油 (8) 与 LED (2) 的热源位置 (5) 以及散热板 (3 ) 接触, LED (2) 热源位置 (5) 的热量 经散热柱 (4) 以及导热油 (8) 传递到散热板 (3 ), 热量由散热板 (3) 散发于空间。
2.根据权利要求 1所述的大功率液体散热 LED灯, 其特征在于: 所述 的 LED (2) 包括有 PN结 (9)、 底座 (10)、 电极 (11 )、 硅胶球 (12)、 阻 悍层 (13 )、 敷铜层 (14)、 绝缘层 (15) 以及铝基板 (16 ), LED (2) 的 铝基板 (16) 与散热板 (3) 之间设有导热硅胶垫 (17); PN结 (9) 与底 座 (10) 连接, 底座 (10) 与敷铜层 (14) 连接, 敷铜层 (14) 与绝缘层
( 15 ) 连接, 绝缘层 (15) 与铝基板 (16) 连接, 敷铜层 (14)、 绝缘层 ( 15 ) 以及铝基板 (16) 连接成为一体; 敷铜层 (14) 与散热板 (3) 之 间设有导热型腔 (18), 导热型腔 (18) 经过绝缘层 (15)、 铝基板 (16) 以及导热硅胶垫 (17) 进入散热板 (3); 散热板 (3) 设有散热通道 (7), 导液孔 (6) 与散热通道 (7) 连通, 散热柱 (4) 设于导热型腔 (18) 内, 散热柱 (4) 的导液孔 (6) 以及散热板 (3) 的散热通道 (7) 充满导热油 (8), 导热油 (8) 与敷铜层 (14) 接触; LED (2) 的 PN 结 (9) 热源位 置(5) 的热量由底座 (10)经敷铜层(14)、 散热柱 (4) 以及导热油 (8) 传递到散热板 (3), 热量由铝合金构成的散热板 (3) 散发于空间。
3.根据权利要求 2所述的大功率液体散热 LED灯, 其特征在于: 所述 的散热柱 (4)被 LED (2) 的敷铜层 (14) 与散热板 (3) 夹紧于导热型腔
( 18) 内, 散热柱 (4) 与 LED (2) 的敷铜层 (14) 以及散热板 (3) 密封 连接, 导热油 (8) 密封于导液孔 (6) 以及散热通道 (7) 内。
4.根据权利要求 3所述的大功率液体散热 LED灯, 其特征在于: 所述 的散热柱 (4) 的高度大于导热型腔 (18) 的固定, 散热柱 (4) 的外径大 于导热型腔 (18) 的内径, 散热柱 (4) 密封连接于导热型腔 (18) 内。
5.根据权利要求 4所述的大功率液体散热 LED灯, 其特征在于: 所述 的散热柱 (4) 的导热系数大于绝缘层 (15 ) 导热系数, 导热油 (8) 的导 热系数大于绝缘层 (15 ) 导热系数; 导热油 (8 ) 的绝缘电阻大于或者等 于绝缘层 (15 ) 的绝缘电阻, 散热柱 (4) 由绝缘的导热硅胶构成, 导热 油 (8) 包括有绝缘的导热油料或者变压器油。
6.根据权利要求 5所述的大功率液体散热 LED灯, 其特征在于: 所述 的散热板 (3 ) 设有补液腔 (19 ), 补液腔 (19 ) 与散热通道 (7 ) 通, 补 液腔 (19) 与散热通道 (7) 连通, 补液腔 (19) 的液位高于散热柱 (4) 导液孔 (6 ) 的液位。
7.根据权利要求 6所述的大功率液体散热 LED灯, 其特征在于: 所述 的散热通道 (7) 设有工艺密封口 (20), 工艺密封口 (20) 设有工艺密封 塞 (21 ); 补液腔 (19) 设有补液口 (22), 补液口 (22) 设有补液密封塞
(23)。
8.一种根据权利要求 7所述的大功率液体散热 LED灯的散热原理, 其 特征在于: 所述的大功率液体散热 LED灯的散热原理是: 大功率液体散热 LED灯的 LED与散热板之间设有绝缘的散热柱, 散热柱的导液孔以及散热 板的散热通道充满有导热油,散热柱直接与 LED的敷铜层以及散热板接触; LED的 PN结的传递到敷铜层热量直接由散热柱传递到散热板, 同时, 利用 导热油与敷铜层以及散热板接触, LED 的热量经散热柱导液孔以及散热板 散热通道的导热油传递到散热板; 利用绝缘的散热柱以及导热油代替绝缘 层, 将敷铜层与铝基板绝缘隔离, 以及利用绝缘的散热柱以及导热油代替 导热硅胶垫将铝基板与散热板绝缘隔离, 解决了绝缘层导热系数低以及散 热效果差的问题, 以及不降低绝缘层的绝缘性能。
9.根据权利要求 8所述的大功率液体散热 LED灯的散热原理, 其特征 在于: 所述的大功率液体散热 LED灯的散热路径有三路: 其一: LED的 PN 结发出的热量经底座→敷铜层→散热柱→散热板→大气; 其二: LED的 PN 结发出的热量经底座→敷铜层→导热油→散热板→大气; 其三: LED的 PN 结发出的热量经底座→敷铜层→绝缘层→铝基板→导热硅胶垫→散热板 →大气。
PCT/CN2013/086966 2013-03-18 2013-11-12 大功率液体散热led灯 WO2014146437A1 (zh)

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