WO2017008564A1 - 一种电子装置的散热结构组件及电子装置 - Google Patents
一种电子装置的散热结构组件及电子装置 Download PDFInfo
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- WO2017008564A1 WO2017008564A1 PCT/CN2016/081626 CN2016081626W WO2017008564A1 WO 2017008564 A1 WO2017008564 A1 WO 2017008564A1 CN 2016081626 W CN2016081626 W CN 2016081626W WO 2017008564 A1 WO2017008564 A1 WO 2017008564A1
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- heat
- main board
- electronic device
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Definitions
- the present invention relates to the field of electronics, and in particular to a heat dissipation structure assembly and an electronic device of an electronic device.
- One of the objects of the present invention is to provide a heat dissipation structure assembly for an electronic device that can automatically transfer heat of a first region of a relatively high temperature of the main board to a second region of relatively low temperature.
- Another object of the present invention is to provide an electronic device including the above heat dissipating structure assembly, which can automatically transfer heat of a relatively high temperature region of the electronic device to a relatively low temperature region.
- the present invention provides a heat dissipation structure assembly for an electronic device, comprising at least a main board for mounting a chip and a main board supporting member, the main board including a first area having a relatively high temperature and a second area having a relatively low temperature, the heat dissipation
- the structural component further includes a heat conducting portion disposed on the main board for transferring heat to the second region, the heat conducting portion including a heat conducting channel disposed on the main board.
- the heat conduction channel includes a heat conduction hole formed on the main board, and the heat conduction hole includes a first heat conduction hole located in the first area and a second heat conduction hole located in the second area.
- the heat conducting portion further includes a heat conducting layer connecting the first heat conducting hole and the second heat conducting hole.
- the heat conducting portion includes a heat conducting layer disposed on the main board, and the heat conducting layer is configured to connect the first area and the second area on the main board.
- the heat dissipation structure assembly further includes a heat conductive material disposed between the main board and the main board support member.
- the heat conductive material is disposed at a position corresponding to the first area and the second area between the main board and the main board supporting member.
- the heat conductive material uses a phase change material.
- the present invention also provides a heat dissipation structure assembly for an electronic device, comprising at least a main board for mounting a chip and a main board supporting member, the main board including a first area having a relatively high temperature and a second area having a relatively low temperature,
- the heat dissipation structure assembly further includes a heat conducting portion disposed on the main board for transferring heat to the second region to the second region.
- the heat conducting portion includes a heat conducting channel disposed on the main board.
- the heat conduction channel includes a heat conduction hole formed on the main board, and the heat conduction hole includes a first heat conduction hole located in the first area and a second heat conduction hole located in the second area.
- the heat conducting portion further includes a heat conducting layer connecting the first heat conducting hole and the second heat conducting hole.
- the heat conducting portion includes a heat conducting layer disposed on the main board, and the heat conducting layer is configured to connect the first area and the second area on the main board.
- the heat dissipation structure assembly further includes a heat conductive material disposed between the main board and the main board support member.
- the heat conductive material is disposed at a position corresponding to the first area and the second area between the main board and the main board supporting member.
- the heat conductive material uses a phase change material.
- an electronic device including a heat dissipation structure assembly including at least a main board for mounting a chip and a main board supporting member, the main board including a first region having a relatively high temperature and a temperature The relatively low second region further includes a heat conducting portion disposed on the main board for transferring heat to the second region to the second region.
- the heat conducting portion includes a heat conducting channel disposed on the main board.
- the heat conduction channel includes a heat conduction hole formed on the main board, and the heat conduction hole includes a first heat conduction hole located in the first area and a second heat conduction hole located in the second area.
- the electronic device further includes a panel assembly and a housing assembly, wherein the main board is disposed on one side of the main board supporting member, and the panel assembly is disposed on the other side of the main board supporting member opposite to the main board, The housing assembly is disposed on the other side of the main board opposite to the main board supporting member.
- a heat conductive material is disposed between the main board supporting member and the panel assembly.
- the main board since the electronic device is at least in operation, the main board includes at least a first region having a relatively high temperature and a second region having a relatively low temperature, so that heat is disposed on the main board for different temperature regions. And transmitting, by the heat conducting portion, the heat of the first region having a relatively high temperature on the main board to the second region having a relatively low temperature, so that the heat distribution on the main board is uniform.
- the electronic device of the present invention introduces the above-mentioned heat dissipating structure component, so that the heat of the relatively high temperature region of the electronic device can be automatically transmitted to the relatively low temperature region, and the local high temperature of the electronic device can be reduced to avoid affecting the user. And system performance to improve the user experience.
- FIG. 1 is a schematic structural diagram of a mobile phone according to an embodiment of the present invention.
- FIG. 2 is a cross-sectional view of a mobile phone according to an embodiment of the present invention.
- FIG. 3 is a cross-sectional view of a main board of a mobile phone according to an embodiment of the present invention.
