WO2016082381A1 - 一种减小过孔串扰的pcb板结构 - Google Patents

一种减小过孔串扰的pcb板结构 Download PDF

Info

Publication number
WO2016082381A1
WO2016082381A1 PCT/CN2015/074674 CN2015074674W WO2016082381A1 WO 2016082381 A1 WO2016082381 A1 WO 2016082381A1 CN 2015074674 W CN2015074674 W CN 2015074674W WO 2016082381 A1 WO2016082381 A1 WO 2016082381A1
Authority
WO
WIPO (PCT)
Prior art keywords
plane
planes
metal
same group
pcb structure
Prior art date
Application number
PCT/CN2015/074674
Other languages
English (en)
French (fr)
Inventor
田艺儿
Original Assignee
田艺儿
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 田艺儿 filed Critical 田艺儿
Publication of WO2016082381A1 publication Critical patent/WO2016082381A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits

Definitions

  • the utility model relates to the field of circuit boards, in particular to a PCB board structure for reducing cross-hole crosstalk of metallized holes.
  • PCB Printed Circuit Board
  • the printed circuit board is an important part of the physical manufacture of electronic products and signal transmission.
  • the structure that connects the traces of different layers plays an important role in the PCB.
  • the impedance of PTH is usually much lower than the impedance of the transmission line.
  • our usual practice is to hollow out the metal plane around the PTH.
  • the larger the hollow area the higher the PTH impedance.
  • the metallized hole in the PCB has a useless copper portion that is not used for signal transmission, and the existing structure uses the same metal plane not used near the signal transmission portion and the metal plane used near the signal transmission portion.
  • Approach. In addition to providing signal reflow as a reference plane, the complete metal plane also acts to isolate interference. Excessive hollowed-out areas can cause excessive signal interference on both sides of the metal plane. Therefore, crosstalk caused by vias increases. In addition, due to the increase in the hollow area, the risk of causing plane resonance is increased.
  • the present invention provides a PCB board structure that reduces cross-hole crosstalk.
  • a PCB board structure for reducing cross-hole crosstalk includes a plurality of metal planes through which metallization holes are disposed, wherein the metal plane includes a top plane and a bottom plane, and each of the two metals The top holes are hollowed out between the two metallized holes of the same group, and the bottom layers of the outer rings of the two metallized holes of the same group are hollowed out.
  • the bottom plane between the two metallized holes of the same group is hollowed out.
  • the beneficial effect is that the metal planes of the same group are hollowed out as the metal plane of the top plane, and the inner and outer sides of the two metallized holes of the same group are used as the metal plane of the bottom plane. Hollowing, reducing the hollow area of the bottom plane, while ensuring the impedance of the signal portion of the metallized hole transmission, avoids the problem of excessive interference between signals caused by excessive hollowing out area.
  • the structure is simple and the cost is low.
  • Figure 1 is a schematic view of the structure of the present invention
  • Figure 2 is a plan view of the utility model
  • Figure 3 is a bottom plan view of the present invention.
  • a PCB board structure for reducing cross-hole crosstalk includes a plurality of metal planes 2, which are provided with metallized holes 1 therethrough.
  • the metal plane 2 comprises a top plane 3 and a bottom plane 4, each of the two metallized holes 1 as a group, the top plane 3 between the two said metallized holes 1 of the same group is hollowed out, two of the same group
  • the bottom plane 4 of the outer ring of the metallized hole 1 is hollowed out.
  • the bottom layer plane 4A closest to the top layer 3 is connected to the bottom layer 4A of the outer ring of the two metallized holes 1 of the same group, and the same group of two
  • the underlying plane 4A between the metallized holes 1 is completely hollowed out, and the metal plane is at least one layer, so that the metallized holes 1 are continuously continuous after the top layer plane 3 and the bottom layer plane 4 are layered. .
  • the utility model divides the metal plane of the same group as the metal plane of the top plane, and the inner and outer sides of the two metallized holes of the same group are hollowed out as the metal plane of the bottom plane, thereby reducing the hollowing of the bottom plane
  • the area ensures the impedance of the signal portion of the metallized hole transmission while avoiding the problem of excessive interference between signals caused by excessively large open space.
  • the structure is simple, the cost is low, and the space between the injection planes is reduced, and the risk of causing plane resonance is reduced, which is especially suitable for parallel signal use.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种减小过孔串扰的PCB板结构，包括若干层金属平面（2），所述金属平面（2）贯穿设置有金属化孔（1），其特征在于，所述金属平面（2）包括顶层平面（3）和底层平面（4），每两个所述金属化孔（1）作为一组，同组的两个所述金属化孔（1）之间的所述顶层平面（3）掏空，同组的两个所述金属化孔（1）外圈的所述底层平面（4）掏空。该结构避免了掏空面积过大而带来的信号干扰过高的问题，并且减小了注入平面之间的能量，减小了造成平面谐振的风险，尤其适合并行信号使用，结构简单，成本低廉。

