WO2017002369A1 - Dispositif de transfert d'élément électronique et dispositif d'inspection d'élément électronique - Google Patents

Dispositif de transfert d'élément électronique et dispositif d'inspection d'élément électronique Download PDF

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Publication number
WO2017002369A1
WO2017002369A1 PCT/JP2016/003135 JP2016003135W WO2017002369A1 WO 2017002369 A1 WO2017002369 A1 WO 2017002369A1 JP 2016003135 W JP2016003135 W JP 2016003135W WO 2017002369 A1 WO2017002369 A1 WO 2017002369A1
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WIPO (PCT)
Prior art keywords
electronic component
unit
surface state
inspection
vibration
Prior art date
Application number
PCT/JP2016/003135
Other languages
English (en)
Japanese (ja)
Inventor
大輔 桐原
Original Assignee
セイコーエプソン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2015130827A external-priority patent/JP2017015480A/ja
Priority claimed from JP2015130828A external-priority patent/JP2017015481A/ja
Priority claimed from JP2015130830A external-priority patent/JP2017015483A/ja
Priority claimed from JP2015130825A external-priority patent/JP2017015478A/ja
Priority claimed from JP2015130826A external-priority patent/JP2017015479A/ja
Priority claimed from JP2015130829A external-priority patent/JP2017015482A/ja
Application filed by セイコーエプソン株式会社 filed Critical セイコーエプソン株式会社
Priority to CN201680037964.0A priority Critical patent/CN108283009A/zh
Publication of WO2017002369A1 publication Critical patent/WO2017002369A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices

Definitions

  • an electronic component inspection apparatus that conveys an electronic component such as an IC device and inspects electrical characteristics of the electronic component is known.
  • Such an electronic component inspection apparatus incorporates an electronic component conveyance device for conveying the IC device to the holding unit of the inspection unit.
  • the IC device When inspecting the IC device, the IC device is disposed in the holding unit, and a plurality of probe pins provided in the holding unit are brought into contact with the terminals of the IC device.
  • the electronic component conveying apparatus heats or cools the IC device in advance to adjust the IC device to a temperature suitable for inspection, and conveys the IC device whose temperature is adjusted by the soak plate to the vicinity of the inspection unit.
  • a supply shuttle, a first device transport head for transporting the IC device between the tray on which the IC device is disposed and the soak plate, and transporting the IC device between the soak plate and the supply shuttle, and the IC after the inspection A recovery shuttle that transports the device, a second device transport head that transports the IC device between the supply shuttle and the inspection unit, and an IC device between the inspection unit and the recovery shuttle, and the recovery shuttle
  • a third device transport head for transporting the IC device to and from the tray on which the IC device is placed It is.
  • Patent Document 1 discloses an auto handler for a device tester.
  • the auto handler according to Patent Document 1 inspects (determines) the presence of a measurement unit that inspects electrical characteristics of a measurement device (IC device) and scratches, cracks, dents, chips, etc. on the surface of the measurement device.
  • an appearance inspection unit that performs an appearance inspection.
  • the measurement unit includes a movable body that picks up the measurement device, a movable arm that moves the movable body, and a contact unit that contacts the measurement device to test various electrical characteristics.
  • the appearance inspection unit includes a movable body that picks up the measurement device, a movable arm that moves the movable body, an appearance measurement table that fixes the measurement device, and a CCD camera that obtains image data on the surface of the measurement device.
  • the electronic component (measuring device disclosed in Patent Document 1) is transported and fixed to the appearance measurement table, and then the appearance inspection of the electronic component is performed.
  • the conventional electronic component inspection apparatus it takes time to transport the electronic component to the dedicated appearance inspection region for the appearance inspection of the electronic component.
  • time is consumed only for the appearance inspection. Therefore, there is a problem that a series of operations for conveying electronic parts and visual inspection cannot be performed quickly and throughput is lowered.
  • the conventional electronic component inspection apparatus has a problem that it is difficult to confirm a relatively small scratch and to perform a high-precision appearance inspection because the resolution of imaging is low.
  • the objective of this invention is providing the electronic component conveyance apparatus and electronic component inspection apparatus which can perform rapidly the conveyance of an electronic component, and acquiring the information of the surface of an electronic component.
  • an electronic component transport device and electronic component inspection device that can acquire information on the surface state of the electronic component with high accuracy, or an electronic component transport that can appropriately determine the presence or absence of scratches on the surface of the electronic component. It is an object of the present invention to provide an apparatus and an electronic component inspection apparatus, or an electronic component conveying apparatus and an electronic component inspection apparatus that can quickly perform an appearance inspection of an electronic component while increasing throughput.
  • the present invention has been made to solve at least a part of the problems described above, and can be realized as the following forms or application examples.
  • An electronic component transport apparatus includes a transport unit on which an electronic component can be placed and transported, and a surface on which information on the surface state of the electronic component placed on the transport unit can be acquired. And a state acquisition unit.
  • the appearance inspection is an inspection for determining whether or not the electronic component is flawed.
  • the surface state acquisition unit can acquire the information on the electronic component in the middle of the transport path of the electronic component by the transport unit. Is preferred.
  • information on the surface state of the electronic component can be acquired while the electronic component is being transported on the transport unit.
  • the surface state information of the electronic component can be continuously acquired while the plurality of electronic components are transferred by the transfer unit, so that the surface state information can be acquired more quickly than before.
  • Application Example 5 In the electronic component transport apparatus according to the application example described above, it is possible to provide an inspection unit that performs an electrical inspection of the electronic component, and the surface state acquisition unit performs the electrical inspection. It is preferable to obtain the information after it has been performed.
  • the transport unit is an electronic component collection unit that transports the electronic component after the electrical inspection is performed.
  • the surface state acquisition unit acquires the information for the electronic component that has passed the electrical inspection.
  • an electronic component that has passed the electrical inspection is an electronic component that satisfies a condition equal to or higher than a standard set by the conduction state of the electronic component.
  • the set reference can be arbitrarily adjusted.
  • the electronic component transport apparatus includes a sorting robot that separates the electronic component based on the information acquired by the surface state acquisition unit and the result of the electrical inspection. Is preferred.
  • the result of either one of the result of the electrical inspection and the result of the visual inspection and the result of the electrical inspection and the result of the visual inspection are rejected, for example. It can be separated into electronic components.
  • the surface state acquisition unit includes an imaging device capable of imaging the electronic component.
  • the surface state of the electronic component can be acquired as image data. Therefore, for example, it is possible to more easily determine the presence or degree of surface scratches or the like on the electronic component.
  • the imaging device acquires the information by imaging the electronic component from vertically above the electronic component.
  • the surface state acquisition unit includes a strobe, and when the electronic component is imaged by the imaging device, the strobe is driven to the electronic component. It is preferable to irradiate light.
  • the electronic component transport apparatus includes a plurality of the surface state acquisition units, and generates three-dimensional image data using the information acquired by the plurality of surface state acquisition units. It is preferable to do.
  • the size (particularly depth) of the scratches can be more easily determined.
  • An electronic component inspection apparatus includes a conveyance unit on which an electronic component can be placed and conveyed, and a surface on which information on the surface state of the electronic component placed on the conveyance unit can be acquired. It has a state acquisition part and the test
  • the electronic component transport apparatus is capable of placing an electronic component, movable in a first direction, and movable in a second direction different from the first direction. And a surface state acquisition unit capable of acquiring information on the surface state of the electronic component placed on the transport unit.
  • the surface state acquisition unit is movable in the second direction, the surface state information of the electronic component can be acquired by dividing or scanning the surface of the electronic component.
  • the resolution of the surface state acquisition unit can be increased in a pseudo manner, and thus information on the surface state of the electronic component can be acquired with high accuracy.
  • the electronic component can be placed on the transport unit with the surface to be inspected of the electronic component facing upward, and information on the surface state of the electronic component can be acquired.
  • the transport unit includes a first unit in which a plurality of first mounting units on which the electronic component is mounted are arranged in the first direction.
  • the said surface state acquisition part can acquire the said information of the said electronic component mounted in the said 1st arrangement row, and the said electronic component mounted in the 2nd arrangement row.
  • the surface state acquisition unit can more efficiently acquire the surface state information of the plurality of electronic components. Can do.
  • the surface state acquisition unit acquires the information about the plurality of electronic components placed in the first arrangement row, and then It is preferable to acquire the information of the plurality of electronic components placed in the second arrangement row by moving in two directions.
  • the surface state information of a plurality of electronic components can be acquired more accurately and more quickly with a smaller number of surface state acquisition units than in the arrangement row.
  • the transport unit is configured to be reciprocally movable in the first direction, and the surface state acquisition unit is configured in a forward path.
  • the imaging device acquires the information on the electronic components placed in the first arrangement row, and the information on the electronic components on which the surface state acquisition unit is placed in the second arrangement row in a return path It is preferable to obtain
  • the surface state information of a plurality of electronic components can be acquired more efficiently with a smaller number of surface state acquisition units than the arrangement row.
  • the transport unit includes a first unit in which a plurality of first mounting units on which the electronic components are mounted are arranged in the first direction.
  • a second arrangement row in which a plurality of second placement units for placing the electronic components are arranged in the first direction, and the surface state acquisition unit is arranged in the first arrangement row.
  • a first surface state acquisition unit that acquires the information of the placed electronic component; and a second surface state acquisition unit that acquires the information of the electronic component placed in the second arrangement row. It is preferable.
  • the surface of each electronic component in each arrangement row is divided by moving the first surface state acquisition unit and the second surface state acquisition unit in the second direction, respectively.
  • it can scan and can acquire the information of the surface state of a plurality of electronic parts with higher accuracy.
  • Application Example 21 In the electronic component transport apparatus according to any one of Application Examples 15 to 20, it is preferable to perform an appearance inspection of the electronic component based on the information acquired by the surface state acquisition unit.
  • appearance inspection can be performed to determine the presence or absence of scratches (including defects such as cracks, dents, and chips) on electronic components based on the information thus obtained, for example, separately from the transportation of electronic components It is possible to save the trouble of performing visual inspection. Therefore, a series of operations for transporting electronic components and visual inspection of electronic components can be performed more quickly.
  • the appearance inspection is an inspection for determining whether or not the electronic component is flawed.
  • Application Example 23 In the electronic component transport device according to any one of Application Examples 15 to 22, it is possible to provide an inspection unit that performs an electrical inspection of the electronic component, and the surface state acquisition unit includes: It is preferable to acquire the information after the electrical inspection is performed.
  • the transport unit is an electronic component recovery unit that transports the electronic component after the electrical inspection is performed.
  • the surface state acquisition unit preferably acquires the information for the electronic component that has passed the electrical inspection. .
  • the surface state acquisition unit includes an imaging device capable of imaging the electronic component.
  • the surface state of the electronic component can be acquired as image data. Therefore, for example, the presence or absence of scratches on the surface of the electronic component can be more easily determined.
  • the surface state acquisition unit includes a strobe, and the electronic component is driven by driving the strobe when the electronic component is imaged by the imaging device. It is preferable to irradiate light.
  • the electronic component inspection apparatus is capable of placing an electronic component and is capable of moving in a second direction that is different from the first direction, and a transport unit that is movable in the first direction. It has a surface state acquisition part which can acquire the information on the surface state of the electronic parts placed in the conveyance part, and an inspection part which inspects the electronic parts.
  • the surface state acquisition unit is movable in the second direction, the surface state information of the electronic component can be acquired by dividing or scanning the surface of the electronic component.
  • the resolution of the surface state acquisition unit can be increased in a pseudo manner, and thus information on the surface state of the electronic component can be acquired with high accuracy.
  • An electronic component transport apparatus includes a transport unit that can place and transport an electronic component, and a surface state acquisition unit that can acquire information on the surface state of the electronic component.
  • the surface state acquisition unit acquires the information of the first part of the electronic component, and acquires the information of the second part that is at least partially different from the first part. .
  • the information on the surface state of the electronic component can be obtained by dividing the information into the first part and the second part, the information can be obtained as compared with the case where the information on the surface state of the electronic component is obtained collectively. It can be acquired with high accuracy.
  • the surface state acquisition unit can acquire the information on the surface state of the electronic component placed on the transport unit. .
  • the surface state acquisition unit includes at least a part of each of the first part and the second part, It is preferable to acquire the information of the first part and the information of the second part.
  • the transport unit is capable of transporting a plurality of the electronic components, and is along a transport direction of the electronic components by the transport unit.
  • the surface state acquisition unit is configured to acquire the information on the first part of the plurality of electronic components in a forward path, and then return the plurality of the plurality of electronic components in a return path. It is preferable to acquire the information of the second part of the electronic component.
  • the conveyance unit is movable in a first direction, and the surface state acquisition unit is different from the first direction. It is preferable to be able to move in different second directions. Thereby, the surface state of the electronic component can be determined from the image data.
  • Application Example 34 In the electronic component transport device according to Application Example 33, the first part and the second part are aligned along the first direction, and the surface state acquisition unit is By moving in the second direction, it is possible to acquire the information of the third part and the fourth part arranged in the second direction with respect to the first part and the second part. preferable.
  • the surface state acquisition unit is capable of imaging a plurality of portions of the electronic component, and is acquired by the surface state acquisition unit. It is preferable to generate data obtained by combining the plurality of pieces of information.
  • Application Example 37 In the electronic component transport apparatus according to any one of Application Examples 29 to 36, it is preferable to perform an appearance inspection of the electronic component based on the information acquired by the surface state acquisition unit.
  • appearance inspection can be performed to determine the presence or absence of scratches (including defects such as cracks, dents, and chips) on electronic components based on the information thus obtained, for example, separately from the transportation of electronic components It is possible to save the trouble of performing an appearance inspection. Therefore, a series of operations for transporting electronic components and visual inspection of electronic components can be performed more quickly.
  • the appearance inspection is an inspection for determining whether or not the electronic component is scratched.
  • Application Example 39 In the electronic component transport apparatus according to any one of Application Examples 29 to 38, an inspection unit that performs an electrical inspection of the electronic component can be provided, and the surface state acquisition unit is It is preferable to acquire the information after the electrical inspection is performed.
  • the transport unit is preferably an electronic component collection unit that transports the electronic component after the electrical inspection is performed.
  • the surface state acquisition unit acquires the information for the electronic component that has passed the electrical inspection. .
  • the surface state acquisition unit includes an imaging device capable of imaging the electronic component.
  • the surface state of the electronic component can be acquired as image data. Therefore, for example, the presence or absence of scratches on the surface of the electronic component can be more easily determined.
  • the surface state acquisition unit includes a strobe, and the electronic component is driven by driving the strobe when the electronic component is imaged by the imaging device. It is preferable to irradiate light.
  • An electronic component inspection apparatus includes a transport unit that can place and transport an electronic component, a surface state acquisition unit that can acquire information on the surface state of the electronic component, and the electronic component.
  • An inspection unit for inspecting wherein the surface state acquisition unit acquires the information of the first part of the electronic component, and at least a part of the second part is different from the first part. The information is acquired.
  • the information on the surface state of the electronic component can be obtained by dividing the information into the first part and the second part, the information can be obtained as compared with the case where the information on the surface state of the electronic component is obtained collectively. It can be acquired with high accuracy.
  • the electronic component transport apparatus includes a surface state acquisition unit that can acquire information on the surface state of the electronic component.
  • vibration is generated. It is characterized in that at least one vibration of the generated vibration generating unit is made smaller than the vibration before the surface state information is acquired.
  • the surface state acquisition unit is, for example, an imaging device
  • blurring is prevented or reduced, that is, the image becomes clear (clear), and it is possible to appropriately determine the presence or absence of scratches on the surface of the electronic component.
  • Application Example 46 In the electronic component transport apparatus according to Application Example 45 described above, when acquiring information on the surface state of the electronic component, the electronic component is placed on a transport unit on which the electronic component can be placed and transported. It is preferable that it is mounted.
  • the vibration generating unit is, for example, a drive mechanism of the electronic component transport apparatus.
  • the speed of the drive mechanism is made slower than before the surface state information is acquired, or the drive mechanism is stopped from the drive mechanism.
  • the generated vibration can be made smaller than the vibration before the surface state information is acquired.
  • the drive mechanism includes, for example, a motor.
  • the motor speed is made slower than before the surface condition information is acquired, or vibration generated from the motor is stopped by stopping the motor.
  • the vibration before the acquisition of the surface state information can be made smaller.
  • the drive mechanism includes, for example, a slide rail and a slider.
  • the slider speed is made slower than before acquiring the surface state information, or the slider is stopped from the slide rail and the slider.
  • the generated vibration can be made smaller than the vibration before the surface state information is acquired.
