WO2017018243A1 - Dispositif de terminal portable - Google Patents

Dispositif de terminal portable Download PDF

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Publication number
WO2017018243A1
WO2017018243A1 PCT/JP2016/070945 JP2016070945W WO2017018243A1 WO 2017018243 A1 WO2017018243 A1 WO 2017018243A1 JP 2016070945 W JP2016070945 W JP 2016070945W WO 2017018243 A1 WO2017018243 A1 WO 2017018243A1
Authority
WO
WIPO (PCT)
Prior art keywords
terminal device
magnetic substrate
coil antenna
mobile terminal
speaker
Prior art date
Application number
PCT/JP2016/070945
Other languages
English (en)
Japanese (ja)
Inventor
浩和 矢▲崎▼
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2017530784A priority Critical patent/JP6394807B2/ja
Publication of WO2017018243A1 publication Critical patent/WO2017018243A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets

Definitions

  • the present invention relates to a mobile terminal device, and more particularly to a mobile terminal device that requires high-density mounting.
  • a space for arranging the coil antenna may be restricted as the mobile terminal device is further mounted with higher density. In this case, since it becomes difficult to ensure the L value or the number of turns of the coil antenna sufficiently, there is a possibility that the communication distance of the mobile terminal device is reduced.
  • an object of the present invention is to provide a portable terminal device that can be mounted with high density while suppressing a decrease in communication performance.
  • a mobile terminal device includes a housing, a speaker element accommodated in the housing, a magnetic substrate on which the speaker element is mounted, and the magnetic substrate. And a coil antenna provided so as to surround the speaker element in plan view.
  • the housing has a metal surface in a portion overlapping the coil antenna in the plan view, and the metal surface has an opening portion at least partially overlapping a coil opening of the coil antenna in the plan view, and A slit portion that connects the opening and the outer edge of the metal surface may be provided.
  • the metal surface can act as a radiator (booster) by providing the metal surface with an opening and a slit that at least partially overlap with the coil opening in plan view. Therefore, according to the mobile terminal device according to this aspect, it is possible to improve communication performance while achieving high-density mounting.
  • boost radiator
  • the magnetic substrate is provided with a cavity portion and a bank portion surrounding the cavity portion, the speaker element is mounted on the cavity portion, and the coil antenna is provided on the bank portion. Also good.
  • the coil antenna can be brought close to the casing by providing the coil antenna on the bank portion of the magnetic substrate. For this reason, since a stronger magnetic field can be generated outside the housing, the communication distance can be further increased.
  • the magnetic material on the bank portion serves as an electromagnetic shield, so that interference between the speaker element and the coil antenna can be suppressed.
  • the coil antenna may be a coil antenna for an HF band communication system.
  • the coil antenna is a coil antenna for an HF band communication system
  • communication such as short-range wireless communication can be performed using the frequency of the HF band.
  • the portable terminal device further includes an HF band communication system IC connected to the coil antenna for the HF band communication system, and the IC for the HF band communication system is mounted on the magnetic substrate. May be.
  • the wiring (conductor) for connecting the coil antenna and the IC for the HF band communication system can be provided in the magnetic substrate. It becomes. Since the magnetic substrate serves as an electromagnetic shield, the communication quality of the HF band communication can be improved by providing the wiring in this way.
  • the speaker element may be mounted on one main surface of the magnetic substrate, and the HF band communication system IC may be mounted on the other main surface of the magnetic substrate.
  • the speaker element is mounted on one main surface of the magnetic substrate and the IC for the HF band communication system is mounted on the other main surface, the interference between the speaker element and the IC for the HF band communication system is suppressed. it can.
  • the portable terminal device further includes an amplifier circuit element connected to the speaker element, a switching circuit element, and a choke coil connected to the switching circuit element, and the DCDC converter connected to the amplifier circuit element
  • the amplification circuit element and the switching circuit element may be mounted on the magnetic substrate.
  • the amplification circuit element and the switching circuit element are mounted on the magnetic substrate, radiation noise from the DCDC converter element can be suppressed. For this reason, the freedom degree of arrangement
  • the coil antenna may be provided on one main surface of the magnetic substrate, and the switching circuit element may be mounted on the other main surface of the magnetic substrate.
