WO2016190423A1 - 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 - Google Patents

物体保持装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 Download PDF

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Publication number
WO2016190423A1
WO2016190423A1 PCT/JP2016/065774 JP2016065774W WO2016190423A1 WO 2016190423 A1 WO2016190423 A1 WO 2016190423A1 JP 2016065774 W JP2016065774 W JP 2016065774W WO 2016190423 A1 WO2016190423 A1 WO 2016190423A1
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Prior art keywords
holding
substrate
flow path
substrate holder
holding device
Prior art date
Application number
PCT/JP2016/065774
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English (en)
French (fr)
Japanese (ja)
Inventor
青木　保夫
亮平 吉田
Original Assignee
株式会社ニコン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to CN201680030014.5A priority Critical patent/CN107615169B/zh
Priority to JP2017520816A priority patent/JP6791132B2/ja
Priority to KR1020177037083A priority patent/KR102625921B1/ko
Publication of WO2016190423A1 publication Critical patent/WO2016190423A1/ja
Priority to HK18106068.4A priority patent/HK1246869A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Definitions

  • the present invention relates to an object holding apparatus, an exposure apparatus, a flat panel display manufacturing method, and a device manufacturing method, and more particularly, an object holding apparatus including a holding member that holds an object, and an object held by the object holding apparatus.
  • the present invention relates to an exposure apparatus that exposes a film, a flat panel display using the exposure apparatus, or a device manufacturing method.
  • a lithography process for manufacturing an electronic device such as a liquid crystal display element, a semiconductor element (integrated circuit, etc.), a pattern formed on a mask or reticle (hereinafter collectively referred to as “mask”) is used as an energy beam.
  • An exposure apparatus is used for transferring to a glass plate or a wafer (hereinafter collectively referred to as “substrate”) using the above.
  • the substrate holder of the substrate stage device corrects the plane along the substrate mounting surface so that no wrinkles or irregularities are formed on the substrate, for example, by vacuum suction of the substrate. (For example, refer to Patent Document 1).
  • the substrate to be exposed tends to be thinner, and it is difficult to correct the plane of the substrate due to unevenness, grooves, or through holes formed on the substrate mounting surface of the substrate holder. There is.
  • the holding unit having a holding surface for holding an object, and a flow path for controlling gas between the holding surface and the object, the holding unit is placed. And a base portion on which the gas flow path portion is placed, and the flow path extends in the first direction and intersects the first direction in the gas flow path portion.
  • a plurality of object holding devices arranged in the second direction are provided.
  • the object holding device according to the first aspect, and the pattern forming device that forms a predetermined pattern on the object held by the object holding device using an energy beam, are provided.
  • a flat panel comprising: exposing a substrate used in a flat panel display using the exposure apparatus according to the second aspect; and developing the exposed substrate.
  • a method of manufacturing a display is provided.
  • a device manufacturing method including exposing an object using the exposure apparatus according to the second aspect and developing the exposed object.
  • FIG. 3 is an exploded view of the substrate holder of FIG. 2. It is a figure which shows the modification of a substrate holder.
  • FIGS. 5A and 5B are views (a side view and a front view, respectively) showing the carry-in and carry-out bearer devices included in the substrate stage device.
  • FIGS. 6A to 6C are views (Nos. 1 to 3) for explaining the replacement operation of the substrate on the substrate holder.
  • FIGS. 7A and 7B are views (No. 4 and No.
  • FIGS. 8A and 8B are views (a side view and a front view, respectively) showing a holder cleaning device included in the substrate stage device.
  • FIGS. 9A and 9B are views (a side view and a front view, respectively) for explaining the cleaning operation (part 1) of the substrate holder using the holder cleaning device.
  • FIGS. 10A and 10B are views (a side view and a front view, respectively) for explaining the cleaning operation (part 2) of the substrate holder using the holder cleaning device.
  • FIGS. 11A and 11B are views (a side view and a front view, respectively) for explaining the cleaning operation (part 3) of the substrate holder using the holder cleaning device.
  • FIG. 1 schematically shows a configuration of a liquid crystal exposure apparatus 10 according to an embodiment.
  • the liquid crystal exposure apparatus 10 employs a step-and-scan method in which a rectangular (square) glass substrate P (hereinafter simply referred to as a substrate P) used in, for example, a liquid crystal display device (flat panel display) is an exposure object.
  • a projection exposure apparatus a so-called scanner.
  • the liquid crystal exposure apparatus 10 includes an illumination system 12, a mask stage device 14 that holds a mask M on which a pattern such as a circuit pattern is formed, a projection optical system 16, and a resist (sensitive) on the surface (the surface facing the + Z side in FIG. 1).
  • a substrate stage device 20 that holds the substrate P coated with the agent, and a control system thereof.