  • the vibration generated from the drive mechanism can be made smaller than the vibration before the surface state information is acquired.
  • Application Example 51 In the electronic component transport device according to any one of Application Examples 47 to 49, it is preferable to stop the driving mechanism when acquiring information on the surface state of the electronic component.
  • the vibration generated from the drive mechanism can be made smaller than the vibration before the surface state information is acquired.
  • the drive mechanism includes a servo motor, and when acquiring information on a surface state of the electronic component, the servo It is preferable to stop the excitation of the motor. Thereby, the vibration which arises from a drive mechanism can be eliminated.
  • the drive mechanism is a grip portion that can grip and transport the electronic component.
  • the generated vibration can be made smaller than the vibration before the surface state information is acquired.
  • the drive mechanism is preferably a transport unit on which the electronic component can be placed and transported.
  • the generated vibration can be made smaller than the vibration before the surface state information is acquired.
  • the surface state acquisition unit acquires information on the surface state of the electronic component and performs an appearance inspection of the electronic component. Is preferred. Thereby, the appearance inspection of the electronic component can be easily performed.
  • Application Example 56 In the electronic component transport apparatus according to Application Example 55, it is preferable that in the appearance inspection, the presence or absence of a scratch on the surface of the electronic component is determined based on the information on the surface state. As a result, it is possible to select a good product and a defective product regarding the appearance of the electronic component.
  • the surface state acquisition unit acquires information on the surface state of the electronic component. It is preferable to do.
  • the surface state acquisition unit includes an imaging device capable of imaging the electronic component.
  • image data of the surface of the electronic component is obtained as information on the surface state of the electronic component, and it is possible to determine the presence or absence of scratches on the surface of the electronic component based on the image data.
  • the surface state acquisition unit includes a strobe, and the electronic component is driven by driving the strobe when the electronic component is imaged by the imaging device. It is preferable to irradiate light.
  • An electronic component inspection apparatus includes a surface state acquisition unit capable of acquiring information on the surface state of the electronic component, and an inspection unit that inspects the electronic component.
  • a surface state acquisition unit capable of acquiring information on the surface state of the electronic component
  • an inspection unit that inspects the electronic component.
  • the surface state acquisition unit is, for example, an imaging device
  • blurring is prevented or reduced, that is, the image becomes clear, and it is possible to appropriately determine the presence or absence of scratches on the surface of the electronic component.
  • the electronic component transport apparatus includes a vibration detection unit that detects vibration and a surface state acquisition unit that can acquire information on the surface state of the electronic component.
  • the appearance inspection is performed, and thus, when the surface state acquisition unit is an imaging device, for example, blurring is prevented or reduced, that is, the image is clear (clear)
  • the surface state acquisition unit is an imaging device, for example, blurring is prevented or reduced, that is, the image is clear (clear)
  • the vibration detection unit includes a first vibration detector that detects vibration of the surface state acquisition unit.
  • the appearance inspection is performed, and thus, when the surface state acquisition unit is, for example, an imaging device, blurring is prevented or reduced. Becomes clear, and it is possible to appropriately determine the presence or absence of scratches on the surface of the electronic component.
  • the electronic component conveyance device includes a conveyance unit on which the electronic component can be placed and conveyed, and the vibration detection unit has the electronic component placed thereon. It is preferable to have a second vibration detector for detecting the vibration of the transport unit.
  • the appearance inspection is performed, and, for example, when the surface state acquisition unit is an imaging device, blurring is prevented or reduced, that is, the image is clear.
  • the surface state acquisition unit is an imaging device
  • the surface state acquisition unit acquires information on the surface state of the electronic component and performs an appearance inspection of the electronic component. Is preferred. Thereby, the appearance inspection of the electronic component can be easily performed.
  • Application Example 66 In the electronic component transport apparatus according to Application Example 65, it is preferable that in the appearance inspection, the presence or absence of a scratch on the surface of the electronic component is determined based on the information on the surface state. As a result, it is possible to select a good product and a defective product regarding the appearance of the electronic component.
  • Application Example 68 In the electronic component transport apparatus according to Application Example 67, information on the surface state of the electronic component is obtained by the surface state acquisition unit for the electronic component that has passed the electrical inspection of the electronic component. It is preferable to obtain
  • Application Example 69 In the electronic component carrying device according to any one of Application Examples 65 to 68, it is determined whether or not to perform the appearance inspection based on vibration information detected by the vibration detection unit. preferable.
  • the surface state acquisition unit is, for example, an imaging device
  • blurring is prevented or reduced, that is, the image becomes clear, and it is possible to appropriately determine the presence or absence of scratches on the surface of the electronic component.
  • Application Example 71 In the electronic component carrying device according to any one of Application Examples 65 to 70, it is preferable to perform the appearance inspection based on vibration information detected by the vibration detection unit.
  • the surface state acquisition unit detects the surface of the electronic component during a period of one cycle of vibration detected by the vibration detection unit. It is preferable to acquire the state information a plurality of times.
  • the surface state acquisition unit is, for example, an imaging device, among images obtained by imaging a plurality of times during one period of vibration, an image in which blurring is prevented or reduced, that is, a clear image is obtained.
  • the presence or absence of scratches on the surface of the electronic component can be appropriately determined based on the clear image.
  • the vibration detection unit includes at least one of an angular velocity sensor and an acceleration sensor. Thereby, vibration can be detected appropriately.
  • the vibration detection unit includes a light irradiation unit and a light receiving unit. Thereby, vibration can be detected appropriately.
  • the surface state acquisition unit preferably includes an imaging device capable of imaging the electronic component.
  • image data of the surface of the electronic component is obtained as information on the surface state of the electronic component, and it is possible to determine the presence or absence of scratches on the surface of the electronic component based on the image data.
  • the surface state acquisition unit includes a strobe, and the electronic component is driven by driving the strobe when the electronic component is imaged by the imaging device. It is preferable to irradiate light.
  • An electronic component inspection apparatus includes a vibration detection unit that detects vibration, a surface state acquisition unit that can acquire information on the surface state of the electronic component, and an inspection unit that inspects the electronic component. It is characterized by having.
  • An electronic component transport apparatus includes a transport unit on which an electronic component can be placed and transported, a detection unit provided in the transport unit, and a detection unit capable of detecting the detection unit. And a surface state acquisition unit capable of acquiring information on the surface state of the electronic component, and acquires information on the surface state of the electronic component based on a detection result of the detected portion by the detection unit. It is characterized by that.
  • the information on the surface state of the electronic component can be acquired in a state where the electronic component is placed on the transport unit, the appearance inspection of the electronic component can be quickly performed without reducing the throughput.
  • the detected part is a light transmitting part capable of transmitting light. Thereby, a to-be-detected part can be easily detected with a simple structure.
  • the detected part is a light reflecting part capable of reflecting light. Thereby, a to-be-detected part can be easily detected with a simple structure.
  • the detection unit preferably includes a light irradiation unit and a light receiving unit. Thereby, a to-be-detected part can be easily detected with a simple structure.
  • Application Example 82 In the electronic component conveyance device according to any one of Application Examples 78 to 81, when the conveyance unit moves a predetermined distance from a position when the detection unit is detected by the detection unit, It is preferable to acquire information on the surface state of the electronic component by the surface state acquisition unit.
  • the electronic component conveying apparatus includes a time measurement unit that measures time, and is measured by the time measurement unit from when the detection unit is detected by the detection unit. It is preferable that when the predetermined time reaches a predetermined time, it is determined that the transport unit has moved the predetermined distance.
  • Application Example 84 In the electronic component transport device according to any one of Application Examples 78 to 83, when the surface state acquisition unit acquires information on the surface state of the electronic component or before acquiring the vibration, It is preferable to have a detectable vibration detector.
  • the appearance inspection is performed, and thus, when the surface state acquisition unit is an imaging device, for example, blurring is prevented or reduced, that is, the image is clear (clear)
  • the surface state acquisition unit is an imaging device, for example, blurring is prevented or reduced, that is, the image is clear (clear)
  • the surface state acquisition unit acquires information on the surface state of the electronic component and performs an appearance inspection of the electronic component. Is preferred. Thereby, the appearance inspection of the electronic component can be easily performed.
  • Application Example 86 In the electronic component transport apparatus according to Application Example 85, in the appearance inspection, it is preferable to determine whether there is a scratch on the surface of the electronic component based on the information on the surface state. As a result, it is possible to select a good product and a defective product regarding the appearance of the electronic component.
  • the surface state acquisition unit acquires information on the surface state of the electronic component. It is preferable to do.
  • the surface state information of the electronic component is obtained by the surface state acquisition unit for the electronic component that has passed the electrical inspection of the electronic component. It is preferable to obtain
  • the surface state acquisition unit includes an imaging device capable of imaging the electronic component.
  • image data of the surface of the electronic component is obtained as information on the surface state of the electronic component, and it is possible to determine the presence or absence of scratches on the surface of the electronic component based on the image data.
  • the surface state acquisition unit includes a strobe, and the electronic component is driven by driving the strobe when the electronic component is imaged by the imaging device. It is preferable to irradiate light.
  • An electronic component inspection apparatus includes a transport unit on which an electronic component can be placed and transported, a detection unit provided in the transport unit, and a detection unit capable of detecting the detection unit. And a surface state acquisition unit that can acquire information on the surface state of the electronic component, and an inspection unit that inspects the electronic component, and based on the detection result of the detected portion by the detection unit, Information on the surface state of the electronic component is acquired.
  • the information on the surface state of the electronic component can be acquired in a state where the electronic component is placed on the transport unit, the appearance inspection of the electronic component can be quickly performed without reducing the throughput.
  • FIG. 1 is a schematic perspective view showing an inspection apparatus (electronic component inspection apparatus) according to a first embodiment of the present invention. It is a schematic plan view of the inspection apparatus shown in FIG. It is a block diagram which shows the control apparatus, the setting display part, and surface state acquisition part which the inspection apparatus shown in FIG. 1 has.
  • FIG. 3 is an enlarged schematic plan view of the inspection area shown in FIG. 2. It is a schematic side view of the surface state acquisition part shown in FIG. It is a figure for demonstrating conveyance of the electronic component collection
  • IC device electronic component
  • FIG. 10 is an enlarged schematic plan view of the inspection area shown in FIG. 9. It is a schematic side view of the surface state acquisition part shown in FIG. It is a figure for demonstrating the moving direction of the surface state acquisition part shown in FIG. It is a figure for demonstrating conveyance of the electronic component collection
  • FIG. 24 is a side view (including a partial cross-sectional view) showing a surface state acquisition unit and its vicinity of the electronic component inspection apparatus shown in FIG. 23. It is a schematic plan view which shows 7th Embodiment of the electronic component inspection apparatus of this invention.
  • FIG. 28 is a side view (including a partial cross-sectional view) showing a surface state acquisition unit and its vicinity of the electronic component inspection apparatus shown in FIG. 27. It is a flowchart which shows an example of control operation of the control part of the electronic component inspection apparatus shown in FIG. It is a schematic plan view which shows 8th Embodiment of the electronic component inspection apparatus of this invention.
  • FIG. 32 is a block diagram of the electronic component inspection apparatus shown in FIG. 31. It is a top view which shows the test
  • FIG. 32 is a side view (including a partial cross-sectional view) showing a surface state acquisition unit and its vicinity of the electronic component inspection apparatus shown in FIG. 31. It is a top view which shows the device collection
  • the X axis, the Y axis, and the Z axis that are orthogonal to each other are illustrated by arrows, and the leading end side of the arrows is “+ (plus)”, and the proximal end side Is "-(minus)".
  • the direction parallel to the X axis (first direction) is the “X axis direction”
  • the direction parallel to the Y axis (second direction) is the “Y axis direction”
  • the direction parallel to the Z axis is “Z Axial direction ".
  • the + Z-axis direction side in the figure is also referred to as “upper” and the ⁇ Z-axis direction side is also referred to as “lower”.
  • the inspection device includes, for example, an IC device such as a BGA (Ball grid array) package or an LGA (Land grid array) package, an LCD (Liquid Crystal Display), or a CIS (CMOS Image Sensor). ) And the like for inspecting and testing (hereinafter simply referred to as “inspection”) electrical characteristics of electronic components.
  • an IC device such as a BGA (Ball grid array) package or an LGA (Land grid array) package, an LCD (Liquid Crystal Display), or a CIS (CMOS Image Sensor).
  • FIG. 1 is a schematic perspective view showing an inspection apparatus (electronic component inspection apparatus) according to the first embodiment of the present invention.
  • FIG. 2 is a schematic plan view of the inspection apparatus shown in FIG.
  • FIG. 3 is a block diagram illustrating a control device, a setting display unit, and a surface state acquisition unit included in the inspection apparatus illustrated in FIG.
  • FIG. 4 is an enlarged schematic plan view of the inspection region shown in FIG.
  • FIG. 5 is a schematic side view of the surface state acquisition unit shown in FIG.
  • FIG. 6 is a view for explaining the conveyance of the electronic component collection unit shown in FIG.
  • FIG. 7 is a diagram for explaining the depth of flaws in an electronic component (IC device).
  • an inspection apparatus (electronic component inspection apparatus) 1 includes a conveyance apparatus (electronic component conveyance apparatus) 10 that conveys an IC device (electronic component) 90, an inspection unit 16, and a display unit 41. And a setting display unit 40 having an operation unit 42 and a control device 30. Further, the inspection apparatus 1 includes a surface state acquisition unit 50 including an imaging device 51 and a strobe 52 (see FIG. 3).
  • the inspection apparatus 1 includes a tray supply area A1, a device supply area A2, an inspection area A3 in which an inspection unit 16 is provided, a device collection area A4, and a tray removal area A5. It is divided into and.
  • the device supply area A2 is a first chamber R1 defined by walls and shutters, and the inspection area A3 is a second chamber R2 defined by walls and shutters.
  • the device collection area A4 is a third chamber R3 defined by walls, shutters, and the like.
  • the first chamber R1 (device supply region A2), the second chamber R2 (inspection region A3), and the third chamber R3 (device collection region A4) can each ensure airtightness and heat insulation. It is configured. Thereby, each of the first chamber R1, the second chamber R2, and the third chamber R3 can maintain humidity and temperature as much as possible.
  • the interiors of the first chamber R1 and the second chamber R2 are controlled to a predetermined humidity and a predetermined temperature, respectively, and can be inspected, for example, in a normal temperature environment, a low temperature environment, and a high temperature environment. ing.
  • the IC device 90 passes through each region in order from the tray supply region A1 to the tray removal region A5, and inspection (electrical inspection) is performed in the intermediate inspection region A3.
  • inspection electrical inspection
  • the inspection unit 16 may perform an inspection for confirming the operation of a circuit (not shown) included in the IC device 90.
  • the inspection apparatus 1 will be described for each of the areas A1 to A5.
  • the tray supply area A1 is an area to which a tray 200 in which a plurality of untested IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.
  • a temperature adjustment unit (soak plate) 12, a supply robot (device transfer head) 13, and a supply empty tray transfer mechanism 15 are provided.
  • the temperature adjusting unit 12 is an apparatus in which the IC device 90 is arranged, and the arranged IC device 90 is heated or cooled to adjust (control) the IC device 90 to a temperature suitable for inspection.
  • two temperature adjusting units 12 are arranged and fixed in the Y-axis direction. Then, the IC device 90 on the tray 200 carried in from the tray supply region A1 by the tray transport mechanism 11a is transported to and placed on one of the temperature adjustment units 12.
  • the supply robot 13 is a transfer unit that transfers the IC device 90, and is supported so as to be movable in the X-axis direction, the Y-axis direction, and the Z-axis direction within the device supply region A2.
  • the supply robot 13 conveys the IC device 90 between the tray 200 carried in from the tray supply area A1 and the temperature adjustment unit 12, and the IC device between the temperature adjustment unit 12 and an electronic component supply unit 14 described later. It is responsible for 90 transports.
  • the supply robot 13 has a plurality of gripping units (not shown) that grip the IC device 90. Each gripping unit includes a suction nozzle, and can grip the IC device 90 by suction. Similarly to the temperature adjustment unit 12, the supply robot 13 can heat or cool the IC device 90 to adjust the IC device 90 to a temperature suitable for inspection.
  • the supply empty tray transport mechanism 15 is a transport unit (transport mechanism) that transports the empty tray 200 from which all IC devices 90 have been removed in the X-axis direction. After this conveyance, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11b.
  • the inspection area A3 is an area where the IC device 90 is inspected.
  • an electronic component supply unit (supply shuttle) 14 an inspection unit 16, a measurement robot (device transport head) 17, and an electronic component recovery unit (recovery shuttle) 18 are provided.
  • the electronic component supply unit 14 and the electronic component collection unit 18 are configured to be independently movable. However, they are configured to be connected or integrated and movable in the same direction. It may be.
