WO2017045252A1 - 印刷电路板用电镀装置 - Google Patents

印刷电路板用电镀装置 Download PDF

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Publication number
WO2017045252A1
WO2017045252A1 PCT/CN2015/093471 CN2015093471W WO2017045252A1 WO 2017045252 A1 WO2017045252 A1 WO 2017045252A1 CN 2015093471 W CN2015093471 W CN 2015093471W WO 2017045252 A1 WO2017045252 A1 WO 2017045252A1
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Prior art keywords
printed circuit
circuit board
disposed
plating
anode plate
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PCT/CN2015/093471
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English (en)
French (fr)
Inventor
王靖
王锋伟
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安捷利电子科技（苏州）有限公司
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Publication of WO2017045252A1 publication Critical patent/WO2017045252A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form

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  • the present invention relates to a plating apparatus for a printed circuit board.
  • Electroplating is an important process in the manufacturing process of printed circuit board (PCB). It uses electrolysis to grow metal layers in the wires and through holes of printed circuit boards to protect bare copper tracks and Connection hole.
  • the electroplating of the printed circuit board mainly adopts a continuous automatic plating apparatus. As shown in FIG. 1, the printed circuit board 1 as a cathode is continuously moved in the plating tank, and the plating tank is located on both sides of the printed circuit board 1 respectively. An anode plate 2 is provided. A plurality of nozzles 3 are further disposed between the anode plate 2 and the printed circuit board 1. The plating solution is ejected from the nozzles 3 and sprayed vertically toward the surface of the printed circuit board 1, thereby accelerating the flow of the plating solution and improving the plating efficiency.
  • the existing printed circuit board uses the spacing B between the printed circuit board 1 and the anode plate 2 as a cathode in the plating apparatus (usually the pitch B is It is difficult to reduce it by more than 15 cm, and the width of the upper and lower end portions of the printed wiring board 1 after plating is 1-2 cm. Therefore, therefore, since the distance B between the cathode and the anode cannot be reduced, the plating efficiency of the plating apparatus for the existing printed circuit board is difficult to be improved, and the energy consumption level cannot be lowered.
  • a plating apparatus for a printed circuit board comprising: a plating tank through which a printed circuit board can pass, an anode plate disposed on either or both sides of the printed circuit board, disposed in the plating tank, and opening toward the opening
  • the nozzle of the printed circuit board is characterized in that: the anode plate is provided with a through hole penetrating in a thickness direction thereof, the nozzle is fixedly disposed on the anode plate, and an opening of the nozzle is opposite to the through hole Cooperate.
  • the number of the nozzles is plural, and the anode plate is provided with a plurality of the through holes, and the plurality of nozzles are matched in a plurality of the through holes in a one-to-one correspondence; the anode plate A plurality of the nozzles are sequentially connected by a nozzle, the nozzle being located on the anode plate facing away from the rear side of the printed circuit board.
  • the open end surface of the nozzle is flush with the front end surface or the rear end surface of the anode plate.
  • the anode plate is a titanium mesh
  • the through hole is a mesh on the titanium mesh
  • the opening shape and the shape of the nozzle The shape of the mesh is matched.
  • the printed circuit board is erected in the plating tank, and the two sides of the printed circuit board are respectively erected with an insulating baffle that restricts the printed circuit board from swinging to both sides. Since the nozzle is disposed on the through hole of the anode plate, the distance between the cathode and the anode is greatly reduced, and there may be a risk that the printed circuit board swings to both sides during the moving process and is short-circuited in contact with the anode plate, so the insulating baffle is The design limits the swing of the printed circuit board and avoids the risk of short circuits.
  • the insulating baffle is mesh-shaped and includes an outer frame and a plurality of insulated wires connected in the outer frame.
  • the length of the insulated wire should be avoided in parallel with the direction of movement of the printed circuit board, thereby preventing the insulated wire from leaving marks on the moving printed circuit board.
  • a plurality of the insulated wires are disposed in parallel, and a length direction of each of the insulated wires is the same fixed size as a moving direction of the printed circuit board through the plating bath. Angle.
