WO2016106827A1 - 软性印刷电路板和液晶显示器 - Google Patents

软性印刷电路板和液晶显示器 Download PDF

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Publication number
WO2016106827A1
WO2016106827A1 PCT/CN2015/070522 CN2015070522W WO2016106827A1 WO 2016106827 A1 WO2016106827 A1 WO 2016106827A1 CN 2015070522 W CN2015070522 W CN 2015070522W WO 2016106827 A1 WO2016106827 A1 WO 2016106827A1
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WO
WIPO (PCT)
Prior art keywords
gold
circuit board
printed circuit
flexible printed
gold finger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/070522
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English (en)
French (fr)
Inventor
曹洪睿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US14/437,826 priority Critical patent/US9804457B2/en
Publication of WO2016106827A1 publication Critical patent/WO2016106827A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13458—Terminal pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Definitions

  • the present invention relates to the field of liquid crystal technology, and in particular to a flexible printed circuit board and a liquid crystal display using the same.
  • liquid crystal displays have been applied in the public life.
  • the resolution of liquid crystal displays is also constantly improving.
  • the resolution of liquid crystal displays is from qHD (Quarter). High Definition, a kind of digital product screen resolution) to HD (High Definition), or from WXGA (Wide Extended) Graphics Array, widescreen) to WUXGA (Widescreen Ultra eXtended Graphics Array, widescreen super extended graphics array).
  • qHD Quantum High Definition
  • HD High Definition
  • WXGA Wide Extended Graphics Array
  • WUXGA Widescreen Ultra eXtended Graphics Array, widescreen super extended graphics array
  • the number of differential lines also increases exponentially. Increasing the number of differential lines necessitates an increase in the number of gold fingers on a flexible printed circuit board.
  • the size of the flexible printed circuit board is fixed, and in order to improve the resolution of the liquid crystal display, the number of gold fingers must be increased on the flexible printed circuit board.
  • the number of gold fingers must be increased on the flexible printed circuit board.
  • it is necessary to increase the size of the flexible printed circuit board which is easy to increase the cost.
  • the gold finger of the flexible printed circuit board is increased, the impedance of the gold finger area must be affected. Therefore, as the resolution of the liquid crystal display is improved, the impedance matching of the gold finger region becomes a major problem.
  • the technical problem to be solved by the present invention is to provide a flexible printed circuit board and a liquid crystal display, which can increase the gold finger while the size of the flexible printed circuit board is constant, and effectively solve the impedance of the golden finger of the flexible printed circuit board. Match the problem.
  • the present invention adopts a technical solution to provide a flexible printed circuit board including a connection area, wherein a plurality of gold fingers are disposed in the connection area, wherein the width of the gold finger is differentiated;
  • the spacing between adjacent gold fingers is differentiated;
  • the gold finger includes a first gold finger for transmitting a differential signal and a second gold finger for transmitting a signal other than the differential signal, wherein the width of the first gold finger Greater than the width of the second gold finger.
  • the gold fingers are arranged in alignment on the connection area.
  • another technical solution adopted by the present invention is to provide a flexible printed circuit board including a connection region in which a plurality of gold fingers are disposed at intervals, wherein the width of the gold finger is differentiated.
  • the golden finger includes a first gold finger for transmitting a differential signal and a second gold finger for transmitting a signal other than the differential signal, wherein a width of the first gold finger is greater than a width of the second gold finger.
  • the first gold finger is located in an intermediate area or a side area of the connection area.
  • the first gold fingers are arranged in a staggered arrangement on the connection area, and the second gold fingers are arranged in a staggered arrangement on the connection area.
  • the spacing between adjacent gold fingers is differentiated.
  • the gold finger comprises a first gold finger for transmitting a differential signal and a second gold finger for transmitting a signal other than the differential signal, wherein a spacing between adjacent first gold fingers is greater than an adjacent second gold The spacing between the fingers or the spacing between the adjacent first gold finger and the second gold finger.
  • the first gold finger is located at two sides of the connection area.
  • the first gold fingers are arranged in a staggered arrangement on the connection area, and the second gold fingers are arranged in a staggered arrangement on the connection area.
  • the spacing between adjacent gold fingers gradually increases from the intermediate portion of the connecting region to the both side regions.
  • a liquid crystal display including a liquid crystal panel and a flexible printed circuit board connected to the liquid crystal panel.
  • the flexible printed circuit board includes a connection area, and the connection area is spaced apart.
  • the golden finger includes a first gold finger for transmitting a differential signal and a second gold finger for transmitting a signal other than the differential signal, wherein a width of the first gold finger is greater than a width of the second gold finger.