  • the electronic component supply unit 14 is a transport unit that places the IC device 90 that has been temperature adjusted (temperature control) and transports the IC device 90 to the vicinity of the inspection unit 16.
  • the electronic component supply unit 14 can reciprocate between the device supply area A2 and the inspection area A3 along the X-axis direction. In the configuration shown in FIG. 2, two electronic component supply units 14 are arranged in the Y-axis direction, and the IC device 90 on the temperature adjustment unit 12 is conveyed to one of the electronic component supply units 14, Placed. This conveyance is performed by the supply robot 13.
  • the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection.
  • the inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90, and is a holding unit that holds the IC device 90 when the IC device 90 is inspected.
  • the inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the inspection (electrical inspection) of the IC device 90 is performed via the probe pin.
  • the IC device 90 similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for the inspection.
  • the measurement robot 17 is a transport unit that transports the IC device 90, and is supported so as to be movable in the inspection region A3.
  • the measuring robot 17 can transport and place the IC device 90 on the electronic component supply unit 14 carried in from the device supply area A2 onto the inspection unit 16.
  • the measurement robot 17 presses the IC device 90 toward the inspection unit 16, thereby bringing the IC device 90 into contact with the inspection unit 16.
  • the measurement robot 17 has a plurality of gripping units (not shown) that grip the IC device 90.
  • Each gripping unit includes a suction nozzle, and can grip the IC device 90 by suction.
  • the measurement robot 17 can heat or cool the IC device 90 to adjust the IC device 90 to a temperature suitable for inspection.
  • the number of measuring robots 17 is one as shown in the figure, but two or more measuring robots 17 may be provided.
  • the electronic component collection unit 18 is a conveyance unit that places the IC device 90 that has been inspected by the inspection unit 16 and conveys it to the device collection area A4.
  • the electronic component collection unit 18 can reciprocate between the inspection area A3 and the device collection area A4 along the X-axis direction.
  • two electronic component collection units 18 are arranged in the Y-axis direction, like the electronic component supply unit 14, and the IC device 90 on the inspection unit 16 has any electronic component. It is transported to and placed on the component collection unit 18. This conveyance is performed by the measurement robot 17.
  • the two electronic component collection units 18 each have a first arrangement row 180a and a second arrangement row 180b.
  • the first arrangement row 180a and the second arrangement row 180b are arranged side by side in the Y-axis direction.
  • Each of the first arrangement row 180a and the second arrangement row 180b has four placement units 180 on which the IC devices 90 are placed.
  • the placement units 180 are arranged at substantially equal intervals along the X-axis direction that is the conveyance direction of the electronic component collection unit 18.
  • one electronic component collection unit 18 has eight placement units 180, but the number of placement units 180 is not limited to this and may be one. A plurality other than eight may be used.
  • the mounting portion 180 has a concave shape that opens upward, and has a shape in which the cross-sectional area gradually decreases toward the bottom surface.
  • the mounting portion 180 having such a shape includes a bottom surface and four inclined side surfaces.
  • Such a side surface of the placement unit 180 functions as a guide surface for guiding the IC device 90 to the placement unit 180 when the IC device 90 is placed. Thereby, the IC device 90 can be easily placed on the placement unit 180.
  • the antireflection treatment is not particularly limited, and examples thereof include formation of an antireflection film, roughening treatment (treatment for increasing light scattering), black treatment (treatment for increasing light absorption), and the like.
  • the device collection area A4 is an area where the IC device 90 that has been inspected is collected.
  • a collection tray 19 a collection robot (sorting robot) 20, and a collection empty tray transport mechanism (tray transport mechanism) 21 are provided.
  • three empty trays 200 are also prepared in the device collection area A4.
  • the collection tray 19 is a placement unit on which the IC device 90 is placed, and is fixed in the device collection area A4.
  • three collection trays 19 are arranged side by side in the X-axis direction.
  • the empty trays 200 are also mounting parts on which the IC devices 90 are mounted, and three empty trays 200 are arranged side by side in the X-axis direction.
  • the IC device 90 on the electronic component collection unit 18 that has moved to the device collection area A4 is transported and placed in one of the collection tray 19 and the empty tray 200. Thereby, the IC device 90 is collected for each inspection result and sorted (classified).
  • the sorting of the IC device 90 based on the inspection result is performed by the collection robot 20.
  • the collection robot 20 sorts the IC device 90 according to a command from the control device 30 described later.
  • the collection robot 20 is a conveyance unit that conveys the IC device 90, and is supported so as to be movable in the X-axis direction, the Y-axis direction, and the Z-axis direction in the device collection area A4.
  • the collection robot 20 can transport the IC device 90 from the electronic component collection unit 18 to the collection tray 19 or the empty tray 200.
  • the collection robot 20 has a plurality of gripping units (not shown) that grip the IC device 90.
  • Each gripping unit includes a suction nozzle, and can grip the IC device 90 by suction.
  • the collection empty tray transport mechanism 21 is a transport unit (transport mechanism) that transports the empty tray 200 carried in from the tray removal area A5 in the X-axis direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.
  • the tray removal area A5 is an area where the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked. Note that tray transport mechanisms (transport sections) 22a and 22b that transport the tray 200 one by one are provided so as to straddle the device collection area A4 and the tray removal area A5. The tray transport mechanism 22a transports the tray 200 on which the inspected IC device 90 is placed from the device collection area A4 to the tray removal area A5. The tray transport mechanism 22b transports an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the device collection area A4.
  • the first chamber R1, the second chamber R2, and the third chamber R3 in each of the regions A1 to A5 as described above include a temperature sensor (thermometer) that detects a room temperature, although not shown.
  • a humidity sensor hygrometer
  • an oxygen concentration sensor oxygen meter
  • the temperature sensor, the humidity sensor, and the oxygen concentration sensor are provided in each of the first chamber R1, the second chamber R2, and the third chamber R3.
  • the temperature sensor, the humidity sensor, and the oxygen concentration are provided.
  • the location where the sensor is provided is arbitrary.
  • the inspection apparatus 1 has a dry air supply mechanism.
  • the dry air supply mechanism is configured to be able to supply gas such as air with low humidity and nitrogen (hereinafter also referred to as dry air) to the first chamber R1, the second chamber R2, and the third chamber R3. Therefore, condensation and icing (icing) of the IC device 90 can be prevented by supplying dry air as necessary.
  • Control device 30 As illustrated in FIG. 3, the control device 30 has a function of controlling each unit of the inspection device 1 and includes a control unit 31 and a storage unit 32.
  • the drive control unit 311 includes components (tray transport mechanisms 11a and 11b, a temperature adjustment unit 12, a supply robot 13, a supply empty tray transport mechanism 15, an electronic component supply unit 14, an inspection unit 16, a measurement robot 17, and an electronic component collection unit 18).
  • the drive of the collection robot 20, the collection empty tray conveyance mechanism 21, and the tray conveyance mechanisms 22a and 22b) are controlled.
  • the inspection control unit 312 can inspect the IC device 90 arranged in the inspection unit 16 based on a program (software) stored in the storage unit 32, for example.
  • the imaging control unit 313 controls the driving of the surface state acquisition unit 50 and the like. Further, the imaging control unit 313 processes a signal from the imaging device 51 and converts the surface state information of the IC device 90 acquired by the surface state acquisition unit 50 into data (generates image data).
  • control unit 31 has a function of displaying the driving of each unit, inspection results, image data, and the like on the display unit 41, a function of performing processing in accordance with an input from the operation unit 42, and the like.
  • the storage unit 32 stores programs, data, and the like for the control unit 31 to perform various processes.
  • the setting display unit 40 includes a display unit 41 and an operation unit 42.
  • the display unit 41 includes a monitor 411 that displays driving of each unit, inspection results, and the like.
  • the monitor 411 can be composed of a display panel such as a liquid crystal display panel or an organic EL, for example. The operator can set or check various processes, conditions, and the like of the inspection apparatus 1 via the monitor 411.
  • the operation unit 42 is an input device such as a mouse 421, and outputs an operation signal corresponding to the operation by the worker to the control unit 31. Therefore, the operator can use the mouse 421 to instruct the control unit 31 for various processes.
  • the mouse 421 is used as the operation unit 42.
  • the operation unit 42 is not limited to this, and may be an input device such as a keyboard, a trackball, or a touch panel.
  • the surface state acquisition unit 50 has a function of acquiring information on the surface state of the IC device 90 that is placed on the electronic component recovery unit 18.
  • the surface state acquisition unit 50 is provided in the vicinity of the above-described inspection region A3 and device recovery region A4 and in the middle of the conveyance path C18 of the electronic component recovery unit 18. . That is, the surface state acquisition unit 50 is provided at a position where information on the surface state of the IC device 90 after inspection (electrical inspection) can be acquired.
  • the surface state acquisition unit 50 includes two first surface state acquisition units 50a and two second surface state acquisition units 50b.
  • the first surface state acquisition unit 50a and the second surface state acquisition unit 50b are arranged side by side in the Y-axis direction.
  • the first surface state acquisition unit 50 a is provided above the first arrangement row 180 a of the electronic component collection unit 18 (+ Z axis direction).
  • the second surface state acquisition unit 50b is provided above the second arrangement row 180b of the electronic component collection unit 18 (+ Z axis direction).
  • the number of the surface state acquisition units 50 is four.
  • the number of the surface state acquisition units 50 is not limited to this and is arbitrary.
  • the number of surface state acquisition units 50 is preferably the same as the number of arrangement rows.
  • the surface state acquisition unit 50 is supported by the support unit 70 so as to be arranged above the electronic component collection unit 18 (+ Z-axis direction). Thereby, the surface state acquisition unit 50 can acquire information on the state of the upper surface 911 of the IC device 90 from vertically above the IC device 90 in the electronic component recovery unit 18.
  • the support part 70 is attached to the support leg (not shown) etc. which support the test
  • the first surface state acquisition unit 50a and the second surface state acquisition unit 50b have an imaging device 51 and a strobe 52, respectively.
  • the imaging device 51 has an imaging element that receives light from the IC device 90 and converts it into an electrical signal.
  • the imaging device 51 is not particularly limited.
  • a camera CCD camera
  • CCD Charge-Coupled Device
  • CMOS Complementary Metal Oxide Semiconductor
  • An electronic camera digital camera
  • a camera using a MOS image sensor as an image pickup device can be used.
  • differential interference method, Fourier transform method or the like it is possible to emphasize fine scratches and scratches that are difficult to see and improve the detection sensitivity of the scratches.
  • the imaging device 51 is configured such that the imaging area is substantially equal to or larger than the size of the upper surface 911 of the IC device 90 in the electronic component collection unit 18.
  • the imaging device 51 preferably includes an optical system such as an optical lens or an autofocus mechanism. Thereby, for example, even when the height (the height in the Z-axis direction) of the IC device 90 on the electronic component collection unit 18 with respect to the imaging device 51 is different, a clear image can be obtained.
  • an optical system such as an optical lens or an autofocus mechanism.
  • the strobe 52 is a light source device that is driven when the imaging device 51 images the IC device 90 and irradiates the IC device 90 with light. With this strobe 52, it is possible to suppress the image from becoming dark due to insufficient light quantity, and to obtain a clearer image.
  • the surface state acquisition unit 50 having such a configuration irradiates the IC device 90 with light using the strobe 52, and images the plurality of IC devices 90 placed on the electronic component collection unit 18 with the imaging device 51.
  • a signal from the imaging device 51 is taken into the imaging control unit 313 described above.
  • the imaging control unit 313 processes a signal from the imaging device 51 and generates information on the surface state of the IC device 90 as two-dimensional image data.
  • the three-dimensional image data may be generated using the surface state information of the IC device 90 acquired by the surface state acquisition unit 50.
  • two or more (for example, three) surface state acquisition units 50 may be provided for one arrangement row.
  • the size (particularly depth) of the scratches can be measured.
  • the size of the scratch 901 (the size in the XY plane) of the IC device 90 and the depth of the scratch 901 (the length in the Z-axis direction) can be measured.
  • a three-dimensional image (3D image image) may be acquired by a laser measuring device (laser length measuring device) using a triangulation method.
  • the IC device 90 is inspected in the inspection area A3 through the tray supply area A1 and the device supply area A2 in order (see FIG. 2).
  • the terminals of the IC device 90 and the probe pins of the inspection unit 16 are electrically connected, and thereby the continuity of the IC device 90 is inspected.
  • the IC device 90 that satisfies the condition of the set standard or higher in the conduction state of the IC device 90 is accepted, and the IC device 90 that does not satisfy the standard is rejected.
  • the set standard can be arbitrarily adjusted.
  • the inspection result may be not only two results of pass and fail but also a result classified into a plurality of results.
  • the IC device 90 that has been inspected is transported and placed by the measuring robot 17 from the inspection unit 16 to the electronic component collection unit 18.
  • the electronic component collection unit 18 on which the IC device 90 is placed is conveyed from the inspection area A3 to the device collection area A4 side along the arrow X1 direction (+ X axis direction). While being conveyed in the direction of the arrow X1, the surface state acquisition unit 50 images each IC device 90.
  • the surface state acquisition unit 50 is configured such that two adjacent portions arranged along the X-axis direction are arranged between the placement units 180 placed in each placement row (the first placement row 180a and the second placement row 180b).
  • Each IC device 90 is imaged by irradiating light at a predetermined timing in accordance with the pitch between the mounting portions 180. Thereby, the surface state acquisition part 50 image
  • the signal acquired by the surface state acquisition unit 50 is taken into the imaging control unit 313, and the imaging control unit 313 generates two-dimensional image data.
  • An appearance inspection is performed based on the image data.
  • the presence and extent of scratches (including defects such as cracks, dents, and chips) on the IC device 90 are determined.
  • an IC device 90 that satisfies the criteria set by the degree of scratches or the like is accepted, and an IC device 90 that does not meet the criteria is rejected.
  • the set standard can be arbitrarily adjusted.
  • size of a crack etc. is measured or a position is specified as needed.
  • the surface state acquisition unit 50 by generating two-dimensional image data using the surface state information of the IC device 90 acquired by the surface state acquisition unit 50, for example, it is possible to easily determine whether or not there is a scratch or the like on the surface of the IC device 90. be able to.
  • the IC device 90 is collected by the collection robot 20 provided in the device collection area A4 based on the results of the electrical inspection and the appearance inspection described above. Sort (see FIG. 2).
  • the IC devices 90 that pass both the electrical inspection result and the appearance inspection result are sorted into empty trays 200 provided in the device collection area A4.
  • the IC device 90 in which one of the result of the electrical inspection and the result of the appearance inspection fails is sorted into the collection tray 19.
  • the IC devices 90 sorted into the empty tray 200 provided in the device collection area A4 are transported to the tray removal area A5.
  • the surface state acquisition unit 50 acquires information on the surface state of the IC device 90 in a state of being placed on the electronic component recovery unit 18.
  • the IC device 90 by imaging the IC device 90 in a state where the IC device 90 is placed on the electronic component collecting unit 18, it is omitted to provide a dedicated appearance inspection region for performing an appearance inspection of the IC device 90. can do.
  • the movement of the IC device 90 is reduced as compared with the case where a dedicated appearance inspection area for performing the appearance inspection is provided, and the appearance inspection of the IC device 90 can be performed more quickly.
  • the number of times the IC device 90 is gripped or released can be reduced, it is possible to prevent the IC device 90 from being damaged.
  • the surface state acquisition unit 50 acquires information on the surface state of the IC device 90 in the middle of the conveyance path C18 by the electronic component collection unit 18. Thereby, information on the surface state of the IC device 90 can be continuously imaged while the plurality of IC devices 90 are being transported while being placed on the electronic component collection unit 18. Therefore, it is possible to acquire the surface state information of the plurality of IC devices 90 more quickly than in the past.
  • the surface state acquisition unit 50 acquires information on the surface state of the IC device 90 on the electronic component collection unit 18 that is a transport unit that transports the IC device 90 after inspection. ing. Thereby, for example, even if the IC device 90 is scratched during the electrical inspection of the IC device 90, the scratch or the like can be found. Therefore, the reliability of the IC device 90 that is finally shipped as a product can be improved.
  • a tray conveyance mechanism 22a as a conveyance unit for placing and conveying the IC device 90 after inspection.
  • a surface state acquisition unit 50 may be provided in the vicinity of the tray transport mechanism 22a.
  • the surface state acquisition unit 50 may acquire information on the surface states of all the IC devices 90, but the electrical inspection result is It is preferable to acquire only the information on the surface state of the IC device 90 that is passed. Thereby, since the acquisition of the surface state of the IC device 90 which is unacceptable is not performed, an unnecessary appearance inspection can be omitted.
