WO2016086537A1 - Oled封装结构及其封装方法 - Google Patents

Oled封装结构及其封装方法 Download PDF

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Publication number
WO2016086537A1
WO2016086537A1 PCT/CN2015/072485 CN2015072485W WO2016086537A1 WO 2016086537 A1 WO2016086537 A1 WO 2016086537A1 CN 2015072485 W CN2015072485 W CN 2015072485W WO 2016086537 A1 WO2016086537 A1 WO 2016086537A1
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Prior art keywords
substrate
oled
sealant
package cover
desiccant
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PCT/CN2015/072485
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English (en)
French (fr)
Inventor
曾维静
王宜凡
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/424,930 priority Critical patent/US20160343977A1/en
Publication of WO2016086537A1 publication Critical patent/WO2016086537A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations

Definitions

  • the present invention relates to the field of display technologies, and in particular, to an OLED package structure and a packaging method thereof.
  • OLED is an Organic Light-Emitting Diode, which has the characteristics of self-illumination, high brightness, wide viewing angle, high contrast, flexibility, low energy consumption, etc., and has received extensive attention as a new generation display mode. It has gradually replaced traditional LCD monitors and is widely used in mobile phone screens, computer monitors, and full-color TVs. OLED display technology is different from traditional liquid crystal display technology. It does not require a backlight. It uses a very thin coating of organic materials and a glass substrate. When there is current, these organic materials will emit light. However, since organic materials are easily reacted with water vapor or oxygen, as an organic material-based display device, the OLED display has a very high requirement for packaging.
  • UV curing sealant packaging glass powder laser sealing (laser sealing), face seal (face seal), frame glue and desiccant filling package (dam and fill), film packaging and so on.
  • UV curing technology is the earliest and most commonly used technology for LCD/OLED packaging.
  • UV glue is an organic material, its molecular gap is large after curing, and water vapor and oxygen are more likely to pass through the medium to reach the inner sealing area. Therefore, it is more suitable for applications that are less sensitive to moisture and oxygen, such as LCDs.
  • the form of the sealant and the desiccant filling package is more suitable for the package of the large-sized panel.
  • the desiccant fills the entire panel to protect the OLED from water and oxygen on the one hand; on the other hand, the desiccant fills the inside of the package cover and the TFT substrate in the form of surface contact to form a high-strength mechanical unit. And superior to the same thickness of ultraviolet (UV) cured sealant package panels relative to the load used daily. That is to say, under a given allowable mechanical load, a large-sized panel package can be realized by filling the package with a sealant and a desiccant.
  • UV ultraviolet
  • the glass powder is made into a certain viscosity, coated on the packaging glass, heated to remove the solvent, and then bonded to the glass to be packaged, and the glass powder is instantaneously burned and melted by a laser to thereby form two flat glass plates. Bonded together.
  • Glass powder laser sealing technology is very resistant to water vapor and oxygen because it is an inorganic packaging medium. Particularly suitable for OLED technology sensitive to water vapor and oxygen. But glass powder laser sealing technology There is a gap in the panel. As the panel size increases, the panel is susceptible to bending and affects the display effect, and is easily broken. Therefore, the package method is not suitable for a large-sized panel.
  • the object of the present invention is to provide an OLED package structure, which uses a sealant and a frit glass for packaging, and at the same time fills the sealant with a desiccant filler, so that the package structure has good sealing and mechanical strength, and the internal OLED device
  • the surface forms a metal oxide layer to avoid problems such as uneven brightness of the display caused by the desiccant filler, especially the liquid desiccant, which corrodes the light-emitting element.
  • Another object of the present invention is to provide an OLED packaging method, which combines the sealant and the desiccant to fill the package while using the frit glass to encapsulate the area of the package cover and the substrate to avoid the package structure. Bending or crushing, while improving the sealing property, further improving the mechanical strength, and forming a metal oxide layer on the surface of the internal OLED device to prevent the brightness of the display caused by the corrosion of the drying agent filler, especially the liquid desiccant, to the light-emitting element. Even and so on.
  • the present invention provides an OLED package structure, including a package cover, a substrate disposed opposite the package cover, and an OLED device disposed between the package cover and the substrate and disposed on the substrate.
  • a sealant disposed on the periphery of the OLED device for bonding the package cover and the substrate, filling an inner space surrounded by the sealant between the package cover and the substrate, and covering the desiccant of the OLED device a filler, and a frit glass disposed on the periphery of the sealant to bond the package cover and the substrate.
  • a metal oxide layer formed on the surface of the OLED device is also included.
  • the package cover and the substrate are both glass substrates, and a recess is disposed on the package cover corresponding to the OLED device, and an inner space of the recess is adapted to the size of the OLED device.
  • the sealant is a UV sealant, and a spacing between the sealant and the frit glass is greater than or equal to 500 um.
  • the desiccant filler is a liquid desiccant or a curable desiccant, and the liquid desiccant is an aluminum-containing polymer.
  • the invention provides an OLED packaging method, comprising the following steps:
  • Step 1 providing a package cover and a substrate
  • An OLED device is disposed on the substrate, and a recess is disposed on the package cover corresponding to the OLED device, and an inner space of the recess is adapted to a size of the OLED device;
  • Step 2 forming a metal oxide layer on the surface of the OLED device
  • Step 3 applying a ring of glass glue on the edge of the opening side of the groove on the package cover plate, and forming a frit glass by high temperature pre-sintering;
  • Step 4 applying a ring of sealant on the inside of the frit glass and outside the groove on the package cover;
  • Step 5 applying a desiccant filler on the package cover in an inner space surrounded by the sealant;
  • Step 6 the package cover plate and the substrate are relatively adhered under vacuum conditions, and the frame sealant is cured by UV light irradiation;
  • Step 7 Melting the frit glass by laser irradiation, and bonding with the package cover and the substrate, thereby completing encapsulation of the package cover to the substrate.
  • the cathode of the OLED device is surface-treated by ion bombardment in the step 2 to form the metal oxide layer.
  • the glass glue is coated on the package cover by screen printing or dispensing.
  • the sealant in the step 4 is a UV sealant, and the distance between the sealant and the frit glass is greater than or equal to 500 um.
  • the desiccant filling in the step 5 is a liquid desiccant or a curable desiccant, the liquid desiccant is an aluminum-containing polymer, and the desiccant filler completely fills between the package cover and the substrate An internal space enclosed by the frame glue.
  • the present invention also provides an OLED package structure, including a package cover, a substrate disposed opposite the package cover, an OLED device disposed between the package cover and the substrate, and disposed on the substrate, disposed at the The OLED device peripherally bonds the sealant of the package cover and the substrate, fills an inner space surrounded by the sealant between the package cover and the substrate, and covers the desiccant filler of the OLED device, and a frit glass for bonding the package cover and the substrate to the periphery of the sealant;
  • the package cover and the substrate are both glass substrates, and a recess is disposed on the package cover corresponding to the OLED device, and an inner space of the recess is adapted to the size of the OLED device.
  • the invention has the beneficial effects that the OLED package structure of the invention is packaged by using a sealant and a frit glass, and the inside of the sealant is filled with a desiccant filler, which has good sealing property and mechanical strength, and is on the surface of the internal OLED device.
  • the formation of the metal oxide layer avoids problems such as uneven brightness of the display caused by the corrosion of the light-emitting element by the desiccant filler, especially the liquid desiccant.
  • the OLED packaging method of the present invention is combined with a frame by using a frit glass
  • the glue and desiccant fill the package to increase the bonding area between the package cover and the substrate to avoid bending or breaking of the package structure, improve the sealing performance, further improve the mechanical strength, and form metal oxide on the surface of the internal OLED device.
  • the layer of matter avoids problems such as uneven brightness of the display caused by the desiccant filler, especially the liquid desiccant corroding the light-emitting element.
