WO2017008559A1 - 一种主板散热结构及移动终端 - Google Patents

一种主板散热结构及移动终端 Download PDF

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Publication number
WO2017008559A1
WO2017008559A1 PCT/CN2016/081490 CN2016081490W WO2017008559A1 WO 2017008559 A1 WO2017008559 A1 WO 2017008559A1 CN 2016081490 W CN2016081490 W CN 2016081490W WO 2017008559 A1 WO2017008559 A1 WO 2017008559A1
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Prior art keywords
heat dissipation
heat
cpu
heat pipe
dissipation structure
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PCT/CN2016/081490
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English (en)
French (fr)
Inventor
周辉煌
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广东欧珀移动通信有限公司
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Publication of WO2017008559A1 publication Critical patent/WO2017008559A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to the field of terminal heat dissipation technologies, and in particular, to a motherboard heat dissipation structure and a mobile terminal, and further relates to a motherboard heat dissipation structure and a mobile phone.
  • the mobile phone is one of the most widely used communication terminals, and the mobile phone is favored and fully popularized by its features such as light weight, simple operation and comprehensive functions.
  • Mobile phones are mobile terminals, which are small in size, but people have high demands on the functions and processing capabilities of mobile phones. Therefore, the integration level of mobile phones is getting higher and higher, and the CPU core of mobile phones is also increasing, and the frequency of CPUs is also taller and taller. With such high frequency and performance, the operating temperature of the CPU is getting higher and higher, and the temperature rise of the CPU will seriously affect its working performance. Therefore, the effective heat dissipation of the CPU is very important.
  • An object of the present invention is to provide a heat dissipation structure of a motherboard.
  • the heat generated by the CPU is quickly transferred to the main heat dissipation area, thereby achieving continuous and rapid heat dissipation of the CPU, and effectively reducing the operating temperature of the CPU.
  • An object of the present invention is to provide a heat dissipation structure for a motherboard, which is provided with heat dissipating fins inserted into the fixing bracket on the heat pipe to increase the heat conduction area between the heat pipe and the main heat dissipation region, thereby accelerating heat transfer from the heat pipe to the main heat dissipation region.
  • the efficiency ensures the cooling efficiency of the CPU.
  • An object of the present invention is to provide a heat dissipation structure for a motherboard, which increases the heat transfer area between the heat pipe and the CPU by providing a heat conduction connection member on the heat pipe that matches the shape of the CPU end face, and accelerates the transfer of heat from the CPU to the heat pipe. Effectively ensure the cooling efficiency of the CPU.
  • An object of the present invention is to provide a mobile terminal that can effectively improve the heat dissipation efficiency of the CPU and ensure the continuous and reliable operation of the mobile terminal by providing a heat dissipation structure of the motherboard with the heat pipe in the mobile terminal.
  • a motherboard heat dissipation structure includes a fixing bracket, a main heat dissipation area for controlling a temperature rise of the CPU is disposed in the fixing bracket, and the CPU and the main heat dissipation area are thermally connected through a heat pipe, and one end of the heat pipe is The CPU is connected, and one end of the heat pipe away from the CPU is located in the main heat dissipation zone, and a portion of the heat pipe located in the main heat dissipation zone is provided with heat dissipation fins for increasing a heat conduction area, and the heat dissipation fins Inserted into the fixing bracket; one end of the heat pipe adjacent to the CPU is provided with a heat conducting connector that is attached to the surface of the CPU; and the heat pipe is an electric body power heat pipe.
  • a main board heat dissipation structure includes a fixing bracket, and a main heat dissipating area for controlling a temperature rise of the CPU is disposed in the fixing bracket, and the CPU and the main heat dissipating area are thermally connected through a heat pipe, and one end of the heat pipe is In the CPU connection, one end of the heat pipe away from the CPU is located in the main heat dissipation zone, and a portion of the heat pipe located in the main heat dissipation zone is provided with heat dissipation fins for increasing the heat conduction area, and the heat dissipation fins are inserted. Inside the fixed bracket.
  • a mobile terminal includes the above-mentioned motherboard heat dissipation structure.
  • FIG. 1 is a schematic structural view showing a position of a fixing bracket and a CPU according to an embodiment
  • FIG. 2 is a schematic view of the fixing bracket and the heat pipe assembled according to the embodiment
  • FIG. 3 is a schematic view of the fixing bracket and the nano carbon heat dissipating film according to the embodiment
  • FIG. 4 is a schematic structural view of the heat pipe and the heat conductive connector according to the embodiment.
  • a motherboard heat dissipation structure includes a fixing bracket, and a main heat dissipation area for controlling temperature rise of the CPU 5 is disposed in the fixing bracket, and the CPU 5 and the The main heat dissipating regions are thermally connected to each other through a heat pipe 6 .
  • One end of the heat pipe 6 is connected to the CPU 5 , and one end of the heat pipe 6 away from the CPU 5 is located in the main heat dissipating region, and the heat pipe 6 is located in the main heat dissipating region.
  • a portion of the region is provided with heat dissipating fins 7 for increasing the heat transfer area, and the heat dissipating fins 7 are inserted into the fixing bracket.
  • the heat pipe 6 is a heat transfer element, which fully utilizes the principle of heat conduction and the rapid heat transfer property of the phase change medium, and the heat of the heat generating object is quickly transmitted to the heat source through the heat pipe 6, and the heat conduction capability thereof exceeds the heat conduction of any known metal. ability.
  • the heat pipe 6 may be any one of a core heat pipe, a two-phase closed thermosiphon (also called a gravity heat pipe), a gravity assisted heat pipe, a rotary heat pipe, an electric body power heat pipe, a magnetohydrodynamic heat pipe, and an osmotic heat pipe.
  • the heat pipe 6 is an electric body power heat pipe.
  • the electrohydrodynamic heat pipe has high thermal conductivity and excellent isothermality, and can effectively ensure that the heat of the CPU 5 is quickly and reliably transmitted outward.
  • the current mobile terminal basically only sets the heat dissipation structure for the PCB, that is, the heat generated when the CPU 5 works must be transmitted to the heat dissipation structure through the PCB to achieve heat dissipation. Since the PCB does not have excellent thermal conductivity, the heat dissipation efficiency of the CPU 5 is low, and the CPU 5 is easy. At a higher operating temperature, which affects the performance of the CPU 5 and even shortens the life of the CPU 5, greatly reducing the reliability of the mobile terminal.
  • the heat pipe 6 is disposed to directly connect the CPU 5 to the main heat dissipation area.
  • the heat pipe 6 Since the heat pipe 6 has excellent heat conduction efficiency, the heat dissipation efficiency of the CPU 5 is high, and the CPU 5 is continuously kept at a lower working temperature, thereby improving the CPU 5. The performance and reliability of the work, and effectively extend the life of the CPU5.
  • the overall structure of the heat pipe 6 is small, so the heat conduction area between the heat pipe 6 and the main heat dissipation zone is also small, which affects the heat conduction efficiency between the heat pipe 6 and the main heat dissipation zone to some extent.
  • the heat transfer area between the heat pipe 6 and the main heat dissipating area is increased, and the efficiency of transferring heat from the heat pipe 6 to the main heat dissipating area is accelerated, thereby effectively ensuring the heat dissipating efficiency of the CPU 5.
  • the heat pipe 6 is disposed near one end of the CPU 5 with a heat conducting connector 8 attached to the surface of the CPU 5.
  • the heat conducting connector 8 is a copper or aluminum sheet having a shape conforming to the shape of the end surface of the CPU 5.
  • One end of the heat conducting connector 8 is soldered to the heat pipe 6, and the other end of the heat conducting connector 8 is connected to the CPU 5.