  • the coil antenna is provided on one main surface of the magnetic substrate and the switching circuit element is mounted on the other main surface, interference between the coil antenna and the switching circuit element can be suppressed. For this reason, since the noise component resulting from the coil antenna in the voltage produced
  • the choke coil may be built in the magnetic substrate.
  • the choke coil since the choke coil is built in the magnetic substrate, the choke coil becomes a closed magnetic circuit type coil, so that interference between the choke coil and the speaker element can be made extremely difficult to occur.
  • Such a configuration is suitable for sound quality while achieving high-density mounting when, for example, a voice coil type speaker element is used as a speaker element mounted on a magnetic substrate, which converts an electric signal into sound by utilizing fluctuations in a magnetic field. This is particularly useful because it is possible to suppress the decrease in.
  • the magnetic substrate may have vias penetrating at least part of the magnetic substrate, and the speaker element may convert an electric signal input through the vias into sound.
  • the speaker element converts an electric signal input through a via penetrating at least a part of the magnetic substrate into sound. For this reason, since the magnetic substrate through which the via penetrates functions as a ferrite bead, noise of the electric signal can be suppressed, so that sound quality can be improved.
  • the present invention it is possible to provide a mobile terminal device that can be mounted with high density while suppressing a decrease in communication performance.
  • FIG. 1A is a top view showing an example of the appearance of the mobile terminal device according to Embodiment 1.
  • FIG. 1B is a cross-sectional view illustrating an example of the configuration of the mobile terminal device according to Embodiment 1.
  • FIG. FIG. 2 is a block diagram illustrating an example of a functional configuration of the mobile terminal device according to the first embodiment.
  • FIG. 3 is a circuit diagram showing an example of a circuit of the DCDC converter element according to the first embodiment.
  • FIG. 4 is a cross-sectional view illustrating an example of a configuration of a main part of the mobile terminal device according to the first embodiment.
  • FIG. 5 is a top view illustrating an example of a configuration of a main part of the mobile terminal device according to the first embodiment.
  • FIG. 6 is a cross-sectional view schematically showing magnetic flux generated in the mobile terminal device according to the first embodiment.
  • FIG. 7 is a top view schematically showing a current generated in the mobile terminal device according to the first embodiment.
  • FIG. 8 is a cross-sectional view illustrating an example of a configuration of a main part of the mobile terminal device according to the first modification of the first embodiment.
  • FIG. 9 is a cross-sectional view illustrating an example of a configuration of a main part of the mobile terminal device according to the second embodiment.
  • FIG. 10 is a cross-sectional view illustrating an example of a configuration of a main part of a mobile terminal device according to another embodiment.
  • FIG. 11 is a top view illustrating an example of an appearance of a mobile terminal device according to another embodiment.
  • FIG. 12 is a cross-sectional view illustrating an example of a configuration of a main part of a mobile terminal device according to another embodiment.
  • FIG. 13 is a top view showing an example of the appearance of a mobile terminal device according to another embodiment.
  • FIG. 14 is a top view illustrating an example of a configuration of a main part of a mobile terminal device according to another embodiment.
  • FIG. 15 is a top view showing an example of the appearance of a mobile terminal device according to another embodiment.
  • Embodiment 1 First, a general description of the mobile terminal device according to Embodiment 1 will be given with reference to FIGS. 1A to 2.
  • FIG. 1A is a top view illustrating an example of an appearance of the mobile terminal device 1 according to Embodiment 1.
  • FIG. 1B is a cross-sectional view illustrating an example of the configuration of the mobile terminal device according to Embodiment 1.
  • FIG. FIG. 2 is a block diagram illustrating an example of a functional configuration of the mobile terminal device 1 according to the first embodiment. Specifically, FIG. 1B is a cross-sectional view of the mobile terminal device 1 taken along the line II of FIG. 1A.
  • FIG. 2 shows an example of the speaker module 20 and a functional configuration related thereto.
  • the thickness direction of the substantially rectangular flat plate-shaped mobile terminal device 1 will be described as the Z-axis direction, the short side direction as the Y-axis direction, and the long side direction as the X-axis direction.
  • the thickness direction may be described as the vertical direction, the thickness direction and the vertical direction may not match in an actual usage mode.