  • FIG. 1 is a schematic view of an OLED package structure of the present invention
  • FIG. 2 is a schematic flow chart of a method for packaging an OLED according to the present invention.
  • step 1 of the OLED packaging method of the present invention is a schematic diagram of step 1 of the OLED packaging method of the present invention.
  • step 2 of the OLED packaging method of the present invention is a schematic diagram of step 2 of the OLED packaging method of the present invention.
  • FIG. 5 is a schematic diagram of step 3 of the OLED packaging method of the present invention.
  • step 4 of the OLED packaging method of the present invention is a schematic diagram of step 4 of the OLED packaging method of the present invention.
  • step 5 of the OLED packaging method of the present invention is a schematic diagram of step 5 of the OLED packaging method of the present invention.
  • step 6 of the OLED packaging method of the present invention is a schematic diagram of step 6 of the OLED packaging method of the present invention.
  • FIG. 9 is a schematic diagram of step 7 of the OLED packaging method of the present invention.
  • the present invention provides an OLED package structure, including a package cover 1 , a substrate 2 disposed opposite the package cover 1 , and a substrate 2 disposed between the package cover 1 and the substrate 2 .
  • the package cover 1 and the substrate 2 are both glass substrates.
  • a recess 10 is disposed on the package cover 1 corresponding to the OLED device 21, and an internal space of the recess 10 is adapted to the size of the OLED device 21.
  • the sealant 12 is a UV sealant.
  • the spacing between the sealant 12 and the frit glass 11 is greater than or equal to 500 um.
  • the desiccant filler 13 is a liquid desiccant or a curable desiccant.
  • the desiccant filler 13 completely fills the inner space enclosed by the sealant 12 between the package cover 1 and the substrate 2 to achieve the effect of blocking moisture.
  • the sealant and the frit glass are used for encapsulation, and the desiccant filler is filled inside the sealant, which has good sealing property and mechanical strength, and a metal oxide layer is formed on the surface of the internal OLED device.
  • the problem that the desiccant filler, especially the liquid desiccant, causes unevenness in brightness of the display caused by corrosion of the light-emitting element is avoided.
  • the present invention further provides an OLED packaging method, including the following steps:
  • Step 1 As shown in FIG. 3, a package cover 1 and a substrate 2 are provided.
  • an OLED device 21 is disposed on the substrate 2, and a recess 10 is disposed on the package cover 1 corresponding to the OLED device 21.
  • the internal space of the recess 10 and the OLED device 21 are The size is adapted.
  • Step 2 As shown in FIG. 4, a metal oxide layer 22 is formed on the surface of the OLED device 21.
  • the cathode of the OLED device 21 is surface-treated by ion bombardment to form the metal oxide layer 22.
  • the metal oxide layer 22 can effectively avoid problems such as uneven brightness of the display caused by corrosion of the light-emitting element by the liquid desiccant.
  • Step 3 as shown in FIG. 5, a ring of glass glue is applied to the package cover 1 at the edge of the opening side of the groove 10, and the frit glass 11 is formed by high temperature pre-sintering.
  • the glass glue is applied to the package cover 1 by screen printing or dispensing.
  • Step 4 as shown in FIG. 6, a ring seal 12 is coated on the inside of the frit glass 11 and outside the groove 10 on the package cover 1.
  • the sealant 12 is a UV sealant.
  • the spacing between the sealant 12 and the frit glass 11 is greater than or equal to 500 um.
  • Step 5 as shown in FIG. 7, a desiccant filler 13 is applied to the inner space enclosed by the sealant 12 on the package cover 1.
  • the desiccant filler 13 is a liquid desiccant or a curable desiccant.
  • the inner space enclosed by the glue 12 is used to block the effect of water vapor.
  • Step 6 as shown in FIG. 8, the package cover 1 and the substrate 2 are relatively attached under vacuum conditions.
  • the frame seal 12 is cured by UV light irradiation.
