WO2016123948A1 - 封装设备和封装方法 - Google Patents

封装设备和封装方法 Download PDF

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Publication number
WO2016123948A1
WO2016123948A1 PCT/CN2015/086446 CN2015086446W WO2016123948A1 WO 2016123948 A1 WO2016123948 A1 WO 2016123948A1 CN 2015086446 W CN2015086446 W CN 2015086446W WO 2016123948 A1 WO2016123948 A1 WO 2016123948A1
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WIPO (PCT)
Prior art keywords
platform
substrate
packaging
patch
electromagnetic device
Prior art date
Application number
PCT/CN2015/086446
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English (en)
French (fr)
Inventor
王伟
孙中元
Original Assignee
京东方科技集团股份有限公司
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Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to JP2016567418A priority Critical patent/JP6593885B2/ja
Priority to EP15832865.8A priority patent/EP3255660B1/en
Priority to US14/908,420 priority patent/US9962916B2/en
Priority to KR1020167031642A priority patent/KR101827871B1/ko
Publication of WO2016123948A1 publication Critical patent/WO2016123948A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/08—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements

Definitions

  • the present application relates to the field of display device manufacturing technologies, and in particular, to a packaging device and a packaging method.
  • the LED display panel is mainly packaged by a glass seal material (for example, UV glue).
  • a glass seal material for example, UV glue.
  • the cover glass and the substrate glass need to be adsorbed and aligned, then the UV glue between the substrate glass and the cover glass is irradiated with ultraviolet light, and the cover glass and the substrate glass are packaged together by UV glue. .
  • the existing adsorption methods mainly include vacuum adsorption method and electrostatic adsorption method. If the vacuum adsorption glass is simply used, when the chamber is in a high vacuum environment, the adsorbed glass substrate is easily dropped, so the vacuum adsorption method cannot achieve the package pressing of the high vacuum process. Further, when it is necessary to release the glass substrate, the switch of the vent hole vibrates the glass substrate to shift the glass substrate, thereby affecting the accuracy of the bonding alignment.
  • the method of electrostatic adsorption it is necessary to set the corresponding electrostatic range according to different types of substrates. If the static electricity is too large, it is easy to cause breakdown of the light emitting diode device. If the static electricity is too small, the substrate may easily fall off, affecting the alignment. Accuracy and complicated operation. Moreover, since the ultraviolet light is required to be irradiated under the device to be packaged, it is difficult for the electrostatic adsorption device to simultaneously provide a vacuum adsorption function, which tends to cause the adsorption strength to be too low, causing the substrate to slip.
  • a package device is provided.
  • the first platform and the second platform are oppositely disposed, the first platform is reciprocally movable toward or away from the second platform, the first platform is provided with a first electromagnetic device, and the packaging device further includes at least a patch that can be adsorbed by the first electromagnetic device, and when the first electromagnetic device adsorbs the patch, one side of the patch is attached to the first platform, and the patch The other side is for attaching to the substrate to be packaged.
  • the patch is a magnetic patch.
  • the first platform is formed with at least one vacuum adsorption hole for adsorbing and fixing the substrate to be packaged on the first platform.
  • the end faces of the vacuum adsorption holes are formed in a square wave shape or a back shape.
  • a position on the second platform corresponding to the first electromagnetic device is provided with a second electromagnetic device, and the magnetic patch can be adsorbed by the second electromagnetic device.
  • the first electromagnetic device comprises a plurality of electromagnetic induction coils, and the plurality of electromagnetic induction coils are disposed at least on opposite sides of the first platform.
  • the magnetic patch comprises a magnetic body and an ultraviolet separation glue disposed on the magnetic body, the ultraviolet separation glue being used for attaching to a substrate to be packaged.
  • the first platform is provided with a groove, and the magnetic patch can be placed in the groove; the depth of the groove is not greater than the thickness of the magnetic patch.
  • a compressible adjustment pad is disposed in the recess, and the compressible adjustment pad is for contacting the magnetic patch.
  • the packaging device further includes a patch carrier on which the carrier tape is wound; the magnetic patch is detachably disposed on the carrier tape; when the patch carrier is opposite When the second platform rotates, the carrier tape on the patch carrier is laid on the second platform, and the magnetic patch is located on the carrier tape facing the first platform. On the surface; when the first platform moves toward the second platform, the magnetic patch can be adsorbed by the first electromagnetic device and attached to the first platform.
  • the magnetic patch is detachably disposed on the carrier tape by an ultraviolet separation glue.
  • the packaging apparatus further includes a carrier tape recovery tray for recycling a blank carrier tape after the packaging is completed.