  • the end faces are connected by a thermal paste.
  • the shape of the end surface of the CPU 5 is a rectangle
  • the heat conducting connector 8 is also rectangular
  • the heat conducting connector 8 is a copper skin.
  • the CPU 5 may be circular
  • the thermally conductive connector 8 is circular
  • the thermally conductive connector 8 is an aluminum sheet.
  • the thermal conductive adhesive has excellent thermal conductivity, can provide a high guaranteed heat dissipation coefficient for the components, and ensures the stability of the components with large heat generation during use, thereby improving the performance and life of the components;
  • the thermal conductive adhesive also has superior electrical properties, aging resistance, cold and heat exchange resistance, and increases the safety factor of the mobile terminal during use.
  • the thermal conductive adhesive adopts any one of a silicone thermal conductive adhesive, an epoxy resin AB adhesive, a polyurethane adhesive, and a polyurethane thermal conductive adhesive.
  • the thermal conductive adhesive is a silicone thermal conductive adhesive.
  • the heat-conductive area of the CPU 5 is fully utilized, thereby increasing the heat pipe 6 and the CPU 5.
  • the heat transfer area between them accelerates the transfer of heat from the CPU 5 to the heat pipe 6.
  • the heat conducting connector 8 is a relatively hard material, so even if the surface of the heat conducting connector 8 is flat, there is still a gap between the heat conducting connector 8 and the end face of the CPU 5, thereby affecting the CPU 5. The heat transfer efficiency with the heat pipe 6.
  • the thermal conductive adhesive is disposed between the heat conducting connector 8 and the end surface of the CPU 5 for sufficiently filling a gap between the heat conducting connector 8 and the end surface of the CPU 5, so that the The heat conducting connector 8 and the end surface of the CPU 5 are sufficiently thermally conductive, thereby effectively improving the heat dissipation efficiency of the CPU 5.
  • the fixing bracket comprises a middle frame 1 and a metal plate 2 disposed inside the middle frame 1, and the metal plate 2 is partially located in the main heat dissipation region.
  • the CPU 5 is inserted into a PCB provided with a central processing unit socket, and the PCB and the CPU 5 constitute a main board of the mobile terminal, and the PCB is mounted on one side of the metal board 2. Since the metal plate 2 is located at one side of the PCB, heat of the PCB can be dissipated through the metal plate 2, and the CPU 5 is connected to the metal plate 2 through the heat pipe 6 to achieve heat dissipation.
  • the main board of the mobile terminal is connected to the metal plate 2 through two heat conduction channels to realize heat dissipation, thereby increasing the heat conduction path and the heat conduction efficiency, thereby effectively improving the heat dissipation efficiency of the motherboard.
  • the middle frame 1 is provided with a placement slot 3 for mounting the heat pipe 6, and the metal plate 2 is provided with a retaining port corresponding to the placement slot 3.
  • the placement slot 3 includes a linear slot on the side of the middle frame 1 and parallel to the side of the middle frame 1, and an arc between the direct slot and the CPU 5. a slot, the linear slot being located in the main heat dissipation zone.
  • the heat pipe 6 is provided with a straight tube and an arc tube corresponding to the placement groove 3, and the heat dissipation fins 7 are disposed on the straight tube.
  • the heat pipe 6 can be embedded in the middle frame 1 by opening the placement groove 3 in the middle frame 1, so that the structure of the middle frame 1 is more compact, and the heat conduction distance of the CPU 5 is shortened, and Conducive to achieving the thickness of the thinned mobile terminal.
  • a plurality of first fin slots 4 are defined on the metal plate 2, and a plurality of second fin slots are formed on the two sides of the retaining port.
  • a sheet 7 is embedded in the first fin groove 4 and the second fin groove.
  • the heat dissipating fins 7 are in close contact with the middle frame 1 and the metal plate 2 by fitting the heat dissipating fins 7 into the first fin slots 4 and the second fin slots.