  • Step 7 as shown in FIG. 9, the frit glass 11 is melted by laser irradiation, and bonded to the package cover 1 and the substrate 2, thereby completing the encapsulation of the substrate 2 by the package cover 1.
  • the package structure of the packaged OLED is as shown in FIG. 1 .
  • the sealing glass is used for encapsulation, and the sealing material and the desiccant are used to fill the package, thereby increasing the bonding area between the package cover and the substrate to avoid bending or breaking of the package structure, and improving the sealing property.
  • the mechanical strength is further improved, and a metal oxide layer is formed on the surface of the internal OLED device to avoid problems such as uneven brightness of the display caused by the corrosion of the drying agent filler, especially the liquid desiccant.
  • the OLED package structure of the present invention is sealed by using a sealant and a frit glass, and the inside of the sealant is filled with a desiccant filler, which has good sealing property and mechanical strength, and is formed on the surface of the internal OLED device.
  • the metal oxide layer avoids the problem that the desiccant filler, especially the liquid desiccant, causes uneven brightness of the display caused by corrosion of the light-emitting element.
  • the OLED packaging method of the invention combines the sealant and the desiccant to fill the package while using the frit glass to encapsulate the area of the package cover and the substrate to avoid bending or breaking of the package structure, and improving the sealing.
  • the mechanical strength is further improved, and a metal oxide layer is formed on the surface of the internal OLED device to avoid problems such as uneven brightness of the display caused by the corrosion of the drying agent filler, especially the liquid desiccant.

