WO2017008575A1 - 移动终端以及对该移动终端散热的方法 - Google Patents
移动终端以及对该移动终端散热的方法 Download PDFInfo
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- WO2017008575A1 WO2017008575A1 PCT/CN2016/082506 CN2016082506W WO2017008575A1 WO 2017008575 A1 WO2017008575 A1 WO 2017008575A1 CN 2016082506 W CN2016082506 W CN 2016082506W WO 2017008575 A1 WO2017008575 A1 WO 2017008575A1
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- heat
- mobile terminal
- main board
- layer
- heat dissipation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Definitions
- the present invention relates to the field of electronic device technologies, and in particular, to a mobile terminal and a method for dissipating heat to the mobile terminal.
- mobile terminals such as mobile phones are increasingly thinner and lighter in order to meet the needs of the market.
- Mobile terminals such as thin and light mobile phones are facing the problem of strength and heat dissipation.
- the existing mobile phone middle frame is usually made of stainless steel, but the heat dissipation effect of stainless steel is not good, and because the thickness of the mobile phone is thin, the main board is thin. The heat is easily transferred to the panel and the back shell, which makes the panel and the back shell hot, giving consumers a bad experience.
- An object of the present invention is to provide a mobile terminal that has a simple structure and a good heat dissipation effect.
- Another object of the present invention is to provide a mobile terminal that is high in strength.
- a mobile terminal includes a main board for mounting a chip, a main board supporting member, and a rear case, the rear case being disposed on a side of the chip away from the main board, and disposed between the chip and the rear case a first heat dissipation layer is disposed between the back cover and the heat conductive layer, and a first heat insulation layer is disposed between the first heat dissipation layer and the rear case; a size and a size of the first heat dissipation layer The dimensions of the rear case are matched; a side of the main board supporting member adjacent to the main board is provided with a second heat insulating layer.
- a mobile terminal includes a main board for mounting a chip, a main board supporting member, and a rear case, the rear case being disposed on a side of the chip away from the main board, and disposed between the chip and the rear case a first heat dissipation layer is disposed between the back cover and the heat conductive layer, and a first heat insulation layer is disposed between the first heat dissipation layer and the rear case.
- a method for dissipating heat to the mobile terminal is further provided, wherein a heat dissipation layer is disposed between the rear case and the chip, and a heat dissipation layer and a heat insulation layer are sequentially disposed between the heat conduction layer and the rear case, and when the chip of the mobile terminal is heated, Heat is transferred to the heat dissipation layer through the heat conductive layer to reduce heat of the mobile terminal.
- a heat dissipation layer is disposed between the chip and the rear case, and a heat dissipation layer and a heat insulation layer are sequentially disposed between the heat conduction layer and the rear case, and most of the heat of the mobile terminal can be directed away from the main plate support member through the heat conduction layer.
- One side of the transfer that is, the heat mostly transfers heat to the heat dissipation layer, reduces the heat transferred to the main board support member, and transfers the heat on the heat dissipation layer toward the periphery of the mobile terminal through the heat insulation layer, reducing the transfer to the main board support member and The heat on the back shell.
- FIG. 1 is a schematic diagram of an explosion of a mobile terminal according to an embodiment of the present invention.
- FIG. 2 is a schematic structural diagram of a mobile terminal according to an embodiment of the present invention (when the rear case is separated).
- FIG. 3 is a cross-sectional view of a mobile terminal according to an embodiment of the invention.
- FIG. 4 is a cross-sectional view of a mobile terminal according to another embodiment of the present invention.
- FIG. 5 is a cross-sectional view of a mobile terminal according to another embodiment of the present invention.
- FIG. 6 is a cross-sectional view of a mobile terminal according to another embodiment of the present invention.
- FIG. 7 is a cross-sectional view of a mobile terminal according to another embodiment of the present invention.
- FIG. 8 is a cross-sectional view of a mobile terminal according to another embodiment of the present invention.
- FIG. 9 is a cross-sectional view of a mobile terminal according to another embodiment of the present invention.
