US20060033206A1 - Semiconductor cooling system and process for manufacturing the same - Google Patents
Semiconductor cooling system and process for manufacturing the same Download PDFInfo
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- US20060033206A1 US20060033206A1 US10/917,312 US91731204A US2006033206A1 US 20060033206 A1 US20060033206 A1 US 20060033206A1 US 91731204 A US91731204 A US 91731204A US 2006033206 A1 US2006033206 A1 US 2006033206A1
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- metallic filler
- filler layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/93—Thermoelectric, e.g. peltier effect cooling
Definitions
- the present invention is directed to a cooling system structure particularly well suited for cooling an element such as an integrated circuit chip, such as a microprocessor installed in a computer, and a process for manufacturing the cooling system.
- Adequate cooling of microprocessors in computer devices is a well known problem.
- the most conventional background approach to cooling a microprocessor in a computer is to attach some type of radiator structure onto a microprocessor computer chip and to use a fan to blow air across the radiator to cool the chip.
- a background approach suffers from several problems as recognized by the present inventors.
- such a radiator-fan system cannot provide cooling at a specified temperature regime since the temperature of the cooling system depends on environmental conditions such as ambient temperature, humidity, etc. Further, such a cooling system is often just not particularly effective as the fan predominantly blows the warm air within the computer across the radiator, and thus often adequate cooling cannot be properly realized.
- such a radiator-fan system has a drawback in that the chip to be cooled is usually of a few cubic centimeters in size and has a mass of a few grams, whereas the cooling system has a significantly greater volume and mass.
- employing such a large cooling system prevents an adequate miniaturization of the overall device.
- such a radiator-fan system includes many mechanical parts for driving the fan. Failure in any of those mechanical parts can result in the fan not properly operating, which obviously results in improper cooling, and which can easily result in a catastrophic breakdown of the semiconductor chip. If a semiconductor chip reaches a temperature of approximately 100° C. the chip performance may deteriorate, and if the chip reaches a temperature of approximately 130° C. that chip may cease to operate, and having a fan breakdown can result in such temperatures being reached at the chip.
- the fan also brings in new air that may have moisture and dust that may coat the cooling system and eventually deteriorate and wear down components of the cooling system.
- a fan also requires a 12 volt power source, and thus such a radiator-fan system consumes a fair amount of energy, which is particularly detrimental in a laptop computer environment as it reduces battery life.
- Another background cooling system may utilize water or liquid cooling systems, particularly for larger microprocessor systems.
- the drawbacks with such liquid cooling systems are that they also require a large amount of space and again mechanical parts to control the liquid flow.
- one object of the present invention is to provide a novel cooling system that can overcome or minimize the above-noted drawbacks in the background art.
- the novel cooling system of the present invention avoids utilizing a fan, radiator, and pump, and thus can maintain a small size and consume less energy.
- novel cooling system of the present invention also does not have any moving parts and thus has increased reliability.
- a further object of the present invention is to provide a novel process for forming the novel cooling system.
- a more specific object of the present invention is to provide in a further embodiment a novel cooling system, and method of manufacturing the same, that utilizes a semiconductor thermoelectric module as a cooling element, and which additionally incorporates a structure to enhance operation of that semiconductor thermoelectric module.
- thermoelectric module allows fixing a specified temperature range and controlling cooling to within that range, and thus effective cooling can be realized.
- FIG. 1 shows a structure of a novel cooling system of the present invention
- FIGS. 2 ( a ) and 2 ( b ) show a structure of a further embodiment of a novel cooling system of the present invention.
- FIGS. 3 ( a ) to 3 ( i ) show a process of manufacturing the novel cooling systems of the present invention.
- FIG. 1 a view of the novel cooling system of the present invention in one embodiment is provided.
- the present invention is suited to cool any element that generates heat at a surface.
- the present invention is particularly applicable to cooling integrated circuit chips, for example microprocessor chips, within computers, and FIG. 1 is directed to such a non-limiting embodiment of the present invention.
- a microprocessor 10 is mounted on a plastic clamp 60 and is secured within a first rubber insulator 50 1 .
- a first metallic filler layer 20 is formed in contact with the microprocessor 10 to completely cover a top surface of the microprocessor 10 .
- a first metal plate 30 which has a larger area than that of the first metallic filler layer 20 and the microprocessor 10 , is provided in contact with the first metallic filler layer 20 .
- first metal plate 30 can contact an outer surface 80 of a computer, for example surface 80 can be the outer casing of a laptop computer.
- the applicants of the present invention recognized that when a microprocessor outputs heat the heat is generally not output uniformly from the top surface of the microprocessor. That is, the present inventors recognized that a top surface of a microprocessor generates small isolated hot spots where intense heat is built up, rather than having a uniform dissipation of heat from a top surface of the microprocessor. Because the heat is intense at certain areas a high degree of cooling is needed or else the certain areas with the intense heat will not be adequately cooled and the microprocessor will not operate properly or may break down.
