WO2016107298A1 - 一种微型模塑封装手机智能卡以及封装方法 - Google Patents

一种微型模塑封装手机智能卡以及封装方法 Download PDF

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Publication number
WO2016107298A1
WO2016107298A1 PCT/CN2015/094436 CN2015094436W WO2016107298A1 WO 2016107298 A1 WO2016107298 A1 WO 2016107298A1 CN 2015094436 W CN2015094436 W CN 2015094436W WO 2016107298 A1 WO2016107298 A1 WO 2016107298A1
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Prior art keywords
mobile phone
chip
carrier tape
smart card
package
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Application number
PCT/CN2015/094436
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English (en)
French (fr)
Inventor
杨辉峰
洪斌
Original Assignee
上海仪电智能电子有限公司
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Filing date
Publication date
Priority claimed from CN201410855172.7A external-priority patent/CN104617052A/zh
Priority claimed from CN201410855552.0A external-priority patent/CN104617051A/zh
Priority claimed from CN201410857393.8A external-priority patent/CN104617076A/zh
Priority claimed from CN201410857387.2A external-priority patent/CN104600044A/zh
Application filed by 上海仪电智能电子有限公司 filed Critical 上海仪电智能电子有限公司
Publication of WO2016107298A1 publication Critical patent/WO2016107298A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the invention relates to a chip and an integrated circuit packaging technology, in particular to a micro-molded packaging mobile phone smart card and a packaging technology thereof.
  • 4FF cards have been processed, which are 12.3 mm wide, 8.8 mm high, and 0.67 mm thick, which are 40% smaller than the current SIM card size.
  • the final design will be developed in a way that ensures backward compatibility with existing SIM cards and continues to provide the same functionality as currently used cards.
  • the fourth type of mobile phone card formed according to this can only realize the contact smart card function after the completion of the production, and the non-contact function cannot be realized.
  • the invention aims at the problems of large size, complicated process, high material cost and high production cost of the mobile phone smart card packaged by the existing packaging process, and provides a micro-molded package mobile phone smart card, the smart card is smaller than the fourth specification (4FF)
  • 4FF fourth specification
  • the card is also small in size, and the smart card integrates the contact smart card function with the contactless smart card function and obtains a highly reliable product.
  • the present invention also provides a packaging process for a micro-molded package mobile phone smart card.
  • a micro-molded package mobile phone smart card the mobile phone smart card comprises a mobile phone card chip, a carrier tape carrying the mobile phone card chip, and a molded body, the carrier tape comprising a chip bearing area and a plurality of functional pads, the mobile phone card chip placement On the chip carrying area of the carrier tape, the function pads on the mobile phone card chip are electrically connected to the corresponding function pads on the carrier tape, and the molded body forms a mobile phone card for the mobile phone card chip and the carrier tape package, and the mobile phone card formed by the package is formed.
  • the length and width dimensions are 5mm*6mm and the thickness is 0.5mm-0.9mm.
  • the functional pads on the carrier tape comprise six contact contact wire regions and two non-contact wire regions.
  • each of the wire bonding regions on the carrier tape is disposed independently of each other.
  • the six contact contact wire areas are divided into two groups on average, and the two sets of contact function pads are symmetrically distributed on both sides of the chip bearing area in the horizontal or vertical direction, and two non-contact functional welding The discs are symmetrically distributed on either side of the chip carrying area in the vertical direction or in the horizontal direction.
  • the mobile phone card chip and the chip carrying area of the carrier tape are installed through a preset adhesive film.
  • the film is preset in the chip carrying area of the carrier tape or preset on the reverse side of the circuit layer of the mobile phone card chip.
  • the film layer is solid at normal temperature, and the film is melted after heating to produce a strong adhesive force, bonding the chip and the carrier tape, and curing.
  • the film thickness is 20-30 um.
  • the package is an ultraviolet package or a molded package.
  • Objective 2 A method for packaging a micro-molded packaged mobile phone smart card, the method comprising the following steps:
  • the mobile phone card chip is seated: the mobile phone card chip is fixedly mounted to the chip bearing area on the carrier tape by using an automatic chip loading device;
  • step (1) Lead welding: the semi-finished product completed in step (1) is sent to the welding equipment, and the electrical connection between the mobile phone card chip and the carrier tape is performed by the lead wire and ultrasonic welding: firstly, the ultrasonic wave is passed through the contact bonding wire area of the carrier tape.
  • the bump is formed in the manner, and then the contact function pad of the mobile phone card chip and the bump on the contact bonding wire area of the carrier tape are directly connected by ultrasonic waves; then the ultrasonic mode is adopted on the non-contact soldering wire area of the carrier tape. Raising the bumps, and finally directly connecting the non-contact function pads of the mobile phone card chip and the bumps on the non-contact wire bonding area of the carrier tape by ultrasonic waves;
  • the lead wire and the chip may be encapsulated by ultraviolet curing epoxy resin glue, and the colloid is cured by ultraviolet irradiation; Or by using a molding and packaging process, the solid molding compound is liquefied and encapsulated in the high-temperature mold to enclose the lead and the chip, and a reliable package is formed after being demolded.
  • step (3) The semi-finished product obtained by step (3) is tested for electrical performance by the automated chip test equipment, the non-conforming product is marked, the qualified product is put into storage, and the production process of the module is completed.
  • the mobile phone card chip is passed through the fully automatic chip mounting device.
  • the heating temperature is 50-100 ° C, so that the preset film between the mobile phone card chip and the carrier tape is melted, and the mobile phone card chip and the carrier tape are bonded, and Curing; when the melted film is cured, after leaving the heating zone after being stepped by the carrier tape, the mobile phone card chip and the carrier tape can be firmly bonded together by natural cooling and colloid curing; or after 100-200 ° C fast Bake to the final cure.
  • the mobile phone card chip to be packaged is placed in a corresponding molding cavity, and the molding and packaging device melts the high temperature and high pressure molding compound and then ejects into the molding cavity.
  • the package of the mobile phone card chip and the circuit is encapsulated in the molded body, and the packaged product formed by the release of the molding compound after cooling and solidification, and the excess molding compound is automatically removed by the molding and packaging device.
  • the arranging and sorting device arranges all the single micro-molded packaging mobile phone smart cards that have been cut in order and direction, passes through the testing device, and first detects the mobile smart card through the infrared probe. The appearance of the bottom package is then laser marked, and then the infrared appearance of the front of the mobile smart card is detected by the infrared probe. After the appearance of the smart card of the mobile phone is passed, the electrical performance test is performed; after the test is passed, the automatic sorting device is loaded into the package or the package. In the belt, the process of completing the entire package.
  • the micro-molded package mobile phone smart card formed by the solution provided by the invention integrates the smart card function of the contact type mobile phone and the smart card function of the contactless mobile phone, and the performance of the whole smart card is stable and reliable; meanwhile, the size of the micro-molded package mobile phone smart card is small, It can achieve a card width of 6 mm, a height of 5 mm and a thickness of 0.5 mm.
  • the solution of the preset film is ensured that the performance between the mobile phone card chip and the carrier tape during packaging is stable and reliable, thereby improving the performance of the smart card of the entire mobile phone, ensuring the product yield and improving production. effectiveness.
  • the existing packaging device can be used for packaging.