  • the plurality of insulated wires comprise a first set of insulated wires disposed along a direction perpendicular to a moving direction of the printed circuit board through the plating bath, and And a second set of insulated wires disposed in parallel with the moving direction of the plating circuit plate at a second oblique angle, wherein the first set of insulated wires and the second set of insulated wires are disposed to cross each other.
  • the insulated wire is a nylon thread.
  • the insulating baffles may be disposed in the plating tank up and down, the printed circuit board being further plated with a plating apparatus
  • the utility model comprises a vertical lifting device for driving the insulating baffle to move up and down.
  • the vertical lifting device is a cam mechanism, including a rotating cam, a top and bottom moving rod, and an elastic member for abutting the jack against the cam; one end of the jack The other end of the cam is connected to the insulating baffle on the outer peripheral surface of the cam.
  • the invention greatly reduces the spacing between the printed circuit board and the anode plate as the cathode without changing the spacing between the nozzle and the printed circuit board, and the spacing can be reduced to 2-3 cm at the minimum, so that the printed circuit board after plating
  • the width of the upper and lower end portions of the upper and lower ends is greatly reduced to 2-3 mm. Therefore, compared with the prior art, the plating apparatus for a printed circuit board of the present invention improves the thickness uniformity of the surface plating layer of the printed circuit board on the one hand, and reduces the voltage required in the plating process on the other hand, thereby reducing the output power. , greatly improving the plating efficiency, reducing energy consumption, with outstanding substantive features and significant progress.
  • FIG. 1 is a schematic plan view of a prior art electroplating apparatus for a printed circuit board.
  • Fig. 2 is a schematic plan view showing a plating apparatus for a printed circuit board according to a first embodiment of the present invention.
  • Fig. 3 is a side elevational view showing the insulating baffle and the vertical lifting device in the first embodiment of the present invention.
  • Figure 4 is a side elevational view of an insulating baffle and a vertical lifting device in a second embodiment of the present invention.
  • a plating apparatus for a printed circuit board includes: a plating tank through which the printed circuit board 10 can pass, an anode plate 20 disposed on both sides of the printed circuit board 10, and a plating tank disposed in the plating tank And a plurality of nozzles 30 that open toward the printed circuit board 10, a nozzle 40 that communicates the plurality of nozzles 30, an insulating baffle 50 that is disposed on both sides of the printed circuit board 10, and a vertical lifting device that drives the insulating baffle 50 to reciprocate up and down .
  • an anode plate 20 may be provided only outside the side to be plated.
  • the anode plate 20 is provided with a through hole 21 penetrating in its thickness direction.
  • the nozzle 30 is fixedly disposed on the anode plate 20 and the opening of the nozzle 30 is engaged with the through hole 21.
  • the opening of the nozzle 20 is generally flared, and therefore, when the anode plate 20 is a solid metal plate, the through hole 21 may be provided as a tapered through hole that matches the shape of the opening of the nozzle 20.
  • the anode plate 20 is a titanium mesh
  • the through hole 21 is a mesh on the titanium mesh
  • the opening shape of the nozzle 30 matches the shape of the mesh.
  • the number of the nozzles 30 is plural, and the anode plate 20 is provided with a plurality of through holes 21, and the plurality of nozzles 30 are fitted in the plurality of through holes 21 one by one.
  • a plurality of nozzles 30 are arranged along the longitudinal direction of the plating tank (i.e., the moving direction of the printed circuit board, as indicated by the arrow in FIG. 2), and the plurality of nozzles 30 on the anode plate 20 are sequentially connected through the nozzle 40, The nozzle 40 is located on the back side of the anode plate 20 facing away from the printed circuit board 10.
  • the open end face of the nozzle 30 In order to make the distance b between the printed circuit board 10 and the anode plate 20 sufficiently small, the open end face of the nozzle 30 must not extend beyond the front end face of the anode plate 20 toward the printed circuit board 10. Therefore, the opening end face of the nozzle 30 can be disposed flush with the front end face or the rear end face of the anode plate 20.
  • the main body of the nozzle 30 is hidden on the rear side of the anode plate 20, so that the distance b between the printed circuit board 10 and the anode plate 20 can be greatly reduced, and the pitch b can be minimized to 2-3 cm.
