CN105283708B - 大功率液体散热led灯 - Google Patents
大功率液体散热led灯 Download PDFInfo
- Publication number
- CN105283708B CN105283708B CN201380005909.XA CN201380005909A CN105283708B CN 105283708 B CN105283708 B CN 105283708B CN 201380005909 A CN201380005909 A CN 201380005909A CN 105283708 B CN105283708 B CN 105283708B
- Authority
- CN
- China
- Prior art keywords
- heat
- heat sink
- led
- thermal column
- conduction oil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 18
- 230000017525 heat dissipation Effects 0.000 claims abstract description 31
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 21
- 238000009413 insulation Methods 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000003921 oil Substances 0.000 claims description 48
- 239000012530 fluid Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 238000001802 infusion Methods 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 229960001866 silicon dioxide Drugs 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 229920002379 silicone rubber Polymers 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201380005909.XA CN105283708B (zh) | 2013-03-18 | 2013-11-12 | 大功率液体散热led灯 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013101110362 | 2013-03-18 | ||
CN2013101110362A CN103196057A (zh) | 2013-03-18 | 2013-03-18 | 大功率液体散热led灯 |
PCT/CN2013/086966 WO2014146437A1 (zh) | 2013-03-18 | 2013-11-12 | 大功率液体散热led灯 |
CN201380005909.XA CN105283708B (zh) | 2013-03-18 | 2013-11-12 | 大功率液体散热led灯 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105283708A CN105283708A (zh) | 2016-01-27 |
CN105283708B true CN105283708B (zh) | 2018-05-08 |
Family
ID=48718780
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2013101110362A Pending CN103196057A (zh) | 2013-03-18 | 2013-03-18 | 大功率液体散热led灯 |
CN201380005909.XA Active CN105283708B (zh) | 2013-03-18 | 2013-11-12 | 大功率液体散热led灯 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2013101110362A Pending CN103196057A (zh) | 2013-03-18 | 2013-03-18 | 大功率液体散热led灯 |
Country Status (2)
Country | Link |
---|---|
CN (2) | CN103196057A (zh) |
WO (1) | WO2014146437A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103196057A (zh) * | 2013-03-18 | 2013-07-10 | 林智勇 | 大功率液体散热led灯 |
CN109210514A (zh) * | 2018-08-31 | 2019-01-15 | 安徽蓝锐电子科技有限公司 | 一种均匀散热模组的制作工艺 |
CN111023057A (zh) * | 2019-11-19 | 2020-04-17 | 施学伍 | 照明灯具快速散热装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101454909A (zh) * | 2006-05-31 | 2009-06-10 | 电气化学工业株式会社 | Led光源单元 |
CN202733851U (zh) * | 2012-09-03 | 2013-02-13 | 北京源深节能技术有限责任公司 | 一种led灯散热结构 |
CN102931331A (zh) * | 2011-08-08 | 2013-02-13 | 乐利士实业股份有限公司 | 具有热管的发光装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005100810A (ja) * | 2003-09-25 | 2005-04-14 | Seiko Epson Corp | 光源装置及びプロジェクタ |
CN1680749A (zh) * | 2004-04-08 | 2005-10-12 | 吴裕朝 | 发光二极管装置、发光二极管散热系统及含其的照明装置 |
CN2741193Y (zh) * | 2004-04-08 | 2005-11-16 | 吴裕朝 | 发光二极管装置、发光二极管散热系统及包含其之照明装置 |
CN101852350A (zh) * | 2010-03-04 | 2010-10-06 | 芜湖晨通照明有限责任公司 | 一种设有专门散热装置的柱形led灯具 |
TW201251147A (en) * | 2011-06-01 | 2012-12-16 | All Real Technology Co Ltd | Liquid cooling light-emitting apparatus |
CN102654280A (zh) * | 2011-08-10 | 2012-09-05 | 东莞市盈通光电照明科技有限公司 | 一种led灯座散热器 |
CN202216213U (zh) * | 2011-08-12 | 2012-05-09 | 吉林大学 | 大功率led照明灯三级散热装置 |
CN102883584B (zh) * | 2012-06-28 | 2014-12-31 | 蔡州 | 一种高效散热装置 |
CN102767714A (zh) * | 2012-06-29 | 2012-11-07 | 大连路飞光电科技有限公司 | Led灯散热结构 |
CN103196057A (zh) * | 2013-03-18 | 2013-07-10 | 林智勇 | 大功率液体散热led灯 |
CN203190136U (zh) * | 2013-03-18 | 2013-09-11 | 林智勇 | 一种大功率液体散热led灯 |
-
2013
- 2013-03-18 CN CN2013101110362A patent/CN103196057A/zh active Pending
- 2013-11-12 WO PCT/CN2013/086966 patent/WO2014146437A1/zh active Application Filing
- 2013-11-12 CN CN201380005909.XA patent/CN105283708B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101454909A (zh) * | 2006-05-31 | 2009-06-10 | 电气化学工业株式会社 | Led光源单元 |
CN102931331A (zh) * | 2011-08-08 | 2013-02-13 | 乐利士实业股份有限公司 | 具有热管的发光装置 |
CN202733851U (zh) * | 2012-09-03 | 2013-02-13 | 北京源深节能技术有限责任公司 | 一种led灯散热结构 |
Also Published As
Publication number | Publication date |
---|---|
CN103196057A (zh) | 2013-07-10 |
CN105283708A (zh) | 2016-01-27 |
WO2014146437A1 (zh) | 2014-09-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Huang Shirong Inventor before: Feng Lin |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180416 Address after: 528300 Guangdong Foshan Shunde District Longjiang town Xinxi village Xinlong Central Avenue West Side Dajin Hardware Factory Applicant after: FOSHAN LEIXING ELECTRIC LIGHTING CO.,LTD. Address before: 362300 Tian Yang 23, wok handle village, Xia Mei Town, Nanan, Fujian Applicant before: Zhu Honghua |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Room 201, 863 Fengting Road, shaping, Heshan, Jiangmen, Guangdong 529000 Patentee after: Jiangmen Leixing Lighting Co.,Ltd. Address before: Next to Dajin hardware factory, west side of Xinlong Central Avenue, Xinhua West Village, Longjiang Town, Shunde District, Foshan City, Guangdong Province, 528300 Patentee before: Foshan Leixing Electric Lighting Co.,Ltd. |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: High power liquid cooling LED light Effective date of registration: 20220728 Granted publication date: 20180508 Pledgee: Heshan Branch of China Construction Bank Co.,Ltd. Pledgor: Jiangmen Leixing Lighting Co.,Ltd. Registration number: Y2022980011494 |
|
CP02 | Change in the address of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: 529000 Room 201, No. 863, Fengting Road, shaping, Heshan City, Jiangmen City, Guangdong Province (self compiled No. 8) Patentee after: Jiangmen Leixing Lighting Co.,Ltd. Address before: Room 201, 863 Fengting Road, shaping, Heshan, Jiangmen, Guangdong 529000 Patentee before: Jiangmen Leixing Lighting Co.,Ltd. |