WO2016104609A1 - Substrat d'élément à del, module monté sur une del et dispositif d'affichage à del les utilisant - Google Patents

Substrat d'élément à del, module monté sur une del et dispositif d'affichage à del les utilisant Download PDF

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Publication number
WO2016104609A1
WO2016104609A1 PCT/JP2015/086038 JP2015086038W WO2016104609A1 WO 2016104609 A1 WO2016104609 A1 WO 2016104609A1 JP 2015086038 W JP2015086038 W JP 2015086038W WO 2016104609 A1 WO2016104609 A1 WO 2016104609A1
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Prior art keywords
led
metal wiring
led element
substrate
resin
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PCT/JP2015/086038
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English (en)
Japanese (ja)
Inventor
貴之 駒井
拓也 大橋
柴崎　聡
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大日本印刷株式会社
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Priority claimed from JP2014263664A external-priority patent/JP2016122816A/ja
Priority claimed from JP2014263661A external-priority patent/JP2016122815A/ja
Application filed by 大日本印刷株式会社 filed Critical 大日本印刷株式会社
Publication of WO2016104609A1 publication Critical patent/WO2016104609A1/fr

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present invention relates to an LED element substrate, an LED mounting module, and an LED display device using them. More specifically, by mounting a large number of light emitting diode (LED) elements, it can be used for the construction of a large LED display device, and can contribute to the improvement of productivity and heat dissipation of the LED display device.
  • the present invention relates to an LED element substrate, an LED mounting module using the same, and an LED display device.
  • LED displays such as liquid crystal televisions and liquid crystal displays that use LED elements as backlight sources can be used to meet demands for lower power consumption and larger and thinner devices instead of conventional CRT monitors.
  • the spread of equipment is rapidly progressing.
  • LED mounting module In order to mount an LED element as a light source in these display devices, various types of LED element substrates each including a support substrate and a wiring portion are usually used.
  • a laminate in which LED elements are mounted on these substrates (hereinafter referred to as “LED mounting module” in this specification) is a light source of various display devices such as the above-mentioned liquid crystal televisions, that is, an LED backlight. Is widely used.
  • any of the above LED element substrates in particular, when a large display device having a screen size of 65 inches or more that requires mounting of 1000 or more LED elements is configured, a plurality of LED element substrates is used.
  • the backlight is configured by connecting the connectors with each other, and it is difficult to arrange the plurality of substrates with high positional accuracy inside the backlight. This was a factor that hindered further improvement in productivity.
  • the present invention has been made in view of the above situation, and can be preferably used as a backlight of an LED display device, and can improve heat dissipation and productivity of the LED display device and the like. It is an object to provide an LED mounting module and an LED display device using them.
  • the present inventors have found that the above problem can be solved by configuring the LED element substrate as follows. That is, it is assumed that a metal wiring part on which a large number of LED elements can be mounted is formed on a resin film, and moreover, on the surface of the above-mentioned resin film, most of a predetermined ratio or more is the metal wiring part. It has been found that the heat dissipation and productivity of the LED display device and the like can be remarkably enhanced as compared with the conventional method, and the present invention has been completed. Specifically, the present invention provides the following.
  • the metal wire constituting the metal wiring part has a thermal conductivity ⁇ of 300 W / (m ⁇ K) or more and 500 W / (m ⁇ K) or less, and the metal resistivity R constituting the metal wiring part is 2.
  • a substrate for an LED element that is 50 ⁇ 10 ⁇ 8 ⁇ m or less, and wherein the metal wiring portion covers a range of 95% or more of one surface of the resin substrate.
  • the length of the diagonal line is at least 65 inches or more and a resin substrate made of a single flexible resin film is laminated on the resin substrate, and conducts between both electrodes of the LED element.
  • the front metal wiring portion is an electrolytic copper foil, and the surface roughness Rz on the side of the laminated surface with the resin substrate is 1.0 or more and 10.0 or less, according to any one of (1) to (5) LED element substrate.
  • An LED mounting module in which at least 100 LED elements are mounted on the LED element substrate according to any one of (1) to (7).
  • An LED display device comprising the LED mounting module according to (8) or (9) as a backlight.
  • LED device substrate, LED mounting module, and LED device substrate and LED mounting which can be preferably used as a backlight for providing an LED display device using the same, and have excellent heat dissipation and productivity Modules can be provided.
  • FIG. 5 is a partially enlarged view of FIG. 4 and is a diagram for explaining a mounting mode of LED elements in the LED mounting module of the present invention. It is a perspective view which shows typically the outline of the layer structure of the LED display apparatus which uses the LED mounting module of this invention.
  • the LED element substrate 1 has a conductive metal wiring portion 13 made of metal foil on the surface of a resin substrate 11 made of a flexible resin film. (See FIG. 3).
  • the metal wiring part 13 is formed on the resin substrate 11 in such a manner that the LED elements 2 arranged in a matrix can be conducted.
  • the resin substrate is not a single resin film bonded to the plurality of flexible resin films, and the resin film is used as a base material. This is possible in the present invention.
  • the LED element substrate 1 has an insulating protective film 15 made of thermosetting ink or the like formed on the resin substrate 11 and the metal wiring portion 13 as shown in FIGS.
  • the insulating protective film 15 is formed on the entire surface of the metal wiring portion 13 except for the connection portion for mounting the LED element 2 and on the resin substrate 11. It is formed so as to cover almost the entire surface of the surface where the metal wiring portion 13 is not formed.
  • the LED element substrate 1 is obtained by further laminating a reflective layer 16 made of a white resin or the like on the resin substrate 11 and the metal wiring portion 13 on the insulating protective film 15. It is preferable that In particular, when the LED mounting module 10 in which the LED element 2 is mounted on the LED element substrate 1 is used as a backlight of the LED display device 100 as shown in FIG. 6, the reflective layer 16 is used as the outermost surface of the LED mounting module. In general, it is essential to arrange them. However, it is also possible to provide the insulating protective film 15 with a reflective function, thereby ensuring the necessary reflective function with the insulating protective film without installing a reflective layer.
  • the LED element substrate 1 is an LED mounting module 10 in which the LED element 2 is mounted on the metal wiring portion 13 in a conductive manner via the solder layer 14. And this LED mounting module 10 can be preferably used for a large-sized LED display device and other various large-sized LED element mounting electronic devices.
  • the length of the diagonal line d shown in FIG. 4 is at least 32 inches or more, more preferably 65 inches or more. Moreover, 100 or more, preferably 1000 or more LED elements 2 can be mounted in a matrix.
  • FIG. 4 is an example of a mounting mode of the LED elements 2 on the LED element substrate 1.
  • FIG. 4 shows an example in which 40 LED elements 2 in the X direction and 30 in the Y direction are mounted in total. Show.
  • the planar shape of the LED element substrate of the present invention is not necessarily limited to a rectangular shape.
  • “the length of the diagonal is 32 inches or more” means, for example, the length of the major axis when the LED element substrate is elliptical.
  • any ellipse-shaped LED element substrate having a major axis length of 32 inches or more that satisfies the other constituent requirements of the present application is within the scope of the present invention.
  • the resin substrate 11 not only has a length of the diagonal line d of at least 32 inches or more, more preferably 65 inches or more in accordance with the size of the LED element substrate 1 described above, but a resin film having such a size is not limited.
  • a resin film having such a size is not limited.
  • One resin film is preferable.
  • the term “single resin film” means that the resin film is not an assembly of a plurality of resin films or a joined body in which they are physically joined, but a resin comprising a single sheet film. Means film. Such a single large film can be produced by a special extrusion apparatus capable of producing a film outside the conventional standard range.
  • the material of the resin substrate 11 As the material of the resin substrate 11, a flexible resin film obtained by molding a thermoplastic resin into a sheet shape can be used.
  • the sheet form is a concept including a film form, and there is no difference between them in the present invention.
  • thermoplastic resin used as the material for the resin substrate 11 is required to have high heat resistance and insulation.
  • a resin a polyimide resin (PI) excellent in heat resistance, dimensional stability during heating, mechanical strength, and durability can be used.
  • various other thermoplastic resins whose heat resistance and dimensional stability are improved by performing a heat resistance improving process such as an annealing process can also be used.
  • PEN polyethylene naphthalate
  • PET etc. which improved the flame retardance by addition of a flame retardant inorganic filler etc. can also be selected as material resin of a resin substrate.
  • the heat resistance of the thermoplastic resin forming the resin substrate 11 has been improved by the annealing treatment so that the thermal shrinkage starting temperature is equal to or higher than the thermosetting temperature of the thermosetting ink forming the insulating protective film 15. It is preferable to use one.
  • the insulating protective film 15 is formed of a thermosetting ink having a thermosetting temperature of about 80 ° C.
  • the heat shrinkage starting temperature of PEN which is usually about 80 ° C., is about 100 ° C. by annealing. Can be improved. Thereby, it is possible to form the insulating protective film 15 having sufficient heat resistance, strength, and insulation while avoiding minute heat damage of the resin substrate 11.
  • thermal shrinkage start temperature means that a sample sheet made of a thermoplastic resin to be measured is set in a TMA apparatus, a load of 1 g is applied, and the temperature is increased to 120 ° C. at a temperature rising rate of 2 ° C./min. Measure the amount of shrinkage (in%) at that time, output this data and record the temperature and amount of shrinkage, read the temperature that deviates from the 0% baseline due to shrinkage, and heat shrink the temperature This is the starting temperature.
  • the “thermosetting temperature” in the present specification is the measurement and calculation of the temperature at the rising position of the thermosetting reaction when the thermosetting resin to be measured is heated, and that temperature is the thermosetting temperature. .
  • the insulating property of the resin substrate 11 may be a resin having a volume resistivity that can provide the insulating property required for the LED element substrate 1 when, for example, the LED display device is integrated as a backlight or the like. Desired.
  • the volume resistivity of the resin substrate 11 is preferably 10 14 ⁇ ⁇ cm or more, and more preferably 10 18 ⁇ ⁇ cm or more.
  • the thickness of the resin substrate 11 is not particularly limited, but is preferably about 10 ⁇ m or more and 100 ⁇ m or less from the viewpoint of heat resistance and insulation, and a balance between manufacturing costs. Also, the thickness is preferably within the above-mentioned thickness range from the viewpoint of maintaining good productivity when manufacturing by the roll-to-roll method.
  • the metal wiring part 13 is preferably joined to the surface of the LED element substrate 1 by a dry laminating method with the adhesive layer 12 interposed therebetween.
  • a known resin adhesive can be appropriately used as long as it has heat resistance at the thermosetting temperature of the thermosetting ink forming the insulating protective film 15.
  • these resin adhesives urethane-based, polycarbonate-based, or epoxy-based adhesives can be particularly preferably used.
  • the metal wiring portion 13 is a wiring pattern formed by a conductive base material on the surface of the LED element substrate 1.
  • the metal wiring portion 13 has a function of supplying electricity by conducting a necessary current by passing between 1000 or more LED elements 2.
  • the metal wiring portion 13 also serves as a heat radiating portion serving as a discharge path for the heat generated from the LED element 2 to the outside of the LED display device or the like.
  • the arrangement of the metal wiring part 13 is not limited to a specific arrangement as long as the LED element can be mounted in a conductive manner.
  • the LED element substrate 1 it is essential that at least 95% or more, preferably 98% or more of one surface of the resin substrate 11 is covered with the metal wiring portion 13. Thereby, preferable heat dissipation can be imparted to the LED display device using the LED element substrate 1.
  • the metal wiring portion 13 is a matrix unit as shown in FIG. 1 where the basic unit of mounting, which is a joint portion of the LED element 2 to the metal wiring portion 13, is a matrix. It is preferable that the arrangement is repeated in both the X and Y directions.
