WO2016101399A1 - 双面oled显示装置及其制作方法 - Google Patents

双面oled显示装置及其制作方法 Download PDF

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Publication number
WO2016101399A1
WO2016101399A1 PCT/CN2015/072556 CN2015072556W WO2016101399A1 WO 2016101399 A1 WO2016101399 A1 WO 2016101399A1 CN 2015072556 W CN2015072556 W CN 2015072556W WO 2016101399 A1 WO2016101399 A1 WO 2016101399A1
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Prior art keywords
substrate
oled display
display device
disposed
double
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English (en)
French (fr)
Inventor
刘亚伟
王宜凡
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/424,428 priority Critical patent/US20160343791A1/en
Publication of WO2016101399A1 publication Critical patent/WO2016101399A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/128—Active-matrix OLED [AMOLED] displays comprising two independent displays, e.g. for emitting information from two major sides of the display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/90—Assemblies of multiple devices comprising at least one organic light-emitting element
    • H10K59/95—Assemblies of multiple devices comprising at least one organic light-emitting element wherein all light-emitting elements are organic, e.g. assembled OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H10K2102/3023—Direction of light emission
    • H10K2102/3031—Two-side emission, e.g. transparent OLEDs [TOLED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H10K2102/3023—Direction of light emission
    • H10K2102/3035—Edge emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a double-sided OLED display device and a method of fabricating the same.
  • the flat panel display device has many advantages such as thin body, power saving, no radiation, and has been widely used.
  • the existing flat panel display devices mainly include a liquid crystal display (LCD) and an organic light emitting display (OLED).
  • OLED display device has the advantages of self-illumination, high backlight, high contrast, thin thickness, wide viewing angle, fast response, flexible panel, wide temperature range, simple structure and simple process. It is recognized as the mainstream technology of the next generation display, and has been favored by major display manufacturers.
  • the OLED display device generally includes a substrate, an anode disposed on the substrate, a hole injection layer disposed on the anode, a hole transport layer disposed on the hole injection layer, and a light-emitting layer disposed on the hole transport layer.
  • the electron transport layer on the light-emitting layer, the electron injection layer provided on the electron transport layer, and the cathode provided on the electron injection layer have a light-emitting mechanism in which the semiconductor material and the organic light-emitting material are driven by an electric field and are injected by a carrier. And compounding leads to luminescence.
  • an OLED display device generally uses an ITO electrode and a metal electrode as an anode and a cathode, respectively.
  • electrons and holes are injected from the cathode and the anode to the electron injection layer and the hole injection layer, respectively, and the electrons and holes are respectively.
  • the electron transport layer and the hole transport layer migrate to the light-emitting layer and meet in the light-emitting layer to form excitons and excite the light-emitting molecules, and the latter emits visible light through radiation relaxation.
  • the double-sided OLED display device emerges as the times require.
  • the double-sided OLED display device can also extend the screen space, quickly switch and process multiple display images, and advertise and portable electronic products.
  • most of the double-sided OLED display devices only perform back-to-back assembly of two independent OLED display devices to realize double-sided display, the structure is relatively heavy, the process is relatively complicated, the manufacturing cost is high, and the light weight and high cost performance that do not meet the consumer's expectations are not met. Requirements.
  • the object of the present invention is to provide a double-sided OLED display device, which can realize the illumination and display functions independently of each other on both sides, and has the advantages of simple structure, light weight, easy manufacture, and no increase in manufacturing cost.
  • Another object of the present invention is to provide a method for fabricating a double-sided OLED display device, which is simple in process, low in production cost, and high in efficiency.
  • the double-sided OLED display device manufactured by the method has a simple structure, is light and thin, and can realize double-sided independence. Illumination and display functions that do not affect each other.
  • the present invention firstly provides a double-sided OLED display device, comprising: a first substrate, a second substrate disposed opposite to the first substrate, and a side of the first substrate facing the second substrate a first OLED display device, a second OLED display device disposed on a side of the second substrate facing the first substrate, and located between the first and second substrates and completely covering the first and second OLED displays End face package film of the device;
  • the first and second OLED display devices are all bottom-emitting OLED display devices, which are disposed opposite to each other and emit light toward the first and second substrates respectively;
  • the end face encapsulating film sticks the first and second substrates together and encapsulates the first and second OLED display devices.
  • the first OLED display device includes a transparent anode disposed on a side of the first substrate facing the second substrate, a reflective cathode, and an organic light emitting layer disposed between the transparent anode and the reflective cathode;
  • the second OLED The display device includes a transparent anode disposed on a side of the second substrate facing the first substrate, a reflective cathode, and an organic light-emitting layer disposed between the transparent anode and the reflective cathode.