  • any of the tray transport mechanism 11a and the transport unit of the electronic component supply unit 14 is transported. What is necessary is just to provide the surface state acquisition part 50 in the vicinity of a part.
  • the imaging device 51 images the IC device 90 from above the IC device 90. Thereby, it is possible to determine whether or not the upper surface 911 of the IC device 90 is scratched. Circuits are concentrated on the upper surface 911 of the IC device 90. Therefore, by determining whether the upper surface 911 of the IC device 90 is scratched or not, the reliability of the IC device 90 that is finally shipped as a product can be improved.
  • the surface state acquisition unit 50 images the entire IC device 90 by one imaging, but may image a plurality of IC devices 90 by one imaging. Further, the surface state acquisition unit 50 may divide and image one IC device 90 into a plurality.
  • FIG. 8 is a schematic perspective view showing an inspection apparatus (electronic component inspection apparatus) according to the second embodiment of the present invention.
  • FIG. 9 is a schematic plan view of the inspection apparatus shown in FIG.
  • FIG. 10 is a block diagram illustrating a control device, a setting display unit, and a surface state acquisition unit included in the inspection apparatus illustrated in FIG.
  • FIG. 11 is an enlarged schematic plan view of the inspection region shown in FIG.
  • FIG. 12 is a schematic side view of the surface state acquisition unit shown in FIG.
  • FIG. 13 is a diagram for explaining the moving direction of the surface state acquisition unit shown in FIG. 11.
  • FIG. 14 is a view for explaining conveyance of the electronic component collection unit shown in FIG.
  • FIG. 15 is a schematic plan view showing an IC device imaged using the surface state acquisition unit shown in FIG.
  • an inspection apparatus (electronic component inspection apparatus) 1 ⁇ / b> A includes a conveyance apparatus (electronic component conveyance apparatus) 10 that conveys an IC device (electronic component) 90, an inspection unit 16, and a display unit 41. And a setting display unit 40 having an operation unit 42 and a control device 30A. Further, the inspection apparatus 1A includes a surface state acquisition unit 50A including an imaging device 51A and a strobe 52, and a moving mechanism 60 that moves the surface state acquisition unit 50A along the Y-axis direction (see FIG. 12). ).
  • the conveying apparatus 10 is comprised by the structure except the test
  • the inspection apparatus 1A includes a tray supply area A1, a device supply area A2, an inspection area A3 in which an inspection unit 16 is provided, a device collection area A4, and a tray removal area A5. It is divided into and. Since each of these areas A1 to A5 is the same as that in the above-described embodiment, the description thereof is omitted.
  • control device 30A As illustrated in FIG. 10, the control device 30A has a function of controlling each unit of the inspection device 1A, and includes a control unit 31A and a storage unit 32.
  • the control unit 31A includes, for example, a CPU (Central Processing Unit), and includes a drive control unit 311A, an inspection control unit 312 and an imaging control unit (surface state acquisition control unit) 313.
  • the storage unit 32 includes, for example, a read only memory (ROM) and a random access memory (RAM).
  • the drive control unit 311A includes components (tray transport mechanisms 11a and 11b, a temperature adjustment unit 12, a supply robot 13, a supply empty tray transport mechanism 15, an electronic component supply unit 14, an inspection unit 16, a measurement robot 17, and an electronic component collection unit 18).
  • the drive of the recovery robot 20, the recovery empty tray transport mechanism 21, the tray transport mechanisms 22a and 22b, and the moving mechanism 60) is controlled.
  • the inspection control unit 312 can inspect the IC device 90 arranged in the inspection unit 16 based on a program (software) stored in the storage unit 32, for example.
  • the imaging control unit 313 controls driving of the surface state acquisition unit 50A and the like. In addition, the imaging control unit 313 processes a signal from the imaging device 51A, and converts the surface state information of the IC device 90 acquired by the surface state acquisition unit 50A into data (generates image data).
  • control unit 31A has a function of displaying the driving of each unit, inspection results, image data, and the like on the display unit 41, a function of performing processing in accordance with an input from the operation unit 42, and the like.
  • the storage unit 32 stores programs, data, and the like for the control unit 31A to perform various processes.
  • the setting display unit 40 includes a display unit 41 and an operation unit 42.
  • the operator can set or confirm various processes, conditions, and the like of the inspection apparatus 1A via the monitor 411 of the display unit 41.
  • the operation unit 42 is an input device such as a mouse 421, and outputs an operation signal corresponding to an operation by an operator to the control unit 31A. Therefore, the operator can use the mouse 421 to instruct various types of processing to the control unit 31A.
  • the surface state acquisition unit 50 ⁇ / b> A has a function of acquiring information on the surface state of the IC device 90 that is placed on the electronic component recovery unit 18.
  • the surface state acquisition unit 50A is provided in the middle of the conveyance path C18 of the electronic component recovery unit 18 in the vicinity between the inspection region A3 and the device recovery region A4. . That is, the surface state acquisition unit 50A is provided at a position where the surface state information of the IC device 90 after the inspection (electrical inspection) can be acquired.
  • the surface state acquisition unit 50A has two first surface state acquisition units 50Aa and two second surface state acquisition units 50Ab.
  • the first surface state acquisition unit 50Aa and the second surface state acquisition unit 50Ab are arranged side by side in the Y-axis direction.
  • the first surface state acquisition unit 50 ⁇ / b> Aa is provided above the first arrangement row 180 a of the electronic component collection unit 18.
  • the second surface state acquisition unit 50Ab is provided above the second arrangement row 180b of the electronic component collection unit 18.
  • the number of the surface state acquisition units 50A is four.
  • the number of the surface state acquisition units 50A is not limited to this and is arbitrary.
  • the number of surface state acquisition units 50A is preferably the same as the number of arrangement rows.
  • the surface state acquisition unit 50 ⁇ / b> A is supported by a moving mechanism 60 described later so as to be disposed above the electronic component collection unit 18. Thereby, the surface state acquisition unit 50A can acquire information on the state of the upper surface 911 of the IC device 90 from vertically above the IC device 90 in the electronic component recovery unit 18.
  • the first surface state acquisition unit 50Aa and the second surface state acquisition unit 50Ab have an imaging device 51A and a strobe 52, respectively.
  • the imaging device 51A has an imaging element that receives light from the IC device 90 and converts it into an electrical signal.
  • the imaging device 51A is not particularly limited.
  • a camera CCD camera
  • CCD Charge-Coupled Device
  • CMOS Complementary Metal Oxide Semiconductor
  • An electronic camera digital camera
  • a camera using a MOS image sensor as an image pickup device can be used.
  • differential interference method, Fourier transform method or the like it is possible to emphasize fine scratches and scratches that are difficult to see and improve the detection sensitivity of the scratches.
  • the imaging device 51A is preferably provided with an optical system such as an optical lens or an autofocus mechanism (not shown).
  • an optical system such as an optical lens or an autofocus mechanism (not shown).
  • the surface state acquisition unit 50A having such a configuration irradiates the IC device 90 with light using the strobe 52, and images a plurality of IC devices 90 placed on the electronic component collection unit 18 with the imaging device 51A.
  • a signal from the imaging device 51A is taken into the imaging control unit 313 described above.
  • the imaging control unit 313 processes a signal from the imaging device 51A and generates information on the surface state of the IC device 90 as two-dimensional image data.
  • the three-dimensional image data may be generated using the surface state information of the IC device 90 acquired by the surface state acquisition unit 50A.
  • two or more (for example, three) surface state acquisition units 50A may be provided for one arrangement row.
  • the size (particularly depth) of the scratches can be measured.
  • a three-dimensional image (3D image image) may be acquired by a laser measuring device (laser length measuring device) using a triangulation method.
  • the moving mechanism 60 has a function of moving the surface state acquisition unit 50 ⁇ / b> A in the Y-axis direction different from the X-axis direction that is the conveyance direction of the electronic component recovery unit 18.
  • the movement mechanism 60 can move the two first surface state acquisition units 50Aa and the two second surface state acquisition units 50Ab together in the same direction by the single movement mechanism 60. These may be configured to be independently movable.
  • the moving mechanism 60 includes a support member 61 to which the surface state acquisition unit 50A is attached, and a moving unit 62 that supports the support member 61 so as to be movable in the Y-axis direction.
  • the moving mechanism 60 is attached to, for example, a support leg (not shown) that supports the inspection unit 16 and the measurement robot 17.
  • the support member 61 can be reciprocated in the Y-axis direction, which is the arrangement direction of the first arrangement row 180a and the second arrangement row 180b, of the electronic component collection unit 18 by the moving unit 62.
  • the support member 61 is configured to reciprocate at a predetermined pitch P1. For this reason, as shown in FIG. 13, the surface state acquisition unit 50A can reciprocate in the Y-axis direction at a predetermined pitch P1.
  • the pitch P1 is set to almost half of the width W (the length in the Y-axis direction) of the IC device 90.
  • the moving unit 62 includes a drive source (not shown) that generates power for moving the support member 61, and a power transmission mechanism (not shown) that transmits the power of the drive source to the support member 61. Yes.
  • Examples of the driving source include motors such as servo motors, stepping motors, linear motors, hydraulic cylinders, pneumatic cylinders, and the like.
  • Examples of the power transmission mechanism include a mechanism including a combination of a belt, a gear, a rack and a pinion, a combination of a ball screw and a ball nut, and the like. The driving of the moving mechanism 60 is controlled by the drive control unit 311A described above.
  • the IC device 90 is inspected in the inspection area A3 through the tray supply area A1 and the device supply area A2 in order (see FIG. 9).
  • the terminals of the IC device 90 and the probe pins of the inspection unit 16 are electrically connected, and thereby the continuity of the IC device 90 is inspected.
  • the IC device 90 that satisfies the condition that is higher than the standard set by the conduction state is accepted, and the IC device 90 that does not meet the standard is rejected.
  • the set standard can be arbitrarily adjusted.
  • the inspection result may be not only two results of pass and fail but also a result classified into a plurality of results.
  • the IC device 90 that has been inspected is transported and placed by the measuring robot 17 from the inspection unit 16 to the electronic component collection unit 18.
  • the electronic component collection unit 18 on which the IC device 90 is placed is conveyed from the inspection area A3 to the device collection area A4 side along the arrow X1 direction (+ X axis direction). While being conveyed in the direction of the arrow X1, the surface state acquisition unit 50A images each IC device 90.
  • the surface state acquisition unit 50A includes two adjacent ones arranged along the X-axis direction between the placement units 180 placed in each placement row (the first placement row 180a and the second placement row 180b). Each IC device 90 is imaged by irradiating light at a predetermined timing in accordance with the pitch between the mounting portions 180. Thereby, the surface state acquisition unit 50A continuously images the plurality of IC devices 90.
  • the surface state acquisition unit 50 ⁇ / b> A is in the imaging region Y ⁇ b> 1 so as to include the first portion 91 on the upper right (+ X axis direction and + Y axis direction) of each IC device 90. Take an image.
  • the electronic component collection unit 18 is conveyed from the device collection area A4 side to the inspection area A3 along the arrow X2 direction ( ⁇ X axis direction).
  • the surface state acquisition unit 50A continuously images the plurality of IC devices 90 in the same manner as described above.
  • the surface state acquisition unit 50A includes the imaging region Y2 so as to include the second portion 92 at the upper left ( ⁇ X axis direction and + Y axis direction) of each IC device 90. Take an image with.
  • the surface state acquisition unit 50A moves at the pitch P1 in the ⁇ Y-axis direction by driving the moving mechanism 60 under the control of the drive control unit 311A.
  • the surface state acquisition unit 50 ⁇ / b> A includes the plurality of IC devices 90 while the electronic component recovery unit 18 is reciprocating in the directions of the arrows X ⁇ b> 1 and X ⁇ b> 2.
  • the surface state acquisition unit 50A includes a third portion 93 at the lower right of each IC device 90 (+ X axis direction and ⁇ Y axis direction), and each IC device 90.
  • the fourth portion 94 in the lower left ( ⁇ X axis direction and ⁇ Y axis direction) is imaged in this order.
  • the surface state acquisition unit 50A images the IC device 90 in four divisions while the electronic component collection unit 18 is moving.
  • the information can be acquired with higher accuracy than when the information on the upper surface 911 of the IC device 90 is acquired collectively.
  • the surface state acquisition unit 50A captures an image so as to include an area where the imaging area Y1 and the imaging area Y2 overlap.
  • the IC device 90 is imaged so as to include a portion where the first portion 91 and the second portion 92 overlap.
  • the pitch P ⁇ b> 1 of the moving mechanism 60 is approximately half the width W of the IC device 90. Therefore, the surface state acquisition unit 50A moved in the ⁇ Y-axis direction by the moving mechanism 60 captures an image in the imaging region Y1 so that a portion overlapping the first portion 91 is generated, and a portion overlapping the second portion 92 is generated. It is possible to take an image in the imaging area Y2. Thereby, the IC device 90 is imaged so that the first portion 91, the second portion 92, the third portion 93, and the fourth portion 94 have portions that overlap each other. By imaging in this way, it is possible to prevent or reduce the occurrence of an imaging omission area of the IC device 90.
  • the signal acquired by the surface state acquisition unit 50A is taken into the imaging control unit 313, and the imaging control unit 313 generates two-dimensional image data.
  • An appearance inspection is performed based on the image data. In this appearance inspection, the presence and extent of scratches (including defects such as cracks, dents, and chips) on the IC device 90 are determined. In this appearance inspection, an IC device 90 that satisfies the criteria set by the degree of scratches or the like is accepted, and an IC device 90 that does not meet the criteria is rejected.
  • the set standard can be arbitrarily adjusted. Further, the size of a scratch or the like is measured or the position is specified as necessary.
  • the presence or absence and degree of the surface of the IC device 90 are easily determined. be able to.
  • the imaging control unit 313 generates a plurality of signals obtained by dividing the surface state acquisition unit 50A as described above as combined (composite) image data. Accordingly, the appearance inspection can be performed collectively for each IC device 90 based on the synthesized image data without performing the appearance inspection for each portion acquired by dividing the surface state information of the IC device 90. it can. For this reason, throughput can be increased.
  • the IC device 90 After the imaging of the IC device 90 by the surface state acquisition unit 50A is completed, the IC device 90 is converted into the result of the electrical inspection and the result of the appearance inspection by the electronic component collection unit 18 provided in the device collection region A4. Based on the classification (see FIG. 9). The IC devices 90 that pass both the electrical inspection result and the appearance inspection result are sorted into empty trays 200 provided in the device collection area A4. On the other hand, the IC device 90 in which one of the result of the electrical inspection and the result of the appearance inspection fails is classified into the collection tray 19 or the like.
  • the IC devices 90 sorted into the empty tray 200 provided in the device collection area A4 are transported to the tray removal area A5.
  • the surface state acquisition unit 50A acquires information on the surface state of the IC device 90 that is placed on the electronic component recovery unit 18. As described above, by imaging the IC device 90 in a state where the IC device 90 is placed on the electronic component collecting unit 18, it is omitted to provide a dedicated appearance inspection region for performing an appearance inspection of the IC device 90. can do. Further, the movement of the IC device 90 is reduced as compared with the case where a dedicated appearance inspection area for performing the appearance inspection is provided, and the appearance inspection of the IC device 90 can be performed more quickly. Furthermore, since the number of times the IC device 90 is gripped or released can be reduced, it is possible to prevent the IC device 90 from being damaged.
  • the surface state acquisition unit 50A can move in the Y-axis direction, which is a different direction from the electronic component collection unit 18 that can move in the X-axis direction, so that the first portion 91 and the second portion of the IC device 90 can be moved.
  • the third portion 93 and the fourth portion 94 can be imaged.
  • the upper surface 911 of the IC device 90 can be imaged by being divided into the first portion 91, the second portion 92, the third portion 93, and the fourth portion 94.
  • the resolution of the acquisition unit 50A can be increased in a pseudo manner. As a result, information on the surface state of the IC device 90 can be obtained with high accuracy.
  • the X-axis direction in which the electronic component recovery unit 18 moves and the Y-axis direction in which the surface state acquisition unit 50A moves are perpendicular to each other along the horizontal plane. For this reason, a plurality of IC devices 90 provided along the X-axis direction can be continuously divided and imaged. Therefore, the information on the surface states of the plurality of IC devices 90 can be acquired more easily and more quickly. Further, since the electronic component collection unit 18 and the surface state acquisition unit 50A each move along a horizontal plane, the IC device 90 is placed in the state where the upper surface 911 to be inspected of the IC device 90 is directed upward. 18, and information on the surface state of the IC device 90 can be acquired.