  • the basic unit of mounting is a basic configuration of mounting composed of a plurality of adjacent rectangular conductive plate portions 131 and insulating slit portions 132 that are gap portions between the conductive plate portions 131.
  • the metal wiring part 13 has a connector wiring 133 that connects between the conductive plate parts 131 arranged mainly in different rows.
  • the metal wiring part 13 has the terminal 134 for making the electrical connection with the LED mounting module 10 and an external power supply etc. in the terminal part. Since the LED element substrate 1 can be formed by using a single resin film as a substrate, the arrangement and combination of the conductive plate portion 131, the connector wiring 133, and the terminal 134 constituting the metal wiring portion 13 are flexible in design. However, it is possible to use any connection such as series, parallel, or a complicated combination of the conductive forms of the large number of LED elements 2. Thus, by providing at least two electrical outlets, electrical connection with an external power source or the like is possible, and flexible wiring is possible according to the demand of the LED display device as the final product.
  • the width of the insulating slit portion (corresponding to the “insulating portion” of the present invention) 132 in the metal wiring portion 13 is preferably a slit shape of 0.1 mm or more and 1.0 mm or less, and is 0.2 mm or more and 0.5 mm or less. More preferably.
  • the slit shape means a slit shape as a whole, and is not necessarily a simple linear shape (including a curved line, of course). For example, an uneven portion is arranged in a part in plan view as a solder connection portion of an LED. It is meant to include things.
  • the width of the insulating slit portion 132 is preferably 0.1 mm or more. Further, when the width of the insulating slit portion 132 is 1.0 mm or less, preferable heat transfer between the conductive plate portions 131 can be achieved.
  • the metal thermal conductivity ⁇ constituting the metal wiring part 13 is preferably 200 W / (m ⁇ K) or more and 500 W / (m ⁇ K) or less, and preferably 300 W / (m ⁇ K) or more and 500 W / (m ⁇ K) or less. More preferred.
  • the electric resistivity R of the metal constituting the metal wiring part 13 is preferably 3.00 ⁇ 10 ⁇ 8 ⁇ m or less, and more preferably 2.50 ⁇ 10 ⁇ 8 ⁇ m or less.
  • the measurement of the thermal conductivity ⁇ can use, for example, a thermal conductivity meter QTM-500 manufactured by Kyoto Electronics Industry Co., Ltd., and the measurement of the electrical resistivity R can be performed, for example, a 6517B type electrometer manufactured by Keithley. Can be used.
  • the thermal conductivity ⁇ is 403 W / (m ⁇ K)
  • the electrical resistivity R is 1.55 ⁇ 10 ⁇ 8 ⁇ m.
  • the heat dissipation from the LED element is stabilized and an increase in electrical resistance can be prevented, the variation in light emission between the LEDs is reduced, and the LED can stably emit light, and the LED life is also extended.
  • the product life of the display device itself in which the LED element substrate is incorporated as a backlight can be extended.
  • the surface resistance value of the metal wiring part 13 is preferably 500 ⁇ / ⁇ or less, more preferably 300 ⁇ / ⁇ or less, further preferably 100 ⁇ / ⁇ or less, and particularly preferably 50 ⁇ / ⁇ or less.
  • the lower limit is about 0.005 ⁇ / ⁇ .
  • a 6517B type electrometer manufactured by Keithley can be used for measuring the surface resistance value.
  • the thickness of the metal wiring portion 13 may be appropriately set according to the magnitude of the withstand current required for the LED element substrate 1 and is not particularly limited, and examples thereof include a thickness of 10 ⁇ m to 50 ⁇ m. From the viewpoint of improving heat dissipation, the thickness of the metal wiring portion 13 is preferably 10 ⁇ m or more. If the thickness of the metal layer is less than the lower limit, the influence of the heat shrinkage of the resin substrate 11 is large, and the warp after the processing is likely to increase during the solder reflow process. Is preferably 10 ⁇ m or more. On the other hand, when the thickness is 50 ⁇ m or less, sufficient flexibility of the LED element substrate can be maintained, and a decrease in handling property due to an increase in weight can be prevented.