- the present invention utilizes the first metallic filler layer 20 to completely cover the top surface of the microprocessor 10 and to operate to spread out the heat from the smaller isolated hot spots on the upper surface of the microprocessor 10 to be more uniform.
- the microprocessor 10 By utilizing such a structure as shown in FIG. 1 the microprocessor 10 generates heat in small isolated hot spots, the first metallic filler layer 20 effectively spreads out that heat, and then the first metal plate 30 can dissipate that heat to an even greater area and can dissipate the heat through the outer casing 80 of the laptop.
- the first metal plate 30 have a larger area than that of the first metallic filler layer 20 so that the first metal plate 30 can effectively conduct heat away from the first metallic filler layer 20 .
- the first metal plate 30 can be anywhere between two to five times or more greater than the size and surface area of the first metallic filler layer 20 . The greater the size of the first metal plate 30 the greater its heat dissipation properties.
- the first metallic filler layer 20 having a thermal conductivity of perhaps one hundred times greater than that of the silicon-based paste is utilized.
- the first metallic filler layer 20 operates to effectively spread out the heat generated at the isolated hot spots on the top surface of the microprocessor 10 .
- the first metal plate 30 is provided in thermal conductive contact with the first metallic filler layer 20 .
- thermal conductive contact is meant that the noted elements can conduct heat between them, either directly or indirectly.
- FIG. 1 shows an embodiment of the present invention in its simplest form.
- FIGS. 2 ( a ) and 2 ( b ) show a further embodiment of the present invention with even further improved heat dissipation properties by virtue of utilizing additional elements, including a semiconductor thermoelectric module, as now discussed.
- an integrated circuit chip microprocessor 10 is provided as an element that generates heat, and which is desired to be cooled.
- FIGS. 2 ( a ) and 2 ( b ) FIG. 2 ( b ) showing a bottom view of FIG. 2 ( a )
- the microprocessor 10 is mounted on plastic clamp 60 and is secured within the first rubber insulator 50 1 .
- the overall device is held together by pins 70 extending through the first rubber insulator 50 1 , and the plastic clamp 60 .
- thermoelectric module 40 As the main cooling element in the device of FIGS. 2 ( a ), 2 ( b ), a semiconductor thermoelectric module 40 is provided, surrounded by a second rubber insulator 50 2 . That element is a well known Peltier element that can receive a current supplied from the source of the direct current (12V source) located inside the computer.
- the semiconductor thermoelectric module 40 can be any type of conventional thermoelectric cooling device such as an UltraTech 4-12-40-F1 thermoelectric cooling element.
- the semiconductor thermoelectric module 40 and the microprocessor 10 are three elements to enhance thermal conduction from the microprocessor 10 to the semiconductor thermoelectric module 40 , and specifically the three elements include the first metallic filler layer 20 , the first metal plate 30 , and a second metallic filler layer 22 .
- the applicants of the present invention recognized that when microprocessors output heat the heat is not generally output uniformly from the top surface of the microprocessor. That is, the present inventors recognized that a top surface of a microprocessor generates small isolated hot spots where intense heat is built up, rather than having a uniform dissipation of heat from a top surface of the microprocessor.
- the cooling device of the present invention utilizes a heat conduction system to spread out the heat from the smaller hot spots on the upper surface of the microprocessor 10 .
- a second metallic filler layer 22 thermally contacts the semiconductor thermoelectric module 40 .
- the second metallic filler layer 22 can be formed of the same material and to serve the same purpose as the first metallic filler layer 20 , namely to increase thermal conductivity and to spread out received heat more evenly.
- the first metal plate 30 and the second metallic filler layer 22 preferably have a greater surface area than that of the first metallic filler layer 20 to spread out heat to the semiconductor thermoelectric module 40 , which is preferably larger in surface area than the microprocessor 10 .
- the first metallic filler layer 20 , the first metal plate 30 , and the second metallic filler layer 22 serve to spread out the heat generated at the isolated hot spots on the top surface of the microprocessor 10 and to provide such spread out heat to the semiconductor thermoelectric module 40 . That allows the semiconductor thermoelectric module 40 to be much more effective in its cooling operation.
- the upper surface of the semiconductor thermoelectric module 40 can directly contact an outer surface of a device in which the microprocessor 10 is utilized, such as the outer surface or casing of a laptop computer.
- a further thermoelectric conductive layer structure can be provided.
- a third metallic filler layer 24 and a second metal plate 32 can serve to further dissipate heat and spread out heat from the semiconductor thermoelectric module 40 in the same manner as the first metallic filler layer 20 , the first metal plate 30 , and the second metallic filler layer 22 .