  • the surface state acquisition unit 50A is movable at a predetermined pitch P1. Then, the surface state acquisition unit 50A images the first part 91 and the third part 93 of the plurality of IC devices 90 on the movement path (outward path) in the X1 direction of the electronic part recovery part 18 to recover the electronic part.
  • the second part 92 and the fourth part 94 of the plurality of IC devices 90 are imaged on the movement path (return path) of the unit 18 in the X2 direction. In this way, the movement of the electronic component collection unit 18 and the movement of the movement mechanism 60 including the surface state acquisition unit 50A are synchronized or linked. For this reason, the information of the surface state of the plurality of IC devices 90 can be acquired more efficiently. Thus, throughput can be increased.
  • the surface state acquisition unit 50A acquires information on the surface state of the IC device 90 on the electronic component collection unit 18, which is a transport unit that transports the IC device 90 after inspection. ing. Thereby, for example, even if the IC device 90 is scratched during the electrical inspection of the IC device 90, the scratch or the like can be found. Therefore, the reliability of the IC device 90 that is finally shipped as a product can be improved.
  • a surface state acquisition unit 50A may be provided in the vicinity of the tray transport mechanism 22a.
  • the surface state acquisition unit 50A may acquire the surface state information of all the IC devices 90, but the electrical inspection result is It is preferable to acquire only the information on the surface state of the IC device 90 that is passed. Thereby, since the acquisition of the surface state of the IC device 90 which is unacceptable is not performed, an unnecessary appearance inspection can be omitted.
  • any of the tray transport mechanism 11a and the transport unit of the electronic component supply unit 14 is transported.
  • the surface state acquisition unit 50A may be provided in the vicinity of the unit.
  • the imaging apparatus 51A images the IC device 90 from above the IC device 90. Thereby, it is possible to determine whether or not the upper surface 911 of the IC device 90 is scratched. Circuits are concentrated on the upper surface 911 of the IC device 90. Therefore, by determining whether the upper surface 911 of the IC device 90 is scratched or not, the reliability of the IC device 90 that is finally shipped as a product can be improved.
  • FIG. 16 is a view for explaining conveyance of the electronic component collection unit according to the third embodiment of the present invention.
  • FIG. 17 is a diagram for explaining the moving direction of the surface state acquisition unit according to the third embodiment.
  • FIG. 18 is a schematic plan view showing an IC device imaged using the inspection apparatus according to the third embodiment.
  • the inspection apparatus 1B according to the present embodiment is the same as the inspection apparatus 1A according to the second embodiment described above except that the imaging area of the imaging apparatus 51B included in the surface state acquisition unit 50B is different.
  • the imaging regions Y3 and Y4 are about 1 ⁇ 2 of the size of the upper surface 911 of the IC device 90 in the electronic component collection unit 18 or more. It is configured to be large.
  • the imaging regions Y3 and Y4 are set to have a length in the X-axis direction that is longer than a length in the Y-axis direction and is almost twice as long as the length in the Y-axis direction.
  • the surface state acquisition unit 50B includes a plurality of ICs.
  • the device 90 is continuously imaged.
  • the surface state acquisition unit 50B captures an image in the imaging region Y3 so as to include a first portion 95 that is a portion on the + Y-axis direction side of each IC device 90.
  • the surface state acquisition unit 50B moves at the pitch P1 in the ⁇ Y axis direction by driving the moving mechanism 60 under the control of the drive control unit 311A.
  • the surface state acquisition unit 50B has a plurality of surface state acquisition units 50B.
  • the IC device 90 is continuously imaged.
  • the surface state acquisition unit 50B captures an image in the imaging region Y4 so as to include the second portion 96 that is a portion on the ⁇ Y axis direction side of each IC device 90.
  • the surface state acquisition unit 50B images the upper surface 911 of the IC device 90 in two parts while the electronic component collection unit 18 is moving.
  • the information can be acquired with higher accuracy than in the case where the information on the surface state of the upper surface 911 of the IC device 90 is acquired collectively.
  • the surface state acquisition unit 50B performs imaging so as to include an area where the imaging area Y3 and the imaging area Y4 overlap.
  • the IC device 90 is imaged so as to include a portion where the first portion 95 and the second portion 96 overlap.
  • FIG. 19A is a view for explaining conveyance of the electronic component collection unit according to the fourth embodiment of the present invention.
  • FIG. 19B is a schematic plan view showing an IC device imaged using the inspection apparatus according to the fourth embodiment of the present invention.
  • the inspection apparatus 1C according to the present embodiment does not include the moving mechanism 60 that moves the surface state acquisition unit 50C in the Y-axis direction, and the imaging region of the imaging device 51C included in the surface state acquisition unit 50C is different. This is the same as the inspection apparatus 1B according to the third embodiment described above.
  • the imaging area (imaging areas Y5, Y6) of the imaging device 51C is configured to be about 1 ⁇ 2 or larger than the size of the upper surface 911 of the IC device 90 in the electronic component collection unit 18. Yes. Further, the imaging region has a length in the X-axis direction that is shorter than a length in the Y-axis direction and is set to approximately 1 ⁇ 2 times the length in the Y-axis direction.
  • the moving mechanism 60 of the above-described embodiment is not provided, and the surface state acquisition unit 50C is provided on a support unit (not illustrated) so as to be disposed above the electronic component recovery unit 18. It is supported.
  • the surface state acquisition unit 50C includes a plurality of ICs.
  • the device 90 is continuously imaged.
  • the surface state acquisition unit 50C images in the imaging region Y5 so as to include the first portion 97 that is a portion on the + X-axis direction side of each IC device 90.
  • the surface state acquisition unit 50C includes a plurality of surface state acquisition units 50C.
  • the IC device 90 is continuously imaged.
  • the surface state acquisition unit 50C images in the imaging region Y6 so as to include the second portion 98 that is a portion on the ⁇ X axis direction side of each IC device 90.
  • the surface state acquisition unit 50C images the upper surface 911 of the IC device 90 in two parts while the electronic component collection unit 18 is moving.
  • the information can be acquired with higher accuracy than in the case where the information on the surface state of the upper surface 911 of the IC device 90 is acquired collectively.
  • the surface state acquisition unit 50C images so as to include an area where the imaging area Y5 and the imaging area Y6 overlap.
  • the IC device 90 is imaged so as to include a portion where the first portion 97 and the second portion 98 overlap.
  • the surface state acquisition unit 50C is fixedly arranged with respect to the inspection apparatus 1C, it is possible to reduce the influence of vibration and the like caused by the movement of the surface state acquisition unit 50C. Therefore, the information can be acquired with higher accuracy.
  • the surface state acquisition units 50A, 50B, and 50C image one IC device 90 in two or four divisions.
  • the number of divisions is not particularly limited, and the performance of the imaging device, etc. It is appropriately set according to various conditions.
  • the number of divisions is preferably an even number, more preferably 2 or more and 64 or less, and further preferably 2 or more and 16 or less. Specifically, 2 divisions or 4 divisions are preferable, and 4 divisions are particularly preferable. Thereby, compared with the case where the information on the surface state of the IC device 90 is acquired collectively, the information can be acquired with high accuracy.
  • FIG. 20 is an enlarged schematic plan view of an inspection region included in the inspection apparatus according to the fifth embodiment of the present invention.
  • FIG. 21 and FIG. 22 are diagrams for explaining the conveyance of the electronic component collection unit shown in FIG.
  • the inspection apparatus 1 ⁇ / b> D according to the present embodiment is the same as the inspection apparatus 1 ⁇ / b> A according to the second embodiment described above except that the number and movement range of the surface state acquisition units are different from the imaging region of the imaging apparatus included in the surface state acquisition unit. It is the same.
  • the inspection apparatus 1D of the present embodiment includes two surface state acquisition units 50D.
  • the two surface state acquisition units 50D are provided side by side in the Y-axis direction.
  • One surface state acquisition unit 50D is provided above the electronic component collection unit 18 provided on the + Y axis direction side.
  • the other surface state acquisition unit 50D is provided above the electronic component recovery unit 18 provided on the ⁇ Y axis direction side.
  • the surface state acquisition unit 50D is provided corresponding to each electronic component collection unit 18.
  • the imaging region of the surface state acquisition unit 50D is configured to be equal to or larger than the size of the upper surface 911 of the IC device 90 in the electronic component collection unit 18.
  • the two surface state acquisition units 50D are supported by the moving mechanism 60 as in the above-described embodiment.
  • Each support member 61 can be reciprocated in the Y-axis direction, which is the direction in which the two electronic component collection units 18 are arranged, by the moving unit 62. Further, as shown in FIG. 21, the support member 61 is configured to reciprocate at a predetermined pitch P2 between the first arrangement row 180a and the second arrangement row 180b of one electronic component collection unit 18. Has been.
  • the surface state acquisition unit 50D is capable of reciprocating in the Y-axis direction and has a predetermined predetermined pitch between the first arrangement row 180a and the second arrangement row 180b of one electronic component collection unit 18. It is configured to reciprocate at P2.
  • the pitch P2 is the pitch P3 between the placement portion 180 provided in the first placement row 180a and the placement portion 180 provided in the second placement row 180b adjacent to the placement portion. Is set to be almost equivalent.
  • the surface state acquisition unit 50D is in the first arrangement while the electronic component collection unit 18 on which the IC device 90 is placed is moving in the arrow X1 direction (+ X axis direction).
  • the plurality of IC devices 90 provided in the column 180a are continuously imaged.
  • the surface state acquisition unit 50D moves at the pitch P2 in the ⁇ Y-axis direction by driving the moving mechanism 60 under the control of the drive control unit.
  • the surface state acquisition unit 50D performs the second operation.
  • the plurality of IC devices 90 provided in the arrangement row 180b are continuously imaged.
  • the surface state acquisition unit 50D continuously images the plurality of IC devices 90 while the electronic component collection unit 18 is moving.
  • the surface state acquisition unit 50D can be moved between the first arrangement row 180a and the second arrangement row 180b by the moving mechanism 60, and the first arrangement row 180a and the second arrangement row.
  • Information on the surface state of the IC device 90 placed on 180b can be acquired. For this reason, even if the number of surface state acquisition units 50D corresponding to the number of each arrangement row is not provided, information on the surface states of the IC devices 90 placed in a plurality of arrangement rows by one surface state acquisition unit 50D is obtained. It can be acquired efficiently.
  • the surface state acquisition unit 50D captures the plurality of IC devices 90 mounted on the first arrangement row 180a, and then moves in the ⁇ Y axis direction to move to the second arrangement row 180b.
  • the plurality of IC devices 90 placed are imaged.
  • the surface state acquisition unit 50D images the plurality of IC devices 90 placed in the first arrangement row 180a in the movement path (outward path) in the X1 direction of the electronic component collection unit 18,
  • the plurality of IC devices 90 placed in the second arrangement row 180b are imaged along the movement path (return path) in the X2 direction of the electronic component collection unit 18.
  • FIG. 23 is a schematic plan view showing a sixth embodiment of the electronic component inspection apparatus of the present invention.
  • FIG. 24 is a block diagram of the electronic component inspection apparatus shown in FIG. 23, and typically shows one surface state acquisition unit.
  • 25 is a plan view showing a surface state acquisition unit and its vicinity of the electronic component inspection apparatus shown in FIG. 26 is a side view (including a partial cross-sectional view) showing a surface state acquisition unit and its vicinity of the electronic component inspection apparatus shown in FIG.
  • the inspection apparatus 1E includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”).
  • supply area a device supply area
  • A3 a device collection area
  • collection area A5 a device collection area
  • the first chamber R1 (supply region A2), the second chamber R2 (inspection region A3), and the third chamber R3 (collection region A4) are each configured to ensure airtightness and heat insulation. ing. Thereby, each of the first chamber R1, the second chamber R2, and the third chamber R3 can maintain humidity and temperature as much as possible.
  • the interiors of the first chamber R1 and the second chamber R2 are controlled to a predetermined humidity and a predetermined temperature, respectively.
  • the IC device 90 passes through the respective areas in order from the tray supply area A1 to the tray removal area A5, and the inspection is performed in the intermediate inspection area A3.
  • the inspection apparatus 1E includes the electronic component transport apparatus that transports the IC device 90 in each region and includes the control unit 80, the inspection unit 16 that performs inspection in the inspection region A3, and an inspection control unit (not shown). It has become.
  • an electronic component transport apparatus is configured by a configuration excluding the inspection unit 16 and the inspection control unit.
  • the tray supply area A1 is an area to which a tray 200 in which a plurality of IC devices 90 in an uninspected state are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.
  • the supply area A2 is an area for supplying a plurality of IC devices 90 on the tray 200 from the tray supply area A1 to the inspection area A3.
  • the 1st tray conveyance mechanism 11a and the 2nd tray conveyance mechanism 11b which convey the tray 200 one by one are provided so that tray supply area
  • a temperature adjusting unit (soak plate) 12 which is an arrangement unit in which the IC device 90 is arranged, a first device conveyance head 13, and a third tray conveyance mechanism 15 are provided.
  • the temperature adjustment unit 12 is an apparatus that heats or cools the plurality of IC devices 90 to adjust (control) the IC devices 90 to a temperature suitable for inspection. That is, the temperature adjustment unit 12 is a temperature control member (member) that can arrange the IC device 90 and can perform both heating and cooling of the IC device 90. In the present embodiment, two temperature adjusting units 12 are arranged and fixed in the Y-axis direction. Then, the IC device 90 on the tray 200 carried (conveyed) from the tray supply area A1 by the first tray transport mechanism 11a is transported to and placed on any temperature adjustment unit 12.
  • the first device transport head 13 is supported so as to be movable in the X-axis direction, the Y-axis direction, and the Z-axis direction in the supply region A2. Thereby, the first device transport head 13 transports the IC device 90 between the tray 200 carried in from the tray supply area A1 and the temperature adjustment unit 12, the temperature adjustment unit 12, and a device supply unit 14 to be described later. And the IC device 90 can be transported between them.
  • the first device transport head 13 has a plurality of hand units 131 as gripping units (electronic component gripping units) that grip the IC device 90, and each hand unit 131 is a second device described later.
  • the suction nozzle is provided and the IC device 90 is gripped by suction.
  • the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection. It may be configured as follows.
  • the third tray transport mechanism 15 is a mechanism for transporting the empty tray 200 in a state where all the IC devices 90 have been removed in the X-axis direction. After this conveyance, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the second tray conveyance mechanism 11b.
  • the inspection area A3 is an area where the IC device 90 is inspected.
  • a device supply section (supply shuttle) 14 that is a transport section (placement section) capable of arranging (mounting) and transporting the IC device 90, an inspection section 16, and a second device transport A head 17 and a device collection unit (collection shuttle) 18 that is a conveyance unit (mounting unit) that can arrange (place) and transport the IC device 90 are provided.
  • the device supply unit 14 is a device that conveys the temperature-adjusted (temperature-controlled) IC device 90 to the vicinity of the inspection unit 16.
  • the device supply unit 14 includes a placement plate 142 on which the IC device 90 is placed (placed), and a device supply unit main body 141 that can move in the X-axis direction. On the upper surface of the arrangement plate 142, a plurality of pockets 145, which are recesses for accommodating (holding) the IC device 90, are provided.
  • the arrangement plate 142 is detachably installed on the device supply unit main body 141.
  • the device supply unit 14 is supported so as to be movable between the supply region A2 and the inspection region A3 along the X-axis direction.
  • two device supply units 14 are arranged in the Y-axis direction, and the IC device 90 on the temperature adjustment unit 12 is one of the device supply units 14 by the first device transport head 13. Are transported to and placed.
  • the IC device 90 similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection.
  • the inspection unit 16 is a unit that inspects / tests (electrically inspects) the electrical characteristics of the IC device 90, that is, a member that holds the IC device 90 when inspecting the IC device 90.
  • the inspection unit 16 includes a holding member 162 that holds the IC device 90 and an inspection unit main body 161 that supports the holding member 162.
  • the holding member 162 is detachably installed on the inspection unit main body 161.
  • a plurality of holding units 163 that are concave portions that house (hold) the IC device 90 are provided on the upper surface of the holding member 162 of the inspection unit 16.
  • the IC device 90 is accommodated in the holding unit 163, thereby being arranged (placed) on the inspection unit 16.
  • probe pins that are electrically connected to the terminals of the IC device 90 in a state where the IC device 90 is held by the holding unit 163 are provided at positions corresponding to the holding units 163 of the inspection unit 16. Yes. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected via the probe pin. The inspection of the IC device 90 is performed based on a program stored in a storage unit of an inspection control unit provided in a tester (not shown) connected to the inspection unit 16. In the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for the inspection.
  • the second device transport head 17 is supported so as to be movable in the Y-axis direction and the Z-axis direction in the inspection area A3.