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Abstract

一种OLED封装结构及其封装方法，其结构包括封装盖板（1），与封装盖板（1）相对设置的基板（2），位于封装盖板（1）与基板（2）之间且设于基板（2）上的OLED器件（21），形成于OLED器件（21）表面的金属氧化物层（22），设于OLED器件外围粘结封装盖板（1）与基板（2）的框胶（12），填充封装盖板（1）与基板（2）之间由胶框（12）围成的内部空间并覆盖OLED器件（21）的干燥剂填充物（13），及设于胶框（12）外围粘结封装盖板（1）与基板（2）的熔接玻璃（11）。通过使用胶框（12）与熔接玻璃（11）进行封装，同时在胶框（12）内部填充干燥剂填充物（13），使封装结构具有良好的密封性与机械强度，并在内部OLED器件（21）表面形成金属氧化物层（22），以避免干燥剂填充物（13）尤其是液态干燥剂对发光元件腐蚀而产生的显示器亮度不均匀等问题。

Description

OLED封装结构及其封装方法 技术领域
本发明涉及显示技术领域，尤其涉及一种OLED封装结构及其封装方法。
背景技术
OLED即有机发光二极管(Organic Light-Emitting Diode)，具备自发光、高亮度、宽视角、高对比度、可挠曲、低能耗等特性，因此受到广泛的关注，并作为新一代的显示方式，已开始逐渐取代传统液晶显示器，被广泛应用在手机屏幕、电脑显示器、全彩电视等。OLED显示技术与传统的液晶显示技术不同，无需背光灯，采用非常薄的有机材料涂层和玻璃基板，当有电流通过时，这些有机材料就会发光。但是由于有机材料易与水汽或氧气反应，作为基于有机材料的显示设备，OLED显示屏对封装的要求非常高。
目前常用的封装技术有：紫外光(UV)固化框胶封装，玻璃粉末镭射封装(laser sealing)，面封装(face seal)，框胶及干燥剂填充封装(dam and fill)，薄膜封装等。紫外光(UV)固化技术是LCD/OLED封装最早也是最常用的技术，但是由于UV胶是有机材料，其固化后分子间隙较大，水汽与氧气比较容易透过介质抵达内部密封区域。所以，其比较适合用于对水汽、氧气不太敏感的应用领域，比如LCD。而框胶及干燥剂填充封装的方式，更适合应用在大尺寸面板的封装上。干燥剂填充满整个面板，一方面可以保护OLED免于受水氧的侵入；另一方面，由于干燥剂以面接触的形式填充于封装盖板和TFT基板的内部，形成高强度的机械单元，且相对于日常使用的负荷而言优于同样厚度的紫外光(UV)固化框胶封装的面板。也就是说，在给定的允许的机械负荷下，可以用框胶及干燥剂填充封装的方式实现大尺寸的面板的封装。玻璃粉末镭射封装(laser sealing)技术是目前正在研发的新型平板玻璃封装技术，在中国大陆几乎没有相关的文献报导。它是将玻璃粉配成一定粘度的溶液，涂覆在封装玻璃上，加热除去溶剂，然后与待封装玻璃贴合，利用激光(laser)将玻璃粉瞬间烧至融化，从而将两片平板玻璃粘结在一起。玻璃粉末镭射封装(laser sealing)技术由于是无机封装介质，所以其阻止水汽与氧气的能力很强。特别适合对水汽、氧气敏感的OLED技术。但玻璃粉末镭射封装(laser sealing)技术由 于面板内存在空隙，随着面板尺寸的增大，面板易产生弯曲影响显示效果，且容易破碎，因此该封装方式并不适合大尺寸面板。
发明内容
本发明的目的在于提供一种OLED封装结构，使用框胶与熔结玻璃进行封装，同时在框胶内部填充干燥剂填充物，使封装结构具有良好的密封性与机械强度，并在内部OLED器件表面形成金属氧化物层，以避免干燥剂填充物尤其是液态干燥剂对发光元件腐蚀而产生的显示器亮度不均匀等问题。