  • the packaging device further comprises being disposed on the first platform away from the second platform An adjustment member on one side, the adjustment member being coupled to the driving device for adjusting a relative position between the first platform and the second platform.
  • the encapsulation method is used to package a first substrate and a second substrate, and the first substrate or the second substrate is provided with a sealing material, wherein the packaging method comprises the following steps:
  • the air pressure of the chamber is restored to a standard air pressure, and the sealing material is irradiated to be melted and then solidified to complete the encapsulation of the first substrate and the second substrate.
  • the first platform is formed with at least one vacuum adsorption hole, and the first substrate is adsorbed and fixed on the first platform through the vacuum adsorption hole; the patch is a magnetic patch.
  • a second electromagnetic device is disposed on the second platform at a position corresponding to the first electromagnetic device, and the magnetic patch can be adsorbed by the second electromagnetic device;
  • the packaging method further includes:
  • the second electromagnetic device is turned on.
  • the magnetic patch is attached to the substrate through the magnetic patch, and the magnetic patch is adsorbed by the electromagnetic device, so that the substrate can be prevented from falling under the high vacuum environment, and the magnetic force of the first platform is closed when the alignment is applied, and the second platform is The magnetic opening ensures that the substrate can be accurately released without offset, which improves the alignment accuracy.
  • FIG. 1 is a schematic structural diagram of a packaging device in an embodiment of the present application.
  • FIG. 2 is a schematic plan view of a first platform in an embodiment of the present application.
  • FIG. 3 is a schematic plan view of a second platform in the embodiment of the present application.
  • FIG. 4 is a schematic view of the magnetic patch in cooperation with the first platform in the embodiment of the present application.
  • 5a-5e are schematic flow diagrams of a packaging method in an embodiment of the present application.
  • the present application firstly provides a package device having a structure as shown in FIG. 1 .
  • the package device includes a first platform 1 and a second platform 2 disposed opposite to each other.
  • the first platform 1 can reciprocate toward or away from the second platform 2 .
  • the first platform 1 is provided with a first electromagnetic device 11 .
  • the packaging device further includes at least one magnetic patch 3 that can be adsorbed by the first electromagnetic device 11 .
  • One side of the magnetic patch 3 is used for the first platform 1 . Attached, the other side of the magnetic patch 3 is attached to the substrate to be packaged, and the substrate can be detachably fixed to the first platform 1.
  • the present application can be used to package a first substrate (such as a cover glass) and a second substrate (such as a substrate glass) of an organic light emitting diode display panel.
  • the first platform 1 is for adsorbing the first substrate
  • the second platform 2 is for placing the second substrate.
  • the first substrate is attached to the magnetic patch 3, and the first electromagnetic device 11 is added to the first platform 1.
  • the first electromagnetic device 11 When the power is applied, the first electromagnetic device 11 generates a magnetic attraction magnetic patch 3, due to the magnetic sticker.
  • the presence of the sheet 3 ensures that the first substrate does not fall under high vacuum environment.
  • the power is turned off, the magnetic force disappears, and the first substrate can be accurately released and aligned with the second substrate.
  • the switch of the first electromagnetic device 11 does not cause vibration of the device, thereby effectively preventing the offset which may occur after the first substrate is released, and ensuring the alignment accuracy.
  • At least one vacuum adsorption hole 12 is formed on the first platform 1, and the vacuum adsorption hole 12 is used for adsorbing and fixing the substrate to be packaged on the first platform 1. That is, as an embodiment of the present application, the substrate can be detachably fixed to the first stage 1 by vacuum adsorption.
  • the first substrate and the second substrate of the OLED display panel As an example, after the first substrate 1 adsorbs the first substrate, the second substrate is placed close to the second substrate placed on the second platform 2, and the chamber is evacuated. The first substrate and the second substrate are subjected to a registration process under vacuum conditions, and the first substrate does not fall due to the presence of the magnetic patch 3. After the bonding of the two substrates is completed, the chamber is inflated to restore the atmospheric pressure in the chamber, and the first substrate and the second substrate can be further pressed due to the difference in pressure between the inside and the outside of the two substrates. The glass sealing material disposed between the two substrates is then irradiated with a laser to effect a packaging process.
  • the end faces of the vacuum adsorption holes 12 in the present application are set to a square waveform. as shown in picture 2. It can be understood that the end surface of the vacuum adsorption hole 12 in the present application can also be set to other shapes, such as a back shape or the like, as long as the function of vacuum adsorption can be realized.
  • a second electromagnetic device 21 is disposed on the second platform 2 at a position corresponding to the first electromagnetic device 11, and the magnetic patch 3 can be adsorbed by the second electromagnetic device 21.