  • the first substrate is a TFT substrate
  • the second substrate is a TFT substrate
  • the double-sided OLED display device further includes a first inorganic package frame disposed on a side of the first substrate facing the second substrate on a periphery of the end face package film, and a periphery of the end face package film at the a second inorganic package frame disposed on a side of the first substrate facing the first substrate, and a sealant disposed between the first and second inorganic package frames.
  • the material of the first and second inorganic package frames is silicon nitride.
  • the invention also provides a method for manufacturing a double-sided OLED display device, comprising the following steps:
  • Step 1 providing a first substrate, preparing a first OLED display device on a side of the first substrate;
  • the first OLED display device is a bottom emission type OLED display device, and emits light toward the first substrate;
  • Step 2 providing a second substrate, preparing a second OLED display device on a side of the second substrate;
  • the second OLED display device is a bottom emission type OLED display device, and emits light toward the second substrate;
  • Step 3 applying an end face encapsulating film on the first substrate, and completely covering the first OLED display device with the end face encapsulating film;
  • Step 4 the first substrate and the second substrate are paired and pressed, so that the first and second OLED display devices are oppositely disposed, so that the end face package film completely covers the second OLED display device,
  • the end face encapsulating film sticks the first and second substrates together and encapsulates the first and second OLED display devices.
  • the step 1 includes sequentially preparing a transparent anode, an organic light-emitting layer, and a reflective cathode on one side of the first substrate.
  • the step 2 includes: sequentially preparing a transparent anode and an organic light on one side of the second substrate. Layer, and reflective cathode.
  • the first substrate in the step 1 and the second substrate in the step 2 are both TFT substrates.
  • the step 3 further includes: forming, on a periphery of the end face encapsulating film, a first inorganic encapsulation frame on a side of the first substrate on which the first OLED display device is disposed, corresponding to the first inorganic encapsulation frame
  • the second substrate is provided with one side of the second OLED display device to form a second inorganic package frame, and the sealant is coated on the first or second inorganic package frame.
  • the step 4 further includes curing the sealant, and bonding the first and second inorganic package frames together through the plastic frame;
  • the material of the first and second inorganic package frames is silicon nitride.
  • the present invention also provides a double-sided OLED display device, including: a first substrate, a second substrate disposed opposite the first substrate, and a first OLED display device disposed on a side of the first substrate facing the second substrate a second OLED display device disposed on a side of the second substrate facing the first substrate, and an end surface package disposed between the first and second substrates and completely covering the first and second OLED display devices film;
  • the first and second OLED display devices are all bottom-emitting OLED display devices, which are disposed opposite to each other and emit light toward the first and second substrates respectively;
  • the end face encapsulating film sticks the first and second substrates together, and packages the first and second OLED display devices;
  • the first OLED display device includes a transparent anode disposed on a side of the first substrate facing the second substrate, a reflective cathode, and an organic light-emitting layer disposed between the transparent anode and the reflective cathode;
  • the OLED display includes a transparent anode disposed on a side of the second substrate facing the first substrate, a reflective cathode, and an organic light-emitting layer disposed between the transparent anode and the reflective cathode;
  • the first substrate is a TFT substrate
  • the second substrate is a TFT substrate
  • the first inorganic package frame disposed on a side of the first substrate facing the second substrate on the periphery of the end face package film, and the second periphery of the end face package film in the second a second inorganic package frame disposed on a side of the substrate facing the first substrate, and a sealant disposed between the first and second inorganic package frames.
  • the present invention provides a double-sided OLED display device in which first and second OLED display devices are respectively disposed on opposite first and second substrates, so that the two are respectively facing the first, The second substrate emits light, and the first and second substrates are pasted together by providing an end face encapsulating film, and the first and second OLED display devices are packaged, thereby achieving illumination and display functions that are independent of each other on both sides, and
  • the utility model has the advantages of simple structure, light weight, easy manufacture, and no increase in production cost.
  • the present invention provides a method for fabricating a double-sided OLED display device by separately preparing first and second OLED display devices on opposite first and second substrates such that the two are respectively directed toward the first and second substrates.
  • the first and second substrates are pasted together by the application of the end face encapsulating film, and the first and second OLED display devices are packaged, so that the method is simple in process, low in production cost and high in efficiency, and is manufactured by the method.
  • the double-sided OLED display device has a simple structure, is light and thin, and can realize a light-emitting and display function that does not affect each other on both sides.
  • FIG. 1 is a schematic cross-sectional structural view of a double-sided OLED display device of the present invention
  • FIG. 2 is a flow chart of a method of fabricating a double-sided OLED display device of the present invention.