- FIG. 4 is a cross-sectional view of a main board of a mobile phone according to another embodiment of the present invention.
- FIG. 5 is a cross-sectional view of a main board of a mobile phone according to another embodiment of the present invention.
- FIG. 6 is a cross-sectional view of a main board of a mobile phone according to another embodiment of the present invention.
- 100 a first heat conduction hole
- 200 a second heat conduction hole
- 300 a heat conduction layer.
- Embodiments of the present invention provide a heat dissipation structure assembly for an electronic device, comprising at least a motherboard for mounting a chip and a motherboard supporting member, the motherboard includes a first region having a relatively high temperature and a second region having a relatively low temperature, and the heat dissipation structure
- the assembly also includes a heat transfer portion disposed on the main board for transferring heat to the second region from the first region.
- a heat conducting portion is disposed on the heat dissipating structural component for different temperature regions, and the heat transfer portion transfers heat of the first region having a relatively high temperature on the main board to the second region having a relatively low temperature, thereby uniformly distributing heat on the main board.
- the heat conducting portion includes a heat conducting channel disposed on the main board.
- the heat in the relatively high temperature area of the main board transfers heat to the relatively low temperature area to reduce the high temperature of a certain area of the main board, so that the temperature of the entire main board is consistent.
- the heat conduction channel includes a heat conduction hole formed on the main board, and the heat conduction hole includes a first heat conduction hole located in the first area and a second heat conduction hole located in the second area.
- the heat of the first region and the second region respectively transfers heat to the periphery of the heat conducting hole through the first heat conducting hole and the second heat conducting hole.
- the chip may be mounted on one side of the main board, or the chip may be mounted on both sides of the main board.
- the chips in the electronic device are stacked on the main board by a POP process.
- the first area refers to the main board and the electronic device.
- the chip corresponds to the area, and the second area is all areas except the first area of the main board; and in another embodiment, the chips in the electronic device can be individually mounted on the main board, or a set of two chips or even A set of three chips is stacked on the main board by a POP process, and a gap may be left between the chips and/or the chip sets without leaving a gap.
- the power of the chip mounted on the motherboard is proportional to the amount of heat generated and the temperature of the corresponding motherboard.
- the motherboard corresponding to the chip and/or the chipset is divided by the temperature gradient.
- the main board is divided into the first area and the second area according to the temperature gradient, and when three sets of chips or chipsets with different heat generation are installed on one side of the main board, The main board is divided into a first area, a second area, and a third area according to a temperature gradient.
- the temperature gradient division of the main board is analogized.
- the temperature gradient of the main board is divided according to the heat generation amount of each chip or chip set, and the division manner is similar to the division manner of the main board of the single-sided mounting chip described above. This will not be repeated here.
- the electronic device includes an electronic product such as a mobile phone, a tablet, a learning machine, etc.
- an electronic product such as a mobile phone, a tablet, a learning machine, etc.
- the above technical solution is further described by taking a heat dissipating structural component of the mobile phone as an example.
- FIG. 1 is a schematic view of a mobile phone having the above-described heat dissipation structure assembly according to an embodiment of the present invention.
- the main board 10 of the heat dissipation structure assembly has three sets of chips mounted on one side, respectively, a PMU chip 11 , a CPU/LPDDR3 chip 12 , and an eMMC chip 13 .
- the CPU/LPDDR 3 chip 12 is located on the PMU chip 11 and the eMMC chip 13 . between.
- the function of the CPU/LPDDR3 chip 12 is to handle the communication requirements of each module and the CPU data transfer.
- the CPU/LPDDR3 chip 12 refers to the CPU chip and the LPDDR3 chip stacked by the POP process, and the heat generation thereof is very large, corresponding to the motherboard 10
- the temperature of the corresponding region is also relatively high, that is, the first region having a relatively high temperature
- the function of the PMU chip 11 is to supply power to the entire system of the electronic device and each module, and the power consumption is relatively large, and the heat generation thereof is correspondingly Larger, the temperature of the corresponding area of the corresponding main board 10 is relatively lower than the temperature of the first area, that is, the second area where the temperature is relatively low
- the function of the eMMC chip 13 is to store user data and various programs. The power consumption is lower, and the heat generation amount is correspondingly smaller.
- the temperature of the corresponding area of the corresponding main board 10 is relatively lower than the temperature of the second area.
- the third area is named, and the temperature of the three areas is in the order of : First Area > Second Area > Third Area, correspondingly, the first area of the main board is located between the second area and the third area.
- the heat distribution on the main board is achieved by providing a heat conduction portion that can transfer heat to the first region to the second region, the third region, and/or the second region to the third region.
- the CPU/LPDDR3 chip 12 and the PMU chip 11 installed on the mobile phone motherboard correspond to the first area and the second area of the main board as an example.
