WO2016189576A1 - 電子部品圧着装置及び電子部品実装機 - Google Patents
電子部品圧着装置及び電子部品実装機 Download PDFInfo
- Publication number
- WO2016189576A1 WO2016189576A1 PCT/JP2015/064692 JP2015064692W WO2016189576A1 WO 2016189576 A1 WO2016189576 A1 WO 2016189576A1 JP 2015064692 W JP2015064692 W JP 2015064692W WO 2016189576 A1 WO2016189576 A1 WO 2016189576A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic component
- circuit board
- pressure
- crimping
- support block
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
- H01L2224/75651—Belt conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
- H01L2224/75822—Rotational mechanism
- H01L2224/75823—Pivoting mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
- H01L2224/7592—Load or pressure adjusting means, e.g. sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Definitions
- the present invention relates to an electronic component crimping apparatus and an electronic component mounting machine that pressurize an electronic component placed on a crimping portion of a circuit board with a pressure tool from above and crimp the electronic component to the crimping portion of the circuit board. .
- the lower surface of the pressure tool when the lower surface of the pressure tool is inclined with respect to the upper surface (pressure surface) of the electronic component on the circuit board, the lower surface of the pressure tool hits the upper surface of the electronic component and pressurizes. Since the pressure applied by the tool locally acts on one side of the electronic component, the electronic component is displaced during crimping, or the crimping state of the electronic component is non-uniform, which causes a reduction in mounting reliability.
- Patent Document 1 Japanese Patent Laid-Open No. 11-330156
- Patent Document 2 Japanese Patent Laid-Open No. 2008-258473
- An inclination measuring device is provided to detect the inclination of the component (circuit board) or the stage on which the circuit board is placed and the parallelism between the stage (circuit board) and the pressing tool.
- a tilt adjustment device is provided to adjust the tilt of the tool, and the tilt measuring device measures the tilt of the pressure tool before the start of production. Based on the measured value, the tilt adjusting device determines the tilt of the press tool and the tilt of the stage. After adjusting, there is what started production.
- the problem to be solved by the present invention is that the pressure tool can be adjusted in accordance with the inclination of the crimping portion (electronic component) of the circuit board during the crimping operation without performing the tilt measurement process or the tilt adjustment process before the start of production. Inclination is automatically adjusted to uniformly pressurize the electronic component so that it can be accurately crimped to the crimping portion of the circuit board.
- the present invention provides an electronic component crimping apparatus that pressurizes an electronic component placed on a crimping portion of a circuit board from above and crimps the electronic component to the crimping portion of the circuit board.
- a plurality of pressurizing tools that pressurize the electronic components on the crimping portion of each of the above, a support block that supports each of the plurality of pressurizing tools via a scanning mechanism that can tilt in any direction of 360 °, and the support A drive mechanism that drives the block in the vertical direction and presses the electronic component on the crimping portion of the circuit board with any of the plurality of pressurizing tools by the lowering operation to crimp the electronic component to the crimping portion of the circuit board It is set as the structure provided with.
- each of the plurality of pressurizing tools is supported by the support block via a scanning mechanism that can tilt in any direction of 360 °.
- the inclination of the pressing tool is automatically adjusted according to the tilt of the electronic component on the crimping part of the circuit board by the copying mechanism.
- the electronic component is evenly pressed and accurately crimped to the crimping portion of the circuit board.
- the manufacturing cost of the electronic component crimping apparatus can be reduced.
- the plurality of pressure tools can be driven in the vertical direction by a single drive mechanism, and the configuration of the drive system It is possible to simultaneously pressurize a plurality of electronic components with a plurality of pressing tools in one support block, or pressurize one electronic component with a plurality of pressing tools at the same time. Change of component size, number of components, board size, etc.).
- each of the plurality of pressure tools supported by the support block can be tilted in any direction of 360 ° by the copying mechanism. Therefore, each pressurizing tool is adjusted according to the unevenness of the circuit board and the inclination of each electronic component.
- the pressure tool can be individually tilt adjusted.
- the electronic component crimping apparatus may have only one support block.