- the third metallic filler layer 24 and the second metal plate 32 can be formed of the same materials respectively as the first metallic filler layer 20 and the first metal plate 30 , and the first, second, and third metallic filler layers 20 , 22 , 24 can also be formed of the same material.
- first and second metal plates 30 and 32 can be formed of any material having a large thermal conductivity, such as aluminum (with a thermal conductivity of 210 W/m° K.) or copper (with a thermal conductivity of 390 W/m° K.), and other similar type materials.
- the material of any or all of the first, second, and third metallic filler layers 20 , 22 , and 24 can be of alloys with low melting temperature and high thermal conductivity, i.e. are molten metal conductive layers.
- one usable alloy having a melting temperature of 45° C. can be formed as follows: Sn 21.1%; Bi 50%; Pb 20.5%; and Cd 8.4%.
- Another alloy having a melting temperature of 60.5° C. that can be utilized can be formed as follows: Sn 12.5%; Bi 50%; Pb 25%; and Cd 12.5%.
- Another alloy having a melting temperature at 70° C. that can be utilized can be formed as follows: Sn 12.9%; Bi 49.4%; Pb 27.7%; and Cd 10%.
- the novel cooling system disclosed above can provide enhanced cooling of an element such as a microprocessor. Further enhanced cooling can be realized by utilizing a semiconductor thermoelectric module that can allow fixing a specified temperature range with a control, with providing a cooling module that has small overall dimensions, and with providing a cooling module that has no moving parts and thus has increased reliability.
- FIGS. 3 ( a ) to 3 ( i ) show a process for manufacturing the novel cooling system of the present invention.
- an element to be cooled is provided, i.e., in this disclosed embodiment the microprocessor 10 is provided.
- the first rubber frame 50 1 is provided around edges of the microprocessor 10 .
- the first metallic filler layer 20 is provided to cover and be in thermal contact with the entire top surface of the microprocessor 10 .
- the first metal plate 30 is provided to cover and to be in thermal contact with the first metallic filler layer 20 .
- FIGS. 3 ( a )- 3 ( d ) With the operations shown in FIGS. 3 ( a )- 3 ( d ) the structure shown in FIG. 1 , with the exception of the plastic clamp 60 , is realized. As shown in FIG. 1 , the device in FIG. 3 ( d ) can then be directly put in contact with an outer surface 80 of a computer.
- the manufacturing process then proceeds to an operation shown in FIG. 3 ( e ).
- the second rubber frame 50 2 is then provided to surround the first metal plate 30 .
- the second metallic filler layer 22 is provided to cover and to be in thermal contact with the entire surface of the first metal plate 30 .
- the semiconductor thermoelectric module 40 is provided to be in contact and in thermal contact with the second metallic filler layer 22 .
- the third metallic filler layer 24 is provided to cover an entire surface of and to be in thermal contact with the semiconductor thermoelectric module 40 .
- the second metallic plate 32 is provided to cover and to be in thermal contact with the third metallic filler layer 24 .
- FIG. 3 ( i ) The resulting structure shown in FIG. 3 ( i ) can then be applied against an outer casing 80 of a computer, after being held in place with a clamp 60 , to realize the structure shown in FIGS. 2 ( a ), 2 ( b ).
- FIGS. 3 ( a )- 3 ( i ) can realize the novel cooling devices shown in both FIG. 1 and FIG. 2 ( a ).
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- General Physics & Mathematics (AREA)
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Abstract
A cooling device for an element such as a microprocessor in a computer, and a process for manufacturing the cooling device. The cooling device provides an effective structure of cooling a microprocessor by providing a metallic filler layer and a metal plate layer spreading out heat generated from the microprocessor, and thereby effectively thermally conducting heat away from the microprocessor. Further, a semiconductor thermoelectric module can be utilized to further cool the microprocessor.
Description
- 1. Field of the Invention
- The present invention is directed to a cooling system structure particularly well suited for cooling an element such as an integrated circuit chip, such as a microprocessor installed in a computer, and a process for manufacturing the cooling system.
- 2. Description of the Background Art
- Adequate cooling of microprocessors in computer devices is a well known problem. The most conventional background approach to cooling a microprocessor in a computer is to attach some type of radiator structure onto a microprocessor computer chip and to use a fan to blow air across the radiator to cool the chip. However, such a background approach suffers from several problems as recognized by the present inventors.
- First, such a radiator-fan system cannot provide cooling at a specified temperature regime since the temperature of the cooling system depends on environmental conditions such as ambient temperature, humidity, etc. Further, such a cooling system is often just not particularly effective as the fan predominantly blows the warm air within the computer across the radiator, and thus often adequate cooling cannot be properly realized.
- Secondly, such a radiator-fan system has a drawback in that the chip to be cooled is usually of a few cubic centimeters in size and has a mass of a few grams, whereas the cooling system has a significantly greater volume and mass. With the desire to increase the miniaturization of computers, such as in a laptop computer, employing such a large cooling system prevents an adequate miniaturization of the overall device.