- FIG. 3 is a cross-sectional view showing the structure of a mobile terminal according to an embodiment of the present invention.
- the mobile terminal includes a main board 3 for mounting the chip 5, a main board supporting member 2 and a rear case 4, and the rear case 4 is disposed on the chip 5 away from the main board 3.
- a heat conducting layer 6 is disposed between the chip 5 and the rear case 4, and a first heat dissipation layer 7 is disposed between the rear case 4 and the heat conductive layer 6.
- the first heat dissipation layer 7 is A first heat insulating layer 8 is disposed between the rear cases 4.
- a first heat dissipation layer 7 is further disposed between the heat conductive layer 6 and the rear case 4, and most of the heat of the mobile terminal can be directed away from the main board support member through the heat conductive layer 6.
- One side of the transfer of 2 that is, heat mostly transfers heat toward the first heat dissipation layer 7, reducing the heat transferred to the main board support member 2, while the heat on the first heat dissipation layer 7 is directed toward the mobile terminal through the first heat insulation layer 8. Passing around, reducing the amount of heat transferred to the rear shell 4.
- the mobile terminal is a mobile phone
- the main board 3 is a PCB board
- the main board supporting member 2 can also be referred to as a middle frame of the mobile terminal.
- the main board The support member 2 ie, the middle frame
- the chip 5 includes a PMU unit 51 that supplies power to the system and each module, a CPU unit 52 that processes communication requirements of the respective modules, and an MCP unit 53 that assists the CPU unit 52 in performing data processing.
- the PMU unit 51, the CPU unit 52, and the MCP unit 53 are all components that generate a large amount of heat on the main board 3.
- the mobile terminal may also be a tablet computer, a wearable terminal, or the like.
- a flexible wiring board (FPC) or the like may be employed, and the chip 5 may further include heat generating components other than the PMU unit 51, the CPU unit 52, and the MCP unit 53.
- the rear case 4 of the present invention is made of metal having a relatively high strength.
- the rear case 4 is made of stainless steel. By making the rear case 4 made of stainless steel, the strength of the mobile terminal can be ensured.
- the size of the first heat dissipation layer 7 matches the size of the rear case 4.
- the size of the first heat dissipation layer 7 can be matched with the size of the rear case 4, that is, the first heat dissipation layer 4 can be clothed.
- the full back shell is close to one side of the chip.
- the first heat insulating layer 8 is disposed at a position corresponding to the chip 5 between the first heat dissipation layer 7 and the rear case 4.
- the first thermal insulation layer 8 By providing the first thermal insulation layer 8 at a position corresponding to the chip 5, the heat generating region of the chip 5 is isolated by the first thermal insulation layer 8, that is, the heat generated by the chip 5 is not transmitted to the rear case 4 through the first heat dissipation layer 7. And the portion between the first heat dissipation layer 7 and the rear case 4 where the first heat insulation layer 8 is not provided is not in direct contact, and the temperature on the rear case 4 is lowered.
- the first heat insulation layer 8 is covered with the rear case 4 adjacent to a side surface of the chip 5.
- the first heat dissipation layer 7 and the rear case 4 are completely separated by the first heat insulation layer 8 by the first heat insulation layer 8 being covered by the back cover 4 near one side of the chip 5, that is, the heat on the first heat dissipation layer 7 is not Will be passed to the rear shell 4.
- a second heat insulating layer 9 is disposed on a side of the main board supporting member 2 adjacent to the main board 3.
- the main board support member 2 A second heat insulating layer 9 is disposed on a side of the main board 3, so that the main board supporting member 2 is completely isolated from the main board 3, and heat on the main board 3 cannot be transmitted to the main board supporting member 3, thereby improving the user experience.
- the second heat insulating layer 9 is disposed on a side of the main board supporting member 2 away from the main board 3 .
- the mobile terminal When the mobile terminal is in use, most of the heat generated by the chip 5 is led out to the first heat dissipation layer 7 through the heat conductive layer 6, but some heat is transferred to the main board support member 2 through the main board 3, and then through the main board support member 2.
