WO2016177267A1 - 封装胶、封装方法、显示面板及显示装置 - Google Patents

封装胶、封装方法、显示面板及显示装置 Download PDF

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Publication number
WO2016177267A1
WO2016177267A1 PCT/CN2016/079368 CN2016079368W WO2016177267A1 WO 2016177267 A1 WO2016177267 A1 WO 2016177267A1 CN 2016079368 W CN2016079368 W CN 2016079368W WO 2016177267 A1 WO2016177267 A1 WO 2016177267A1
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encapsulation layer
encapsulant
encapsulation
glass substrate
thermal expansion
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French (fr)
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殷川
张家豪
熊先江
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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Priority to US15/544,329 priority Critical patent/US10707439B2/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing

Definitions

  • the present disclosure relates to the field of display, and in particular, to an encapsulant, a packaging method, a display panel, and a display device.
  • OLED organic light-emitting diode
  • a glass frit is usually used to complete the package between the package cover and the array substrate. Specifically, firstly, a low-softening point glass powder (glass paste) having a width of about 1 to 2 mm and a thickness of about 6 to 100 ⁇ m is deposited on the edge of the package cover by screen printing, and then the organic solvent is removed by prebaking. It is cured to form a glass frit, which is then heated by laser irradiation to melt the glass frit to bond the package cover and the array substrate.
  • the height difference of the formed frit is difficult to control within 1 ⁇ m due to the difficulty of the coating technique and the baking technique, as shown in FIG.
  • the cross section in the AA' direction after laser irradiation is as shown in FIG. 2, in which the surface of the glass frit 300' formed on the package cover 100' can be In contact with the surface of the array substrate 200', the area is well packaged.
  • the cross section in the AA' direction after laser irradiation is as shown in FIG. 3, in which the surface of the frit 300' has a gap with the surface of the array substrate 200'. Poor packaging.
  • the present disclosure provides a technical solution to solve the problem of poor packaging due to height unevenness of the formed frit in the prior art.
  • the technical solution of the present disclosure provides an encapsulant comprising a frit and an organic solvent, and further comprising a material having a coefficient of thermal expansion greater than the frit.
  • the glass frit is borosilicate glass, and the material having a thermal expansion coefficient greater than that of the glass frit is quartz.
  • the mass ratio of the quartz to the borosilicate glass ranges from 3:7 to 4:6.
  • the present disclosure also provides a packaging method, including:
  • step S1 further includes: removing the organic solvent by heating the encapsulant to form an encapsulation layer on the package region;
  • Step S2 further includes irradiating the encapsulation layer with a laser to form a sealing structure between the first glass substrate and the second glass substrate.
  • step S1 specifically includes:
  • each of the encapsulants Forming at least two layers of the encapsulant in the package region of the first glass substrate, each of the encapsulants forming an encapsulation layer after heating and removing the organic solvent, thereby forming at least two layers of the encapsulation layer in a stacked manner, wherein For any two of the formed encapsulation layers, the encapsulation layer formed by the encapsulation adhesive has a thermal expansion coefficient greater than that of the encapsulation layer formed by the encapsulation adhesive.
  • step S1 two layers of an encapsulation layer are formed in a stacked manner, wherein a thermal expansion coefficient of the encapsulation layer formed by the first encapsulation adhesive is 80 ⁇ 10 -7 /° C. to 25 ⁇ 10 -6 /° C.
  • the encapsulating layer formed by the encapsulant has a thermal expansion coefficient of 30 ⁇ 10 -7 /° C. to 40 ⁇ 10 -7 /° C.
  • volume ratio of the encapsulation layer formed by the post-installation encapsulant to the encapsulation layer formed by the encapsulation glue disposed first is greater than or equal to 5:1.
  • the encapsulation layer formed by the post-setting encapsulant has a volume ratio of 6:1 to the encapsulation layer formed by the pre-set encapsulant.
  • the present disclosure further provides a display panel including a first glass substrate and a second glass substrate disposed opposite to each other, and the first glass substrate and the second glass substrate are disposed between A sealing structure formed by an encapsulant.
  • the sealing structure comprises at least two layers of encapsulation layers stacked in layers, and the at least two layers are arranged in a stacked manner by sequentially providing the corresponding number of layers on the package area of the first glass substrate. After the glue is heated and formed, wherein, for any two layers of the encapsulation layer, the encapsulation layer formed by the encapsulation layer has a thermal expansion coefficient greater than a thermal expansion coefficient of the encapsulation layer formed by the encapsulation adhesive.
  • the present disclosure also provides a display device including the above display panel.
  • the encapsulant provided by the present disclosure is doped with a material having a thermal expansion coefficient greater than that of the frit in the existing glass paste, thereby improving the thermal expansion coefficient of the encapsulant after removing the organic solvent, and improving the encapsulation process by laser irradiation.
  • the expansion volume of the encapsulant when it is heated thereby effectively reducing the gap between the encapsulant and the array substrate, thereby improving the packaging effect.
  • FIG. 1-3 are partial schematic views of a package structure formed by a packaging process in the prior art
  • 4-6 are partial schematic views of a package structure in an embodiment of the present disclosure.
  • 7-9 are partial schematic views of another package structure in an embodiment of the present disclosure.
  • Embodiments of the present disclosure provide an encapsulant comprising a frit and an organic solvent, and further comprising a material having a coefficient of thermal expansion greater than the frit.
  • the encapsulant provided by the embodiment of the present disclosure improves the thermal expansion coefficient of the encapsulant after removing the organic solvent by doping the existing glass paste with a thermal expansion coefficient larger than the material of the frit, and the process of encapsulation by laser irradiation
  • the expansion volume of the encapsulant is increased when heated, thereby effectively reducing the gap between the encapsulant and the array substrate, thereby improving the packaging effect.
  • a quartz material can be heated therein, so that the coefficient of thermal expansion of the glass paste after removing the organic solvent can be improved.
  • the mass ratio of the added quartz to the borosilicate glass in the glass paste may be 3:7 to 4:6, for example, 1:2, 4:5, or the like.
  • the proportion of the two can be controlled to obtain the encapsulant corresponding to different thermal expansion coefficients.
  • the above selected materials may be added to the glass glue used in the conventional packaging process, and stirred to be evenly distributed in the glass glue, thereby producing the above-mentioned encapsulant.
  • the embodiments of the present disclosure further provide a method for packaging by using the above package glue, including:
  • the substrate may be a package cover plate in the OLED manufacturing process.
  • the package adhesive may be coated on the package area of the package cover by a screen printing method, and then the organic solvent is removed by prebaking to form an encapsulation layer;
  • step S2 bonding the first glass substrate and the second glass substrate, and irradiating the encapsulation layer with a laser to form a sealing structure between the first glass substrate and the second glass substrate; wherein
  • the second glass substrate may be an array substrate in the OLED manufacturing process, and a plurality of organic light emitting units are formed thereon.
  • the package cover plate obtained in the above step S1 is aligned with the array substrate provided with the organic light emitting unit. Then, heat curing is performed with a laser to form a sealing structure between the package cover and the array substrate.
  • the present disclosure can significantly increase the expansion volume of the entire encapsulation layer when heated by encapsulating the existing glass paste with a material having a thermal expansion coefficient greater than that of the glass frit in the process of encapsulation by laser irradiation after prebaking, such as Figure 4 shows.
  • Figure 4 shows the cross section in the AA' direction after laser irradiation.
  • the contact area of the colloid with the array substrate 200 is increased, thereby further improving the sealing property of this region.
  • the cross section in the AA' direction after laser irradiation is as shown in Fig. 6. Since the volume of the colloid is significantly increased when heated, the height thereof is correspondingly increased as compared with the prior art, so that it can be brought into contact with the array substrate 200, thereby forming a sealing structure there.
  • At least two layers of the encapsulant may be sequentially coated on the package region of the first glass substrate, and each layer of encapsulant forms an encapsulation layer after heating and removing the organic solvent, thereby At least two layers of encapsulation layers are formed in a stacked manner.
  • the thermal expansion coefficient of the encapsulation layer formed by applying the encapsulant first is greater than the thermal expansion coefficient of the encapsulation layer formed by applying the encapsulation adhesive. That is, for each of the encapsulation layers, the coefficient of thermal expansion is greater than the encapsulation layer formed on the surface thereof.
  • the larger encapsulation layer exerts an outward force on the encapsulation layer having a smaller coefficient of thermal expansion, thereby increasing the deformation of the outermost encapsulation layer and improving the uniformity of contact between the surface and the second glass substrate, thereby improving the encapsulation effect.