  • the first gold finger is located in an intermediate area or a side area of the connection area.
  • the first gold fingers are arranged in a staggered arrangement on the connection area, and the second gold fingers are arranged in a staggered arrangement on the connection area.
  • the spacing between adjacent gold fingers is differentiated.
  • the gold finger comprises a first gold finger for transmitting a differential signal and a second gold finger for transmitting a signal other than the differential signal, wherein a spacing between adjacent first gold fingers is greater than an adjacent second gold The spacing between the fingers or the spacing between the adjacent first gold finger and the second gold finger.
  • the first gold finger is located at two sides of the connection area.
  • the first gold fingers are arranged in a staggered arrangement on the connection area, and the second gold fingers are arranged in a staggered arrangement on the connection area.
  • the spacing between adjacent gold fingers gradually increases from the intermediate portion of the connecting region to the both side regions.
  • the flexible printed circuit board of the present invention comprises a connection area, and a plurality of gold fingers are arranged in the connection area, wherein the width of the gold finger is differently set.
  • the present invention can increase the gold finger of the soft printed circuit board by changing the wide band of the golden finger of the flexible printed circuit board, thereby effectively solving the gold of the flexible printed circuit board. Finger impedance matching problem.
  • FIG. 1 is a schematic structural view of a flexible printed circuit board and a display panel of the present invention
  • Figure 2 is a schematic structural view of a first embodiment of the area A of Figure 1;
  • Figure 3 is a schematic structural view of a second embodiment of the area A of Figure 1;
  • Figure 4 is a schematic structural view of a third embodiment of the area A of Figure 1;
  • Figure 5 is a schematic structural view of a fourth embodiment of the area A in Figure 1;
  • Figure 6 is a schematic view showing the structure of a fifth embodiment of the area A in Figure 1.
  • FIG. 1 is a schematic structural view of a flexible printed circuit board and a display panel of the present invention
  • FIG. 2 is a schematic structural view of a first embodiment of the area A of FIG.
  • the invention discloses a liquid crystal display comprising a liquid crystal panel 11 and a flexible printed circuit board, and the liquid crystal panel 11 and the flexible printed circuit board are connected.
  • the flexible printed circuit board comprises a connection area 12, and a plurality of gold fingers are arranged in the connection area 12, and the gold finger is used for transmitting signals.
  • the connection area 12 includes a first area 121 and a second area 122, and the gold finger includes a first gold finger 13 and a second gold finger 14.
  • the first gold finger 13 is disposed on the first region 121
  • the second gold finger 14 is disposed on the second region 122.
  • the first gold finger 13 is used to transmit a differential signal
  • the second gold finger 14 is used to transmit other signals than the differential signal.
  • the gold fingers are arranged in alignment on the connection region 12, that is, the first gold fingers 13 are aligned and arranged in the first region 121, and the second gold fingers 14 are aligned and arranged in the second region. 122.
  • the width of the gold finger is set differently, and the width of the gold finger is differently set according to the importance of the signal transmitted by each gold finger.
  • the higher the importance of the transmitted signal the greater the width of the golden finger.
  • the importance of the differential signal is high, and the importance of other signals other than the differential signal is lower. Therefore, the width a of the first gold finger 13 is greater than the width b of the second gold finger 14.
  • all the first gold fingers 13 disposed in the first region 121 have a width a
  • all the second gold fingers 14 disposed in the second region 122 have a width b, which is between the golden fingers of the embodiment.
  • the pitch is w, that is, the pitch between all the first gold fingers 13 disposed in the first region 121 is w, and the pitch between all the second gold fingers 14 disposed in the second region 122 is also w.
  • the importance of the differential signal is not limited to the highest, and the importance of the signal is mainly based on the layout of the signal transmission line in the actual flexible printed circuit board.
  • first gold finger 13 may be located in the middle area of the connection area 12 or in the two side areas of the connection area 12, that is, the first gold finger 13 may be located in the second area 122 or in addition to the first area 121 or Other areas.
  • the width of the first gold finger 13 in the middle portion of the connection region 12 is constant, and by narrowing the width of the second gold finger 14, the two sides of the connection region 12 are freely spaced to facilitate connection.
  • the addition or modification of the gold finger on both sides of the area 12 can solve the problem of impedance matching of the flexible printed circuit board.
  • FIG. 3 is a schematic structural view of a second embodiment of the area A in FIG. 1.