Description

一种减小过孔串扰的PCB板结构 技术领域
本实用新型涉及电路板领域，特别涉及一种关于金属化孔的减少过孔串扰的PCB板结构。
背景技术
印制电路板(Printed Circuit Board，PCB板)又称印刷电路板，印刷线路板是电子产品的物理制成以及信号传输的重要组成部分，PCB板中的金属化孔(Plated through hole，PTH)作为连接不同层面走线的结构在PCB板中起着重要的作用。
PTH的阻抗通常会比传输线的阻抗低很多，为了增加PTH的阻抗使其达到与传输线阻抗相匹配，我们通常的做法会将PTH周围的金属平面掏空，掏空面积越大，PTH阻抗越高。PCB板中的金属化孔中有一段不用于信号传输的、无用的孔铜部分，而现有结构会将不用于信号传输部分附近的金属平面与用于信号传输部分附近的金属平面用相同的处理方法。完整的金属平面除了作为参考平面提供信号回流之外，还起到隔绝干扰的作用，过大的掏空区域会使得金属平面两边的信号干扰过高，因此，由过孔引起的串扰增加。另外由于掏空面积增大，增大了造成平面谐振的风险。
以上问题，值得解决。
实用新型内容
为了克服现有的技术的不足,本实用新型提供一种减小过孔串扰的PCB板结构。
本实用新型技术方案如下所述：
一种减小过孔串扰的PCB板结构，包括若干层金属平面，所述金属平面贯穿设置有金属化孔，其特征在于，所述金属平面包括顶层平面和底层平面，每两个所述金属化孔作为一组，同组的两个所述金属化孔之间的所述顶层平面掏空，同组的两个所述金属化孔外圈的所述底层平面掏空。
进一步的，连接所述顶层平面最近的至少一层所述底层平面中，同组的两个所述金属化孔之间的所述底层平面掏空。
根据上述结构的本实用新型，其有益效果在于：将同组的两个金属化孔之间作为顶层平面的金属平面掏空，同组的两个金属化孔内外两侧作为底层平面的金属平面掏空，减小底层平面的掏空面积，在保证了金属化孔传输信号部分的阻抗同时，避免了掏空面积过大而带来的信号之间干扰过高的问题。
同时，由于掏空面积减小，减小了注入平面之间的能量，减小了造成平面谐振的风险，尤其适合并行信号使用。
结构简单，成本低廉。
附图说明
图1为本实用新型结构示意图；
图2为本实用新型俯视图；
图3为本实用新型仰视图。
在图中，1、金属化孔；2、金属平面；3、顶层平面；4、底层平面。
具体实施方式
下面结合附图以及实施方式对本实用新型进行进一步的描述：
如图1-3所示，一种减小过孔串扰的PCB板结构包括若干层金属平面2，该金属平面2贯穿设置有金属化孔1。金属平面2包括顶层平面3和底层平面4，每两个金属化孔1作为一组，同组的两个所述金属化孔1之间的所述顶层平面3掏空，同组的两个所述金属化孔1外圈的所述底层平面4掏空。
在本实施例中，连接所述顶层平面3最近的所述底层平面4A中，除了同组的两个所述金属化孔1外圈的所述底层平面4A掏空外，且同组的两个所述金属化孔1之间的所述底层平面4A完全掏空，且该金属平面至少一层，这样使得金属化孔1在顶层平面3与底层平面4换层后的走线阻抗保持连续。
本实用新型将同组的两个金属化孔之间作为顶层平面的金属平面掏空，同组的两个金属化孔内外两侧作为底层平面的金属平面掏空，减小底层平面的掏空面积，在保证了金属化孔传输信号部分的阻抗同时，避免了掏空面积过大而带来的信号之间干扰过高的问题。结构简单，成本低廉，并且由于掏空面积减小，同时减小了注入平面之间的能量，减小了造成平面谐振的风险，尤其适合并行信号使用。
应当理解的是，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，而所有这些改进和变换都应属于本实用新型所附权利要求的保护范围。
上面结合附图对本实用新型专利进行了示例性的描述，显然本实用新 型专利的实现并不受上述方式的限制，只要采用了本实用新型专利的方法构思和技术方案进行的各种改进，或未经改进将本实用新型专利的构思和技术方案直接应用于其它场合的，均在本实用新型的保护范围内。

Claims (2)