- the CPU and LPDDR3 chips are stacked to form a CPU/LPDDR3 chip 12, and the lateral heat dissipation speed along the motherboard surface during operation is lower than the longitudinal heat dissipation speed perpendicular to the motherboard surface, thereby causing the CPU/LPDDR3 chip 12 to be located.
- the local temperature is too high, which in turn affects user performance and overall system performance. Therefore, the present embodiment proposes the following solution to this problem.
- the first heat conduction hole 100 is disposed in the first area along a direction perpendicular to the board surface of the main board, and the second board area is disposed in the second area along a direction perpendicular to the board surface.
- the heat conduction hole 200, the heat of the first region is quickly transmitted to the periphery of the first heat conduction hole 100 through the first heat conduction hole 100, and the heat of the second region is quickly transmitted to the periphery of the second heat conduction hole 200 through the second heat conduction hole 200.
- the heat conducting hole in this embodiment may be a metallized heat conducting hole or a heat conducting hole filled with a phase change material. It should be understood that the direction in which the heat conducting holes are disposed is not limited to the direction perpendicular to the board surface.
- the heat conducting portion further includes a heat conducting layer 300 connecting the first heat conducting hole 100 and the second heat conducting hole 200.
- a heat conducting layer 300 is disposed between the first heat conducting hole 100 and the second heat conducting hole 200 for communicating the first heat conducting hole 100 and the second heat conducting hole 200, that is, the first heat conducting hole 100 is passed through the heat conducting layer 300.
- the heat is transferred to the second heat conduction hole 200, and the heat diffusion speed of the first region having a relatively high temperature is accelerated, so that the temperatures of the first region and the second region are quickly consistent.
- a heat conducting layer shown in FIG.
- the heat conducting layer 300 is disposed between the boards of the main board.
- the heat conducting layer may be disposed at the bottom of the main board, and the bottom of the first heat conducting hole and the second heat conducting hole extend to the main board. The position of the thermally conductive layer at the bottom can also achieve the efficacy of the present invention.
- the heat dissipation path of the main board in the heat dissipation structure assembly is: heat is longitudinally transmitted from the first area through the first heat conduction hole 100 to one side of the main board opposite to the chip, and is laterally transmitted through the heat conduction layer 300 connected to the second heat conduction hole 200. The second region where the second heat conduction hole 200 is located.
- the thermally conductive portion includes a thermally conductive layer disposed on the main board for connecting the first region and the second region on the main board.
- the main board in this embodiment is a multi-layer PCB board.
- the heat conductive layer 300 is disposed on the surface of the PCB board between the first area and the second area, and the heat conductive layer 300 may be covered on the PCB board surface ( Referring to FIG. 6 ), a heat conductive layer may be disposed between the boards of the PCB board corresponding to the position between the first area and the second area, and the heat conductive layer 300 is preferably a copper layer, or may be other suitable for connecting the PCB board and conducting heat. Good performance materials. Heat from the first region is transferred to the second region through the thermally conductive layer 300 to reduce localized high temperatures in the first region.
- the heat dissipation path of the main board in the heat dissipation structure assembly is: heat is transferred from the first area to the second area through the PCB board surface or the heat conduction layer 300 disposed between the boards, and the heat of all the first area and the second area is longitudinally transmitted to The other side of the main board 10 is opposite to the CPU/LPDDR3 chip 12 and the PMU chip 11.
- the heat dissipation structure assembly in another embodiment of the present invention further includes a heat conductive material disposed between the main board and the main board support member. As shown in FIG. 2, heat is transmitted to the other side of the main board 10 opposite to the PMU chip 11 and the CPU/LPDDR3 chip 12 through the heat conducting portion, and then further transmitted to the main board supporting member 20 through the heat conducting material for heat dissipation.
- the thermally conductive material is disposed at a position corresponding to the chip between the main board and the main board supporting member.
- the thermally conductive material is provided only at the position corresponding to the chip between the main board and the main board supporting member.
- the material cost of the heat dissipating structural component can be reduced while ensuring good thermal conductivity.
- a position corresponding to the CPU/LPDDR3 chip 12 between the main board 10 and the main board supporting member 20 is provided with a first heat conductive material 51, and a position setting corresponding to the PMU chip 11 between the main board 10 and the main board supporting member 20 is provided.
- the second heat conductive material 52 is provided.
- phase change material (PCM - Phase Change Material refers to a substance that changes its physical properties as it changes in temperature and provides latent heat. The process of transforming physical properties is called a phase change process, in which case the phase change material will absorb or release a large amount of latent heat.
- the corresponding first phase change material and the second phase change material undergo a phase transition from a solid state to a liquid phase.
- the first phase change material and the second phase change material will fill all the gaps between the main board 10 and the main board support member 20, thereby making the heat transfer efficiency higher.