- a plurality of support blocks are provided, a drive mechanism is provided for each support block, and each support block is individually driven in the vertical direction by each drive mechanism.
- each drive mechanism is provided for each support block, and each support block is individually driven in the vertical direction by each drive mechanism.
- the present invention includes a conveyor that conveys the circuit board, and the plurality of support blocks are arranged in a width direction of the circuit board that is conveyed by the conveyor, and the circuit board is conveyed by the conveyor to
- the conveyance of the circuit board is stopped and the support block is lowered by the drive mechanism of the support block.
- the electronic component may be crimped to the crimping portion of the circuit board with the pressure tool of the support block. In this way, without moving the support block in the horizontal direction (X direction and / or Y direction), the electronic component on the crimping portion of the circuit board is moved below the support block, and the electronic component is moved.
- the support block may be moved in the horizontal direction with respect to the stopped circuit board, and the support block may be moved above the electronic component on the crimping portion of the circuit board to be crimped.
- at least one of the support block and the circuit board may be moved in the horizontal direction so that the support block and the electronic component on the crimping portion of the circuit board are positioned vertically and are crimped.
- the present invention provides a pressure detection means for detecting pressure applied to pressurize an electronic component on a pressure-bonding portion of a circuit board with a pressure tool, and the pressure applied during pressure bonding detected by the pressure detection means is a predetermined value A. It is good also as a structure provided with the control means which controls the downward movement of the said support block by the said drive mechanism. If it does in this way, it can control to the target applied pressure (predetermined value A) at the time of pressure bonding. In this case, feedback control may be performed so that the support block is lowered until the detected value of the applied pressure reaches a predetermined value A for each crimping operation, or the applied pressure at the time of crimping is detected by a trial operation before the start of production.
- the lowering amount of the support block may be determined so that the pressure applied during the pressure bonding becomes a predetermined value A, and production may be started.
- the pressing force during crimping is monitored during production, and when the pressing force during crimping increases or decreases from the target value A by a predetermined value B or more, the descending amount of the support block is decreased or increased by the predetermined value C. You may do it.
- the support block may be attached to be exchangeable with a support block having a different number of pressure tools and / or different pressure tool sizes.
- the number and size of the pressing tools for the support block can be easily changed at the time of setup change according to the production form (part size to be crimped, number of parts, board size, etc.). Can be improved.
- the electronic component crimping apparatus of the present invention is configured separately from an electronic component mounting machine for mounting electronic components on a circuit board, and the electronic component crimping apparatus of the present invention is arranged side by side on the board carry-out side of the electronic component mounting machine.
- the electronic component crimping apparatus of the present invention may be provided in the electronic component mounting machine.
- FIG. 1 is a perspective view of an electronic component mounting machine according to an embodiment of the present invention.
- FIG. 2 is a perspective view of a pressing tool and its peripheral part of the electronic component crimping apparatus.
- FIG. 3 is a perspective view of the drive mechanism of the electronic component crimping apparatus and its peripheral portion.
- FIG. 4 is an enlarged vertical cross-sectional view of the copying mechanism of the pressing tool and its peripheral portion.
- FIG. 5 is an enlarged longitudinal sectional view showing a state after the tilt adjustment by the copying mechanism of the pressing tool.
- a die supply device 12 which is an electronic component supply device is detachably set. In FIG. 1, only a part of the die supply device 12 is shown, and the other parts are not shown.
- the die supply device 12 is provided with a magazine (not shown) for storing the wafer pallets 13 in a plurality of stages, and a pallet loading / unloading mechanism (not shown) for taking the wafer pallets 13 out of the magazines.
- the wafer pallet 13 expands an expandable dicing sheet (not shown) on which a wafer diced so as to be divided into a large number of dies 14 (electronic components) is attached to a dicing frame 15 having a circular opening. It has a configuration that is installed in the state.
- the electronic component mounting machine 11 is provided with a conveyor 18 that transports the circuit board 17 in the X direction, and an XY moving mechanism 20 (XY robot) that moves the mounting head 19 in the XY direction (left and right and front and rear directions).
- the XY moving mechanism 20 is slidable in the Y direction (a direction perpendicular to the conveying direction of the circuit board 17) and slidable in the X direction (the conveying direction of the circuit board 17) on the Y slide 21.