- Thirdly, such a radiator-fan system includes many mechanical parts for driving the fan. Failure in any of those mechanical parts can result in the fan not properly operating, which obviously results in improper cooling, and which can easily result in a catastrophic breakdown of the semiconductor chip. If a semiconductor chip reaches a temperature of approximately 100° C. the chip performance may deteriorate, and if the chip reaches a temperature of approximately 130° C. that chip may cease to operate, and having a fan breakdown can result in such temperatures being reached at the chip.
- Fourthly, in such a radiator-fan system the fan also brings in new air that may have moisture and dust that may coat the cooling system and eventually deteriorate and wear down components of the cooling system. Such a fan also requires a 12 volt power source, and thus such a radiator-fan system consumes a fair amount of energy, which is particularly detrimental in a laptop computer environment as it reduces battery life.
- Another background cooling system may utilize water or liquid cooling systems, particularly for larger microprocessor systems. The drawbacks with such liquid cooling systems are that they also require a large amount of space and again mechanical parts to control the liquid flow.
- Accordingly, one object of the present invention is to provide a novel cooling system that can overcome or minimize the above-noted drawbacks in the background art.
- The novel cooling system of the present invention avoids utilizing a fan, radiator, and pump, and thus can maintain a small size and consume less energy.
- Further, the novel cooling system of the present invention also does not have any moving parts and thus has increased reliability.
- A further object of the present invention is to provide a novel process for forming the novel cooling system.
- A more specific object of the present invention is to provide in a further embodiment a novel cooling system, and method of manufacturing the same, that utilizes a semiconductor thermoelectric module as a cooling element, and which additionally incorporates a structure to enhance operation of that semiconductor thermoelectric module.
- Certain other advantages achieved with the novel cooling system and process of the present invention is that the semiconductor thermoelectric module allows fixing a specified temperature range and controlling cooling to within that range, and thus effective cooling can be realized.
- A more complete appreciation of the present invention and many of the attendant advantages thereof will be readily obtained as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings, wherein:
-
FIG. 1 shows a structure of a novel cooling system of the present invention; - FIGS. 2(a) and 2(b) show a structure of a further embodiment of a novel cooling system of the present invention; and
- FIGS. 3(a) to 3(i) show a process of manufacturing the novel cooling systems of the present invention.
- Referring now to
FIG. 1 , a view of the novel cooling system of the present invention in one embodiment is provided. - The present invention is suited to cool any element that generates heat at a surface. The present invention is particularly applicable to cooling integrated circuit chips, for example microprocessor chips, within computers, and
FIG. 1 is directed to such a non-limiting embodiment of the present invention. - As shown in
FIG. 1 , amicroprocessor 10 is mounted on aplastic clamp 60 and is secured within a first rubber insulator 50 1. According to features in the present invention, a firstmetallic filler layer 20 is formed in contact with themicroprocessor 10 to completely cover a top surface of themicroprocessor 10. Further, afirst metal plate 30, which has a larger area than that of the firstmetallic filler layer 20 and themicroprocessor 10, is provided in contact with the firstmetallic filler layer 20. In the simplest embodiment thatfirst metal plate 30 can contact anouter surface 80 of a computer, forexample surface 80 can be the outer casing of a laptop computer. - The applicants of the present invention recognized that when a microprocessor outputs heat the heat is generally not output uniformly from the top surface of the microprocessor. That is, the present inventors recognized that a top surface of a microprocessor generates small isolated hot spots where intense heat is built up, rather than having a uniform dissipation of heat from a top surface of the microprocessor. Because the heat is intense at certain areas a high degree of cooling is needed or else the certain areas with the intense heat will not be adequately cooled and the microprocessor will not operate properly or may break down.
- In recognizing this characteristic of the heating of a microprocessor, the present invention utilizes the first
metallic filler layer 20 to completely cover the top surface of themicroprocessor 10 and to operate to spread out the heat from the smaller isolated hot spots on the upper surface of themicroprocessor 10 to be more uniform. - By utilizing such a structure as shown in
FIG. 1 themicroprocessor 10 generates heat in small isolated hot spots, the firstmetallic filler layer 20 effectively spreads out that heat, and then thefirst metal plate 30 can dissipate that heat to an even greater area and can dissipate the heat through theouter casing 80 of the laptop. - In the present invention it is beneficial that the
first metal plate 30 have a larger area than that of the firstmetallic filler layer 20 so that thefirst metal plate 30 can effectively conduct heat away from the firstmetallic filler layer 20. Thefirst metal plate 30 can be anywhere between two to five times or more greater than the size and surface area of the firstmetallic filler layer 20. The greater the size of thefirst metal plate 30 the greater its heat dissipation properties. - In semiconductor applications it has been known to fill a space between a microprocessor and a radiator or cooling element with a silicon-based paste that may typically have a thermal conductivity range of 0.2-0.5 W/m° K. Otherwise, if only an air layer is provided between a microprocessor and a cooling element, as air only has a thermal conductivity of 0.025 W/m° K., effective thermal transmission cannot be realized.