  • the direction in which the mask M and the substrate P are relatively scanned with respect to the projection optical system 16 at the time of exposure is defined as the X-axis direction
  • the direction orthogonal to the X-axis in the horizontal plane is defined as the Y-axis direction, the X-axis, and the Y-axis.
  • the description will be made with the orthogonal direction as the Z-axis direction.
  • the illumination system 12 is configured similarly to the illumination system disclosed in, for example, US Pat. No. 5,729,331.
  • the illumination system 12 irradiates light emitted from a light source (not shown) (for example, a mercury lamp) through exposure mirrors (not shown), dichroic mirrors, shutters, wavelength selection filters, various lenses, and the like. ) Irradiate the mask M as IL.
  • a light source for example, a mercury lamp
  • the illumination light IL for example, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), or the combined light of the i-line, g-line, and h-line is used.
  • the mask stage device 14 holds the mask M by, for example, vacuum suction.
  • the mask stage device 14 is driven with a predetermined long stroke at least in the scanning direction (X-axis direction) by, for example, a mask stage drive system (not shown) including a linear motor.
  • the position information of the mask stage device 14 is obtained by a mask stage measurement system (not shown) including a linear encoder system, for example.
  • the projection optical system 16 is disposed below the mask stage device 14.
  • the projection optical system 16 is a so-called multi-lens type projection optical system having the same configuration as the projection optical system disclosed in, for example, US Pat. No. 6,552,775, and forms, for example, an erect image. It has multiple optical systems that are telecentric on both sides.
  • the illumination area passes through the projection optical system 16 by the illumination light that has passed through the mask M.
  • a projection image (partial pattern image) of the pattern of the mask M inside is formed in an exposure region on the substrate P.
  • the mask M moves relative to the illumination area (illumination light IL) in the scanning direction
  • the substrate P moves relative to the exposure area (illumination light IL) in the scanning direction.
  • One shot area is scanned and exposed, and the pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M) is transferred to the shot area.
  • the illumination area on the mask M and the exposure area (illumination light irradiation area) on the substrate P are optically conjugate with each other by the projection optical system 16.
  • the substrate stage device 20 includes a surface plate 22, a substrate table 24, a self-weight support device 26, and a substrate holder 30.
  • the surface plate 22 is formed of a rectangular plate-like member (viewed from the + Z side), for example, disposed so that the upper surface (+ Z surface) is parallel to the XY plane, and is passed through a vibration isolator (not shown). It is installed on the floor F.
  • the substrate table 24 is formed of a thin box-shaped member having a rectangular shape in plan view.
  • the self-weight support device 26 is placed on the surface plate 22 in a non-contact state, and supports the self-weight of the substrate table 24 from below.
  • the substrate holder 30 is integrally fixed on the upper surface of the substrate table 24.
  • the substrate stage device 20 includes, for example, a linear motor, and the substrate table 24 (and the substrate holder 30) is moved in the X-axis and Y-axis directions (along the XY plane) by a predetermined long stroke.
  • a substrate stage drive system that micro-drives in the direction of 6 degrees of freedom (X axis, Y axis, Z axis, ⁇ x, ⁇ y, and ⁇ z), and an optical interferometer system, for example.
  • a substrate stage measurement system for obtaining position information in the six-degree-of-freedom direction is provided.
  • the substrate holder 30 is formed of a thin box-shaped member having an overall rectangular shape in plan view, and the substrate P is placed on the upper surface (+ Z side surface).
  • the aspect ratio of the upper surface of the substrate holder 30 is substantially the same as that of the substrate P.
  • the length of the long side and the short side of the upper surface of the substrate holder 30 is set to the length of the long side and the short side of the substrate P.
  • Each of the lengths is set to be somewhat shorter, and the vicinity of the four edge portions of the substrate P protrudes outward from the substrate holder 30 in a state where the substrate P is placed on the upper surface of the substrate holder 30. This is to prevent the resist applied to the surface of the substrate P from adhering to the back surface near the end of the substrate P, so that the resist does not adhere to the substrate holder 30. .
  • the substrate holder 30 includes a base portion 40, a conduit portion 50, and a holding surface portion 60.
  • the base part 40, the pipe line part 50, and the holding surface part 60 are each formed in a plate shape having a rectangular shape in plan view.
  • the substrate holder 30 has a three-layer structure as a whole by arranging (stacking) the pipe line part 50 on the base part 40 and further arranging (stacking) the holding surface part 60 on the pipe part 50. Yes.
  • the base part 40, the pipe line part 50, and the holding surface part 60 are fixed to each other by, for example, an adhesive, but are not limited thereto, and may be fastened to each other by, for example, a bolt.