- the mounting head 19 is attached to the X slide 22.
- the mounting head 19 of the component mounting machine 11 has one or more suction nozzles (not shown) for sucking the die 14 on the wafer pallet 13 of the die supply device 12 and mounting the die 14 on the circuit board 17, and the circuit board.
- a mark camera (not shown) or the like that images an imaging object such as 17 reference marks from above is provided.
- the die 14 which is an electronic component mounted on the crimping part of the circuit board 17, is pressed from above to crimp the die 14 to the crimping part of the circuit board 17.
- An electronic component crimping device 25 is provided.
- the configuration of the electronic component crimping apparatus 25 will be described with reference to FIGS.
- the electronic component crimping device 25 individually includes a plurality of support blocks 26 arranged in a line in the width direction of the circuit board 17 transported by the conveyor 18 (the Y direction perpendicular to the transport direction) and the plurality of support blocks 26.
- a plurality of drive mechanisms 27 see FIG. 3
- a plurality of pressure tools 28 are individually supported on each support block 26 via a scanning mechanism 29. 28 can be tilted in any direction of 360 ° by each copying mechanism 29.
- the plurality of pressing tools 28 of each support block 26 are arranged in a line in the width direction (Y direction) of the circuit board 17.
- each support block 26 is different from the elevating member 36 (see FIG. 3) of each drive mechanism 27 in the number of pressure tools 28 and / or the size of the pressure tools 28. It is attached interchangeably.
- each drive mechanism 27 that drives each support block 26 in the vertical direction uses an air cylinder 30 as a drive source, and each air cylinder 30 is attached to the cylinder of the main body frame 31 of the electronic component crimping device 25.
- a connecting piece 34 of an elevating member 36 that supports each support block 26 is connected and fixed to an upper end portion of a rod 33 that is fixed to the lower surface side of the piece 32 and protrudes upward from each air cylinder 30.
- the rod 33 is biased upward by the elastic force of the spring 35 attached to the rod 33 of each air cylinder 30.
- the air cylinder 30 When the air cylinder 30 is not operated, the rod 33 protrudes upward and is supported by the elastic force of the spring 35.
- the block 26 is held at a standby position that is the upper limit position of the vertical movement range.
- a load cell 37 serving as a pressure detection means for detecting pressure applied to pressurize the die 14 on the crimping portion of the circuit board 17 with the pressure tool 28 is provided in each support block 26. It is fixed so as to face the connecting piece 34 that moves up and down integrally.
- the air cylinder 30 is actuated to lower the rod 33 and the connecting piece 34 is lowered integrally with the support block 26, the connecting piece 34 comes into contact with the load cell 37, and the connecting piece 34 pushes down the load cell 37.
- a corresponding signal is output from the load cell 37 to the control device 38 (control means) of the electronic component mounting machine 11.
- a fixing hole 19 for fixing the three-stage stepped pin 42 is formed downward in the center of the lower portion of the base portion 41 of the copying mechanism 29, and the stepped pin 42 is attached to the fixing hole 43 by press fitting, screwing or the like from below.
- the spacer portion 44 and the disc-like support portion 45 formed on the stepped pin 42 protrude downward from the lower end surface of the base portion 41, and the disc-like support portion 45 is horizontally fixed to the lower portion of the base portion 41. It has become.
- the disk-shaped support part 45 is formed to have a larger diameter than the spacer part 44, and the spacer part 44 is formed to have a larger diameter than the part of the stepped pin 42 inserted into the fixing hole 43.
- the stepped pin 42 is press-fitted into the fixing hole 43 and screwed in until the upper end surface of the base portion 41 comes into contact with the lower end surface of the base portion 41. A gap corresponding to the thickness of the spacer portion 44 is secured between them.
- a circular flange portion 46 is formed so as to be fitted to the disc-like support portion 45 on the base portion 41 side. Are fitted so that they can move up and down and tilt with a clearance.
- a ring-shaped stopper 47 is inserted into the spacer portion 44 of the stepped pin 42 with a predetermined clearance.