  • the printed circuit board 10 is erected in the plating tank, and the two sides of the printed circuit board 10 are also respectively provided with an insulating baffle 50 for restricting the swing of the printed circuit board 10 to both sides. Since the nozzle 30 is disposed on the through hole of the anode plate 20, the distance a between the cathode and the anode is greatly reduced, and there is a possibility that the printed circuit board 10 swings to both sides during the movement and is short-circuited in contact with the anode plate 20, and is disposed.
  • the insulating baffle 50 limits the amplitude of the wobble of the printed circuit board 10, avoiding the risk of short circuits.
  • the insulating baffle 50 is mesh-shaped and includes an outer frame 51 and a plurality of insulated wires 52 connected in the outer frame 51, and the insulated wires are preferably nylon wires.
  • the length direction of the insulated wire 52 should be avoided from the moving direction of the printed circuit board 10. Parallel to (as indicated by the arrows in Fig. 3), thereby preventing the insulated wires 52 from leaving marks on the moving printed circuit board 10, affecting the appearance of the printed circuit board.
  • the plurality of insulated wires 52 of the present embodiment are disposed in parallel, and the length direction of each of the insulated wires 52 is at the same fixed angle C with the moving direction of the printed circuit board 10 through the plating bath.
  • the angle C may be an acute angle or an obtuse angle.
  • the plating apparatus for a printed circuit board further includes a vertical lifting device that drives the insulating shutter 50 to reciprocate up and down, and the outer frame of the insulating shutter 50 has a supporting portion 511.
  • the vertical lifting device in this embodiment is a cam mechanism, and includes a rotating cam 512, a top rod 513 that is vertically moved, and an elastic member 514 that causes the jack 512 to abut the top cam 512.
