WO2017059645A1 - 加热装置以及加热腔室 - Google Patents

加热装置以及加热腔室 Download PDF

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Publication number
WO2017059645A1
WO2017059645A1 PCT/CN2015/099858 CN2015099858W WO2017059645A1 WO 2017059645 A1 WO2017059645 A1 WO 2017059645A1 CN 2015099858 W CN2015099858 W CN 2015099858W WO 2017059645 A1 WO2017059645 A1 WO 2017059645A1
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WIPO (PCT)
Prior art keywords
heating
temperature
substrate
heating device
bearing surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/099858
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English (en)
French (fr)
Inventor
张军
武学伟
董博宇
徐宝岗
张鹤南
郭冰亮
张文
刘绍辉
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Beijing NMC Co Ltd
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Beijing NMC Co Ltd
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Filing date
Publication date
Application filed by Beijing NMC Co Ltd filed Critical Beijing NMC Co Ltd
Priority to JP2018517601A priority Critical patent/JP2018531324A/ja
Priority to US15/543,472 priority patent/US10937672B2/en
Priority to SG11201802148YA priority patent/SG11201802148YA/en
Priority to KR1020187000331A priority patent/KR20180015244A/ko
Publication of WO2017059645A1 publication Critical patent/WO2017059645A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D5/00—Supports, screens or the like for the charge within the furnace
    • F27D5/0037—Supports specially adapted for semi-conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00—Charging; Discharging; Manipulation of charge
    • F27D2003/0034—Means for moving, conveying, transporting the charge in the furnace or in the charging facilities
    • F27D2003/0065—Lifts, e.g. containing the bucket elevators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D19/00—Arrangements of controlling devices
    • F27D2019/0003—Monitoring the temperature or a characteristic of the charge and using it as a controlling value

Definitions

  • the present invention relates to the field of semiconductor device processing technology, and in particular to a heating device and a heating chamber.
  • PVD Physical Vapor Deposition
  • the apparatus includes a susceptor for carrying a substrate, and a heating assembly for heating and temperature maintaining the substrate to a temperature required for the sputtering process.
  • a conventional heating device is an electric resistance heater which realizes heating of a substrate by providing a resistance wire in the susceptor and transferring heat generated by the resistance wire to the substrate through the susceptor.
  • a back blowing pipe is provided in the susceptor for supplying an inert gas (for example, argon gas) to the gap between the susceptor and the substrate.
  • the electric resistance heater has a thermocouple for detecting the temperature of the susceptor for control.
  • the heating efficiency of the electric resistance heater is low, and the temperature rise rate of the substrate is slow, thereby reducing the production efficiency.
  • the substrate is required to be rapidly heated to the required temperature of the process after being transferred to the process chamber; after the process is finished, the temperature of the substrate can be quickly reduced to the tolerance of the robot. Below the temperature, to ensure that the robot can perform the pick and place operation normally. Therefore, the current resistance heater cannot meet the requirements of the high temperature PVD process for rapid temperature rise and fall.
  • thermocouple indirectly obtains the substrate temperature by measuring the temperature of the susceptor, the susceptor and the substrate may have temperature differences due to factors such as heat conduction efficiency (a difference of at least 100 ° C). Therefore, the accuracy of the substrate temperature control is low.
  • FIG. 1 is a schematic structural diagram of a conventional PVD device.
  • the PVD apparatus includes a heating chamber 10 in which a sealed quartz window 13 is disposed, and the heating chamber 10 is partitioned into an upper sub-chamber and a lower sub-chamber by means of a sealed quartz window 13.
  • a susceptor 11 for carrying a substrate is disposed in the lower sub-chamber, and a resistance wire 111 is disposed inside the susceptor 11 for heating the substrate 14 disposed on the susceptor 11.
  • a heating bulb 12 is disposed at the top of the upper sub-chamber, which heats the substrate 14 disposed on the surface of the susceptor 11 through the sealed quartz window 13 by thermal radiation.
  • . 2 is a cross-sectional view taken along line A-A of FIG. 1.
  • the heating bulbs 12 are arranged in the circumferential direction of the heating chamber 10.
  • the above heating device inevitably has the following problems in practical applications:
  • the heating bulb 12 can only be used in an atmospheric environment, it can only be heated by means of heat, that is, it is radiated over the substrate.
  • This heating method has a small application range, for example, cannot be applied to A magnetron sputtering chamber with a target at the top.
  • the heating bulb 12 can only be used in an atmospheric environment, the heat loss is large, which is particularly noticeable when performing high-temperature heating (above 500 ° C), so that the heating efficiency is low and the high-temperature heating cannot be maintained. Moreover, the heating bulb 12 must indirectly heat the substrate 14 through the sealed quartz window 13, thereby causing heat loss, which further causes a decrease in heating efficiency.
  • the present invention provides a heating device and a heating chamber which are not only highly efficient in heating, but also can be applied in a vacuum environment or an atmospheric environment, so that the application range can be expanded.
  • a technical solution to solve the above technical problem is to provide a heating device including a substrate, at least three support columns, and a heating assembly, wherein the at least three support columns are vertical Disposed on the substrate and distributed along a circumferential interval of the substrate, and a top end of the at least three support columns forms a bearing surface for supporting the heated member;
  • the heating assembly includes a heating tube and heat radiation a shielding assembly, wherein the heating lamp tube is disposed above the substrate and below the bearing surface for radiating heat toward the bearing surface, and an effective heating region formed by the uniform distribution of the heating lamps
  • a projection on the substrate covers a projection of the bearing surface on the substrate; the thermal radiation shielding assembly is for shielding heat radiated by the heating tube toward the periphery and the bottom.
  • the heating lamp tube comprises a heating section and two non-heating sections at both ends thereof, wherein a heating wire for generating heat is disposed in the heating section, and the area where the heating wire is located is An effective heating zone; in each of the non-heating sections, wires respectively connected to both ends of the heating wire are provided for use as a positive electrode and a negative electrode of the heating lamp.
  • the shape and size of the effective heating zone is obtained by setting the shape of the heating tube and the length of the heating wire.
  • the shape of the effective heating zone corresponds to the shape of the bearing surface.
  • the heating lamp tubes are plural; the plurality of heating lamps are straight tubes, and are arranged parallel to each other at equal intervals; or each of the heating lamps includes an arc portion and the arc a straight portion connecting the two ends of the shape portion, wherein the arc portions of the respective heating lamps are concentric and have different radii, and are arranged at equal intervals; the straight portions of the respective heating lamps are parallel to each other, and the like Arranged at intervals.
  • the heating lamp tube is divided into a plurality of groups of heating groups according to different regions of the bearing surface, and the heating lamps in the same heating group are electrically connected, and the heating lamps in different heating groups are mutually shielded.
  • the heating device further comprises a heating control system, the heating control system comprising a temperature detector, a temperature controller, an adjustment controller and a plurality of power controllers, wherein the temperature detector is used in a heating process
  • An execution stage detects a real-time temperature at any position of the heated member and sends it to the temperature controller;
  • the temperature controller is configured to Generating a control signal from the real-time temperature sent by the thermometer and the preset target temperature, and transmitting the control signal to the adjustment controller;
  • the adjustment controller is configured to obtain each of the control signal and the heating weight function respectively Grouping a plurality of sub-control signals corresponding to the heating group, and transmitting each sub-control signal to each power controller in a one-to-one correspondence;
  • the number of the power controllers corresponds to the number of groups of the heating groups, each The power controller is configured to adjust a heating power of the heating lamp in the heating group corresponding thereto according to the sub control signal.
  • the heating weight function is established in a preset stage according to a temperature distribution of the heated member by a trial and error method.
  • the heating weight function is:
  • n is an integer greater than 0 and less than or equal to N, and N represents the number of groups of the heating group
  • Tmeas is the real-time temperature detected by the thermometer
  • Un represents the sub-control signal corresponding to the nth heating group
  • Fn(U) represents a preset correspondence rule corresponding to the nth heating group
  • Tp is the preset target temperature
  • T is a preset threshold temperature
  • Kn represents a weight coefficient corresponding to the nth heating group
  • temperature measurement points are set in the area where each group of heating groups is located in the bearing surface in a one-to-one correspondence;
  • the real-time temperature of the temperature measurement point is detected; if the real-time temperature detected by any one of the temperature measurement points is close to the preset target temperature, the real-time temperature detected by each of the temperature measurement points is obtained according to the real-time temperature detected by each of the temperature measurement points at this time.
  • the temperature distribution of the heated member, and according to the temperature The heating condition establishes the heating weight function such that the temperature difference between different regions of the heated member satisfies the process requirements for temperature uniformity.
  • one of the support columns is a thermocouple used as the temperature detector, and each thermocouple is located one by one in a region corresponding to each group of heating groups in the bearing surface. .
  • the heating tube is one and is a plane spiral tube of equal spacing.
  • the heat radiation shielding assembly comprises: a first shielding member including a first horizontal portion and a first vertical portion, wherein the first horizontal portion is located below the heating lamp tube and covers the effective portion a heating region; the first vertical portion is coupled to the first horizontal portion and surrounds a heating section of the heating tube, and a top of the first vertical portion is higher than the heating tube a second shield comprising a second horizontal portion and a second vertical portion, wherein the second vertical portion surrounds the bearing surface, and a top of the second vertical portion is higher than the a bearing surface; the second horizontal portion surrounds an outer side of the second vertical portion, and the second horizontal portion is located higher than the first vertical portion and the heating lamp.