  • the holding surface part 60 and the pipe line part 50 may be fixed to each other by vacuum suction.
  • the holding surface part 60 and the pipe line part 50 may be configured to be attachable / detachable and exchangeable.
  • the base part 40 which is the lowest layer is formed thicker than the pipe line part 50 and the holding surface part 60.
  • the structure of the base portion 40 is not particularly limited, but it is desirable that the base portion 40 be lightweight and highly rigid (particularly highly rigid in the thickness direction).
  • the base portion 40 of the present embodiment is made of, for example, CFRP (carbon-fiber-reinforced plastic) on each of the upper surface, the lower surface, and each side surface of a honeycomb-shaped plate member (not shown) formed of, for example, an aluminum alloy. It has a so-called sandwich structure in which a plate-like member is affixed, is lightweight and highly rigid, and is easy to create.
  • the pipe section 50 which is an intermediate layer includes a plurality of (for example, 13 in FIG. 2 and FIG. 3) square pipes 52 having a rectangular YZ section extending in the X-axis direction.
  • the number of the square pipes 52 is not particularly limited.
  • the dimension of the rectangular pipe 52 in the longitudinal direction (X-axis direction) is set to be approximately the same as the dimension of the base portion 40 in the X-axis direction.
  • a gap narrower than the dimension in the width direction (Y-axis direction) of the square pipe 52 is formed between a pair of adjacent square pipes 52. There may be no gap.
  • each square pipe 52 Both ends in the longitudinal direction of each square pipe 52 are closed by a lid member (not shown). Moreover, a joint for air piping (not shown) is attached to one lid member among the pair of lid members attached to both ends in the longitudinal direction of the square pipe 52. In the present embodiment, the joint (not shown) is attached to the end portions of all the square pipes 52, but is not limited thereto, and is attached only to a part of the plurality of square pipes 52, for example. May be.
  • Through holes 58 are formed at predetermined positions on the upper surface of the square pipes 52 (all the square pipes 52 in the present embodiment) to which the joint is attached among the plurality of square pipes 52. Yes.
  • the through hole 58 is shown larger than the actual size.
  • one or two through holes 58 are formed for each square pipe 52, but the through holes 58 formed in one square pipe 52 The number is not particularly limited.
  • the uppermost holding surface portion 60 is a portion that holds the substrate P (see FIG. 1) and has a plurality of flat plates 62.
  • the flat plate 62 is made of, for example, black granite (gabbroite) or ceramics, and the thickness thereof is set to about 5 mm to 10 mm, for example.
  • the surface of each flat plate 62 (the surface facing the + Z side in FIGS. 2 and 3) is finished to be extremely flat over the entire surface.
  • the 15 flat plates 62 are laid on the duct portion 50 (the plurality of square pipes 52) almost without any gaps (at intervals at which gaps can be substantially ignored), so that the holding surface portion 60 is provided.
  • the number of the flat plates 62 is not particularly limited, and may be, for example, 14 or less (for example, 1) or 16 or more.
  • a plurality of through holes 68 for air blowing and / or vacuum suction are formed in the holding surface portion 60.
  • the positions of the plurality of through holes 68 correspond to the positions corresponding to the plurality of through holes 58 formed in the pipe section 50, that is, the holding surface section 60 (the plurality of flat plates 62) on the pipe section 50 (the plurality of square pipes 52). ) Are overlapped (see FIG. 2), and the through hole 58 and the through hole 68 are formed at positions where they overlap in the vertical direction (positions that coincide in the XY plane).
  • the through hole 58 is formed by mechanical processing using, for example, a drill. 2 and 3, the through hole 68 is shown larger than the actual size.
  • one through hole 68 is formed for one flat plate 62.
  • the present invention is not limited to this.
  • a plurality of through holes 68 may be formed in one flat plate 62.
  • it is desirable that the plurality of through holes 68 are formed at almost equal intervals over the entire upper surface (substrate mounting surface) of the substrate holder 30.
  • the holding surface portion 60 is formed by arranging (laying out) a plurality of flat plates 62, and therefore it is preferable that no step exists between the flat plates 62.
  • the substrate holder 30 is assembled on a flat member such as the surface plate 22 (see FIG. 1) by placing a plurality of flat plates 62 on one surface (surface on the side that functions as a substrate mounting surface after assembly).
  • the plurality of flat plates 62 and the plurality of square pipes 52 are fixed by, for example, an adhesive.
  • each one surface of the some flat plate 62 can be joined in the state without a level
  • the assembly procedure of the substrate holder 30 is not limited to this.
  • a plane that follows the surface of the surface plate 22 is formed by assembling a plurality of square pipes 52 that constitute the pipe section 50 on the surface plate 22. After that, a plurality of flat plates 62 constituting the holding surface portion 60 may be arranged on the pipe line portion 50 (a plane following the surface of the surface plate 22).