- the inner diameter of the stopper 47 is formed smaller than the outer diameter of the disk-shaped support part 45, and the thickness of the fitting part of the stopper 47 with the spacer part 44 is formed smaller than the thickness of the spacer part 44.
- the stopper 47 is engaged and held on the upper surface side of the outer peripheral portion of the disk-like support portion 45 so as to be movable up and down and tiltable.
- a cylindrical portion 48 is formed on the upper surface side of the pressing tool 28 so as to surround the ring-shaped stopper 47, and the screw 50 is tightened from the outside into a screw hole 49 formed in the cylindrical portion 48.
- the press tool 28 and the stopper 47 are fixed by fitting the tip of the screw 50 into a recess 51 formed on the outer peripheral surface of the stopper 47.
- the pressing tool 28 is supported by the support block 26 via the copying mechanism 29 that can tilt in any direction of 360 °.
- a cylindrical portion 52 having the same diameter as the cylindrical portion 48 of the pressurizing tool 28 is formed below the base portion 41 of the copying mechanism 29, and a stopper 47 is provided by a spring 53 attached to the inner peripheral side of the cylindrical portion 52.
- the pressure tool 28 is biased downward.
- the circular flange portion 46 provided upward on the upper surface side of the pressurizing tool 28 can be moved up and down and tilted with a clearance on the outer peripheral side of the disc-like support portion 45 provided on the base portion 41. 4
- the pressing tool 28 comes into contact with the die 14 as shown in FIG. 5. Only the side that does not contact the die 14 is pushed up against the spring 53 and is not pushed up until it contacts the die 14. As a result, the pressurizing tool 28 is tilted along the inclination of the die 14 to eliminate the one-sided contact.
- the control device 38 of the electronic component mounting machine 11 sucks the die 14 on the wafer pallet 13 of the die supply device 12 with the suction nozzle of the mounting head 19 and carries it into the electronic component mounting machine 11 by the conveyor 18.
- the operation of attaching the die 14 to the crimping portion 17 is controlled, and after the die 14 is attached, the circuit board 17 is conveyed by the conveyor 18 so that the die 14 on the crimping portion of the circuit board 17 is connected to the electronic component crimping device 25.
- the circuit board 17 is conveyed below the support block 26 of the plurality of support blocks 26, the conveyance of the circuit board 17 is stopped and the support block 26 is lowered by the drive mechanism 27 of the support block 26.
- the pressure tool 28 of the block 26 functions as control means for controlling the operation of crimping the die 14 to the crimping portion of the circuit board 17.
- control device 38 of the electronic component mounting machine 11 detects the applied pressure based on the output signal of the load cell 37 when the die 14 on the crimping portion of the circuit board 17 is pressed by the pressing tool 28 of the support block 26. Then, the lowering operation of the support block 26 by the drive mechanism 27 is controlled so that the applied pressure at the time of pressure bonding becomes a target applied pressure (predetermined value A). At this time, feedback control may be performed so that the support block 26 is lowered until the detected value of the applied pressure reaches a predetermined value A for each crimping operation, or the applied pressure at the time of crimping is detected by a trial operation before the start of production.
- the amount of lowering of the support block 26 may be determined so that the pressure applied during crimping becomes a predetermined value A, and production may be started.
- the pressure applied during crimping is monitored during production, and when the pressure applied during crimping is increased or decreased from the target value A by a predetermined value B or more, the descending amount of the support block 26 is decreased or increased by the predetermined value C. You may make it let it. Further, if a profile of the pressurizing force detected by the load cell 37 is created and the production information is made into a database, an operator can be supported.
- each of the plurality of pressure tools 28 is supported by the support block 26 via the copying mechanism 29 that can tilt in any direction of 360 °.
- the support block 26 is lowered and the die 14 on the pressure-bonding portion of the circuit board 17 is pressed by the pressure tool 28, the inclination of the pressure tool 28 is changed by the copying mechanism 29 of the die 14 on the pressure-bonding portion of the circuit board 17. It is automatically adjusted according to the inclination, and the die 14 is evenly pressed in a state where the parallelism between the pressing tool 28 and the die 14 (the crimping portion of the circuit board 17) is ensured. Crimped to the crimping section with high accuracy.