  • the heat pipe 6 is embedded in the placement groove 3, so that the heat pipe 6 is in direct contact with the middle frame 1 and the metal plate 2, thereby achieving heat transfer in two ways and improving heat dissipation efficiency of the main board.
  • the heat dissipating fins 7 are connected to the middle frame 1 and the metal plate 2 by a heat conductive glue.
  • the thermal conductive adhesive adopts any one of a silicone thermal conductive adhesive, an epoxy resin AB adhesive, a polyurethane adhesive, and a polyurethane thermal conductive adhesive.
  • the thermal conductive adhesive is a silicone thermal conductive adhesive.
  • the heat dissipating fins 7 are relatively hard materials, so even if the surface of the heat dissipating fins 7 is flat, there is still a gap between the heat dissipating fins 7 and the middle frame 1 and the metal plate 2, Thereby, the heat conduction efficiency of the heat pipe 6 and the middle frame 1 and the metal plate 2 is affected.
  • the present embodiment provides a thermal conductive adhesive between the heat dissipating fins 7 and the middle frame 1 and the metal plate 2 for fully filling the heat dissipating fins 7 and the middle frame 1 and the The gap between the metal plates 2 causes the heat pipe 6 and the middle frame 1 and the metal plate 2 to sufficiently conduct heat, thereby effectively improving the heat dissipation efficiency of the CPU 5.
  • the heat dissipating fins 7 are formed by annular pieces disposed at the periphery of the heat pipe 6, and the plurality of annular pieces are disposed along the axial direction of the heat pipe 6, and the heat dissipating fins 7 are fixed to the heat pipe 6 by welding. on. In the present embodiment, the heat dissipating fins 7 are disposed at equal intervals along the axial direction of the heat pipe 6.
