WO2008078427A1 - フレキシブル配線基板およびこれを用いたｌｃｄモジュール - Google Patents

フレキシブル配線基板およびこれを用いたｌｃｄモジュール Download PDF

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Publication number
WO2008078427A1
WO2008078427A1 PCT/JP2007/064605 JP2007064605W WO2008078427A1 WO 2008078427 A1 WO2008078427 A1 WO 2008078427A1 JP 2007064605 W JP2007064605 W JP 2007064605W WO 2008078427 A1 WO2008078427 A1 WO 2008078427A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible wiring
substrate
wiring substrate
lcd module
fpc terminals
Prior art date
Application number
PCT/JP2007/064605
Other languages
English (en)
French (fr)
Inventor
Gen Nagaoka
Original Assignee
Sharp Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Publication of WO2008078427A1 publication Critical patent/WO2008078427A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

　本発明のフレキシブル配線基板（１）は、縁部の少なくとも一部に、互いに離間し、かつ、互いに略平行かつ直線的に配列され、電気的接続に用いられる短冊状のＦＰＣ端子（７）を複数有している、フレキシブル配線基板（１）において、端部付近に配されたＦＰＣ端子（７）間のピッチは、中央部付近に配されたＦＰＣ端子（７）間のピッチよりも大きい。これにより、寸法公差の影響を極力小さくした、フレキシブル配線基板を提供することができる。
PCT/JP2007/064605 2006-12-26 2007-07-25 フレキシブル配線基板およびこれを用いたｌｃｄモジュール WO2008078427A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-350639 2006-12-26
JP2006350639 2006-12-26

Publications (1)

Publication Number Publication Date
WO2008078427A1 true WO2008078427A1 (ja) 2008-07-03

Family

ID=39562222

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/064605 WO2008078427A1 (ja) 2006-12-26 2007-07-25 フレキシブル配線基板およびこれを用いたｌｃｄモジュール

Country Status (1)

Country Link
WO (1) WO2008078427A1 (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013170463A1 (zh) * 2012-05-16 2013-11-21 深圳市华星光电技术有限公司 一种柔性电路板、覆晶薄膜及制作方法
CN104507254A (zh) * 2014-12-31 2015-04-08 深圳市华星光电技术有限公司 软性印刷电路板和液晶显示器
CN104540315A (zh) * 2014-12-31 2015-04-22 深圳市华星光电技术有限公司 软性印刷电路板和液晶显示器
US9167687B2 (en) 2012-05-16 2015-10-20 Shenzhen China Star Optoelectronics Technology Co., Ltd. Flexible printed circuit board, chip on film and manufacturing method
JP2015204458A (ja) * 2014-04-10 2015-11-16 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 電子部品
JP2017109388A (ja) * 2015-12-16 2017-06-22 エスアイアイ・プリンテック株式会社 液体噴射ヘッドおよび液体噴射装置
CN107144784A (zh) * 2017-03-31 2017-09-08 北京德威特继保自动化科技股份有限公司 信号传输方法和装置以及存储介质、处理器
CN108198808A (zh) * 2017-12-27 2018-06-22 武汉华星光电半导体显示技术有限公司 一种压合片排列结构及oled显示屏
CN110018598A (zh) * 2019-04-10 2019-07-16 武汉华星光电技术有限公司 显示面板及显示装置
US11457531B2 (en) 2013-04-29 2022-09-27 Samsung Display Co., Ltd. Electronic component, electric device including the same, and bonding method thereof
CN115359716A (zh) * 2016-10-31 2022-11-18 昆山国显光电有限公司 驱动电路载体、显示面板及平板显示器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05145209A (ja) * 1991-11-22 1993-06-11 Sharp Corp 端子の接続構造
JP2003218492A (ja) * 2002-01-28 2003-07-31 Mitsubishi Electric Corp 端子接続構造及びマトリクス型平面ディスプレイ装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05145209A (ja) * 1991-11-22 1993-06-11 Sharp Corp 端子の接続構造
JP2003218492A (ja) * 2002-01-28 2003-07-31 Mitsubishi Electric Corp 端子接続構造及びマトリクス型平面ディスプレイ装置

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9167687B2 (en) 2012-05-16 2015-10-20 Shenzhen China Star Optoelectronics Technology Co., Ltd. Flexible printed circuit board, chip on film and manufacturing method
WO2013170463A1 (zh) * 2012-05-16 2013-11-21 深圳市华星光电技术有限公司 一种柔性电路板、覆晶薄膜及制作方法
US11979987B2 (en) 2013-04-29 2024-05-07 Samsung Display Co., Ltd. Electronic component, electric device including the same, and bonding method thereof
US11696402B2 (en) 2013-04-29 2023-07-04 Samsung Display Co., Ltd. Electronic component, electric device including the same, and bonding method thereof
US11457531B2 (en) 2013-04-29 2022-09-27 Samsung Display Co., Ltd. Electronic component, electric device including the same, and bonding method thereof
CN110246822A (zh) * 2014-04-10 2019-09-17 三星显示有限公司 电子组件
CN110246822B (zh) * 2014-04-10 2023-09-26 三星显示有限公司 电子组件
JP2015204458A (ja) * 2014-04-10 2015-11-16 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 電子部品
JP2020115592A (ja) * 2014-04-10 2020-07-30 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 電子部品
WO2016106826A1 (zh) * 2014-12-31 2016-07-07 深圳市华星光电技术有限公司 软性印刷电路板和液晶显示器
US9839122B2 (en) 2014-12-31 2017-12-05 Shenzhen China Star Optoelectronics Technology Co., Ltd. Flexible printed circuit board and liquid crystal display
US9804457B2 (en) 2014-12-31 2017-10-31 Shenzhen China Star Optoelectronics Technology Co., Ltd Flexible printed circuit board and liquid crystal display
WO2016106827A1 (zh) * 2014-12-31 2016-07-07 深圳市华星光电技术有限公司 软性印刷电路板和液晶显示器
CN104540315A (zh) * 2014-12-31 2015-04-22 深圳市华星光电技术有限公司 软性印刷电路板和液晶显示器
CN104507254A (zh) * 2014-12-31 2015-04-08 深圳市华星光电技术有限公司 软性印刷电路板和液晶显示器
JP2017109388A (ja) * 2015-12-16 2017-06-22 エスアイアイ・プリンテック株式会社 液体噴射ヘッドおよび液体噴射装置
CN115359716A (zh) * 2016-10-31 2022-11-18 昆山国显光电有限公司 驱动电路载体、显示面板及平板显示器
CN115359716B (zh) * 2016-10-31 2024-01-26 昆山国显光电有限公司 驱动电路载体、显示面板及平板显示器
CN107144784A (zh) * 2017-03-31 2017-09-08 北京德威特继保自动化科技股份有限公司 信号传输方法和装置以及存储介质、处理器
CN108198808A (zh) * 2017-12-27 2018-06-22 武汉华星光电半导体显示技术有限公司 一种压合片排列结构及oled显示屏
CN110018598A (zh) * 2019-04-10 2019-07-16 武汉华星光电技术有限公司 显示面板及显示装置
CN110018598B (zh) * 2019-04-10 2024-03-26 武汉华星光电技术有限公司 显示面板及显示装置

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