- the mounting reliability of the die 14 can be ensured without performing the tilt measurement process and the tilt adjustment process before the start of production, the productivity can be improved, and the conventional tilt measurement / adjustment device becomes unnecessary.
- the manufacturing cost of the electronic component crimping device 25 can be reduced.
- the plurality of pressing tools 28 are supported by the single support block 26 via the copying mechanism 29, the plurality of pressing tools 28 can be driven in the vertical direction by the single driving mechanism 27.
- the configuration of the drive system can be simplified, and a plurality of dies 14 can be simultaneously pressurized with a plurality of pressing tools 28 of one support block 26, or one die 14 can be simultaneously pressed with a plurality of pressing tools 28. It is also possible to respond to changes in production form (size, number of die 14 to be crimped, substrate size, etc.).
- the plurality of pressing tools 28 supported by the support block 26 can be tilted in any direction of 360 ° by the copying mechanism 29, the unevenness of the circuit board 17 and the inclination of each die 14 are affected.
- the inclination of each pressing tool 28 can be adjusted individually.
- the electronic component crimping device 25 may have only one support block 26. Then, since a plurality of support blocks 26 are provided and a drive mechanism 27 is provided for each support block 26 and each support block 26 is individually driven in the vertical direction by each drive mechanism 27, a large circuit board 17 is provided. Even when a relatively large number of dies 14 are crimped, the dies 14 are evenly bonded in a state in which the parallelism between the pressing tools 28 of the plurality of support blocks 26 and the dies 14 (crimped portions of the circuit board 17) is secured. The pressure can be applied to the crimping portion of the circuit board 17 with high accuracy. In this case, it is not necessary to lower all the plurality of support blocks 26 at the same time, and only the support block 26 located above the die 14 on the crimping portion of the circuit board 17 may be lowered.
- a plurality of support blocks 26 are arranged in the width direction of the circuit board 17, the circuit board 17 is conveyed by the conveyor 18, and the die 14 on the crimping portion of the circuit board 17 is provided with the plurality of support blocks 26.
- the conveyance of the circuit board 26 is stopped, and the support block 26 is moved down by the drive mechanism 27 of the support block 26 to pressurize the support block 26. Since the die 14 is crimped to the crimping portion of the circuit board 17 at 28, the circuit is provided below the support block 26 without moving the support block 26 in the horizontal direction (X direction and / or Y direction).
- the die 14 on the crimping portion of the substrate 17 can be moved to crimp the die 14 to the crimping portion of the circuit board 17.
- the support block 26 is moved in the horizontal direction with respect to the stopped circuit board 17, and the support block 26 is moved above the die 14 on the crimping portion of the circuit board 17 to be crimped.
- at least one of the support block 26 and the circuit board 17 is moved in the horizontal direction, and the support block 26 and the die 14 on the crimping portion of the circuit board 17 are positioned up and down so as to be crimped. It ’s fine.
- a load cell 37 is provided for detecting the pressure applied by the pressurizing tool 28 to pressurize the die 14 on the crimping portion of the circuit board 17, and the pressurizing force detected by the load cell 37 is a predetermined value A. Since the lowering operation of the support block 26 by the drive mechanism 27 is controlled so as to become, it is possible to control the applied pressure at the time of pressure bonding to a target applied pressure (predetermined value A). *
- the support block 26 attached to the elevating member 36 of the drive mechanism 27 can be replaced with a support block 26 having a different number of pressure tools 28 and / or different sizes of the pressure tools 28, the support block 26 is changed during the setup change.
- the number and size of the pressing tools 28 can be easily changed in accordance with the production form (the size and number of the die 14 to be crimped, the substrate size, etc.), and the changeability can be improved.
- the electronic component crimping device 25 is provided in the electronic component mounting machine 11.
- the electronic component crimping device is configured separately from the electronic component mounting device, and the board unloading side of the electronic component mounting machine is used.
- the electronic component crimping devices may be arranged side by side.
- the electronic component to be crimped to the crimping portion of the circuit board 17 is not limited to the die, and may be a chip component other than the die, and the drive source of the drive mechanism 27 is limited to the air cylinder.