  • the jack 512 extends in the up and down direction, and the lower end thereof is abutted against the outer peripheral surface of the cam 512 by a roller, and the other end thereof is connected to the support portion 511 of the insulating shutter 50.
  • the jack 513 can be moved up and down one by one, thereby driving the insulating shutter 50 to reciprocate up and down once.
  • the relatively fixed insulating baffle 50 may leave marks on the moving printed circuit board 10.
  • the structure of the first embodiment is basically the same as that of the first embodiment.
  • the plurality of the insulated wires comprise a moving direction along the plating plate with the printed circuit board 10 (the direction indicated by the arrow in FIG. 4).
  • a first set of insulated wires 52 disposed in parallel at a first oblique angle
  • a second set of insulated wires 53 disposed in parallel with the direction of movement of the printed circuit board 10 through the plating bath, the first set of insulated wires 52 And the second group of insulated wires 53 are arranged to cross each other.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

一种印刷电路板用电镀装置，包括中间可供印刷电路板（10）通过的电镀槽、设置在所述印刷电路板（10）的任意一侧或者两侧的阳极板（20）、设置在所述电镀槽中且开口朝向所述印刷电路板的喷嘴（30），所述阳极板（20）上开设有沿自身厚度方向贯穿的通孔（21），所述喷嘴（30）固定设置在所述阳极板（20）上且所述喷嘴（30）的开口与所述通孔（21）相配合。相较于现有技术，该电镀装置在不改变喷嘴（30）与印刷电路板（10）的间距的前提下，大大缩小了作为阴极的印刷电路板（10）与阳极板（20）之间的间距，间距可缩减到2-3cm，一方面有效地提高了印刷电路板的表面电镀层的厚度均一性，另一方面可大大提高电镀效率，降低能耗。

Description

印刷电路板用电镀装置 技术领域
本发明涉及一种印刷电路板用电镀装置。
背景技术
电镀是印刷电路板(PCB，Printed Circuit Board)制作工艺中很重要的一个工序，它利用电解作用使金属增层生长在印刷电路板的导线和通孔中，从而保护裸露的铜印制线和连接孔。目前，印刷电路板的电镀主要采用连续式全自动电镀装置，如图1所示，将作为阴极的印刷电路板1在电镀槽中连续移动通过，电镀槽中位于印刷电路板1的两侧分别设置有阳极板2。在阳极板2和印刷电路板1之间还设置有多个喷嘴3，电镀液从喷嘴3上喷出并垂直喷向印刷电路板1的板面，从而加快电镀液的流动，提高电镀效率。
正是由于在阳极板和印刷电路板之间设置的喷嘴3，使得现有的印刷电路板用电镀装置中作为阴极的印刷电路板1和阳极板2之间的间距B(通常该间距B都大于15cm)难以缩小，电镀后印刷线路板1的上下端部偏厚区的宽度达到1-2cm。因此，因此，由于阴极和阳极之间间距B无法缩小，导致现有印刷电路板用电镀装置的电镀效率难以提高，能耗水平无法降低。
发明内容
有鉴于现有技术的缺陷，本发明的目的是提供一种能够有效提高印刷电路板的电镀效率、更加节能的印刷电路板用电镀装置。
为了达到上述目的，本发明采用以下技术方案：