  • FIG. 1 is a schematic view showing the internal structure of a micro-molded and packaged mobile phone smart card according to the present invention
  • Figure 2 is a cross-sectional view of Figure 1 taken along the line A-A;
  • Example 3 is a schematic view showing a continuous carrier tape with a film preset in Example 1 of the present invention
  • FIG. 4 is a schematic view showing a conductive layer of a smart card carrier tape according to Example 1 of the present invention.
  • Example 5 is a cross-sectional view of a smart card of a mobile phone using a preset tape and an ultraviolet package in Example 1 of the present invention
  • FIG. 6 is a schematic view showing a mounting surface of a smart card carrier chip in the second embodiment of the present invention.
  • Example 7 is a schematic diagram of a conductive layer of a smart card carrier in Example 2 of the present invention.
  • FIG. 9 is a schematic view showing a method of attaching a solid crystal film to a back surface of a wafer circuit according to Example 2 of the present invention.
  • FIG. 10 is a schematic view showing a method of attaching a die-bonding film to a wafer circuit surface and applying a film according to Example 2 of the present invention
  • Example 11 is a schematic view showing a wafer after a preset film is subjected to a cutting process in Example 2 of the present invention
  • FIG. 12 is a cross-sectional view of a smart phone card of a mobile phone using a chip preset film and a molded package in the second embodiment of the present invention.
  • the present invention provides a micro-molded packaged mobile phone smart card 100 having a length to width dimension of 5 mm * 6 mm and a thickness dimension of 0.5 mm - 0.9 mm.
  • the micro-molded package mobile phone smart card 100 simultaneously integrates the contact type mobile phone smart card function and the non-contact type mobile phone smart card function, and can achieve a card width of 6 mm, a height of 5 mm, a thickness of 0.5 mm, wherein the thickness can also be 0.6 mm, 0.7. Mm, 0.8mm, 0.9mm, etc. It is smaller than the current fourth specification (4FF) card and can be miniaturized accordingly.
  • 4FF current fourth specification
  • the chip Since the existing packaging equipment is packaged, the chip needs to be mounted on the carrier tape by means of silver paste solid crystal, the silver paste is cured by heating, and subsequent wire bonding, packaging, testing and the like are performed.
  • the micro-molded package mobile phone smart card since the length and width dimensions are 5mm*6mm, in the packaging process, effective silver paste solidification cannot be performed at all, and the chip and the carrier tape are fixed.
  • the contact smart card function and the contactless smart card function need to be integrated at the same time.
  • the present invention provides a miniature molded package mobile phone smart card 100 that facilitates packaging and simultaneous integration of a contact smart card function and a contactless smart card function.
  • the micro-molded package mobile phone smart card 100 mainly includes a mobile phone card chip 101, a carrier tape 102, and a package body 103.
  • the mobile phone card chip 101 has a contact function and a non-contact function, and has eight function pads, specifically, six contact function pads 101a and two non-contact function pads 101b for implementing the chip. Contact and non-contact functions.
  • the carrier tape 102 is used as a carrying device for the mobile phone card chip, and the whole is made of a metal material, and specifically may be made of copper or a copper alloy material.
  • the carrier tape 102 includes a chip carrying area 102a and eight functional pads (ie, wire bonding areas).
  • the chip bearing area 102a is used for locating the mobile phone card chip 101, and the eight function pads correspond to the function pads of the mobile phone chip, specifically, six contact function pads 102b and two non-contact function pads 102c, respectively
  • the gold wire 104 is electrically connected to the six contact function pads 101a and the two non-contact function pads 101b on the mobile phone card chip 101. Then, the carrying of the mobile phone card chip 101 is realized.
  • the solution is reliably bonded between the chip and the chip bearing area of the carrier tape through the preset adhesive film 105. Since the corresponding adhesive film 105 is preset, the corresponding silver paste curing operation is not required in the packaging process, and the package of the micro-molded packaging mobile phone smart card is effectively realized.
  • the film 105 can be preset in the chip carrying area of the smart card carrier or on the reverse side of the circuit layer of the chip, which can be determined according to actual needs.
  • the film 105 has a uniform thickness and a thickness of 20 to 30 um.
  • the film has a property of changing state and viscosity with temperature change, and the film is solid at normal temperature, and the film is melted after heating, and a strong adhesive force is generated, and the melting temperature of the film is 50-100. Between °C.
  • the film is solid at room temperature, and the film has strong viscosity after being heated at a low temperature of 50-100 ° C. This state can provide the requirement for fixing the upper seat of the chip, and then rapidly baking at 100-200 ° C to achieve final curing, again. Baking heating does not melt, and has a film that is not traceable.
  • the film may be a film that is cured at room temperature after being heated and melted once, and is not melted at the time of secondary heating.
  • the film may be a film that can be melted multiple times after being heated for a plurality of times, such as a film that is cured at a normal temperature after being melted at a low temperature and can be melted again at a second low temperature.
  • the chip bearing area 102a on the carrier tape 102 is located in the middle of the carrier tape, and its size and shape are matched with the mobile phone card chip.
  • a corresponding adhesive film 105 may be previously disposed in the chip carrying area 102a as needed.
  • the functional pads on the mobile phone card chip are distributed independently of each other around the chip carrying area 102a.
  • Corresponding isolation trenches 106 are disposed between the six contact functional pads 102b, between the two non-contact functional pads 102c, and between the contact functional pads and the non-contact functional pads.
  • the functional pads on the carrier tape are isolated and independently arranged, and the isolation trench can fill the package during packaging, strengthen the bonding force between the package and the carrier tape, and ensure the stability and reliability of the smart card.
  • the six contact function pads 102b and the two non-contact function pads 102c on the carrier tape can be specifically distributed as follows:
  • the six contact functional pads 102b are equally divided into two groups symmetrically distributed on the left and right sides of the chip carrying region 102a (as shown in FIG. 1), and the three contact functional pads 102b in each group are evenly distributed.
  • the two non-contact function pads 102c are symmetrically distributed on the upper and lower sides of the chip carrying area 102a (as shown in FIG. 1).
  • the molded package 103 is used to package the mobile phone card chip 101 and package it with the carrier tape 102 to form a corresponding smart card.
  • the shape after packaging can be determined according to actual needs.
  • the packaged smart card is a square structure having a length and width of 5 mm * 6 mm and a thickness of 0.5 mm - 0.9 mm.
  • the present invention provides a corresponding packaging method, the process is as follows:
  • (1) Smart chip upper seat The smart chip is mounted on the chip carrying area of the carrier tape through the fully automatic chip upper device, and is heated from the bottom of the carrier tape, and the heating temperature is 50-100 ° C, so that the glue between the smart chip and the carrier tape The film melts, bonds the chip and the carrier tape, and cures; when the melted film is cured, after leaving the heating zone after being stepped by the carrier tape, the chip and the carrier tape are firmly bonded by natural cooling and colloid curing. Together; or after 100-200 ° C fast baking to achieve final curing;
  • step (1) Lead welding: the semi-finished product completed in step (1) is sent to the welding equipment, and the electrical connection between the smart chip and the carrier tape is performed by the lead wire and the ultrasonic welding: firstly, the ultrasonic welding method is adopted on the contact bonding wire area of the carrier tape. The bump is grown, and then the contact function pad of the smart chip and the bump on the contact wire region of the carrier tape are directly connected by ultrasonic waves; then the ultrasonically grown on the non-contact wire bonding area of the carrier tape Bumping, and finally the non-contact function pad of the smart chip and the bump on the non-contact wire bonding area of the carrier tape are directly connected by ultrasonic waves;
  • the lead wire and the chip may be encapsulated by ultraviolet curing epoxy resin glue, and the colloid is cured by ultraviolet irradiation; Or by using a molding and packaging process, the solid molding compound is liquefied and encapsulated in the high-temperature mold to enclose the lead and the chip, and a reliable package is formed after being demolded.