  • two encapsulation layers 310 and 320 may be sequentially formed on the package region of the package cover 100. Since the thermal expansion coefficient of the encapsulation layer 310 formed by first coating the encapsulant is relatively high, when the laser is heated, the encapsulation layer 310 will exert an outward force on the encapsulation layer 320 formed by applying the encapsulant, thereby causing the encapsulation layer 320 to occur. A larger deformation than a single layer improves the uniformity of contact between the surface and the array substrate, thereby improving the packaging effect.
  • Fig. 8 is a schematic cross-sectional view in the AA' direction of the area a in Fig. 7, and Fig.
  • FIG. 9 is a schematic cross-sectional view in the AA' direction of the area b in Fig. 7.
  • the scheme of the multi-layer encapsulation layer of the present embodiment can further improve the encapsulation effect compared to the scheme of forming only one encapsulation layer.
  • the thermal expansion coefficient (CTE) of the encapsulation layer 310 may be: in order to avoid excessive pores generated after laser irradiation at the junction between the encapsulation layer 310 and the package cover (glass material) 100 formed by applying the encapsulant first. 80 ⁇ 10 -7 / ° C ⁇ 25 ⁇ 10 -6 / ° C.
  • the thermal expansion coefficient of the encapsulating layer 320 may be 30 ⁇ 10 -7 /° C. to 40 ⁇ 10 -7 . / ° C, which is close to the thermal expansion coefficient of the array substrate 200 (glass material) to reduce the adverse effect of the sealing stress on the package.
  • the encapsulation layer 320 formed by the post-coating adhesive and the encapsulation layer 310 formed by coating the encapsulant first may be used.
  • the volume ratio is greater than or equal to 5:1, for example, in one embodiment, may be 6:1 or the like.
  • an embodiment of the present disclosure further provides a display panel including a first glass substrate and a second glass substrate disposed opposite to each other, and the package is disposed between the first glass substrate and the second glass substrate Sealing structure formed by glue.