  • the first shielding member is plural, and the first vertical portions of the respective first shielding members are arranged at intervals along a direction parallel to the bearing surface; the first horizontal portion of each of the first shielding members is vertical Arranged in the direction of the bearing surface.
  • the surfaces of the first horizontal portion, the first vertical portion, the second horizontal portion and the second vertical portion facing the heating tube are respectively polished or coated to increase the light reflectivity.
  • the surface facing the heating tube of the first horizontal portion, the first vertical portion, the second horizontal portion and the second vertical portion respectively comprises a plane or a curved surface.
  • the materials of the first shielding member and the second shielding member comprise molybdenum, stainless steel or quartz.
  • the heating device further includes: two electrodes disposed on the substrate and located at a central position near the substrate; upper and lower ends of the electrodes are respectively located at the Above and below the substrate; two electrical connectors are located between the heat radiation shielding assembly and the substrate, and one end of each of the electrical connectors is electrically connected to each of the electrodes, and the other end of each of the electrical connectors is The heating lamps are electrically connected.
  • the heating device further includes: a first electrical shielding member disposed around the substrate and having a first closed space for shielding a connection between the electrical connector and the heating lamp tube An electric field generated; a second electrical shielding member covering a junction of the electrode and the electrical connector to form a second enclosed space for respectively shielding at a connection between the electrode and the electrical connector Electric field.
  • the heating tube is an infrared short-wave tube.
  • a cooling passage is provided in the substrate, and cooling of the substrate is achieved by introducing cooling water into the cooling passage.
  • the present invention also provides a heating chamber including a heating device and a driving device for driving the heating device to rise or fall, the heating device employing the above-described heating device provided by the present invention.
  • the driving device includes a first lifting shaft and a first driving mechanism, wherein the first lifting shaft is vertically disposed, and an upper end of the first lifting shaft is connected to the substrate, the first lifting a lower end of the shaft extends vertically downward to an exterior of the heating chamber; the first drive mechanism is disposed at a bottom of the heating chamber and coupled to the first lifting shaft for passing the first The lift shaft drives the substrate to rise or fall.
  • the driving device further includes at least three moving support columns, a connecting member, a second lifting shaft and a second driving mechanism, wherein the at least three moving supporting columns are vertically disposed on the connecting member, and Distributed along the circumferential direction of the substrate, and the top ends of the at least three movable support columns are used to support the heated member;
  • the second lift shaft is vertically disposed, and the upper end of the second lift shaft is The connecting member is connected, a lower end of the second lifting shaft extends vertically downward to an outside of the heating chamber;
  • the second driving mechanism is disposed at a bottom of the heating chamber, and the second a lifting shaft connection for driving the movable support column through the second lifting shaft Rise or fall.
  • the invention provides a heating device which heats by directly radiating heat upward by using a heating lamp disposed under the heated member, and shields heat radiated from the heating lamp toward the periphery and the bottom by using the heat radiation shielding assembly.
  • the heat loss of the heating lamp tube can be reduced, thereby improving the heating efficiency, thereby meeting the requirements of the high temperature PVD process for rapid temperature rise, high temperature maintenance and rapid temperature drop of the substrate.
  • the heating device provided by the present invention can be directly applied not only in a vacuum environment or an atmospheric environment, but also in a wide application range, and the heat loss of the heating lamp tube in the vacuum environment is less, so that the heating efficiency can be further improved.
  • the heating chamber provided by the invention not only has high heating efficiency but also can be applied in a vacuum environment or an atmospheric environment by using the above heating device, so that the application range can be expanded.
  • FIG. 1 is a schematic structural view of a heating chamber of a conventional PVD device
  • Figure 2 is a cross-sectional view taken along line A-A of Figure 1;
  • Figure 3 is a cross-sectional view of a heating device according to an embodiment of the present invention.
  • FIG. 4A is a layout view of a heating lamp tube used in an embodiment of the present invention.
  • FIG. 4B is a sectional layout view of a heating lamp tube used in an embodiment of the present invention.
  • 4C is a schematic block diagram of a heating control system used in an embodiment of the present invention.
  • 4D is a flow chart of a heating control system used in an embodiment of the present invention.
  • 4E is a flow chart of establishing a heating weight function according to an embodiment of the present invention.
  • FIG. 5A is a schematic structural view of a heat radiation shielding assembly according to an embodiment of the present invention.
  • Figure 5B is an enlarged view of the area I in Figure 5A;
  • Figure 5C is an enlarged view of the area II in Figure 5A;
  • Figure 6 is a layout view of a heating lamp tube used in a modified embodiment of the embodiment of the present invention.
  • Figure 7 is a cross-sectional view of a heating chamber provided by an embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of a heating device according to an embodiment of the present invention.
  • a heating device is used to heat the heated member 23 by means of heat radiation, which may be a single substrate or a tray for carrying a plurality of substrates.
  • the heating device includes a substrate 21, three support columns 22, and a heating assembly, wherein three support columns 22 are vertically disposed on the substrate 21, and are circumferentially spaced along the substrate 21, and the top ends of the three support columns 22 are formed.
  • the heating assembly includes a heating tube 24 and a thermal radiation shielding assembly.
  • the heating lamp tube 24 is disposed on the substrate 21 and located below the bearing surface, that is, below the top end of the three supporting columns 22, for radiating heat toward the bearing surface, so that heating can be performed by heating down.
  • Heating element 23, the heating mode can be applied to the magnetron sputtering chamber with the target at the top, and can be directly applied in a vacuum environment or an atmospheric environment, not only in a wide application range, but also in the heat loss of the heating lamp in a vacuum environment. Less, so that the heating efficiency can be further improved.
  • FIG. 4A is a layout view of a heating lamp tube used in an embodiment of the present invention.
  • the plurality of heating lamps 24 are a plurality of tubes, and the plurality of heating tubes 24 are straight tubes, and are arranged in parallel and at equal intervals.
  • the projection of the effective heating region 244 formed by the uniform distribution of the heating lamps 24 on the substrate 21 covers the projection of the bearing surface on the substrate 21, which enables the plurality of heating lamps 24 to be uniformly heated to be placed on the top end of the support column 22.
  • the member 23 is heated so that the temperature uniformity of the member to be heated can be improved.
  • each of the heating lamps 24 includes a heating section 241 and two non-heating sections 242 at both ends thereof, that is, the middle section of the heating lamp tube 24.
  • the heating wire 241 is provided with a heating wire for generating heat, and the length A of the heating wire is smaller than the total length B of the heating lamp tube 24. Since the heating wire is a heating source capable of radiating heat, the heating wire is located The area is the effective heating zone 244. Also, two wires respectively connected to both ends of the heating wire are provided in the two non-heating sections 242 for use as the positive electrode and the negative electrode of the heating lamp tube 24.
  • the shape and size of the effective heating region 244 can be obtained.
  • the shape of the effective heating zone 244 corresponds to the shape of the aforementioned bearing surface.
  • the shape of the heated member 23 placed on the top end of the support post 22 on the substrate 21 is circular, that is, the bearing surface is orthographically projected on the substrate 21.
  • the shape is round.
  • the shape of the heating wires in each of the heating lamps 24 is also circular. Specifically, the lengths of the plurality of heating wires are gradually reduced from the central region of the bearing surface to the edge regions on both sides.
  • the diameter C of the effective heating zone 244 may be greater than the diameter of the heated member 23 to ensure that the projection of the effective heating zone 244 on the substrate 21 covers the projection of the bearing surface on the substrate 21.
  • the spacing D between two adjacent heating lamps 24 can be freely set according to specific conditions.
  • the heating tube is an infrared short-wave tube, because the power of the short-wave radiation is greater than the medium-long wave, and the thermal energy distribution of the infrared short-wave tube is mainly concentrated in the wavelength ⁇ 2 ⁇ m area, which is 62.5%, which can rapidly heat the object, thereby infrared
  • the short-wave tube can penetrate the surface of the heated member 23, thereby achieving rapid heating of the heated member 23.
  • the plurality of heating lamps 24 are divided into a plurality of heating groups according to different regions of the bearing surface, and the heating lamps 24 in the same heating group are electrically connected, and the heating lamps in the different heating groups are shielded from each other.
  • FIG. 4B is a partition diagram of a heating lamp tube used in an embodiment of the present invention. Referring to FIG. 4B, the plurality of heating lamps 24 are divided into two groups of heating groups (Z2, Z1) according to the central region of the bearing surface and the edge regions on both sides.
  • the heating lamps are The tubes 24 are electrically connected by wires, and the heating groups of different groups are shielded from each other, so that the heating power of the heating lamps 24 in the two groups of heating groups can be separately controlled, thereby realizing the partition adjustment of the heating elements.
  • the temperature of the central region and the edge region is reduced to reduce the temperature difference between the two, and the temperature uniformity of the heated member 23 is further improved.
  • FIG. 4C is a schematic block diagram of a heating control system employed in an embodiment of the present invention.