  • the mobile terminal device 1 is an electronic device that outputs sound. More specifically, the mobile terminal device 1 is a mobile phone terminal such as a smartphone that emits sound such as music or buzzer sound or voice such as a human voice. is there. Note that the mobile terminal device 1 is not limited to a mobile phone terminal, and may be a music-only terminal or a tablet computer. In this embodiment, sound and sound are not particularly distinguished, and are described as sound.
  • the mobile terminal device 1 includes a speaker module 20 that outputs sound.
  • the portable terminal device 1 further includes a housing 10, a display 30, a main board 40, and a processor 50.
  • the housing 10 is a housing that houses the speaker module 20 and the like, and forms an outer housing of the mobile terminal device 1 together with the display 30 in the present embodiment.
  • the housing 10 is provided with an opening 10 a for outputting the sound output from the speaker module 20 to the outside of the mobile terminal device 1 at a position facing the speaker module 20.
  • the opening 10a is provided on the front side (Z-axis direction plus side) of the mobile terminal device 1, so that the user can listen to music while watching the video displayed on the display 30. This is suitable for listening usage.
  • the housing 10 has a metal surface 11 made of, for example, aluminum that forms a front cover of the housing 10. Moreover, the housing
  • PP polypropylene
  • the metal surface 11 is provided with the opening 10a. Further, the metal surface 11 is provided with a slit portion 10 b that connects the opening 10 a and the outer edge of the metal surface 11. That is, as for the metal surface 11, the opening edge formed by the opening part 10a and the outer edge edge are connected by the slit part 10b. That is, the metal surface 11 is provided with a notch including a slit portion 10b and an opening portion 10a. Details of the opening 10a and the slit 10b will be described later with reference to FIG.
  • the metal surface 11 is not limited to aluminum, and may be formed of a conductive material such as a metal or an alloy including at least one of silver, copper, iron, and aluminum.
  • the resin surface 12 is not limited to PP, and may be formed of an insulating material such as polycarbonate (PC), polyethylene (PE), or polyphenylene sulfide resin (PPS).
  • the speaker module 20 is a module in which a speaker element and a coil antenna for short-range wireless communication are integrated. As shown in FIG. 2, in the present embodiment, the speaker module 20 converts a sound signal, which is an electrical signal output from the processor 50, into air vibration using a DC voltage Vcc supplied from the battery 70. This is a module that produces sound. Moreover, as shown in the figure, the speaker module 20 is a module on which a wireless circuit that performs short-range wireless communication is further mounted.
  • the speaker module 20 includes a speaker element 220 and a coil antenna 260.
  • the speaker module 20 further includes a DCDC converter element 210 and an amplification circuit element 230 that are circuit parts for the speaker element 220, and an IC 240 for an HF band communication system that is a circuit part for the coil antenna 260. And a matching circuit 250.
  • a DCDC converter element 210 and an amplification circuit element 230 that are circuit parts for the speaker element 220
  • an IC 240 for an HF band communication system that is a circuit part for the coil antenna 260.
  • a matching circuit 250 Each component of the speaker module 20 will be described later.
  • the display 30 is, for example, a liquid crystal display device that displays an image or the like according to the control of the processor 50.
  • the main board 40 is, for example, a printed wiring board on which main circuit components of the mobile terminal device 1 such as the processor 50 are mounted.
  • the main board 40 is connected to the speaker module 20 via the flexible board 60.
  • the main board 40 is an RF that performs wireless communication with a communication partner of the mobile terminal device 1 such as Bluetooth (registered trademark), wireless LAN (Local Area Network), and GPS (Global Positioning System).
  • a communication partner of the mobile terminal device 1 such as Bluetooth (registered trademark), wireless LAN (Local Area Network), and GPS (Global Positioning System).
  • Bluetooth registered trademark
  • wireless LAN Local Area Network
  • GPS Global Positioning System
  • the processor 50 is a chip set that outputs a sound signal to the speaker module 20 and includes, for example, an MPU (Micro Processing Unit).
  • the processor 50 outputs sound data indicating sound recorded on a storage medium such as a semiconductor memory or sound data decoded from a received signal received from a communication partner of the mobile terminal device 1 as a sound signal.
  • the flexible substrate 60 is a flexible substrate that connects the main substrate 40 and the speaker module 20.