- the other components of the mobile terminal, such as the panel, are transmitted to the side away from the main board 3, so that the second insulating layer 9 is disposed on the side of the main board supporting member 2 away from the main board 3, so that the main board supporting member 2 can be completely supported by the main board.
- the member 2 is isolated from other components of the mobile terminal on the side of the main board 3, and heat on the main board 3 cannot be transferred to the other components of the mobile terminal through the main board supporting member 3.
- the second heat insulating layer 9 is covered with a side surface of the main board supporting member 2 close to the main board 3 or a side surface away from the main board 3.
- a second heat dissipation layer 10 is disposed between the main board 3 and the second heat insulation layer 9. As shown in FIG. 7, in the embodiment, the second heat dissipation layer 10 is disposed on a side of the main board supporting member 2 adjacent to the main board 3, and is located at the main board 3 and the second heat insulation layer. Between 9. Since the heat conduction layer 6 transfers only a large part of the heat of the chip 5 to the first heat dissipation layer 7, the remaining part of the heat is transmitted to the side of the main board 3 away from the chip 5 through the main board 3, and the second heat dissipation layer 10 is provided to the main board 3.
- the second heat dissipation layer 10 may also be disposed on a side of the main board support member 2 away from the main board 3 and between the main board support member 2 and the second heat insulation layer 9.
- the position of the second heat dissipation layer 10 may be disposed on a side of the main board support member 2 near the main board 3, or may be disposed on a side of the main board support member 2 away from the main board 3, and only needs to ensure that the position of the second heat dissipation layer 10 is located on the main board 3 and The second heat dissipation layer is only required, so the second heat dissipation layer 10 needs to transfer the remaining heat on the main board 3.
- the first heat dissipation layer 7 and the second heat dissipation layer 10 may each be a graphite heat dissipation layer, and the graphite is a carbonaceous element crystal mineral, and the crystal lattice is a hexagonal layer structure, belonging to the hexagonal
- the crystal system has complete layered cleavage, and the cleavage surface is mainly composed of molecular bonds, which has weak molecular attraction, so its natural floatability is very good.
- Graphite has the following advantages: (1), high temperature resistance: graphite has a melting point of 3850 ⁇ 50°C and a boiling point of 4250°C.
- the first heat dissipation layer 7 and the second heat dissipation layer 10 may also be a copper foil heat dissipation layer, the copper foil is made of copper and a certain proportion of other metals, and the copper foil generally has 90 foils. And 88 foil, that is, the copper content is 90% and 88%. Among the metals, copper has the best thermal conductivity, and its thermal conductivity is 401 W/mK. Therefore, copper foil is used to dissipate heat. 9, the heat transferred from the heat-conducting layer 6 can be dissipated as much as possible in a short time to ensure the mobile terminal. Normal use.
- the first heat dissipation layer 7 and the second heat dissipation layer 10 may also be aluminum alloy heat dissipation layers.
- the thermal conductivity of aluminum is second only to copper and far exceeds that of iron.
- the thermal conductivity of aluminum is 237W. /mK, and the heat transfer coefficient of iron is 80W/mK, so the heat dissipation layer 9 made of aluminum alloy can also accelerate heat dissipation, improve heat dissipation efficiency, and ensure the normal use of the mobile terminal.
- FIG. 9 is a cross-sectional view showing the structure of a mobile terminal according to still another embodiment of the present invention.
- a panel 1 is disposed on a side of the main board supporting member 2 away from the main board 3, and the second partition is disposed between the panel 1 and the main board supporting member 2.
- Thermal layer 9 By providing the second heat insulating layer 9 on the side of the main board supporting member 2 away from the main board 3, the heat generated by the chip 5 is separated by the second heat insulating layer 9 after being transferred from the main board 3 to the main board supporting member 2, that is, The heat is not transferred to the panel 1.
- the panel 1 does not generate heat and has a good customer experience.