  • the pipe section 50 (the plurality of square pipes 52)
  • a flat surface may be formed by applying an adhesive on top and arranging a plurality of flat plates 62 on the pipe line part 50 (adhesive).
  • the order of the holding surface portion 60, the conduit portion 50, and the base portion 40 that is, the case where the upper layer side of the substrate holder 30 is assembled first (in order from the upper layer side) has been described. It is not restricted, You may assemble so that the member of the upper layer side may be piled up sequentially from the lower layer side.
  • a joint (not shown) attached to a plurality of square pipes 52 constituting the pipe section 50 includes, for example, a vacuum device (not shown) disposed outside the substrate holder 30 via a piping member such as a tube, and the like.
  • a pressurized gas supply device (not shown) is connected to be switchable (selectable).
  • the vacuum device supplies a vacuum suction force to the square pipe 52 by sucking air inside the square pipe 52.
  • the substrate holder 30 sucks the air between the upper surface of the holding surface portion 60 and the substrate P (see FIG. 1) placed on the holding surface portion 60 by the vacuum suction force through the through holes 58 and 68. To do.
  • the substrate P is sucked and held by the holding surface portion 60, and substantially the entire surface is flattened (following) along the upper surface of the holding surface portion 60 (the plurality of flat plates 62).
  • the configuration of the pipe line part 50 is not limited to this and can be changed as appropriate.
  • the duct portion 50 gas flow path
  • the pipe line part 50 is comprised by two plate-shaped members.
  • the base portion 40 may be the other plate-shaped member (lid)
  • the holding surface portion 60 may be the other plate-shaped member (lid).
  • the pipe line part 50 can be formed by one plate-shaped member.
  • pressurized gas for example, compressed air
  • the substrate holder 30 ejects (exhausts) pressurized gas to the lower surface of the substrate P (see FIG. 1) placed on the holding surface portion 60 through the through holes 58 and 68.
  • the substrate P is in a state where the entire surface is separated (floated) from the upper surface of the holding surface portion 60.
  • the switching between the supply of the vacuum suction force and the supply of the pressurized gas is appropriately performed by a main controller (not shown) via a valve or the like, for example.
  • the main control device switches the supply of the vacuum suction force to the substrate holder 30 and the supply of the pressurized gas as appropriate, thereby causing the substrate holder 30 to hold the substrate P by vacuum suction, and the substrate holder 30 to remove the substrate P from the substrate holder 30. It is possible to arbitrarily switch between contact and support.
  • the main control device causes a time difference in the timing of exhausting the pressurized gas in each of the plurality of through holes 68 formed in the holding surface portion 60, and the through holes 68 for performing vacuum suction and the pressurized gas.
  • the grounding state of the substrate P is optimized by appropriately replacing the place of the through-hole 68 to be exhausted or by appropriately changing the air pressure between suction and exhaust (for example, the rear surface of the substrate P and the upper surface of the substrate holder 30). It is also possible to prevent air from being trapped in between.
  • a vacuum apparatus to some square pipes 52
  • a portion that performs suction holding of the substrate P and a portion that performs non-contact support of the substrate P are distinguished, but control is easy.
  • the pipe line part 50 is constituted by a plurality of members (square pipes 52), but it is possible to supply pressurized gas or vacuum suction force over almost the entire upper surface of the holding surface part 60. If so, the structure of the pipe line part 50 can be changed as appropriate, and for example, may be an integrated structure like the pipe line part 50A of the substrate holder 30A shown in FIG.
  • the pipe section 50A includes a plurality of strip-shaped plate materials 54c (vertical ribs) formed by CFRP and parallel to the XZ plane extending in the X-axis direction between a pair of thin plate materials 54a and 54b formed by CFRP, for example. , A sandwich structure disposed in a predetermined interval in the Y-axis direction.
  • both ends of the conduit formed by the plate members 54a to 54c are closed by lid members (not shown).
  • lid members not shown.
  • through holes may be formed in the plate material 54c so that a pair of adjacent pipe lines communicate with each other.
  • the CFRP may be subjected to a coating process in order to prevent the CFRP from generating static electricity.
  • the material for forming the pipe line section 50 square pipe 52
  • a material for forming the pipe line portion 50 it is preferable to use a material having a linear expansion coefficient different from at least one of the material for forming the base portion 40 and the material for forming the holding surface portion 60. Thereby, it is possible to disperse the force acting in the arrangement direction of the plurality of flow paths forming the pipe section 50 (the Y-axis direction in FIGS. 2 and 3).
  • the substrate stage apparatus 20 is a pair of ones (one of which overlaps the back side of the drawing) used for carrying out the substrate P (see FIG. 1) from the substrate holder 30.