  • a flexible substrate 60 for example, a flexible printed circuit (FPC) substrate using a polyethylene terephthalate (PET) resin as a base film and a conductive paste such as carbon silver as a conductor can be used.
  • the material of the flexible substrate 60 is not particularly limited as long as it has flexibility.
  • the battery 70 is a battery that supplies power to each component of the mobile terminal device 1 such as the speaker module 20, and is, for example, a lithium ion secondary battery that can be repeatedly charged and discharged.
  • the operation button 90 is an input device that receives an instruction from the user of the mobile terminal device 1.
  • the mobile terminal device 1 includes, for example, an antenna for performing wireless communication such as cellular communication with a communication partner of the mobile terminal device 1, an operation button 90, and the main board 40.
  • Other elements such as a communication cable for connecting the battery 70 and a power cable for connecting the battery 70 to each of the speaker module 20 and the main board 40 are also provided, but these are not shown.
  • FIG. 3 is a circuit diagram showing an example of the DCDC converter element 210 according to the first embodiment.
  • the DCDC converter element 210 is a power supply circuit that generates an output voltage different from the input voltage by switching the input voltage.
  • the DCDC converter element 210 is generated by boosting the DC voltage Vcc supplied from the battery 70. This is a step-up DCDC converter element that supplies a DC voltage Vdd to the amplifier circuit element 230.
  • the DCDC converter element 210 includes a switching circuit element 211 and a choke coil 212 connected to the switching circuit element 211.
  • DCDC converter element 210 further includes capacitors 213 and 214.
  • the DCDC converter element 210 is connected to the amplifier circuit element 230 as shown in FIG.
  • the switching circuit element 211 is a switching IC in this embodiment that intermittently applies the voltage input to the DCDC converter element 210 to the choke coil 212.
  • the switching circuit element 211 includes a switch element and a controller that controls switching of the switch element, so that the difference between the output voltage of the DCDC converter element 210 and a desired voltage (here, Vdd) is reduced.
  • the DC voltage Vcc supplied to the DCDC converter element 210 is intermittently applied to the choke coil 212.
  • the choke coil 212 is a coil element built in a magnetic substrate, which will be described later.
  • the DC voltage Vcc is intermittently applied by the switching circuit element 211, so that the voltage generated by the back electromotive force is generated. Superimposed on the DC voltage Vcc. Thereby, the choke coil 212 can generate a voltage higher than the DC voltage Vcc.
  • the capacitor 213 is a smoothing capacitor on the input side of the DCDC converter element 210
  • the capacitor 214 is a smoothing capacitor on the output side of the DCDC converter element 210.
  • the capacitors 213 and 214 are chip capacitors.
  • the DCDC converter element 210 configured as described above causes the choke coil 212 to store or release magnetic energy by switching the DC voltage Vcc supplied from the battery 70 by the switching circuit element 211. As a result, a DC voltage Vdd higher than the DC voltage Vcc is generated and supplied to the amplifier circuit element 230.
  • the amplifier circuit element 230 is connected to the speaker element 220 and generates an electrical signal (here, a sound signal) using the output voltage (here, the direct current voltage Vdd) of the DCDC converter element 210.
  • the amplifier circuit element 230 is an amplifier IC. is there.
  • the amplification circuit element 230 generates the electric signal by performing amplification using the output voltage of the DCDC converter element 210. More specifically, the amplifier circuit element 230 amplifies the sound signal output from the processor 50 using the DC voltage Vdd, and outputs the amplified sound signal to the speaker element 220.
  • the amplification circuit element 230 may be any configuration as long as it can amplify the sound signal of the analog electrical signal.
  • the digital electrical signal It is preferable that the sound signal is analog-converted and amplified.
  • the amplifier circuit element 230 preferably has a DSP (Digital Signal Processor) for audio processing.
  • a wiring here, the flexible substrate 60 for transmitting a sound signal is arranged (drawn) in the casing 10 for a long time. Since the analog electric signal is more attenuated and deteriorated than the digital electric signal, such an arrangement may cause deterioration in sound quality of the speaker module 20. In such an arrangement, since the wiring functions like an antenna, noise due to the sound signal is radiated into the housing 10. Since this causes noise interference with the RF circuit in the mobile terminal device 1 in which the RF circuit is mounted, the communication quality may be deteriorated.
  • the HF band communication system IC 240 is an IC that is connected to the coil antenna 260 and controls HF band communication.
  • the HF band communication system IC 240 is an IC that controls near field communication (NFC).