- Based on the recognition of the present inventors of the intense heat generated at isolated hot spots on top of the
microprocessor 10, the firstmetallic filler layer 20 having a thermal conductivity of perhaps one hundred times greater than that of the silicon-based paste is utilized. - The first
metallic filler layer 20 operates to effectively spread out the heat generated at the isolated hot spots on the top surface of themicroprocessor 10. To continue that spreading out of the generated heat, thefirst metal plate 30 is provided in thermal conductive contact with the firstmetallic filler layer 20. By thermal conductive contact is meant that the noted elements can conduct heat between them, either directly or indirectly. -
FIG. 1 shows an embodiment of the present invention in its simplest form. FIGS. 2(a) and 2(b) show a further embodiment of the present invention with even further improved heat dissipation properties by virtue of utilizing additional elements, including a semiconductor thermoelectric module, as now discussed. - As shown in FIGS. 2(a) and 2(b), in this further embodiment, an integrated
circuit chip microprocessor 10 is provided as an element that generates heat, and which is desired to be cooled. As shown in FIGS. 2(a) and 2(b),FIG. 2 (b) showing a bottom view of FIG. 2(a), themicroprocessor 10 is mounted onplastic clamp 60 and is secured within the first rubber insulator 50 1. The overall device is held together bypins 70 extending through the first rubber insulator 50 1, and theplastic clamp 60. - As the main cooling element in the device of FIGS. 2(a), 2(b), a semiconductor
thermoelectric module 40 is provided, surrounded by a second rubber insulator 50 2. That element is a well known Peltier element that can receive a current supplied from the source of the direct current (12V source) located inside the computer. The semiconductorthermoelectric module 40 can be any type of conventional thermoelectric cooling device such as an UltraTech 4-12-40-F1 thermoelectric cooling element. - Provided between the semiconductor
thermoelectric module 40 and themicroprocessor 10 are three elements to enhance thermal conduction from themicroprocessor 10 to the semiconductorthermoelectric module 40, and specifically the three elements include the firstmetallic filler layer 20, thefirst metal plate 30, and a secondmetallic filler layer 22. - As noted above, the applicants of the present invention recognized that when microprocessors output heat the heat is not generally output uniformly from the top surface of the microprocessor. That is, the present inventors recognized that a top surface of a microprocessor generates small isolated hot spots where intense heat is built up, rather than having a uniform dissipation of heat from a top surface of the microprocessor. To more effectively utilize the semiconductor
thermoelectric module 40, prior to heat being conducted from themicroprocessor 10 to the semiconductorthermoelectric module 40, the cooling device of the present invention utilizes a heat conduction system to spread out the heat from the smaller hot spots on the upper surface of themicroprocessor 10. - In the further embodiment of FIGS. 2(a), 2(b) a second
metallic filler layer 22 thermally contacts the semiconductorthermoelectric module 40. The secondmetallic filler layer 22 can be formed of the same material and to serve the same purpose as the firstmetallic filler layer 20, namely to increase thermal conductivity and to spread out received heat more evenly. - The
first metal plate 30 and the secondmetallic filler layer 22 preferably have a greater surface area than that of the firstmetallic filler layer 20 to spread out heat to the semiconductorthermoelectric module 40, which is preferably larger in surface area than themicroprocessor 10. - With the above-noted structure the first
metallic filler layer 20, thefirst metal plate 30, and the secondmetallic filler layer 22 serve to spread out the heat generated at the isolated hot spots on the top surface of themicroprocessor 10 and to provide such spread out heat to the semiconductorthermoelectric module 40. That allows the semiconductorthermoelectric module 40 to be much more effective in its cooling operation. - In the present invention the upper surface of the semiconductor
thermoelectric module 40 can directly contact an outer surface of a device in which themicroprocessor 10 is utilized, such as the outer surface or casing of a laptop computer. However, to be even more effective in conducting heat provided between the semiconductorthermoelectric module 40 and the casing of a device such as a laptop computer a further thermoelectric conductive layer structure can be provided. - As seen in FIGS. 2(a) and 2(b), provided on the shown upper surface of the semiconductor
thermoelectric module 40 can be a thirdmetallic filler layer 24 and asecond metal plate 32. The thirdmetallic filler layer 24 and thesecond metal plate 32 can serve to further dissipate heat and spread out heat from the semiconductorthermoelectric module 40 in the same manner as the firstmetallic filler layer 20, thefirst metal plate 30, and the secondmetallic filler layer 22. Further, the thirdmetallic filler layer 24 and thesecond metal plate 32 can be formed of the same materials respectively as the firstmetallic filler layer 20 and thefirst metal plate 30, and the first, second, and third metallic filler layers 20, 22, 24 can also be formed of the same material. - One or both of the first and
second metal plates - The material of any or all of the first, second, and third metallic filler layers 20, 22, and 24 can be of alloys with low melting temperature and high thermal conductivity, i.e. are molten metal conductive layers. For example, one usable alloy having a melting temperature of 45° C. can be formed as follows:
Sn 21.1%; Bi 50%; Pb 20.5%; and Cd 8.4%. - Another alloy having a melting temperature of 60.5° C. that can be utilized can be formed as follows:
Sn 12.5%; Bi 50%; Pb 25%; and Cd 12.5%. - Another alloy having a melting temperature at 70° C. that can be utilized can be formed as follows:
Sn 12.9%; Bi 49.4%; Pb 27.7%; and Cd 10%. - In such ways, the novel cooling system disclosed above can provide enhanced cooling of an element such as a microprocessor. Further enhanced cooling can be realized by utilizing a semiconductor thermoelectric module that can allow fixing a specified temperature range with a control, with providing a cooling module that has small overall dimensions, and with providing a cooling module that has no moving parts and thus has increased reliability.