  • the present invention firstly provides a double-sided OLED display device, comprising: a first substrate 11 , a second substrate 21 disposed opposite to the first substrate 11 , and a first substrate 11 facing the second substrate a first OLED display device 12 on one side of the substrate 21, a second OLED display device 22 disposed on a side of the second substrate 21 facing the first substrate 11, and the first and second substrates 11 and 21
  • the face seal film 30 of the first and second OLED display devices 12, 22 is completely and completely covered.
  • the first and second OLED display devices 12 and 22 are both bottom-emitting OLED display devices, and the two are oppositely disposed, respectively facing the first and second The substrates 11, 21 emit light.
  • the light emitted by the first OLED display device 12 is independently displayed on the screen through the first substrate 11, and the light emitted by the second OLED display device 22 is independently displayed on the screen through the second substrate 21, thereby
  • the first and second OLED display devices 12 and 22 can operate independently of each other to display different screens, thereby realizing light-emitting and display functions that are independent of each other on both sides.
  • the end face encapsulating film 30 is similar to the double-sided tape, and has adhesiveness on both sides, and the end face encapsulating film 30 has the functions of drying and blocking moisture and oxygen, and the first and second substrates 11 are disposed through the end face encapsulating film 30, 21 is pasted together and the first and second OLED display devices 12, 22 are packaged.
  • the end face package film 30 and the first and second substrates 11 and 21 are always in physical contact, the first and the first The pressure resistance of the two substrates 11 and 21 is improved, and it is not easily damaged by an external force.
  • the end face encapsulating film 30 is disposed to paste the first and second substrates 11 and 21 together, and package the first and second OLED display devices 12 and 22 so that the double-sided OLED display device
  • the structure is simple, light and easy to manufacture, and does not increase the production cost.
  • the first and second substrates 11 and 21 are transparent TFT substrates.
  • the first OLED display device 12 is a bottom emission type OLED display device, and further includes a transparent anode, a reflective cathode, and a transparent anode and a reflective cathode disposed on a side of the first substrate 11 facing the second substrate 21
  • the second OLED display device 22 includes a transparent anode disposed on a side of the second substrate 21 facing the first substrate 11, a reflective cathode, and disposed between the transparent anode and the reflective cathode Organic luminescent layer. It is worth mentioning that the two electrode leads are led out from the same side of the OLED display device.
  • the double-sided OLED display device further includes a first inorganic package frame 13 disposed on a side of the end surface encapsulation film 30 on a side of the first substrate 11 facing the second substrate 21, a second inorganic package frame 23 disposed on a side of the second substrate 21 facing the first substrate 11 and a first and second inorganic package frames 13 and 23 on the periphery of the end face package film 30 Between the box glue 31.
  • the material of the first and second inorganic package frames 13 and 23 is silicon nitride (SiNx).
  • SiNx silicon nitride
  • the internal structures of the first and second inorganic encapsulating frames 13 and 23 are dense, and the water vapor cannot penetrate. Only the sealant 31 can pass a small amount of water vapor and oxygen, thereby being more effective in preventing moisture and oxygen from invading.
  • the two OLED display devices 12, 22 are better packaged and protected.
  • the present invention further provides a method for fabricating a double-sided OLED display device, comprising the following steps:
  • Step 1 A first substrate 11 is provided, and a first OLED display device 12 is prepared on the side of the first substrate 11.
  • the first substrate 11 is a transparent TFT substrate.
  • the first OLED display device 12 is a bottom emission type OLED display device that emits light toward the first substrate 11.
  • the step 1 includes: sequentially preparing a transparent anode, an organic light emitting layer, and a reflective cathode on one side of the first substrate 11, thereby preparing the first OLED display device 12.
  • Step 2 providing a second substrate 21, and preparing a second OLED display device 22 on the side of the second substrate 21.
  • the second substrate 21 is a transparent TFT substrate.
  • the second OLED display device 22 is a bottom emission type OLED display device that emits light toward the second substrate 21.
  • the step 2 includes: sequentially preparing a transparent anode, an organic light emitting layer, and a reflective cathode on one side of the second substrate 21 to thereby obtain the second OLED display device 22; and connecting the two electrode leads to the OLED The same side of the display device is led out.
  • Step 3 Applying the end face encapsulating film 30 on the first substrate 11 and completely covering the first OLED display device 12 with the end face encapsulating film 30.
  • the end face encapsulating film 30 is similar to the double-sided tape, and has adhesiveness on both sides, and the end face encapsulating film 30 has the functions of drying and blocking moisture and oxygen.
  • the step 3 further includes: forming a first inorganic package frame 13 on a side of the first substrate 11 on which the first OLED display device 12 is disposed on the periphery of the end face package film 30, corresponding to the The first inorganic package frame 13 is formed on the side of the second substrate 21 on which the second OLED display device 22 is disposed, and is formed on the first or second inorganic package frames 13 and 23.
  • the sealant 31 is applied.