  • NFC near field communication
  • the HF band communication system IC 240 performs HF band communication with the communication partner by magnetic coupling between the coil antenna 260 and an antenna coil of an external communication partner.
  • the matching circuit 250 is a circuit that matches the IC 240 for the HF band communication system and the coil antenna 260, and converts balanced-unbalanced, and is configured by appropriately combining an inductor and a capacitor, for example.
  • FIG. 4 is a cross-sectional view illustrating an example of a configuration of a main part of the mobile terminal device 1 according to the first embodiment.
  • FIG. 5 is a top view illustrating an example of a configuration of a main part of the mobile terminal device according to the first embodiment.
  • FIG. 4 is a cross-sectional view showing an example of the configuration of the speaker module 20 and the casing 10 around it, and is an enlarged view of the main part of FIG. 1B.
  • FIG. 5 is a top view showing an example of the configuration of the speaker module 20 and the casing 10 around it, and is an enlarged view of the main part of FIG. 1A.
  • FIG. 4 for the sake of simplicity, components in different cross sections may be strictly illustrated and described in the same drawing. The same applies to the subsequent sectional views.
  • the housing 10 is hatched, and the hatching is different between the metal surface 11 and the resin surface 12.
  • the speaker module 20 is provided with a magnetic substrate 21 on which a speaker element 220 is mounted.
  • the magnetic substrate 21 is provided with a coil antenna 260 so as to surround the speaker element 220 in plan view.
  • the HF band communication system IC 240 is mounted on the magnetic substrate 21. Specifically, the HF band communication system IC 240 is mounted on a surface opposite to the surface on which the speaker element 220 of the magnetic substrate 21 is mounted. That is, the speaker element 220 is mounted on one main surface (main surface on the Z axis direction plus side) of the magnetic substrate 21, and the HF band communication system IC 240 is mounted on the other main surface (Z axis) of the magnetic substrate 21. It is mounted on the main surface on the minus side.
  • the amplifier circuit element 230 and the switching circuit element 211 are mounted on the magnetic substrate 21.
  • the switching circuit element 211 is mounted on a surface opposite to the surface on which the coil antenna 260 of the magnetic substrate 21 is provided. That is, the coil antenna 260 is provided on one main surface of the magnetic substrate 21, and the switching circuit element 211 is mounted on the other main surface of the magnetic substrate 21.
  • the amplifier circuit element 230 is mounted on the mounting surface of the switching circuit element 211 of the magnetic substrate 21 (the other main surface of the magnetic substrate 21).
  • the choke coil 212 is built in the magnetic substrate 21. That is, between the switching circuit element 211 and the speaker element 220, the magnetic substrate 21 having the choke coil 212 built therein and mounted with the switching circuit element 211 is disposed.
  • the magnetic substrate 21 is a multilayer substrate incorporating the choke coil 212, and is formed by laminating a plurality of magnetic layers.
  • the magnetic substrate 21 is configured to be larger than, for example, the speaker element 220 to be mounted in a top view.
  • the magnetic substrate 21 is provided with various conductors for forming the DCDC converter element 210 including the choke coil 212.
  • the conductor is provided on one main surface of the magnetic substrate 21, provided with a surface electrode (not shown) for mounting the speaker element 220, provided on the other main surface of the magnetic substrate 21, and includes the switching circuit element 211 and the like.
  • a surface electrode (not shown) for mounting, an in-plane conductor 21a formed along the main surface of each magnetic layer, and an interlayer conductor 21b (via) formed through each magnetic layer in the thickness direction ) Is included.
  • At least some of the plurality of magnetic layers are provided with loop-shaped in-plane conductors 21a, and the end portions of the in-plane conductors 21a are interposed via the interlayer conductors 21b.
  • the choke coil 212 is formed as a whole by being sequentially connected.
  • Each magnetic layer is made of, for example, a magnetic ceramic base material having a relatively high magnetic permeability.
  • magnetic ferrite ceramics are used as the magnetic ceramics.
  • ferrite containing iron oxide as a main component and containing at least one of zinc, nickel, and copper can be used.
  • the surface electrode for example, a metal or alloy mainly composed of silver can be used.
  • the surface electrode may be plated with nickel, palladium, or gold.
  • the magnetic ferrite ceramics constituting each layer of the magnetic substrate 21 are so-called LTCC ceramics (Low Temperature Co-fired Ceramics), and the firing temperature of the magnetic substrate 21 is lower than the melting point of silver, and silver is used for the conductor. It becomes possible.