- the thermally conductive layer 6 is a layer of phase change material.
- the characteristics of the phase change material are such that the physical state can be changed after being heated, and the gap of the contact surface can be sufficiently filled, that is, the heat conductive layer 6 can be filled in a state of being filled with heat, and the heat transfer area can be increased to accelerate the heat. Transfer speed.
- the phase change material layer is any one of an inorganic PCM layer, an organic PCM layer, or a composite PCM layer.
- Inorganic PCM mainly includes crystalline hydrated salts, molten salts, metals or alloys; organic PCM mainly includes paraffin, acetic acid and other organic substances; composite PCM layer is a mixture of organic PCM and inorganic PCM, composite phase change storage
- the thermal material can effectively overcome the shortcomings of a single inorganic or organic phase change heat storage material, and can improve the application effect of the phase change material and expand its application range. Therefore, the development of composite phase change heat storage materials has become a hot research topic in the field of heat storage materials.
- mixed phase change materials may also cause disadvantages such as a decrease in latent heat of phase change or a tendency to be denatured during long-term phase transition.
- the first heat insulation layer 8 and the second heat insulation layer 9 are both heat insulating foams.
- Insulating foam can not only achieve the effect of heat insulation, but also protect the safety of the panel 1 and the rear shell 4 during use, because the insulating foam has a certain buffering effect, and the panel 1 and the rear shell 4 suffer during use.
- the external impact is applied, the external force is transmitted to the insulating foam through the panel 1 and the rear shell 4, and is buffered and dispersed by the insulating foam, thereby effectively protecting the panel 1 and the rear shell 4 and the internal components of the terminal. Safety.
- the main board 3 and the main board support member 2 have an insulation gap 11.
- the heat insulating gap 11 is not less than 1 mm.
- the thermally conductive layer 6 is fixed to the chip 5.
- heat can be quickly absorbed while the chip 5 is heated, and physical deformation occurs to fill the respective corners of the surface of the chip 5.
Abstract
本发明公开一种移动终端，其包括用于安装芯片的主板、主板支撑构件和后壳，后壳设置于芯片远离主板的一侧，芯片与后壳之间设置导热层，后壳与导热层之间设置第一散热层，第一散热层与后壳之间设置第一隔热层。本发明还公开一种对上述的移动终端散热的方法，当移动终端的芯片发热后，热量通过导热层向散热层传递。
Description
本发明涉及电子设备技术领域，尤其涉及一种移动终端以及对该移动终端散热的方法。
目前手机等移动终端为了配合市场需要，愈来愈向薄、轻化发展。而薄、轻化手机等移动终端面临着强度和散热的问题。手机越薄，手机的中框或外壳就更需要高强度的材料制成，现有手机中框通常采用不锈钢制成，但是不锈钢的散热效果不佳，且由于手机的厚度较薄，主板上的热量容易传递到面板和后壳，使面板和后壳发烫，给消费者带来不好的体验。
因此，为了配合薄、轻化移动终端的发展，亟需设计一种强度高、散热效果好以及用户体验好的移动终端。
本发明的一个目的在于提供一种移动终端，其结构简单、散热效果好。
本发明的另一个目的在于提供一种移动终端，其强度高。
本发明的又一个目的在于提供一种移动终端，其可以将芯片产生的热量大部分通过散热层传递到移动终端的四周，减少传递到移动终端的后壳和面板上的热量，增加用户的体验效果。
提供一种移动终端，其包括用于安装芯片的主板、主板支撑构件和后壳，所述后壳设置于所述芯片远离所述主板的一侧，所述芯片与所述后壳之间设置导热层，所述后壳与所述导热层之间设置第一散热层，所述第一散热层与所述后壳之间设置第一隔热层；所述第一散热层的尺寸与所述后壳的尺寸相匹配；所述主板支撑构件靠近所述主板的一侧设置有第二隔热层。
提供一种移动终端，其包括用于安装芯片的主板、主板支撑构件和后壳，所述后壳设置于所述芯片远离所述主板的一侧，所述芯片与所述后壳之间设置导热层，所述后壳与所述导热层之间设置第一散热层，所述第一散热层与所述后壳之间设置第一隔热层。
还提供一种对上述的移动终端散热的方法，通过在后壳与芯片之间设置导热层，在导热层与后壳之间依次设置散热层和隔热层，当移动终端的芯片发热后，热量通过导热层向散热层传递，以降低所述移动终端的热量。
本发明的移动终端通过在芯片与后壳之间设置导热层，在导热层与后壳之间依次设置散热层和隔热层，可以通过导热层将移动终端的大部分热量朝向远离主板支撑构件的一侧传递，即热量大部分朝向散热层传递散热，减少传递到主板支撑构件上的热量，并通过隔热层使散热层上的热量朝向移动终端的四周传递，减少传递到主板支撑构件和后壳上的热量。
图1为本发明实施例所述的移动终端的爆炸示意图。
图2为本发明实施例所述的移动终端的结构示意图（后壳分离时）。
图3为本发明一实施例所述的移动终端的剖视示意图。
图4为本发明另一实施例所述的移动终端的剖视示意图。
图5为本发明另一实施例所述的移动终端的剖视示意图。
图6为本发明另一实施例所述的移动终端的剖视示意图。
图7为本发明另一实施例所述的移动终端的剖视示意图。
图8为本发明另一实施例所述的移动终端的剖视示意图。
图9为本发明另一实施例所述的移动终端的剖视示意图。
图1至9中：