  • the main heat dissipation zone is provided with an artificial graphite heat dissipation film or a nano carbon heat dissipation film 9.
  • the artificial graphite heat-dissipating film or the nano-carbon heat-dissipating film 9 is a main material for manufacturing the heat sink, and has excellent heat dissipation performance, and can improve the heat dissipation efficiency of the main heat dissipation region.
  • the main heat dissipation region is provided with a nano carbon heat dissipation film 9 attached to one side of the metal plate 2.
  • a mobile terminal in another aspect, includes the above-described motherboard heat dissipation structure.
  • the mobile terminal further includes a front frame and a rear frame respectively disposed on two sides of the middle frame 1, and the front frame, the middle frame 1 and the rear frame enclose an installation space for installing internal components.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种主板散热结构和具有上述主板散热结构的移动终端。主板散热结构包括设置有主散热区的固定支架，CPU（5）与该主散热区之间通过热管（6）导热连接，该热管（6）的一端与该CPU（5）连接，该热管（6）远离该CPU（5）的一端位于该主散热区内，该热管（6）位于该主散热区内的部分设置有散热翅片（7），该散热翅片（7）插入该固定支架内。

Description

一种主板散热结构及移动终端 技术领域
本发明涉及终端散热技术领域，尤其涉及一种主板散热结构及移动终端，进一步地，涉及一种主板散热结构及手机。
 背景技术
现代社会人们的生活节奏越来越快，人与人之间的通信也越来越紧密和频繁，人们对于通信设备的依赖很强。其中，手机是应用最广泛的通信终端之一，手机以其轻便、操作简单和功能全面等特点得到人们的青睐和全面普及。手机是移动终端，尺寸较小，但人们对手机的功能和处理能力的需求很高，因此，手机的集成程度越来越高，手机的CPU的内核也越来越多，同时CPU的频率也越来越高。如此高的频率和性能，使CPU的工作温度越来越高，而CPU的温度升高将严重影响其工作性能，因此，CPU的有效散热相当重要。
除手机终端外，目前大部分电子产品终端上均设置有高集成和高性能的CPU，这些电子产品终端上的CPU在使用过程中也需要解决散热的问题。
基于上述情况，我们有必要设计一种主板的散热结构和移动终端，以保证CPU的工作性能和延长CPU的寿命。
 技术问题
本发明的一个目的在于：提供一种主板散热结构，通过设置与CPU连接的热管，使CPU工作时产生的热量快速传递至主散热区，实现CPU的持续快速散热，有效降低CPU的工作温度。
本发明的一个目的在于：提供一种主板散热结构，通过在热管上设置插入固定支架内的散热翅片，增大热管与主散热区之间的导热面积，加快热量从热管向主散热区传递的效率，有效保证CPU的散热效率。
本发明的一个目的在于：提供一种主板散热结构，通过在热管上设置与CPU端面形状一致的导热连接件，增大热管与CPU之间的导热面积，加快热量从CPU向热管传递的效率，有效保证CPU的散热效率。