本发明的另一目的在于提供一种OLED封装方法，在采用熔结玻璃进行封装的同时，结合框胶及干燥剂填充封装的方式，增加封装盖板与基板粘合的面积，以避免封装结构弯曲或破碎，在提高密封性的同时，进一步提高了机械强度，并在内部OLED器件表面形成金属氧化物层，以避免干燥剂填充物尤其是液态干燥剂对发光元件腐蚀而产生的显示器亮度不均匀等问题。
为实现上述目的，本发明提供一种OLED封装结构，包括封装盖板、与所述封装盖板相对设置的基板、位于所述封装盖板与基板之间且设于所述基板上的OLED器件、设于所述OLED器件外围粘结所述封装盖板与基板的框胶、填充所述封装盖板与基板之间由所述框胶围成的内部空间并覆盖所述OLED器件的干燥剂填充物、及设于所述框胶外围粘结所述封装盖板与基板的熔结玻璃。
还包括形成于所述OLED器件表面的金属氧化物层。
所述封装盖板与基板均为玻璃基板，所述封装盖板上对应所述OLED器件的位置设有一凹槽，所述凹槽的内部空间与所述OLED器件的大小相适应。
所述框胶为UV框胶，所述框胶与所述熔结玻璃的间距大于或等于500um。
所述干燥剂填充物为液态干燥剂或可固化型干燥剂，所述液态干燥剂为含铝的聚合物。
本发明提供一种OLED封装方法，包括如下步骤：
步骤1、提供封装盖板与基板；
所述基板上设有OLED器件，所述封装盖板上对应所述OLED器件的位置设有一凹槽，所述凹槽的内部空间与所述OLED器件的大小相适应；
步骤2、在所述OLED器件表面形成金属氧化物层；
步骤3、在所述封装盖板上于所述凹槽的开口一侧的边缘位置涂布一圈玻璃胶材，并通过高温预烧结形成熔结玻璃；
步骤4、在所述封装盖板上于所述熔结玻璃内侧、所述凹槽外侧涂布一圈框胶；
步骤5、在所述封装盖板上于所述框胶所围成的内部空间中涂布干燥剂填充物；
步骤6、将所述封装盖板与基板在真空条件下相对贴合，并通过UV光照射使所述框胶固化；
步骤7、通过激光照射使所述熔结玻璃熔化，并与所述封装盖板及基板相粘结，从而完成封装盖板对基板的封装。
所述步骤2中采用离子轰击对所述OLED器件的阴极进行表面处理，形成所述金属氧化物层。
所述步骤3中采用丝网印刷或点胶的方式将所述玻璃胶材涂布在封装盖板上。
所述步骤4中的框胶为UV框胶，所述框胶与所述熔结玻璃的间距大于或等于500um。
所述步骤5中的干燥剂填充物为液态干燥剂或可固化型干燥剂，所述液态干燥剂为含铝的聚合物，所述干燥剂填充物完全填充所述封装盖板与基板之间由所述框胶围成的内部空间。
本发明还提供一种OLED封装结构，包括封装盖板、与所述封装盖板相对设置的基板、位于所述封装盖板与基板之间且设于所述基板上的OLED器件、设于所述OLED器件外围粘结所述封装盖板与基板的框胶、填充所述封装盖板与基板之间由所述框胶围成的内部空间并覆盖所述OLED器件的干燥剂填充物、及设于所述框胶外围粘结所述封装盖板与基板的熔结玻璃；
其中，还包括形成于所述OLED器件表面的金属氧化物层；
其中，所述封装盖板与基板均为玻璃基板，所述封装盖板上对应所述OLED器件的位置设有一凹槽，所述凹槽的内部空间与所述OLED器件的大小相适应。
本发明的有益效果：本发明的OLED封装结构，使用框胶与熔结玻璃进行封装，同时在框胶内部填充有干燥剂填充物，具有良好的密封性与机械强度，并在内部OLED器件表面形成有金属氧化物层，避免了干燥剂填充物尤其是液态干燥剂对发光元件腐蚀而产生的显示器亮度不均匀等问题。本发明的OLED封装方法，在采用熔结玻璃进行封装的同时，结合框 胶及干燥剂填充封装的方式，增加封装盖板与基板粘合的面积，以避免封装结构弯曲或破碎，在提高密封性的同时，进一步提高了机械强度，并在内部OLED器件表面形成金属氧化物层，以避免干燥剂填充物尤其是液态干燥剂对发光元件腐蚀而产生的显示器亮度不均匀等问题。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为本发明OLED封装结构的示意图；
图2为本发明OLED封装方法的示意流程图；
图3为本发明OLED封装方法的步骤1的示意图；
图4为本发明OLED封装方法的步骤2的示意图；
图5为本发明OLED封装方法的步骤3的示意图；
图6为本发明OLED封装方法的步骤4的示意图；
图7为本发明OLED封装方法的步骤5的示意图；
图8为本发明OLED封装方法的步骤6的示意图；