1、面板；2、主板支撑构件；3、主板；4、后壳；5、芯片；51、PMU模块；52、CPU模块；53、MCP模块；6、导热层；7、隔热层；8、隔热间隙；9、散热层；10、第二散热层；11、隔热间隙。
下面结合附图并通过具体实施方式来进一步说明本发明的技术方案。
图3是本发明一实施例提供的移动终端的结构剖视示意图。如图3所示，于本实施例中，移动终端包括用于安装芯片5的主板3、主板支撑构件2和后壳4，所述后壳4设置于所述芯片5远离所述主板3的一侧，所述芯片5与所述后壳4之间设置导热层6，所述后壳4与所述导热层6之间设置第一散热层7，所述第一散热层7与所述后壳4之间设置第一隔热层8。通过在芯片5与后壳4之间设置导热层6，而导热层6与后壳4之间还设置第一散热层7，可以通过导热层6将移动终端的大部分热量朝向远离主板支撑构件2的一侧传递，即热量大部分朝向第一散热层7传递散热，减少传递到主板支撑构件2上的热量，同时通过第一隔热层8使第一散热层7上的热量朝向移动终端的四周传递，减少传递到后壳4上的热量。用户在使用该移动终端时，由于芯片5发出的热量大部分通过第一散热层7朝向移动终端的四周传递，而传递到后壳4和主板支撑构件3上的热量极少，进一步提高了用户在使用时的体验效果。
如图1、2、3所示，在本实施例中，移动终端为手机，主板3采用PCB板，主板支撑构件2也可称为移动终端的中框，为了保证较高的结构强度，主板支撑构件2（即中框）采用不锈钢制成；芯片5包含为系统以及各个模块进行供电的PMU单元51、处理各个模块的通信需求的CPU单元52以及协助CPU单元52进行数据处理的MCP单元53，PMU单元51、CPU单元52以及MCP单元53均是主板3上发热量较大的部件，当然在本发明的其他实施例中，移动终端也可以为平板电脑、穿戴式终端等，主板3还可以采用柔性线路板（FPC）等，芯片5还可以包括除PMU单元51、CPU单元52以及MCP单元53以外的其它发热部件。
本发明的后壳4采用具有较高强度的金属制成。在本发明的一实施例中，所述后壳4采用不锈钢制成。通过将后壳4采用不锈钢制成，可以保证移动终端的强度。
如图3所示，于本实施例中，所述第一散热层7的尺寸与所述后壳4的尺寸相匹配。为了使芯片5发出的热量能顺利的通过第一散热层7传递到移动终端的四周，可以将第一散热层7的尺寸设置与后壳4的尺寸相匹配，即第一散热层4可以布满后壳靠近芯片的一侧面。
如图3所示，于本实施例中，在所述第一散热层7与所述后壳4之间对应所述芯片5的位置设置所述第一隔热层8。通过在芯片5对应的位置设置第一隔热层8，使得芯片5的发热区域被第一隔热层8隔离，即芯片5发出的热量不会通过第一散热层7传递到后壳4上，并且第一散热层7与后壳4之间未设有第一隔热层8的部位也不直接接触，降低了后壳4上的温度。
如图4所示，于本实施例中，所述第一隔热层8布满所述后壳4靠近所述芯片5的一侧面。通过将第一隔热层8布满后壳4靠近芯片5的一侧面，使得第一散热层7与后壳4通过第一隔热层8完全隔离，即第一散热层7上的热量不会传递到后壳4上。
如图5所示，于本实施例中，所述主板支撑构件2靠近所述主板3的一侧设置第二隔热层9。移动终端在使用时，芯片5发出的热量虽然大部分通过导热层6导出至第一散热层7上，但是还有部分热量会通过主板3传递到主板支撑构件2上，因此在主板支撑构件2靠近主板3的一侧设置第二隔热层9，可以使主板支撑构件2完全与主板3隔离，主板3上的热量也无法传递到主板支撑构件3上，提高用户体验。
如图6所示，于本实施例中，所述主板支撑构件2远离所述主板3的一侧设置第二隔热层9。移动终端在使用时，芯片5发出的热量虽然大部分通过导热层6导出至第一散热层7上，但是还有部分热量会通过主板3传递到主板支撑构件2上，进而通过主板支撑构件2传递到其远离主板3的一侧的移动终端的其它部件，例如面板上，因此在主板支撑构件2远离主板3的一侧设置第二隔热层9，可以使主板支撑构件2完全与主板支撑构件2远离主板3的一侧的移动终端的其它部件隔离，主板3上的热量也无法通过主板支撑构件3传递到移动终端的其它部件上。优选的，所述第二隔热层9布满所述主板支撑构件2靠近所述主板3的一侧面或布满远离所述主板3的一侧面。
