WO2014146437A1 - 大功率液体散热led灯 - Google Patents
大功率液体散热led灯 Download PDFInfo
- Publication number
- WO2014146437A1 WO2014146437A1 PCT/CN2013/086966 CN2013086966W WO2014146437A1 WO 2014146437 A1 WO2014146437 A1 WO 2014146437A1 CN 2013086966 W CN2013086966 W CN 2013086966W WO 2014146437 A1 WO2014146437 A1 WO 2014146437A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- heat dissipation
- led
- column
- dissipating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Definitions
- the invention relates to an LED lamp, in particular to a high-power liquid heat-dissipating LED lamp. Background technique
- the existing high-power LED lamp, the copper layer of the LED lamp and the aluminum substrate are provided with an insulating layer. Due to the low thermal conductivity of the insulating layer, the heat dissipation of the PN junction of the LED lamp is hindered, and the heat dissipation of the LED lamp is reduced. The effect affects the service life of the LED lamp. Summary of the invention
- the object of the present invention is to overcome the deficiencies of the prior art and provide a high-power liquid heat-dissipating LED lamp for improving the thermal conductivity of the LED lamp insulation layer and improving the heat dissipation effect of the LED lamp.
- a high-power liquid heat-dissipating LED lamp comprising a bracket, an LED and a heat sink, the LED is mounted on the bracket, the LED is connected with the heat sink, and an insulating heat-dissipating column is arranged between the LED and the heat sink to dissipate heat.
- the column is in contact with the heat source of the LED and the heat sink, the heat sink is provided with a liquid guiding hole, the liquid guiding hole is provided with an insulating heat conduction oil, the heat conducting oil is in contact with the heat source position of the LED and the heat sink, and the heat of the LED heat source is passed through the heat dissipation column and The heat transfer oil is transferred to the heat dissipation plate, and the heat is radiated from the heat dissipation plate in the space to improve the heat dissipation efficiency of the LED; the insulation resistance of the heat dissipation column and the heat conduction oil is greater than or equal to the insulation resistance of the insulation layer.
- the LED comprises a PN junction, a base, an electrode, a silica gel ball, a barrier layer, a copper layer, an insulating layer and an aluminum substrate, and a thermal conductive silicone pad is arranged between the aluminum substrate of the LED and the heat dissipation plate;
- the PN junction is connected with the base, and the base is
- the copper layer is connected, the copper layer is connected with the insulating layer, the insulating layer is connected with the aluminum substrate, the copper layer, the insulating layer and the aluminum substrate are integrally connected;
- the heat conducting cavity is provided between the copper layer and the heat sink, and the heat conducting cavity is
- the heat dissipation plate is disposed through the insulating layer, the aluminum substrate and the thermal conductive silicone pad;
- the heat dissipation plate is provided with a heat dissipation channel, the liquid guiding hole is connected with the heat dissipation channel, the heat dissipation column is disposed in the heat conduction cavity, the liquid guiding
- the working principle of high-power liquid heat-dissipating LED lamp is: LED of high-power liquid heat-dissipating LED lamp An insulating heat dissipating column is arranged between the heat dissipating plate, the liquid guiding hole of the heat dissipating post and the heat dissipating channel of the heat dissipating plate are filled with heat conducting oil, and the heat dissipating column directly contacts the copper layer of the LED and the heat dissipating plate; the PN junction of the LED is transmitted to The heat of the copper layer is directly transferred from the heat dissipation column to the heat dissipation plate.
- the heat conduction oil is contacted with the copper layer and the heat dissipation plate, and the heat of the LED is transmitted to the heat dissipation plate through the heat conduction oil of the heat dissipation column and the heat dissipation oil of the heat dissipation plate of the heat dissipation plate; Insulating heat-dissipating column and heat-conducting oil instead of insulating layer, insulating and insulating the copper-clad layer from the aluminum substrate, and insulating and insulating the aluminum substrate from the heat-dissipating plate by using the heat-dissipating heat-dissipating column and the heat-conducting oil instead of the heat-dissipating silicone pad, thereby solving the low thermal conductivity of the insulating layer And the problem of poor heat dissipation, and does not reduce the insulation properties of the insulating layer.