本发明的一个目的在于：提供一种移动终端，通过在移动终端内设置具有热管的主板散热结构，有效提高CPU的散热效率，保证移动终端的持续可靠运行。
 技术解决方案
为达此目的，本发明采用以下技术方案：
一种主板散热结构，其包括固定支架，所述固定支架内设置有用于控制CPU温升的主散热区，所述CPU与所述主散热区之间通过热管导热连接，所述热管的一端与所述CPU连接，所述热管远离所述CPU的一端位于所述主散热区内，所述热管位于所述主散热区内的部分设置有用于增加导热面积的散热翅片，所述散热翅片插入所述固定支架内；所述热管靠近所述CPU的一端设置有与CPU表面贴合的导热连接件；所述热管是电流体动力热管。
一种主板散热结构，包括固定支架，所述固定支架内设置有用于控制CPU温升的主散热区，所述CPU与所述主散热区之间通过热管导热连接，所述热管的一端与所述CPU连接，所述热管远离所述CPU的一端位于所述主散热区内，所述热管位于所述主散热区内的部分设置有用于增加导热面积的散热翅片，所述散热翅片插入所述固定支架内。
一种移动终端，包括上述的主板散热结构。
 有益效果
（一）提供一种主板散热结构，通过设置与CPU连接的热管，使CPU工作时产生的热量快速传递至主散热区，实现CPU的持续快速散热，有效降低CPU的工作温度。
（二）提供一种主板散热结构，通过在热管上设置插入固定支架内的散热翅片，增大热管与主散热区之间的导热面积，加快热量从热管向主散热区传递的效率，有效保证CPU的散热效率。
（三）提供一种移动终端，通过在移动终端内设置具有热管的主板散热结构，有效提高CPU的散热效率，保证移动终端的持续可靠运行。
 附图说明
图1为实施例所述的固定支架与CPU的位置结构示意图；
图2为实施例所述的固定支架与热管组装后的示意图；
图3为实施例所述的固定支架与纳米碳散热膜组装后的示意图；
图4为实施例所述的热管与导热连接件组装后的结构示意图。
图1至图4中：
1、中框；2、金属板；3、放置槽；4、第一翅片槽；5、CPU；6、热管；7、散热翅片；8、导热连接件；9、纳米碳散热膜。
 本发明的最佳实施方式
下面结合附图并通过具体实施方式来进一步说明本发明的技术方案。
如图1～4所示，于本实施例中，一方面，一种主板散热结构，包括固定支架，所述固定支架内设置有用于控制CPU5温升的主散热区，所述CPU5与所述主散热区之间通过热管6导热连接，所述热管6的一端与所述CPU5连接，所述热管6远离所述CPU5的一端位于所述主散热区内，所述热管6位于所述主散热区内的部分设置有用于增加导热面积的散热翅片7，所述散热翅片7插入所述固定支架内。
热管6是一种传热元件，它充分利用了热传导原理与相变介质的快速热传递性质，透过热管6将发热物体的热量迅速传递到热源外，其导热能力超过任何已知金属的导热能力。热管6可采用有芯热管、两相闭式热虹吸管（又称重力热管）、重力辅助热管、旋转热管、电流体动力热管、磁流体动力热管、渗透热管中的任意一种。于本实施例中，所述热管6是电流体动力热管。该电流体动力热管具有很高的导热性和优良的等温性，能够有效保证CPU5的热量快速可靠向外传递。
目前的移动终端基本上只会针对PCB设置散热结构，即CPU5工作时产生的热量必须通过PCB传递至散热结构实现散热，由于PCB不具备优良的导热性能，因此CPU5的散热效率较低，CPU5容易处于较高的工作温度，从而影响CPU5的工作性能甚至缩短CPU5的寿命，极大降低了移动终端的可靠性。本实施例通过设置热管6，使CPU5与主散热区直接导热连接，由于热管6具备极佳的导热效率，因此CPU5的散热效率很高，有效保证CPU5持续处于较低的工作温度，从而提高CPU5的工作性能和可靠性，并有效延长CPU5的使用寿命。另外，热管6的整体结构较小，因此热管6与所述主散热区之间的导热面积也较小，一定程度上影响了热管6与所述主散热区之间的导热效率，本实施例通过在热管6上设置插入固定支架内的散热翅片7，增大热管6与主散热区之间的导热面积，加快热量从热管6向主散热区传递的效率，有效保证CPU5的散热效率。
所述热管6靠近所述CPU5的一端设置有与CPU5表面贴合的导热连接件8。
所述导热连接件8是形状与所述CPU5端面形状一致的铜皮或者铝片，所述导热连接件8的一端与所述热管6焊接，所述导热连接件8的另一端与所述CPU5端面通过导热胶连接。于本实施例中，所述CPU5端面的形状为矩形，所述导热连接件8也是矩形，所述导热连接件8是铜皮。于其它实施例中，所述CPU5可以是圆形，所述导热连接件8是圆形，所述导热连接件8是铝片。