  • one second device transport head 17 is arranged in the Y-axis direction, and the second device transport head 17 is an IC on the device supply unit 14 carried in from the supply area A2.
  • the device 90 can be transported and placed on the inspection unit 16, and the IC device 90 on the inspection unit 16 can be transported and placed on the device collection unit 18.
  • the second device transport head 17 presses the IC device 90 toward the inspection unit 16, thereby bringing the IC device 90 into contact with the inspection unit 16.
  • the terminals of the IC device 90 and the probe pins of the inspection unit 16 are electrically connected.
  • the number of second device transport heads 17 is not limited to one, and may be two, for example.
  • the second device transport head 17 has a plurality of hand units 171 as gripping parts (electronic component gripping parts) for gripping the IC device 90. Since the configuration of each hand unit 171 is the same, one hand unit 171 will be typically described below.
  • the hand unit 171 includes a gripping member 173 that holds the IC device 90 and a hand unit main body 172 that supports the gripping member 173.
  • the grip member 173 is detachably installed on the hand unit main body 172.
  • the hand unit 171 includes a suction nozzle and grips the IC device 90 by suction. Further, in each hand unit 171 of the second device transport head 17, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the IC device 90 to a temperature suitable for inspection.
  • the device collection unit 18 is an apparatus that conveys the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4.
  • the device collection unit 18 includes an arrangement plate 182 on which the IC device 90 is arranged, and a device collection unit main body 181 that can move in the X-axis direction. On the upper surface of the arrangement plate 182, a plurality of pockets 185, which are recesses for accommodating (holding) the IC devices 90, are arranged in four rows of four.
  • the arrangement plate 182 is detachably installed on the device collection unit main body 181.
  • the device collection unit 18 is supported so as to be movable along the X-axis direction between the inspection area A3 and the collection area A4.
  • two device recovery units 18 are arranged in the Y-axis direction, similarly to the device supply unit 14, and the IC device 90 on the inspection unit 16 is moved by the second device transport head 17. , And are transported to and placed on one of the device collection units 18.
  • the device collection unit 18 and the device supply unit 14 are configured to move independently of each other.
  • the present invention is not limited to this.
  • the device collection unit 18 and the device supply unit 14 include The device collection unit 18 and the device supply unit 14 may be configured to move integrally with each other.
  • the collection area A4 is an area where the IC device 90 that has been inspected is collected.
  • a collection tray 19 In the collection area A4, a collection tray 19, a third device transport head 20, and a sixth tray transport mechanism 21 are provided.
  • An empty tray 200 is also prepared in the collection area A4.
  • the collection trays 19 are fixed in the collection area A4, and in the present embodiment, three collection trays 19 are arranged along the X-axis direction. Three empty trays 200 are also arranged along the X-axis direction. Then, the IC device 90 on the device recovery unit 18 that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.
  • the third device transport head 20 is supported so as to be movable in the X-axis direction, the Y-axis direction, and the Z-axis direction within the collection area A4. Accordingly, the third device transport head 20 can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200.
  • the third device transport head 20 has a plurality of hand units 201 as gripping units (electronic component gripping units) that grip the IC device 90, and each hand unit 201 is configured to transport the second device. Similar to the head 17, the suction nozzle is provided and the IC device 90 is gripped by suction.
  • the sixth tray transport mechanism 21 is a mechanism for transporting the empty tray 200 carried in from the tray removal area A5 in the X-axis direction. Then, after this conveyance, the empty tray 200 is arranged at a position where the IC device 90 is collected, that is, it can be one of the three empty trays 200.
  • the tray removal area A5 is an area where the tray 200 in which a plurality of inspected IC devices 90 are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.
  • a fourth tray transport mechanism 22a and a fifth tray transport mechanism 22b that transport the tray 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5.
  • the fourth tray transport mechanism 22a is a mechanism that transports the tray 200 on which the inspected IC device 90 is placed from the collection area A4 to the tray removal area A5.
  • the fifth tray transport mechanism 22b is a mechanism for transporting an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the collection area A4.
  • the test control unit of the tester performs (electrical) test of the electrical characteristics of the IC device 90 arranged in the test unit 16 based on, for example, a program stored in a storage unit (not shown).
  • the inspection apparatus 1E includes a control unit 80, an operation unit 6 that is electrically connected to the control unit 80 and performs each operation of the inspection apparatus 1E, and information on the surface state of the IC device 90. And a surface state acquisition unit 3 that can acquire the IC device 90, and is configured to be able to perform an appearance inspection (surface inspection) of the IC device 90.
  • the surface state acquisition unit 3 acquires the surface state information of the IC device 90, and based on the surface state information, for example, the determination unit 802 of the control unit 80 described later uses the IC device 90. It is determined whether or not there is a crack such as a crack, a dent or a chip, the size of the scratch is measured, and the position is specified. Note that the appearance inspection may be performed on all of the upper surface, the lower surface (back surface), and the side surfaces in FIG. 26 of the IC device 90, that is, the entire surface. It may be performed only on the upper surface.
  • the appearance inspection may be performed at any stage (process), but is preferably performed after the inspection of the electrical characteristics of the IC device 90 is performed.
  • the IC device 90 is connected to the device collection unit 18. In this state, the IC device 90 is imaged by the imaging device 301 described later, which is the first step of the appearance inspection.
  • the control unit 80 includes a storage unit 801 that stores information, a determination unit 802 that performs each determination (determination), and the like.
  • a storage unit 801 that stores information
  • a determination unit 802 that performs each determination (determination), and the like.
  • the adjustment unit 12 the first device transport head 13, the device supply unit 14, the third tray transport mechanism 15, the second device transport head 17, the device collection unit 18, and the third device transport head 20, the sixth tray transport mechanism 21, the fourth tray transport mechanism 22 a, the fifth tray transport mechanism 22 b, the display unit 602, and the surface state acquisition unit 3.
  • the operation unit 6 includes an input unit 601 for performing each input, and a display unit 602 for displaying each information (data) such as an image.
  • the input unit 601 is not particularly limited, and examples thereof include a keyboard and a mouse.
  • the display unit 602 is not particularly limited, and examples thereof include a liquid crystal display panel and an organic EL display panel.
  • the operator operates the operation unit 6 by, for example, operating the input unit 601, moving the cursor to the position of each operation button (icon) displayed on the display unit 602, and selecting (clicking). Is made by
  • the input unit 601 is not limited to the one having the above configuration, and examples thereof include mechanical operation buttons such as push buttons.
  • the operation unit 6 is not limited to the above-described configuration, and examples thereof include a device such as a touch panel that can input and display information.
  • the surface state acquisition unit 3 includes an imaging device 301 that images the IC device 90 and a strobe 302 that irradiates the IC device 90 with light when the IC device 90 is imaged by the imaging device 301.
  • the imaging apparatus 301 itself may have a strobe 302, or the strobe 302 may be omitted.
  • the imaging device 301 Although it does not specifically limit as the imaging device 301, the camera (CCD camera) which used CCD (Charge
  • CCD Charge
  • CMOS Complementary
  • the surface state acquisition unit 3 is not limited to the imaging device 301 as long as it can acquire information on the surface state of the IC device 90, and for example, the surface of the IC device 90 is irradiated with the laser light, and the laser A device that scans light and receives laser light reflected on the surface is exemplified.
  • the strobe 302 is a light source device that is driven when the IC device 90 is imaged by the imaging device 301 and irradiates the IC device 90 with light.
  • the strobe 302 can suppress an image from becoming dark due to insufficient light quantity.
  • the strobe 302 has an annular shape and is disposed around the imaging device 301.
  • the IC device 90 can be irradiated with light uniformly.
  • the shape and arrangement of the strobe 302 are not limited to the above-described configuration.
  • the inspection apparatus 1E has a structure 5 to which a member for movably supporting the second device transport head 17 is attached, and the surface state acquisition unit 3 has its structure. It is installed on the body 5.
  • the surface state acquisition unit 3 has one surface in one row of pockets 185 of one device collection unit 18, that is, four pockets 185 arranged in the X-axis direction.
  • the state acquisition unit 3 is provided so as to correspond. Then, when the device collection unit 18 moves in the X-axis direction, the imaging device 301 images the surface of the IC device 90 while moving the device collection unit 18 or with the device collection unit 18 stopped. .
  • the imaging device 301 is arranged so as to be positioned above the device collection unit 18 when the device collection unit 18 moves to a position corresponding to the imaging device 301.
  • the upper surface of the IC device 90 in FIG. 26 is imaged. Since the IC device 90 is arranged with concentrated circuits on the upper part, it is preferable to perform an appearance inspection on the upper surface of the IC device 90 in FIG.
  • the imaging device 301 may be configured to be able to image the lower surface (back surface), side surface, and the like of the IC device 90 in FIG.
  • the lower part of the pocket 185 of the device collection unit 18 is formed of a light-transmitting member (transparent member), or a hole is formed in the lower part of the pocket 185. To do.
  • At least the surface of the vicinity of the IC device 90 on the inner surface of the pocket 185 of the device recovery unit 18 or the like are made of a material having a low light reflectance. Alternatively, it may be formed of a material having a high light absorption rate, or may be roughened so that light scattering is increased.
  • the appearance inspection of the IC device 90 can be performed easily and quickly.
  • the number of times the IC device 90 is gripped or released can be reduced, and damage to the IC device 90 can be suppressed.
  • the determination unit 802 of the control unit 80 determines the presence or absence of scratches on the surface of the IC device 90. Moreover, the magnitude
  • the appearance inspection of the IC device 90 may be performed on all the IC devices 90, but it is preferable that the appearance inspection is performed only on the IC devices 90 that have passed the inspection of the electrical characteristics. Thereby, useless imaging of the IC device 90 can be prevented, and the appearance inspection of the IC device 90 can be quickly performed.
  • the imaging of the IC device 90 is performed in a state where the IC device 90 is placed on the device collection unit 18.
  • the present invention is not limited to this. You may carry out in the state mounted in the empty tray 200, and prepare the tray for external appearance inspection which is not illustrated separately, and perform it in the state where IC device 90 was mounted in the tray for external appearance inspection. You can also.
  • the surface state acquisition unit 3 is fixed to the structure 5, but is not limited thereto, and may be installed in the structure 5 or the like so as to be movable in the Y-axis direction.
  • the following configuration 1 and configuration 2 can be realized.
  • (Configuration 1) The number of surface state acquisition units 3 for one device recovery unit 18 is changed from two to one, and the surface state acquisition unit 3 is moved in the Y-axis direction so that one imaging device 301 is arranged in two rows.
  • the IC device 90 is imaged. Specifically, after imaging the first row of IC devices 90 with the imaging device 301, the surface state acquisition unit 3 is moved in the Y-axis direction, that is, the second row of IC devices 90 is moved to a position where imaging is possible. Then, the imaging device 301 images the second row of IC devices 90. In the case of this configuration 1, the number of surface state acquisition units 3 can be reduced, and the configuration of the inspection apparatus 1E can be simplified.
  • (Configuration 2) The imaged region of the IC device 90, that is, the region on the surface of the IC device 90 that is imaged by the imaging device 301 is divided into a plurality (a plurality of parts) and imaged. Thereby, a high-definition image can be obtained and even a fine scratch can be detected.
  • imaging when the imaging area is divided into a plurality of parts in the Y-axis direction, imaging is performed by moving the surface state acquisition unit 3 in the Y-axis direction, and the imaging area is set in the X-axis direction.
  • the IC device 90 device collection unit 18
  • the IC device 90 is moved in the X-axis direction to perform image capturing.
  • images may be taken sequentially. Imaging may be performed by reciprocating between the X axis direction plus side and the X axis direction minus side.
  • the number of divisions is not particularly limited and is appropriately set according to various conditions such as the performance of the imaging device 301, but is an even number. Is preferably 2 or more and 64 or less, more preferably 2 or more and 16 or less. Specifically, two divisions or four divisions are preferable, four divisions are more preferable, two divisions in the X-axis direction, and two divisions in the Y-axis direction (four divisions in total) are more preferable. Thereby, a necessary and sufficiently high-definition image can be obtained, and the entire imaging area can be quickly imaged.
  • two adjacent images may have a common part in each image (imaging region of the imaging device 301), or two adjacent images The boundaries may be matched.
  • the surface state acquisition unit 3 may be configured to be able to acquire a 3D (three-dimensional) image of the IC device 90.
  • an imaging device (not shown) capable of obtaining a 3D image may be used as the surface state acquisition unit 3, and two or more, preferably three or more (for example, three) are illustrated. It is also possible to arrange the imaging devices not to be arranged at positions different from each other and create 3D image data based on image data obtained from the respective imaging devices.
  • the vibration generation unit that generates vibrations.
  • a first tray transport mechanism 11a, a second tray transport mechanism 11b, a third tray transport mechanism 15, a fourth tray transport mechanism 22a, a fifth tray transport mechanism 22b, a sixth tray transport mechanism 21, 1 device transport head 13, second device transport head 17, third device transport head 20, device supply unit 14, device recovery unit 18 and other inspection mechanism 1E (electronic component transport device) drive mechanism at least one
  • the vibration is made smaller than the vibration before acquiring the surface state information (before imaging).
  • “reducing vibration” includes eliminating vibration.
  • making the vibration smaller than the vibration before acquiring the surface state information (before imaging) (operation) is also simply referred to as “vibration reducing operation”.
  • Examples of the driving mechanism include a motor having at least one of a motor such as a servo motor, a slide rail, and a slider.
  • the vibration reduction operation of the drive mechanism for example, the speed of the drive mechanism is made slower than before imaging, and the drive mechanism is stopped.
  • the drive mechanism has a servo motor as a drive source
  • the excitation of the servo motor is stopped (power supply to the servo motor is stopped).
  • the most effective method for reducing or eliminating vibration is to stop the excitation of the servo motor
  • the next most effective method is to stop the drive mechanism.
  • a highly effective method is to make the speed of the drive mechanism slower than before imaging.
  • drive sources such as the first device transport head 13, the second device transport head 17, the third device transport head 20, the device supply unit 14, and the device collection unit 18 are servo motors, respectively.
  • other drive sources are also applicable.
  • the vibration reducing operation may be performed in all the driving devices, and the vibration reducing operation may be performed in some of the driving devices.
  • a high effect can be obtained by performing a vibration reducing operation in the driving device.
  • a vibration reducing operation is performed in some driving apparatuses, a high effect can be obtained by performing the vibration reducing operation in the device collection unit 18 on which the IC device 90 is placed.
  • a clear image can be obtained in the appearance inspection of the IC device 90, whereby the presence or absence of a flaw on the surface of the IC device 90 can be appropriately determined.
  • FIG. 27 is a schematic plan view showing a seventh embodiment of the electronic component inspection apparatus of the present invention.
  • FIG. 28 is a block diagram of the electronic component inspection apparatus shown in FIG. 27. Typically, one surface state acquisition unit and one first vibration detector and one second vibration detector are described.
  • Has been. 29 is a side view (including a partial cross-sectional view) showing a surface state acquisition unit and its vicinity of the electronic component inspection apparatus shown in FIG.
  • FIG. 30 is a flowchart showing an example of the control operation of the control unit of the electronic component inspection apparatus shown in FIG.
  • the inspection apparatus 1F includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”).
  • supply area a device supply area
  • A3 a device collection area
  • collection area a device collection area
  • the inspection apparatus 1F includes an electronic component conveyance apparatus that conveys the IC device 90 in each region and has a control unit 80, an inspection unit 16 that performs inspection in the inspection region A3, and an inspection control unit (not shown). It has become.
  • an electronic component transport apparatus is configured by a configuration excluding the inspection unit 16 and the inspection control unit.
  • the inspection apparatus 1F includes a control unit 80, an operation unit 6 that is electrically connected to the control unit 80 and performs each operation of the inspection apparatus 1F, and vibration detection that detects vibration (vibration information).
  • Unit 4 and a surface state acquisition unit 3 that can acquire information on the surface state of the IC device 90, and is configured to be able to perform an appearance inspection (surface inspection) of the IC device 90.
  • the inspection apparatus 1F has a structure 5 to which a member or the like that movably supports the second device transport head 17 is attached, and the surface state acquisition unit 3 is attached to the structure 5. is set up.
  • the vibration detection unit 4 includes a first vibration detector 401 and a second vibration detector 402 that detect vibration.
  • the first vibration detector 401 is a sensor that detects vibration of the imaging device 301 (a portion of the structure 5 in the vicinity of the imaging device 301). In the present embodiment, when at least one of an angular velocity sensor and an acceleration sensor, which will be described later, is used as the first vibration detector 401, the first vibration detector 401 is a portion of the structure 5 in the vicinity of the imaging device 301. Installed. The first vibration detector 401 is installed in the vicinity of each imaging device 301 of the structure 5. However, the first vibration detector 401 is not limited to this, and for example, one first vibration detector in the structure 5. 401 may be installed.