- the present invention may be implemented in various ways without departing from the scope of the invention, such as a motor, and the configuration of the copying mechanism 29 may be changed as appropriate.
- SYMBOLS 11 Electronic component mounting machine, 12 ... Die supply apparatus (electronic component supply apparatus), 14 ... Die (electronic component), 17 ... Circuit board, 18 ... Conveyor, 19 ... Mounting head, 25 ... Electronic component crimping apparatus, 26 ... Support block 27 ... Drive mechanism 28 ... Pressure tool 29 ... Copying mechanism 30 ... Air cylinder 34 ... Connecting piece 36 ... Elevating member 37 ... Load cell (pressure detection means) 38 ... Control device (control) means)
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Die Bonding (AREA)
Abstract
Description
まず、図1に基づいて電子部品実装機11の構成を説明する。
倣い機構29のベース部41の下部中心には、3段の段付きピン42を固定する固定穴19が下向きに形成され、段付きピン42が固定穴43に下方から圧入、ねじ込み等により取り付けられ、該段付きピン42に形成されたスペーサ部44と円盤状支持部45がベース部41の下端面から下方に突出して、ベース部41の下部に円盤状支持部45が水平に固定された状態となっている。円盤状支持部45は、スペーサ部44よりも径が大きく形成され、スペーサ部44は、段付きピン42のうちの固定穴43に挿入される部分よりも径が大きく形成され、該スペーサ部44の上端面がベース部41の下端面に当接するまで段付きピン42を固定穴43に圧入、ねじ込み等することで、円盤状支持部45の外周部上端面とベース部41の下端面との間にスペーサ部44の厚み分の隙間を確保している。
本実施例では、加圧ツール28の上面側に上向きに設けられた円形フランジ部46を、ベース部41に設けられた円盤状支持部45の外周側にクリアランスを持って上下動可能且つ傾動可能に嵌合しているため、図4に示すように、加圧ツール28が加圧対象のダイ14に片当たりすると、図5に示すように、加圧ツール28は、ダイ14に接触する側のみがスプリング53に抗して押し上げられ、ダイ14に接触しない側は、ダイ14に接触するまで押し上げられない。これにより、加圧ツール28がダイ14の傾斜に沿って傾動して片当たりが解消される。しかも、加圧ツール28側の円形フランジ部46とベース部41側の円盤状支持部45との間には、前者を後者に上下動可能且つ傾動可能に嵌合するためのクリアランスが存在するだけであるため、加圧ツール28の傾動による加圧ツール28の水平方向の位置ずれ量はクリアランスの範囲内に収まり、加圧ツール28の傾動による加圧ツール28の水平方向の位置ずれ量を低減できる。従って、反りのある回路基板17上のダイ14でも均等に加圧して精度良く圧着できる。
Claims (6)
- 回路基板の圧着部に載せた電子部品を上方から加圧して該電子部品を該回路基板の圧着部に圧着する電子部品圧着装置において、
前記回路基板の圧着部上の電子部品を加圧する複数の加圧ツールと、
前記複数の加圧ツールの各々を360°いずれの方向にも傾動可能とする倣い機構を介して支持する支持ブロックと、
前記支持ブロックを上下方向に駆動し、下降動作により前記複数の加圧ツールのいずれかで前記回路基板の圧着部上の電子部品を加圧して該電子部品を該回路基板の圧着部に圧着する駆動機構と
を備えていることを特徴とする電子部品圧着装置。 - 複数の前記支持ブロックを備え、
各支持ブロック毎に前記駆動機構が設けられ、
各駆動機構により各支持ブロックが個別に上下方向に駆動されることを特徴とする請求項1に記載の電子部品圧着装置。 - 前記回路基板を搬送するコンベアを備え、
前記複数の支持ブロックは、前記コンベアで搬送する回路基板の幅方向に配列され、
前記コンベアにより前記回路基板を搬送して該回路基板の圧着部上の電子部品が前記複数の支持ブロックのいずれかの支持ブロックの下方に到達したときに該回路基板の搬送を停止して該支持ブロックの前記駆動機構により該支持ブロックを下降動作させて該支持ブロックの加圧ツールで該電子部品を該回路基板の圧着部に圧着することを特徴とする請求項2に記載の電子部品圧着装置。 - 前記加圧ツールで前記回路基板の圧着部上の電子部品を加圧する加圧力を検出する加圧力検出手段と、
前記加圧力検出手段で検出する圧着時の加圧力が所定値となるように前記駆動機構による前記支持ブロックの下降動作を制御する制御手段と
を備えていることを特徴とする請求項1乃至3のいずれかに記載の電子部品圧着装置。 - 前記支持ブロックは、前記加圧ツールの数及び/又は該加圧ツールのサイズが異なる支持ブロックと交換可能に取り付けられていることを特徴とする請求項1乃至4のいずれかに記載の電子部品圧着装置。