  • the heating control system includes a temperature detector 301, a temperature controller 302, an adjustment controller 303, and two power controllers (304, 305), wherein the temperature detector 301 is used to detect being detected during the execution phase of the heating process.
  • the real time temperature at any location of the heating element 23 is sent to the temperature controller 302.
  • the temperature controller 302 is configured to generate a control signal U based on the real-time temperature Tmeas transmitted from the temperature detector 301 and the preset target temperature Tp, and send it to the adjustment controller 303.
  • the preset target temperature Tp is the temperature of the heated member required for the process.
  • the adjustment controller 303 is configured to respectively obtain two sub-control signals (U1, U2) corresponding to the two groups of heating groups (Z1, Z2) according to the control signal U and the heating weight function, and send the sub-control signal U1 to the first power
  • the controller 304 transmits the sub control signal U2 to the second power controller 305.
  • the first power controller 304 is configured to adjust the heating power of the heating lamp tube in the heating group Z1 according to the sub-control signal U1, thereby achieving temperature adjustment of the edge region of the heated member 23.
  • the second power controller 305 is configured to adjust the heating power of the heating lamp tube in the heating group Z2 according to the sub-control signal U2, thereby achieving temperature adjustment of the central region of the heated member 23.
  • the temperature of the central region and the edge region of the heated member can be independently controlled, so that the temperature uniformity of the heated member can be satisfied.
  • the zone control of the temperature of the heated member 23 can be realized, thereby improving
  • the difficulty in designing and installing the machine due to multiple temperature measuring points can be avoided, and the probability of leakage of the vacuum chamber can also be reduced. Thereby the risk of affecting the quality of the film deposition can be reduced.
  • the three support columns 22 are a first support column 221, a second support column 222, and a third support column 223, respectively, wherein one of the support columns 22 can be used as the thermoelectricity of the temperature detector 301.
  • the second support column 222 is used as a thermocouple of the temperature detector 301, and is disposed in the region where the heating group Z1 is located.
  • the second support column 222 has both functions of support and temperature detection, thereby not only simplifying The structure of the heating device, and since the thermocouple can be in direct contact with the member to be heated 23, the temperature of the member to be heated 23 can be more accurately obtained, so that the accuracy of the temperature control can be improved.
  • the temperature detector can also be a non-contact sensor such as an infrared sensor.
  • the heating weight function satisfies: balancing the heating power specific gravity of the heating lamp tubes in each group of heating groups to achieve a temperature difference between the central region and the edge region of the heated member 23, and improving the temperature uniformity of the heated member 23.
  • FIG. 4D is a flow chart of a heating control system employed in an embodiment of the present invention. Please refer to Figure 4D, assuming T is 50 °C.
  • the heating power of the heating tube in the heating groups (Z1, Z2) of the two groups ensures the heating rate.
  • the heating weight function can be established in the following manner: the heating weight function is established in a preset stage according to the temperature distribution of the heated member by a trial and error method. For example, in the process of establishing the heating weight function, in the preset stage, the temperature measuring points are set in the area where each group of heating groups is located in the bearing surface for supporting the heated member one by one.
  • the real-time temperature of each temperature measurement point is detected; if the real-time temperature detected by any one of the temperature measurement points is close to the preset target temperature, then according to the real-time temperature detected by each temperature measurement point at this time, The temperature distribution of the heated member, and the heating weight function is established according to the temperature distribution, so that the temperature difference between different regions of the heated member satisfies the requirements of the process for temperature uniformity.
  • multiple thermocouples or infrared sensors can be used to detect the real-time temperature of the heated member at each temperature measurement point in a one-to-one correspondence.
  • the partitioning manner of the heating lamp tube is as follows: the plurality of heating lamps are divided into three groups of heating groups (Z1 to Z3), respectively being the central region Z1 of the bearing surface of the heated member, and located in the central region Z1.
  • the temperature measurement points are three, and are located in the central area Z1, the intermediate area Z2, and the edge area Z3, respectively.
  • FIG. 4E is a flow chart of establishing a heating weight function according to an embodiment of the present invention. Referring to FIG. 4E, establishing a heating weight function includes the following steps:
  • each group of heating groups starts heating, and simultaneously detects the real-time temperature Tmeas of the temperature measuring points in the central region Z1, the intermediate region Z2 and the edge region Z3 of the heated member, and sends them to the temperature controller.
  • Step S3 when the real-time temperature Tmeas detected by any temperature measurement point approaches the preset target temperature Tp, the temperature controller determines whether the temperature uniformity of the heated member satisfies the requirement, and if yes, proceeds to step S4, and if not, enters Step S5. Specifically, if the real-time temperature Tmeas ⁇ [Tp - 5 ° C, Tp + 5 ° C], the real-time temperature Tmeas is considered to be close to the preset target temperature Tp.
  • step S4 the current weight coefficient is determined as the weight coefficient required for the process.
  • Step S5 referring to the region where the real-time temperature is close to the preset target temperature Tp (here, the central region Z1), and adjusting k1 and k2 according to the detected real-time temperatures of the intermediate region Z2 and the edge region Z3. Specifically, it is determined whether the real-time temperature of the edge region Z3 is greater than the real-time temperature of the central region Z1, and if so, the k1 is decreased, and then the reduced weight coefficient is used as the current weight coefficient k1; if not, the k1 is increased, and then The increased weight coefficient is taken as the current weight coefficient k1.
  • step S6 each group of heating groups stops heating, and after the temperature of the heated member is lowered to room temperature, the process proceeds to step S2.
  • the present invention is not limited thereto. In practical applications, the initial value of the heating weight function may also set other values according to actual conditions.
  • Un is a linear function, but the present invention is not limited thereto. In practical applications, Un may also be a nonlinear function such as a quadratic function, for example, twice.
  • the function Un k1nU2+k2nU+b.
  • the heat radiation shield assembly is used to shield the heat radiated from the heating tube 24 toward the surroundings and the bottom. Specifically, please refer to FIG. 5A-5C together.
  • the heat radiation shielding assembly includes a first shielding member and a second shielding member.
  • the first shielding member is three, respectively a first shielding member 261, a first shielding member 262 and a first shielding member 263, and each of the first shielding members comprises a first horizontal portion and a first vertical portion, wherein A horizontal portion is located below the heating lamp tube 24 and covers the effective heating region 244; the first vertical portion is coupled to the first horizontal portion and surrounds the heating section 241 (i.e., the effective heating region 244) of the heating lamp tube 24 And the top of the first vertical portion is higher than the heating lamp tube 24, as shown in Fig. 5C.
  • first vertical portions of the respective first shield members are spaced apart in a direction parallel to the bearing surface; the first horizontal portions of the respective first shield members are spaced apart in a direction perpendicular to the bearing surface.
  • the three first shields used as the reflective screen have a gradient of temperature from the inside to the outside, that is, T0>T1>T2>T3>T4, so that the heating lamp 24 can be reduced to the substrate 21 and The heat of other parts in the chamber can effectively prevent the temperature of these parts from being too high.
  • the number of first shields is not limited to three, and Set to one, two or more depending on the situation.
  • the second shield includes a second horizontal portion 252 and a second vertical portion 251, wherein the second vertical portion 251 surrounds the bearing surface, and the top of the second vertical portion 251 is higher than the bearing surface; the second level The portion 252 surrounds the outside of the second vertical portion 251, and the plane of the second horizontal portion 252 is higher than the first vertical portion and the heating lamp tube 24.
  • the second vertical portion 251 is located inside the innermost first vertical portion.
  • the second vertical portion 251 may also be located outside the outermost first vertical portion. Or inserted between any two adjacent first vertical portions.
  • the heat radiated from the heating lamp tube 24 to the surroundings can be effectively shielded. It can be seen from the above that, under the action of the first shielding member and the second shielding member, the heating lamp tube 24 can be prevented from directly acting on other parts of the chamber other than the heated member 23, so that the temperature of the parts can be effectively avoided. Too high.
  • the surfaces of the first horizontal portion, the first vertical portion, the second horizontal portion 252, and the second vertical portion 251 that face the heating tube 24 may include a plane or a curved surface as the case may be.
  • the materials of the first shield and the second shield may include materials that are resistant to high temperatures such as molybdenum, stainless steel, or quartz, and that are small in deformation at high temperatures and that are low in venting.
  • the surfaces of the first horizontal portion, the first vertical portion, the second horizontal portion 252, and the second vertical portion 251 facing the heating lamp tube are respectively polished or coated to improve light reflectance. .
  • the heating device further includes two electrodes 281 and two electrical connectors 282.
  • the two electrodes 281 are disposed on the substrate 21 at a central position near the substrate 21; the upper end and the lower end of the electrode 281 are respectively located above and below the substrate 21; and the two electrical connectors 282 are located at the first horizontal portion of the lowermost layer.
  • One end of each of the electrical connectors 282 is electrically connected to each of the electrodes 281, and the other end of each of the electrical connectors 282 is electrically connected to the heating lamp 24 via a wire (not shown).
  • the heating device further includes An electrical shield 271 and a second electrical shield 272.
  • the first electrical shielding member 271 adopts an annular structure and is disposed on the substrate 21 and has a first closed space for shielding an electric field generated at a connection between the electrical connector 282 and the heating lamp tube 24;
  • the shield 272 is wrapped around the junction of the electrode 281 and the electrical connector 282 to form a second enclosed space for shielding the electric field generated at the junction of the two electrodes 281 and the electrical connection 282, respectively.