  • the sealing structure comprises a plurality of encapsulation layers arranged in a stack, wherein the plurality of encapsulation layers are laminated by sequentially coating a corresponding number of layers on a package area of the first glass substrate.
  • the encapsulant is formed and heated to form.
  • the encapsulation layer formed by applying the encapsulant first has a thermal expansion coefficient greater than that of the post-applied seal. The coefficient of thermal expansion of the encapsulation layer formed by the gluing.
  • the present disclosure also provides a display device including the above display panel.
  • the display device provided by the embodiment of the present disclosure may be any product or component having a display function, such as a notebook computer display screen, a television, a digital photo frame, a mobile phone, a tablet computer, and the like.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种封装胶、封装方法、显示面板及显示装置，该封装胶包括玻璃料和有机溶剂，还包括热膨胀系数大于该玻璃料的材料。该封装胶，通过在现有的玻璃胶中掺杂入热膨胀系数大于其中玻璃料的材料，从而提高去除有机溶剂后封装胶的热膨胀系数，在采用激光照射进行封装的过程中，提高封装胶受热时的膨胀体积，从而有效减小封装胶与阵列基板（200）之间的间隙，进而提高封装效果。

Description

封装胶、封装方法、显示面板及显示装置
相关申请的交叉引用
本申请要求于2015年05月07日递交的中国专利申请第201510230326.8号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开文本涉及显示领域，尤其涉及一种封装胶、封装方法、显示面板及显示装置。
背景技术
近年来，有机发光二极管(OLED)显示器作为一种新兴的平板显示器，被引起广泛的关注，由于OLED器件本身对水汽和氧气非常敏感，因此在实际应用中需要对OLED器件进行封装以隔绝水汽和氧气从而延长OLED的使用寿命。
在目前的OLED显示器制作工艺中，通常采用玻璃料完成封装盖板与阵列基板之间的封装。具体地，首先通过丝网印刷的方式在封装盖板边缘沉积宽约为1～2mm，厚度约为6～100μm的低软化点玻璃粉(玻璃胶)，然后经过预烘烤去除其中的有机溶剂使其固化形成玻璃料，再使用激光照射加热玻璃料使其熔化从而粘结封装盖板和阵列基板。然而，对于大尺寸面板，由于涂布技术与烘烤技术的困难导致形成的玻璃料的高度差很难控制在1μm以内，如图1所示。对于预烘烤后高度较高的a’区域，激光照射后其AA’方向上的截面如图2所示，在该区域中，形成在封装盖板100’上的玻璃料300’的表面能够与阵列基板200’的表面相接触，该区域封装良好。而对于烘烤后高度较低的b’区域，激光照射后其AA’方向上的截面如图3所示，在该区域中，玻璃料300’的表面与阵列基板200’的表面存在间隙，造成封装不良。
发明内容
本公开文本提供了解决现有技术中由于形成的玻璃料的高度不均导致的封装不良的问题的技术方案。
在一个方面，本公开文本的技术方案提供了一种封装胶，包括玻璃料和有机溶剂，还包括热膨胀系数大于所述玻璃料的材料。
进一步地，所述玻璃料为硼硅酸盐玻璃，所述热膨胀系数大于所述玻璃料的材料为石英。
进一步地，在所述封装胶中，所述石英与所述硼硅酸盐玻璃的质量比例的范围为3:7～4:6。
在另一个方面，本公开文本还提供了一种封装方法，包括：
S1：在第一玻璃基板的封装区域上设置上述的封装胶；
S2：将所述第一玻璃基板与第二玻璃基板进行贴合。
在一个实施例中，步骤S1进一步包括：通过加热所述封装胶而去除所述有机溶剂，以在所述封装区域上形成封装层；
步骤S2进一步包括：采用激光照射所述封装层，以在所述第一玻璃基板与所述第二玻璃基板之间形成密封结构。
进一步地，步骤S1具体包括：
在所述第一玻璃基板的封装区域依次设置至少两层所述封装胶，每层封装胶在加热去除有机溶剂后形成一层封装层，从而形成至少两层呈层叠设置的封装层，其中，对于所形成的任意两层封装层，先设置的封装胶所形成的封装层的热膨胀系数大于后设置的封装胶所形成的封装层的热膨胀系数。
进一步地，在步骤S1中形成两层呈层叠设置的封装层，其中，先设置的封装胶所形成的封装层的热膨胀系数为80×10-7/℃～25×10-6/℃，后设置的封装胶所形成的封装层的热膨胀系数为30×10-7/℃～40×10-7/℃。