- 請求項1乃至5のいずれかに記載の電子部品圧着装置と、
電子部品を供給する電子部品供給装置とを備え、
前記電子部品供給装置により供給される電子部品を吸着ノズルで吸着して回路基板の圧着部に載せて前記電子部品圧着装置により該電子部品を該回路基板の圧着部に圧着することを特徴とする電子部品実装機。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15893212.9A EP3300102B1 (en) | 2015-05-22 | 2015-05-22 | Electronic component pressure-bonding device and electronic component mounting machine |
JP2017520054A JP6476290B2 (ja) | 2015-05-22 | 2015-05-22 | 電子部品圧着装置及び電子部品実装機 |
PCT/JP2015/064692 WO2016189576A1 (ja) | 2015-05-22 | 2015-05-22 | 電子部品圧着装置及び電子部品実装機 |
US15/575,987 US10462950B2 (en) | 2015-05-22 | 2015-05-22 | Electronic component bonding device and electronic component mounter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2015/064692 WO2016189576A1 (ja) | 2015-05-22 | 2015-05-22 | 電子部品圧着装置及び電子部品実装機 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016189576A1 true WO2016189576A1 (ja) | 2016-12-01 |
Family
ID=57392610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2015/064692 WO2016189576A1 (ja) | 2015-05-22 | 2015-05-22 | 電子部品圧着装置及び電子部品実装機 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10462950B2 (ja) |
EP (1) | EP3300102B1 (ja) |
JP (1) | JP6476290B2 (ja) |
WO (1) | WO2016189576A1 (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03225842A (ja) * | 1990-01-30 | 1991-10-04 | Mitsubishi Electric Corp | ボンディングツール |
JPH0631145U (ja) * | 1992-09-28 | 1994-04-22 | カシオ計算機株式会社 | 熱圧着装置 |
JPH06216201A (ja) * | 1993-01-18 | 1994-08-05 | Matsushita Electric Ind Co Ltd | タブデバイスの熱圧着装置および熱圧着方法 |
JPH0774214A (ja) * | 1993-09-03 | 1995-03-17 | Fujitsu Ltd | 熱圧着装置と熱圧着方法 |
JPH1064958A (ja) * | 1996-08-13 | 1998-03-06 | Hitachi Ltd | ボンディング方法および装置 |
JPH10321673A (ja) * | 1997-05-22 | 1998-12-04 | Matsushita Electric Ind Co Ltd | バンプ付きチップのボンディング装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1032946A1 (en) * | 1997-11-20 | 2000-09-06 | Matsushita Electric Industrial Co., Ltd. | Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components |
JP3759837B2 (ja) | 1998-05-11 | 2006-03-29 | 松下電器産業株式会社 | 電子部品実装装置及びその方法 |
JP4743495B2 (ja) * | 2005-07-08 | 2011-08-10 | 東京エレクトロン株式会社 | 流体加熱装置 |
DE102006003735A1 (de) * | 2006-01-26 | 2007-08-09 | Infineon Technologies Ag | Anordnung zum Befestigen von elektronischen Bauelementen auf einem Träger |
JP5004636B2 (ja) | 2007-04-06 | 2012-08-22 | パナソニック株式会社 | 電子部品圧着装置および電子部品圧着装置の平行度調整方法 |
KR101335275B1 (ko) | 2007-07-20 | 2013-11-29 | 삼성전자주식회사 | 반도체 칩 본딩 장치 |
JP5732631B2 (ja) | 2009-09-18 | 2015-06-10 | ボンドテック株式会社 | 接合装置および接合方法 |
-
2015