  • a cooling passage (not shown) is provided in the substrate 21, and cooling water is supplied into the cooling passage by the cooling water pipe 31, whereby the substrate 21 can be cooled.
  • FIG. 6 is an arrangement diagram of a heating lamp tube used in a modified embodiment of the embodiment of the present invention.
  • the embodiment of the present modification is different from the above embodiment only in that the arrangement of the heating lamps is different.
  • each of the heating lamps includes an arc portion 321 and a straight portion 322 connected to both ends of the arc portion 321 , wherein the arc portions 321 of the respective heating lamps are concentric, and The radii are different and are arranged at equal intervals; the straight portions of the respective heating lamps are parallel to each other and are equally spaced.
  • the heating wires in each of the heating lamps collectively form an effective heating zone 323 which enables uniform heating of the heated member.
  • the number of the heating lamps is plural, but the present invention is not limited thereto.
  • the heating tube may be one and formed into a certain shape by uniform winding.
  • An effective heating zone is formed, for example, the heating lamps may be planar spiral tubes of equal spacing to achieve uniform heating of the heated member.
  • an embodiment of the present invention further provides a heating chamber
  • FIG. 7 is a cross-sectional view of the heating chamber provided by the embodiment of the present invention.
  • the heating chamber 40 includes a heating device and a driving device for driving the heating device to rise or fall.
  • the heating means is disposed inside the heating chamber 40, which employs the heating means provided in the various embodiments described above.
  • the driving device includes a first lifting shaft 30 and a first driving mechanism (figure Not shown in the drawings), at least three movable support columns 41, a connecting member 43, a second lifting shaft 44, and a second driving mechanism 42.
  • first lifting shaft 30 is vertically disposed, and the upper end of the first lifting shaft 30 is connected to the substrate 21, and the lower end of the first lifting shaft 30 extends vertically downward to the outside of the heating chamber.
  • the first driving mechanism is disposed at the bottom of the heating chamber 40 and is connected to the first lifting shaft 30 for driving the substrate 21 to rise or fall by the first lifting shaft 30, thereby driving the support column 22 to rise or fall, thereby achieving heating.
  • the pick and place operation of the piece 23 is disposed at the bottom of the heating chamber 40 and is connected to the first lifting shaft 30 for driving the substrate 21 to rise or fall by the first lifting shaft 30, thereby driving the support column 22 to rise or fall, thereby achieving heating.
  • At least three movable support columns 41 are vertically disposed on the connecting member 43 and distributed along the circumferential direction of the substrate 21, and the top ends of the at least three moving support columns 41 are used to support the heated member 23;
  • the second lifting shaft 44 is vertical Straightly disposed, and the upper end of the second lifting shaft 44 is connected to the connecting member 43, the lower end of the second lifting shaft 44 extends vertically downward to the outside of the heating chamber 40;
  • the second driving mechanism 42 is disposed in the heating chamber 40
  • the bottom portion is coupled to the second lift shaft 44 for driving the at least three movable support columns 41 to rise or fall synchronously by the second lift shaft 44.
  • the heated member 23 When the heated member 23 is introduced into the heating chamber 40, it is first placed on the movable support column 41; then, under the driving of the second driving mechanism 42, the movable support column 41 is lowered to a position lower than the top end of the support column 22. During this process, the driven member 23 is transferred to the support post 22 by the heating member 23, at which time the heated member 23 can be heated.
  • a passage is formed at a corresponding position of the heat radiation shielding assembly for the passage of a robot for conveying the heated member 23, and a pick-and-place operation is realized.