- An embodiment of the present invention further provides an electronic device, including any one of the above heat dissipation structure components, further comprising a panel assembly and a housing assembly, wherein the main board is disposed on one side of the main board support member, and the panel assembly is disposed on the main board support On the other side of the member opposite to the main board, the housing assembly is disposed on the other side of the main board opposite to the main board supporting member.
- the mobile phone includes a panel assembly 30 and a housing assembly 40.
- the main board 10 is disposed on one side of the main board supporting member 20, and the panel assembly 30 is disposed on the main board supporting member 20 opposite to the main board 10.
- the housing assembly 40 is disposed on the other side of the main board 10 opposite to the main board support member 20.
- a heat conductive material is disposed between the main board support member and the panel assembly.
- the heat is transmitted to the main board supporting member through the heat dissipating structure assembly, and then transmitted to the panel assembly through the heat conducting material, that is, the heat generated by the chip on the main board is transmitted and diffused to the surface of the electronic device through the heat dissipating structure assembly and the heat conducting material.
- heat exchange with the external environment through the air is finally performed to rapidly lower the temperature of the entire electronic device.
- a third heat conductive material 53 is disposed between the panel assembly 30 and the main board support member 20.
- the third heat conductive material 53 is a material having good heat conductivity, such as graphite or copper foil. Of course, the above phase change material may also be selected.
- the above electronic device further includes a shielding assembly.
- the shielding assembly 60 is disposed between the housing assembly 40 and the main board 10. Specifically, the shielding assembly 60 is disposed at a position corresponding to the chip between the housing assembly 40 and the main board 10.
- the shielding assembly 60 is preferably A shield that acts to prevent the chip from being disturbed or to prevent the chip from interfering with other functional modules in the electronic device.