  • the mobile phone card chip to be packaged is placed in a corresponding molding cavity, and the molding and packaging device melts the high-temperature and high-pressure molding compound and then ejects it into the molding cavity, and packages the mobile phone card chip and the circuit.
  • the package is formed in the molded body, and the molded product is formed by cooling and solidifying the mold, and the excess molding compound is automatically removed by the molding and packaging device.
  • step (3) The semi-finished product obtained by step (3) is tested for electrical performance by the automated chip test equipment, the non-conforming product is marked, the qualified product is put into storage, and the production process of the module is completed.
  • the alignment and sorting device arranges all the single mini-molded package smart cards that have been cut in order and direction, passes through the test device, and first detects the appearance of the bottom package of the mini-molded package smart card through the infrared probe, and then performs laser processing. Marking, and then performing infrared visual inspection on the front side of the mini-molded package smart card through an infrared probe. After the appearance of the mini-molded package smart card is passed, electrical performance test is performed; after the test is passed, the package is loaded by the automatic sorting device. In the box or packaging tape, the entire packaging process is completed.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • the carrier tape is a continuous elongated strip and infinitely elongated structure, which mainly comprises a carrier tape body formed of an insulating substrate 1 and a conductive layer 3, and a plurality of uniform arrangements are arranged on the long side of the insulating substrate 1.
  • the perforation 2 is used for stepping the device to move the carrier tape forward.
  • a plurality of wire bonding holes 4 are provided for connecting the functional pads on the chip and the conductive patterns on the carrier tape.
  • the center area of the lead bonding hole 4 is a chip carrying area.
  • a conductive pattern 3 is provided at the conductive level.
  • a corresponding adhesive film 5 is preset in each chip bearing area of the carrier tape, and the adhesive film 5 is matched with the chip bearing area and closely fits on the surface of the chip bearing area, thereby covering the entire The surface of the chip carrying area.
  • the thickness of the film 5 is uniform, and the specific size can be determined according to actual needs. In order to ensure the reliability of the bonding and not affect the size of the final module, it is generally 5 to 30 um.
  • the present example is implemented by the following process steps (see FIGS. 3 and 4):
  • (2) Plating copper The entire strip of long copper foil is attached through an adhesive and an insulating substrate, and the copper foil and the insulating substrate are closely adhered by being rolled and heated by a roller.
  • etching for the semi-finished product obtained by the step (2), a dry film is disposed on the surface of the copper foil 3, and the dry film of the region to be etched is removed by a continuous exposure apparatus; the exposed copper foil is passed through an acidic etching solution Etching is performed to remove the unwanted copper foil, leaving the desired conductive pattern 3, and the remaining dry film and residue are washed away by a cleaning procedure.
  • the semi-finished product obtained by the step (3) is plated with a nickel layer and a gold layer on the copper foil surface by an electroplating process to improve the electrical conductivity and stability of the copper layer.
  • Gluing For the semi-finished product obtained in the step (4), a semi-fluid adhesive layer 5 is coated on the surface of the chip bearing area through a continuous gluing device, the thickness of the adhesive layer is uniform, and the thickness of the adhesive layer is controlled at 5- 30um.
  • the specific coating method in this step may be performed by screen printing, spraying, or filming.
  • a semi-finished product is obtained for the step (5), and a film of a film is formed on the surface of the carrier-carrying region of the carrier tape by natural cooling.
  • the smart card carrier tape thus formed has a film preset in the chip bearing area, and the carrier tape is mounted on the film of the carrier tape in a specific application, and the film is heated to fuse the chip and the carrier tape, and naturally Cooling and solidifying, and finally through the process of wire bonding, packaging, testing, etc., to form a stable performance smart card package module.
  • the carrier tape for module packaging, the process of dispensing the device can be omitted, and the package of the micro-molded package mobile phone smart card can be realized.
  • the chip 6 is first mounted on the preset film 5 in the chip carrying area of the carrier tape 1 by a fully automatic chip mounting device; When heated, the heating temperature was 80 ° C, and the film 5 between the chip 6 and the carrier tape 1 was melted.
  • the carrier tape is guided forward through the perforation 2 on the carrier tape 1, the carrier tape is stepped out of the heating region, and the melted film 5 is solidified by natural cooling, so that the chip and the carrier tape are firmly bonded.
  • the functional pads on the chip 6 and the corresponding pads on the carrier tape 1 are connected by a fully automatic wire bonding apparatus, and the leads 7 are connected to the pads on the chip and the connection points at the wire bonding holes 4 of the conductive layer 3. To extend the functional pads on the chip to the carrier tape.
  • the resin glue 8 encloses the lead and the chip, and cures the colloid by ultraviolet irradiation to form a reliable package 8.
  • the packaged module is tested for electrical performance of the module through the automated chip test equipment, the non-conforming product is marked, the qualified product is put into the warehouse, and the module production process is completed.
  • the smart card carrier tape in the example has a film preset in the chip bearing area, and the carrier tape is mounted on the film of the carrier tape in a specific application, and the film is heated to fuse the chip and the carrier tape, and naturally Cooling and solidifying, and finally through the process of wire bonding, packaging, testing, etc., to form a stable performance smart card package module.
  • the carrier tape for module packaging the process of dispensing the device can be omitted, the production efficiency is greatly improved, the defect rate caused by the dispensing process is avoided, the product cost is effectively reduced, and the entire production process can be extended to the existing production process.
  • the equipment is produced in large quantities.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • FIG. 6 and FIG. 7 it is a schematic diagram of a chip mounting surface and a conductive layer diagram of the smart card carrier tape in the present example.
  • a plurality of evenly arranged perforations 2 are arranged on the long side of the carrier tape 1 for device stepping. Move the carrier tape forward.
  • a plurality of wire bonding holes 4 are provided for connecting the functional pads on the chip and the conductive patterns on the carrier tape.
  • the center area of the lead bonding hole 4 is a chip carrying area.
  • a conductive pattern 3 is provided at the conductive level.
  • a schematic structural view of the chip 6 in the present example there is shown a schematic structural view of the chip 6 in the present example.
  • the chip 6 is preset with a corresponding adhesive film 5 on the reverse side of the circuit layer, and the adhesive film 5 cooperates with the reverse surface of the circuit layer of the chip 6, completely covering the reverse side of the circuit layer of the chip 6.
  • the thickness is uniform, and the specific size can be determined according to actual needs. In order to ensure the reliability of the bonding and not affect the size of the final module, it is generally 5 to 30 um.
  • the film constituting the film layer 5 has a property of changing state and viscosity with temperature change, and the film is solid at normal temperature, and the film is melted after heating, and a strong adhesive force is generated, and the film is formed.
  • the low temperature melting temperature is between 50 and 100 °C.
  • the film constituting the film layer 5 is solidified at a normal temperature after being melted at a low temperature, and cannot be melted again at the time of the second low temperature heating.