图9为本发明OLED封装方法的步骤7的示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
如图1所示，本发明提供一种OLED封装结构，包括封装盖板1、与所述封装盖板1相对设置的基板2、位于所述封装盖板1与基板2之间且设于所述基板2上的OLED器件21、形成于所述OLED器件21表面的金属氧化物层22、设于所述OLED器件21外围粘结所述封装盖板1与基板2的框胶12、填充所述封装盖板1与基板2之间由所述框胶12围成的内部空间并覆盖所述OLED器件21的干燥剂填充物13、及设于所述框胶12外围粘结所述封装盖板1与基板2的熔结玻璃11。
优选的，所述封装盖板1与基板2均为玻璃基板。
具体地，所述封装盖板1上对应所述OLED器件21的位置设有一凹槽10，所述凹槽10的内部空间与所述OLED器件21的大小相适应。
所述框胶12为UV框胶，优选的，所述框胶12与所述熔结玻璃11的间距大于或等于500um。
所述干燥剂填充物13为液态干燥剂或可固化型干燥剂，优选的，所述干燥剂填充物13为液态干燥剂，所述液态干燥剂可以是含铝的聚合物，如[R-O-Al＝O]n(n≥1)等。所述干燥剂填充物13完全填充所述封装盖板1与基板2之间由所述框胶12围成的内部空间，以到达到阻挡水汽的效果。
上述OLED封装结构中，使用框胶与熔结玻璃进行封装，同时在框胶内部填充有干燥剂填充物，具有良好的密封性与机械强度，并在内部OLED器件表面形成有金属氧化物层，避免了干燥剂填充物尤其是液态干燥剂对发光元件腐蚀而产生的显示器亮度不均匀等问题。
请参阅图2，本发明还提供一种OLED封装方法，包括如下步骤：
步骤1、如图3所示，提供封装盖板1与基板2。
具体地，所述基板2上设有OLED器件21，所述封装盖板1上对应所述OLED器件21的位置设有一凹槽10，所述凹槽10的内部空间与所述OLED器件21的大小相适应。
步骤2、如图4所示，在所述OLED器件21表面形成金属氧化物层22。
具体地，采用离子轰击对所述OLED器件21的阴极进行表面处理，形成所述金属氧化物层22。所述金属氧化物层22能有效避免液态干燥剂对发光元件腐蚀而产生的显示器亮度不均匀等问题。
步骤3、如图5所示，在所述封装盖板1上于所述凹槽10的开口一侧的边缘位置涂布一圈玻璃胶材，并通过高温预烧结形成熔结玻璃11。
具体地，采用丝网印刷或点胶的方式将所述玻璃胶材涂布在封装盖板1上。
步骤4、如图6所示，在所述封装盖板1上于所述熔结玻璃11内侧、所述凹槽10外侧涂布一圈框胶12。
所述框胶12为UV框胶，优选的，所述框胶12与所述熔结玻璃11的间距大于或等于500um。
步骤5、如图7所示，在所述封装盖板1上所述框胶12所围成的内部空间中涂布干燥剂填充物13。
具体地，所述干燥剂填充物13为液态干燥剂或可固化型干燥剂，优选的，所述干燥剂填充物13为液态干燥剂，所述液态干燥剂可以是含铝的聚合物，如[R-O-Al＝O]n(n≥1)等。控制所述干燥剂填充物13涂布的量，使得封装盖板1与基板2贴合后，所述干燥剂填充物13能够完全填充所述封装盖板1与基板2之间由所述框胶12围成的内部空间，以达到阻挡水汽的效果。
步骤6、如图8所示，将所述封装盖板1与基板2在真空条件下相对贴 合，并通过UV光照射使所述框胶12固化。
步骤7、如图9所示，通过激光照射使所述熔结玻璃11熔化，并与所述封装盖板1及基板2相粘结，从而完成封装盖板1对基板2的封装。
具体地，完成封装后的OLED的封装结构如图1所示。
上述OLED封装方法中，在采用熔结玻璃进行封装的同时，结合框胶及干燥剂填充封装的方式，增加封装盖板与基板粘合的面积，以避免封装结构弯曲或破碎，在提高密封性的同时，进一步提高了机械强度，并在内部OLED器件表面形成金属氧化物层，以避免干燥剂填充物尤其是液态干燥剂对发光元件腐蚀而产生的显示器亮度不均匀等问题。