- the heat dissipation path of the electronic device of the embodiment of the present invention is as shown by the arrow in FIG. 2: the heat is transmitted laterally from the first region of the relatively high temperature main board 10 to the second region through the heat dissipation portion, and simultaneously passes through the first heat conductive material, 51
- the two heat conductive materials 52 are longitudinally transferred to the main board 10, transferred to the panel assembly 30 through the third heat conductive material 53, and finally exchanged heat with the external environment.
- the housing assembly may be made of metal, plastic or the like.
- the above motherboard can be a PCB board or an FPC board.
- the above-mentioned main board supporting member refers to a middle frame for supporting the main board, and has good thermal conductivity, and may be made of stainless steel, aluminum alloy, magnesium aluminum alloy or magnesium alloy.
- the above panel component refers to an LCD display or a TP touch screen of an electronic device.
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Abstract
本发明公开了一种电子装置的散热结构组件及电子装置，至少包括用于安装芯片的主板以及主板支撑构件，主板包括温度相对较高的第一区域以及温度相对较低的第二区域，散热结构组件还包括设于主板上的可供第一区域向第二区域传递热量的导热部。针对不同温度区域在主板上设置导热部，通过该导热部将主板上温度相对较高的第一区域的热量传递给温度相对较低的第二区域，从而使主板上的热量分布均匀。
Description
本发明涉及电子领域，具体涉及一种电子装置的散热结构组件及电子装置。
随着电子装置中芯片的发展，电子装置的功能越来越强大，相应的电子装置的功耗也越来越大。芯片运行时产生的高功耗直接导致芯片所在区域的温度急剧升高，同时，由于缺乏良好的散热装置，使存储于电子装置内的热量散发速度慢，导致电子装置中的芯片所在区域的温度居高不下。
为了紧跟芯片的发展步伐，亟需设计一种散热效果优良的散热装置，以快速降低电子装置中高温区域的热量，使电子装置的整机温度分布均匀。
本发明的目的之一在于提供一种电子装置的散热结构组件，该散热结构组件能够自动将主板的温度相对较高的第一区域的热量传递给温度相对较低的第二区域。
本发明的目的之二在于提供一种包含上述散热结构组件的电子装置，可以实现将电子装置的温度相对较高的区域的热量自动传递给温度相对较低的区域。
本发明提供一种电子装置的散热结构组件，至少包括用于安装芯片的主板以及主板支撑构件，所述主板包括温度相对较高的第一区域以及温度相对较低的第二区域，所述散热结构组件还包括设于所述主板上的可供第一区域向第二区域传递热量的导热部，所述导热部包括设置于所述主板上的导热通道。
所述导热通道包括开设于所述主板上的导热孔，所述导热孔包括位于第一区域的第一导热孔、位于第二区域的第二导热孔。
所述导热部还包括连接所述第一导热孔与所述第二导热孔之间的导热层。
所述导热部包括设置于所述主板上的导热层，所述导热层用于连接所述主板上的所述第一区域和所述第二区域。
所述散热结构组件还包括设置于所述主板与所述主板支撑构件之间的导热材料。
所述导热材料设于所述主板与所述主板支撑构件之间的对应于所述第一区域、所述第二区域的位置。
所述导热材料采用相变材料。
本发明还提供一种电子装置的散热结构组件，至少包括用于安装芯片的主板以及主板支撑构件，所述主板包括温度相对较高的第一区域以及温度相对较低的第二区域，所述散热结构组件还包括设于所述主板上的可供第一区域向第二区域传递热量的导热部。
所述导热部包括设置于所述主板上的导热通道。
所述导热通道包括开设于所述主板上的导热孔，所述导热孔包括位于第一区域的第一导热孔、位于第二区域的第二导热孔。
所述导热部还包括连接所述第一导热孔与所述第二导热孔之间的导热层。
所述导热部包括设置于所述主板上的导热层，所述导热层用于连接所述主板上的所述第一区域和所述第二区域。
所述散热结构组件还包括设置于所述主板与所述主板支撑构件之间的导热材料。
所述导热材料设于所述主板与所述主板支撑构件之间的对应于所述第一区域、所述第二区域的位置。
所述导热材料采用相变材料。
依据本发明的上述目的，提供一种电子装置，该电子装置包括一散热结构组件，其至少包括用于安装芯片的主板以及主板支撑构件，所述主板包括温度相对较高的第一区域以及温度相对较低的第二区域，所述散热结构组件还包括设于所述主板上的可供第一区域向第二区域传递热量的导热部。
所述导热部包括设置于所述主板上的导热通道。
所述导热通道包括开设于所述主板上的导热孔，所述导热孔包括位于第一区域的第一导热孔、位于第二区域的第二导热孔。