  • the main area of FIG. 3 and FIG. 2 is that the width of the gold finger is incremented or decremented according to the importance of the signal transmitted by each gold finger. That is, the connection region 22 includes a first region 221, a second region 222, and a third region 223, and the gold finger includes a first gold finger 23, a second gold finger 24, and a third gold finger 25.
  • the first gold finger 23 is disposed on the first region 221
  • the second gold finger 24 is disposed on the second region 222
  • the third gold finger 25 is disposed on the third region 223.
  • the first gold finger 23 is used to transmit a differential signal
  • the second gold finger 24 is used to transmit a first signal
  • the third gold finger 25 is used to transmit a second signal.
  • the gold fingers are arranged in alignment on the connection region 22, that is, the first gold fingers 23 are arranged in alignment on the first region 221, and the second gold fingers 24 are aligned in the second region.
  • the third gold fingers 25 are arranged in alignment on the third area 223.
  • the width a of the first gold finger 23 is larger than the width b of the second gold finger 24, and the width b of the second gold finger 24 is larger than the width c of the third gold finger 25.
  • the width a of the first gold finger 23, the width b of the second gold finger 24, and the width c of the third gold finger 25 are set in a decreasing ratio, or the width a of the first gold finger 23, the second gold finger 24
  • the width b and the width c of the third gold finger 25 are set in equal proportions.
  • the pitch between the first gold fingers 23, the pitch between the second gold fingers 24, and the pitch between the third gold fingers 25 are both w.
  • the importance of the differential signal in the flexible printed circuit board is not limited, the importance of the first signal, and the importance of the second signal are low, and the importance of the signal is mainly based on Depending on the layout of the signal transmission lines in the actual flexible printed circuit board, the importance of the first signal can also be high, or the importance of the second signal can be high.
  • the first gold finger 23 may be located on the first area 221, or the first gold finger 23 may be located in the second area 222.
  • the width a of the first gold finger 23, the width b of the second gold finger 24, and the width c of the third gold finger 25 are set to a decreasing ratio. Since the width of the adjacent gold fingers is set in an equal ratio, the size of the width of the adjacent gold fingers can be well controlled, and the process efficiency is effectively improved.
  • FIG. 4 is a schematic structural view of a third embodiment of the area A in FIG. 1.
  • the main areas of FIG. 4 and FIG. 2 are that the width of the most important gold finger and the width of the gold finger with the lowest importance are differentiated, and the gold fingers are arranged in a staggered arrangement on the connection area 32.
  • the connection area 32 includes a first area 321, a plurality of second areas 322, and a third area 323, and the gold finger includes a first gold finger 33, a second gold finger 34, and a third gold finger 35.
  • the first gold fingers 33 are arranged in a staggered arrangement on the first area 321
  • the second gold fingers 34 are arranged in a staggered arrangement on the second area 322 .
  • the third gold fingers 35 are arranged in a staggered arrangement on the third area 323 . .
  • the first gold finger 33 is used to transmit a differential signal
  • the second gold finger 34 is used to transmit a first signal
  • the third gold finger 35 is used to transmit a second signal.
  • the width a of the first gold finger 33 is larger than the width b of the third gold finger 35.
  • the width a of the first gold finger 33 and the width b of the third gold finger 35 are arranged in equal proportions, that is, the width a of the first gold finger 33 is a multiple of the width b of the third gold finger 35.
  • the width a of the first gold finger 33 is equal to the width a of the second gold finger 34 of the second region 322, and the spacing between the first gold fingers 33, the spacing between the second gold fingers 34, and the third The spacing between the gold fingers 35 is w.
  • the highest importance of the differential signal and the lowest importance of the second signal are mainly based on the actual soft printed circuit board.
  • the highest importance of the signal may also be the first signal, and the minimum importance of the signal may also be the third signal, depending on the layout of the actual flexible printed circuit board.
  • the difference between the width of the most important gold finger and the width of the gold finger with the lowest importance is differentiated, and the problem of impedance matching of the flexible printed circuit board is solved; since only the gold finger with the highest importance is The width and the minimum importance of the gold finger are set, which can quickly control the size of the spacing between adjacent gold fingers, effectively improving the process efficiency; in addition, the gold fingers are arranged in a staggered arrangement, which can be between the golden fingers Provide more space to reduce mutual interference between adjacent gold fingers.
  • FIG. 5 is a schematic structural view of a fourth embodiment of the area A in FIG. 1.
  • the main areas of FIG. 4 and FIG. 2 are that the width of the gold finger is differentiated, and the spacing between adjacent gold fingers is differentiated.