  • the first substrate needs to be released to be attached to the second substrate. Since the vacuum is drawn in the chamber, the vacuum adsorption function on the first platform 1 disappears, and at this time, only the power is turned off, and the magnetic force of the first electromagnetic device 11 is turned off.
  • the second electromagnetic device 21 since the second electromagnetic device 21 is disposed at a position corresponding to the first electromagnetic device 11 on the second platform 2, in order to ensure that no offset occurs during the process of releasing the first substrate, the second electromagnetic device may be first given. 21 is energized, and then the first electromagnetic device 11 is powered off, ensuring that the magnetic patch 3 is always in an adsorbed state, thereby avoiding the offset of the first substrate during the release process, and improving the precision of the alignment package.
  • the first electromagnetic device 11 includes a plurality of electromagnetic induction coils, and the plurality of electromagnetic induction coils are disposed at least on opposite sides of the first platform 1.
  • the second electricity The magnetic device 21 also includes a plurality of electromagnetic induction coils, and the positions of the electromagnetic induction coils on the second stage 2 correspond to the positions of the electromagnetic induction coils on the first stage 1, respectively.
  • the material of the first platform 1 and the second platform 2 is not limited.
  • the base of the second platform 2 may be quartz glass 22, and the second electromagnetic device 21 may be disposed around the quartz glass 22, as shown in FIG. .
  • the magnetic patch 3 in the present application may be an iron patch. As shown in FIG. 4, the magnetic patch 3 includes a magnetic body 31 and an ultraviolet separation adhesive 32 disposed on the magnetic body 31, and the ultraviolet separation adhesive 32 is attached to the substrate to be packaged.
  • a portion of the first platform 1 attached to the magnetic patch 3 is provided with a recess 13 so that the magnetic patch 3 can be placed in the recess 13 and the depth of the recess 13 is not greater than the magnetic patch.
  • the thickness of 3 is to ensure that the magnetic patch 3 can be attached to the substrate to be packaged.
  • the purpose of providing the groove 13 is to reduce the distance between the vacuum adsorption hole 12 and the substrate to ensure a vacuum adsorption effect.
  • a compressible adjustment pad 14 can be disposed in the recess 13 for contacting the magnetic patch 3 to prevent deformation of the adsorbed portion of the substrate.
  • the packaging device further includes a patch carrier 4 on which the carrier tape 5 is wound, and the magnetic patch 3 is detachably disposed on the carrier tape 5 when the patch
  • the carrier tape 5 can be laid on the second platform 2
  • the magnetic patch 3 is placed on the surface of the carrier tape 5 facing the first platform 1, when the first platform 1 is oriented
  • the magnetic patch 3 can be adsorbed by the first electromagnetic device 11 and attached to the first platform 1.
  • the magnetic patch 3 is detachably disposed on the carrier tape 5 by the ultraviolet separation adhesive 32.
  • the packaging apparatus further comprises a carrier tape recovery tray 6 for recycling the blank carrier tape 5 after the end of the packaging.
  • the packaging device further includes an adjusting member 7 disposed on a side of the first platform 1 away from the second platform 2, and the adjusting member 7 is connected to the driving device for adjusting the first platform 1 and the second platform 2 Relative position between.
  • the relative position here includes a vertical distance, a horizontal distance, a parallelism, and the like between the two substrates.
  • the present application also provides a packaging method using the above packaging device, the packaging method is for packaging a first substrate and a second substrate, and the first substrate or the second substrate is provided with a sealing material,
  • the encapsulation method includes the following steps:
  • the air pressure of the chamber is restored to a standard air pressure, and the sealing material is irradiated to be melted and then solidified to complete the encapsulation of the first substrate and the second substrate.
  • the present application can ensure that the first substrate does not fall under high vacuum environment.
  • the magnetic force disappears, and the first substrate can be accurately released and aligned with the second substrate.
  • the switch of the first electromagnetic device 11 does not cause vibration of the device, thereby effectively preventing the offset which may occur after the first substrate is released, and ensuring the alignment accuracy.
  • At least one vacuum adsorption hole is formed on the first platform, and the first substrate is adsorbed and fixed on the first platform through the vacuum adsorption hole.
  • a second electromagnetic device is disposed on the second platform at a position corresponding to the first electromagnetic device, and the magnetic patch can be adsorbed by the second electromagnetic device;
  • the packaging method also includes performing before the first electromagnetic device is turned off:
  • the second electromagnetic device is turned on.
  • magnetic attraction and vacuum adsorption are combined, and the magnetic patch is attached to the substrate, and the magnetic patch is adsorbed by the electromagnetic device, thereby ensuring that the substrate does not fall under high vacuum environment, and when the alignment is applied
  • the magnetic force of the first platform is closed, and the magnetic force of the second platform is opened, which ensures that the substrate can be accurately released without offset, and the alignment accuracy is improved.
  • the present application is described in detail below with reference to the embodiments shown in FIG. 5a to FIG. 5e.
  • the package process of the present application includes the following steps:
  • the patch carrier 4 is rotated, the carrier tape 5 is laid, and the magnetic patch 3 is placed on the second platform 2, as shown in FIG. 5a;
  • the first platform 1 is moved downward until it contacts the magnetic patch 3, and the first electromagnetic device 11 is turned on, so that the magnetic patch 3 is adsorbed on the first platform 1, as shown in FIG. 5b;
  • the first substrate 8 enters the device, moves the first platform 1 close to the first substrate 8, opens the vacuum adsorption function, and adsorbs the first substrate 8 onto the first platform 1.
  • the magnetic patch 3 is provided with the ultraviolet separation adhesive 32.
  • One side is bonded to the first substrate 8, as shown in Figure 5d;
  • the second substrate 9 enters the device, the chamber begins to evacuate, and the first substrate 8 and the second substrate 9 are accurately aligned by the adjusting member 7.
  • the second electromagnetic device 21 is turned on, and the first electromagnetic device 11 is turned off.
  • the first substrate 8 is released to ensure that the first substrate 8 can be displaced without being released, and then the chamber is inflated to atmospheric pressure, and the ultraviolet light is irradiated to seal the glass between the first substrate 8 and the second substrate 9.
  • the material is cured and the package is completed, as shown in Figure 5e.