所述电子装置还包括面板组件和壳体组件，其中，所述主板设置于所述主板支撑构件的一侧，所述面板组件设置于所述主板支撑构件与所述主板相对的另一侧，所述壳体组件设置于所述主板与所述主板支撑构件相对的另一侧。
所述主板支撑构件与所述面板组件之间设置导热材料。
本发明的电子装置的散热结构组件中，由于电子装置处于工作状态时，主板至少包括温度相对较高的第一区域以及温度相对较低的第二区域，因此针对不同温度区域在主板上设置导热部，通过该导热部将主板上温度相对较高的第一区域的热量传递给温度相对较低的第二区域，从而使主板上的热量分布均匀。此外，本发明的电子装置引入了上述散热结构组件，故可以实现将电子装置的温度相对较高的区域的热量自动传递给温度相对较低的区域，降低电子装置的局部高温，避免影响用户使用和系统性能，改善用户体验。
图1是本发明实施例所述手机的结构示意图;
图2是本发明实施例所述手机的剖视图;
图3是本发明一实施例所述手机的主板剖视图;
图4是本发明另一实施例所述手机的主板剖视图;
图5是本发明另一实施例所述手机的主板剖视图;
图6是本发明另一实施例所述手机的主板剖视图。
图中：
10、主板；11、PMU芯片；12、CPU/LPDDR3芯片；13、eMMC芯片；20、主板支撑构件；30、面板组件；40、壳体组件；51、第一导热材料；52、第二导热材料；53、第三导热材料；60、屏蔽组件；
100、第一导热孔；200、第二导热孔；300、导热层。
下面结合附图并通过具体实施方式来进一步说明本发明的技术方案。
本发明的实施例提供一种电子装置的散热结构组件，至少包括用于安装芯片的主板以及主板支撑构件，主板包括温度相对较高的第一区域以及温度相对较低的第二区域，散热结构组件还包括设于主板上的可供第一区域向第二区域传递热量的导热部。针对不同温度区域在散热结构组件上设置导热部，通过该导热部将主板上温度相对较高的第一区域的热量传递给温度相对较低的第二区域，从而使主板上的热量分布均匀。
具体地，上述导热部包括设置于主板上的导热通道。主板上的温度相对较高的区域的热量通过该导热通道将热量传递给温度相对较低的区域，以降低主板某一区域的高温，使整个主板的温度保持一致。
更具体地，导热通道包括开设于主板上的导热孔，导热孔包括位于第一区域的第一导热孔、位于第二区域的第二导热孔。第一区域、第二区域的热量分别通过第一导热孔、第二导热孔将热量快速传递至导热孔的周围。
上述实施例中，可以在主板的单面安装芯片，也可以在主板的双面均安装芯片。
作为在主板的单面安装芯片的一种实施方式，电子装置内的所有芯片通过POP工艺叠置安装于主板上，该电子装置内的散热结构组件中，第一区域指的是主板与电子装置的芯片对应的区域，而第二区域是主板除了第一区域以外的所有区域；而在另一种实施方式中，电子装置内的芯片可以单个安装于主板上，也可以两个芯片一组甚至三个芯片一组通过POP工艺叠置安装于主板上，芯片和/或芯片组之间可以留有间隙，也可以不留间隙。主板上安装的芯片的功率与发热量大小、对应主板的区域的温度高低成正比，因此根据芯片或者芯片组的功率由大到小将芯片和/芯片组对应的主板的按温度梯度对主板进行划分，当主板单面安装有两组不同发热量的芯片或者芯片组时，按温度梯度将主板划分第一区域、第二区域，当主板单面安装有三组不同发热量的芯片或者芯片组时，按温度梯度将主板划分第一区域、第二区域、第三区域，当主板单面安装有三组以上不同发热量的芯片或者芯片组时，主板的温度梯度划分依次类推。针对主板上每个不同温度的区域在散热结构组件上设置导热部，即可实现将热量从温度相对较高的区域传递至温度相对较低的区域。
作为在主板的双面安装芯片的一种实施方式，根据每一芯片或芯片组的发热量大小对主板的温度梯度进行区域划分，划分方式与上述单面安装芯片的主板的划分方式相似，在此不再赘述。
上述电子装置包括手机、平板、学习机等电子产品，本实施例中以手机的散热结构组件为例对上述技术方案进行进一步说明。
图1是本发明一实施例的具有上述散热结构组件的手机的示意图。如图1所示，其中散热结构组件的主板10的单面安装有三组芯片，分别为PMU芯片11、CPU/LPDDR3芯片12、eMMC芯片13，CPU/LPDDR3芯片12位于PMU芯片11与eMMC芯片13之间。其中CPU/LPDDR3芯片12的功能是处理各个模块的通信需求以及CPU数据传递，CPU/LPDDR3芯片12指的是CPU芯片与LPDDR3芯片通过POP工艺叠置在一起，其发热量非常大，对应主板10的相应区域的温度也比较高，即上述的温度相对较高的第一区域；PMU芯片11的功能是为电子装置的整个系统以及各个模块进行供电，功耗比较大，其发热量也相应地比较大，对应主板10的相应区域的温度与第一区域的温度相比相对较低，即上述的温度相对较低的第二区域；而eMMC芯片13的功能是存储用户数据以及各种程序，其功耗较低，发热量也相应地比较小，对应主板10的相应区域的温度与第二区域的温度相比相对较低，在此命名为第三区域，三个区域的温度高低顺序为：第一区域>第二区域>第三区域，相应地，该主板的第一区域位于第二区域与第三区域之间。本实施例的散热结构组件中，通过设置可供第一区域向第二区域、第三区域，和/或，第二区域向第三区域传递热量的导热部，实现主板上的热量均布。
以下实施例均以上述手机主板上安装的CPU/LPDDR3芯片12以及PMU芯片11对应主板的第一区域、第二区域为例进行说明。
CPU、LPDDR3芯片叠加在一起形成CPU/LPDDR3芯片12，其工作过程中的沿主板板面的横向散热速度低于沿垂直于主板板面的纵向散热速度，从而导致CPU/LPDDR3芯片12所处的局部温度过高，进而影响用户使用和整个系统的性能。因此，本实施例针对该问题提出以下解决方案。