  • the metal wiring part 13 is an electrolytic copper foil
  • the surface roughness Rz on the side of the laminated surface with the resin substrate 11 is preferably 1.0 or more and 10.0 or less.
  • Rz is a ten-point average roughness defined by JISB0601. From the viewpoint of heat dissipation, by setting the surface roughness within the above range, the surface area on the side of the laminated surface with the resin substrate 11 can be increased, and the heat dissipation can be further enhanced. Moreover, since the adhesiveness with the resin substrate 11 can be improved by the surface unevenness, the heat dissipation can also be improved by this.
  • the copper foil surface having such a surface roughness Rz the rough surface side (mat surface side) of the electrolytic copper foil can be effectively utilized.
  • solder layer In the LED element substrate 1, the metal wiring portion 13 and the LED element 2 are joined through the solder layer 14. Details of the soldering method will be described later, but can be roughly classified into either a reflow method or a laser method.
  • the insulating protective film 15 is mainly a substrate for an LED element except for a portion that requires electrical bonding on the surface of the metal wiring portion 13 and the resin substrate 11 with thermosetting ink. 1 to improve the migration resistance.
  • thermosetting ink a known ink can be suitably used as long as the thermosetting temperature is about 100 ° C. or less.
  • an ink that can preferably use an insulating ink having a polyester resin, an epoxy resin, an epoxy resin and a phenol resin, an epoxy acrylate resin, a silicone resin, or the like as a base resin, respectively.
  • polyester-based thermosetting insulating ink is particularly preferable as a material for forming the insulating protective film 15 of the LED element substrate 1 because of its excellent flexibility.
  • thermosetting ink for forming the insulating protective film 15 may be a white ink further containing an inorganic white pigment such as titanium dioxide, for example.
  • formation of the insulating protective film 15 with the above insulating thermosetting ink can be performed by well-known methods, such as screen printing.
  • the reflective layer 16 is provided on the outermost surface on the light emitting surface side of the LED element substrate except for the mounting portion of the LED element 2 for the purpose of improving the light emitting capability in the LED mounting module 10 described above. Laminated. It is not particularly limited as long as it is a member having a reflective surface for reflecting the light emitted from the LED element and guiding it in a predetermined direction, but white polyester foam type white polyester, white polyethylene resin, silver vapor-deposited polyester, etc. And can be used as appropriate according to the required specifications.
  • the LED element substrate 1 can be manufactured by an etching process which is one of conventionally known methods for manufacturing an electronic substrate. Further, it is preferable to subject the resin in advance to a heat resistance improving process by annealing according to the material resin to be selected.
  • the annealing treatment temperature when the thermoplastic resin forming the resin substrate 11 is PEN, the glass transition temperature to the melting point range, more specifically 160 ° C. to 260 ° C., more preferably 180 ° C. to 230 ° C. Range.
  • An example of the annealing time is about 10 seconds to 5 minutes. According to such heat treatment conditions, the thermal contraction start temperature of PEN, which is generally about 80 ° C., can be improved to about 100 ° C.
  • a metal wiring part 13 such as a copper foil used as a material for the metal wiring part 13 is laminated on the surface of the resin substrate 11 that has been annealed to obtain a laminate that uses the LED element substrate 1 as a material.
  • a metal foil is adhered to the surface of the resin substrate 11 with an adhesive, or a plating method or a vapor deposition method (sputtering, ion plating, electron beam evaporation, Examples thereof include a method of depositing the metal wiring portion 13 by vacuum deposition, chemical vapor deposition, or the like. From the viewpoint of cost and productivity, a method of bonding a metal foil to the surface of the resin substrate 11 with a urethane-based adhesive is advantageous.
  • an etching mask patterned in the shape of the metal wiring portion 13 is formed on the surface of the metal foil of the above laminate.
  • the etching mask is provided so that the wiring pattern forming portion of the metal foil that will become the metal wiring portion 13 is free from corrosion by the etching solution.
  • the method for forming the etching mask is not particularly limited.
  • the etching mask may be formed on the surface of the laminated sheet by exposing the photoresist or dry film through the photomask and then developing the ink mask.
  • An etching mask may be formed on the surface of the laminated sheet by this printing technique.
  • the metal foil in a portion not covered with the etching mask is removed with an immersion liquid. Thereby, parts other than the location used as the metal wiring part 13 are removed among metal foil.
  • the etching mask is removed using an alkaline stripping solution. As a result, the etching mask is removed from the surface of the metal wiring portion 13.
  • an insulating protective film 15 and a reflective layer 16 are further laminated as necessary. These laminations can be performed by a known method. Depending on the material to be employed, various laminating methods such as screen printing, dry lamination, thermal lamination, and the like can be used.
  • the LED mounting module 10 can be obtained by directly mounting the LED element 2 on the metal wiring portion 13 of the LED element substrate 1.
  • the LED element 2 is a light emitting element utilizing light emission at a PN junction where a P-type semiconductor and an N-type semiconductor are joined.
  • Any structure of the LED element 2 can be used for the LED mounting module 10 of the present invention, and among the above, the LED element having a structure in which both the P-type and N-type electrodes are provided on the element single side is particularly preferably used. Can do.
  • the LED mounting module 10 exhibits high heat dissipation by covering the base material with a metal having a predetermined thermal conductivity and electrical resistance value of 95% or more on the substrate as the LED element substrate 1.
  • the LED element 2 is directly mounted on the metal wiring portion 13 that can be used. Thereby, the heat
  • the LED mounting module 10 is preferably applied to 32 inches or more, preferably 65 inches or more in terms of screen size, on the assumption that 100 or more LED elements, preferably 1000 or more LED elements 2 are mounted. Since the LED element substrate of the present invention has a high degree of freedom in circuit design, it is possible to freely adjust the arrangement interval of the LED elements 2 to be mounted. It can respond at a lower cost.
  • substrate 1 for LED elements is demonstrated.
  • the joining of the LED element 2 to the metal wiring part 13 can be preferably performed by soldering.
  • This solder bonding can be performed by a reflow method or a laser method.
  • the LED element 2 is mounted on the metal wiring part 13 through solder, and then the LED element substrate 1 is transported into the reflow furnace, and hot air at a predetermined temperature is applied to the metal wiring part 13 in the reflow furnace.
  • the solder paste is melted by spraying, and the LED element 2 is soldered to the metal wiring portion 13.
  • the laser method is a method of soldering the LED element 2 to the metal wiring portion 13 by locally heating the solder with a laser.
  • soldering the LED element 2 to the metal wiring portion 13 it is preferable to perform a solder reflow method by laser irradiation from the back surface side of the resin substrate 11. Thereby, the ignition of the organic component of the solder by heating and the accompanying damage to the base material can be more reliably suppressed.
  • FIG. 6 is a perspective view schematically showing an outline of a layer configuration of the LED display device 100 using the LED mounting module 10.
  • the LED display device 100 displays information (images) such as characters and images on the monitor 3 by driving (emitting light) the plurality of LED elements 2 arranged in a matrix at predetermined intervals.
  • the LED element 2 is mounted on the metal wiring portion 13 of the LED element substrate 1.
  • the heat dissipation structure 4 for radiating the heat radiated from the LED mounting module 10 to the outside more efficiently is installed on the back surface side of the resin substrate 11.
  • the LED element substrate is coated with a metal wiring part over a predetermined ratio (95% or more) of the surface of the resin substrate, and the thermal conductivity of the metal constituting the metal wiring part
  • the electrical resistivity R was optimized within a predetermined range.
  • required in a large sized LED display apparatus improves notably.