  • the heating chamber 40 also includes a bellows assembly that includes an upper flange 293, a lower flange 295, and a bellows 294.
  • the upper flange 293 is fixed to the bottom of the substrate 21 by a fastening screw 291, and is sleeved at the top end of the first lifting shaft 30, and the electrode 281 is located at the center hole of the upper flange 293 and the hollow of the first lifting shaft 30.
  • a sealing member 292 is disposed between the upper flange 293 and the substrate 21 for sealing the gap therebetween.
  • the lower flange 295 is sleeved on the first lifting shaft 30, and is sealingly connected thereto; the bellows 294 is sleeved on the first lifting shaft 30 and located between the upper flange 293 and the lower flange 295.
  • the heating chamber provided by the present invention can be applied not only in a vacuum environment or an atmospheric environment but also in heating efficiency and heating uniformity by using the above-described heating device.

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Abstract

一种加热装置以及加热腔室，包括基板（21）、至少三个支撑柱（22）和加热组件，其中，至少三个支撑柱竖直设置在基板上，且沿基板的周向间隔分布，并且至少三个支撑柱的顶端形成用于支撑被加热件（23）的承载面；加热组件包括加热灯管（24）和热辐射屏蔽组件，其中，加热灯管设置在基板上方，且位于承载面的下方，用于朝向承载面辐射热量，并且由加热灯管均匀分布构成的有效加热区域在基板上的投影覆盖承载面在基板上的投影；热辐射屏蔽组件用于屏蔽由加热灯管朝向周围和底部辐射出的热量。不仅应用范围较大，而且可以提高加热效率和加热均匀性。

Description

加热装置以及加热腔室 技术领域
本发明涉及半导体设备加工技术领域，具体地，涉及一种加热装置以及加热腔室。
背景技术
物理气相沉积(Physical Vapor Deposition，以下简称PVD)技术是半导体领域常用的加工技术，例如磁控溅射工艺，通常是在真空腔室中进行的，且在真空腔室内设置有加热装置，该加热装置包括用于承载基片的基座，以及加热组件，该加热组件用于对基片进行加热和温度保持，以使其达到溅射工艺所需要的温度。
现有的一种加热装置是电阻加热器，其是通过在基座内设置电阻丝，由电阻丝产生的热量通过基座传递至基片，来实现基片的加热。为了提高热传导效率，提高加热均匀性，在基座内还设置有背吹管路，用以向基座与基片之间的间隙输送惰性气体(例如氩气)。此外，电阻加热器还具有热电偶，用以检测基座的温度用于控制。
电阻加热器在实际应用中不可避免地存在以下问题：
其一，电阻加热器的加热效率较低，基片的升温速度较慢，从而降低了生产效率。尤其对于高温PVD工艺，要求基片在被传送至工艺腔室之后，能够迅速被加热至工艺所需温度并保持；在工艺结束之后，又要求基片的温度能够迅速被降至机械手的耐受温度以下，以保证机械手能够正常进行取放片操作。因此，目前的电阻加热器无法达到高温PVD工艺对快速升降温的要求。
其二，由于热电偶是通过测量基座的温度来间接获取基片温度，而基座与基片会因热传导效率等因素存在温度差异(相差至少100℃)， 从而基片温度控制的准确度较低。
为解决上述问题，通常利用加热灯泡采用热辐射的方式辅助电阻加热器对基片进行加热。具体地，图1为现有的PVD设备的结构示意图。请参阅图1，PVD设备包括加热腔室10，在加热腔室10的内部设置有密封石英窗13，借助密封石英窗13将加热腔室10分隔为上子腔室和下子腔室。其中，在下子腔室内设有用于承载基片的基座11，在基座11的内部设置有电阻丝111，用以加热设置于基座11上的基片14。为了使基片14能够快速升温，提高工艺效率，在上子腔室内的顶部设置有加热灯泡12，其通过热辐射方式透过密封石英窗13对设置在基座11表面的基片14进行加热。如图2所示，为沿图1中A-A线的剖面图。加热灯泡12沿加热腔室10的周向排列设置。
上述加热装置在实际应用中不可避免地存在以下问题：
其一，由于加热灯泡12只能在大气环境中使用，因而只能采用上加热的方式，即，在基片上方对其进行热辐射，这种加热方式的应用范围较小，例如无法应用在顶部具有靶材的磁控溅射腔室。
其二，由于加热灯泡12只能在大气环境中使用，热量损失较大，这在进行高温加热(500℃以上)时尤为明显，从而加热效率较低，无法维持高温加热。而且，加热灯泡12必须透过密封石英窗13间接加热基片14，从而造成热量损失，这进一步造成加热效率降低。
发明内容
为解决上述技术问题，本发明提供一种加热装置以及加热腔室，其不仅加热效率较高，而且可以应用在真空环境或大气环境内，从而可以扩大应用范围。
解决上述技术问题的所采用的技术方案是提供一种加热装置，其包括基板、至少三个支撑柱和加热组件，其中，所述至少三个支撑柱竖直 设置在所述基板上，且沿所述基板的周向间隔分布，并且所述至少三个支撑柱的顶端形成用于支撑被加热件的承载面；所述加热组件包括加热灯管和热辐射屏蔽组件，其中，所述加热灯管设置在所述基板上方，且位于所述承载面的下方，用于朝向所述承载面辐射热量，并且由所述加热灯管均匀分布构成的有效加热区域在所述基板上的投影覆盖所述承载面在所述基板上的投影；所述热辐射屏蔽组件用于屏蔽由所述加热灯管朝向周围和底部辐射出的热量。
优选的，所述加热灯管包括加热段和位于其两端的两个非加热段，其中，在所述加热段中设置有用于产生热量的加热丝，所述加热丝所在的区域即为所述有效加热区域；在每个所述非加热段中设置有分别与所述加热丝的两端连接的导线，用作所述加热灯管的正极和负极。
优选的，通过设置所述加热灯管的形状和所述加热丝的长度，来获得所述有效加热区域的形状和尺寸。
优选的，所述有效加热区域的形状与所述承载面的形状相对应。
优选的，所述加热灯管为多根；多根所述加热灯管均为直管，且相互平行、等间隔排布；或者，每根所述加热灯管包括弧形部和与该弧形部的两端连接的直线部，其中，各根所述加热灯管的弧形部同心、且半径不同，并且等间隔排布；各根所述加热灯管的直线部相互平行，且等间隔排布。
优选的，所述加热灯管按所述承载面的不同区域被划分为多组加热组，且同一加热组中的加热灯管电性连接，不同加热组中的加热灯管相互屏蔽。
优选的，所述加热装置还包括加热控制系统，所述加热控制系统包括测温器、温度控制器、调节控制器以及多个功率控制器，其中，所述测温器，用于在加热工艺执行阶段检测所述被加热件任一位置的实时温度，并将其发送至所述温度控制器；所述温度控制器，用于根据由所述 测温器发送而来的实时温度以及预设目标温度生成控制信号，并将其发送至所述调节控制器；所述调节控制器，用于根据所述控制信号和加热权重函数分别获得与各组所述加热组相对应的多个子控制信号，并将各个子控制信号一一对应地发送至各个功率控制器；所述功率控制器的数量与所述加热组的组数相对应，每个功率控制器用于根据所述子控制信号调节与之相对应的所述加热组中所述加热灯管的加热功率。
优选的，所述加热权重函数在预设阶段，根据所述被加热件的温度分布情况通过试凑方法建立。
优选的，所述加热权重函数为：
在Tmeas<Tp-T时，Un＝U；
在Tmeas≥Tp-T时，Un＝fn(U)＝knU+b；
其中，n为大于0，且小于或等于N的整数，N表示所述加热组的组数；
Tmeas为由所述测温器检测到的实时温度；
Un表示与第n个加热组相对应的所述子控制信号；
U表示所述控制信号；
fn(U)表示与第n个加热组相对应的预设对应法则；
Tp为预设目标温度；
T为预设阈值温度；
kn表示与第n个加热组相对应的权重系数；
b为常数。
优选的，在所述预设阶段，建立所述加热权重函数的过程中，一一对应地在所述承载面中各组加热组所在区域内设置测温点；在检测过程中，对各个所述测温点的实时温度进行检测；若任意一个所述测温点检测到的实时温度接近预设目标温度时，则根据此时由各个所述测温点检测到的实时温度，获得所述被加热件的温度分布情况，并根据该温度分 布情况建立所述加热权重函数，以使所述被加热件不同区域之间的温差满足工艺对温度均匀性的要求。
优选的，在所述至少三个支撑柱中，其中一个支撑柱为用作所述测温器的热电偶，且各个热电偶一一对应地位于所述承载面中各组加热组所在区域内。
优选的，所述加热灯管为一根，且为等间距的平面螺旋管。
优选的，所述热辐射屏蔽组件包括：第一屏蔽件，包括第一水平部和第一竖直部，其中，所述第一水平部位于所述加热灯管的下方，且覆盖所述有效加热区域；所述第一竖直部与所述第一水平部连接，且环绕在所述加热灯管的加热段的周围，并且所述第一竖直部的顶部高于所述加热灯管；第二屏蔽件，包括第二水平部和第二竖直部，其中，所述第二竖直部环绕在所述承载面的周围，且所述第二竖直部的顶部高于所述承载面；所述第二水平部环绕在所述第二竖直部的外侧，且所述第二水平部所在平面高于所述第一竖直部和所述加热灯管。