  • the application not only realizes the alignment packaging of the substrate under vacuum conditions, but also improves the precision of the alignment package. Moreover, the switch of the electromagnetic device does not cause vibration of the device, thereby effectively avoiding the substrate offset caused by the vibration of the device, and ensuring the alignment accuracy.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Vacuum Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Contacts (AREA)

Abstract

一种封装设备和封装方法，所述封装设备包括相对设置的第一平台（1）和第二平台（1），所述第一平台（1）能够朝向或远离所述第二平台（2）作往复移动，所述第一平台（1）上设置有第一电磁装置（11），所述封装设备还包括至少一个能够被所述第一电磁装置（11）吸附的磁性贴片（3），所述磁性贴片（3）的一侧用于与所述第一平台（1）相贴附，所述磁性贴片（3）的另一侧用于与待封装的基板相贴附，且所述基板能够可分离地固定在所述第一平台（1）上。

Description

封装设备和封装方法
相关申请的交叉引用
本申请主张在2015年2月2日在中国提交的中国专利申请号No.201510053620.6的优先权，其全部内容通过引用包含于此。
技术领域
本申请涉及显示设备制造技术领域，尤其涉及一种封装设备和封装方法。
背景技术
目前发光二极管显示面板主要采用玻璃封接料(例如：UV胶)进行封装。在封装过程中，需要对盖板玻璃和基板玻璃进行吸附和对位，然后使用紫外光照射位于基板玻璃和盖板玻璃之间的UV胶，通过UV胶将盖板玻璃和基板玻璃封装在一起。
现有的吸附方式主要有真空吸附法和静电吸附法两种。如果单纯采用真空吸附玻璃的方法，当腔室内处于真空度较高的环境时，被吸附的玻璃基板容易掉落，因此真空吸附方式不能实现高真空工艺的封装压合。并且，当需要释放玻璃基板时，通气孔的开关会使玻璃基板发生振动，使玻璃基板发生偏移，从而影响贴合对位的精度。
对于静电吸附的方法，需要根据不同类型的基板设定与之相应的静电范围，如果静电过大，容易对发光二极管器件造成击穿等问题，如果静电过小，容易使基板滑落，影响对位精度，操作过程复杂。并且，由于待封装器件的下方需要照射紫外光，静电吸附装置难以同时设置真空吸附功能，容易造成吸附强度过低，导致基板滑落。
发明内容
本申请的目的在于提供一种封装设备和封装方法，以在高真空条件下对器件进行封装。
为解决上述技术问题，作为本申请的第一个方面，提供一种封装设备， 包括相对设置的第一平台和第二平台，所述第一平台能够朝向或远离所述第二平台作往复移动，所述第一平台上设置有第一电磁装置，所述封装设备还包括至少一个能够被所述第一电磁装置吸附的贴片，当所述第一电磁装置吸附所述贴片时，所述贴片的一侧与所述第一平台相贴附，所述贴片的另一侧用于与待封装的基板相贴附。
优选地，所述贴片为磁性贴片。
优选地，所述第一平台上形成有至少一个真空吸附孔，所述真空吸附孔用于将所述待封装的基板吸附固定在所述第一平台上。
优选地，所述真空吸附孔的端面形成为方波形或者回字形。
优选地，所述第二平台上与所述第一电磁装置相对应的位置设置有第二电磁装置，所述磁性贴片能够被所述第二电磁装置吸附。
优选地，所述第一电磁装置包括多个电磁感应线圈，多个所述电磁感应线圈至少设置在所述第一平台上相对的两侧。
优选地，所述磁性贴片包括磁性本体和设置在所述磁性本体上的紫外分离胶，所述紫外分离胶用于与待封装的基板相贴附。
优选地，所述第一平台上设置有凹槽，所述磁性贴片能够置于所述凹槽中；所述凹槽的深度不大于所述磁性贴片的厚度。
优选地，所述凹槽内设置有可压缩的调节垫，所述可压缩的调节垫用于与所述磁性贴片相接触。
优选地，所述封装设备还包括贴片载盘，所述贴片载盘上缠绕有载带；所述磁性贴片可分离地设置在所述载带上；当所述贴片载盘相对所述第二平台转动时，所述贴片载盘上的所述载带被铺设在所述第二平台上，并使所述磁性贴片位于所述载带的朝向所述第一平台的表面上；当所述第一平台朝向所述第二平台移动时，所述磁性贴片能够被所述第一电磁装置吸附，并与所述第一平台相贴附。
优选地，所述磁性贴片通过紫外分离胶可分离地设置在所述载带上。
优选地，所述封装设备还包括载带回收盘，所述载带回收盘用于在封装结束后回收空白的载带。
优选地，所述封装设备还包括设置在所述第一平台上远离所述第二平台 的一侧的调节件，所述调节件与驱动装置相连，用于调整所述第一平台与所述第二平台之间的相对位置。
作为本申请的第二个方面，还提供一种使用上述封装设备的封装方法，包括以下步骤：
所述封装方法用于封装第一基板和第二基板，所述第一基板或所述第二基板上设置有封接料，其中，所述封装方法包括以下步骤：
开启所述第一平台上的第一电磁装置，使所述贴片贴附在所述第一平台上；
将第一基板放置在所述第二平台上，使所述第一平台朝向所述第二平台移动，直至所述贴片与所述第一基板相贴附，同时使所述第一基板固定在所述第一平台上；
使所述第一平台远离所述第二平台，将第二基板放置在所述第二平台上，并对腔室抽真空；
使所述第一平台朝向所述第二平台移动，同时调整所述第一平台的位置，使所述第一基板与所述第二基板之间准确对位；
关闭所述第一电磁装置，释放所述第一基板，使所述第一基板与所述第二基板贴合；
恢复所述腔室的气压至标准气压，照射所述封接料使之熔化后再固化，完成所述第一基板与所述第二基板的封装。
优选地，所述第一平台上形成有至少一个真空吸附孔，所述第一基板通过所述真空吸附孔吸附固定在所述第一平台上；所述贴片为磁性贴片。
优选地，所述第二平台上与所述第一电磁装置相对应的位置设置有第二电磁装置，所述磁性贴片能够被所述第二电磁装置吸附；
在关闭所述第一电磁装置之前，所述封装方法还包括：
开启所述第二电磁装置。
本申请通过磁性贴片与基板相贴附，通过电磁装置吸附磁性贴片，能够确保基板在高真空环境下吸附不跌落，对位贴合时，第一平台的磁力关闭，同时第二平台的磁力开启，保证了基板可以准确释放，不发生偏移，提高了对位精度。
附图说明
附图是用来提供对本申请的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本申请，但并不构成对本申请的限制。
图1是本申请实施例中封装设备的结构示意图；
图2是本申请实施例中第一平台的平面示意图；
图3是本申请实施例中第二平台的平面示意图；
图4是本申请实施例中磁性贴片与第一平台相配合的示意图；
图5a-图5e是本申请实施例中封装方法的流程示意图。
在附图中，1-第一平台；2-第二平台；11-第一电磁装置；12-真空吸附孔；13-凹槽；14-调节垫；21-第二电磁装置；22-石英玻璃；3-磁性贴片；31-磁性本体；32-紫外分离胶；4-贴片载盘；5-载带；6-载带回收盘；7-调节件；8-第一基板；9-第二基板。
具体实施方式
以下结合附图对本申请的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本申请，并不用于限制本申请。
本申请首先提供一种封装设备，其结构如图1所示，所述封装设备包括相对设置的第一平台1和第二平台2，第一平台1能够朝向或远离第二平台2作往复移动，第一平台1上设置有第一电磁装置11，所述封装设备还包括至少一个能够被第一电磁装置11吸附的磁性贴片3，磁性贴片3的一侧用于与第一平台1相贴附，磁性贴片3的另一侧用于与待封装的基板相贴附，且所述基板能够可分离地固定在第一平台1上。
本申请可用于封装有机发光二极管显示面板的第一基板(如盖板玻璃)和第二基板(如基板玻璃)。其中，第一平台1用于吸附所述第一基板，第二平台2用于放置所述第二基板。本申请使第一基板与磁性贴片3相贴附，并在第一平台1上增加第一电磁装置11，当加电时，第一电磁装置11产生磁力吸附磁性贴片3，由于磁性贴片3的存在，可以保证第一基板在高真空环境下吸附不跌落，当断电后，磁力消失，第一基板可以准确释放，与第二基板进行对位封装。
并且，第一电磁装置11的开关不会造成设备振动，从而有效防止了第一基板释放后可能产生的偏移，确保了对位精度。
进一步地，如图2所示，第一平台1上形成有至少一个真空吸附孔12，真空吸附孔12用于将待封装的基板吸附固定在第一平台1上。也就是说，作为本申请的一种实施方式，可以通过真空吸附的方式与磁力吸附方式相配合，从而使基板可分离地固定在第一平台1上。
以封装有机发光二极管显示面板的第一基板和第二基板为例，第一平台1吸附第一基板后，向放置在第二平台2上的第二基板靠近，此时对腔室抽真空，使第一基板和第二基板在真空条件下完成对位贴合过程，由于磁性贴片3的存在，第一基板不会掉落。两基板贴合完成后，对腔室充气，使腔室内恢复大气压，由于两基板内外气压差的作用，能够进一步对第一基板和第二基板实现压合。然后使用激光照射设置在两基板之间的玻璃封接料，实现封装过程。
具体地，在第一基板被吸附后并靠近第二基板之前，为了增强第一平台1对第一基板真空吸附的强度和均匀性，本申请中的真空吸附孔12的端面设置为方波形，如图2所示。可以理解的是，本申请中真空吸附孔12的端面还可以设置成其它的形状，例如回字形等，只要能够实现真空吸附的功能即可。
进一步地，如图3所示，第二平台2上与第一电磁装置11相对应的位置设置有第二电磁装置21，磁性贴片3能够被第二电磁装置21吸附。
以封装有机发光二极管显示面板的第一基板和第二基板为例，第一基板靠近第二基板并准确对位后，需要将第一基板释放，使其与第二基板贴合。由于腔室内抽了真空，第一平台1上真空吸附功能消失，此时只需要断电，关闭第一电磁装置11的磁力即可。在本申请中，由于第二平台2上与第一电磁装置11相对应的位置设置了第二电磁装置21，为了保证释放第一基板的过程中不发生偏移，可以先给第二电磁装置21通电，然后在给第一电磁装置11断电，确保磁性贴片3一直处于被吸附的状态，从而避免第一基板在释放过程中发生偏移，提高了对位封装的精度。
具体地，参考图2和图3，第一电磁装置11包括多个电磁感应线圈，多个所述电磁感应线圈至少设置在第一平台1上相对的两侧。相应地，第二电 磁装置21也包括多个电磁感应线圈，并且，第二平台2上的电磁感应线圈的位置分别与第一平台1上的电磁感应线圈的位置对应。
本申请对于第一平台1和第二平台2的材质不做限定，例如第二平台2的基底可以采用石英玻璃22，第二电磁装置21可以设置在石英玻璃22的四周，如图3所示。
本申请中的磁性贴片3可以是铁质贴片。如图4所示，磁性贴片3包括磁性本体31和设置在磁性本体31上的紫外分离胶32，紫外分离胶32用于与待封装的基板相贴附。
进一步地，第一平台1上与磁性贴片3相贴附的部位设置有凹槽13，以使得磁性贴片3能够置于凹槽13中，并且，凹槽13的深度不大于磁性贴片3的厚度，以确保磁性贴片3能够与待封装的基板相贴附。设置凹槽13的目的是为了减小真空吸附孔12与基板的距离，以确保真空吸附效果。
凹槽13内可以设置可压缩的调节垫14，所述可压缩的调节垫14用于与磁性贴片3相接触，以防止基板上被吸附的部位发生形变。
进一步地，如图1所示，所述封装设备还包括贴片载盘4，贴片载盘4上缠绕有载带5，磁性贴片3可分离地设置在载带5上，当贴片载盘4滚动经过第二平台2时，能够将载带5铺设在第二平台2上，并使磁性贴片3位于载带5的朝向第一平台1的表面上，当第一平台1朝向第二平台2移动时，磁性贴片3能够被第一电磁装置11吸附，并与第一平台1相贴附。
具体地，磁性贴片3通过紫外分离胶32可分离地设置在载带5上。此外，所述封装设备还包括载带回收盘6，载带回收盘6用于在封装结束后回收空白的载带5。
进一步地，所述封装设备还包括设置在第一平台1上远离第二平台2的一侧的调节件7，调节件7与驱动装置相连，用于调整第一平台1与第二平台2之间的相对位置。这里的相对位置包括两基板之间的垂直距离、水平距离、平行度等。
本申请还提供了一种使用上述封装设备的封装方法，所述封装方法用于封装第一基板和第二基板，所述第一基板或所述第二基板上设置有封接料，所述封装方法包括以下步骤：
开启所述第一平台上的第一电磁装置，使所述磁性贴片贴附在所述第一平台上；
将第一基板放置在所述第二平台上，使所述第一平台朝向所述第二平台移动，直至所述磁性贴片与所述第一基板相贴附，同时使所述第一基板固定在所述第一平台上；
使所述第一平台远离所述第二平台，将第二基板放置在所述第二平台上，并对腔室抽真空；
使所述第一平台朝向所述第二平台移动，同时调整所述第一平台的位置，使所述第一基板与所述第二基板之间准确对位；
关闭所述第一电磁装置，释放所述第一基板，使所述第一基板与所述第二基板贴合；
恢复所述腔室的气压至标准气压，照射所述封接料使之熔化后再固化，完成所述第一基板与所述第二基板的封装。
如上所述，本申请可以保证第一基板在高真空环境下吸附不跌落，当断电后，磁力消失，第一基板可以准确释放，与第二基板进行对位封装。并且，第一电磁装置11的开关不会造成设备振动，从而有效防止了第一基板释放后可能产生的偏移，确保了对位精度。
进一步地，所述第一平台上形成有至少一个真空吸附孔，所述第一基板通过所述真空吸附孔吸附固定在所述第一平台上。
进一步地，所述第二平台上与所述第一电磁装置相对应的位置设置有第二电磁装置，所述磁性贴片能够被所述第二电磁装置吸附；
所述封装方法还包括在关闭所述第一电磁装置之前进行的：
开启所述第二电磁装置。
上述实施例中采用磁力吸附和真空吸附相配合的方式，通过磁性贴片与基板相贴附，通过电磁装置吸附磁性贴片，能够确保基板在高真空环境下吸附不跌落，对位贴合时，第一平台的磁力关闭，同时第二平台的磁力开启，保证了基板可以准确释放，不发生偏移，提高了对位精度。
下面结合图5a-图5e中所示的实施例对本申请进行详细的阐述，本申请封装流程包括以下步骤：
贴片载盘4旋转，铺设载带5，把磁性贴片3设置到第二平台2上，如图5a所示；
第一平台1向下移动，直到与磁性贴片3接触，开启第一电磁装置11，使磁性贴片3吸附在第一平台1上，如图5b所示；
向上移动第一平台1，等待第一基板进入设备，如图5c所示；
第一基板8进入设备，移动第一平台1靠近第一基板8，开启真空吸附功能，把第一基板8吸附到第一平台1上，同时，磁性贴片3上设置有紫外分离胶32的一侧与第一基板8粘合在一起，如图5d所示；
第二基板9进入设备，腔室开始抽真空，利用调节件7使第一基板8和第二基板9准确对位，对位完成后，开启第二电磁装置21，关闭第一电磁装置11，释放第一基板8，以保证第一基板8在释放时能够不发生偏移，然后对腔室充气恢复至大气压，照射紫外光使位于第一基板8和第二基板9之间的玻璃封接料固化，完成封装，如图5e所示。