  • copper having a size of 330 mm ⁇ 560 mm annealed PEN film having a thickness of 50 ⁇ m and a width of an insulating slit between adjacent conductive plate portions of 1.0 mm is used. What formed the metal wiring part which consists of foils so that said coverage may become 95% is mentioned.
  • the LED mounting module in which 160 LED elements in total, 8 in the X direction and 20 in the Y direction, are mounted on this LED element substrate has an insulating slit portion in the Y direction of 2.0 mm that is not related to ensuring conduction. A clear improvement in heat dissipation was recognized as compared with the case where the coating rate was 90% and the other specifications were made exactly the same as above.
  • the resin substrate of the LED element substrate was made of a large single resin film, and the surface of the surface was covered with a metal wiring part over a predetermined ratio.
  • productivity of the LED mounting module which comprises a large sized LED display apparatus improves notably, and the heat dissipation requested
  • a metal made of copper foil on a PEN film having a size of 330 mm ⁇ 560 mm and an insulating slit portion between adjacent conductive plate portions having a width of 1.0 mm What formed the wiring part so that said coverage may become 95% is mentioned.
  • the LED mounting module in which 160 LED elements in total, 8 in the X direction and 20 in the Y direction, are mounted on this LED element substrate has an insulating slit portion in the Y direction of 2.0 mm that is not related to ensuring conduction. A clear improvement in heat dissipation was recognized as compared with the case where the coating rate was 90% and the other specifications were made exactly the same as above.
  • the metal wiring part is made of copper.
  • the average thickness of the metal wiring part was set to 5 ⁇ m or more and 50 ⁇ m or less. Thereby, sufficient flexibility of the board
  • the insulating part formed on the metal wiring part is formed in a slit shape having a width of 0.1 mm or more and 1.0 mm or less.
  • preferable heat transfer between the conductive plate portions is also possible.
  • preferable heat transfer for example, when local heat generation occurs in a large-sized LED backlight of a local dimming method (area control with fine LED emission luminance), the conductivity of a portion at a relatively high temperature is detected. There is an effect of transferring heat from the plate portion 131 to the conductive plate portion 131 that remains at a relatively low temperature. Thereby, the local high temperature in LED backlight can be dissipated to the whole board
  • the metal wiring part was formed of an electrolytic copper foil having a surface roughness Rz of 1.0 to 10.0 on the side of the laminated surface with the resin substrate.
  • the resin film forming the resin substrate was made of polyethylene naphthalate having a heat shrinkage starting temperature of 100 ° C. or higher subjected to heat resistance improvement treatment.
  • An LED mounting module in which at least 100 LED elements are mounted on an LED element substrate.
  • An LED mounting module in which at least 1000 LED elements are mounted on an LED element substrate.
  • An LED display device provided with the LED mounting module of the present invention as a backlight Since the backlight type display device needs to arrange a larger number of LEDs on the substrate than the edge light type, the increase in the amount of heat generated from the LED element is caused by the decrease in the light emitting capacity of the LED element and the resulting This leads to an increase in power consumption. Further, by expanding the peripheral member such as the substrate by heat dissipation and further repeating ON / OFF, it becomes a factor of deteriorating the peripheral member such as warp and crack. By using the LED mounting module of the present invention as a backlight, power consumption of each LED element can be suppressed and variation in light emission luminance can be reduced due to its high heat dissipation and low electrical resistance. Further, deterioration of peripheral members such as a substrate due to heat can be prevented and the product life can be extended.
  • an LED element substrate As described above, according to the present invention, it is possible to provide an LED element substrate, an LED mounting module, and an LED display device excellent in heat dissipation and productivity under productivity and quality stability that are more advantageous than those in the past.