  • the spacing between the gold finger and the adjacent gold finger is differentiated according to the importance of the signal transmitted by each gold finger, and the width of the gold finger is also differentiated according to the importance of the signal transmitted by each gold finger.
  • the higher the importance of the transmitted signal the greater the width of the spacing between the gold finger and the adjacent gold finger, and the greater the width of the gold finger.
  • the gold finger includes a first gold finger 43 for transmitting a differential signal and a second gold finger 44 for transmitting a signal other than the differential signal
  • the connection region 42 includes a first region 421, a second region 422, and a third region. 423
  • the first gold finger 43 is disposed on the first region 421 and the second region 422, that is, the first gold finger 43 is located on both side regions of the connection region 42
  • the second gold finger 44 is disposed on the third region 423.
  • the gold fingers are arranged in alignment on the connection region 42, that is, the first gold fingers 43 are arranged in alignment on the first region 421 and the second region 422, and the second gold fingers 44 are aligned. The arrangement is arranged on the third area 423.
  • the spacing between adjacent gold fingers is from the middle region to the two sides of the connection region 42. Gradually getting bigger. Therefore, the spacing w between the adjacent first gold fingers 43 is greater than the spacing w1 between the adjacent second gold fingers 44, or the spacing w between the adjacent first gold fingers 43 is greater than the adjacent first The spacing between the gold finger 43 and the second gold finger 44; at the same time, the width a of the first gold finger 43 is greater than the width b of the second gold finger 44.
  • the width a of the first gold finger 43 and the width b of the second gold finger 44 are arranged in equal proportions, that is, the width a of the first gold finger 43 is 1.5 times, 2 times the width b of the second gold finger 44, 3 times or more; the spacing w between the first gold fingers 43 and the spacing w1 between the second gold fingers 44 are set in equal proportions, that is, the spacing w between the first gold fingers 43 is the second gold finger 44 1.5 times, 2 times, 3 times or more times the spacing w1 between.