  • the film constituting the film layer 5 may be a film which is cured at a normal temperature after being melted at a low temperature and can be melted again at the time of secondary low-temperature heating.
  • the film constituting the film layer 5 may be a film which is subjected to rapid high-temperature heating at 100 to 200 ° C to achieve final curing, and which is finally heated and then heated and cannot be melted, and has an unreversible property.
  • FIG. 9 a schematic view of attaching a die-bonding film to the back side of a wafer circuit in the present example is shown.
  • the uncut wafer 9 has its circuit surface mark 10 placed upward, and the reverse side of the wafer and the solid crystal film 11 are attached to the wafer through the film colloid 12 on the solid crystal film to serve as a fixed crystal.
  • the metal support frame 13 is used for fixing the solid crystal film flatly and reliably.
  • the wafer 9 Before the gluing process, the wafer 9 needs to be turned 180 degrees, that is, the circuit marking surface (ie, the front side) is placed downward, so that the circuit front surface of the wafer and the solid crystal film are bonded.
  • the mold-transforming process should be carried out by removing the old film after the new film is applied first. The film should be attached to the flat and reliable.
  • FIG. 10 a schematic diagram of attaching a die-bonding film to a wafer circuit surface and coating a film is performed.
  • the metal support frame 13 effectively fixes the die-bonding film 11 to the wafer 9
  • the front side of the circuit is attached to the film colloid 12 of the solid crystal film; and the reverse side of the circuit of the wafer 9 is exposed.
  • the glue is applied to the reverse surface of the circuit of the wafer 9 by a gluing device, and is cured to form a film layer 5.
  • the wafer is again flipped, and the film layer of the wafer with the film is preset.
  • the film colloid 12 of the solid crystal film 11 is bonded together to be cut (see Fig. 11).
  • FIG. 11 a schematic diagram of a wafer after a pre-adhesive film is subjected to a cutting process in the present example.
  • the wafers that have been coated and over-molded are cut by the wafer cutting device as required, and a separate chip 6 is formed to be packaged for use.
  • the specific process is as follows:
  • the solid crystal film 11 is effectively fixed by the metal support frame 13 and is turned over, so that the circuit surface mark 10 of the wafer 9 is upward, and the film layer 5 is downward and the solid crystal film is formed.
  • the film colloids 12 of 11 are attached together, and the corresponding cutting grooves 14 are formed between the chips 6, so that the chips 6 are independent of each other, and the film 5 at the bottom of the chip 6 is also separated by the cutting grooves 14, and the depth of the cutting grooves is controlled at Greater than the depth of the bottom of the film.
  • FIG. 8 a schematic diagram of a single chip and a film after the preset film is taken in the present embodiment, the film layer 5 and the chip 6 are attached together after the chip is removed.
  • the chip 6 based on the carrier tape 1 and the preset film is formed to form a mobile phone smart card, referring to FIG. 12, the chip 6 with the film preset is mounted to the chip bearing area of the carrier tape 1 by the fully automatic chip mounting device. At the same time, the bottom of the carrier tape is heated, and the heating temperature is 60 ° C, so that the film 5 between the chip 6 and the carrier tape 1 is melted.
  • the film 5 has the characteristics of no-bake heating and melting and non-backtracking, which can solve the problem of poor soldering caused by chip sloshing due to melting or softening of the heated glue layer during wire bonding, and the glue layer and the chip silicon layer or strip are caused by heat during the packaging process. Surface holes and delamination problems to avoid affecting subsequent product reliability.
  • the curing of the film bonds the chip and the carrier tape firmly together.
  • the functional pads on the chip 6 and the corresponding pads on the carrier tape 1 are connected by a fully automatic wire bonding apparatus, and the leads 7 are connected to the pads on the chip and the leads at the wire bonding holes 4 of the conductive layer 3.
  • the contacts extend the functional pads on the chip to the carrier tape.
  • the semi-finished product of the lead wire is soldered, and the solid molding compound is liquefied in the high-temperature mold to encapsulate the lead wire and the chip, and the package lead and the chip are sealed after being demolded.
  • a reliable package 8 is formed.
  • the packaged module is tested for electrical performance of the module through the automated chip test equipment, the non-conforming product is marked, the qualified product is put into the warehouse, and the module production process is completed.
  • the chip with the film preset when used for the production of the smart card of the mobile phone, the chip is mounted on the carrier tape to be heated and solidified, and then subjected to wire bonding, packaging, testing and the like to form a package module with stable performance.
  • the module is packaged by the chip, which not only saves the process of dispensing the device, but also greatly improves the production efficiency, and avoids the defect rate caused by the dispensing process, thereby effectively reducing the product cost, and the entire production process can be extended to the existing production process.
  • the equipment is produced in large quantities.
  • the production of the mobile phone smart card by using the solution provided by the invention can save the process of dispensing the device, which not only simplifies the production process, but more importantly, can realize the card width of 6 mm and the height of 5 mm.

Abstract

提供了一种微型模塑封装手机智能卡，该手机智能卡(100)包括手机卡芯片(101)、承载手机卡芯片(101)的载带(102)以及模塑封装体(103)，所述载带(102)包括芯片承载区域(102a)和若干功能焊盘，所述手机卡芯片(101)安置在载带(102)的芯片承载区域(102a)上，手机卡芯片(101)上的功能焊盘(101a，101b)与载带(102)上的对应功能焊盘(102b，102c)电连接，所述模塑封装体(103)对手机卡芯片(101)和载带(102)封装形成手机卡，封装形成的手机卡的长宽尺寸为5mm*6mm，厚度尺寸为0.5mm-0.9mm。还提供了一种微型模塑封装手机智能卡的封装方法。所述微型模塑封装手机智能卡，同时集成接触式智能卡功能与非接触式智能卡功能，并且整个智能卡性能稳定可靠。

Description

一种微型模塑封装手机智能卡以及封装方法 技术领域
本发明涉及一种芯片及集成电路封装技术，特别涉及一种微型模塑封装手机智能卡及其封装技术。
背景技术
随着集成电路封装技术的不断进步，集成电路的集成度日益提高，功能越来越丰富。对于不断出现的新应用需求，要求集成电路封装企业能设计出新型的封装形式来配合新的需求。
传统的手机智能卡的标准依然采用SIM卡和UIM卡标准，其存在尺寸较大、工艺繁琐、材料成本高、生产成本高等缺点；将来的智能卡越来越趋向于小型化、集成化等特点，传统的手机智能卡就不能有效发挥其性能，势必需要通过新的手机智能卡来实现。
基于不断进步的集成电路封装技术，目前已经出现处理4FF卡，这种卡宽12.3毫米、高8.8毫米、厚0.67毫米，比目前使用的SIM卡尺寸小了40％。最终的设计方案将以确保向后兼容现有SIM卡的方式制定，并继续提供与目前使用卡相同的功能。
但是据此形成的第四种规格手机卡在制作完成后仅能够实现接触式智能卡功能，无法实现非接触功能。
再者对于第四种规格(4FF)卡的封装结构，由于其尺寸小，若采用现有封装设备和工艺进行封装，对产品的性能影响较大，成品率低并且整个生产效率也会降低。
因此，提供一种新型的迷你型智能卡封装结构，以解决现有的微型手机智能卡所存在的问题，是本领域亟需要解决的技术问题。
发明内容
本发明针对现有封装工艺封装成的手机智能卡尺寸较大、工艺繁琐、材料成本高、生产成本高等问题，而提供一种微型模塑封装手机智能卡，该智能卡的尺寸比第四种规格(4FF)卡的尺寸还小，并且该智能卡集成接触式智能卡功能与非接触式智能卡功能，并获得高可靠性的产品。
在此基础上，本发明还提供一种微型模塑封装手机智能卡的封装工艺。
为了达到上述目的，本发明采用如下的技术方案：