  • LTCC ceramics Low Temperature Co-fired Ceramics
  • the DCDC converter element 210 having low loss and excellent circuit characteristics such as power efficiency is formed.
  • the magnetic substrate 21 can be fired in an oxidizing atmosphere such as air.
  • a speaker element 220 and a coil antenna 260 are provided on one main surface of the magnetic substrate 21.
  • a module case 24 that covers the speaker element 220 and the coil antenna 260 is also provided.
  • the speaker element 220 is a voice coil type speaker element having a voice coil 222 that vibrates when an electric signal (sound signal here) flows.
  • the speaker element 220 accommodates a substantially conical cone 221 (diaphragm) whose diameter decreases downward, a voice coil 222 in contact with the lower end of the cone 221, and the voice coil 222. It has a magnet 223 and a speaker box 224 that houses them.
  • a terminal electrode 225 (terminal electrode 225a) is provided on the lower surface of the speaker element 220.
  • the magnetic field fluctuates when the sound signal amplified by the amplifier circuit element 230 flows to the voice coil 222, and the voice coil 222 vibrates in the vertical direction due to the fluctuation of the magnetic field. Therefore, the cone 221 in contact with the voice coil 222 vibrates in the vertical direction, and the sound signal that is an electrical signal is converted into the sound that is air vibration.
  • an interlayer conductor that passes through at least a part (here, all) of the magnetic substrate 21 and is connected to the terminal electrode 225a that is an input terminal of the speaker element 220, in the magnetic substrate 21. 21b1 is provided.
  • the interlayer conductor 21b1 includes the terminal electrode 225a of the speaker element 220 mounted on one main surface of the magnetic substrate 21 and the output terminal of the amplifier circuit element 230 mounted on the other main surface of the magnetic substrate 21. And connect. Therefore, the speaker element 220 converts an electric signal input through the interlayer conductor 21b1 penetrating at least part of the magnetic substrate 21 into sound.
  • the coil antenna 260 is a coil antenna for an HF band communication system, for example, a coil antenna for short-range wireless communication.
  • the coil antenna 260 is a spiral antenna that is provided in a spiral shape (spiral shape) on the same plane so as to surround the speaker element 220 and has, for example, three turns.
  • the coil antenna 260 is provided on the same surface as the surface on which the speaker element 220 of the magnetic substrate 21 is provided.
  • the number of turns of the coil antenna 260 is not particularly limited as long as it is 1 turn or more, and the coil antenna 260 may be a loop antenna having a turn number of 1 turn.
  • the number of laminated coil antennas 260 is not particularly limited, and may be a single layer type or a multilayer type.
  • the opening 10 a is provided on the metal surface 11 of the housing 10. Specifically, at least a part (here, all) of the metal surface 11 overlaps with the coil opening of the coil antenna 260 and the opening 10 a and the outer edge of the metal surface 11 are connected to the metal surface 11.
  • a slit portion 10b is provided. The slit portion 10b extends in the radial direction of the coil antenna 260, and the coil antenna 260 is overlapped with the slit portion 10b in the radial direction. That is, in the present embodiment, the coil antenna 260 is not visually recognized inside the opening 10a in plan view, and the speaker box 224 and the cone 221 of the speaker element 220 are visually recognized.
  • the coil opening of the coil antenna 260 refers to a portion of the coil antenna 260 where the coil antenna 260 is not provided, as viewed from the winding axis direction of the coil antenna 260.
  • the opening 10 a is provided, for example, such that the center of the opening 10 a is located on the winding axis of the coil antenna 260.
  • the opening 10a only needs to be provided so that at least a portion thereof overlaps with the coil opening of the coil antenna 260 in plan view.
  • the center of the opening 10a may not be located on the winding axis. It doesn't matter.
  • the coil antenna 260 is provided on the magnetic substrate 21 so as to surround the speaker element 220 in plan view, while ensuring the characteristics required for the coil antenna 260. High-density mounting of the speaker element 220 and the coil antenna 260 can be achieved. The reason why such an effect is achieved will be described with reference to FIG.
  • the coil antenna 260 is provided so as to surround the speaker element 220, it is possible to achieve high-density mounting of the mobile terminal device 1 while ensuring the opening area of the coil antenna 260.
  • the metal surface 11 of the housing 10 is provided with the opening 10a and the slit 10b at least partially overlapping in the plan view (all in the present embodiment) with the coil opening.
  • the metal surface 11 can be made to work as a radiator (booster). This will be described using FIG. 7 with reference to FIG.
