WO2017068835A1 - 弾性波装置 - Google Patents
弾性波装置 Download PDFInfo
- Publication number
- WO2017068835A1 WO2017068835A1 PCT/JP2016/073303 JP2016073303W WO2017068835A1 WO 2017068835 A1 WO2017068835 A1 WO 2017068835A1 JP 2016073303 W JP2016073303 W JP 2016073303W WO 2017068835 A1 WO2017068835 A1 WO 2017068835A1
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- WIPO (PCT)
- Prior art keywords
- film
- wave device
- electrode
- thickness
- elastic wave
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 5
- 229910013641 LiNbO 3 Inorganic materials 0.000 claims description 27
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 10
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 230000004044 response Effects 0.000 abstract description 8
- 229910003327 LiNbO3 Inorganic materials 0.000 abstract 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000035945 sensitivity Effects 0.000 description 6
- 229910016570 AlCu Inorganic materials 0.000 description 5
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 5
- 229910001120 nichrome Inorganic materials 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 239000007772 electrode material Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000010606 normalization Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02889—Means for compensation or elimination of undesirable effects of influence of mass loading
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
- H03H3/10—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02637—Details concerning reflective or coupling arrays
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14538—Formation
- H03H9/14541—Multilayer finger or busbar electrode
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02157—Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
Definitions
- the present invention relates to an acoustic wave device in which an IDT electrode, a dielectric film, and a frequency adjustment film are stacked on a LiNbO 3 substrate.
- the ⁇ is in the range of 25 ° to 31 °. In this case, even if the thickness of the frequency adjustment film is thin, the fluctuation of the SH wave spurious can be more effectively suppressed.
- the acoustic wave device 1 has a LiNbO 3 substrate 2.
- An IDT electrode 3 is provided on the LiNbO 3 substrate 2.
- the IDT electrode 3 has a plurality of electrode fingers 3a.
- Reflectors 4 and 5 are provided on both sides of the IDT electrode 3 in the elastic wave propagation direction. Thereby, a 1-port elastic wave resonator is configured.
- the elastic wave device 1 uses Rayleigh waves.
- the thickness of the SiO 2 film as the dielectric film is not particularly limited, it may be thicker than the IDT electrode and about 0.6 ⁇ or less. If the thickness of the SiO 2 film is within this range, good frequency temperature characteristics can be obtained. In addition, the resonance frequency is hardly lowered.
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
2…LiNbO3基板
3…IDT電極
3a…電極指
4,5…反射器
6…誘電体膜
7…周波数調整膜
11…NiCr膜
12…Pt膜
13…Ti膜
14…AlCu合金膜
Claims (11)
- LiNbO3基板と、
前記LiNbO3基板に設けられたIDT電極と、
前記IDT電極を覆うように、前記LiNbO3基板上に設けられた誘電体膜と、
前記誘電体膜上に設けられた周波数調整膜とを備え、
前記LiNbO3基板のオイラー角が、(0°±5°の範囲内,θ±1.5°の範囲内,0°±10°の範囲内)であり、前記IDT電極が主電極を有し、前記IDT電極の電極指ピッチで定まる波長λにより規格化してなる前記主電極の膜厚をT、前記主電極の材料とPtとの密度比をrとしたときに、
前記主電極の膜厚Tと前記オイラー角のθとが下記の式(1)を満たしている、弾性波装置。
式(1):θ=-0.05°/(T/r-0.04)+31.35° - 前記θが25°以上、31°以下の範囲内にある、請求項1に記載の弾性波装置。
- 前記主電極が、Pt、Au、W、Ta、Mo及びCuからなる群から選択された1種の金属または該金属を主体とする合金である、請求項1または2に記載の弾性波装置。
- 前記周波数調整膜の膜厚が、0より大きく、0.025λ以下である、請求項1~3のいずれか1項に記載の弾性波装置。
- 前記周波数調整膜の膜厚が、0.005λ以下である、請求項4に記載の弾性波装置。
- 前記誘電体膜が、酸化ケイ素からなる、請求項1~5のいずれか1項に記載の弾性波装置。
- 前記周波数調整膜が窒化ケイ素からなる、請求項1~6のいずれか1項に記載の弾性波装置。
- 前記IDT電極が、前記主電極と、前記主電極以外の金属からなる他の電極層を有する、請求項1~7のいずれか1項に記載の弾性波装置。
- 前記IDT電極を有する帯域通過型フィルタである、請求項1~8のいずれか1項に記載の弾性波装置。
- 前記IDT電極の合計膜厚は、0.25λ以下である、請求項1~9のいずれか1項に記載の弾性波装置。
- 前記酸化ケイ素の厚みは、前記IDT電極よりも厚い、請求項6に記載の弾性波装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020207014375A KR102310917B1 (ko) | 2015-10-23 | 2016-08-08 | 탄성파 장치 |
CN202210371064.7A CN114665840A (zh) | 2015-10-23 | 2016-08-08 | 弹性波装置 |