进一步地，后设置的封装胶所形成的封装层与先设置的封装胶所形成的封装层的体积比例大于或等于5:1。
在一个实施例中，后设置的封装胶所形成的封装层与先设置的封装胶所形成的封装层的体积比例为6:1。
在又一个方面，本公开文本还提供了一种显示面板，包括相对设置的第一玻璃基板和第二玻璃基板，所述第一玻璃基板与所述第二玻璃基板之间设置有采用上述的封装胶形成的密封结构。
进一步地，所述密封结构包括至少两层呈层叠设置的封装层，所述至少两层呈层叠设置的封装层通过依次在所述第一玻璃基板的封装区域上设置对应层数的所述封装胶并加热后形成，其中，对于所述密封结构中的任意两层封装层，先设置的封装胶所形成的封装层的热膨胀系数大于后设置的封装胶所形成的封装层的热膨胀系数。
在另一个方面，本公开文本还提供了一种显示装置，包括上述的显示面板。
本公开文本提供的封装胶，在现有的玻璃胶中掺杂入热膨胀系数大于其中玻璃料的材料，从而提高去除有机溶剂后封装胶的热膨胀系数，在采用激光照射进行封装的过程中，提高封装胶受热时的膨胀体积，从而有效减少封装胶与阵列基板之间的间隙，进而提高封装效果。
附图说明
为了更清楚地说明本公开实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1-3是现有技术中的封装工艺形成的封装结构的局部示意图；
图4-6是本公开文本实施方式中的一种封装结构的局部示意图；
图7-9是本公开文本实施方式中的另一种封装结构的局部示意图。
具体实施方式
下面结合附图和实施例，对本公开文本的具体实施方式作进一步详细 描述。以下实施例用于说明本公开文本，但不用来限制本公开文本的范围。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非另作定义，此处使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开专利申请说明书以及权利要求书中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”或者“一”等类似词语也不表示数量限制，而是表示存在至少一个。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也相应地改变。
本公开文本实施方式提供了一种封装胶，包括玻璃料和有机溶剂，此外，该封装胶还包括热膨胀系数大于所述玻璃料的材料。
本公开文本实施方式提供的封装胶，通过在现有的玻璃胶中掺杂入热膨胀系数大于其中玻璃料的材料，从而提高去除有机溶剂后封装胶的热膨胀系数，在采用激光照射进行封装的过程中，提高封装胶受热时的膨胀体积，从而有效减少封装胶与阵列基板之间的间隙，进而提高封装效果。
例如，对于采用硼硅酸盐玻璃作为玻璃料所形成的玻璃胶，可以在其中加热石英材料，从而可以提高玻璃胶在去除有机溶剂后的热膨胀系数。其中，所添加的石英与玻璃胶中的硼硅酸盐玻璃的质量比例可以为3:7～4:6，例如，可以为1:2、4:5等。在使用过程中，可以通过控制两者的比例，从而得到对应不同热膨胀系数的封装胶。具体地，可将上述所选取的材料加入到传统封装工艺所采用的玻璃胶中，并搅拌使其均匀的分布在玻璃胶中，从而制作得到上述的封装胶。
此外，本公开文本实施方式还提供了一种采用上述封装胶进行封装的方法，包括：
S1：在第一玻璃基板的封装区域上涂布上述的封装胶，通过对所述涂布的封装胶加热去除其中的有机溶剂后在所述封装区域上形成封装层；其中，该第一玻璃基板可以为OLED制作工艺中的封装盖板，具体，可采用丝网印刷的方法在封装盖板的封装区域上涂布上述的封装胶，而后通过预烘烤去除有机溶剂后从而形成封装层；
S2：将所述第一玻璃基板与第二玻璃基板进行贴合，并采用激光照射所述封装层以在所述第一玻璃基板与所述第二玻璃基板之间形成密封结构；其中，该第二玻璃基板可以为OLED制作工艺中的阵列基板，其上形成有多个有机发光单元，具体地，将将上述步骤S1得到的封装盖板与设有有机发光单元的阵列基板进行对合，然后用激光进行加热固化，从而在封装盖板与阵列基板之间形成密封结构。
在现有技术中，由于丝网印刷及烘烤技术的困难，玻璃胶预烘烤完后，均一性很难控制在1μm以内。本公开文本通过在现有的玻璃胶中掺杂入热膨胀系数大于其中玻璃料的材料，在预烘烤后采用激光照射进行封装的过程中，能够显著提高整个封装层受热时的膨胀体积，如图4所示。在对封装盖板100和阵列基板200之间的封装层300激光照射后，对于原本预烘烤后高度就较高的a区域，激光照射后其AA’方向上的截面如图5所示。由于在激光照射时该区域中的胶体体积相比现有技术显著增加，使得胶体与阵列基板200的接触面积增加，从而进一步地提高此区域的密封性。而对于原本预烘烤后高度较低的b区域，激光照射后其AA’方向上的截面如图6所示。由于胶体在受热时体积显著增加，相比现有技术其高度也相应增加，从而使其能够与阵列基板200相接触，进而在此处形成密封结构。
在一个实施例中，在步骤S1中，可以在所述第一玻璃基板的封装区域依次涂布至少两层所述封装胶，每层封装胶在加热去除有机溶剂后形成一层封装层，从而形成至少两层呈层叠设置的封装层。其中，对于所形成的任意两层封装层，先涂布封装胶所形成的封装层的热膨胀系数大于后涂布封装胶所形成的封装层的热膨胀系数。即，对于每一层封装层，其热膨胀系数均大于形成在其表面上的封装层。当进行激光加热时，热膨胀系数 较大的封装层会对热膨胀系数较小的封装层一个向外的力，从而提高最外层的封装层的形变量，改善其表面与第二玻璃基板接触的均一性，从而提高封装效果。