- FIGS. 3(a) to 3(i) show a process for manufacturing the novel cooling system of the present invention.
- As shown in
FIG. 3 (a), an element to be cooled is provided, i.e., in this disclosed embodiment themicroprocessor 10 is provided. In a next operation shown inFIG. 3 (b) the first rubber frame 50 1 is provided around edges of themicroprocessor 10. Then, as shown inFIG. 3 (c), the firstmetallic filler layer 20 is provided to cover and be in thermal contact with the entire top surface of themicroprocessor 10. Then, as shown inFIG. 3 (d), thefirst metal plate 30 is provided to cover and to be in thermal contact with the firstmetallic filler layer 20. - With the operations shown in FIGS. 3(a)-3(d) the structure shown in
FIG. 1 , with the exception of theplastic clamp 60, is realized. As shown inFIG. 1 , the device inFIG. 3 (d) can then be directly put in contact with anouter surface 80 of a computer. - However, to realize the enhanced device of
FIG. 2 (a), the manufacturing process then proceeds to an operation shown inFIG. 3 (e). As shown inFIG. 3 (e) the second rubber frame 50 2 is then provided to surround thefirst metal plate 30. Then, as shown inFIG. 3 (f), the secondmetallic filler layer 22 is provided to cover and to be in thermal contact with the entire surface of thefirst metal plate 30. Then, as shown inFIG. 3 (g), the semiconductorthermoelectric module 40 is provided to be in contact and in thermal contact with the secondmetallic filler layer 22. Then, as shown inFIG. 3 (h), the thirdmetallic filler layer 24 is provided to cover an entire surface of and to be in thermal contact with the semiconductorthermoelectric module 40. Then, as shown inFIG. 3 (i), the secondmetallic plate 32 is provided to cover and to be in thermal contact with the thirdmetallic filler layer 24. - The resulting structure shown in
FIG. 3 (i) can then be applied against anouter casing 80 of a computer, after being held in place with aclamp 60, to realize the structure shown in FIGS. 2(a), 2(b). - In such ways, the operations shown in FIGS. 3(a)-3(i) can realize the novel cooling devices shown in both
FIG. 1 andFIG. 2 (a). - Obviously, numerous additional modifications and variations of the present invention are possible in light of the above teachings. It is therefore to be understood that within the scope of the appended claims, the present invention may be practiced otherwise than as specifically described herein.
Claims (45)
1. A cooling device, comprising
an element to be cooled and including a surface outputting heat;
a first metallic filler layer configured to cover and to be in thermal conductive contact with an entire portion of said surface of said element outputting heat;
a first metal plate covering and in thermal conductive contact with a surface of said first metallic filler layer, the first metal plate having a greater area than an area of said first metallic filler layer.
2. A cooling device according to claim 1 , further comprising:
a second metallic filler layer in thermal conductive contact with said first metal plate; and
a semiconductor thermoelectric module in thermal conductive contact with said second metallic filler layer.
3. A cooling device according to claim 2 , further comprising:
a third metallic filler layer in thermal conductive contact with said semiconductor thermoelectric module; and
a second metal plate in thermal conductive contact with said third metallic filler layer.
4. A cooling device according to claim 3 , wherein said second and third metallic filler layers cover entire surfaces of said semiconductor thermoelectric module.