  • the second vibration detector 402 is a sensor that detects the vibration of the IC device 90, that is, the vibration of the device collection unit 18 on which the IC device 90 is placed. In the present embodiment, when at least one of an angular velocity sensor and an acceleration sensor described later is used as the second vibration detector 402, the second vibration detector 402 is installed in the device recovery unit 18. The second vibration detector 402 is installed in each device recovery unit 18.
  • a predetermined process described later can be performed. In the image obtained in this way, blurring is prevented or reduced, and a clear image is obtained. Thus, by obtaining a clear image, it is possible to appropriately determine whether or not there is a scratch on the surface of the IC device 90.
  • the imaging of the IC device 90 is performed in a state where the IC device 90 is placed on the device collection unit 18, and thus the second vibration detector 402 is installed in the device collection unit 18.
  • the present invention is not limited thereto, and when the IC device 90 is imaged in a state where the IC device 90 is placed on another member, the second vibration detector 402 is installed on the other member, and the other The vibration of the member is detected.
  • the first vibration detector 401 and the second vibration detector 402 are not particularly limited.
  • the first vibration detector 401 and the second vibration detector 402 are optical sensors having an angular velocity sensor (gyro sensor), an acceleration sensor, a light irradiation unit, and a light receiving unit. Examples thereof include sensors and sensors having one or more of these. By using such a sensor, vibration can be detected appropriately.
  • examples of the optical sensor include a laser Doppler vibrometer and a laser displacement meter (displacement sensor).
  • first vibration detector 401 and the second vibration detector 402 may be the same or different. In addition, one of the first vibration detector 401 and the second vibration detector 402 may be omitted.
  • the vibration is detected by the vibration detection unit 4, and predetermined processing is performed based on the detected vibration information (vibration information).
  • vibration information vibration information
  • processing 1 and 2 specific examples of the processing will be described. Further, the vibration detection will be described in the processing 1 as a representative.
  • the vibration information includes, for example, vibration magnitude (strength), vibration period (frequency), and the like.
  • the magnitude of the vibration includes, for example, the amplitude of the vibration (displacement of the target point moved by the vibration), the speed of the target point moved by the vibration (maximum speed), and the acceleration of the target point moved by the vibration (maximum acceleration). Etc.
  • the imaging device 301 images the surface of the IC device 90 and performs an appearance inspection.
  • whether or not the vibration detected by the vibration detection unit 4 is equal to or less than a predetermined vibration is determined based on the amplitude of the vibration, the speed of the target point moved by the vibration (maximum speed), and the target point moved by the vibration. Any one of these accelerations (maximum acceleration), or any two, or three are compared with a predetermined threshold value.
  • the vibration detection unit 4 detects the vibration amplitude, and the detected vibration amplitude is Compare with a predetermined threshold. When the vibration amplitude is equal to or smaller than the threshold, it is determined that the vibration is equal to or smaller than the predetermined vibration.
  • the vibration threshold is an upper limit value of an allowable range of vibration amplitude for obtaining a desired clear image, and is experimentally obtained in advance and stored in the storage unit 801.
  • the determination of the vibration is made by the vibration of the imaging device 301 (the portion in the vicinity of the imaging device 301 of the structure 5) detected by the first vibration detector 401 of the vibration detection unit 4 and the second vibration detector. 402 may be performed for each of the vibrations of the device recovery unit 18 detected by 402, or may be performed for any one of the vibrations. The other relative vibration with respect to the vibration may be obtained and performed on the vibration.
  • the timing for detecting the vibration is not particularly limited as long as it is before imaging by the imaging device 301, but is preferably immediately before the imaging. As a result, it is possible to detect a vibration that is equivalent to or similar to the vibration at the time of imaging.
  • the imaging device 301 does not perform imaging of the IC device 90 and determination of the presence or absence of scratches on the surface of the IC device 90, that is, the IC device. 90 visual inspection is not performed. Accordingly, it is possible to prevent imaging in a situation where an image obtained by imaging with the imaging apparatus 301 is blurred and the image becomes unclear. In such a case, for example, the following process [1] or [2] is preferably performed.
  • the IC device 90 is imaged by the imaging device 301 regardless of the magnitude of vibration, and after the imaging, the amplitude of the vibration is compared with a threshold value, Based on the result, it may be configured to determine whether or not to determine whether or not the surface of the IC device 90 is scratched.
  • the presence / absence of the scratch is determined to complete the appearance inspection. If the detected vibration amplitude is larger than the threshold value, the presence / absence of the scratch is not determined, and therefore the appearance inspection is not completed and the appearance inspection is not performed.
  • vibration detection and imaging can be performed simultaneously.
  • the vibration is detected by the vibration detector 4 and the same processing as described above is performed.
  • an upper limit value for the number of times of vibration detection is set.
  • the vibration after taking a countermeasure against vibration, the vibration may be detected again by the vibration detecting unit 4 and the same processing as described above may be performed, or the vibration is sufficiently reduced by taking the vibration countermeasure.
  • the appearance inspection may be performed without detecting the vibration by the vibration detection unit 4. Further, if the vibration is not sufficiently reduced even after the vibration countermeasure is taken, the vibration countermeasure may be taken again by changing the conditions and method.
  • At least one vibration of the drive mechanism is made smaller than in normal time (during normal operation).
  • “reducing vibration” includes eliminating vibration.
  • making the vibration smaller than the vibration at the normal time (operation) is also simply referred to as “vibration reducing operation”.
  • a method for reducing the vibration of the driving mechanism to be smaller than the vibration at the normal time that is, as the vibration reducing operation of the driving mechanism, for example, the speed of the driving mechanism is made slower than the normal time, the driving mechanism is stopped.
  • the mechanism has a servo motor as a drive source
  • the excitation of the servo motor is stopped (power supply to the servo motor is stopped).
  • the most effective method for reducing or eliminating vibration is to stop the excitation of the servo motor
  • the next most effective method is to stop the drive mechanism.
  • a highly effective method is to make the speed of the drive mechanism slower than before imaging.
  • drive sources such as the first device transport head 13, the second device transport head 17, the third device transport head 20, the device supply unit 14, and the device collection unit 18 are servo motors, respectively.
  • other drive sources are also applicable.
  • the vibration reduction operation may be performed in all the drive mechanisms, and the vibration reduction operation may be performed in some of the drive mechanisms.
  • a high effect can be obtained by performing a vibration reducing operation in the drive mechanism.
  • a high effect can be obtained by performing the vibration reduction operation in the device collection unit 18 on which the IC device 90 is placed.
  • a vibration period (frequency) is detected by the vibration detection unit 4, and an appearance inspection is performed by performing imaging a plurality of times by the imaging device 301 during one period of the detected vibration.
  • the IC device 90 is based on the clear image. It is possible to appropriately determine the presence or absence of scratches on the surface.
  • the number of times of imaging performed in one period of vibration is not particularly limited as long as it is a plurality of times, and is appropriately set according to various conditions, but may be 2 times or more and 20 times or less. Preferably, it is 3 times or more and 15 times or less, more preferably 4 times or more and 10 times or less. Thereby, a clear image in which blurring is prevented or reduced can be obtained. Note that both the processing 2 and the processing 1 may be performed.
  • vibration is detected by the vibration detector 4 (step S101).
  • the detected vibration information is input to the control unit 80 and stored in the storage unit 801.
  • the detected vibration amplitude a is compared with the threshold value as to determine whether or not the vibration amplitude a is equal to or smaller than the threshold value as (step S102).
  • This threshold value as is the upper limit value of the allowable range of the vibration amplitude for obtaining a desired clear image when the imaging device 301 images the surface of the IC device 90.
  • step S102 If it is determined in step S102 that the vibration amplitude a is equal to or less than the threshold value as (YES), the imaging device 301 images the surface of the IC device 90 (step S103). The obtained image data is input to the control unit 80 and stored in the storage unit 801.
  • step S104 the presence / absence of a scratch on the surface of the IC device 90 is determined. Next, the process proceeds to the next step, and the following process is performed as described above.
  • step S102 If it is determined in step S102 that the vibration amplitude a is larger than the threshold value as (NO), the imaging of the surface of the IC device 90 by the imaging device 301 is stopped (step S105). Next, the process proceeds to the next step, and the following process is performed as described above.
  • a clear image can be obtained in the appearance inspection of the IC device 90, whereby the presence or absence of a flaw on the surface of the IC device 90 can be appropriately determined.
  • FIG. 31 is a schematic plan view showing an eighth embodiment of the electronic component inspection apparatus of the present invention.
  • FIG. 32 is a block diagram of the electronic component inspection apparatus shown in FIG. 31.
  • 33 to 35 are plan views showing the inspection unit, device recovery unit, surface state acquisition unit, detection unit, and structure of the electronic component inspection apparatus shown in FIG. 31, respectively.
  • 36 is a side view (including a partial cross-sectional view) showing the surface state acquisition unit and its vicinity of the electronic component inspection apparatus shown in FIG.
  • the inspection apparatus 1G includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, and a device collection area (hereinafter simply referred to as “collection area”).
  • supply area a device supply area
  • A3 a device collection area
  • collection area a device collection area
  • the inspection apparatus 1G includes an electronic component conveyance apparatus that conveys the IC device 90 in each region and has a control unit 80G, an inspection unit 16 that performs inspection in the inspection region A3, and an inspection control unit (not shown). It has become.
  • an electronic component transport apparatus is configured by a configuration excluding the inspection unit 16 and the inspection control unit.
  • the device supply unit (supply shuttle) 14 which is a transport unit (mounting unit) that can place and mount the IC device 90, the inspection unit 16, and the second And a device recovery unit (recovery shuttle) 18G, which is a transfer unit (mounting unit) that can place (load) the IC device 90 and transfer it.
  • one second device transport head 17 is arranged in the Y-axis direction, and the second device transport head 17 is an IC device 90 on the device supply unit 14 carried in from the supply region A2. Can be transported and placed on the inspection unit 16, and the IC device 90 on the inspection unit 16 can be transported and placed on the device collection unit 18G.
  • the device collection unit 18G is a device that conveys the IC device 90 that has been inspected by the inspection unit 16 to the collection area A4.
  • the device collection unit 18G includes an arrangement plate 182 on which the IC device 90 is arranged, and a device collection unit main body 181 that can move in the X-axis direction.
  • a plurality of pockets 185 that are concave portions for accommodating (holding) the IC device 90 are provided on the upper surface of the arrangement plate 182 (see FIG. 33).
  • the arrangement plate 182 is detachably installed on the device collection unit main body 181.
  • the device collection unit 18G is supported so as to be movable along the X-axis direction between the inspection area A3 and the collection area A4.
  • two device recovery units 18G are arranged in the Y-axis direction, like the device supply unit 14, and the IC device 90 on the inspection unit 16 is moved by the second device transport head 17. , And are transported to and placed on one of the device collection units 18G.
  • the device collection unit 18G and the device supply unit 14 are configured to move independently of each other.
  • the present invention is not limited to this.
  • the device collection unit 18G and the device supply unit 14 include The device collection unit 18G and the device supply unit 14 may be configured to move together or integrally.
  • the collection trays 19 are fixed in the collection area A4, and in the present embodiment, three collection trays 19 are arranged along the X-axis direction. Three empty trays 200 are also arranged along the X-axis direction. Then, the IC device 90 on the device recovery unit 18G that has moved to the recovery area A4 is transported and placed in one of the recovery tray 19 and the empty tray 200. As a result, the IC device 90 is collected and classified for each inspection result.
  • the third device transport head 20 is supported so as to be movable in the X-axis direction, the Y-axis direction, and the Z-axis direction within the collection area A4.
  • the third device transport head 20 can transport the IC device 90 from the device recovery unit 18G to the recovery tray 19 or the empty tray 200.
  • the third device transport head 20 has a plurality of hand units 201 as gripping units (electronic component gripping units) that grip the IC device 90, and each hand unit 201 is configured to transport the second device. Similar to the head 17, the suction nozzle is provided and the IC device 90 is gripped by suction.
  • the inspection apparatus 1G detects a vibration (vibration information), a control unit 80G, an operation unit 6 that is electrically connected to the control unit 80G and performs each operation of the inspection apparatus 1G.
  • the vibration detection unit 4 the surface state acquisition unit 3 that can acquire information on the surface state of the IC device 90, the marker (detected unit) 23 provided in the device recovery unit 18G, and the marker (detected unit) 23 It has a detection unit 7 that can be detected, and is configured so that an appearance inspection (surface inspection) of the IC device 90 can be performed.
  • the appearance inspection may be performed at any stage (process), but is preferably performed after the inspection of the electrical characteristics of the IC device 90 is performed.
  • the IC device 90 is connected to the device collection unit 18G. In this state, the IC device 90 is imaged by the imaging device 301 described later, which is the first step of the appearance inspection.
  • the control unit 80G includes a storage unit 801 that stores information, a determination unit 802 that performs each determination (determination), a time measurement unit 803 that measures time, and the like.
  • a storage unit 801 that stores information
  • a determination unit 802 that performs each determination (determination)
  • a time measurement unit 803 that measures time, and the like.
  • the drive of each part, such as the detection part 7, is controlled.
  • the inspection apparatus 1G has a structure 5 to which a member for movably supporting the second device transport head 17 is attached, and the surface state acquisition unit 3 has its structure. It is installed on the body 5.
  • the surface state acquisition unit 3 has one surface in one row of pockets 185 of one device recovery unit 18G, that is, four pockets 185 arranged in the X-axis direction.
  • the state acquisition unit 3 is provided so as to correspond. Then, when the device collection unit 18G moves in the X-axis direction, the imaging device 301 images the surface of the IC device 90 while moving the device collection unit 18G or with the device collection unit 18G stopped. .
  • the imaging device 301 is disposed so as to be positioned above the device collection unit 18G when the device collection unit 18G moves to a position corresponding to the imaging device 301.
  • the upper surface of the IC device 90 in FIG. 36 is imaged. Since the IC device 90 has the circuits concentrated on the upper part, it is preferable to perform an appearance inspection on the upper surface of the IC device 90 in FIG.
  • the imaging device 301 may be configured to be able to image the lower surface (back surface), side surface, and the like of the IC device 90 in FIG.
  • the lower part of the pocket 185 of the device collection unit 18G is formed of a light-transmitting member (transparent member), or a hole is formed in the lower part of the pocket 185. To do.
  • the surface of the device collection unit 18G in the vicinity of the IC device 90 is emitted from the strobe 302 and is reflected by the device collection unit 18G toward the imaging device 301. It is preferable to configure so that the amount of light is reduced. Thereby, when the IC device 90 is imaged by the imaging device 301, unnecessary light can be prevented from entering the imaging element of the imaging device 301, and a clearer image can be obtained.
  • At least the surface of the portion in the vicinity of the IC device 90, such as the inner surface of the pocket 185 of the device recovery unit 18G are made of a material having a low light reflectance. Alternatively, it may be formed of a material having a high light absorption rate, or may be roughened so that light scattering is increased.
  • the strobe 302 is driven to irradiate the surface of the IC device 90, and the imaging device 301 uses the imaging device 301 to The surface is imaged, and image data (surface state information) of the surface of the IC device 90 is acquired.
  • image data surface state information
  • the imaging of the IC device 90 is sequentially performed on the four IC devices 90 arranged in the X-axis direction.
  • the image data is input to the control unit 80G and stored in the storage unit 801.
  • a dedicated appearance inspection area for performing an appearance inspection of the IC device 90 is provided by imaging the IC device 90 in a state where the IC device 90 is placed on the device collection unit 18G.
  • the appearance inspection of the IC device 90 can be easily and quickly performed without reducing the throughput.
  • the number of times the IC device 90 is gripped or released can be reduced, and damage to the IC device 90 can be suppressed.
  • the appearance inspection of the IC device 90 may be performed on all the IC devices 90, but it is preferable that the appearance inspection is performed only on the IC devices 90 that have passed the inspection of the electrical characteristics. Thereby, useless imaging of the IC device 90 can be prevented, and the appearance inspection of the IC device 90 can be quickly performed.
  • the imaging of the IC device 90 is performed in a state where the IC device 90 is placed on the device collection unit 18G.
  • the present invention is not limited to this. It can also be performed in a state where the IC device 90 is placed on the transport unit.
  • the surface state acquisition unit 3 is fixed to the structure 5, but is not limited thereto, and may be installed in the structure 5 or the like so as to be movable in the Y-axis direction.