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Abstract

La présente invention concerne un module monté sur une DEL, qui peut être utilisé de façon optimale comme un rétroéclairage dans de grands dispositifs d'affichage à DEL et qui peut améliorer la dissipation de chaleur et la productivité de dispositifs d'affichage à DEL et autres. Le substrat (1) d'élément à DEL de l'invention est doté d'un substrat (11) en résine, comprenant un film de résine flexible et une unité (13) de câblage métallique, stratifiée sur le substrat (11) en résine, afin d'effectuer une conduction entre les électrodes d'éléments à DEL (2) et sur lequel une unité d'isolation est formée. La conductivité thermique (λ) du métal constituant l'unité (13) de câblage métallique est de 300-500 W/(m*K), la résistivité électrique (R) du métal constituant l'unité (13) de câblage métallique est de 2,50×10-8 Ωm ou moins et l'unité (13) de câblage métallique recouvre 95 % ou plus d'une surface des substrats (11) en résine.
PCT/JP2015/086038 2014-12-25 2015-12-24 Substrat d'élément à del, module monté sur une del et dispositif d'affichage à del les utilisant WO2016104609A1 (fr)

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JP2014263664A JP2016122816A (ja) 2014-12-25 2014-12-25 Ｌｅｄ素子用基板及びｌｅｄ実装モジュール
JP2014263661A JP2016122815A (ja) 2014-12-25 2014-12-25 Ｌｅｄ素子用基板
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020220389A1 (fr) * 2019-04-28 2020-11-05 深圳市晶泓科技有限公司 Écran d'affichage à del transparent et son procédé de fabrication

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10852583B2 (en) * 2018-09-17 2020-12-01 Sharp Kabushiki Kaisha Lighting device, display device, and method of producing lighting device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086847A (ja) * 2001-07-06 2003-03-20 Hitachi Aic Inc 発光素子用積層板およびそれを使用した表示体
JP2007513520A (ja) * 2003-12-02 2007-05-24 スリーエム イノベイティブ プロパティズ カンパニー 発光ダイオードに基づく照明組立体
JP2008258296A (ja) * 2007-04-03 2008-10-23 Sony Corp 発光装置及び光源装置
JP2009290167A (ja) * 2008-06-02 2009-12-10 Mitsui Mining & Smelting Co Ltd 発光モジュール
JP2013254877A (ja) * 2012-06-08 2013-12-19 Koito Mfg Co Ltd 光源ユニット
JP2014130967A (ja) * 2012-12-28 2014-07-10 Nichia Chem Ind Ltd 発光装置
JP2014179520A (ja) * 2013-03-15 2014-09-25 Nichia Chem Ind Ltd 発光装置の封止部材の取り外し方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7284894B2 (en) * 2005-05-31 2007-10-23 Avago Technologies Eceliip (Singapore) Pte Ltd Light source utilizing a flexible circuit carrier
TWI362774B (en) * 2011-01-21 2012-04-21 Atek Technology Corp Lighting device and method for forming the same
TWM461880U (zh) * 2013-04-12 2013-09-11 Ritedia Corp 覆晶式發光二極體

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086847A (ja) * 2001-07-06 2003-03-20 Hitachi Aic Inc 発光素子用積層板およびそれを使用した表示体
JP2007513520A (ja) * 2003-12-02 2007-05-24 スリーエム イノベイティブ プロパティズ カンパニー 発光ダイオードに基づく照明組立体
JP2008258296A (ja) * 2007-04-03 2008-10-23 Sony Corp 発光装置及び光源装置
JP2009290167A (ja) * 2008-06-02 2009-12-10 Mitsui Mining & Smelting Co Ltd 発光モジュール
JP2013254877A (ja) * 2012-06-08 2013-12-19 Koito Mfg Co Ltd 光源ユニット
JP2014130967A (ja) * 2012-12-28 2014-07-10 Nichia Chem Ind Ltd 発光装置
JP2014179520A (ja) * 2013-03-15 2014-09-25 Nichia Chem Ind Ltd 発光装置の封止部材の取り外し方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020220389A1 (fr) * 2019-04-28 2020-11-05 深圳市晶泓科技有限公司 Écran d'affichage à del transparent et son procédé de fabrication

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