- the high-power liquid heat-dissipating LED lamp has three heat-dissipating paths: First, the heat generated by the PN junction of the LED passes through the base ⁇ copper layer ⁇ heat sink column ⁇ heat sink plate ⁇ atmosphere; second: the heat generated by the PN junction of the LED passes through the base ⁇ Copper layer ⁇ heat transfer oil ⁇ heat sink ⁇ atmosphere; Third: the heat generated by the PN junction of the LED through the base ⁇ copper layer ⁇ insulation layer ⁇ aluminum substrate ⁇ thermal silica gel pad ⁇ heat sink ⁇ atmosphere.
- the beneficial effects of the invention are: the high-power liquid heat-dissipating LED lamp is provided with a heat-dissipating column and a heat-conducting oil, the heat-dissipating column and the heat-conducting oil are directly in contact with the copper-clad layer of the LED and the heat-dissipating plate, and most of the heat of the PN junction is applied to the copper layer and the heat dissipation The heat transfer oil of the column and the heat dissipation column is directly transmitted to the heat dissipation plate.
- the thermal conductivity of the heat dissipation column and the heat conduction oil is greater than the thermal conductivity of the insulation layer, thereby improving the LED.
- the insulation resistance of the heat dissipation column and the heat transfer oil is greater than or equal to the insulation resistance of the insulation layer, which ensures the insulation requirement between the copper plate and the aluminum substrate.
- Figure 1 is a schematic view showing the structure of a high-power liquid heat-dissipating LED lamp. detailed description
- FIG. 1 is a schematic view showing the structure of a high-power liquid heat-dissipating LED lamp, including a high-power liquid heat-dissipating LED lamp, including a bracket 1, an LED 2, and a heat sink 3.
- the LED 2 is mounted on the bracket 1, the LED 2 is connected to the heat sink 3, and the LED 2 and the heat sink are connected.
- the board 3 is provided with an insulating heat dissipating column 4, the heat dissipating column 4 is in contact with the heat source position 5 of the LED 2 and the heat dissipating plate 3, the heat dissipating column 4 is provided with a liquid guiding hole 6, and the liquid guiding hole 6 is provided with an insulating heat conducting oil 8 and a heat conducting oil 8 is in contact with the heat source position 5 of the LED 2 and the heat sink 3, and the heat of the heat source position 5 of the LED 2 is transmitted to the heat sink 3 through the heat dissipation column 4 and the heat transfer oil 8, and the heat is dissipated.
- the board 3 is distributed in the space to improve the heat dissipation efficiency of the LED 2.
- the LED 2 includes a PN junction 9, a base 10, an electrode 11, a silicone ball 12, a barrier layer 13, a copper layer 14, an insulating layer 15, and an aluminum substrate 16, an aluminum substrate 16 of the LED 2 and A heat-dissipating silicone pad 17 is disposed between the heat dissipation plates 3; the PN junction 9 is connected to the base 10, the base 10 is connected to the copper-clad layer 14, the copper-clad layer 14 is connected to the insulating layer 15, and the insulating layer 15 is connected to the aluminum substrate 16, and copper is applied.
- the layer 14, the insulating layer 15 and the aluminum substrate 16 are integrally connected; a heat-conducting cavity 18 is disposed between the copper-clad layer 14 and the heat-dissipating plate 3, and the heat-conducting cavity 18 is cooled by the insulating layer 15, the aluminum substrate 16, and the thermal conductive silicone pad 17.
- the heat dissipation plate 3 is provided with a heat dissipation channel 7, and the liquid guiding hole 6 is connected with the heat dissipation channel 7.
- the heat dissipation column 4 is disposed in the heat conduction cavity 18, and the liquid guiding hole 6 of the heat dissipation column 4 and the heat dissipation channel 7 of the heat dissipation plate 3 are filled.
- the heat transfer oil 8, the heat transfer oil 8 is in contact with the copper layer 14; the heat of the PN junction 9 heat source position 5 of the LED 2 is transferred from the base 10 through the copper layer 14, the heat dissipation column 4 and the heat transfer oil 8 to the heat sink 3, and the heat is made of aluminum alloy
- the heat sink 3 is formed in the air .
- the heat dissipation column 4 is clamped in the heat conduction cavity 18 by the copper layer 14 of the LED 2 and the heat dissipation plate 3, the copper layer 14 of the heat dissipation column 4 and the LED 2, and the heat dissipation plate.