  • the configuration 1 and the configuration 2 described in the above-described embodiment can be realized.
  • the vibration detection unit 4 includes a first vibration detector 401 and a second vibration detector 402 that detect vibration.
  • the first vibration detector 401 is a sensor that detects vibration of the imaging device 301 (a portion of the structure 5 in the vicinity of the imaging device 301). In the present embodiment, when at least one of an angular velocity sensor and an acceleration sensor, which will be described later, is used as the first vibration detector 401, the first vibration detector 401 is a portion of the structure 5 in the vicinity of the imaging device 301. Installed. The first vibration detector 401 is installed in the vicinity of each imaging device 301 of the structure 5. However, the first vibration detector 401 is not limited to this, and for example, one first vibration detector in the structure 5. 401 may be installed.
  • the second vibration detector 402 is a sensor that detects vibration of the IC device 90, that is, vibration of the device collection unit 18G on which the IC device 90 is placed.
  • the second vibration detector 402 when at least one of an angular velocity sensor and an acceleration sensor described later is used as the second vibration detector 402, the second vibration detector 402 is installed in the device collection unit 18G.
  • the second vibration detector 402 is installed in each device recovery unit 18G.
  • a predetermined process described later can be performed.
  • blurring is prevented or reduced, a clear image is obtained, and the presence or absence of a flaw on the surface of the IC device 90 can be appropriately determined.
  • the second vibration detector 402 is installed in the device collection unit 18G.
  • the present invention is not limited thereto, and when the IC device 90 is imaged in a state where the IC device 90 is placed on another member, the second vibration detector 402 is installed on the other member, and the other The vibration of the member is detected.
  • first vibration detector 401 and the second vibration detector 402 of this embodiment are the same as those of the above-described embodiment, description thereof is omitted.
  • vibration is detected by the vibration detection unit 4, and predetermined processing is performed based on detected vibration information (vibration information).
  • the detected vibration information is input to the control unit 80G and stored in the storage unit 801.
  • specific examples (processing 1 and 2) of the processing will be described. Further, the vibration detection will be described in the processing 1 as a representative.
  • the vibration information includes, for example, vibration magnitude (strength), vibration period (frequency), and the like.
  • the magnitude of the vibration includes, for example, the amplitude of the vibration (displacement of the target point moved by the vibration), the speed of the target point moved by the vibration (maximum speed), and the acceleration of the target point moved by the vibration (maximum acceleration). Etc.
  • the vibration detected by the vibration detection unit 4 is equal to or less than a predetermined vibration (threshold value)
  • the appearance of the IC device 90 is imaged by the imaging device.
  • whether or not the vibration detected by the vibration detection unit 4 is equal to or less than a predetermined vibration is determined based on the amplitude of the vibration, the speed of the target point moved by the vibration (maximum speed), and the target point moved by the vibration. Any one of these accelerations (maximum acceleration), or any two, or three are compared with a predetermined threshold value.
  • the vibration detection unit 4 detects the vibration amplitude, and the detected vibration amplitude is Compare with a predetermined threshold. When the vibration amplitude is equal to or smaller than the threshold, it is determined that the vibration is equal to or smaller than the predetermined vibration.
  • the vibration threshold is an upper limit value of an allowable range of vibration amplitude for obtaining a desired clear image, and is experimentally obtained in advance and stored in the storage unit 801.
  • the determination of the vibration is made by the vibration of the imaging device 301 (the portion in the vicinity of the imaging device 301 of the structure 5) detected by the first vibration detector 401 of the vibration detection unit 4 and the second vibration detector.
  • 402 may be performed on each of the vibrations of the device recovery unit 18G detected by 402, or may be performed on any one of the vibrations.
  • the other relative vibration with respect to the vibration may be obtained and performed on the vibration.
  • the timing for detecting the vibration is not particularly limited as long as it is before imaging by the imaging device 301, but is preferably immediately before the imaging. As a result, it is possible to detect a vibration that is equivalent to or similar to the vibration at the time of imaging.
  • the imaging device 301 does not perform imaging of the IC device 90 and determination of the presence or absence of scratches on the surface of the IC device 90, that is, the IC device. 90 visual inspection is not performed. Accordingly, it is possible to prevent imaging in a situation where an image obtained by imaging with the imaging apparatus 301 is blurred and the image becomes unclear. In such a case, for example, the following process [1] or [2] is preferably performed.
  • the IC device 90 is imaged by the imaging device 301 regardless of the magnitude of vibration, and after the imaging, the amplitude of the vibration is compared with a threshold value, Based on the result, it may be configured to determine whether or not to determine whether or not the surface of the IC device 90 is scratched.
  • the presence / absence of the scratch is determined to complete the appearance inspection. If the detected vibration amplitude is larger than the threshold value, the presence / absence of the scratch is not determined, and therefore the appearance inspection is not completed and the appearance inspection is not performed.
  • vibration detection and imaging can be performed simultaneously.
  • the vibration is detected by the vibration detector 4 and the same processing as described above is performed.
  • an upper limit value for the number of times of vibration detection is set.
  • the vibration after taking a countermeasure against vibration, the vibration may be detected again by the vibration detecting unit 4 and the same processing as described above may be performed, or the vibration is sufficiently reduced by taking the vibration countermeasure.
  • the appearance inspection may be performed without detecting the vibration by the vibration detection unit 4. Further, if the vibration is not sufficiently reduced even after the vibration countermeasure is taken, the vibration countermeasure may be taken again by changing the conditions and method.
  • At least one vibration of the drive mechanism is made smaller than in normal time (during normal operation).
  • “reducing vibration” includes eliminating vibration.
  • making the vibration smaller than the vibration at the normal time (operation) is also simply referred to as “vibration reducing operation”.
  • a method for reducing the vibration of the driving mechanism to be smaller than the vibration at the normal time that is, as the vibration reducing operation of the driving mechanism, for example, the speed of the driving mechanism is slower than the normal time, the driving mechanism is stopped.
  • the mechanism has a servo motor as a drive source
  • the excitation of the servo motor is stopped (power supply to the servo motor is stopped).
  • the most effective method for reducing or eliminating vibration is to stop the excitation of the servo motor
  • the next most effective method is to stop the drive mechanism.
  • a highly effective method is to make the speed of the drive mechanism slower than before imaging.
  • the drive sources such as the first device transport head 13, the second device transport head 17, the third device transport head 20, the device supply unit 14, and the device collection unit 18G are servo motors, respectively.
  • other drive sources are also applicable.
  • the vibration reduction operation may be performed in all the drive mechanisms, and the vibration reduction operation may be performed in some of the drive mechanisms.
  • a high effect can be obtained by performing a vibration reducing operation in the drive mechanism.
  • a high effect can be obtained by performing the vibration reduction operation in the device collection unit 18G on which the IC device 90 is placed.
  • a vibration period (frequency) is detected by the vibration detection unit 4, and an appearance inspection is performed by performing imaging a plurality of times by the imaging device 301 during one period of the detected vibration.
  • the IC device 90 is based on the clear image. It is possible to appropriately determine the presence or absence of scratches on the surface.
  • the number of times of imaging performed in one period of vibration is not particularly limited as long as it is a plurality of times, and is appropriately set according to various conditions, but may be 2 times or more and 20 times or less. Preferably, it is 3 times or more and 15 times or less, more preferably 4 times or more and 10 times or less.
  • the inspection apparatus 1G is configured to acquire information on the surface state of the IC device based on the detection result of the marker (detected part) 23 by the detection unit 7.
  • each device collection unit 18G is provided with a plurality (four in the illustrated configuration) of markers 23.
  • the detection part 7 is installed in the predetermined position of the structure 5 with respect to each device collection part 18G, respectively.
  • the X axis direction plus side is the direction in which the device collection unit 18G moves when collecting the IC device 90, that is, the direction in which the imaging device 301 moves when imaging the surface of the IC device 90.
  • the marker 23 provided on the detection unit 7 and the device recovery unit 18G arranged on the + Y axis direction side in FIG. 33 will be described as a representative.
  • the marker 23 is an example of a light reflecting portion that can reflect light, and is formed of, for example, a reflecting film, a reflecting member, or the like.
  • a total of four markers 23 are installed on the side surface of the arrangement plate 182 of the device collection unit 18G so as to correspond to the four pockets 185 arranged in the X-axis direction.
  • the number of pockets 185 and the number of markers 23 are not limited to the numbers shown.
  • the marker 23 is arranged on the X axis direction plus side from the pocket 185.
  • the marker 23 may be disposed on the minus side in the X-axis direction with respect to the pocket 185, and may be disposed at the same position as the pocket 185 in the X-axis direction.
  • the detection unit 7 includes a light irradiation unit 71 that irradiates (emits) light, and a light receiving unit 72 that receives light and performs photoelectric conversion (see FIG. 32).
  • the detection unit 7 is configured such that light emitted from the light irradiation unit 71 is reflected by the marker 23 and can be received by the light receiving unit 72.
  • the detection unit 7 is arranged on the Y axis direction plus side with respect to the device collection unit 18G. Further, the detection unit 7 is disposed on the minus side in the X-axis direction with respect to the imaging device 301. Further, the position of the detection unit 7 in the Z-axis direction is set to a position where the light emitted from the light irradiation unit 71 can be applied to the marker 23.
  • a signal generated in the light receiving unit 72 by receiving the light is input to the control unit 80G.
  • the determination unit 802 of the control unit 80G determines that the marker 23 is detected by the detection unit 7 when the level of the signal (voltage) input from the light receiving unit 72 changes from the low level to the high level.
  • the image collection unit 301 uses the device collection unit.
  • the surface of 18G is imaged (see FIG. 35).
  • the time measurement unit 803 starts measuring time. Then, when the time measured by the time measuring unit 803 reaches the predetermined time t, it is determined that the device collection unit 18G has moved the predetermined distance L, and imaging is performed by the imaging device 301.
  • the distance in the X-axis direction between the pocket 185 (IC device 90) and the imaging device 301 when the marker 23 is detected by the detection unit 7 is the predetermined distance L.
  • the predetermined distance L is known.
  • the predetermined time t can be obtained in advance.
  • the detection unit 7 detects the marker 23, and the imaging apparatus 301 performs imaging based on the information. Therefore, the imaging timing and the like are set for the inspection apparatus 1G. There is no need to do work.
  • the detection unit 7 detects the marker 23
  • the imaging apparatus 301 By performing imaging by the imaging apparatus 301 based on the information, it is possible to suppress the time of imaging from being shifted, the surface of the IC device 90 can be imaged, and the image data can be obtained. Thereby, the presence or absence of the damage
  • the IC device 90 is imaged in a state where the IC device 90 is placed on the device collection unit 18G, the appearance inspection of the IC device 90 can be easily and quickly performed without reducing the throughput.
  • the detection unit 7 is disposed at a position different from the imaging device 301 in the X-axis direction, but is not limited thereto, and may be disposed at the same position as the imaging device 301.
  • FIG. 37 is a plan view showing a device recovery unit, a surface state acquisition unit, a detection unit, and a structure in the ninth embodiment of the electronic component inspection apparatus of the present invention.
  • a through hole 24 is provided as a detected part on the arrangement plate 182 of the device recovery part 18H.
  • the through hole 24 is an example of a light transmitting portion that can transmit light, and extends in the Y-axis direction of the arrangement plate 182.
  • the through hole 24 is disposed at the same position as the pocket 185 in the X-axis direction.
  • the through hole 24 may be disposed on the plus side in the X-axis direction with respect to the pocket 185, or may be disposed on the minus side in the X-axis direction with respect to the pocket 185.
  • the light transmission part is not limited to the through hole 24, and may be, for example, a slit or may be formed of a light transmissive member (transparent member).
  • the light irradiation unit 71H and the light receiving unit 72H of the detection unit 7H are arranged along the Y-axis direction so that light emitted from the light irradiation unit 71H can be received by the light receiving unit 72H.
  • the light irradiation unit 71H is arranged on the Y axis direction plus side with respect to the device collection unit 18H, and the light receiving unit 72H is arranged on the Y axis direction minus side with respect to the device collection unit 18H.
  • the light irradiation part 71H and the light-receiving part 72H may be arrange
  • the light irradiation unit 71H and the light receiving unit 72H are respectively disposed on the minus side in the X-axis direction with respect to the imaging device 301.
  • the positions of the light irradiation unit 71H and the light receiving unit 72H in the Z-axis direction are respectively set to positions at which light emitted from the light irradiation unit 71H can pass through the through hole 24.
  • the imaging apparatus 301 performs imaging.
  • the light irradiation unit 71H and the light receiving unit 72H are arranged at positions different from the imaging device 301 in the X-axis direction.
  • the present invention is not limited to this, and the imaging device 301 in the X-axis direction. May be arranged at the same position. In this case, when light is detected by the light receiving unit 72H, imaging is performed instantaneously by the imaging device 301.
  • the present invention is not limited to this, and the configuration of each part has the same function. It can be replaced with one having any structure. In addition, any other component may be added to the present invention.
  • the configuration including the imaging device and the strobe is described as the surface state acquisition unit, but the configuration of the surface state acquisition unit is not limited to this.
  • the surface state acquisition unit may be a device that irradiates the surface of an electronic component with laser light, scans the laser light, and receives the laser light reflected on the surface.
  • the electronic components can be imaged collectively, and for example, the resolution of the surface state acquisition unit can be artificially increased.
  • the surface state acquisition unit is configured to image the upper surface in the vertical direction of the electronic component.
  • the present invention is not limited thereto, and for example, the surface state acquisition unit includes the back surface, the side surface, and the like of the electronic component. You may comprise so that it can image.
  • the lower part of the mounting part included in the electronic component recovery part is formed of a light transmissive member (transparent member), or a hole is formed in the lower part of the mounting part. Just do it.
  • the present invention may be a combination of any two or more configurations (features) of the above-described embodiments.
  • Imaging control unit 32 ... Storage unit, 40 ... setting display section, 41 ... display section, 411 ... monitor, 421 ... mouse, 42 ... operation section, 50 ... surface state acquisition section, 50a ... first surface state acquisition section, 50b ... second surface state acquisition section, 51 Imaging device 52 ... Strobe 70 ... Supporting part 90 ... IC device 911 ... Upper surface 200 ... Tray, A1 ... Tray supply area, A2 ... Device supply area, A3 ... Inspection area, A4 ... Device collection area, A5 ... Tray removal area, C18 ... transport path, R1 ... first chamber, R2 ... second chamber, R3 ... third chamber, X1 ... arrow, 901 ... scratches.

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Abstract

L'invention concerne un dispositif de transfert d'élément électronique et un dispositif d'inspection d'élément électronique, pouvant transférer rapidement des éléments électroniques et acquérir des informations de surface desdits éléments électroniques. Un dispositif de transfert d'élément électronique (10) comporte : une unité de transfert pouvant avoir un élément électronique placé sur cette dernière et transférer l'élément électronique ; et une unité d'acquisition d'état de surface pouvant acquérir des informations de l'état de surface de l'élément électronique allant être placé sur l'unité de transfert. Un dispositif d'inspection d'élément électronique (1) comprend : une unité de transfert pouvant avoir un élément électronique placé sur cette dernière et transférer l'élément électronique ; une unité d'acquisition d'état de surface pouvant acquérir des informations de l'état de surface de l'élément électronique allant être placé sur l'unité de transfert ; et une unité d'inspection qui inspecte l'élément électronique.
PCT/JP2016/003135 2015-06-30 2016-06-30 Dispositif de transfert d'élément électronique et dispositif d'inspection d'élément électronique WO2017002369A1 (fr)

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JP2015130828A JP2017015481A (ja) 2015-06-30 2015-06-30 電子部品搬送装置および電子部品検査装置
JP2015130830A JP2017015483A (ja) 2015-06-30 2015-06-30 電子部品搬送装置および電子部品検査装置
JP2015-130829 2015-06-30
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JP2015130825A JP2017015478A (ja) 2015-06-30 2015-06-30 電子部品搬送装置および電子部品検査装置
JP2015-130827 2015-06-30
JP2015130826A JP2017015479A (ja) 2015-06-30 2015-06-30 電子部品搬送装置および電子部品検査装置
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KR20200011352A (ko) * 2018-07-24 2020-02-03 (주)테크윙 전자부품 처리장비용 촬영장치
JP7362507B2 (ja) * 2020-02-25 2023-10-17 株式会社Ｎｓテクノロジーズ 電子部品搬送装置、電子部品検査装置およびポケット位置検出方法
KR20210116777A (ko) * 2020-03-13 2021-09-28 (주)테크윙 전자부품 처리장비용 촬영장치
TWI808357B (zh) * 2020-11-19 2023-07-11 鏵友益科技股份有限公司 半導體元件的檢測方法

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