综上所述，本发明的OLED封装结构，使用框胶与熔结玻璃进行封装，同时在框胶内部填充有干燥剂填充物，具有良好的密封性与机械强度，并在内部OLED器件表面形成有金属氧化物层，避免了干燥剂填充物尤其是液态干燥剂对发光元件腐蚀而产生的显示器亮度不均匀等问题。本发明的OLED封装方法，在采用熔结玻璃进行封装的同时，结合框胶及干燥剂填充封装的方式，增加封装盖板与基板粘合的面积，以避免封装结构弯曲或破碎，在提高密封性的同时，进一步提高了机械强度，并在内部OLED器件表面形成金属氧化物层，以避免干燥剂填充物尤其是液态干燥剂对发光元件腐蚀而产生的显示器亮度不均匀等问题。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (13)

  1. 一种OLED封装结构，包括封装盖板、与所述封装盖板相对设置的基板、位于所述封装盖板与基板之间且设于所述基板上的OLED器件、设于所述OLED器件外围粘结所述封装盖板与基板的框胶、填充所述封装盖板与基板之间由所述框胶围成的内部空间并覆盖所述OLED器件的干燥剂填充物、及设于所述框胶外围粘结所述封装盖板与基板的熔结玻璃。
  2. 如权利要求1所述的OLED封装结构，其中，还包括形成于所述OLED器件表面的金属氧化物层。
  3. 如权利要求1所述的OLED封装结构，其中，所述封装盖板与基板均为玻璃基板，所述封装盖板上对应所述OLED器件的位置设有一凹槽，所述凹槽的内部空间与所述OLED器件的大小相适应。
  4. 如权利要求1所述的OLED封装结构，其中，所述框胶为UV框胶，所述框胶与所述熔结玻璃的间距大于或等于500um。
  5. 如权利要求1所述的OLED封装结构，其中，所述干燥剂填充物为液态干燥剂或可固化型干燥剂，所述液态干燥剂为含铝的聚合物。
  6. 一种OLED封装方法，包括如下步骤：
    步骤1、提供封装盖板与基板；
    所述基板上设有OLED器件，所述封装盖板上对应所述OLED器件的位置设有一凹槽，所述凹槽的内部空间与所述OLED器件的大小相适应；
    步骤2、在所述OLED器件表面形成金属氧化物层；
    步骤3、在所述封装盖板上于所述凹槽的开口一侧的边缘位置涂布一圈玻璃胶材，并通过高温预烧结形成熔结玻璃；
    步骤4、在所述封装盖板上于所述熔结玻璃内侧、所述凹槽外侧涂布一圈框胶；
    步骤5、在所述封装盖板上于所述框胶所围成的内部空间中涂布干燥剂填充物；
    步骤6、将所述封装盖板与基板在真空条件下相对贴合，并通过UV光照射使所述框胶固化；
    步骤7、通过激光照射使所述熔结玻璃熔化，并与所述封装盖板及基板相粘结，从而完成封装盖板对基板的封装。
  7. 如权利要求6所述的OLED封装方法，其中，所述步骤2中采用离子轰击对所述OLED器件的阴极进行表面处理，形成所述金属氧化物层。
  8. 如权利要求6所述的OLED封装方法，其中，所述步骤3中采用丝网印刷或点胶的方式将所述玻璃胶材涂布在封装盖板上。
  9. 如权利要求6所述的OLED封装方法，其中，所述步骤4中的框胶为UV框胶，所述框胶与所述熔结玻璃的间距大于或等于500um。
  10. 如权利要求6所述的OLED封装方法，其中，所述步骤5中的干燥剂填充物为液态干燥剂或可固化型干燥剂，所述液态干燥剂为含铝的聚合物，所述干燥剂填充物完全填充所述封装盖板与基板之间由所述框胶围成的内部空间。
  11. 一种OLED封装结构，包括封装盖板、与所述封装盖板相对设置的基板、位于所述封装盖板与基板之间且设于所述基板上的OLED器件、设于所述OLED器件外围粘结所述封装盖板与基板的框胶、填充所述封装盖板与基板之间由所述框胶围成的内部空间并覆盖所述OLED器件的干燥剂填充物、及设于所述框胶外围粘结所述封装盖板与基板的熔结玻璃；
    其中，还包括形成于所述OLED器件表面的金属氧化物层；
    其中，所述封装盖板与基板均为玻璃基板，所述封装盖板上对应所述OLED器件的位置设有一凹槽，所述凹槽的内部空间与所述OLED器件的大小相适应。
  12. 如权利要求11所述的OLED封装结构，其中，所述框胶为UV框胶，所述框胶与所述熔结玻璃的间距大于或等于500um。
  13. 如权利要求11所述的OLED封装结构，其中，所述干燥剂填充物为液态干燥剂或可固化型干燥剂，所述液态干燥剂为含铝的聚合物。
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