需要说明的是，照射紫外光的同时，还可以实现磁性贴片3与第一基板8的分离，从而拆卸磁性贴片3。
本申请不仅实现了基板在真空条件下的对位封装，而且能够提升对位封装的精度。并且，电磁装置的开关不会造成设备振动，从而有效避免了设备振动造成的基板偏移，确保了对位精度。
可以理解的是，以上实施方式仅仅是为了说明本申请的原理而采用的示例性实施方式，然而本申请并不局限于此。对于本领域内的普通技术人员而言，在不脱离本申请的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本申请的保护范围。

Claims (16)

  1. 一种封装设备，包括相对设置的第一平台和第二平台，所述第一平台能够朝向或远离所述第二平台作往复移动；所述第一平台上设置有第一电磁装置；所述封装设备还包括至少一个能够被所述第一电磁装置吸附的贴片；当所述第一电磁装置吸附所述贴片时，所述贴片的一侧与所述第一平台相贴附，所述贴片的另一侧用于与待封装的基板相贴附。
  2. 根据权利要求1所述的封装设备，其中，所述贴片为磁性贴片。
  3. 根据权利要求2所述的封装设备，其中，所述第一平台上形成有至少一个真空吸附孔，所述真空吸附孔用于将所述待封装的基板吸附固定在所述第一平台上。
  4. 根据权利要求3所述的封装设备，其中，所述真空吸附孔的端面形成为方波形或者回字形。
  5. 根据权利要求2所述的封装设备，其中，所述第二平台上与所述第一电磁装置相对应的位置设置有第二电磁装置，所述磁性贴片能够被所述第二电磁装置吸附。
  6. 根据权利要求5所述的封装设备，其中，所述第一电磁装置包括多个电磁感应线圈，多个所述电磁感应线圈至少设置在所述第一平台上相对的两侧。
  7. 根据权利要求2至6中任意一项所述的封装设备，其中，所述磁性贴片包括磁性本体和设置在所述磁性本体上的紫外分离胶，所述紫外分离胶用于与所述待封装的基板相贴附。
  8. 根据权利要求2至6中任意一项所述的封装设备，其中，所述第一平台上设置有凹槽，所述磁性贴片能够置于所述凹槽中；所述凹槽的深度不大于所述磁性贴片的厚度。
  9. 根据权利要求8所述的封装设备，其中，所述凹槽内设置有可压缩的调节垫，所述可压缩的调节垫用于与所述磁性贴片相接触。
  10. 根据权利要求2至6中任意一项所述的封装设备，其中，所述封装设备还包括贴片载盘，所述贴片载盘上缠绕有载带；所述磁性贴片可分离地设置在所述载带上；当所述贴片载盘相对所述第二平台转动时，所述贴片载盘上的所述载带被铺设在所述第二平台上，并使所述磁性贴片位于所述载带的朝向所述第一平台的表面上；当所述第一平台朝向所述第二平台移动时，所述磁性贴片能够被所述第一电磁装置吸附，并与所述第一平台相贴附。
  11. 根据权利要求10所述的封装设备，其中，所述磁性贴片通过紫外分离胶可分离地设置在所述载带上。
  12. 根据权利要求10所述的封装设备，其中，所述封装设备还包括载带回收盘，所述载带回收盘用于在封装结束后回收空白的载带。
  13. 根据权利要求2至6中任意一项所述的封装设备，其中，所述封装设备还包括设置在所述第一平台上远离所述第二平台的一侧的调节件，所述调节件与驱动装置相连，用于调整所述第一平台与所述第二平台之间的相对位置。
  14. 一种使用权利要求1至13中任意一项所述的封装设备的封装方法，所述封装方法用于封装第一基板和第二基板，所述第一基板或所述第二基板上设置有封接料，其中，所述封装方法包括以下步骤：
    开启所述第一平台上的第一电磁装置，使所述贴片贴附在所述第一平台 上；
    将第一基板放置在所述第二平台上，使所述第一平台朝向所述第二平台移动，直至所述贴片与所述第一基板相贴附，同时使所述第一基板固定在所述第一平台上；
    使所述第一平台远离所述第二平台，将第二基板放置在所述第二平台上，并对腔室抽真空；
    使所述第一平台朝向所述第二平台移动，同时调整所述第一平台的位置，使所述第一基板与所述第二基板之间准确对位；
    关闭所述第一电磁装置，释放所述第一基板，使所述第一基板与所述第二基板贴合；
    恢复所述腔室的气压至标准气压，照射所述封接料使之固化，完成所述第一基板与所述第二基板的封装。
  15. 根据权利要求14所述的封装方法，其中，所述第一平台上形成有至少一个真空吸附孔，所述第一基板通过所述真空吸附孔吸附固定在所述第一平台上；所述贴片为磁性贴片。
  16. 根据权利要求15所述的封装方法，其中，所述第二平台上与所述第一电磁装置相对应的位置设置有第二电磁装置，所述磁性贴片能够被所述第二电磁装置吸附；
    在关闭所述第一电磁装置之前，所述封装方法还包括：
    开启所述第二电磁装置。
PCT/CN2015/086446 2015-02-02 2015-08-10 封装设备和封装方法 WO2016123948A1 (zh)

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