  • the material of the first and second inorganic package frames 13 and 23 is silicon nitride.
  • Step 4 The first substrate 11 and the second substrate 12 are paired and pressed, so that the first and second OLED display devices 12 and 22 are oppositely disposed, so that the end surface encapsulation film 30 completely covers the second surface.
  • the OLED display device 22 pastes the first and second substrates 11, 21 together through the end face encapsulating film 30, and encapsulates the first and second OLED display devices 12, 22.
  • step 4 further includes curing the sealant 31, and bonding the first and second inorganic package frames 13, 23 together through the plastic frame 31.
  • the double-sided OLED display device produced by the method the first and second OLED display devices 12 and 22 are both bottom-emitting OLED display devices, which are disposed opposite to each other, respectively facing the first and second substrates 11, 21 light.
  • the light emitted by the first OLED display device 12 is independently displayed on the screen through the first substrate 11, and the light emitted by the second OLED display device 22 is independently displayed on the screen through the second substrate 21, thereby
  • the first and second OLED display devices 12 and 22 can work independently of each other to display different pictures, thereby achieving independent effects on both sides. Light, display function.
  • the end face encapsulating film 30 sticks the first and second substrates 11 and 21 together, and encapsulates the first and second OLED display devices 12 and 22 so that the first and second substrates 11 and 21 have compressive properties. It is not easy to be damaged by external force, and the double-sided OLED display device has a simple structure, is light and thin, and is easy to manufacture without increasing the manufacturing cost.
  • the internal structures of the first and second inorganic encapsulating frames 13 and 23 are dense, and the water vapor cannot penetrate. Only the sealant 31 can pass a small amount of water vapor and oxygen, thereby being more effective in preventing moisture and oxygen from invading.
  • the two OLED display devices 12, 22 are better packaged and protected.
  • the double-sided OLED display device of the present invention is configured to respectively provide first and second OLED display devices on opposite first and second substrates, so that the two are respectively illuminated toward the first and second substrates.
  • the first and second substrates are pasted together by providing an end face encapsulating film, and the first and second OLED display devices are packaged, which can realize the illumination and display functions independently of each other and have a simple structure. Lightweight, easy to manufacture, without increasing the cost of production.
  • the method for fabricating the double-sided OLED display device of the present invention is characterized in that the first and second OLED display devices are respectively prepared on the opposite first and second substrates, so that the two light are respectively emitted toward the first and second substrates.
  • the first and second substrates are pasted together, and the first and second OLED display devices are packaged, so that the method is simple in process, low in production cost, high in efficiency, and double-sided by the method
  • the OLED display device has a simple structure, is light and thin, and can realize a light-emitting and display function that does not affect each other on both sides.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种双面OLED显示装置及其制作方法，该双面OLED显示装置包括：相对设置的第一、第二基板(11、21)、设于第一基板(11)面向第二基板(21)一侧的第一OLED显示器件(12)、设于第二基板(21)面向第一基板(11)一侧的第二OLED显示器件(22)、及设于第一、第二基板(11、21)之间并完全覆盖所述第一、第二OLED显示器件(12、22)的端面封装薄膜(30)；所述第一、第二OLED显示器件(12、22)均为底发光型OLED显示器件，二者相对设置，分别朝向第一、第二基板(11、21)发光；所述端面封装薄膜(30)将第一、第二基板(11、21)粘贴在一起，并对第一、第二OLED显示器件(12、22)进行封装。该双面OLED装置结构简单、轻薄、易于制作，制作成本低。

Description

双面OLED显示装置及其制作方法 技术领域
本发明涉及显示技术领域，尤其涉及一种双面OLED显示装置及其制作方法。
背景技术
平板显示器件具有机身薄、省电、无辐射等众多优点，得到了广泛的应用。现有的平板显示器件主要包括液晶显示器件(Liquid Crystal Display，LCD)及有机电致发光显示器件(Organic Light Emitting Display，OLED)。
OLED显示器件由于同时具备自发光，不需背光源、对比度高、厚度薄、视角广、反应速度快、可用于挠曲性面板、使用温度范围广、构造及制程较简单等优异特性，一致被公认为是下一代显示的主流技术，得到了各大显示器厂家的青睐。
OLED显示器件通常包括：基板、设于基板上的阳极、设于阳极上的空穴注入层、设于空穴注入层上的空穴传输层、设于空穴传输层上的发光层、设于发光层上的电子传输层、设于电子传输层上的电子注入层、及设于电子注入层上的阴极，其发光机理为半导体材料和有机发光材料在电场驱动下，通过载流子注入和复合导致发光。具体的，OLED显示器件通常采用ITO电极和金属电极分别作为阳极和阴极，在一定电压驱动下，电子和空穴分别从阴极和阳极注入到电子注入层和空穴注入层，电子和空穴分别经过电子传输层和空穴传输层迁移到发光层，并在发光层中相遇，形成激子并使发光分子激发，后者经过辐射弛豫而发出可见光。
随着显示技术的发展，消费者除了要求显示装置具备反应速度快、分辨率高、画质细腻的特点外，也追求功能及显示模式上的突破。因此，双面OLED显示装置应运而生，双面OLED显示装置除了具备普通OLED显示装置的各种特性外，还可以延伸画面空间，快速切换与处理多个显示画面，在广告宣传与便携式电子产品中有巨大的应用空间。目前的双面OLED显示装置大多只是将两个独立的OLED显示器件进行背靠背组装，以实现双面显示，结构比较厚重，工艺相对复杂，制作成本较高，不符合消费者期望的轻薄与高性价比的要求。
发明内容
本发明的目的在于提供一种双面OLED显示装置，既能实现双面独立互不影响的发光、显示功能，又具备结构简单、轻薄、易于制作，不增加制作成本的优点。
本发明的目的还在于提供一种双面OLED显示装置的制作方法，该方法工艺简便，制作成本低、效率高，由该方法制作的双面OLED显示装置结构简单、轻薄，能够实现双面独立互不影响的发光、显示功能。
为实现上述目的，本发明首先提供一种双面OLED显示装置，包括：第一基板、与所述第一基板相对设置的第二基板、设于所述第一基板面向第二基板一侧的第一OLED显示器件、设于所述第二基板面向第一基板一侧的第二OLED显示器件、及位于所述第一、第二基板之间并完全覆盖所述第一、第二OLED显示器件的端面封装薄膜；
其中，所述第一、第二OLED显示器件均为底发光型OLED显示器件，二者相对设置，分别朝向所述第一、第二基板发光；
所述端面封装薄膜将第一、第二基板粘贴在一起，并对第一、第二OLED显示器件进行封装。
所述第一OLED显示器件包括设于所述第一基板面向第二基板一侧的透明阳极、反射阴极、及设于所述透明阳极与反射阴极之间的有机发光层；所述第二OLED显示器件包括设于所述第二基板面向第一基板一侧的透明阳极、反射阴极、及设于所述透明阳极与反射阴极之间的有机发光层。
所述第一基板为TFT基板，所述第二基板为TFT基板。
所述双面OLED显示装置还包括于所述端面封装薄膜的外围在所述第一基板面向第二基板一侧设置的第一无机物封装框、于所述端面封装薄膜的外围在所述第二基板面向第一基板一侧设置的第二无机物封装框、及设于所述第一、第二无机封装框之间的框胶。
所述第一、第二无机封装框的材料为氮化硅。
本发明还提供一种双面OLED显示装置的制作方法，包括如下步骤：
步骤1、提供一第一基板，在所述第一基板一侧制备第一OLED显示器件；
所述第一OLED显示器件为底发光型OLED显示器件，朝向所述第一基板发光；
步骤2、提供一第二基板，在所述第二基板一侧制备第二OLED显示器件；
所述第二OLED显示器件为底发光型OLED显示器件，朝向所述第二基板发光；
步骤3、在所述第一基板上贴敷端面封装薄膜，并使所述端面封装薄膜完全覆盖第一OLED显示器件；
步骤4、将所述第一基板与第二基板进行对组、压合，使所述第一、第二OLED显示器件相对设置，使所述端面封装薄膜完全覆盖第二OLED显示器件，通过所述端面封装薄膜将第一、第二基板粘贴在一起，并对第一、第二OLED显示器件进行封装。
所述步骤1包括：在所述第一基板的一侧依次制备透明阳极、有机发光层、及反射阴极；所述步骤2包括：在所述第二基板的一侧依次制备透明阳极、有机发光层、及反射阴极。
所述步骤1中的第一基板和所述步骤2中的第二基板均为TFT基板。
所述步骤3还包括：于所述端面封装薄膜的外围在所述第一基板设置有第一OLED显示器件的一侧制作第一无机物封装框，对应于所述第一无机物封装框在所述第二基板设置有第二OLED显示器件的一侧制作第二无机物封装框，并在所述第一或第二无机封装框上涂覆框胶。
所述步骤4还包括固化框胶，通过所述胶框将第一、第二无机物封装框粘结在一起；
所述第一、第二无机封装框的材料为氮化硅。
本发明还提供一种双面OLED显示装置，包括：第一基板、与所述第一基板相对设置的第二基板、设于所述第一基板面向第二基板一侧的第一OLED显示器件、设于所述第二基板面向第一基板一侧的第二OLED显示器件、及设于所述第一、第二基板之间并完全覆盖所述第一、第二OLED显示器件的端面封装薄膜；
其中，所述第一、第二OLED显示器件均为底发光型OLED显示器件，二者相对设置，分别朝向所述第一、第二基板发光；
所述端面封装薄膜将第一、第二基板粘贴在一起，并对第一、第二OLED显示器件进行封装；
其中，所述第一OLED显示器件包括设于所述第一基板面向第二基板一侧的透明阳极、反射阴极、及设于所述透明阳极与反射阴极之间的有机发光层；所述第二OLED显示器包括设于所述第二基板面向第一基板一侧的透明阳极、反射阴极、及设于所述透明阳极与反射阴极之间的有机发光层；
其中，所述第一基板为TFT基板，所述第二基板为TFT基板；
其中，还包括于所述端面封装薄膜的外围在所述第一基板面向第二基板一侧设置的第一无机物封装框、于所述端面封装薄膜的外围在所述第二 基板面向第一基板一侧设置的第二无机物封装框、及设于所述第一、第二无机封装框之间的框胶。
本发明的有益效果：本发明提供的一种双面OLED显示装置，通过在相对的第一、第二基板上分别设置第一、第二OLED显示器件，使二者分别朝向所述第一、第二基板发光，通过设置端面封装薄膜将第一、第二基板粘贴在一起，并对第一、第二OLED显示器件进行封装，既能实现双面独立互不影响的发光、显示功能，又具备结构简单、轻薄、易于制作，不增加制作成本的优点。本发明提供的一种双面OLED显示装置的制作方法，通过在相对的第一、第二基板上分别制备第一、第二OLED显示器件，使二者分别朝向所述第一、第二基板发光，通过贴敷端面封装薄膜将第一、第二基板粘贴在一起，并对第一、第二OLED显示器件进行封装，使该方法的工艺简便，制作成本低、效率高，由该方法制作的双面OLED显示装置结构简单、轻薄，能够实现双面独立互不影响的发光、显示功能。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为本发明双面OLED显示装置的剖面结构示意图；