5. A cooling device according to claim 1 , wherein said element to be cooled is an integrated circuit chip.
6. A cooling device according to claim 3 , wherein said element to be cooled is an integrated circuit chip.
7. A cooling device according to claim 1 , wherein said first metallic filler layer is formed of an alloy of:
8. A cooling device according to claim 3 , wherein at least one of said first, second, and third metallic filler layers is formed of an alloy of:
9. A cooling device according to claim 1 , wherein said first metallic filler layer is formed of an alloy of:
10. A cooling device according to claim 3 , wherein at least one of said first, second, and third metallic filler layers is formed of an alloy of:
11. A cooling device according to claim 1 , wherein said first metallic filler layer is formed of an alloy of:
12. A cooling device according to claim 3 , wherein at least one of said first, second, and third metallic filler layers is formed of an alloy of:
13. A cooling device according to claim 1 , wherein said first metal plate is formed of at least one of aluminum or copper.
14. A cooling device according to claim 3 , wherein at least one of said first and second metal plates is formed of at least one of aluminum or copper.
15. A cooling device according to claim 3 , wherein said semiconductor thermoelectric module is a Peltier element.
16. A cooling device according to claim 7 , wherein said element to be cooled is an integrated circuit chip.
17. A cooling device according to claim 8 , wherein said element to be cooled is an integrated circuit chip.
18. A cooling device according to claim 9 , wherein said element to be cooled is an integrated circuit chip.
19. A cooling device according to claim 10 , wherein said element to be cooled is an integrated circuit chip.
20. A cooling device according to claim 11 , wherein said element to be cooled is an integrated circuit chip.
21. A cooling device according to claim 12 , wherein said element to be cooled is an integrated circuit chip.
22. A cooling device comprising:
an element to be cooled including a surface outputting heat;
first means for conducting heat away from said surface of said element outputting heat; and
means for cooling for element to be cooled, in thermal conduction with said first means for conducting.
23. A cooling device according to claim 22 , further comprising:
second means for conducting heat away from said means for cooling.
24. A cooling device according to claim 22 , wherein said element to be cooled is an integrated circuit chip.
25. A process for manufacturing a cooling device, comprising
providing an element to be cooled and including a surface outputting heat;
providing a first metallic filler layer to cover and to be in thermal conductive contact with an entire portion of said surface of said element outputting heat;
providing a first metal plate to cover and to be in thermal conductive contact with a surface of said first metallic filler layer, the first metal plate having a greater area than an area of said first metallic filler layer.
26. A process for manufacturing a cooling device according to claim 25 , further comprising:
providing a second metallic filler layer in thermal conductive contact with said first metal plate; and
providing a semiconductor thermoelectric module in thermal conductive contact with said second metallic filler layer.
27. A process for manufacturing a cooling device according to claim 26 , further comprising:
providing a third metallic filler layer in thermal conductive contact with said semiconductor thermoelectric module; and
providing a second metal plate in thermal conductive contact with said third metallic filler layer.
28. A process for manufacturing a cooling device according to claim 27 , wherein said second and third metallic filler layers cover entire surfaces of said semiconductor thermoelectric module.
29. A cooling device according to claim 25 , wherein said element to be cooled is an integrated circuit chip.
30. A cooling device according to claim 27 , wherein said element to be cooled is an integrated circuit chip.
31. A cooling device according to claim 25 , wherein said first metallic filler layer is formed of an alloy of:
32. A cooling device according to claim 27 , wherein at least one of said first, second, and third metallic filler layers is formed of an alloy of:
33. A cooling device according to claim 25 , wherein said first metallic filler layer is formed of an alloy of:
34. A cooling device according to claim 27 , wherein at least one of said first, second, and third metallic filler layers is formed of an alloy of:
35. A cooling device according to claim 25 , wherein said first metallic filler layer is formed of an alloy of:
36. A cooling device according to claim 27 , wherein at least one of said first, second, and third metallic filler layers is formed of an alloy of:
37. A cooling device according to claim 25 , wherein said first metal plate is formed of at least one of aluminum or copper.
38. A cooling device according to claim 27 , wherein at least one of said first and second metal plates is formed of at least one of aluminum or copper.