如图3所示，主板上位于第一区域中沿着垂直于主板板面的方向设置了第一导热孔100，主板上位于第二区域中沿着垂直于主板板面的方向设置了第二导热孔200，第一区域的热量通过第一导热孔100快速传递至第一导热孔100的周围，第二区域的热量通过第二导热孔200快速传递至第二导热孔200的周围。本实施例中的导热孔可以是金属化的导热孔，也可以是填充有相变材料的导热孔。需要了解的是，导热孔的设置方向不限于垂直于主板板面的方向。
如图3所示，导热部还包括连接上述第一导热孔100与第二导热孔200的导热层300。本实施例在第一导热孔100与第二导热孔200之间增设了导热层300，用于连通第一导热孔100与第二导热孔200，即通过该导热层300将第一导热孔100的热量传递至第二导热孔200，加快温度相对较高的第一区域的热量的扩散速度，使第一区域与第二区域的温度迅速保持一致。当然，也可以在主板10靠近两端部的位置分别设置导热层（请参考图4所示），使第一区域、第二区域的温度迅速降低并使整个主板10的温度保持一致。本实施例中，导热层300设置于主板的板间，当然，于其他实施例中，导热层还可以设置于主板的底部，同时，第一导热孔和第二导热孔的孔底部延伸至主板的底部的导热层的位置也同样可以实现本发明的功效。
上述散热结构组件中的主板的散热路径为：热量从第一区域通过第一导热孔100纵向传递给与芯片相对的主板的一侧，同时通过与第二导热孔200相连的导热层300横向传递给第二导热孔200所处的第二区域。
于本发明的另一个实施例中，导热部包括设置于主板上的导热层，该导热层用于连接主板上的第一区域和第二区域。如图5所示，本实施例中的主板为多层PCB板，在PCB板表面并位于第一区域与第二区域之间设置导热层300，也可以在PCB板面铺满导热层300（参考图6所示），还可以在PCB板的板间对应第一区域与第二区域之间的位置设置导热层，导热层300优选为铜层，也可以是其他适用于连接PCB板且导热性能良好的材料。第一区域的热量通过该导热层300传递至第二区域，以降低第一区域的局部高温。
该散热结构组件中的主板的散热路径为：热量从第一区域通过PCB板面或板间设置的导热层300横向传递给第二区域，同时所有第一区域、第二区域的热量纵向传递给主板10与CPU/LPDDR3芯片12以及PMU芯片11相对的另一侧。
于本发明的另一个实施例中的散热结构组件还包括设置于主板与主板支撑构件之间的导热材料。如图2所示，热量通过上述导热部传递至主板10与PMU芯片11、CPU/LPDDR3芯片12相对的另一侧之后，再通过该导热材料进一步传递至主板支撑构件20进行散热。
更具体地，导热材料设于主板与主板支撑构件之间的对应于芯片的位置。通过仅在主板与主板支撑构件之间的对应于芯片的位置设置导热材料，在降低散热结构组件的材料成本的同时还可以保证良好的导热性能。如图2所示，主板10与主板支撑构件20之间的对应于CPU/LPDDR3芯片12的位置设置第一导热材料51，主板10与主板支撑构件20之间的对应于PMU芯片11的位置设置第二导热材料52。
现实情况下，受加工工艺的限制，主板以及主板支撑构件之间均不可能达到完全平整，两者相接触的平面之间会形成一定的空隙，该空隙中会存有空气，空气的热阻较大，会降低两者之间的导热效果。因此上述导热材料采用相变材料。相变材料(PCM
- Phase Change
Material)是指随温度变化而改变物理性质并能提供潜热的物质。转变物理性质的过程称为相变过程，这时相变材料将吸收或释放大量的潜热。本实施例中，当第一区域、第二区域的温度升高至相变材料的熔化温度时，对应的第一相变材料、第二相变材料就会产生从固态到液态的相变，当成为液体时，第一相变材料、第二相变材料将填充主板10与主板支撑构件20之间所有的空隙，从而使得导热效率更高。
本发明的实施例还提供一种电子装置，包括上述的散热结构组件中的任意一个，还包括面板组件和壳体组件，其中，主板设置于主板支撑构件的一侧，面板组件设置于主板支撑构件与主板相对的另一侧，壳体组件设置于主板与主板支撑构件相对的另一侧。通过在该电子装置中设置上述散热结构组件，可以实现将电子装置的温度相对较高的区域的热量自动传递给温度相对较低的区域，降低电子装置的局部高温，保证电子装置正常使用，延长电子装置的使用寿命，进而改善用户体验。以手机为例，如图2所示，该手机包括面板组件30和壳体组件40，主板10设置于主板支撑构件20的一侧，面板组件30设置于主板支撑构件20与主板10相对的另一侧，壳体组件40设置于主板10与主板支撑构件20相对的另一侧。
主板支撑构件与面板组件之间设置导热材料。热量通过上述散热结构组件传递至主板支撑构件之后，再通过该导热材料传递至面板组件，也就是说，芯片在主板上产生的热量通过散热结构组件以及该导热材料传递扩散至电子装置的表面，以达到快速降低电子装置的内部某一个温度相对较高的区域的热量的目的，最终再与外部环境通过空气进行热交换，以将整个电子装置的温度迅速降低。如图2所示，在面板组件30与主板支撑构件20之间设置有第三导热材料53。该第三导热材料53为导热性能较好的材料，例如石墨或者铜箔，当然，也可以选择上述的相变材料。
上述电子装置还包括屏蔽组件。如图2所示，屏蔽组件60设置在壳体组件40与主板10之间，具体地，屏蔽组件60设置在壳体组件40与主板10之间的与芯片对应的位置，屏蔽组件60优选为屏蔽罩，其作用使防止芯片受到干扰或者防止芯片干扰电子装置中的其他功能模块。
本发明实施例的电子装置的散热路径如图2中箭头所示：热量通过散热部从温度相对较高的主板10的第一区域横向传递至第二区域，同时通过第一导热材料、51第二导热材料52纵向传递至主板10，再通过第三导热材料53传递至面板组件30，最后与外部环境进行热交换。
上述壳体组件可以为金属、塑料等材质。上述主板可以为PCB板、FPC板。上述主板支撑构件指的是用来支撑主板的中框，具有良好的导热性能，可以是不锈钢、铝合金、镁铝合金或者镁合金等材质。上述面板组件指的是电子装置的LCD显示屏或者TP触摸屏。