例如，如图7所示，可以在封装盖板100的封装区域上依次形成两层封装层310和320。由于先涂布封装胶所形成的封装层310的热膨胀系数比较高，经激光加热时，封装层310会对后涂布封装胶所形成的封装层320一个往外的力，从而使得封装层320发生比单独一层更大的形变，改善其表面与阵列基板接触的均一性，从而提高封装效果。图8是图7中a区域的AA’方向上的截面示意图，图9是图7中b区域的AA’方向上的截面示意图。相比只形成一层封装层的方案，本实施方式多层封装层的方案能够进一步地提高封装效果。
其中，为避免先涂布封装胶所形成的封装层310与封装盖板(玻璃材质)100之间的连接处的在激光照射后产生过多气孔，封装层310的热膨胀系数(CTE)可以为80×10-7/℃～25×10-6/℃。此外，为了提高后涂布封装胶所形成的封装层320在激光照射后与阵列基板200之间的密封性，封装层320的热膨胀系数可以为30×10-7/℃～40×10-7/℃，使其与阵列基板200(玻璃材质)的热膨胀系数相接近，以降低密封应力对封装的不良影响。
优选地，为了避免两层封装层310和320的热膨胀系数差别太大造成连接处气孔太多，可以使后涂布封装胶所形成的封装层320与先涂布封装胶所形成的封装层310的体积比例大于或等于5:1，例如，在一个实施例中，可以为6:1等。
此外，本公开文本实施方式还提供了一种显示面板，包括相对设置的第一玻璃基板和第二玻璃基板，所述第一玻璃基板与所述第二玻璃基板之间设置有采用上述的封装胶形成的密封结构。
在一个实施例中，所述密封结构包括多层呈层叠设置的封装层，所述多层呈层叠设置的封装层通过依次在所述第一玻璃基板的封装区域上涂布对应层数的所述封装胶并加热后形成。其中，对于所述密封结构中的任意两层封装层，先涂布封装胶所形成的封装层的热膨胀系数大于后涂布封 装胶所形成的封装层的热膨胀系数。
此外，本公开文本还提供了一种显示装置，包括上述的显示面板。其中，本公开文本实施方式提供的显示装置可以是笔记本电脑显示屏、电视、数码相框、手机、平板电脑等任何具有显示功能的产品或部件。
以上实施方式仅用于说明本公开文本，而并非对本公开文本的限制，有关技术领域的普通技术人员，在不脱离本公开文本的精神和范围的情况下，还可以做出各种变化和变型，因此所有等同的技术方案也属于本公开文本的范畴，本公开文本的专利保护范围应由权利要求限定。

Claims (12)

  1. 一种封装胶，包括玻璃料和有机溶剂，其中，所述封装胶还包括热膨胀系数大于所述玻璃料的材料。
  2. 根据权利要求1所述的封装胶，其中，所述玻璃料为硼硅酸盐玻璃，所述热膨胀系数大于所述玻璃料的材料为石英。
  3. 根据权利要求2所述的封装胶，其中，在所述封装胶中，所述石英与所述硼硅酸盐玻璃的质量比例的范围为3:7～4:6。
  4. 一种封装方法，包括：
    S1：在第一玻璃基板的封装区域上设置权利要求1至3任一所述的封装胶；
    S2：将所述第一玻璃基板与第二玻璃基板进行贴合。
  5. 根据权利要求4所述的封装方法，其中，
    步骤S1进一步包括：通过加热所述封装胶而去除所述有机溶剂，以在所述封装区域上形成封装层；
    步骤S2进一步包括：采用激光照射所述封装层，以在所述第一玻璃基板与所述第二玻璃基板之间形成密封结构。
  6. 根据权利要求5所述的封装方法，其中，步骤S1进一步包括：
    在所述第一玻璃基板的封装区域依次设置至少两层所述封装胶，每层封装胶在加热去除有机溶剂后形成一层封装层，从而形成至少两层呈层叠设置的封装层，其中，对于所形成的任意两层封装层，先设置的封装胶所形成的封装层的热膨胀系数大于后设置的封装胶所形成的封装层的热膨胀系数。
  7. 根据权利要求6所述的封装方法，其中，在步骤S1中形成两层呈层叠设置的封装层，其中，先设置的封装胶所形成的封装层的热膨胀系数为80×10-7/℃～25×10-6/℃，后设置的封装胶所形成的封装层的热膨胀系数为30×10-7/℃～40×10-7/℃。
  8. 根据权利要求7所述的封装方法，其中，后设置的封装胶所形成的封装层与先设置的封装胶所形成的封装层的体积比例大于或等于5:1。
  9. 根据权利要求8所述的封装方法，其中，后设置的封装胶所形成的封装层与先设置的封装胶所形成的封装层的体积比例为6:1。
  10. 一种显示面板，包括相对设置的第一玻璃基板和第二玻璃基板，所述第一玻璃基板与所述第二玻璃基板之间设置有采用如权利要求1至3任一所述的封装胶形成的密封结构。
  11. 根据权利要求10所述的显示面板，其中，所述密封结构包括至少两层呈层叠设置的封装层，所述至少两层呈层叠设置的封装层通过依次在所述第一玻璃基板的封装区域上设置对应层数的所述封装胶并加热后形成，其中，对于所述密封结构中的任意两层封装层，先设置的封装胶所形成的封装层的热膨胀系数大于后设置的封装胶所形成的封装层的热膨胀系数。
  12. 一种显示装置，其中，包括如权利要求10-11任一所述的显示面板。
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