在本发明的一实施例中，所述主板3与所述第二隔热层9之间设置第二散热层10。如图7所示，于本实施例中，所述第二散热层10设置在所述主板支撑构件2靠近所述主板3的一侧，并位于所述主板3与所述第二隔热层9之间。由于导热层6仅将芯片5的大部分热量传递给第一散热层7，而余下的部分热量会通过主板3传递到主板3远离芯片5的一侧，设置第二散热层10可以将主板3上的热量传递至移动终端的四周，进而进行散热，提高散热效率。如图8所示，第二散热层10还可以设置在主板支撑构件2远离主板3的一侧并位于主板支撑构件2与第二隔热层9之间。第二散热层10的位置可以设置在主板支撑构件2靠近主板3的一侧，也可以设置在主板支撑构件2远离主板3的一侧，只需要保证第二散热层10的位置位于主板3与第二散热层之间即可，因此第二散热层10需要将主板3上剩余的热量传递出。
在本发明的一实施例中，第一散热层7和第二散热层10均可以为石墨散热层，石墨是碳质元素结晶矿物，它的结晶格架为六边形层状结构，属六方晶系，具完整的层状解理，解理面以分子键为主，对分子吸引力较弱，故其天然可浮性很好。石墨具有以下优点：（1）、耐高温性：石墨的熔点为3850±50℃，沸点为4250℃，即使经超高温电弧灼烧，重量的损失很小，热膨胀系数也很小，石墨强度随温度提高而加强，在2000℃时，石墨强度提高一倍；（2）、导电、导热性好：石墨的导电性比一般非金属矿高一百倍，导热性超过钢、铁、铅等金属材料，导热系数随温度升高而降低，甚至在极高的温度下，石墨成绝热体；（3）、润滑性好：石墨的润滑性能取决于石墨鳞片的大小，鳞片越大，摩擦系数越小，润滑性能越好；（4）化学稳定性：石墨在常温下有良好的化学稳定性，能耐酸、耐碱和耐有机溶剂的腐蚀；（5）、可塑性：石墨的韧性好，可碾成很薄的薄片；（6）、抗热震性：石墨在常温下使用时能经受住温度的剧烈变化而不致破坏，温度突变时，石墨的体积变化不大，不会产生裂纹。
在本发明的另一实施例中，第一散热层7和第二散热层10还可以为铜箔散热层，铜箔由铜加一定比例的其它金属打制而成，铜箔一般有90箔和88箔两种，即为含铜量为90%和88%。在金属中，铜的导热性最好，其热传导系数为401W/mK，因此采用铜箔制作散热,9，可以使导热层6传递过来的热量尽可能在短时间内发散出去，保证移动终端的正常使用。
在本发明的又一实施例中，第一散热层7和第二散热层10还可以为铝合金散热层，铝的导热性能仅次于铜，且远超于铁，铝的热传导系数为237W/mK，而铁的热传导系数为80W/mK，因此用铝合金制成的散热层9也能加速散热，提高散热效率，保证移动终端的正常使用。
图9是于本发明的又一实施例提供的移动终端的结构剖视示意图。如图9所示，于本实施例中，在所述主板支撑构件2远离所述主板3的一侧设置面板1，所述面板1与所述主板支撑构件2之间设置所述第二隔热层9。通过在主板支撑构件2远离所述主板3的一侧设置第二隔热层9，芯片5发出的热量在由主板3传递到主板支撑构件2上后通过第二隔热层9进行隔离，即热量不会传递到面板1上，当用户打电话时，面板1不会发热，具有良好的客户体验。
在本发明的一实施例中，所述导热层6采用相变材料层。相变材料的特性使得其在受热以后物理状态可以发生变化，进而可以充分填充接触面的间隙，即导热层6受热后可呈流动的状态填充需要散热的各个间隙内，增加导热面积，加快热传递速度。所述相变材料层为无机PCM层、有机PCM层或复合PCM层中的任意一种。无机类PCM主要有结晶水合盐类、熔融盐类、金属或合金类等；有机类PCM主要包括石蜡、醋酸和其他有机物；复合PCM层即为有机PCM和无机PCM混合而成，复合相变储热材料既能有效克服单一的无机物或有机物相变储热材料存在的缺点，又可以改善相变材料的应用效果以及拓展其应用范围。因此，研制复合相变储热材料已成为储热材料领域的热点研究课题。但是混合相变材料也可能会带来相变潜热下降，或在长期的相变过程中容易变性等缺点。
在本发明的一实施例中，所述第一隔热层8和第二隔热层9均为隔热泡棉。隔热泡棉不仅可以达到隔热的效果，还可以保护面板1和后壳4在使用过程中的安全，因为隔热泡棉具有一定的缓冲作用，面板1和后壳4在使用过程中遭受到外部冲击的时候，外部的作用力通过面板1和后壳4传递到隔热泡棉上，通过隔热泡棉进行缓冲、分散，可有效保护面板1和后壳4及终端内部元器件的安全。
如图9所示，在本发明的实施例中，所述主板3与所述主板支撑构件2之间具有隔热间隙11。优选的，所述隔热间隙11不小于1mm。通过在主板支撑构件2与主板3之间设置隔热间隙11，减少主板3与主板支撑构件2的直接接触面积，进一步减少由主板3传递到主板支撑构件2上的热量，并配合导热层6引导主板3上的热量朝向远离主板支撑构件2的一侧转移。所述的远离主板支撑构件2的一侧是指设置后壳4的位置。