以上内容仅为本发明的较佳实施例，对于本领域的普通技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，本说明书内容不应理解为对本发明的限制。
Claims (20)
- 一种电子装置的散热结构组件，其至少包括用于安装芯片的主板以及主板支撑构件，所述主板包括温度相对较高的第一区域以及温度相对较低的第二区域，所述散热结构组件还包括设于所述主板上的可供第一区域向第二区域传递热量的导热部，所述导热部包括设置于所述主板上的导热通道。
- 根据权利要求1所述的电子装置的散热结构组件，其中所述导热通道包括开设于所述主板上的导热孔，所述导热孔包括位于第一区域的第一导热孔、位于第二区域的第二导热孔。
- 根据权利要求2所述的电子装置的散热结构组件，其中所述导热部还包括连接所述第一导热孔与所述第二导热孔之间的导热层。
- 根据权利要求1所述的电子装置的散热结构组件，其中所述导热部包括设置于所述主板上的导热层，所述导热层用于连接所述主板上的所述第一区域和所述第二区域。
- 根据权利要求1所述的电子装置的散热结构组件，其中所述散热结构组件还包括设置于所述主板与所述主板支撑构件之间的导热材料。
- 根据权利要求5所述的电子装置的散热结构组件，其中所述导热材料设于所述主板与所述主板支撑构件之间的对应于所述第一区域、所述第二区域的位置。
- 根据权利要求6所述的电子装置的散热结构组件，其中所述导热材料采用相变材料。
- 一种电子装置的散热结构组件，其至少包括用于安装芯片的主板以及主板支撑构件，所述主板包括温度相对较高的第一区域以及温度相对较低的第二区域，所述散热结构组件还包括设于所述主板上的可供第一区域向第二区域传递热量的导热部。
- 根据权利要求8所述的电子装置的散热结构组件，其中所述导热部包括设置于所述主板上的导热通道。
- 根据权利要求9所述的电子装置的散热结构组件，其中所述导热通道包括开设于所述主板上的导热孔，所述导热孔包括位于第一区域的第一导热孔、位于第二区域的第二导热孔。
- 根据权利要求10所述的电子装置的散热结构组件，其中所述导热部还包括连接所述第一导热孔与所述第二导热孔之间的导热层。
- 根据权利要求9所述的电子装置的散热结构组件，其中所述导热部包括设置于所述主板上的导热层，所述导热层用于连接所述主板上的所述第一区域和所述第二区域。
- 根据权利要求9所述的电子装置的散热结构组件，其中所述散热结构组件还包括设置于所述主板与所述主板支撑构件之间的导热材料。
- 根据权利要求13所述的电子装置的散热结构组件，其中所述导热材料设于所述主板与所述主板支撑构件之间的对应于所述第一区域、所述第二区域的位置。
- 根据权利要求14所述的电子装置的散热结构组件，其中所述导热材料采用相变材料。
- 一种电子装置，其包括一散热结构组件，其至少包括用于安装芯片的主板以及主板支撑构件，所述主板包括温度相对较高的第一区域以及温度相对较低的第二区域，所述散热结构组件还包括设于所述主板上的可供第一区域向第二区域传递热量的导热部。
- 根据权利要求16所述的电子装置，其中所述导热部包括设置于所述主板上的导热通道。
- 根据权利要求17所述的电子装置，其中所述导热通道包括开设于所述主板上的导热孔，所述导热孔包括位于第一区域的第一导热孔、位于第二区域的第二导热孔。
- 根据权利要求18所述的电子装置，其还包括面板组件和壳体组件，其中，所述主板设置于所述主板支撑构件的一侧，所述面板组件设置于所述主板支撑构件与所述主板相对的另一侧，所述壳体组件设置于所述主板与所述主板支撑构件相对的另一侧。
- 根据权利要求19所述的电子装置，其中所述主板支撑构件与所述面板组件之间设置导热材料。
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109814682A (zh) * | 2019-01-30 | 2019-05-28 | 合肥陆通智能科技有限公司 | 一种全方位多功能防护主板 |
| CN112639671A (zh) * | 2018-09-14 | 2021-04-09 | 深圳市柔宇科技股份有限公司 | 电子装置 |
| CN113692154A (zh) * | 2021-07-23 | 2021-11-23 | 维沃移动通信（杭州）有限公司 | 电子设备 |
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| CN105050361A (zh) * | 2015-07-14 | 2015-11-11 | 广东欧珀移动通信有限公司 | 一种电子装置的散热结构组件及电子装置 |
| CN105824378B (zh) * | 2016-03-14 | 2020-10-27 | 联想(北京)有限公司 | 一种调整方法及电子设备 |
| WO2018090554A1 (zh) * | 2016-11-15 | 2018-05-24 | 华为技术有限公司 | 一种终端 |
| CN107741776A (zh) * | 2017-10-25 | 2018-02-27 | 南宁恒腾科技有限公司 | 一种计算机微处理器降温装置 |
| CN110086723B (zh) * | 2019-04-25 | 2022-01-25 | 新华三技术有限公司 | 一种路由器 |
| CN111698895A (zh) * | 2020-07-17 | 2020-09-22 | 珠海格力电器股份有限公司 | 散热结构及移动终端 |
| CN114554784A (zh) * | 2020-11-26 | 2022-05-27 | 华为技术有限公司 | 电子设备 |
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