  1. 一种减小过孔串扰的PCB板结构，包括若干层金属平面，所述金属平面贯穿设置有金属化孔，其特征在于，所述金属平面包括顶层平面和底层平面，每两个所述金属化孔作为一组，同组的两个所述金属化孔之间的所述顶层平面掏空，同组的两个所述金属化孔外圈的所述底层平面掏空。
  2. 根据权利要求1所述的减小过孔串扰的PCB板结构，其特征在于，连接所述顶层平面最近的至少一层所述底层平面中，同组的两个所述金属化孔之间的所述底层平面掏空。
PCT/CN2015/074674 2014-11-26 2015-03-20 一种减小过孔串扰的pcb板结构 WO2016082381A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201420717337.X 2014-11-26
CN201420717337.XU CN204244570U (zh) 2014-11-26 2014-11-26 一种减小过孔串扰的pcb板结构

Publications (1)

Publication Number Publication Date
WO2016082381A1 true WO2016082381A1 (zh) 2016-06-02

Family

ID=52774003

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/074674 WO2016082381A1 (zh) 2014-11-26 2015-03-20 一种减小过孔串扰的pcb板结构

Country Status (2)

Country Link
CN (1) CN204244570U (zh)
WO (1) WO2016082381A1 (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09321433A (ja) * 1996-05-29 1997-12-12 Oki Electric Ind Co Ltd 多層プリント配線板のバイアホール
US20020027020A1 (en) * 2000-09-07 2002-03-07 International Business Machines Corporation Through-hole structure and printed circuit board including the through-hole structure
JP2004241680A (ja) * 2003-02-07 2004-08-26 Mitsubishi Electric Corp 多層プリント基板
CN2886982Y (zh) * 2006-04-26 2007-04-04 华为技术有限公司 印刷电路板
CN200969706Y (zh) * 2006-07-28 2007-10-31 鸿富锦精密工业（深圳）有限公司 设有过孔的印刷电路板
WO2013146931A1 (ja) * 2012-03-30 2013-10-03 日立化成株式会社 多層配線板
CN203884075U (zh) * 2014-05-04 2014-10-15 深圳市一博科技有限公司 一种基于背钻的pcb板结构

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09321433A (ja) * 1996-05-29 1997-12-12 Oki Electric Ind Co Ltd 多層プリント配線板のバイアホール
US20020027020A1 (en) * 2000-09-07 2002-03-07 International Business Machines Corporation Through-hole structure and printed circuit board including the through-hole structure
JP2004241680A (ja) * 2003-02-07 2004-08-26 Mitsubishi Electric Corp 多層プリント基板
CN2886982Y (zh) * 2006-04-26 2007-04-04 华为技术有限公司 印刷电路板
CN200969706Y (zh) * 2006-07-28 2007-10-31 鸿富锦精密工业（深圳）有限公司 设有过孔的印刷电路板
WO2013146931A1 (ja) * 2012-03-30 2013-10-03 日立化成株式会社 多層配線板
CN203884075U (zh) * 2014-05-04 2014-10-15 深圳市一博科技有限公司 一种基于背钻的pcb板结构

Also Published As

Publication number Publication date
CN204244570U (zh) 2015-04-01

Similar Documents

Publication Publication Date Title
US9756734B2 (en) Manufacturing method for back drilling hole in PCB and PCB
CN101820728B (zh) 一种具有台阶槽的pcb板加工工艺方法
WO2018071874A3 (en) Improved multilayer printed circuit board via hole registration and accuracy
WO2012091373A3 (en) Method for manufacturing printed circuit board
CN104219880A (zh) Pcb板及其加工方法
MY188258A (en) Copper foil for printed circuit board production, copper foil with carrier, and copper-clad laminate plate, and printed circuit board production method using copper foil for printed circuit board production, copper foil with carrier, and copper-clad laminate plate
WO2018193318A3 (zh) 一种悬置带线滤波器
CN206077826U (zh) 一种优化电源平面通道压降的pcb板结构
CN204859745U (zh) 高可靠性的pcb板
CN205566806U (zh) 一种pcb板焊盘结构
WO2016082381A1 (zh) 一种减小过孔串扰的pcb板结构
EP3038145A3 (en) Electronic packages with pre-defined via patterns and methods of making and using the same
US20150008029A1 (en) Circuit board and method of manufacturing the same
CN207744232U (zh) 一种侧面开槽的pcb板
CN203884075U (zh) 一种基于背钻的pcb板结构
WO2016082382A1 (zh) 一种减小通道损耗的pcb板结构
US20140144691A1 (en) Method for shortening via stub and printed circuit board designed based on the method
TW200742523A (en) Multilayer circuit board and its manufacturing method
CN104902698A (zh) 电路板金手指的加工方法和具有金手指的电路板
CN204014259U (zh) 可校准盲孔位置度的hdi电路板
CN204335154U (zh) 金属化过孔焊盘和电路板
WO2011064573A3 (en) Circuit board
CN206743637U (zh) 一种减小信号损耗的pcb板结构
WO2018081710A3 (en) Flexible printed circuit to mitigate cracking at through-holes
TW201448679A (zh) 印刷電路板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15862194

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15862194

Country of ref document: EP

Kind code of ref document: A1