  • FIG. 7 is a top view schematically showing a current generated in the mobile terminal device 1 according to the present embodiment. Specifically, FIG. 7 is a top view schematically showing a current I1 flowing through the coil antenna 260 and a current I2 flowing through the housing 10.
  • the mobile terminal device 1 may have an RFIC and an antenna for performing wireless communication such as a cellular system with a communication partner.
  • the RFIC and the antenna are affected by noise interference by the magnetic flux radiated from the coil antenna 260, the quality of the wireless communication may be deteriorated.
  • the choke coil 212 is built in the magnetic substrate 21 and the choke coil 212 becomes a closed magnetic circuit type coil, interference between the choke coil 212 and the speaker element 220 is caused. Can be made extremely difficult to occur.
  • Such a configuration is intended to achieve high-density mounting when, for example, a voice coil type speaker element that converts an electric signal into sound using the fluctuation of a magnetic field is used as the speaker element 220 mounted on the magnetic substrate 21. It is particularly useful because it can suppress the deterioration of sound quality.
  • the magnetic substrate 21B As shown in FIG. 9, the magnetic substrate 21B according to the present embodiment is provided with a cavity portion 21Ba (concave portion) and a bank portion 21Bb surrounding the cavity portion 21Ba.
  • the coil antenna 260 and the housing 10 can be brought closer by providing the coil antenna 260 on the bank portion 21Bb of the magnetic substrate 21B. For this reason, since a stronger magnetic field can be generated outside the housing 10, the communication distance can be further increased.
  • the opening 10a and the slit 10b are provided on the metal surface 11, when a current is passed through the coil antenna 260, a stronger magnetic field can be generated from the metal surface 11.
  • the communication distance can be further expanded. That is, since the coil antenna 260 is provided on the bank portion 21Bb, the degree of coupling between the coil antenna 260 that functions as a feeding coil antenna and the metal surface 11 that functions as a PB antenna increases, so that the communication distance can be further expanded. .
  • FIG. 11 is a top view showing an example of the appearance of such a portable terminal device 1D.
  • the mobile terminal device 1D is provided with a plurality (two in this case) of speaker modules 20 that emit sound on the front side (Z-axis direction plus side) of the mobile terminal device 1D.
  • a magnetic field of HF band communication can be generated from a plurality of locations of the mobile terminal device 1D, so that the communication distance can be further increased.
  • variation of the communication performance by the relative angle with the antenna coil of the other party of communication of portable terminal device 1D becomes small, it becomes easy to ensure favorable communication performance irrespective of the said relative angle.
  • the coil antenna 260E is provided on the magnetic substrate 21E so as to surround the speaker element 220 in a plan view, thereby ensuring the characteristics required for the coil antenna 260E and the speaker element 220E. High density mounting with the coil antenna 260E can be achieved.
  • the slit portion 10b is provided on the metal surface of the housing. However, the slit portion 10b may not be provided.
  • FIG. 13 is a top view showing an example of the appearance of such a portable terminal device 1F.
  • FIG. 14 is a top view illustrating an example of a configuration of a main part of the mobile terminal device 1F.
  • the housing 10 ⁇ / b> F is hatched, and the hatching is differentiated between the metal surface 11 ⁇ / b> F and the resin surface 12 ⁇ / b> F.
  • FIG. 14 is a top view showing an example of the appearance of such a portable terminal device 1G.
  • a mobile terminal device 1G shown in the figure has a housing 10G formed of resin instead of the housing 10 as compared with the first embodiment.
  • the housing 10G is provided with an opening 10Ga.
  • the coil antenna 260 is provided on the magnetic substrate 21 so as to surround the speaker element 220 in a plan view, thereby ensuring the characteristics required for the coil antenna 260 and the speaker element 220. High density mounting with the coil antenna 260 can be achieved.
  • the DCDC converter element 210 is not limited to a step-up converter, and may be a step-down converter element or a step-up / step-down converter element.
  • the speaker element 220 only needs to convert an electric signal inputted through the interlayer conductor 21b that penetrates at least a part of the magnetic substrate 21, and through the interlayer conductor 21b that penetrates all of the magnetic substrate 21. There is no need to convert the input electrical signal. According to such a configuration, although the noise suppression effect is somewhat inferior to the case of penetrating all of them, the magnetic layer through which the interlayer conductor 21b penetrates functions as a ferrite bead, thereby suppressing the noise of the electric signal. can do.