  • the first gold finger 43 may be disposed on the first region 421 and the second gold finger 44 is disposed on the second region 422 and the third region 423.
  • the first gold finger 43 is disposed on the third region 423, and the second gold finger 44 is on the first region 421 and the second region 422.
  • FIG. 6 is a schematic structural view of a fifth embodiment of the area A in FIG. 1.
  • the main area of FIG. 6 and FIG. 5 is that the gold fingers are arranged in a staggered arrangement on the connection area 52, that is, the first gold fingers 53 are arranged in a staggered arrangement on the first area 521 and the second area 522, and the second gold finger
  • the staggered arrangement between the 54 is disposed on the second region 522.
  • the flexible printed circuit board of the present invention includes a connection area, and a plurality of gold fingers are disposed at intervals in the connection area, wherein the width of the gold finger is differently set, and the broadband of the golden finger of the flexible printed circuit board can be Differentiate the settings, and at the same time, the spacing between the gold fingers of the flexible printed circuit board can be differently set, so that the gold finger can be added while the size of the flexible printed circuit board is unchanged, and the soft printing can be effectively solved.
  • the impedance matching problem of the gold finger of the board is a connection area, and a plurality of gold fingers are disposed at intervals in the connection area, wherein the width of the gold finger is differently set, and the broadband of the golden finger of the flexible printed circuit board can be Differentiate the settings, and at the same time, the spacing between the gold fingers of the flexible printed circuit board can be differently set, so that the gold finger can be added while the size of the flexible printed circuit board is unchanged, and the soft printing can be effectively solved.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种软性印刷电路板以及包括所述软性印刷电路板的液晶显示器，所述软性印刷电路板包括连接区域（12），连接区域（12）内间隔设置有多个金手指，其中金手指的宽度采用差异化设置。通过上述方式，能够在软性印刷电路板的尺寸不变的情况下增加金手指，有效解决软性印刷电路板的金手指的阻抗匹配问题。

Description

软性印刷电路板和液晶显示器
【技术领域】
本发明涉及液晶技术领域，特别是涉及一种软性印刷电路板和应用该软性印刷电路板的液晶显示器。
【背景技术】
随着技术的发展，液晶显示器已应用在大众生活中，为了满足需求，液晶显示器的解析度也在不断地提高，例如液晶显示器的解析度从qHD（Quarter High Definition，数码产品屏幕分辨率的一种）到HD（High Definition，高清晰度），亦或从WXGA（Wide Extended Graphics Array，宽屏）到WUXGA（Widescreen Ultra eXtended Graphics Array，宽屏超级扩展图形阵列）。随着液晶显示器的解析度的提升，那么随之而来的是差分线的数量也要成倍的增加，增加差分线的数量就必须去增加软性印刷电路板的金手指的数量。