  • a carry-out bearer device 70a and a pair of carry-in bearer devices 70b (see FIG. 5B) used for carrying the substrate P into the substrate holder 30 are provided.
  • the pair of carry-out bearer devices 70a are arranged at a predetermined interval in the Y-axis direction on the + X side of the substrate holder 30, and the pair of carry-in bearer devices 70b are arranged at a predetermined interval in the Y-axis direction on the ⁇ X side of the substrate holder 30. ing.
  • the carry-in bearer device 70b includes a holding pad 72b, a Z actuator 76z, and an X actuator 76x.
  • a part of the holding pad 72b can be inserted into a notch 32b (not shown in FIGS. 2 and 3) formed on the upper surface of the substrate holder 30 (holding surface portion 60 (see FIG. 2 and the like)). ing.
  • the holding pad 72b can suck and hold the vicinity of the ⁇ X side end of the substrate P (see FIG. 1) from the lower surface side by a vacuum suction force supplied from a vacuum device (not shown). .
  • the holding pad 72b is attached to the X actuator 76x via a shaft 74 extending in the Z-axis direction, and is driven with a predetermined stroke in the X-axis direction by the X actuator 76x.
  • the X actuator 76x (that is, the holding pad 72b) is driven with a predetermined stroke in the Z-axis direction by the Z actuator 76z attached to the substrate table 24.
  • each of the pair of carry-out bearer devices 70a is substantially the same as the carry-in bearer device 70b except that the arrangement and functions are different. That is, the carry-out bearer device 70a supports the holding pad 72a and the holding pad 72a that can be partially inserted into a notch 32a (not shown in FIGS. 2 and 3) formed on the upper surface of the substrate holder 30.
  • the vicinity of the end on the side can be sucked and held from the lower surface side.
  • the substrate holder 30 holding the exposed substrate P 1, in order to unload the substrate P 1, is positioned at a predetermined substrate exchange position.
  • the pair of carrying-out the bearer device 70a adsorbs hold the end portion of the + X side of the substrate P 1.
  • the main control device drives the holding pad 72a of the pair of carry-out bearer devices 70a in the + X direction with a predetermined stroke (for example, about 50 mm to 100 mm).
  • the substrate P 1 protrudes from the end portion of the + X side of the substrate holder 30. Further, the substrate P 2 to be exposed next to the substrate P 1 is transported by the robot hand 36 for transporting the substrate above the substrate holder 30 positioned at the substrate replacement position.
  • the portion near the + X side end of the substrate P 1 and not held by the pair of carry-out bearer devices 70 a is sucked and held by the substrate carry-out device 34.
  • a pair of discharge bearer device 70a releases the suction holding of the substrate P 1.
  • the vicinity of an end of the -X side of the substrate P 2 which is transported over the substrate P 1 is sucked and held by a pair of carrying-bearer device 70b.
  • the main control unit by driving the substrate carry-out device 34 in the + X direction to move the substrate P 1 in the + X direction.
  • the substrate P 1 moves substantially parallel to the horizontal plane with the upper surface of the substrate holder 30 and the upper surface of the guide beam 38 disposed on the + X side of the substrate stage apparatus 20 as a guide surface, and from the substrate holder 30 onto the guide beam 38. And transferred.
  • Guide beam 38 has an air bearing, pressurized gas to the lower surface of the substrate P 1 during the movement of the substrate P 1 is by ejecting, in a non-contact support the substrate P 1.
  • the substrate holder 30 is also, by ejecting a pressurized gas to the lower surface of the substrate P 1, functions equivalent to the air bearing.
  • the robot hand 36 moves to the + X side with high acceleration, retracted from above the substrate holder 30. At this time, to reduce friction between the robot hand 36 and the substrate P 2, the robot hand 36 for ejecting pressurized gas to the lower surface of the substrate P 1.
  • the substrate P 2 is left above the substrate holder 30 because the vicinity of the ⁇ X side end is adsorbed and held by the pair of carry-in bearer devices 70 b.
  • Substrate P 2 lost support from below by the robot hand 36 is moved in the direction of gravity downward by its own weight (falling), as shown in FIG. 7 (a), lands on the substrate holder 30.
  • the main control device also drives the holding pads 72b of the pair of carry-in bearer devices 70b to descend. At this time, the substrate P 2 moves gently at an acceleration smaller than the gravitational acceleration due to the air resistance between the substrate P 2 and the upper surface of the substrate holder 30. Further, the substrate holder 30 after unloading the substrate P 1 are also ejected pressurized gas from the upper surface to continue to reduce the impact of landing on the substrate holder 30 above the substrate P 2.