一种微型模塑封装手机智能卡，所述手机智能卡包括手机卡芯片、承载手机卡芯片的载带以及模塑体，所述载带包括芯片承载区域和若干功能焊盘，所述手机卡芯片安置在载带的芯片承载区域上，手机卡芯片上功能焊盘与载带上的对应功能焊盘电连接，所述模塑体对手机卡芯片和载带封装形成手机卡，封装形成的手机卡的长宽尺寸为5mm*6mm，厚度尺寸为0.5mm-0.9mm。
优选的，所述载带上的功能焊盘包括六个接触式接触式焊线区域和两个非接接触式焊线区域。
优选的，所述载带上各焊线区域之间相互独立设置。
优选的，所述六个接触式接触式焊线区域平均分成两组，且两组接触式功能焊盘对称分布在芯片承载区域水平或者垂直方向上的两侧，而两个非接触式功能焊盘对称分布在芯片承载区域垂直方向或水平方向上的两侧。
优选的，所述手机卡芯片与载带的芯片承载区域之间通过预置的胶膜进行安装。
优选的，所述的胶膜预置在载带的芯片承载区域内或预置在手机卡芯片的电路层反面。
优选的，所述的胶膜层常温下胶膜呈固态，在加热后胶膜融化，产生较强的粘结力，粘结芯片和载带，并进行固化。
优选的，所述的胶膜厚度为20～30um。
优选的，所述封装体为紫外线封装体或者模塑封装体。
目的2：一种微型模塑封装手机智能卡的封装方法，该方法包括如下步骤：
(1)手机卡芯片上座：用自动芯片装载设备将手机卡芯片固定安装到载带上的芯片承载区域；
(2)引线焊接：将步骤(1)完成的半成品送入焊接设备，通过引线和超声波焊接进行手机卡芯片与载带之间的电连接：首先在载带的接触式焊线区域上通过超声波方式长出凸点，接着将手机卡芯片的接触式功能焊盘和载带的接触式焊线区域上的凸点通过超声波直接连接；接着在载带的非接触式焊线区域上通过超声波方式长出凸点，最后将手机卡芯片的非接触式功能焊盘和载带的非接触式焊线区域上的凸点通过超声波直接连接；
(3)封装：对由步骤(2)得到的半成品进行封装成型；进行封装时，可通过紫外线固化的环氧树脂胶点胶，将引线和芯片包封起来，并采用紫外线照射使胶体固化；或者采用模塑封装工艺，在高温模具内将固体模塑料液化包封住引线和芯片，待脱模后即形成可靠地封装体。
(4)测试：对由步骤(3)得到的半成品通过自动化芯片测试设备对模块进行电性能测试，将不合格品标示出来，合格品进行入库，完成模块的生产过程。
进一步的，在所述步骤(1)中，通过全自动芯片上座设备将手机卡芯片 安装到载带的芯片承载区域，并从载带底部加热，加热温度为50-100℃，使手机卡芯片和载带之间预置的胶膜融化，粘结手机卡芯片和载带，并进行固化；融化状胶膜固化时，在由载带步进后离开加热区域后，可通过自然冷却，胶体固化使手机卡芯片和载带牢固地粘结在一起；或经过100-200℃快速烘烤达到最终固化。
进一步的，在所述步骤(3)进行模塑封装时，将待封装的手机卡芯片置于相应的模塑腔体内，模塑封装设备将高温高压的模塑料融化后射出到模塑腔体内，将手机卡芯片和线路等包封在模塑体内，等模塑料冷却固化后脱膜形成的封装品，通过模塑封装设备自动去除多余的模塑料。
进一步的，在所述步骤(4)中进行测试时，排列和分选设备将已切割完成的所有单个微型模塑封装手机智能卡按顺序和方向排列后通过测试装置，通过红外线探头首先检测手机智能卡底部封装外观，然后进行激光打标，再通过红外线探头进行手机智能卡正面红外线外观检测，手机智能卡的外观检测通过后，进行电性能测试；测试合格后，通过自动分检设备装到包装盒或包装带中，完成整个封装的过程。
利用本发明提供的方案所形成的微型模塑封装手机智能卡，集成接触式手机智能卡功能与非接触式手机智能卡功能，并且整个智能卡性能稳定可靠；同时，本微型模塑封装手机智能卡的尺寸小，可达到卡宽6毫米、高5毫米、厚0.5毫米的效果。
另外，本手机智能卡的封装结构中，通过预置胶膜的方案，保证封装时手机卡芯片与载带间的性能稳定可靠，从而提高整个手机智能卡性能稳定可靠，保证产品的成品率，提高生产效率。再者，基于本手机智能卡的封装结构，可采用现有封装设备在进行封装。
附图说明
以下结合附图和具体实施方式来进一步说明本发明。
图1为本发明微型模塑封装手机智能卡的内部结构示意图；
图2为图1沿A-A方向的剖视图；
图3为本发明实例一中预置了胶膜的连续载带示意图；
图4为本发明实例一中智能卡载带导电层面示意图；
图5为本发明实例一中采用载带预置胶膜及紫外线封装体的手机智能卡剖面图；
图6为本发明实例二中智能卡载带芯片安装面示意图；
图7为本发明实例二中智能卡载带导电层面示意图；
图8为本发明实例二中预置了胶膜的芯片示意图；
图9为本发明实例二中晶圆电路背面贴附固晶薄膜的示意图；
图10为本发明实例二中晶圆电路面贴附固晶薄膜并涂布胶膜的示意图；
图11为本发明实例二中经过预置了胶膜的晶圆经过切割工序后的示意图；
图12为本发明实例二中采用芯片预置胶膜及模塑封装体的手机智能卡剖面图。
具体实施方式
为了使本发明实现的技术手段、创作特征、达成目的与功效易于明白了解，下面结合具体图示，进一步阐述本发明。
参见图1和2，本发明提供的微型模塑封装手机智能卡100，其的长宽尺寸为5mm*6mm，厚度尺寸为0.5mm-0.9mm。
该微型模塑封装手机智能卡100同时集成接触式手机智能卡功能与非接触式手机智能卡功能，且可达到卡宽6毫米、高5毫米、厚0.5毫米的尺寸，其中厚度还可以为0.6mm、0.7mm、0.8mm、0.9mm等。其比目前的第四种规格(4FF)卡可达到的尺寸更小，达到相应的微型化。
由于现有封装设备在进行封装时，需要采用银浆固晶的方式将芯片安装到载带上，通过加热将银浆固化，再进行后续的引线焊接、封装、测试等工序。针对该微型模塑封装手机智能卡，由于其长宽尺寸为5mm*6mm，在封装过程中，根本无法进行有效的银浆固晶，将芯片和载带进行固定。
并且在此微型尺寸的智能卡100中还需同时集成接触式智能卡功能与非接触式智能卡功能。
为此，本发明提供一种便于封装和同时集成接触式智能卡功能与非接触式智能卡功能的微型模塑封装手机智能卡100。
由图1和图2可知，该微型模塑封装手机智能卡100主要包括手机卡芯片101、载带102以及封装体103。
其中，手机卡芯片101为具备接触式功能和非接触式功能，其具有8个功能焊盘，具体为6个接触式功能焊盘101a和2个非接触式功能焊盘101b，用于实现芯片的接触式功能和非接触式功能。
载带102作为手机卡芯片的承载装置，其整体由金属材质制成，具体可以为铜或者铜合金材料制成。为了实现手机卡芯片配合，载带102包括一芯片承载区域102a和8个功能焊盘(即焊线区域)。芯片承载区域102a用于安置手机卡芯片101，而8个功能焊盘与手机芯片的功能焊盘对应，具体为6个接触式功能焊盘102b和2个非接触式功能焊盘102c，分别通过金线104与手机卡芯片101上的6个接触式功能焊盘101a和2个非接触式功能焊盘101b电性相 接，由此实现手机卡芯片101的承载。
为实现手机卡芯片101固定安置于载带102上芯片承载区域102a上，本方案在芯片与载带的芯片承载区域之间通过预置的胶膜105进行可靠的粘结安。由于预先设置了相应的胶膜105，在封装过程中无需进行相应的点银浆固化操作，有效的实现该微型模塑封装手机智能卡的封装。
其中，胶膜105可预先设置在智能卡载带的芯片承载区域内或设置在芯片的电路层反面，可根据实际需求而定。
该胶膜105厚度均匀，厚度为20～30um。
再者，该胶膜具有随温度变化而产生状态和粘性变化的特性，常温下胶膜呈固态，加热后胶膜融化，并产生较强的粘结力，胶膜的融化温度在50-100℃之间。
进一步的，该胶膜采用常温下呈固态，50-100℃低温加热后胶膜具备较强粘性，此状态可以提供芯片上座固定的要求，后经过100-200℃快速烘烤达到最终固化，再次烘烤加热不能融化，具有不可回溯的特性的胶膜。
作为替代方案，该胶膜可采用经过一次加热融化后常温固化，在二次加热时不再融化的胶膜。
作为另一替代方案，该胶膜可采用经多次加热后可以多次融化的胶膜，如采用经过一次低温加热融化后在常温下固化，在二次低温加热时可以再次融化的胶膜。
为了保证载带102承载手机卡芯片101的可靠性，载带102上的芯片承载区域102a位于载带的中部，其大小形状与手机卡芯片相配合。根据需要芯片承载区域102a内可预先设置相应的胶膜105。
载带102上的6个接触式功能焊盘102b和2个非接触式功能焊盘102c对 手机卡芯片上的功能焊盘相互独立的相对应的分布在芯片承载区域102a的四周。6个接触式功能焊盘102b之间、2个非接触式功能焊盘102c之间以及接触式功能焊盘和非接触式功能焊盘之间设置相应的隔离槽106，这些隔离槽106除了能够隔离载带上的各个功能焊盘，使其独立设置，并且该隔离槽能够在封装时，填充封装体，加强封装体与载带的结合力，保证智能卡的稳定可靠性。