所述导热胶具有优异的导热性能，能够为元器件提供高保障的散热系数，为大发热量的元器件在使用过程中的稳定起到保障作用，提高了元器件的使用性能及寿命；所述导热胶还具有优越的电气性、耐老化、抗冷热交变性能，增加了移动终端在使用过程中的安全系数。所述导热胶采用有机硅导热胶，环氧树脂AB胶，聚氨酯胶，聚氨酯导热胶中的任意一种。于本实施例中，所述导热胶是有机硅导热胶。
本实施例通过在热管6上设置与CPU5端面形状一致的导热连接件8，并使导热连接件8与所述CPU5端面贴合，充分利用了CPU5的可导热区域，从而增大热管6与CPU5之间的导热面积，加快热量从CPU5向热管6传递的效率。但是，所述导热连接件8是较硬的物质，因此即使所述导热连接件8的表面很平整，所述导热连接件8与所述CPU5端面之间仍然会存在间隙，从而影响所述CPU5与所述热管6的导热效率。基于上述情况，本实施例在所述导热连接件8与所述CPU5端面之间设置所述导热胶，用于充分填充所述导热连接件8与所述CPU5端面之间的间隙，使所述导热连接件8与所述CPU5端面充分导热，从而有效提高所述CPU5的散热效率。
所述固定支架包括中框1和设置在所述中框1内侧的金属板2，所述金属板2部分位于所述主散热区内。
于本实施例中，所述CPU5插装在设置有中央处理器插接口的PCB上，所述PCB与所述CPU5构成移动终端的主板，所述PCB安装在所述金属板2的一侧。由于所述金属板2位于所述PCB的一侧，因此，所述PCB的热量能够通过所述金属板2进行散热，另外，所述CPU5通过所述热管6与所述金属板2连接实现散热，使移动终端的主板通过两条导热通道与所述金属板2连接并实现散热，增加了导热的途径和导热效率，从而有效提高主板的散热效率。
所述中框1上开设有用于安装所述热管6的放置槽3，所述金属板2对应所述放置槽3开设有让位口。
于本实施例中，所述放置槽3包括位于所述中框1一侧并与所述中框1的侧边平行的直线槽，以及位于所述直接槽与所述CPU5之间的弧形槽，所述直线槽位于所述主散热区内。所述热管6对应所述放置槽3设置有直线管和弧形管，所述散热翅片7设置在所述直线管上。
通过在所述中框1内开设所述放置槽3，使所述热管6能够嵌装在所述中框1内，使所述中框1的结构更加紧凑，缩短CPU5的导热距离，而且有利于实现减薄移动终端的厚度。
所述放置槽3沿其径向外延伸开设有若干第一翅片槽4，所述金属板2上并位于所述让位口的两侧开设有若干第二翅片槽，所述散热翅片7嵌装在所述第一翅片槽4和所述第二翅片槽内。
通过将所述散热翅片7嵌装在所述第一翅片槽4和所述第二翅片槽内，使所述散热翅片7与所述中框1和所述金属板2紧密接触，同时，所述热管6嵌装在所述放置槽3内，使所述热管6与所述中框1和所述金属板2直接接触，从而实现双途径传递热量，提高主板的散热效率。
所述散热翅片7通过导热胶与所述中框1和所述金属板2连接。所述导热胶采用有机硅导热胶，环氧树脂AB胶，聚氨酯胶，聚氨酯导热胶中的任意一种。于本实施例中，所述导热胶是有机硅导热胶。所述散热翅片7是较硬的物质，因此即使所述散热翅片7的表面很平整，所述散热翅片7与所述中框1、所述金属板2之间仍然会存在间隙，从而影响所述热管6与所述中框1、所述金属板2的导热效率。基于上述情况，本实施例在所述散热翅片7与所述中框1、所述金属板2之间设置导热胶，用于充分填充所述散热翅片7与所述中框1和所述金属板2之间的间隙，使所述热管6与所述中框1和所述金属板2充分导热，从而有效提高所述CPU5的散热效率。
所述散热翅片7采用设置在所述热管6周部的环形片，若干所述环形片沿所述热管6的轴向方向间隙设置，所述散热翅片7通过焊接固定在所述热管6上。于本实施例中，所述散热翅片7沿所述热管6的轴向方向等间距设置。
所述主散热区设置有人工石墨散热膜或纳米碳散热膜9。该人工石墨散热膜或纳米碳散热膜9是制作散热片的主要材料，具备优良的散热性能，能够提高所述主散热区的散热效率。于本实施例中，所述主散热区设置有纳米碳散热膜9，该纳米碳散热膜9粘贴在所述金属板2的一侧。
另一方面，一种移动终端，包括上述的主板散热结构。该移动终端还包括分别设置在所述中框1两侧的前框和后框，所述前框、中框1和后框围成一个用于安装内部元器件的安装空间。通过在移动终端内设置具有热管6的主板散热结构，有效提高CPU5的散热效率，保证移动终端的持续可靠运行。