  • the substrate P 2 is between the substrate P 2 and the upper surface (substrate mounting surface) of the substrate holder 30 with the substrate P 2 landing on the substrate holder 30.
  • a minute gap is formed by the static pressure of the pressurized gas.
  • the main control unit based on the output of the substrate position measurement system (not shown), above small gap is formed state (state where the substrate P 2 is contactlessly supported by the substrate holder 30), a pair of carrying-bearer device by finely driven in the X-axis direction holding pad 72b of 70b independently perform alignment of the substrate P 2.
  • the substrate holder 30 After completing the alignment operation, as shown in FIG. 7 (b), the substrate holder 30, to stop the ejection of the pressurized gas, for holding the vacuum suction of the substrate P 2.
  • the holding pads 72b of the pair of carry-in bearer devices 70b are accommodated in the notches 32b (see FIG. 5A) of the substrate holder 30.
  • the substrate holder 30 of the present embodiment has the holding surface portion 60 that functions as the substrate mounting surface formed by the plurality of flat plates 62 so as to be entirely flat. There is a high possibility that dust will adhere directly to the surface.
  • the substrate stage apparatus 20 includes a cleaner 90 for cleaning the upper surface (substrate mounting surface) of the substrate holder 30.
  • a device 80 is included.
  • the cleaning device 80 has a pair of support blocks 82a spaced in the X-axis direction on the + Y side surface and the ⁇ Y side side surface of the substrate holder 30, respectively.
  • the pair of support blocks 82a is attached to the side surface of the substrate holder 30 via an angle member 82b having an L-shaped YZ cross section.
  • a guide bar 84a extending in the X-axis direction is installed between the pair of support blocks 82a.
  • a slider 84b (for example, a linear bush) that is movable in the X-axis direction along the guide bar 84a is attached to the guide bar 84a.
  • a plate-like base member 86 extending in the ⁇ X direction is attached to the slider 84b.
  • the base member 86 axially supports an intermediate portion in the longitudinal direction of each of the pair of link members 88 arranged in parallel to each other so as to be rotatable around the Y axis.
  • the cleaner 90 is made of a member having a rectangular XZ section extending in the Y-axis direction, and the length in the Y-axis direction is such that the ⁇ Y-side end protrudes outward from the ⁇ Y-side end of the substrate holder 30.
  • the upper surface of the substrate holder 30 (the holding surface portion 60 (see FIGS. 2 and 3)) is set somewhat longer than the length in the Y-axis direction.
  • the cleaner 90 is formed of a porous body made of, for example, PVA (polyvinyl alcohol).
  • the cleaner 90 is inserted between the vicinity of the upper ends of the pair of link members 88 disposed on the + Y side of the substrate holder 30 and the vicinity of the upper ends of the pair of link members 88 disposed on the ⁇ Y side of the substrate holder 30.
  • the shaft is rotatably supported with respect to the link member 88 in the direction around the Y axis.
  • the cleaner 90 may not be directly attached to the link member 88.
  • the cleaner 90 may be attached via another member so that replacement and position adjustment are easy.
  • the cleaner 90 is arranged so that the lower surface thereof is parallel to the upper surface of the substrate holder 30, and maintains the posture in the XZ plane when each link member 88 rotates around the Y axis with respect to the base member 86. As it is (in a state in which the lower surface of the cleaner 90 and the upper surface of the substrate holder 30 are kept parallel), it rotates around the Y axis. Further, tapered recesses 92 are formed in the vicinity of both end portions on the upper surface of the cleaner 90. The function of the recess 92 will be described later.
  • FIGS. 9A and 9B show a state where the carry-in bearer device 70b and the cleaning device 80 described above are combined.
  • the cutout groove 94 formed in the cleaner 90 and the auxiliary plate member 96 does not interfere with the above-described substrate replacement operation.
  • it is disposed outside the substrate holder 30 ( ⁇ X side).
  • the rotation range of the cleaner 90 is limited by a limit pin 82c attached to the angle member 82b.
  • the main controller (not shown) starts the shaft 74 of the carry-in bearer device 70b as shown in FIG. 10A and FIG. 10B.
  • the control pin 78 attached to the shaft 74 is fitted into the notch groove 94 formed in the auxiliary plate member 96.
  • the auxiliary plate member 96 moves in the ⁇ X direction.
  • the cleaner 90 rotates through the pair of link members 88, and the lower surface of the cleaner 90 and the upper surface of the substrate holder 30 are in contact (opposed). )
  • a high-pressure nozzle may be attached to the cleaner 90 to blow off dust, or vacuum suction may be performed.
  • a brush may be attached to the cleaner 90 and moved while sweeping the substrate holder 30. Further, the surface of the substrate holder 30 may be wiped off while exhausting water or steam from the cleaner 90. Moreover, these combinations may be sufficient.