然而，软性印刷电路板的尺寸是固定不变的，为了使得液晶显示器的解析度提高，则必须在软性印刷电路板上增加金手指的数量。但是为了能够满足增加的金手指的数量，必须增加软性印刷电路板的尺寸，这容易增加成本。另外，由于软性印刷电路板的金手指增加，则必须会影响金手指区域的阻抗。因此，随着液晶显示器的解析度提高的情况下，金手指区域的阻抗匹配也成为一大问题。
综上所述，有必要提供一种软性印刷电路板和液晶显示器以解决上述问题。
【发明内容】
本发明主要解决的技术问题是提供一种软性印刷电路板和液晶显示器，能够在软性印刷电路板的尺寸不变的情况下增加金手指，有效解决软性印刷电路板的金手指的阻抗匹配问题。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种软性印刷电路板，其包括连接区域，连接区域内间隔设置有多个金手指，其中金手指的宽度采用差异化设置；相邻的金手指之间的间距采用差异化设置；金手指包括用于传输差分信号的第一金手指以及用于传输差分信号以外的其他信号的第二金手指，其中第一金手指的宽度大于第二金手指的宽度。
其中，金手指之间对齐排列设置在连接区域上。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种软性印刷电路板，其包括连接区域，连接区域内间隔设置有多个金手指，其中金手指的宽度采用差异化设置。
其中，金手指包括用于传输差分信号的第一金手指以及用于传输差分信号以外的其他信号的第二金手指，其中第一金手指的宽度大于第二金手指的宽度。
其中，第一金手指位于连接区域的中间区域或两侧区域。
其中，第一金手指之间错开排列设置在连接区域上，第二金手指之间错开排列设置在连接区域上。
其中，相邻的金手指之间的间距采用差异化设置。
其中，金手指包括用于传输差分信号的第一金手指以及用于传输差分信号以外的其他信号的第二金手指，其中相邻的第一金手指之间的间距大于相邻的第二金手指之间的间距或相邻的第一金手指与第二金手指之间的间距。
其中，第一金手指位于连接区域的两侧区域。
其中，第一金手指之间错开排列设置在连接区域上，第二金手指之间错开排列设置在连接区域上。
其中，相邻的金手指之间的间距在从连接区域的中间区域向两侧区域逐渐变大。
为解决上述技术问题，本发明采用的又一个技术方案是：提供一种液晶显示器，其包括液晶面板以及连接液晶面板的软性印刷电路板，软性印刷电路板包括连接区域，连接区域内间隔设置有多个金手指，其中金手指的宽度采用差异化设置。
其中，金手指包括用于传输差分信号的第一金手指以及用于传输差分信号以外的其他信号的第二金手指，其中第一金手指的宽度大于第二金手指的宽度。
其中，第一金手指位于连接区域的中间区域或两侧区域。
其中，第一金手指之间错开排列设置在连接区域上，第二金手指之间错开排列设置在连接区域上。
其中，相邻的金手指之间的间距采用差异化设置。
其中，金手指包括用于传输差分信号的第一金手指以及用于传输差分信号以外的其他信号的第二金手指，其中相邻的第一金手指之间的间距大于相邻的第二金手指之间的间距或相邻的第一金手指与第二金手指之间的间距。
其中，第一金手指位于连接区域的两侧区域。
其中，第一金手指之间错开排列设置在连接区域上，第二金手指之间错开排列设置在连接区域上。
其中，相邻的金手指之间的间距在从连接区域的中间区域向两侧区域逐渐变大。
本发明的有益效果是：区别于现有技术的情况，本发明的软性印刷电路板包括连接区域，连接区域内间隔设置有多个金手指，其中金手指的宽度采用差异化设置。通过上述方式，本发明通过对软性印刷电路板的金手指的宽带进行差异化设置，能够在软性印刷电路板的尺寸不变的情况下增加金手指，有效解决软性印刷电路板的金手指的阻抗匹配问题。
【附图说明】
图1是本发明软性印刷电路板和显示面板的结构示意图；
图2是图1中区域A的第一实施例的结构示意图；
图3是图1中区域A的第二实施例的结构示意图；
图4是图1中区域A的第三实施例的结构示意图；
图5是图1中区域A的第四实施例的结构示意图；
图6是图1中区域A的第五实施例的结构示意图。
【具体实施方式】
下面结合附图和实施方式对本发明进行详细说明。
如图1和图2所示，图1是本发明软性印刷电路板和显示面板的结构示意图，图2是图1中区域A的第一实施例的结构示意图。本发明公开一种液晶显示器，该液晶显示器包括液晶面板11以及软性印刷电路板，液晶面板11和软性印刷电路板连接。其中，软性印刷电路板包括连接区域12，连接区域12内间隔设置有多个金手指，金手指用于传输信号。
其中，连接区域12包括第一区域121和第二区域122，金手指包括第一金手指13和第二金手指14。第一金手指13设置在第一区域121上，第二金手指14设置在第二区域122上。第一金手指13用于传输差分信号，第二金手指14用于传输差分信号以外的其他信号。在本实施例中，金手指之间对齐排列设置在连接区域12上，即第一金手指13之间对齐排列设置在第一区域121，第二金手指14之间对齐排列设置在第二区域122上。
在本实施例中，金手指的宽度采用差异化设置，根据各金手指所传输信号的重要度对金手指的宽度进行差异化设置。优选地，所传输信号的重要度越高，金手指的宽度越大。在本实施例中，差分信号的重要度较高，差分信号以外的其他信号的重要度较低，因此，第一金手指13的宽度a大于第二金手指14的宽度b。应理解，设置在第一区域121的所有第一金手指13的宽度都为a，设置在第二区域122的所有第二金手指14的宽度都为b，本实施例的金手指之间的间距均为w，即设置在第一区域121的所有第一金手指13之间的间距为w，设置在第二区域122的所有第二金手指14之间的间距也为w。