图2为本发明双面OLED显示装置的制作方法的流程图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图1，本发明首先提供一种双面OLED显示装置，包括：第一基板11、与所述第一基板11相对设置的第二基板21、设于所述第一基板11面向第二基板21一侧的第一OLED显示器件12、设于所述第二基板21面向第一基板11一侧的第二OLED显示器件22、及设于所述第一、第二基板11、21之间并完全覆盖所述第一、第二OLED显示器件12、22的端面封装(Face Seal)薄膜30。其中，所述第一、第二OLED显示器件12、22均为底发光型OLED显示器件，二者相对设置，分别朝向所述第一、第二 基板11、21发光。所述第一OLED显示器件12发出的光透过所述第一基板11独立进行画面显示，所述第二OLED显示器件22发出的光透过所述第二基板21独立进行画面显示，从而所述第一、第二OLED显示器件12、22能够彼此独立工作，显示不同的画面，实现双面独立互不影响的发光、显示功能。
所述端面封装薄膜30类似于双面胶，两面均具有粘性，且所述端面封装薄膜30同时具有干燥及阻隔水汽、氧气的功能，通过该端面封装薄膜30将第一、第二基板11、21粘贴在一起，并对第一、第二OLED显示器件12、22进行封装。相比于惯用的通过在两基板的四周边缘设置框胶来对基板进行粘贴与封装，由于所述端面封装薄膜30与第一、第二基板11、21始终保持实体接触，使得第一、第二基板11、21的抗压性能提高，不易被外力损坏。更为重要的是，设置所述端面封装薄膜30将第一、第二基板11、21粘贴在一起，并对第一、第二OLED显示器件12、22进行封装，使得双面OLED显示装置的结构简单、轻薄、易于制作，不增加制作成本。
具体的，所述第一、第二基板11、21均为透明的TFT基板。
所述第一OLED显示器件12为底发光型OLED显示器件，进一步包括设于所述第一基板11面向第二基板21一侧的透明阳极、反射阴极、及设于所述透明阳极与反射阴极之间的有机发光层；所述第二OLED显示器件22包括设于所述第二基板21面向第一基板11一侧的透明阳极、反射阴极、及设于所述透明阳极与反射阴极之间的有机发光层。值得一提的是，两电极引线由OLED显示器件的同侧相对引出。
此外，为了进一步提高封装效果，所述双面OLED显示装置还包括于所述端面封装薄膜30的外围在所述第一基板11面向第二基板21一侧设置的第一无机物封装框13、于所述端面封装薄膜30的外围在所述第二基板21面向第一基板11一侧设置的第二无机物封装框23、及设于所述第一、第二无机封装框13、23之间的框胶31。进一步的，所述第一、第二无机封装框13、23的材料为氮化硅(SiNx)。所述第一、第二无机封装框13、23的内部组织致密，水汽无法穿透，仅框胶31可以通过少量水汽、氧气，从而能够更加有效的防止水汽、氧气侵入，对第一、第二OLED显示器件12、22进行更好的封装与保护。
请参阅图2，同时结合图1，本发明还提供一种双面OLED显示装置的制作方法，包括如下步骤：
步骤1、提供一第一基板11，在所述第一基板11一侧制备第一OLED显示器件12。
所述第一基板11为透明的TFT基板。所述第一OLED显示器件12为底发光型OLED显示器件，朝向所述第一基板11发光。
具体的，所述步骤1包括：在所述第一基板11的一侧依次制备透明阳极、有机发光层、及反射阴极，从而制得所述第一OLED显示器件12。
步骤2、提供一第二基板21，在所述第二基板21一侧制备第二OLED显示器件22。
所述第二基板21为透明的TFT基板。所述第二OLED显示器件22为底发光型OLED显示器件，朝向所述第二基板21发光。
具体的，所述步骤2包括：在所述第二基板21的一侧依次制备透明阳极、有机发光层、及反射阴极，从而制得所述第二OLED显示器件22；将两电极引线由OLED显示器件的同侧相对引出。
步骤3、在所述第一基板11上贴敷端面封装薄膜30，并使所述端面封装薄膜30完全覆盖第一OLED显示器件12。
所述端面封装薄膜30类似于双面胶，两面均具有粘性，且所述端面封装薄膜30同时具有干燥及阻隔水汽、氧气的功能。
进一步的，所述步骤3还包括：于所述端面封装薄膜30的外围在所述第一基板11设置有第一OLED显示器件12的一侧制作第一无机物封装框13，对应于所述第一无机物封装框13在所述第二基板21设置有第二OLED显示器件22的一侧制作第二无机物封装框23，并在所述第一或第二无机封装框13、23上涂覆框胶31。
所述第一、第二无机封装框13、23的材料为氮化硅。
步骤4、将所述第一基板11与第二基板12进行对组、压合，使所述第一、第二OLED显示器件12、22相对设置，使所述端面封装薄膜30完全覆盖第二OLED显示器件22，通过所述端面封装薄膜30将第一、第二基板11、21粘贴在一起，并对第一、第二OLED显示器件12、22进行封装。
进一步的，所述步骤4还包括固化框胶31，通过所述胶框31将第一、第二无机物封装框13、23粘结在一起。
至此，完成双面OLED显示装置的制作。
通过该方法制得的双面OLED显示装置，其第一、第二OLED显示器件12、22均为底发光型OLED显示器件，二者相对设置，分别朝向所述第一、第二基板11、21发光。所述第一OLED显示器件12发出的光透过所述第一基板11独立进行画面显示，所述第二OLED显示器件22发出的光透过所述第二基板21独立进行画面显示，从而所述第一、第二OLED显示器件12、22能够彼此独立工作，显示不同的画面，实现双面独立互不影响 的发光、显示功能。所述端面封装薄膜30将第一、第二基板11、21粘贴在一起，并对第一、第二OLED显示器件12、22进行封装，使得第一、第二基板11、21的抗压性能提高，不易被外力损坏，更使得双面OLED显示装置的结构简单、轻薄、易于制作，不增加制作成本。所述第一、第二无机封装框13、23的内部组织致密，水汽无法穿透，仅框胶31可以通过少量水汽、氧气，从而能够更加有效的防止水汽、氧气侵入，对第一、第二OLED显示器件12、22进行更好的封装与保护。