载带上的6个接触式功能焊盘102b和2个非接触式功能焊盘102c具体可采用如下的分布方式：
6个接触式功能焊盘102b平均分成两组对称分布在芯片承载区域102a左右两侧(如图1所示)，并且每一组中的三个接触式功能焊盘102b之间匀距分布。2个非接触式功能焊盘102c对称分布在芯片承载区域102a上下两侧(如图1所示)。
其中，模塑封装体103用于封装手机卡芯片101，将其与载带102封装在一起，形成一相应的智能卡。对于封装后的形状可根据实际需求而定，在本发明中，封装后的智能卡为长宽尺寸为5mm*6mm，厚度尺寸为0.5mm-0.9mm的方体结构。
针对上述结构和特性的手机智能卡，本发明提供一种相应的封装方法，其过程如下：
(1)智能芯片上座：通过全自动芯片上座设备将智能芯片安装到载带的芯片承载区域，并从载带底部加热，加热温度为50-100℃，使智能芯片和载带之间的胶膜融化，粘结芯片和载带，并进行固化；融化状胶膜固化时，在由载带步进后离开加热区域后，可通过自然冷却，胶体固化使芯片和载带牢固地粘结在一起；或经过100-200℃快速烘烤达到最终固化；
(2)引线焊接：将步骤(1)完成的半成品送入焊接设备，通过引线和超声波焊接进行智能芯片与载带之间的电连接：首先在载带的接触式焊线区域上通过超声波方式长出凸点，接着将智能芯片的接触式功能焊盘和载带的接触式焊线区域上的凸点通过超声波直接连接；接着在载带的非接触式焊线区域上通过超声波方式长出凸点，最后将智能芯片的非接触式功能焊盘和载带的非接触式焊线区域上的凸点通过超声波直接连接；
(3)封装：对由步骤(2)得到的半成品进行封装成型；进行封装时，可通过紫外线固化的环氧树脂胶点胶，将引线和芯片包封起来，并采用紫外线照射使胶体固化；或者采用模塑封装工艺，在高温模具内将固体模塑料液化包封住引线和芯片，待脱模后即形成可靠地封装体。
若进行模塑封装时，将待封装的手机卡芯片置于相应的模塑腔体内，模塑封装设备将高温高压的模塑料融化后射出到模塑腔体内，将手机卡芯片和线路等包封在模塑体内，等模塑料冷却固化后脱膜形成的封装品，通过模塑封装设备自动去除多余的模塑料。
(4)测试：对由步骤(3)得到的半成品通过自动化芯片测试设备对模块进行电性能测试，将不合格品标示出来，合格品进行入库，完成模块的生产过程。
进行测试时，排列和分选设备将已切割完成的所有单个迷你模塑封装智能卡按顺序和方向排列后通过测试装置，通过红外线探头首先检测所述迷你模塑封装智能卡底部封装外观，然后进行激光打标，再通过红外线探头进行所述迷你模塑封装智能卡正面红外线外观检测，所述迷你模塑封装智能卡的外观检测通过后，进行电性能测试；测试合格后，通过自动分检设备装到包装盒或包装带中，完成整个封装的过程。
以下通过具体实例来进一步的说明本方案的方案：
实施例一：
参见图3和图4，其所示为本实例中预置了胶膜的连续载带示意图和导电层面示意图。由图可知，该载带为连续长条形并无限延长的结构，其主要包括由绝缘基材1和导电层3形成的载带本体，在绝缘基材1的长边设置了若干个均匀排列的齿孔2，用于设备步进使载带向前移动。在载带的芯片安装面中部，设置了若干个引线焊接孔4，用于将芯片上的功能焊盘和载带上的导电图形连通。引线焊接孔4的中心区域为芯片承载区域。在导电层面，设置了导电图形3。
该载带在其上的每个芯片承载区域内都预置有相应的胶膜5，该胶膜5与芯片承载区域相配合，并紧密贴合在芯片承载区域的表面上，从而覆盖住整个芯片承载区域的表面。胶膜5的厚度均匀，具体大小可根据实际需求而定，为了保证粘结的可靠性和不影响最终模块的尺寸，一般为5～30um。
针对上述的预置胶膜的智能卡载带，本实例通过如下的工艺步骤来实现(参见图3和图4)：
(1)冲孔：将连续的长条形的薄型绝缘基材1按要求冲切出定位齿孔2和引线焊接孔4，齿孔分布在两条长边的内侧，引线焊接孔分布在中心区域。
(2)贴铜：将整片的长条形铜箔通过粘结剂和绝缘基材贴附起来，经过滚筒碾压并加热使铜箔和绝缘基材紧密贴合。
(3)蚀刻：对由步骤(2)得到的半成品，在铜箔3表面设置干膜，并通过连续曝光设备将需要蚀刻掉的区域的干膜去除；将经过曝光的铜箔通过酸性蚀刻液进行蚀刻，去除不需要的铜箔，留下需要的导电图形3，并经过清洗程序将剩余的干膜及残留物清洗掉。
(4)电镀：对由步骤(3)得到的半成品通过电镀工艺在铜箔面上电镀上镍层和金层，提高铜层的导电性能和稳定性。
(5)涂胶：对步骤(4)得到的半成品，经过连续涂胶装置在芯片承载区域表面涂布一层半流体的胶层5，该胶层厚度均匀，且胶层厚度控制在5-30um。
该步骤中的具体涂布方式，可以采用丝网印刷方式，也可以采用喷涂方式，也可以采用贴膜方式来实现。
(6)固化：对步骤(5)得到半成品，经过自然冷却在载带芯片承载区域的表面形成形成一层胶膜层。
由此形成的智能卡载带，其在芯片承载区域预置了胶膜，该载带在具体应用时，将芯片安装在载带的胶膜上，加热胶膜使芯片和载带融合，并自然冷却固化，最后经过引线焊接、封装、测试等工艺，形成性能稳定的智能卡封装模块。采用该载带进行模块的封装，可以省去设备点胶的工序，能够实现微型模塑封装手机智能卡的封装。
基于该载带1在进行封装形成手机智能卡时，参见图5，首先通过全自动芯片上座设备将芯片6安装到载带1的芯片承载区域内预置的胶膜5上；同时使载带底部受热，加热温度为80℃，使芯片6和载带1之间的胶膜5融化。
接着，通过载带1上的齿孔2引导载带向前步进，载带步进后离开加热区域，通过自然冷却，使得融化的胶膜5固化，从而使芯片和载带牢固地粘结在一起。
再接着，通过全自动引线焊接设备将芯片6上的功能焊盘和载带1上相应的焊盘连接起来，引线7连接芯片上的焊盘和导电层3的引线焊接孔4处的连接点，使芯片上的功能焊盘延伸到载带上。
再接着，将焊接好引线的半成品，通过自动点胶设备将紫外线固化型环氧 树脂胶8把引线和芯片包封起来，并采用紫外线照射使胶体固化，形成可靠地封装体8。
最后，将封装好的模块通过自动化芯片测试设备对模块进行电性能测试，将不合格品标示出来，合格品进行入库，完成模块的生产过程。
本实例中的智能卡载带，其在芯片承载区域预置了胶膜，该载带在具体应用时，将芯片安装在载带的胶膜上，加热胶膜使芯片和载带融合，并自然冷却固化，最后经过引线焊接、封装、测试等工艺，形成性能稳定的智能卡封装模块。采用该载带进行模块的封装，可以省去设备点胶的工序，大大提高了生产效率，同时避免了由于点胶制程产生的不良率，有效降低了产品成本，整个生产过程可以延用现有设备进行大批量生产。
实施例二：
参见图6和图7，其所示为本实例中智能卡载带的芯片安装面示意图和导电层面示意图，在载带1的长边设置了若干个均匀排列的齿孔2，用于设备步进使载带向前移动。在载带的芯片安装面中部，设置了若干个引线焊接孔4，用于将芯片上的功能焊盘和载带上的导电图形连通。引线焊接孔4的中心区域为芯片承载区域。在导电层面，设置了导电图形3。
参见图8，其所示为本实例中的芯片6的结构示意图。由图可知，本实例中芯片6在其电路层的反面预置有相应的胶膜5，该胶膜5与芯片6电路层的反面相配合，完全覆盖住芯片6电路层的反面。其厚度均匀，具体大小可根据实际需求而定，为了保证粘结的可靠性和不影响最终模块的尺寸，一般为5～30um。
在具体实现时，构成胶膜层5的胶膜具有随温度变化而产生状态和粘性变化的特性，常温下胶膜呈固态，加热后胶膜融化，并产生较强的粘结力,胶膜 的低温融化温度在50-100℃之间。
进一步的，构成胶膜层5的胶膜经过一次低温加热融化后在常温下固化，在二次低温加热时不可再次融化。
作为替代方案，构成胶膜层5的胶膜，也可采用经过一次低温加热融化后在常温下固化，在二次低温加热时可以再次融化的胶膜。
作为替代方案，构成胶膜层5的胶膜，还可采用经100-200℃快速高温加热后达到最终固化，最终固化后再次加热不能融化，具有不可回溯的特性的胶膜。
针对上述的预置胶膜的单个芯片，本实例的具体实现方案如下：
参见图9，其所示为本实例中晶圆电路背面贴附固晶薄膜的示意图。
一般情况下，未经切割加工的晶圆9，其电路面标记10向上放置，晶圆的电路反面和固晶薄膜11通过固晶薄膜上的薄膜胶体12将晶圆附着起来，起到固定晶圆的作用。金属支撑架13用于将固晶薄膜平整可靠地固定起来。