  • the substrate holder 30 having a three-layer structure constituted by a base portion 40 having a honeycomb structure, a pipe line portion 50 including a plurality of square pipes 52, and a holding surface portion 60 formed of a stone material or CFRP is light and high. It is rigid and the surface flatness of the substrate holder 30 is good. Further, since the substrate holder 30 functions as an air bearing, the substrate P can be completely levitated on the substrate holder 30. Therefore, the substrate holder 30 can function as a lower surface guide for sliding out the substrate P.
  • the through-holes 58 are formed in all of the plurality of square pipes 52 included in the duct portion 50, but the square pipe 52 in which the through-holes 58 are not formed (sealed).
  • the square pipe 52 is deformed by supplying pressurized gas to the sealed square pipe 52 (or vacuum suction of the gas in the square pipe 52), and thereby the substrate holder 30 (holding surface portion 60). ) Surface flatness may be controlled.
  • the upper surface of the substrate holder 30 can be a highly accurate plane regardless of the processing of the holding surface portion 60.
  • the plurality of flat holes 62 forming the holding surface portion 60 are mechanically formed with a plurality of through holes 68.
  • the pressurized gas supplied from the conduit 50 or the pipe is not limited to this as long as the gas can be sucked by the vacuum suction force supplied from the passage portion 50.
  • the flat plate 62 is formed of a porous member, and the above-described addition is performed through the minute holes of the porous member. You may perform ejection of pressurized gas and suction of gas.
  • the base part 40, the pipe line part 50, and the holding surface part 60 are set to have substantially the same area in plan view.
  • the pipe line part 50 was formed of the some square pipe 52, it is not restricted to this, A groove
  • the wavelength of the light source used in the illumination system 12 and the illumination light IL emitted from the light source is not particularly limited.
  • ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or the like.
  • Light or vacuum ultraviolet light such as F2 laser light (wavelength 157 nm) may be used.
  • the projection optical system 16 is an equal magnification system.
  • the present invention is not limited to this, and a reduction system or an enlargement system may be used.
  • the use of the exposure apparatus is not limited to an exposure apparatus for liquid crystal that transfers a liquid crystal display element pattern onto a square glass plate.
  • an exposure apparatus for manufacturing an organic EL (Electro-Luminescence) panel, a semiconductor The present invention can be widely applied to an exposure apparatus for manufacturing, an exposure apparatus for manufacturing a thin film magnetic head, a micromachine, a DNA chip, and the like.
  • an exposure apparatus for manufacturing a thin film magnetic head a micromachine, a DNA chip, and the like.
  • the present invention can also be applied to an exposure apparatus that transfers a circuit pattern.
  • the object to be exposed is not limited to the glass plate, but may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank.
  • the thickness of the substrate is not particularly limited, and includes, for example, a film-like (flexible sheet-like member).
  • the exposure apparatus of the present embodiment is particularly effective when a substrate having a side length or diagonal length of 500 mm or more is an exposure target. Further, when the substrate to be exposed is a flexible sheet, the sheet may be formed in a roll shape.
  • the step of designing the function and performance of the device the step of producing a mask (or reticle) based on this design step, and the step of producing a glass substrate (or wafer)
  • the above-described exposure method is executed using the exposure apparatus of the above embodiment, and a device pattern is formed on the glass substrate. Therefore, a highly integrated device can be manufactured with high productivity. .
  • the object holding device of the present invention is suitable for holding an object.
  • the exposure apparatus of the present invention is suitable for exposing an object.
  • the manufacturing method of the flat panel display of this invention is suitable for manufacture of a flat panel display.
  • the vice manufacturing method of the present invention is suitable for manufacturing a micro device.