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Aerials With Secondary Devices (AREA)
  • Support Of Aerials (AREA)

Abstract

L'invention concerne un dispositif de terminal portable équipé d'un boîtier (10), d'un élément de haut-parleur (220) logé à l'intérieur du boîtier (10), d'un substrat magnétique (21) sur lequel est monté l'élément de haut-parleur (220), et d'une antenne spiralée (260) disposée sur le substrat magnétique (21) de manière à entourer l'élément de haut-parleur (220) lorsque vu à partir d'une vue en plan.
PCT/JP2016/070945 2015-07-27 2016-07-15 Dispositif de terminal portable WO2017018243A1 (fr)

Priority Applications (1)

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JP2017530784A JP6394807B2 (ja) 2015-07-27 2016-07-15 携帯端末機器

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JP2015-148076 2015-07-27
JP2015148076 2015-07-27

Publications (1)

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WO2017018243A1 true WO2017018243A1 (fr) 2017-02-02

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PCT/JP2016/070945 WO2017018243A1 (fr) 2015-07-27 2016-07-15 Dispositif de terminal portable

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JP (1) JP6394807B2 (fr)
WO (1) WO2017018243A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112672558A (zh) * 2020-12-07 2021-04-16 Oppo广东移动通信有限公司 定位标签及电子设备

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JP2007076166A (ja) * 2005-09-14 2007-03-29 Kyocera Chemical Corp スピーカ付書籍装置およびスピーカ付書籍担持装置
WO2007116790A1 (fr) * 2006-04-03 2007-10-18 Panasonic Corporation Module de memoire a semi-conducteur incorporant une antenne
JP2009152714A (ja) * 2007-12-19 2009-07-09 Sony Corp Ｒｆｉｄ用アンテナおよびアンテナコイルの製造方法
JP2009171567A (ja) * 2007-12-20 2009-07-30 Harada Ind Co Ltd パッチアンテナ装置
JP2009188801A (ja) * 2008-02-07 2009-08-20 Panasonic Corp 圧電スピーカ
WO2010122685A1 (fr) * 2009-04-21 2010-10-28 株式会社村田製作所 Appareil d'antenne et procédé de réglage de la fréquence de résonance de celui-ci
US20140008659A1 (en) * 2012-07-09 2014-01-09 Taiwan Semiconductor Manufacturing Company, Ltd. High electron mobility transistor and method of forming the same

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US9083388B2 (en) * 2012-08-29 2015-07-14 Red Tail Hawk Corporation Transmitter with improved sensitivity and shielding

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005269537A (ja) * 2004-03-22 2005-09-29 Mitsubishi Electric Corp 無線装置
JP2007076166A (ja) * 2005-09-14 2007-03-29 Kyocera Chemical Corp スピーカ付書籍装置およびスピーカ付書籍担持装置
WO2007116790A1 (fr) * 2006-04-03 2007-10-18 Panasonic Corporation Module de memoire a semi-conducteur incorporant une antenne
JP2009152714A (ja) * 2007-12-19 2009-07-09 Sony Corp Ｒｆｉｄ用アンテナおよびアンテナコイルの製造方法
JP2009171567A (ja) * 2007-12-20 2009-07-30 Harada Ind Co Ltd パッチアンテナ装置
JP2009188801A (ja) * 2008-02-07 2009-08-20 Panasonic Corp 圧電スピーカ
WO2010122685A1 (fr) * 2009-04-21 2010-10-28 株式会社村田製作所 Appareil d'antenne et procédé de réglage de la fréquence de résonance de celui-ci
US20140008659A1 (en) * 2012-07-09 2014-01-09 Taiwan Semiconductor Manufacturing Company, Ltd. High electron mobility transistor and method of forming the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112672558A (zh) * 2020-12-07 2021-04-16 Oppo广东移动通信有限公司 定位标签及电子设备

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JPWO2017018243A1 (ja) 2018-04-12

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