综上所述，本发明的双面OLED显示装置，通过在相对的第一、第二基板上分别设置第一、第二OLED显示器件，使二者分别朝向所述第一、第二基板发光，通过设置端面封装薄膜将第一、第二基板粘贴在一起，并对第一、第二OLED显示器件进行封装，既能实现双面独立互不影响的发光、显示功能，又具备结构简单、轻薄、易于制作，不增加制作成本的优点。本发明的双面OLED显示装置的制作方法，通过在相对的第一、第二基板上分别制备第一、第二OLED显示器件，使二者分别朝向所述第一、第二基板发光，通过贴敷端面封装薄膜将第一、第二基板粘贴在一起，并对第一、第二OLED显示器件进行封装，使该方法的工艺简便，制作成本低、效率高，由该方法制作的双面OLED显示装置结构简单、轻薄，能够实现双面独立互不影响的发光、显示功能。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (12)

  1. 一种双面OLED显示装置，包括：第一基板、与所述第一基板相对设置的第二基板、设于所述第一基板面向第二基板一侧的第一OLED显示器件、设于所述第二基板面向第一基板一侧的第二OLED显示器件、及设于所述第一、第二基板之间并完全覆盖所述第一、第二OLED显示器件的端面封装薄膜；
    其中，所述第一、第二OLED显示器件均为底发光型OLED显示器件，二者相对设置，分别朝向所述第一、第二基板发光；
    所述端面封装薄膜将第一、第二基板粘贴在一起，并对第一、第二OLED显示器件进行封装。
  2. 如权利要求1所述的双面OLED显示装置，其中，所述第一OLED显示器件包括设于所述第一基板面向第二基板一侧的透明阳极、反射阴极、及设于所述透明阳极与反射阴极之间的有机发光层；所述第二OLED显示器包括设于所述第二基板面向第一基板一侧的透明阳极、反射阴极、及设于所述透明阳极与反射阴极之间的有机发光层。
  3. 如权利要求1所述的双面OLED显示装置，其中，所述第一基板为TFT基板，所述第二基板为TFT基板。
  4. 如权利要求1所述的双面OLED显示装置，其中，还包括于所述端面封装薄膜的外围在所述第一基板面向第二基板一侧设置的第一无机物封装框、于所述端面封装薄膜的外围在所述第二基板面向第一基板一侧设置的第二无机物封装框、及设于所述第一、第二无机封装框之间的框胶。
  5. 如权利要求4所述的双面OLED显示装置，其中，所述第一、第二无机封装框的材料为氮化硅。
  6. 一种双面OLED显示装置的制作方法，包括如下步骤：
    步骤1、提供一第一基板，在所述第一基板一侧制备第一OLED显示器件；
    所述第一OLED显示器件为底发光型OLED显示器件，朝向所述第一基板发光；
    步骤2、提供一第二基板，在所述第二基板一侧制备第二OLED显示器件；
    所述第二OLED显示器件为底发光型OLED显示器件，朝向所述第二基板发光；
    步骤3、在所述第一基板上贴敷端面封装薄膜，并使所述端面封装薄膜完全覆盖第一OLED显示器件；
    步骤4、将所述第一基板与第二基板进行对组、压合，使所述第一、第二OLED显示器件相对设置，使所述端面封装薄膜完全覆盖第二OLED显示器件，通过所述端面封装薄膜将第一、第二基板粘贴在一起，并对第一、第二OLED显示器件进行封装。
  7. 如权利要求6所述的双面OLED显示装置的制作方法，其中，所述步骤1包括：在所述第一基板的一侧依次制备透明阳极、有机发光层、及反射阴极；所述步骤2包括：在所述第二基板的一侧依次制备透明阳极、有机发光层、及反射阴极。
  8. 如权利要求6所述的双面OLED显示装置的制作方法，其中，所述步骤1中的第一基板和所述步骤2中的第二基板均为TFT基板。
  9. 如权利要求6所述的双面OLED显示装置的制作方法，其中，所述步骤3还包括：于所述端面封装薄膜的外围在所述第一基板设置有第一OLED显示器件的一侧制作第一无机物封装框，对应于所述第一无机物封装框在所述第二基板设置有第二OLED显示器件的一侧制作第二无机物封装框，并在所述第一或第二无机封装框上涂覆框胶。
  10. 如权利要求9所述的双面OLED显示装置的制作方法，其中，所述步骤4还包括固化框胶，通过所述胶框将第一、第二无机物封装框粘结在一起；
    所述第一、第二无机封装框的材料为氮化硅。
  11. 一种双面OLED显示装置，包括：第一基板、与所述第一基板相对设置的第二基板、设于所述第一基板面向第二基板一侧的第一OLED显示器件、设于所述第二基板面向第一基板一侧的第二OLED显示器件、及设于所述第一、第二基板之间并完全覆盖所述第一、第二OLED显示器件的端面封装薄膜；
    其中，所述第一、第二OLED显示器件均为底发光型OLED显示器件，二者相对设置，分别朝向所述第一、第二基板发光；
    所述端面封装薄膜将第一、第二基板粘贴在一起，并对第一、第二OLED显示器件进行封装；
    其中，所述第一OLED显示器件包括设于所述第一基板面向第二基板一侧的透明阳极、反射阴极、及设于所述透明阳极与反射阴极之间的有机发光层；所述第二OLED显示器包括设于所述第二基板面向第一基板一侧的透明阳极、反射阴极、及设于所述透明阳极与反射阴极之间的有机发光 层；
    其中，所述第一基板为TFT基板，所述第二基板为TFT基板；
    其中，还包括于所述端面封装薄膜的外围在所述第一基板面向第二基板一侧设置的第一无机物封装框、于所述端面封装薄膜的外围在所述第二基板面向第一基板一侧设置的第二无机物封装框、及设于所述第一、第二无机封装框之间的框胶。
  12. 如权利要求11所述的双面OLED显示装置，其中，所述第一、第二无机封装框的材料为氮化硅。
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