如图9所示，在本发明的一实施例中，所述导热层6固定在所述芯片5上。过将导热层6固定在芯片5上，可以在芯片5发热的同时迅速的吸收热量，并发生物理变形，填充满芯片5的表面的各个角落。
本发明的“第一”、“第二”等等，仅仅用于在描述上加以区分，并没有特殊的含义。
以上结合具体实施例描述了本发明的技术原理。这些描述只是为了解释本发明的原理，而不能以任何方式解释为对本发明保护范围的限制。基于此处的解释，本领域的技术人员不需要付出创造性的劳动即可联想到本发明的其它具体实施方式，这些方式都将落入本发明的保护范围之内。
Claims (20)
- 一种移动终端，其包括用于安装芯片的主板、主板支撑构件和后壳，所述后壳设置于所述芯片远离所述主板的一侧，所述芯片与所述后壳之间设置导热层，所述后壳与所述导热层之间设置第一散热层，所述第一散热层与所述后壳之间设置第一隔热层；所述第一散热层的尺寸与所述后壳的尺寸相匹配；所述主板支撑构件靠近所述主板的一侧设置有第二隔热层。
- 根据权利要求1所述的移动终端，其中所述主板与所述第二隔热层之间设置第二散热层。
- 一种移动终端，其包括用于安装芯片的主板、主板支撑构件和后壳，所述后壳设置于所述芯片远离所述主板的一侧，所述芯片与所述后壳之间设置导热层，所述后壳与所述导热层之间设置第一散热层，所述第一散热层与所述后壳之间设置第一隔热层。
- 根据权利要求3所述的移动终端，其中所述第一散热层的尺寸与所述后壳的尺寸相匹配。
- 根据权利要求3所述的移动终端，其中在所述第一散热层与所述后壳之间对应所述芯片的位置设置所述第一隔热层。
- 根据权利要求3所述的移动终端，其中所述第一隔热层布满所述后壳靠近所述芯片的一侧面。
- 根据权利要求3所述的移动终端，其中所述主板支撑构件靠近所述主板的一侧设置第二隔热层。
- 根据权利要求7所述的移动终端，其中所述第二隔热层布满所述主板支撑构件靠近所述主板的一侧面。
- 根据权利要求7所述的移动终端，其中所述第二隔热层布满远离所述主板的一侧面。
- 根据权利要求7所述的移动终端，其中所述主板与所述第二隔热层之间设置有第二散热层。
- 根据权利要求10所述的移动终端，其中所述第二散热层为石墨散热层、铜箔散热层以及铝合金散热层中的至少一种。
- 根据权利要求7所述的移动终端，其中所述第二隔热层为隔热泡棉。
- 根据权利要求3所述的移动终端，其中所述主板支撑构件远离所述主板的一侧设置有第二隔热层。
- 根据权利要求3所述的移动终端，其中所述第一散热层为石墨散热层、铜箔散热层以及铝合金散热层中的至少一种。
- 根据权利要求3所述的移动终端，其中所述第一隔热层为隔热泡棉。
- 根据权利要求3所述的移动终端，其中所述导热层为相变材料层。
- 根据权利要求3所述的移动终端，其中所述后壳采用不锈钢制成。
- 根据权利要求3所述的移动终端，其中所述主板支撑构件采用不锈钢制成。
- 根据权利要求3所述的移动终端，其中所述主板与所述主板支撑构件之间具有隔热间隙。
- 一种对权利要求3所述的移动终端散热的方法，其中通过在后壳与芯片之间设置导热层，并在导热层与后壳之间依次设置散热层和隔热层，当移动终端的芯片发热后，热量通过导热层向散热层传递，以降低所述移动终端的热量。
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| CN113380283A (zh) * | 2021-06-09 | 2021-09-10 | 西安交通大学 | 一种m2固态硬盘散热贴 |
| DE102022119665A1 (de) | 2022-08-04 | 2024-02-15 | Ruag Ammotec Ag | Werkstückträger für eine automatisierte Fertigungslinie für Munition mit wenigstens zwei Munitionsteilen |
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| CN105072868B (zh) | 2018-04-27 |
| CN105072868A (zh) | 2015-11-18 |
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