- the heat conducting oil 8 is sealed in the liquid guiding hole 6 and the heat dissipation channel 7, preventing the heat conducting oil 8 of the liquid guiding hole 6 and the heat dissipation channel 7 from overflowing;
- the height of the heat dissipation column 4 is larger than the fixing of the heat conduction cavity 18, the heat dissipation column 4
- the outer diameter of the heat dissipation cavity 18 is larger than the inner diameter of the heat conduction cavity 18, and the heat dissipation column 4 is sealingly connected to the heat conduction cavity 18.
- the thermal conductivity of the heat dissipation column 4 is greater than the thermal conductivity of the insulation layer 15
- the thermal conductivity of the heat transfer oil 8 is greater than the thermal conductivity of the insulation layer 15
- the insulation of the heat transfer oil 8 The electric resistance is greater than or equal to the insulation resistance of the insulating layer 15, and the heat dissipating post 4 is composed of an insulating thermal conductive rubber, and the heat conducting oil 8 includes an insulating heat conductive oil or transformer oil.
- the heat dissipating plate 3 is provided with a refilling chamber 19, the replenishing chamber 19 is connected with the heat dissipating passage 7, and the replenishing chamber 19 is connected with the heat dissipating passage 7, and the liquid level of the refilling chamber 19 is higher than that of the heat dissipating column 4
- the liquid level of the liquid hole 6 is such that the heat transfer oil 8 of the liquid guiding hole 6 of the heat radiating column 4 is kept in contact with the copper-clad layer 14, and also serves as a supplement to the heat-transfer oil 8 reduction.
- the heat dissipation channel 7 is provided with a process sealing port 20, and the process sealing port 20 is provided with a process sealing plug 21;
- the liquid replacement port 22 and the liquid replacement port 22 are provided with a fluid replacement sealing plug 23 for injecting the heat transfer oil 8 into the heat dissipation passage 7.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201380005909.XA CN105283708B (zh) | 2013-03-18 | 2013-11-12 | 大功率液体散热led灯 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013101110362A CN103196057A (zh) | 2013-03-18 | 2013-03-18 | 大功率液体散热led灯 |
CN201310111036.2 | 2013-03-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014146437A1 true WO2014146437A1 (zh) | 2014-09-25 |
Family
ID=48718780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2013/086966 WO2014146437A1 (zh) | 2013-03-18 | 2013-11-12 | 大功率液体散热led灯 |
Country Status (2)
Country | Link |
---|---|
CN (2) | CN103196057A (zh) |
WO (1) | WO2014146437A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103196057A (zh) * | 2013-03-18 | 2013-07-10 | 林智勇 | 大功率液体散热led灯 |
CN109210514A (zh) * | 2018-08-31 | 2019-01-15 | 安徽蓝锐电子科技有限公司 | 一种均匀散热模组的制作工艺 |
CN111023057A (zh) * | 2019-11-19 | 2020-04-17 | 施学伍 | 照明灯具快速散热装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101852350A (zh) * | 2010-03-04 | 2010-10-06 | 芜湖晨通照明有限责任公司 | 一种设有专门散热装置的柱形led灯具 |
CN102654280A (zh) * | 2011-08-10 | 2012-09-05 | 东莞市盈通光电照明科技有限公司 | 一种led灯座散热器 |
CN102810625A (zh) * | 2011-06-01 | 2012-12-05 | 乐利士实业股份有限公司 | 液冷式发光装置 |
CN102883584A (zh) * | 2012-06-28 | 2013-01-16 | 蔡州 | 一种高效散热装置 |
CN103196057A (zh) * | 2013-03-18 | 2013-07-10 | 林智勇 | 大功率液体散热led灯 |
CN203190136U (zh) * | 2013-03-18 | 2013-09-11 | 林智勇 | 一种大功率液体散热led灯 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005100810A (ja) * | 2003-09-25 | 2005-04-14 | Seiko Epson Corp | 光源装置及びプロジェクタ |
CN1680749A (zh) * | 2004-04-08 | 2005-10-12 | 吴裕朝 | 发光二极管装置、发光二极管散热系统及含其的照明装置 |
CN2741193Y (zh) * | 2004-04-08 | 2005-11-16 | 吴裕朝 | 发光二极管装置、发光二极管散热系统及包含其之照明装置 |
KR20090014153A (ko) * | 2006-05-31 | 2009-02-06 | 덴끼 가가꾸 고교 가부시키가이샤 | Led 광원 유니트 |
TWI439636B (zh) * | 2011-08-08 | 2014-06-01 | Jun Zhan Technology Co Ltd | 具有熱管之發光裝置 |
CN202216213U (zh) * | 2011-08-12 | 2012-05-09 | 吉林大学 | 大功率led照明灯三级散热装置 |
CN102767714A (zh) * | 2012-06-29 | 2012-11-07 | 大连路飞光电科技有限公司 | Led灯散热结构 |
CN202733851U (zh) * | 2012-09-03 | 2013-02-13 | 北京源深节能技术有限责任公司 | 一种led灯散热结构 |
-
2013
- 2013-03-18 CN CN2013101110362A patent/CN103196057A/zh active Pending
- 2013-11-12 WO PCT/CN2013/086966 patent/WO2014146437A1/zh active Application Filing
- 2013-11-12 CN CN201380005909.XA patent/CN105283708B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101852350A (zh) * | 2010-03-04 | 2010-10-06 | 芜湖晨通照明有限责任公司 | 一种设有专门散热装置的柱形led灯具 |
CN102810625A (zh) * | 2011-06-01 | 2012-12-05 | 乐利士实业股份有限公司 | 液冷式发光装置 |
CN102654280A (zh) * | 2011-08-10 | 2012-09-05 | 东莞市盈通光电照明科技有限公司 | 一种led灯座散热器 |
CN102883584A (zh) * | 2012-06-28 | 2013-01-16 | 蔡州 | 一种高效散热装置 |
CN103196057A (zh) * | 2013-03-18 | 2013-07-10 | 林智勇 | 大功率液体散热led灯 |
CN203190136U (zh) * | 2013-03-18 | 2013-09-11 | 林智勇 | 一种大功率液体散热led灯 |
Also Published As
Publication number | Publication date |
---|---|
CN105283708B (zh) | 2018-05-08 |
CN103196057A (zh) | 2013-07-10 |
CN105283708A (zh) | 2016-01-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105333407A (zh) | 散热结构及制造方法 | |
WO2014146421A1 (zh) | 磁流体热交换led灯 | |
WO2014146436A1 (zh) | 油脂散热led灯 | |
CN201204203Y (zh) | 大功率led的散热装置 | |
WO2014146437A1 (zh) | 大功率液体散热led灯 | |
CN107871723A (zh) | 一种预埋热管的散热板及其应用于电子设备的方法 | |
JP2012022855A (ja) | 照明装置 | |
WO2012130063A1 (zh) | 电源模块以及应用该电源模块的电子设备 | |
CN209729960U (zh) | 散热性良好的贴片led结构 | |
CN203190136U (zh) | 一种大功率液体散热led灯 | |
CN201462739U (zh) | 一种散热装置 | |
CN206449428U (zh) | 一种led灯散热结构 | |
CN203298263U (zh) | Led灯管的硅胶散热装置 | |
CN209298102U (zh) | 一种igbt芯片用水冷循环型散热装置 | |
CN201992605U (zh) | 大功率led灯的散热装置 | |
CN201845809U (zh) | 集成式大功率led光源模组导热基板 | |
CN203659935U (zh) | 一种大功率led的液冷散热装置 | |
CN210951229U (zh) | 一种led芯片的散热结构 | |
CN217406795U (zh) | 用于支撑印制电路板的覆铜箔 | |
CN203190137U (zh) | 一种油脂散热led灯 | |
WO2014048049A1 (zh) | 一种内置灌胶散热系统的一体化led灯 | |
CN209370973U (zh) | 一种新型具备防爆安全性的led平台灯 | |
CN219123990U (zh) | 一种工业开关电源模块用散热结构 | |
CN102767714A (zh) | Led灯散热结构 | |
CN110299443B (zh) | 一种基于cob封装的大功率led的散热装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201380005909.X Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13878862 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 13878862 Country of ref document: EP Kind code of ref document: A1 |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 23/02/2016) |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 13878862 Country of ref document: EP Kind code of ref document: A1 |