应理解，在其他实施例中，并不限定于差分信号的重要度最高，信号的重要度最高主要是根据实际软性印刷电路板内的信号传输线的布局而定的。
应理解，第一金手指13可以位于连接区域12的中间区域，也可以位于连接区域12的两侧区域，即第一金手指13除了可以位于第一区域121外，还位于第二区域122或其他区域。
本实施例位于连接区域12的中间区域的第一金手指13的宽度不变，通过对第二金手指14的宽度进行变小，使得连接区域12的两侧区域空出足够间距，方便在连接区域12的两侧区域进行金手指的增加或修改，能够解决软性印刷电路板的阻抗匹配问题。
进一步地，如图3所示，图3是图1中区域A的第二实施例的结构示意图。图3与图2的主要区域在于：根据各金手指所传输信号的重要度对金手指的宽度进行递增或递减比例设置。即连接区域22包括第一区域221、第二区域222和第三区域223，金手指包括第一金手指23、第二金手指24和第三金手指25。第一金手指23设置在第一区域221上，第二金手指24设置在第二区域222上，第三金手指25设置在第三区域223上。第一金手指23用于传输差分信号，第二金手指24用于传输第一信号，第三金手指25用于传输第二信号。在本实施例中，金手指之间对齐排列设置在连接区域22上，即第一金手指23之间对齐排列设置在第一区域221上，第二金手指24之间对齐排列设置在第二区域222上，第三金手指25之间对齐排列设置在第三区域223上。
在本实施例中，差分信号的重要度高，第一信号的重要度中，第二信号的重要度低。因此，第一金手指23的宽度a比第二金手指24的宽度b大，第二金手指24的宽度b比第三金手指25的宽度c大。优选地，第一金手指23的宽度a、第二金手指24的宽度b和第三金手指25的宽度c成递减比例设置，或者第一金手指23的宽度a、第二金手指24的宽度b和第三金手指25的宽度c成等差比例设置。另外，第一金手指23之间的间距、第二金手指24之间的间距和第三金手指25之间的间距都为w。
应理解，在其他实施例中，并不限定于软性印刷电路板内的差分信号的重要度高、第一信号的重要度中和第二信号的重要度低，信号的重要度主要是根据实际软性印刷电路板内的信号传输线的布局而定的，即第一信号的重要度也可以为高，又或者第二信号的重要度也可以为高。另外，第一金手指23可以位于第一区域221上，又或者第一金手指23也可以位于第二区域222。
本实施例通过对第一金手指23的宽度a、第二金手指24的宽度b和第三金手指25的宽度c设置成递减比例，在解决软性印刷电路板的阻抗匹配问题的同时，由于相邻的金手指的宽度是等比例设置的，能够很好的控制相邻的金手指的宽度的尺寸，有效提升工艺效率。
如图4所示，图4是图1中区域A的第三实施例的结构示意图。图4与图2的主要区域在于：对重要度最高的金手指的宽度和重要度最低的金手指的宽度进行差异化设置，且金手指之间错开排列设置在连接区域32上。具体而言，连接区域32包括第一区域321、多个第二区域322和第三区域323，金手指包括第一金手指33、第二金手指34和第三金手指35。第一金手指33之间错开排列设置在第一区域321上，第二金手指34之间错开排列设置在第二区域322上，第三金手指35之间错开排列设置在第三区域323上。第一金手指33用于传输差分信号，第二金手指34用于传输第一信号，第三金手指35用于传输第二信号。
在本实施例中，差分信号的重要度最高，第二信号的重要度最低。因此，第一金手指33的宽度a比第三金手指35的宽度b大。优选地，第一金手指33的宽度a和第三金手指35的宽度b成等比例设置，即第一金手指33的宽度a是第三金手指35的宽度b的倍数。另外，第一金手指33的宽度a与第二区域322的第二金手指34的宽度a相等，同时，第一金手指33之间的间距、第二金手指34之间的间距和第三金手指35之间的间距都为w。
应理解，在其他实施例中，并不限定于差分信号的重要度最高和第二信号的重要度最低，信号的重要度最高和信号的重要度最低主要是根据实际软性印刷电路板内的信号传输线的布局而定的，即信号的重要度最高也可以是第一信号，信号的重要度最低也可以是第三信号，具体根据实际软性印刷电路板的布局而定。
本实施例通过对重要度最高的金手指的宽度和重要度最低的金手指的宽度进行差异化设置，在解决软性印刷电路板的阻抗匹配问题的同时；由于只对重要度最高的金手指的宽度和重要度最低的金手指的宽度进行设置，能够快速控制相邻的金手指之间的间距的尺寸，有效提升工艺效率；另外，金手指之间错开排列设置，能够为金手指之间提供更多的空间，降低相邻的金手指之间的互相干扰。
如图5所示，图5是图1中区域A的第四实施例的结构示意图。图4与图2的主要区域在于：金手指的宽度采用差异化设置，且相邻的金手指之间的间距采用差异化设置。
优选地，根据各金手指所传输信号的重要度对金手指与相邻金手指之间的间距进行差异化设置，同时也根据各金手指所传输信号的重要度对金手指的宽度采用差异化设置。其中，所传输信号的重要度越高，金手指与相邻金手指之间的间距的宽度越大，且金手指的宽度也越大。
其中，金手指包括用于传输差分信号的第一金手指43以及用于传输差分信号以外的其他信号的第二金手指44，连接区域42包括第一区域421、第二区域422和第三区域423，第一金手指43设置在第一区域421和第二区域422上，即第一金手指43位于连接区域42的两侧区域上，第二金手指44设置在第三区域423上。在本实施例中，金手指之间对齐排列设置在连接区域42上，即第一金手指43之间对齐排列设置在第一区域421和第二区域422上，第二金手指44之间对齐排列设置在第三区域423上。