在进行涂胶工序前，需要将晶圆9翻转180度，即使得电路标记面(即正面)向下放置，使晶圆的电路正面和固晶薄膜贴合。翻模过程应采用先贴新膜后除旧膜的方式进行，膜应贴附平整可靠，
参见图10，为本实例中晶圆电路面贴附固晶薄膜并涂布胶膜的示意图，在经过晶圆翻模工艺后，金属支撑架13将固晶薄膜11有效固定起来，晶圆9的电路正面和固晶薄膜的薄膜胶体12贴附在一起；并且，晶圆9的电路反面暴露。
针对暴露出的晶圆9的电路反面，通过涂胶设备，将胶体涂布在晶圆9的电路反面表面，固化后形成胶膜层5。
待胶膜完全干透后，再次将晶圆翻模，将预置了胶膜的晶圆的胶膜层5 和固晶薄膜11的薄膜胶体12贴合在一起，待切割(参见图11)。
参见图11，为本实例中经过预置了胶膜的晶圆经过切割工序后的示意图。将完成胶膜涂布和翻模的晶圆通过晶圆切割设备按要求切割好，形成一颗颗独立的芯片6待封装使用。具体过程如下：
完成胶膜涂布和固化的晶圆，由金属支撑架13将固晶薄膜11有效固定起来，经过翻模，使得晶圆9的电路面标记10向上，胶膜层5向下和固晶薄膜11的薄膜胶体12贴附在一起，芯片6之间形成相应的切割槽14，使芯片6之间相互独立，芯片6底部的胶膜5也通过切割槽14独立，该切割槽的深度控制在大于胶膜底部的深度。
参见图8，为本实例中经过预置胶膜后的单个芯片及胶膜示意图，芯片被取下后胶膜层5和芯片6附着在一起。
基于上述的载带1和预置胶膜的芯片6在进行封装形成手机智能卡时，参见图12，通过全自动芯片上座设备将预置了胶膜的芯片6安装到载带1的芯片承载区域上；同时使载带底部受热，加热温度为60℃，使芯片6和载带1之间的胶膜5融化。
接着，通过载带1上的齿孔2引导载带向前步进，载带步进后离开加热区域，进行180℃快速烘烤，达到最终固化。该胶膜5具有再次烘烤加热不能融化及不可回溯特性，这样能够解决引线焊接时由于加热胶层融化或软化引起芯片晃动造成焊接不良，封装过程中受热引发胶层与芯片硅层或条带表面孔洞及分层问题，从而避免影响后续产品可靠性。胶膜的固化使芯片和载带牢固地粘结在一起。
再接着，通过全自动引线焊接设备将芯片6上的功能焊盘和载带1上相应的焊盘连接起来，引线7连接芯片上的焊盘和导电层3的引线焊接孔4处的连 接点，使芯片上的功能焊盘延伸到载带上。
再接着，将焊接好引线的半成品，采用模塑封装工艺，在高温模具内将固体模塑料液化后包封住引线和芯片，待脱模后即形成可靠地封装体引线和芯片包封起来，形成可靠地封装体8。
最后，将封装好的模块通过自动化芯片测试设备对模块进行电性能测试，将不合格品标示出来，合格品进行入库，完成模块的生产过程。
本实例利用上述预置了胶膜的芯片进行手机智能卡的生产时，将芯片安装在载带上加热固化，然后经过引线焊接、封装、测试等工艺，形成性能稳定的封装模块。采用该芯片进行模块的封装，不仅可以省去设备点胶的工序，大大提高了生产效率，同时避免了由于点胶制程产生的不良率，有效降低了产品成本，整个生产过程可以延用现有设备进行大批量生产。
通过上述两个实例可知，利用本发明提供的方案进行手机智能卡的生产，可以省去设备点胶的工序，这样不仅能够使生产制程简化，更重要的是能够实现卡宽6毫米、高5毫米、厚0.5毫米这样微型模塑封装手机智能卡的可靠封装。
以上显示和描述了本发明的基本原理、主要特征和本发明的优点。本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是说明本发明的原理，在不脱离本发明精神和范围的前提下，本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。

Claims (13)

  1. 一种微型模塑封装手机智能卡，所述手机智能卡包括手机卡芯片、承载手机卡芯片的载带以及模塑体，其特征在于，所述载带包括芯片承载区域和若干功能焊盘，所述手机卡芯片安置在载带的芯片承载区域上，手机卡芯片上功能焊盘与载带上的对应功能焊盘电连接，所述模塑体对手机卡芯片和载带封装形成手机卡，封装形成的手机卡的长宽尺寸为5mm*6mm，厚度尺寸为0.5mm-0.9mm。
  2. 根据权利要求1所述的一种微型模塑封装手机智能卡，其特征在于，所述载带上的功能焊盘包括六个接触式接触式焊线区域和两个非接接触式焊线区域。
  3. 根据权利要求1或2所述的一种微型模塑封装手机智能卡，其特征在于，所述载带上各焊线区域之间相互独立设置。
  4. 根据权利要求2所述的一种微型模塑封装手机智能卡，其特征在于，所述六个接触式接触式焊线区域平均分成两组，且两组接触式功能焊盘对称分布在芯片承载区域水平或者垂直方向上的两侧，而两个非接触式功能焊盘对称分布在芯片承载区域垂直方向或水平方向上的两侧。
  5. 根据权利要求1所述的一种微型模塑封装手机智能卡，其特征在于，所述手机卡芯片与载带的芯片承载区域之间通过预置的胶膜进行安装。
  6. 根据权利要求5所述的一种微型模塑封装手机智能卡，其特征在于，所述的胶膜预置在智能卡载带的芯片承载区域内或预置在手机卡芯片的电路层反面。
  7. 根据权利要求5或6所述的一种微型模塑封装手机智能卡，其特征在 于，所述的胶膜层常温下胶膜呈固态，在加热后胶膜融化，产生较强的粘结力，粘结芯片和载带，并进行固化。
  8. 根据权利要求5或6所述的一种微型模塑封装手机智能卡，其特征在于，所述的胶膜厚度为20～30um。
  9. 根据权利要求1所述的一种微型模塑封装手机智能卡，其特征在于，所述封装体为紫外线封装体或者模塑封装体。
  10. 一种微型模塑封装手机智能卡的封装方法，其特征在于，所述方法包括如下步骤：
    (1)手机卡芯片上座：用自动芯片装载设备将手机卡芯片固定安装到载带上的芯片承载区域；
    (2)引线焊接：将步骤(1)完成的半成品送入焊接设备，通过引线和超声波焊接进行手机卡芯片与载带之间的电连接：首先在载带的接触式焊线区域上通过超声波方式长出凸点，接着将手机卡芯片的接触式功能焊盘和载带的接触式焊线区域上的凸点通过超声波直接连接；接着在载带的非接触式焊线区域上通过超声波方式长出凸点，最后将手机卡芯片的非接触式功能焊盘和载带的非接触式焊线区域上的凸点通过超声波直接连接；
    (3)封装：对由步骤(2)得到的半成品进行封装成型；进行封装时，可通过紫外线固化的环氧树脂胶点胶，将引线和芯片包封起来，并采用紫外线照射使胶体固化；或者采用模塑封装工艺，在高温模具内将固体模塑料液化包封住引线和芯片，待脱模后即形成可靠地封装体。
    (4)测试：对由步骤(3)得到的半成品通过自动化芯片测试设备对模块进行电性能测试，将不合格品标示出来，合格品进行入库，完成模块的生产过程。
  11. 根据权利要求10所述的一种微型模塑封装手机智能卡的封装方法，其特征在于，在所述步骤(1)中，通过全自动芯片上座设备将手机卡芯片安装到载带的芯片承载区域，并从载带底部加热，加热温度为50-100℃，使手机卡芯片和载带之间预置的胶膜融化，粘结手机卡芯片和载带，并进行固化；融化状胶膜固化时，在由载带步进后离开加热区域后，可通过自然冷却，胶体固化使手机卡芯片和载带牢固地粘结在一起；或经过100-200℃快速烘烤达到最终固化。
  12. 根据权利要求10所述的一种微型模塑封装手机智能卡的封装方法，其特征在于，在所述步骤(3)进行模塑封装时，将待封装的手机卡芯片置于相应的模塑腔体内，模塑封装设备将高温高压的模塑料融化后射出到模塑腔体内，将手机卡芯片和线路等包封在模塑体内，等模塑料冷却固化后脱膜形成的封装品，通过模塑封装设备自动去除多余的模塑料。
  13. 根据权利要求10所述的一种微型模塑封装手机智能卡的封装方法，其特征在于，在所述步骤(4)中进行测试时，排列和分选设备将已切割完成的所有单个迷你模塑封装智能卡按顺序和方向排列后通过测试装置，通过红外线探头首先检测所述迷你模塑封装智能卡底部封装外观，然后进行激光打标，再通过红外线探头进行所述迷你模塑封装智能卡正面红外线外观检测，所述迷你模塑封装智能卡的外观检测通过后，进行电性能测试；测试合格后，通过自动分检设备装到包装盒或包装带中，完成整个封装的过程。
PCT/CN2015/094436 2014-12-30 2015-11-12 一种微型模塑封装手机智能卡以及封装方法 WO2016107298A1 (zh)

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