本文中的“第一”、“第二”仅仅是为了在描述上加以区分，并没有特殊的含义。
需要声明的是，上述具体实施方式仅仅为本发明的较佳实施例及所运用技术原理，在本发明所公开的技术范围内，任何熟悉本技术领域的技术人员所容易想到的变化或替换，都应涵盖在本发明的保护范围内。

Claims (20)

  1. 一种主板散热结构，其包括固定支架，所述固定支架内设置有用于控制CPU温升的主散热区，所述CPU与所述主散热区之间通过热管导热连接，所述热管的一端与所述CPU连接，所述热管远离所述CPU的一端位于所述主散热区内，所述热管位于所述主散热区内的部分设置有用于增加导热面积的散热翅片，所述散热翅片插入所述固定支架内；所述热管靠近所述CPU的一端设置有与CPU表面贴合的导热连接件；所述热管是电流体动力热管。
  2. 根据权利要求1所述的主板散热结构，其中所述固定支架包括中框和设置在所述中框内侧的金属板，所述金属板部分位于所述主散热区内。
  3. 根据权利要求2所述的主板散热结构，其中所述中框上开设有用于安装所述热管的放置槽，所述金属板对应所述放置槽开设有让位口。
  4. 根据权利要求3所述的主板散热结构，其中所述放置槽沿其径向外延伸开设有若干第一翅片槽，所述金属板上并位于所述让位口的两侧开设有若干第二翅片槽，所述散热翅片嵌装在所述第一翅片槽和所述第二翅片槽内。
  5. 根据权利要求1所述的主板散热结构，其中所述散热翅片通过导热胶与所述中框和所述金属板连接。
  6. 根据权利要求1所述的主板散热结构，其中所述导热连接件是形状与所述CPU端面形状一致的铜皮，所述导热连接件的一端与所述热管焊接，所述导热连接件的另一端与所述CPU端面通过导热胶连接。
  7. 根据权利要求1所述的主板散热结构，其中所述散热翅片采用设置在所述热管周部的环形片，若干所述环形片沿所述热管的轴向方向间隙设置，所述散热翅片通过焊接固定在所述热管上。
  8. 根据权利要求1所述的主板散热结构，其中所述主散热区设置有人工石墨散热膜、碳散热膜中的至少一种。
  9. 一种主板散热结构，其包括固定支架，所述固定支架内设置有用于控制CPU温升的主散热区，所述CPU与所述主散热区之间通过热管导热连接，所述热管的一端与所述CPU连接，所述热管远离所述CPU的一端位于所述主散热区内，所述热管位于所述主散热区内的部分设置有用于增加导热面积的散热翅片，所述散热翅片插入所述固定支架内。
  10. 根据权利要求9所述的主板散热结构，其中所述热管靠近所述CPU的一端设置有与CPU表面贴合的导热连接件。
  11. 根据权利要求10所述的主板散热结构，其中所述固定支架包括中框和设置在所述中框内侧的金属板，所述金属板部分位于所述主散热区内。
  12. 根据权利要求11所述的主板散热结构，其中所述中框上开设有用于安装所述热管的放置槽，所述金属板对应所述放置槽开设有让位口。
  13. 根据权利要求12所述的主板散热结构，其中所述放置槽沿其径向外延伸开设有若干第一翅片槽，所述金属板上并位于所述让位口的两侧开设有若干第二翅片槽，所述散热翅片嵌装在所述第一翅片槽和所述第二翅片槽内。
  14. 根据权利要求11所述的主板散热结构，其中所述散热翅片通过导热胶与所述中框和所述金属板连接。
  15. 根据权利要求10所述的主板散热结构，其中所述导热连接件是形状与所述CPU端面形状一致的铜皮，所述导热连接件的一端与所述热管焊接，所述导热连接件的另一端与所述CPU端面通过导热胶连接。
  16. 根据权利要求10所述的主板散热结构，其中所述导热连接件是形状与所述CPU端面形状一致的铝片，所述导热连接件的一端与所述热管焊接，所述导热连接件的另一端与所述CPU端面通过导热胶连接。
  17. 根据权利要求9所述的主板散热结构，其中所述散热翅片采用设置在所述热管周部的环形片，若干所述环形片沿所述热管的轴向方向间隙设置，所述散热翅片通过焊接固定在所述热管上。
  18. 根据权利要求9所述的主板散热结构，其中所述主散热区设置有人工石墨散热膜。
  19. 根据权利要求9所述的主板散热结构，其中所述主散热区设置有人纳米碳散热膜。
  20. 一种移动终端，其包括权利要求1所述的主板散热结构。
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