- 2015-05-22 EP EP15893212.9A patent/EP3300102B1/en active Active
- 2015-05-22 US US15/575,987 patent/US10462950B2/en active Active
- 2015-05-22 JP JP2017520054A patent/JP6476290B2/ja active Active
- 2015-05-22 WO PCT/JP2015/064692 patent/WO2016189576A1/ja active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03225842A (ja) * | 1990-01-30 | 1991-10-04 | Mitsubishi Electric Corp | ボンディングツール |
JPH0631145U (ja) * | 1992-09-28 | 1994-04-22 | カシオ計算機株式会社 | 熱圧着装置 |
JPH06216201A (ja) * | 1993-01-18 | 1994-08-05 | Matsushita Electric Ind Co Ltd | タブデバイスの熱圧着装置および熱圧着方法 |
JPH0774214A (ja) * | 1993-09-03 | 1995-03-17 | Fujitsu Ltd | 熱圧着装置と熱圧着方法 |
JPH1064958A (ja) * | 1996-08-13 | 1998-03-06 | Hitachi Ltd | ボンディング方法および装置 |
JPH10321673A (ja) * | 1997-05-22 | 1998-12-04 | Matsushita Electric Ind Co Ltd | バンプ付きチップのボンディング装置 |
Also Published As
Publication number | Publication date |
---|---|
EP3300102B1 (en) | 2019-04-17 |
US10462950B2 (en) | 2019-10-29 |
EP3300102A4 (en) | 2018-05-30 |
US20180153060A1 (en) | 2018-05-31 |
JPWO2016189576A1 (ja) | 2018-03-15 |
JP6476290B2 (ja) | 2019-02-27 |
EP3300102A1 (en) | 2018-03-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11007768B2 (en) | Board work device having support member conveyance section for conveying board support member | |
KR101079687B1 (ko) | 압착 장치 | |
CN106413372B (zh) | 搬运装置 | |
JP4677275B2 (ja) | 電子部品用のエキスパンド装置 | |
JP2013232667A (ja) | 実装装置および実装方法 | |
JP5001633B2 (ja) | プリント基板保持方法および装置 | |
JP4084393B2 (ja) | 部品実装装置および部品実装方法 | |
JP6476290B2 (ja) | 電子部品圧着装置及び電子部品実装機 | |
CN107466197B (zh) | 部件安装装置以及部件安装方法 | |
JP2009246285A (ja) | 部品実装装置 | |
CN108136766B (zh) | 印刷装置、基板位置调整方法 | |
JP6673753B2 (ja) | 基板クランプ装置及び基板処理装置 | |
JP2009166302A (ja) | スクリーン印刷方法及び装置 | |
JP2019067834A (ja) | 部品実装装置、部品実装ライン、部品実装装置による部品実装方法及び部品実装ラインによる部品実装方法 | |
JP2680773B2 (ja) | 部品装着装置における加圧力制御装置 | |
JP4498894B2 (ja) | スクリーン印刷機 | |
CN112602385B (zh) | 控制程序的检查装置 | |
JP2014078655A (ja) | 樹脂貼着装置 | |
WO2022130444A1 (ja) | 部品実装機およびクランプ制御方法 | |
CN110087885B (zh) | 丝网印刷机 | |
KR101638869B1 (ko) | 미세동축케이블 본딩장치 | |
CN114501816A (zh) | 半导体芯片贴片机 | |
JP4957685B2 (ja) | スクリーン印刷機及びスクリーン印刷方法 | |
JP2023084390A (ja) | コレット傾き検知構造、コレット傾き修正構造、コレット傾き検知方法、コレット傾き修正方法、ボンディング装置、およびボンディング方法 | |
CN115602571A (zh) | 部件压接装置以及部件压接装置的控制方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 15893212 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2017520054 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15575987 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2015893212 Country of ref document: EP |