一种印刷电路板用电镀装置，包括中间可供印刷电路板通过的电镀槽、设置在所述印刷电路板的任意一侧或者两侧的阳极板、设置在所述电镀槽中且开口朝向所述印刷电路板的喷嘴，其特征在于：所述阳极板上开设有沿自身厚度方向贯穿的通孔，所述喷嘴固定设置在所述阳极板上且所述喷嘴的开口与所述通孔相配合。
优选地，所述喷嘴的数量为多个，所述阳极板上开设有多个所述的通孔，多个所述喷嘴一一对应地配合在多个所述通孔中；所述阳极板上的多个所述喷嘴通过喷管依次相连通，所述喷管位于所述阳极板上背向所述印刷电路板的后侧。
优选地，所述喷嘴的开口端面与所述阳极板的前端面或者后端面齐平。
在具体实施例中，阳极板为钛网，所述通孔为钛网上的网孔，所述喷嘴的开口形状和所 述网孔的形状相匹配。
在一具体实施例中，所述印刷电路板竖立设置在所述电镀槽中，所述印刷电路板的两侧还分别竖立设置有限制所述印刷电路板向两侧摆动的绝缘挡板。由于将喷嘴设置在阳极板的通孔上，阴极和阳极之间间距大大缩小，可能存在印刷电路板在移动过程中向两侧摆动并与阳极板接触而短路的风险，所以，绝缘挡板的设计就限制了印刷电路板的摆动，避免了短路的风险。
优选地，所述绝缘挡板为网状，其包括外框架以及连接在所述外框架中的多根绝缘线。
绝缘线的自身长度方向应避免与印刷电路板的移动方向平行，从而避免绝缘线可能在移动的印刷电路板上留下痕迹。
作为一种可选的具体实施方式，多根所述绝缘线相平行设置，且每根所述绝缘线的自身长度方向与所述印刷电路板通过所述电镀槽的移动方向呈同一固定大小的夹角。
作为另一种可选的具体实施方式，多根所述绝缘线包括沿与所述印刷电路板通过所述电镀槽的移动方向呈第一倾斜角度平行设置的第一组绝缘线、沿与所述印刷电路板通过所述电镀槽的移动方向呈第二倾斜角度平行设置的第二组绝缘线，所述第一组绝缘线和所述第二组绝缘线相互交叉设置。
在一具体实施例中，所述绝缘线为尼龙线。
为了更进一步地避免相对固定设置的绝缘挡板可能在移动的印刷电路板上留下痕迹，所述绝缘挡板可上下移动地设置在所述电镀槽中，所述印刷电路板用电镀装置还包括驱动所述绝缘挡板上下往复移动的垂直升降装置。
作为一种优选的实施方式，所述垂直升降装置为凸轮机构，包括转动设置的凸轮、上下运动设置的顶杆以及使所述顶杆抵顶所述凸轮的弹性件；所述顶杆的一端抵顶在所述凸轮的外周面上，其另一端与所述绝缘挡板连接。
本发明在不改变喷嘴与印刷电路板的间距的前提下，大大缩小了作为阴极的印刷电路板与阳极板之间的间距，该间距最小能够缩减到2-3cm，使得电镀后的印刷电路板的上下端部偏厚区宽度大大缩减为2-3mm。因此，相对于现有技术，本发明的印刷电路板用电镀装置一方面提高了印刷电路板的表面电镀层的厚度均一性，另一方面可降低电镀过程中所需的电压，从而降低输出功率，大大提高了电镀效率，降低了能耗，具有突出的实质性特点和显著的进步。
附图说明
图1为本现有技术的印刷电路板用电镀装置的俯视示意图。
图2为本发明第一实施例的印刷电路板用电镀装置的俯视示意图。
图3为本发明第一实施例中的绝缘挡板和垂直升降装置的侧视示意图。
图4为本发明第二实施例中的绝缘挡板和垂直升降装置的侧视示意图。
具体实施方式
下面结合附图对本发明优选的实施方式进行详细说明。
实施例一
请参阅图2和3，一种印刷电路板用电镀装置，包括：中间可供印刷电路板10通过的电镀槽、设置在印刷电路板10的两侧的阳极板20、设置在所述电镀槽中且开口朝向印刷电路板10的多个喷嘴30、连通多个喷嘴30的喷管40、设置在印刷电路板10两侧的绝缘挡板50以及驱动绝缘挡板50上下往复移动的垂直升降装置。当印刷电路板10仅主要只电镀其中一个侧面时，可仅在需要电镀的一面外侧设置一个阳极板20。
阳极板20上开设有沿自身厚度方向贯穿的通孔21，喷嘴30固定设置在阳极板20上且喷嘴30的开口与通孔21相配合。喷嘴20的开口通常是喇叭状，因此，当阳极板20为实心金属板材时，通孔21可设置为与喷嘴20的开口形状相匹配的锥形通孔。本实施例中，阳极板20为钛网，通孔21为钛网上的网孔，喷嘴30的开口形状和网孔的形状相匹配。
喷嘴30的数量为多个，阳极板20上开设有多个通孔21，多个喷嘴30一一对应地配合在多个通孔21中。通常多个喷嘴30沿着电镀槽的长度方向(即印刷电路板的移动方向，如图2中的箭头所示)间隔布置，阳极板20上的多个喷嘴30通过喷管40依次相连通，喷管40位于阳极板20上背向印刷电路板10的后侧。
为了使印刷电路板10与阳极板20之间的间距b足够小，喷嘴30的开口端面不得超出阳极板20朝向印刷电路板10的前端面。因此，喷嘴30的开口端面可设置为与阳极板20的前端面或者后端面齐平。将喷嘴30的主体藏在阳极板20的后侧，从而能够大大缩减印刷电路板10与阳极板20之间的间距b，该间距b最小能够做到2-3cm。