优选的，所述第一屏蔽件为多个，且各个第一屏蔽件的第一竖直部沿平行于所述承载面的方向间隔排布；各个第一屏蔽件的第一水平部沿垂直于所述承载面的方向间隔排布。
优选的，分别对所述第一水平部、第一竖直部第二水平部和第二竖直部的朝向所述加热灯管的表面进行抛光或者涂镀处理，以提高光反射率。
优选的，分别对所述第一水平部、第一竖直部第二水平部和第二竖直部的朝向所述加热灯管的表面包括平面或者曲面。
优选的，所述第一屏蔽件和第二屏蔽件的材料包括钼、不锈钢或者石英。
优选的，所述加热装置还包括：两个电极，设置在所述基板上，且位于靠近所述基板的中心位置处；所述电极的上端和下端分别位于所述 基板的上方和下方；两个电连接件，位于所述热辐射屏蔽组件与所述基板之间，且各个电连接件的其中一端分别与各个电极电连接，各个电连接件的其中另一端与所述加热灯管电连接。
优选的，所述加热装置还包括：第一电屏蔽件，其环绕设置在所述基板上，且具有第一封闭空间，用于屏蔽在所述电连接件和所述加热灯管的连接处产生的电场；第二电屏蔽件，包覆在所述电极与所述电连接件的连接处，形成第二封闭空间，用于分别屏蔽在所述电极与所述电连接件的连接处产生的电场。
优选的，所述加热灯管为红外短波灯管。
优选的，在所述基板内设置有冷却通道，通过向所述冷却通道内通入冷却水，来实现对所述基板进行冷却。
作为另一个技术方案，本发明还提供一种加热腔室，包括加热装置和用于驱动所述加热装置上升或下降的驱动装置，所述加热装置采用了本发明提供的上述加热装置。
优选的，所述驱动装置包括第一提升轴和第一驱动机构，其中，所述第一提升轴竖直设置，且所述第一提升轴的上端与所述基板连接，所述第一提升轴的下端竖直向下延伸至所述加热腔室的外部；所述第一驱动机构设置在所述加热腔室的底部，并与所述第一提升轴连接，用于通过所述第一提升轴驱动所述基板上升或下降。
优选的，所述驱动装置还包括至少三个动支撑柱、连接件、第二提升轴和第二驱动机构，其中，所述至少三个动支撑柱竖直设置在所述连接件上，且沿所述基板的周向间隔分布，并且所述至少三个动支撑柱的顶端用于支撑所述被加热件；所述第二提升轴竖直设置，且所述第二提升轴的上端与所述连接件连接，所述第二提升轴的下端竖直向下延伸至所述加热腔室的外部；所述第二驱动机构设置在所述加热腔室的底部，并与所述第二提升轴连接，用于通过所述第二提升轴驱动所述动支撑柱 上升或下降。
本发明具有以下有益效果：
本发明提供的加热装置，其通过采用设置在被加热件下方的加热灯管直接朝上辐射热量的方式进行加热，并通过利用热辐射屏蔽组件屏蔽由加热灯管朝向四周和底部辐射出的热量，可以减少加热灯管的热量损失，从而可以提高加热效率，进而可以满足高温PVD工艺对基片快速升温、高温保持和快速降温的要求。而且，本发明提供的加热装置不仅可以直接应用在真空环境或大气环境内，应用范围较大，而且真空环境中的加热灯管热量损失更少，从而可以进一步提高加热效率。
本发明提供的加热腔室，其通过采用上述加热装置，不仅加热效率较高，而且可以应用在真空环境或大气环境内，从而可以扩大应用范围。
附图说明
图1为现有的PVD设备加热腔室的结构示意图；
图2为沿图1中A-A线的剖面图；
图3为本发明实施例提供的加热装置的剖视图；
图4A为本发明实施例采用的加热灯管的排布图；
图4B为本发明实施例采用的加热灯管的分区排布图；
图4C为本发明实施例采用的加热控制系统的原理框图；
图4D为本发明实施例采用的加热控制系统的流程框图；
图4E为本发明实施例建立加热权重函数的流程框图；
图5A为本发明实施例采用的热辐射屏蔽组件的结构示意图；
图5B为图5A中I区域的放大图；
图5C为图5A中II区域的放大图；
图6为本发明实施例的变型实施例采用的加热灯管的排布图；以及
图7为本发明实施例提供的加热腔室的剖视图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图对本发明提供的加热装置以及加热腔室进行说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
图3为本发明实施例提供的加热装置的剖视图。请参阅图3，加热装置用于采用热辐射的方式加热被加热件23，该被加热件23可以为单个基片，或者为用于承载多个基片的托盘。该加热装置包括基板21、三个支撑柱22和加热组件，其中，三个支撑柱22竖直设置在基板21上，且沿基板21的周向间隔分布，并且三个支撑柱22的顶端形成用于支撑被加热件23的承载面，该承载面的形状和面积可以视为被置于支撑柱22的顶端上的被加热件23在基板21上正投影的形状和面积。加热组件包括加热灯管24和热辐射屏蔽组件。其中，加热灯管24设置在基板21上，且位于上述承载面的下方，即，位于三个支撑柱22的顶端下方，用于朝向该承载面辐射热量，从而可以实现下加热的方式加热被加热件23，该加热方式可以应用在顶部具有靶材的磁控溅射腔室，而且可以直接应用在真空环境或大气环境中，不仅应用范围较大，而且真空环境中的加热灯管热量损失更少，从而可以进一步提高加热效率。
图4A为本发明实施例采用的加热灯管的排布图。请参阅图4A，在本实施例中，加热灯管24为多根，多根加热灯管24均为直管，且相互平行、等间隔排布。并且，由加热灯管24均匀分布构成的有效加热区域244在基板21上的投影覆盖承载面在基板21上的投影，这可以实现多根加热灯管24均匀地加热置于支撑柱22顶端上的被加热件23，从而可以提高被加热件的温度均匀性。进一步说，上述加热灯管24的有效加热区域244的设置方式具体为：每根加热灯管24包括加热段241和位于其两端的两个非加热段242，即，加热灯管24的中间段为加热 段241，而两个边缘段为非加热段242。其中，在加热段241中设置有用于产生热量的加热丝，且该加热丝的长度A小于加热灯管24的总长度B，由于加热丝是可辐射热量的加热源，因此该加热丝所在的区域即为有效加热区域244。并且，在两个非加热段242中设置有分别与加热丝的两端连接的两条导线，用作加热灯管24的正极和负极。
而且，通过设置加热灯管24的形状和加热丝的长度，可以获得有效加热区域244的形状和尺寸。优选的，有效加热区域244的形状与上述承载面的形状相对应。例如，在本实施例中，如图4A所示，被置于支撑柱22的顶端上的被加热件23在基板21上正投影的形状为圆形，即，承载面在基板21上正投影的形状为圆形。在这种情况下，各根加热灯管24中的加热丝共同形成的形状也为圆形，具体来说，多个加热丝的长度自承载面的中心区域分别向两侧的边缘区域逐渐减小，且通过将各根加热丝的端点依次连接，可以获得一个圆形，从而最终形成了圆形的有效加热区域244。在实际应用中，有效加热区域244的直径C可以大于被加热件23的直径，以保证有效加热区域244在基板21上的投影覆盖承载面在基板21上的投影。另外，相邻两根加热灯管24之间的间距D可以根据具体情况而自由设定。
优选的，加热灯管为红外短波灯管，由于短波辐射的功率要大于中长波，而红外短波灯管的热能分配主要集中在波长＜2μm区域，为62.5％，可以对物体迅速加热，从而红外短波灯管可以穿透被加热件23的表面，进而实现对被加热件23的快速加热。
另外优选的，多根加热灯管24按承载面的不同区域被划分为多组加热组，且同一加热组中的加热灯管24电性连接，不同加热组中的加热灯管相互屏蔽。具体地，图4B为本发明实施例采用的加热灯管的分区排布图。请参阅图4B，多根加热灯管24按承载面的中心区域和两侧的边缘区域被划分为两组加热组(Z2，Z1)，在每组加热组中，加热灯 管24之间通过导线电性连接，而不同组的加热组之间相互屏蔽，从而可以分别对两组加热组中的加热灯管24的加热功率进行单独控制，进而可以实现分区调节被加热件23中心区域和边缘区域的温度，以减少二者之间的温差，进一步提高被加热件23的温度均匀性。
进一步地，可以利用加热控制系统对上述被加热件23中心区域和边缘区域的温度进行单独控制。具体地，图4C为本发明实施例采用的加热控制系统的原理框图。请参阅图4C，加热控制系统包括测温器301、温度控制器302、调节控制器303以及两个功率控制器(304，305)，其中，测温器301用于在加热工艺执行阶段检测被加热件23任一位置的实时温度，并将其发送至温度控制器302。温度控制器302用于根据由测温器301发送而来的实时温度Tmeas以及预设目标温度Tp生成控制信号U，并将其发送至调节控制器303。该预设目标温度Tp为工艺所需的被加热件温度。调节控制器303用于根据控制信号U和加热权重函数分别获得与两组加热组(Z1，Z2)相对应的两个子控制信号(U1，U2)，并将子控制信号U1发送至第一功率控制器304，将子控制信号U2发送至第二功率控制器305。第一功率控制器304用于根据子控制信号U1调节加热组Z1中加热灯管的加热功率，从而实现被加热件23边缘区域的温度调节。第二功率控制器305用于根据子控制信号U2调节加热组Z2中加热灯管的加热功率，从而实现被加热件23中心区域的温度调节。
由此，可以实现对被加热件中心区域和边缘区域的温度进行独立控制，从而可以使被加热件的温度均匀性满足要求。而且，通过在加热工艺执行阶段利用单个测温器301检测被加热件23任一位置的实时温度，即仅使用单一测温点，就可以实现被加热件23温度的分区控制，从而在提高被加热件的温度均匀性的基础上，可以避免因多个测温点带来的机台设计和安装难度增加问题，而且还可以降低真空腔室泄漏的几率， 从而可以降低影响薄膜沉积质量的风险。
另外，如图4B所示，三个支撑柱22分别为第一支撑柱221、第二支撑柱222和第三支撑柱223，其中，可以将其中一个支撑柱22用作测温器301的热电偶，例如，将第二支撑柱222用作测温器301的热电偶，并设置在加热组Z1所在区域内，该第二支撑柱222兼具支撑和温度检测两个功能，从而不仅可以简化加热装置的结构，而且由于热电偶可以与被加热件23直接接触，因而可以更准确地获得被加热件23的温度，从而可以提高温控的准确度。当然，在实际应用中，测温器也可以为诸如红外传感器等的非接触式传感器。
上述加热权重函数满足：平衡各组加热组中加热灯管的加热功率比重，以达到被加热件23中心区域和边缘区域之间的温差，提高被加热件23的温度均匀性的目的。具体地，加热权重函数可以为：在Tmeas<Tp-T时，Un＝U。在Tmeas≥Tp-T时，Un＝fn(U)＝knU+b。其中，n为大于0，且小于或等于N的整数，N表示加热组的组数。Tmeas为由测温器检测到的实时温度。Un表示与第n个加热组相对应的子控制信号。U表示控制信号。fn(U)表示与第n个加热组相对应的预设对应法则。Tp为预设目标温度。T为预设阈值温度。kn表示与第n个加热组相对应的权重系数。b为常数。
图4D为本发明实施例采用的加热控制系统的流程框图。请参阅图4D，假设T为50℃。当Tmeas<Tp-50℃时，Un＝U，这样，在被加热件的实时温度升温至Tp-50℃的升温阶段中，各个功率控制器均在子控制信号Un＝U的控制下分别调节两组加热组(Z1，Z2)中加热灯管的加热功率，保证升温速度。当Tmeas≥Tp-50℃时，Un＝fn(U)＝knU+b，即，U1＝f1(U)＝k1U+b；U2＝f2(U)＝k2U+b。这样，当被加热件的实时温度接近工艺温度时，第一功率控制器在子控制信号U1＝f1(U)＝k1U+b的控制下调节加热组Z1中加热灯管的加热功率；第二功率控 制器在子控制信号U2＝f2(U)＝k2U+b的控制下调节加热组Z2中加热灯管的加热功率，从而在将被加热件的温度保持在Tp-50℃内的保温阶段中，保证被加热件的温度均匀性满足要求。
由上可知，采用如上分段函数作为加热权重函数，不仅可以在保温阶段实现被加热件的温度均匀性满足要求，而且还在升温阶段保证升温速度，从而可以减少工艺时间，提高工艺效率。
优选的，该加热权重函数的建立可以采用以下方式：加热权重函数是在预设阶段，根据被加热件的温度分布情况通过试凑方法建立。例如，在建立加热权重函数的过程中，在预设阶段，一一对应地在用于支撑被加热件的承载面中各组加热组所在区域内设置测温点。在检测过程中，对各个测温点的实时温度进行检测；若任意一个测温点检测到的实时温度接近预设目标温度时，则根据此时由各个测温点检测到的实时温度，获得被加热件的温度分布情况，并根据该温度分布情况建立加热权重函数，以使被加热件不同区域之间的温差满足工艺对温度均匀性的要求。在实际应用中，可以利用多个热电偶或者红外传感器一一对应地检测被加热件在各个测温点处的实时温度。
下面对建立加热权重函数的具体实施方式进行详细描述。其中，加热灯管的分区方式以如下为例：多根加热灯管被划分为三组加热组(Z1～Z3)，分别为被加热件的承载面的中心区域Z1、位于该中心区域Z1两侧的中间区域Z2以及分别位于两个中间区域Z2外侧的两个边缘区域Z3。与之相对应的，测温点为三个，且分别位于中心区域Z1、中间区域Z2和边缘区域Z3内。
图4E为本发明实施例建立加热权重函数的流程框图。请参阅图4E，建立加热权重函数包括以下步骤：
步骤S1，初始化权重系数kn＝1，即，初始化加热权重函数为：U1＝U，U2＝U，U3＝U，以及设置预设目标温度Tp为工艺所需的温度。
步骤S2，各组加热组开始加热，同时分别检测在被加热件中心区域Z1、中间区域Z2和边缘区域Z3内的测温点的实时温度Tmeas，并将其发送至温度控制器。
步骤S3，温度控制器在任意一个测温点检测到的实时温度Tmeas接近预设目标温度Tp时，判断被加热件的温度均匀性是否满足要求，若是，则进入步骤S4，若否，则进入步骤S5。具体地，若实时温度Tmeas∈[Tp-5℃，Tp+5℃]，则认为该实时温度Tmeas接近预设目标温度Tp。
步骤S4，确定当前权重系数作为工艺所需的权重系数。
步骤S5，参考实时温度接近预设目标温度Tp的区域(在此，为中心区域Z1)，并根据检测到的中间区域Z2和边缘区域Z3的实时温度对k1和k2进行调整。具体地，判断边缘区域Z3的实时温度是否大于中心区域Z1的实时温度，若是，则减小k1，然后将减小后的权重系数作为当前权重系数k1；若否，则增大k1，然后将增大后的权重系数作为当前权重系数k1。同时，判断边缘区域Z2的实时温度是否大于中心区域Z1的实时温度，若是，则减小k2，然后将减小后的权重系数作为当前权重系数k2；若否，则增大k2，然后将增大后的权重系数作为当前权重系数k2。
步骤S6，各组加热组停止加热，并在被加热件的温度降至室温之后，进入步骤S2。
在上述步骤S1中，优选地，权重系数的初始值kn＝1，这样，在升温阶段，可以使各组加热组均能达到额定功率输出，从而可以保证升温速度，减少工艺时间，进而可以提高工艺效率。当然，本发明并不局限于此，在实际应用中，加热权重函数的初始值还可以根据实际情况设置其他数值。
需要说明的是，在本实施例中，加热权重函数为分段函数，但是，本发明并不局限于此，在实际应用中，加热权重函数还可以为Un＝fn (U)，这样同样能够实现被加热件的温度均匀性满足要求。
还需要说明的是，在本实施例中，Un为线性函数，但是，本发明并不局限于此，在实际应用中，Un还可以为诸如二次函数等的非线性函数，例如，二次函数Un＝k1nU2+k2nU+b。
热辐射屏蔽组件用于屏蔽由加热灯管24朝向周围和底部辐射出的热量。具体地，请一并参阅图5A-5C，在本实施例中，热辐射屏蔽组件包括第一屏蔽件和第二屏蔽件。其中，第一屏蔽件为三个，分别为第一屏蔽件261，第一屏蔽件262和第一屏蔽件263，每个第一屏蔽件包括第一水平和第一竖直部，其中，第一水平部位于加热灯管24的下方，且覆盖有效加热区域244；第一竖直部与第一水平部连接，且环绕在加热灯管24的加热段241(即有效加热区域244)的周围，并且第一竖直部的顶部高于加热灯管24，如图5C所示。此外，各个第一屏蔽件的第一竖直部沿平行于承载面的方向间隔排布；各个第一屏蔽件的第一水平部沿垂直于承载面的方向间隔排布。借助上述三个第一屏蔽件，可以防止加热灯管24直接作用于腔室中除了被加热件23之外的其他零件，而且第一屏蔽件的数量越多，屏蔽掉的辐射热量越多，这是因为：在真空中，热量的传导主要为热辐射，假设加热灯管24中加热丝的温度为T0，由其产生的红外短波直接辐射作用于第一屏蔽件261，该第一屏蔽件261吸收辐射热量，并且温度升高至T1，同时发出热辐射至第一屏蔽件262，同理，第一屏蔽件262吸收辐射热量，并且温度升高至T2；第一屏蔽件263吸收辐射热量，并且温度升高至温度为T3。当第一屏蔽件263发出热辐射至基板21时，基板21吸收辐射热量，并且温度升高至T4。根据热辐射规律，用作反射屏的三个第一屏蔽件由内而外会有温度的梯度变化，即T0＞T1＞T2＞T3＞T4，从而可以降低加热灯管24辐射到基板21和腔室内其他零件的热量，进而可以有效避免这些零件的温度过高。在实际应用中，第一屏蔽件的数量并不局限于三个，还可以 根据具体情况设定为一个，两个或者四个以上。
第二屏蔽件包括第二水平部252和第二竖直部251，其中，第二竖直部251环绕在承载面的周围，且第二竖直部251的顶部高于承载面；第二水平部252环绕在第二竖直部251的外侧，且第二水平部252所在平面高于第一竖直部和加热灯管24。在本实施例中，第二竖直部251位于最内层第一竖直部的内侧，当然，在实际应用中，第二竖直部251也可以位于最外层第一竖直部的外侧，或者插在任意的相邻两个第一竖直部之间。
借助第二屏蔽件，可以有效屏蔽加热灯管24向四周辐射出的热量。由上可知，在上述第一屏蔽件和第二屏蔽件共同作用下，可以防止加热灯管24直接作用于腔室中除了被加热件23之外的其他零件，从而可以有效避免这些零件的温度过高。在实际应用中，第一水平部、第一竖直部、第二水平部252和第二竖直部251的朝向加热灯管24的表面可以根据具体情况包括平面或者曲面。而且，第一屏蔽件和第二屏蔽件的材料可以包括诸如钼、不锈钢或者石英等的耐高温、且在高温下变形小、放气小的材料。另外，优选的，分别对第一水平部、第一竖直部、第二水平部252和第二竖直部251的朝向加热灯管24的表面进行抛光或者涂镀处理，以提高光反射率。
在本实施例中，加热装置还包括两个电极281和两个电连接件282。其中，两个电极281设置在基板21上，且位于靠近基板21的中心位置处；电极281的上端和下端分别位于基板21的上方和下方；两个电连接件282位于最下层第一水平部与基板21之间，各个电连接件282的其中一端分别与各个电极281电连接，各个电连接件282的其中另一端通过导线(图中未示出)与加热灯管24电连接。
优选的，为了防止电连接件282与加热灯管的连接处以及电极281与电连接件282的连接处对其他元件产生电场干扰，加热装置还包括第 一电屏蔽件271和第二电屏蔽件272。其中，第一电屏蔽件271采用环形结构，且环绕设置在基板21上，并且具有第一封闭空间，用于屏蔽在电连接件282和加热灯管24的连接处产生的电场；第二电屏蔽件272包覆在电极281与电连接件282的连接处，形成第二封闭空间，用于分别屏蔽在两个电极281及二者与电连接件282的连接处产生的电场。
优选的，为了降低基板21的温度，在基板21内设置有冷却通道(图中未示出)，并利用冷却水管31向该冷却通道内输送冷却水，从而可以实现对基板21进行冷却。
作为上述实施例的一个变型实施例，图6为本发明实施例的变型实施例采用的加热灯管的排布图。请参阅图6，本变型实施例与上述实施例相比，其区别仅在于，加热灯管的排布方式不同。
具体地，在本实施例中，每根加热灯管包括弧形部321和与该弧形部321的两端连接的直线部322，其中，各根加热灯管的弧形部321同心、且半径不同，并且等间隔排布；各根加热灯管的直线部相互平行，且等间隔排布。各根加热灯管中的加热丝共同形成有效加热区域323，该有效加热区域323可以实现均匀地加热被加热件。
需要说明的是，在上述各个实施例中，加热灯管为多根，但是本发明并不局限于此，在实际应用中，加热灯管还可以为一根，并通过均匀缠绕形成一定形状而形成有效加热区域，例如，该加热灯管可以为为等间距的平面螺旋管，以实现均匀地加热被加热件。
作为另一个技术方案，本发明实施例还提供一种加热腔室，图7为本发明实施例提供的加热腔室的剖视图。请一并参阅图3和图7，加热腔室40包括加热装置和用于驱动该加热装置上升或下降的驱动装置。其中，加热装置设置在加热腔室40内部，其采用了上述各个实施例提供的加热装置。
在本实施例中，驱动装置包括第一提升轴30、第一驱动机构(图 中未示出)、至少三个动支撑柱41、连接件43、第二提升轴44和第二驱动机构42。其中，第一提升轴30竖直设置，且该第一提升轴30的上端与基板21连接，第一提升轴30的下端竖直向下延伸至加热腔室的外部。第一驱动机构设置在加热腔室40的底部，并与第一提升轴30连接，用于通过第一提升轴30驱动基板21上升或下降，从而带动支撑柱22上升或下降，进而实现被加热件23的取放片操作。
至少三个动支撑柱41竖直设置在连接件43上，且沿基板21的周向间隔分布，并且至少三个动支撑柱41的顶端用于支撑被加热件23；第二提升轴44竖直设置，且该第二提升轴44的上端与连接件43连接，第二提升轴44的下端竖直向下延伸至加热腔室40的外部；第二驱动机构42设置在加热腔室40的底部，并与第二提升轴44连接，用于通过第二提升轴44驱动至少三个动支撑柱41同步上升或下降。当被加热件23被传入加热腔室40内时，首先放置在动支撑柱41上；然后在第二驱动机构42的驱动下，动支撑柱41下降至低于支撑柱22的顶端位置处，在此过程中被加热件23从动支撑柱41被传递至支撑柱22上，此时可以开始加热被加热件23。
当然，在实际应用中，也可以仅使用上述第一提升轴30和第一驱动机构驱动基板21上升或下降，以实现被加热件23的取放片操作，在这种情况下，还需要通过在热辐射屏蔽组件的相应位置处开设通道，用以供用于传输被加热件23的机械手通过，并实现取放片操作。
另外，为了保证腔室的真空度，加热腔室40还包括波纹管组件，该波纹管组件包括上法兰293、下法兰295和波纹管294。其中，上法兰293通过紧固螺钉291固定在基板21的底部，且套设在第一提升轴30的顶端，并且电极281位于由上法兰293的中心孔以及第一提升轴30的中空空间内。此外，在上法兰293与基板21之间还设置有密封件292，用以对二者之间的间隙进行密封。下法兰295套设在第一提升轴 30上，并与之密封连接；波纹管294套设在第一提升轴30上，且位于上法兰293和下法兰295之间。
本发明提供的加热腔室，其通过采用上述加热装置，不仅可以应用在真空环境和大气环境内，而且可以提高加热效率和加热均匀性。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。

Claims (24)

  1. 一种加热装置，其特征在于，包括基板、至少三个支撑柱和加热组件，其中，所述至少三个支撑柱竖直设置在所述基板上，且沿所述基板的周向间隔分布，并且所述至少三个支撑柱的顶端形成用于支撑被加热件的承载面；
    所述加热组件包括加热灯管和热辐射屏蔽组件，其中，
    所述加热灯管设置在所述基板上方，且位于所述承载面的下方，用于朝向所述承载面辐射热量，并且由所述加热灯管均匀分布构成的有效加热区域在所述基板上的投影覆盖所述承载面在所述基板上的投影；
    所述热辐射屏蔽组件用于屏蔽由所述加热灯管朝向周围和底部辐射出的热量。
  2. 根据权利要求1所述的加热装置，其特征在于，所述加热灯管包括加热段和位于其两端的两个非加热段，其中，
    在所述加热段中设置有用于产生热量的加热丝，所述加热丝所在的区域即为所述有效加热区域；
    在每个所述非加热段中设置有分别与所述加热丝的两端连接的导线，用作所述加热灯管的正极和负极。
  3. 根据权利要求2所述的加热装置，其特征在于，通过设置所述加热灯管的形状和所述加热丝的长度，来获得所述有效加热区域的形状和尺寸。
  4. 根据权利要求1所述的加热装置，其特征在于，所述有效加热区域的形状与所述承载面的形状相对应。
  5. 根据权利要求2-4任意一项所述的加热装置，其特征在于，所述加 热灯管为多根；
    多根所述加热灯管均为直管，且相互平行、等间隔排布；或者，
    每根所述加热灯管包括弧形部和与该弧形部的两端连接的直线部，其中，各根所述加热灯管的弧形部同心、且半径不同，并且等间隔排布；各根所述加热灯管的直线部相互平行，且等间隔排布。
  6. 根据权利要求1所述的加热装置，其特征在于，所述加热灯管按所述承载面的不同区域被划分为多组加热组，且同一加热组中的加热灯管电性连接，不同加热组中的加热灯管相互屏蔽。
  7. 根据权利要求6所述的加热装置，其特征在于，所述加热装置还包括加热控制系统，所述加热控制系统包括测温器、温度控制器、调节控制器以及多个功率控制器，其中，
    所述测温器，用于在加热工艺执行阶段检测所述被加热件任一位置的实时温度，并将其发送至所述温度控制器；
    所述温度控制器，用于根据由所述测温器发送而来的实时温度以及预设目标温度生成控制信号，并将其发送至所述调节控制器；
    所述调节控制器，用于根据所述控制信号和加热权重函数分别获得与各组所述加热组相对应的多个子控制信号，并将各个子控制信号一一对应地发送至各个功率控制器；
    所述功率控制器的数量与所述加热组的组数相对应，每个功率控制器用于根据所述子控制信号调节与之相对应的所述加热组中所述加热灯管的加热功率。
  8. 根据权利要求7所述的加热装置，其特征在于，所述加热权重函数是在预设阶段，根据所述被加热件的温度分布情况通过试凑方法建立。
  9. 根据权利要求7或8所述的加热装置，其特征在于，所述加热权重函数为：
    在Tmeas<Tp-T时，Un＝U；
    在Tmeas≥Tp-T时，Un＝fn(U)＝knU+b；
    其中，n为大于0，且小于或等于N的整数，N表示所述加热组的组数；
    Tmeas为由所述测温器检测到的实时温度；
    Un表示与第n个加热组相对应的所述子控制信号；
    U表示所述控制信号；
    fn(U)表示与第n个加热组相对应的预设对应法则；
    Tp为预设目标温度；
    T为预设阈值温度；
    kn表示与第n个加热组相对应的权重系数；
    b为常数。
  10. 根据权利要求8所述的加热装置，其特征在于，在所述预设阶段，建立所述加热权重函数的过程中，一一对应地在所述承载面中各组加热组所在区域内设置测温点；
    在检测过程中，对各个所述测温点的实时温度进行检测；若任意一个所述测温点检测到的实时温度接近预设目标温度时，则根据此时由各个所述测温点检测到的实时温度，获得所述被加热件的温度分布情况，并根据该温度分布情况建立所述加热权重函数，以使所述被加热件不同区域之间的温差满足工艺对温度均匀性的要求。
  11. 根据权利要求7所述的加热装置，其特征在于，在所述至少三个支撑柱中，其中一个支撑柱为用作所述测温器的热电偶。
  12. 根据权利要求2-4任意一项所述的加热装置，其特征在于，所述加 热灯管为一根，且为等间距的平面螺旋管。
  13. 根据权利要求2所述的加热装置，其特征在于，所述热辐射屏蔽组件包括：
    第一屏蔽件，包括第一水平部和第一竖直部，其中，所述第一水平部位于所述加热灯管的下方，且覆盖所述有效加热区域；所述第一竖直部与所述第一水平部连接，且环绕在所述加热灯管的加热段的周围，并且所述第一竖直部的顶部高于所述加热灯管；
    第二屏蔽件，包括第二水平部和第二竖直部，其中，所述第二竖直部环绕在所述承载面的周围，且所述第二竖直部的顶部高于所述承载面；所述第二水平部环绕在所述第二竖直部的外侧，且所述第二水平部所在平面高于所述第一竖直部和所述加热灯管。
  14. 根据权利要求13所述的加热装置，其特征在于，所述第一屏蔽件为多个，且各个第一屏蔽件的第一竖直部沿平行于所述承载面的方向间隔排布；各个第一屏蔽件的第一水平部沿垂直于所述承载面的方向间隔排布。
  15. 根据权利要求13所述的加热装置，其特征在于，分别对所述第一水平部、第一竖直部第二水平部和第二竖直部的朝向所述加热灯管的表面进行抛光或者涂镀处理，以提高光反射率。
  16. 根据权利要求13所述的加热装置，其特征在于，分别对所述第一水平部、第一竖直部第二水平部和第二竖直部的朝向所述加热灯管的表面包括平面或者曲面。
  17. 根据权利要求13所述的加热装置，其特征在于，所述第一屏蔽件和第二屏蔽件的材料包括钼、不锈钢或者石英。
  18. 根据权利要求1所述的加热装置，其特征在于，所述加热装置还包括：
    两个电极，设置在所述基板上，且位于靠近所述基板的中心位置处；所述电极的上端和下端分别位于所述基板的上方和下方；
    两个电连接件，位于所述热辐射屏蔽组件与所述基板之间，且各个电连接件的其中一端分别与各个电极电连接，各个电连接件的其中另一端与所述加热灯管电连接。
  19. 根据权利要求18所述的加热装置，其特征在于，所述加热装置还包括：
    第一电屏蔽件，其环绕设置在所述基板上，且具有第一封闭空间，用于屏蔽在所述电连接件和所述加热灯管的连接处产生的电场；
    第二电屏蔽件，包覆在所述电极与所述电连接件的连接处，形成第二封闭空间，用于分别屏蔽在所述电极与所述电连接件的连接处产生的电场。
  20. 根据权利要求1所述的加热装置，其特征在于，所述加热灯管为红外短波灯管。
  21. 根据权利要求1所述的加热装置，其特征在于，在所述基板内设置有冷却通道，通过向所述冷却通道内通入冷却水，来实现对所述基板进行冷却。
  22. 一种加热腔室，包括加热装置和用于驱动所述加热装置上升或下降的驱动装置，其特征在于，所述加热装置采用权利要求1-21任意一项所述的加热装置。
  23. 根据权利要求22所述的加热腔室，其特征在于，所述驱动装置包括第一提升轴和第一驱动机构，其中，
    所述第一提升轴竖直设置，且所述第一提升轴的上端与所述基板连接，所述第一提升轴的下端竖直向下延伸至所述加热腔室的外部；
    所述第一驱动机构设置在所述加热腔室的底部，并与所述第一提升轴连接，用于通过所述第一提升轴驱动所述基板上升或下降。
  24. 根据权利要求23所述的加热腔室，其特征在于，所述驱动装置还包括至少三个动支撑柱、连接件、第二提升轴和第二驱动机构，其中，
    所述至少三个动支撑柱竖直设置在所述连接件上，且沿所述基板的周向间隔分布，并且所述至少三个动支撑柱的顶端用于支撑所述被加热件；
    所述第二提升轴竖直设置，且所述第二提升轴的上端与所述连接件连接，所述第二提升轴的下端竖直向下延伸至所述加热腔室的外部；
    所述第二驱动机构设置在所述加热腔室的底部，并与所述第二提升轴连接，用于通过所述第二提升轴驱动所述动支撑柱上升或下降。
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