在本实施例中，差分信号的重要度较高，差分信号以外的其他信号的重要度较低，优选地，相邻的金手指之间的间距在从连接区域42的中间区域向两侧区域逐渐变大。因此，相邻的第一金手指43之间的间距w大于相邻的第二金手指44之间的间距w1，或者相邻的第一金手指43之间的间距w大于相邻的第一金手指43与第二金手指44之间的间距；同时，第一金手指43的宽度a大于第二金手指44的宽度b。优选地，第一金手指43的宽度a和第二金手指44的宽度b成等比例设置，即第一金手指43的宽度a是第二金手指44的宽度b的1.5倍、2倍、3倍或更多倍；第一金手指43之间的间距w和第二金手指44之间的间距w1成等比例设置，即第一金手指43之间的间距w是第二金手指44之间的间距w1的1.5倍、2倍、3倍或更多倍。
应理解，在其他实施例中，第一金手指43可以设置在第一区域421上，第二金手指44设置在第二区域422和第三区域423上。又或者第一金手指43设置在第三区域423上，第二金手指44第一区域421和第二区域422上。
本实施例通过同时对金手指之间的间距和金手指的宽度进行差异化，能够为软性印刷电路板空出足够大的空间，可以大大提升软性印刷电路板的组装良率。
如图6所示，图6是图1中区域A的第五实施例的结构示意图。图6与图5的主要区域在于：金手指之间错开排列设置在连接区域52上，即第一金手指53之间错开排列设置在第一区域521和第二区域522上，第二金手指54之间错开排列设置在第二区域522上。
综上所述，本发明的软性印刷电路板包括连接区域，连接区域内间隔设置有多个金手指，其中金手指的宽度采用差异化设置，能够对软性印刷电路板的金手指的宽带进行差异化设置，同时，还可以对软性印刷电路板的金手指之间的间距进行差异化设置，使得在软性印刷电路板的尺寸不变的情况下增加金手指，有效解决软性印刷电路板的金手指的阻抗匹配问题。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (20)

  1. 一种软性印刷电路板，其中，所述软性印刷电路板包括连接区域，所述连接区域内间隔设置有多个金手指，其中所述金手指的宽度采用差异化设置；
    相邻的所述金手指之间的间距采用差异化设置；
    所述金手指包括用于传输差分信号的第一金手指以及用于传输差分信号以外的其他信号的第二金手指，其中所述第一金手指的宽度大于所述第二金手指的宽度。
  2. 根据权利要求1所述的软性印刷电路板，其中，所述金手指之间对齐排列设置在所述连接区域上。
  3. 一种软性印刷电路板，其中，所述软性印刷电路板包括连接区域，所述连接区域内间隔设置有多个金手指，其中所述金手指的宽度采用差异化设置。
  4. 根据权利要求3所述的软性印刷电路板，其中，所述金手指包括用于传输差分信号的第一金手指以及用于传输差分信号以外的其他信号的第二金手指，其中所述第一金手指的宽度大于所述第二金手指的宽度。
  5. 根据权利要求4所述的软性印刷电路板，其中，所述第一金手指位于所述连接区域的中间区域或两侧区域。
  6. 根据权利要求5所述的软性印刷电路板，其中，所述第一金手指之间错开排列设置在所述连接区域上，所述第二金手指之间错开排列设置在所述连接区域上。
  7. 根据权利要求3所述的软性印刷电路板，其中，相邻的所述金手指之间的间距采用差异化设置。
  8. 根据权利要求7所述的软性印刷电路板，其中，所述金手指包括用于传输差分信号的第一金手指以及用于传输差分信号以外的其他信号的第二金手指，其中相邻的所述第一金手指之间的间距大于相邻的所述第二金手指之间的间距或相邻的所述第一金手指与所述第二金手指之间的间距。
  9. 根据权利要求8所述的软性印刷电路板，其中，所述第一金手指位于所述连接区域的两侧区域。
  10. 根据权利要求9所述的软性印刷电路板，其中，所述第一金手指之间错开排列设置在所述连接区域上，所述第二金手指之间错开排列设置在所述连接区域上。
  11. 根据权利要求7所述的软性印刷电路板，其中，相邻的所述金手指之间的间距在从所述连接区域的中间区域向两侧区域逐渐变大。
  12. 一种液晶显示器，其中，所述液晶显示器包括液晶面板以及连接所述液晶面板的软性印刷电路板，所述软性印刷电路板包括连接区域，所述连接区域内间隔设置有多个金手指，其中所述金手指的宽度采用差异化设置。
  13. 根据权利要求12所述的软性印刷电路板，其中，所述金手指包括用于传输差分信号的第一金手指以及用于传输差分信号以外的其他信号的第二金手指，其中所述第一金手指的宽度大于所述第二金手指的宽度。
  14. 根据权利要求13所述的软性印刷电路板，其中，所述第一金手指位于所述连接区域的中间区域或两侧区域。
  15. 根据权利要求14所述的软性印刷电路板，其中，所述第一金手指之间错开排列设置在所述连接区域上，所述第二金手指之间错开排列设置在所述连接区域上。
  16. 根据权利要求12所述的软性印刷电路板，其中，相邻的所述金手指之间的间距采用差异化设置。
  17. 根据权利要求16所述的软性印刷电路板，其中，所述金手指包括用于传输差分信号的第一金手指以及用于传输差分信号以外的其他信号的第二金手指，其中相邻的所述第一金手指之间的间距大于相邻的所述第二金手指之间的间距或相邻的所述第一金手指与所述第二金手指之间的间距。
  18. 根据权利要求17所述的软性印刷电路板，其中，所述第一金手指位于所述连接区域的两侧区域。
  19. 根据权利要求18所述的软性印刷电路板，其中，所述第一金手指之间错开排列设置在所述连接区域上，所述第二金手指之间错开排列设置在所述连接区域上。
  20. 根据权利要求16所述的软性印刷电路板，其中，相邻的所述金手指之间的间距在从所述连接区域的中间区域向两侧区域逐渐变大。
PCT/CN2015/070522 2014-12-31 2015-01-12 软性印刷电路板和液晶显示器 Ceased WO2016106827A1 (zh)

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