CN201680059542.3A CN108141198B (zh) | 2015-10-23 | 2016-08-08 | 弹性波装置 |
KR1020187008476A KR102115177B1 (ko) | 2015-10-23 | 2016-08-08 | 탄성파 장치 |
US15/924,311 US11424731B2 (en) | 2015-10-23 | 2018-03-19 | Elastic wave device |
US17/868,819 US11621692B2 (en) | 2015-10-23 | 2022-07-20 | Elastic wave device |
US18/115,117 US11936365B2 (en) | 2015-10-23 | 2023-02-28 | Elastic wave device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2015208924 | 2015-10-23 | ||
JP2015-208924 | 2015-10-23 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US15/924,311 Continuation US11424731B2 (en) | 2015-10-23 | 2018-03-19 | Elastic wave device |
Publications (1)
Publication Number | Publication Date |
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WO2017068835A1 true WO2017068835A1 (ja) | 2017-04-27 |
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PCT/JP2016/073303 WO2017068835A1 (ja) | 2015-10-23 | 2016-08-08 | 弾性波装置 |
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US (3) | US11424731B2 (ja) |
KR (2) | KR102115177B1 (ja) |
CN (2) | CN108141198B (ja) |
WO (1) | WO2017068835A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190110020A (ko) * | 2018-03-19 | 2019-09-27 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치 |
JPWO2018193830A1 (ja) * | 2017-04-17 | 2019-11-07 | 株式会社村田製作所 | 弾性波装置、高周波フロントエンド回路及び通信装置 |
CN111164891A (zh) * | 2017-09-29 | 2020-05-15 | 株式会社村田制作所 | 多工器、高频前端电路以及通信装置 |
CN111183584A (zh) * | 2017-09-29 | 2020-05-19 | 株式会社村田制作所 | 多工器、高频前端电路以及通信装置 |
WO2023162979A1 (ja) * | 2022-02-28 | 2023-08-31 | 株式会社村田製作所 | 弾性波装置 |
Families Citing this family (1)
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KR102115177B1 (ko) * | 2015-10-23 | 2020-05-26 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치 |
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2016
- 2016-08-08 KR KR1020187008476A patent/KR102115177B1/ko active IP Right Grant
- 2016-08-08 WO PCT/JP2016/073303 patent/WO2017068835A1/ja active Application Filing
- 2016-08-08 CN CN201680059542.3A patent/CN108141198B/zh active Active
- 2016-08-08 KR KR1020207014375A patent/KR102310917B1/ko active IP Right Grant
- 2016-08-08 CN CN202210371064.7A patent/CN114665840A/zh active Pending
-
2018
- 2018-03-19 US US15/924,311 patent/US11424731B2/en active Active
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2022
- 2022-07-20 US US17/868,819 patent/US11621692B2/en active Active
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2023
- 2023-02-28 US US18/115,117 patent/US11936365B2/en active Active
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WO2008102577A1 (ja) * | 2007-02-19 | 2008-08-28 | Murata Manufacturing Co., Ltd. | 弾性表面波センサー装置 |
JP2013145930A (ja) * | 2010-04-21 | 2013-07-25 | Murata Mfg Co Ltd | 弾性表面波装置及びその製造方法 |
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Cited By (8)
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JPWO2018193830A1 (ja) * | 2017-04-17 | 2019-11-07 | 株式会社村田製作所 | 弾性波装置、高周波フロントエンド回路及び通信装置 |
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CN111183584A (zh) * | 2017-09-29 | 2020-05-19 | 株式会社村田制作所 | 多工器、高频前端电路以及通信装置 |
CN111164891B (zh) * | 2017-09-29 | 2023-04-04 | 株式会社村田制作所 | 多工器、高频前端电路以及通信装置 |
CN111183584B (zh) * | 2017-09-29 | 2023-08-18 | 株式会社村田制作所 | 多工器、高频前端电路以及通信装置 |
KR20190110020A (ko) * | 2018-03-19 | 2019-09-27 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치 |
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WO2023162979A1 (ja) * | 2022-02-28 | 2023-08-31 | 株式会社村田製作所 | 弾性波装置 |
Also Published As
Publication number | Publication date |
---|---|
US20180212586A1 (en) | 2018-07-26 |
CN114665840A (zh) | 2022-06-24 |
KR20200058594A (ko) | 2020-05-27 |
US11424731B2 (en) | 2022-08-23 |
US11936365B2 (en) | 2024-03-19 |
KR102115177B1 (ko) | 2020-05-26 |
KR20180042401A (ko) | 2018-04-25 |
CN108141198B (zh) | 2022-04-29 |
US20220360247A1 (en) | 2022-11-10 |
US20230208387A1 (en) | 2023-06-29 |
CN108141198A (zh) | 2018-06-08 |
KR102310917B1 (ko) | 2021-10-08 |
US11621692B2 (en) | 2023-04-04 |
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