CN107086182A - 一种低成本的智能芯片载带以及制造方法 - Google Patents
一种低成本的智能芯片载带以及制造方法 Download PDFInfo
- Publication number
- CN107086182A CN107086182A CN201710415093.8A CN201710415093A CN107086182A CN 107086182 A CN107086182 A CN 107086182A CN 201710415093 A CN201710415093 A CN 201710415093A CN 107086182 A CN107086182 A CN 107086182A
- Authority
- CN
- China
- Prior art keywords
- carrier band
- layer
- base material
- metal layer
- lumen pore
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000003466 welding Methods 0.000 claims abstract description 47
- 239000011148 porous material Substances 0.000 claims abstract description 42
- 239000000463 material Substances 0.000 claims abstract description 41
- 239000002184 metal Substances 0.000 claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 230000004888 barrier function Effects 0.000 claims abstract description 18
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 52
- 229910052759 nickel Inorganic materials 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 239000011889 copper foil Substances 0.000 claims description 22
- 239000010931 gold Substances 0.000 claims description 20
- 229910052737 gold Inorganic materials 0.000 claims description 20
- 239000012530 fluid Substances 0.000 claims description 11
- 238000011161 development Methods 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 abstract description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 18
- 238000012545 processing Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710415093.8A CN107086182B (zh) | 2017-06-05 | 2017-06-05 | 一种低成本的智能芯片载带以及制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710415093.8A CN107086182B (zh) | 2017-06-05 | 2017-06-05 | 一种低成本的智能芯片载带以及制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107086182A true CN107086182A (zh) | 2017-08-22 |
CN107086182B CN107086182B (zh) | 2023-08-18 |
Family
ID=59608106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710415093.8A Active CN107086182B (zh) | 2017-06-05 | 2017-06-05 | 一种低成本的智能芯片载带以及制造方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107086182B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108399449A (zh) * | 2018-04-28 | 2018-08-14 | 山东新恒汇电子科技有限公司 | 一种双界面智能卡载带模块及制造方法 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101189924A (zh) * | 2005-06-01 | 2008-05-28 | 三井金属矿业株式会社 | 电路基板形成用铸型及其制造方法、电路基板及其制造方法、多层层压电路基板的制造方法以及导电孔的形成方法 |
CN201548983U (zh) * | 2009-11-13 | 2010-08-11 | 中电智能卡有限责任公司 | 一种新型接触式智能卡模块 |
CN102548231A (zh) * | 2010-12-23 | 2012-07-04 | 北大方正集团有限公司 | 电路板制作方法 |
JP2013182959A (ja) * | 2012-02-29 | 2013-09-12 | Hitachi Chemical Co Ltd | 半導体チップ搭載用基板及びその製造方法 |
CN104505350A (zh) * | 2014-12-24 | 2015-04-08 | 恒汇电子科技有限公司 | 双面导电ic卡载带及其加工方法 |
CN104600044A (zh) * | 2014-12-30 | 2015-05-06 | 上海仪电智能电子有限公司 | 一种微型智能卡及封装方法 |
CN204315568U (zh) * | 2014-12-24 | 2015-05-06 | 恒汇电子科技有限公司 | 一种ic封装载带 |
CN104637902A (zh) * | 2013-11-06 | 2015-05-20 | 上海蓝沛新材料科技股份有限公司 | 一种智能卡模块 |
WO2016107298A1 (zh) * | 2014-12-30 | 2016-07-07 | 上海仪电智能电子有限公司 | 一种微型模塑封装手机智能卡以及封装方法 |
CN205452274U (zh) * | 2016-03-09 | 2016-08-10 | 马兴光 | 一种ic卡载板结构 |
CN206806291U (zh) * | 2017-06-05 | 2017-12-26 | 陈同胜 | 一种低成本的智能芯片载带 |
-
2017
- 2017-06-05 CN CN201710415093.8A patent/CN107086182B/zh active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101189924A (zh) * | 2005-06-01 | 2008-05-28 | 三井金属矿业株式会社 | 电路基板形成用铸型及其制造方法、电路基板及其制造方法、多层层压电路基板的制造方法以及导电孔的形成方法 |
CN201548983U (zh) * | 2009-11-13 | 2010-08-11 | 中电智能卡有限责任公司 | 一种新型接触式智能卡模块 |
CN102548231A (zh) * | 2010-12-23 | 2012-07-04 | 北大方正集团有限公司 | 电路板制作方法 |