39. A cooling device according to claim 27 , wherein said semiconductor thermoelectric module is a Peltier element.
40. A cooling device according to claim 31 , wherein said element to be cooled is an integrated circuit chip.
41. A cooling device according to claim 32 , wherein said element to be cooled is an integrated circuit chip.
42. A cooling device according to claim 33 , wherein said element to be cooled is an integrated circuit chip.
43. A cooling device according to claim 34 , wherein said element to be cooled is an integrated circuit chip.
44. A cooling device according to claim 35 , wherein said element to be cooled is an integrated circuit chip.
45. A cooling device according to claim 36 , wherein said element to be cooled is an integrated circuit chip.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/917,312 US7067913B2 (en) | 2004-08-13 | 2004-08-13 | Semiconductor cooling system and process for manufacturing the same |
KR1020077005427A KR20070051308A (en) | 2004-08-13 | 2005-08-11 | Semiconductor cooling system and process for manufacturing the same |
CNA2005800305051A CN101019218A (en) | 2004-08-13 | 2005-08-11 | Semiconductor cooling system and process for manufacturing the same |
PCT/IL2005/000870 WO2006016367A2 (en) | 2004-08-13 | 2005-08-11 | Semiconductor cooling system and process for manufacturing the same |
US11/438,210 US20060208353A1 (en) | 2004-08-13 | 2006-05-23 | Semiconductor cooling system and process for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/917,312 US7067913B2 (en) | 2004-08-13 | 2004-08-13 | Semiconductor cooling system and process for manufacturing the same |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/438,210 Continuation US20060208353A1 (en) | 2004-08-13 | 2006-05-23 | Semiconductor cooling system and process for manufacturing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
US20060033206A1 true US20060033206A1 (en) | 2006-02-16 |
US7067913B2 US7067913B2 (en) | 2006-06-27 |
Family
ID=35799231
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/917,312 Expired - Fee Related US7067913B2 (en) | 2004-08-13 | 2004-08-13 | Semiconductor cooling system and process for manufacturing the same |
US11/438,210 Abandoned US20060208353A1 (en) | 2004-08-13 | 2006-05-23 | Semiconductor cooling system and process for manufacturing the same |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/438,210 Abandoned US20060208353A1 (en) | 2004-08-13 | 2006-05-23 | Semiconductor cooling system and process for manufacturing the same |
Country Status (4)
Country | Link |
---|---|
US (2) | US7067913B2 (en) |
KR (1) | KR20070051308A (en) |
CN (1) | CN101019218A (en) |
WO (1) | WO2006016367A2 (en) |
Cited By (2)
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US20070101737A1 (en) * | 2005-11-09 | 2007-05-10 | Masao Akei | Refrigeration system including thermoelectric heat recovery and actuation |
US20070101748A1 (en) * | 2005-11-09 | 2007-05-10 | Pham Hung M | Refrigeration system including thermoelectric module |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7067913B2 (en) * | 2004-08-13 | 2006-06-27 | Dtnr Ltd. | Semiconductor cooling system and process for manufacturing the same |
US20080028767A1 (en) * | 2006-08-01 | 2008-02-07 | Broderick Lionel H | Computer cooler |
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ATE345307T1 (en) * | 2000-06-15 | 2006-12-15 | S H B L S A | LIFTING RING |
US7067913B2 (en) * | 2004-08-13 | 2006-06-27 | Dtnr Ltd. | Semiconductor cooling system and process for manufacturing the same |
-
2004
- 2004-08-13 US US10/917,312 patent/US7067913B2/en not_active Expired - Fee Related
-
2005
- 2005-08-11 KR KR1020077005427A patent/KR20070051308A/en not_active Application Discontinuation
- 2005-08-11 WO PCT/IL2005/000870 patent/WO2006016367A2/en active Application Filing
- 2005-08-11 CN CNA2005800305051A patent/CN101019218A/en active Pending
-
2006
- 2006-05-23 US US11/438,210 patent/US20060208353A1/en not_active Abandoned
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US5637921A (en) * | 1995-04-21 | 1997-06-10 | Sun Microsystems, Inc. | Sub-ambient temperature electronic package |
US6249434B1 (en) * | 2000-06-20 | 2001-06-19 | Adc Telecommunications, Inc. | Surface mounted conduction heat sink |
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Cited By (9)
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US20070101737A1 (en) * | 2005-11-09 | 2007-05-10 | Masao Akei | Refrigeration system including thermoelectric heat recovery and actuation |
US20070101738A1 (en) * | 2005-11-09 | 2007-05-10 | Masao Akei | Vapor compression circuit and method including a thermoelectric device |
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US20070101750A1 (en) * | 2005-11-09 | 2007-05-10 | Pham Hung M | Refrigeration system including thermoelectric module |
US20070101740A1 (en) * | 2005-11-09 | 2007-05-10 | Masao Akei | Vapor compression circuit and method including a thermoelectric device |
US20070101739A1 (en) * | 2005-11-09 | 2007-05-10 | Masao Akei | Vapor compression circuit and method including a thermoelectric device |
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US8307663B2 (en) | 2005-11-09 | 2012-11-13 | Emerson Climate Technologies, Inc. | Vapor compression circuit and method including a thermoelectric device |
Also Published As
Publication number | Publication date |
---|---|
US20060208353A1 (en) | 2006-09-21 |
KR20070051308A (en) | 2007-05-17 |
WO2006016367A3 (en) | 2006-03-30 |
US7067913B2 (en) | 2006-06-27 |
CN101019218A (en) | 2007-08-15 |
WO2006016367A2 (en) | 2006-02-16 |
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