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PCT/JP2016/065774 2015-05-28 2016-05-27 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 WO2016190423A1 (ja)

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CN201680030014.5A CN107615169B (zh) 2015-05-28 2016-05-27 物体保持装置、曝光装置、平板显示器的制造方法及器件制造方法
JP2017520816A JP6791132B2 (ja) 2015-05-28 2016-05-27 物体保持装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
KR1020177037083A KR102625921B1 (ko) 2015-05-28 2016-05-27 물체 유지 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 및 디바이스 제조 방법
HK18106068.4A HK1246869A1 (zh) 2015-05-28 2018-05-10 物體保持裝置、曝光裝置、平板顯示器的製造方法及器件製造方法

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018181913A1 (ja) * 2017-03-31 2018-10-04 株式会社ニコン 物体保持装置、処理装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び物体保持方法
JP2018205330A (ja) * 2017-05-30 2018-12-27 株式会社オーク製作所 露光装置及び基板載置方法
WO2020145630A1 (en) * 2019-01-07 2020-07-16 Samsung Electronics Co., Ltd. Display apparatus and method of manufacturing display apparatus thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7105482B2 (ja) * 2018-04-03 2022-07-25 株式会社ブイ・テクノロジー 石定盤の温度調整装置およびそれを備えた検査装置
CN109384062B (zh) * 2018-09-19 2020-02-18 武汉华星光电技术有限公司 一种曝光机及其传送基板的方法
CN112936021B (zh) * 2021-01-20 2022-11-18 大连理工大学 一种薄壁大口径非球面碳纤维复材高性能零件磨削装备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09278181A (ja) * 1996-04-11 1997-10-28 Canon Inc ワーク搬送装置及び搬送方法
JP2005228881A (ja) * 2004-02-12 2005-08-25 Tokyo Electron Ltd 浮上式基板搬送処理方法及びその装置
JP2010040790A (ja) * 2008-08-05 2010-02-18 Olympus Corp 基板浮上装置
JP2011225355A (ja) * 2010-04-22 2011-11-10 Sumitomo Heavy Ind Ltd エア浮上ユニット、ステージ装置、検査システム、露光システム及び塗布システム
JP2013227151A (ja) * 2012-04-24 2013-11-07 Jae-Sung Lee 大面積パネル用の搬送プレート
JP2014118221A (ja) * 2012-12-13 2014-06-30 Toray Eng Co Ltd 基板浮上装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273702A (ja) 2003-03-07 2004-09-30 Nikon Corp 搬送装置及び搬送方法、露光装置
CN101866113B (zh) * 2004-10-26 2013-04-24 株式会社尼康 衬底处理方法、曝光装置及器件制造方法
JP2009135169A (ja) * 2007-11-29 2009-06-18 Tokyo Electron Ltd 基板処理システムおよび基板処理方法
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
KR101773494B1 (ko) * 2013-02-26 2017-08-31 가부시키가이샤 아이에이치아이 반송 장치
JP2014218342A (ja) * 2013-05-09 2014-11-20 オイレス工業株式会社 支持用エアプレートおよびその気体流抵抗器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09278181A (ja) * 1996-04-11 1997-10-28 Canon Inc ワーク搬送装置及び搬送方法
JP2005228881A (ja) * 2004-02-12 2005-08-25 Tokyo Electron Ltd 浮上式基板搬送処理方法及びその装置
JP2010040790A (ja) * 2008-08-05 2010-02-18 Olympus Corp 基板浮上装置
JP2011225355A (ja) * 2010-04-22 2011-11-10 Sumitomo Heavy Ind Ltd エア浮上ユニット、ステージ装置、検査システム、露光システム及び塗布システム
JP2013227151A (ja) * 2012-04-24 2013-11-07 Jae-Sung Lee 大面積パネル用の搬送プレート
JP2014118221A (ja) * 2012-12-13 2014-06-30 Toray Eng Co Ltd 基板浮上装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018181913A1 (ja) * 2017-03-31 2018-10-04 株式会社ニコン 物体保持装置、処理装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び物体保持方法
KR20190077564A (ko) * 2017-03-31 2019-07-03 가부시키가이샤 니콘 물체 유지 장치, 처리 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 및 물체 유지 방법
JPWO2018181913A1 (ja) * 2017-03-31 2019-12-26 株式会社ニコン 物体保持装置、処理装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び物体保持方法
JP2021015285A (ja) * 2017-03-31 2021-02-12 株式会社ニコン 物体保持装置、処理装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
KR102315472B1 (ko) * 2017-03-31 2021-10-21 가부시키가이샤 니콘 물체 유지 장치, 처리 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 및 물체 유지 방법
TWI762610B (zh) * 2017-03-31 2022-05-01 日商尼康股份有限公司 物體保持裝置、處理裝置、平板顯示器的製造方法、元件製造方法以及物體保持方法
JP7192841B2 (ja) 2017-03-31 2022-12-20 株式会社ニコン 物体保持装置、処理装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2018205330A (ja) * 2017-05-30 2018-12-27 株式会社オーク製作所 露光装置及び基板載置方法
JP7023620B2 (ja) 2017-05-30 2022-02-22 株式会社オーク製作所 露光装置及び基板載置方法
WO2020145630A1 (en) * 2019-01-07 2020-07-16 Samsung Electronics Co., Ltd. Display apparatus and method of manufacturing display apparatus thereof

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JP6791132B2 (ja) 2020-11-25
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JP2021039362A (ja) 2021-03-11
HK1246869A1 (zh) 2018-09-14
CN107615169A (zh) 2018-01-19
TWI731860B (zh) 2021-07-01
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TW201703189A (zh) 2017-01-16
KR102625921B1 (ko) 2024-01-16

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