在本实施例中，印刷电路板10竖立设置在所述电镀槽中，印刷电路板10的两侧还分别竖立设置有限制印刷电路板10向两侧摆动的绝缘挡板50。由于将喷嘴30设置在阳极板20的通孔上，阴极和阳极之间间距a大大缩小，可能存在印刷电路板10在移动过程中向两侧摆动并与阳极板20接触而短路的风险，设置了绝缘挡板50后就限制了印刷电路板10的摆动幅度，避免了短路的风险。
如图3所示，绝缘挡板50为网状，其包括外框架51以及连接在外框架51中的多根绝缘线52，绝缘线优选为尼龙线。绝缘线52的自身长度方向应避免与印刷电路板10的移动方向 (如图3中的箭头所示)平行，从而避免绝缘线52可能在移动的印刷电路板10上留下痕迹，影响印刷电路板的外观。本实施例的多根绝缘线52相平行设置，且每根绝缘线52的自身长度方向与印刷电路板10通过所述电镀槽的移动方向呈同一固定大小的夹角C。夹角C可以为锐角，也可以是钝角。
所述印刷电路板用电镀装置还包括驱动绝缘挡板50上下往复移动的垂直升降装置，绝缘挡板50的外框架上具有支撑部511。本实施例中的垂直升降装置为凸轮机构，包括转动设置的凸轮512、上下运动设置的顶杆513以及使顶杆512向下抵顶凸轮512的弹性件514。顶杆512沿上下方向延伸设置，其下端通过滚轮抵顶在凸轮512的外周面上，其另一端与绝缘挡板50的支撑部511连接。当凸轮512绕自身轴线方向旋转一周时，就能够使顶杆513上下运动一个来回，从而驱动绝缘挡板50上下往复移动一次。采用这样的设计，能够有效地避免相对固定设置的绝缘挡板50可能在移动的印刷电路板10上留下痕迹的缺陷。
实施例二
本实施例与实施例一的结构基本相同，区别在于：绝缘挡板中，多根所述绝缘线包括沿与印刷电路板10通过所述电镀槽的移动方向(如图4箭头所示方向)呈第一倾斜角度平行设置的第一组绝缘线52、沿与印刷电路板10通过所述电镀槽的移动方向呈第二倾斜角度平行设置的第二组绝缘线53，第一组绝缘线52和第二组绝缘线53相互交叉设置。
上述实施例只为说明本发明的技术构思及特点，其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施，并不能以此限制本发明的保护范围，凡根据本发明精神实质所作的等效变化或修饰，都应涵盖在本发明的保护范围之内。

Claims (10)

  1. 一种印刷电路板用电镀装置，包括中间可供印刷电路板通过的电镀槽、设置在所述印刷电路板的任意一侧或者两侧的阳极板、设置在所述电镀槽中且开口朝向所述印刷电路板的喷嘴，其特征在于：所述阳极板上开设有沿自身厚度方向贯穿的通孔，所述喷嘴固定设置在所述阳极板上且所述喷嘴的开口与所述通孔相配合。
  2. 根据权利要求1所述的印刷电路板用电镀装置，其特征在于：所述喷嘴的数量为多个，所述阳极板上开设有多个所述的通孔，多个所述喷嘴一一对应地配合在多个所述通孔中；所述阳极板上的多个所述喷嘴通过喷管依次相连通，所述喷管位于所述阳极板上背向所述印刷电路板的后侧。
  3. 根据权利要求1所述的印刷电路板用电镀装置，其特征在于：所述喷嘴的开口端面与所述阳极板的前端面或者后端面齐平。
  4. 根据权利要求1至3任意一项所述的印刷电路板用电镀装置，其特征在于：所述印刷电路板竖立设置在所述电镀槽中，所述印刷电路板的两侧还分别竖立设置有限制所述印刷电路板向两侧摆动的绝缘挡板。
  5. 根据权利要求4所述的印刷电路板用电镀装置，其特征在于：所述绝缘挡板为网状，其包括外框架以及连接在所述外框架中的多根绝缘线。
  6. 根据权利要求5所述的印刷电路板用电镀装置，其特征在于：多根所述绝缘线相平行设置，且每根所述绝缘线的自身长度方向与所述印刷电路板通过所述电镀槽的移动方向呈同一固定大小的夹角。
  7. 根据权利要求5所述的印刷电路板用电镀装置，其特征在于：多根所述绝缘线包括沿与所述印刷电路板通过所述电镀槽的移动方向呈第一倾斜角度平行设置的第一组绝缘线、沿与所述印刷电路板通过所述电镀槽的移动方向呈第二倾斜角度平行设置的第二组绝缘线，所述第一组绝缘线和所述第二组绝缘线相互交叉设置。
  8. 根据权利要求5所述的印刷电路板用电镀装置，其特征在于：所述绝缘线为尼龙线。
  9. 根据权利要求4所述的印刷电路板用电镀装置，其特征在于：所述绝缘挡板可上下移动地设置在所述电镀槽中，所述印刷电路板用电镀装置还包括驱动所述绝缘挡板上下往复移动的垂直升降装置。
  10. 根据权利要求9所述的印刷电路板用电镀装置，其特征在于：所述垂直升降装置为凸轮机构，包括转动设置的凸轮、上下运动设置的顶杆以及使所述顶杆抵顶所述凸轮的弹性件；所述顶杆的一端抵顶在所述凸轮的外周面上，其另一端与所述绝缘挡板连接。
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