JP2013182959A (ja) * | 2012-02-29 | 2013-09-12 | Hitachi Chemical Co Ltd | 半導体チップ搭載用基板及びその製造方法 |
CN104637902A (zh) * | 2013-11-06 | 2015-05-20 | 上海蓝沛新材料科技股份有限公司 | 一种智能卡模块 |
CN104505350A (zh) * | 2014-12-24 | 2015-04-08 | 恒汇电子科技有限公司 | 双面导电ic卡载带及其加工方法 |
CN204315568U (zh) * | 2014-12-24 | 2015-05-06 | 恒汇电子科技有限公司 | 一种ic封装载带 |
CN104600044A (zh) * | 2014-12-30 | 2015-05-06 | 上海仪电智能电子有限公司 | 一种微型智能卡及封装方法 |
WO2016107298A1 (zh) * | 2014-12-30 | 2016-07-07 | 上海仪电智能电子有限公司 | 一种微型模塑封装手机智能卡以及封装方法 |
CN205452274U (zh) * | 2016-03-09 | 2016-08-10 | 马兴光 | 一种ic卡载板结构 |
CN206806291U (zh) * | 2017-06-05 | 2017-12-26 | 陈同胜 | 一种低成本的智能芯片载带 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108399449A (zh) * | 2018-04-28 | 2018-08-14 | 山东新恒汇电子科技有限公司 | 一种双界面智能卡载带模块及制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN107086182B (zh) | 2023-08-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI264091B (en) | Method of manufacturing quad flat non-leaded semiconductor package | |
CN102017142B (zh) | 三维安装半导体装置及其制造方法 | |
CN101587849A (zh) | 具有通过冲压形成的特征的半导体器件封装 | |
CN204792778U (zh) | 半导体衬底结构及半导体封装 | |
CN102386104A (zh) | 四边扁平无接脚封装方法 | |
US20120168920A1 (en) | Leadless semiconductor package and method of manufacture | |
CN103985647B (zh) | 一种制备铜柱凸点的方法 | |
US20200365492A1 (en) | Package with lead frame with improved lead design for discrete electrical components and manufacturing the same | |
CN102386105B (zh) | 四边扁平无接脚封装方法及其制成的结构 | |
CN105428325B (zh) | 一种带金属屏蔽层的单层超薄基板封装结构的制备工艺及其制品 | |
CN105489565A (zh) | 嵌埋元件的封装结构及其制法 | |
CN206301777U (zh) | 半导体封装件 | |
CN106684050A (zh) | 一种金属柱导通埋芯片线路板结构及其工艺方法 | |
CN104299919A (zh) | 无芯层封装结构及其制造方法 | |
CN106684051A (zh) | 一种金属柱导通芯片级封装结构及其工艺方法 | |
CN206806291U (zh) | 一种低成本的智能芯片载带 | |
CN107086182A (zh) | 一种低成本的智能芯片载带以及制造方法 | |
CN206584922U (zh) | 预包封无导线可电镀引线框架封装结构 | |
CN104465329A (zh) | 一种基板内置环形磁芯电感的工艺方法 | |
CN105161475B (zh) | 带有双圈焊凸点的无引脚csp堆叠封装件及其制造方法 | |
CN104576402B (zh) | 封装载板及其制作方法 | |
CN109686669A (zh) | 一种集成电路封装方法及封装结构 | |
CN209133501U (zh) | 减成法预包封引线框架结构 | |
WO2016107298A1 (zh) | 一种微型模塑封装手机智能卡以及封装方法 | |
CN208655699U (zh) | 带有金属化基板的滤波器芯片封装结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170808 Address after: 256400, No. 1, unit 20, building 2225, Xiyuan District, Dongyue Road, 202 Huantai County, Shandong, Zibo Applicant after: Chen Tongsheng Address before: 255088 No. 187 run Avenue, hi tech Development Zone, Shandong, Zibo Applicant before: HENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. |
|
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180724 Address after: 255088 No. 187, Zhong run Avenue, high tech Industrial Development Zone, Zibo, Shandong. Applicant after: HENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 256400 No. 1, unit 20, 20 Xiyuan Road, 2225 Dongyue Road, Huantai, Zibo, Shandong. Applicant before: Chen Tongsheng |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180808 Address after: 255088 No. 187 middle run road, hi tech Zone, Zibo, Shandong Applicant after: SHANDONG XINHENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 255088 No. 187, Zhong run Avenue, high tech Industrial Development Zone, Zibo, Shandong. Applicant before: HENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. |
|
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: 255088 No. 187 middle run road, hi tech Zone, Zibo, Shandong Applicant after: New Henghui Electronics Co.,Ltd. Address before: 255088 No. 187 middle run road, hi tech Zone, Zibo, Shandong Applicant before: SHANDONG XINHENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant |