WO2016082382A1 - 一种减小通道损耗的pcb板结构 - Google Patents

一种减小通道损耗的pcb板结构 Download PDF

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Publication number
WO2016082382A1
WO2016082382A1 PCT/CN2015/074676 CN2015074676W WO2016082382A1 WO 2016082382 A1 WO2016082382 A1 WO 2016082382A1 CN 2015074676 W CN2015074676 W CN 2015074676W WO 2016082382 A1 WO2016082382 A1 WO 2016082382A1
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Prior art keywords
plane
holes
planes
hollowed out
same group
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PCT/CN2015/074676
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English (en)
French (fr)
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田艺儿
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田艺儿
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Publication of WO2016082382A1 publication Critical patent/WO2016082382A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits

Definitions

  • the utility model relates to the field of circuit boards, in particular to a PCB board structure for reducing channel loss of a metallized hole.
  • PCB Printed Circuit Board
  • PTH Platinum through hole
  • the back-drilling method is often used to minimize the length of the copper portion of the hole in the PTH, and the metal plane on the periphery of a small portion of the metallized hole is hollowed out, thereby reducing the influence on the signal transmission of the PCB.
  • this method increases the associated loss of the channel and increases the cost of back drilling.
  • the present invention provides a PCB board structure that reduces channel loss.
  • a PCB board structure for reducing channel loss comprising a plurality of metal planes, the metal planes being provided with metallized holes, wherein the metal plane comprises a top plane and a bottom plane, each of the two metallizations Hole as a group, two of the same group of metals The top plane between the holes is hollowed out, and the bottom plane between the two metallized holes of the same group is hollowed out, and the bottom planes outside the two metallized holes of the same group are respectively hollowed out.
  • the bottom plane between the two metallization holes of the same group and the hollow area of the top plane are the same size.
  • portions of the bottom layer of the same group of the metallization holes that are connected to the metallized holes are respectively hollowed out.
  • the beneficial effect is that the top plane between the two metallized holes of the same group is hollowed out, and the bottom plane between the two metallized holes of the same group uses the same plane as the top plane.
  • the size of the space is small, and the remaining bottom planes are respectively hollowed out.
  • the impedance of the copper portion of the unnecessary hole is increased, and the influence of the copper of the unnecessary hole on the signal is reduced, and the signal quality is optimized. It has a large optimization effect on the signal quality of the whole channel, especially at the resonance frequency, and is especially suitable for serial signals, and has a simple structure and low cost.
  • Figure 1 is a schematic view of the structure of the present invention
  • Figure 2 is a plan view of the utility model
  • Figure 3 is a bottom plan view of the present invention.
  • a PCB board structure for reducing channel loss includes a plurality of metal planes 2, and the metal plane 2 is provided with a metallized hole 1.
  • the metal plane includes a top plane 3 and a bottom plane 4, each of the two metallized holes 1 as a group, the top plane 3 between the two metallized holes 1 of the same group is hollowed out, and the two metallized holes 1 of the same group
  • the underlying plane 4 is hollowed out, and the bottom planes 4 outside the two metallized holes 1 of the same group are respectively hollowed out, and the bottom plane 4 and the top plane 3 between the two sets of the metallized holes 1 are respectively
  • the hollowed out area is the same size.
  • the portions of the bottom layer planes 4A outside the two metallized holes 1 of the same group that are connected to the metallization holes are respectively It is empty and retains a portion of the underlying plane, and the underlying plane 4A is at least one layer, such that the metallized hole 1 remains continuous in the trace impedance after the top layer plane 3 and the bottom plane 4 are layered.
  • the impedance of the copper portion of the unnecessary hole is increased, thereby reducing the influence of the copper of the unnecessary hole on the signal, optimizing the signal quality, the structure is simple, and the cost is low.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

一种减小通道损耗的PCB板结构，包括若干层金属平面（2），所述金属平面贯穿设置有金属化孔（1），所述金属平面包括顶层平面（3）和底层平面（4），每两个所述金属化孔作为一组，同组的两个所述金属化孔之间的顶层平面掏空，同组的两个所述金属化孔之间的底层平面掏空，同组的两个所述金属化孔外侧的底层平面分别掏空。该PCB板结构简单，在保证了金属化孔传输信号部分的阻抗同时，增加了无用孔铜部分的阻抗，优化了信号质量，尤其适用于串行信号。

Description

一种减小通道损耗的PCB板结构 技术领域
本实用新型涉及电路板领域，特别涉及一种关于金属化孔的减小通道损耗的PCB板结构。
背景技术
印制电路板(Printed Circuit Board，PCB板)又称印刷电路板，印刷线路板，是电子产品的物理职称以及信号传输的重要组成部分，PCB板中的金属化孔(Plated through hole，PTH)中一段不用于信号传输的、无用的孔铜部分会增加PCB板中信号传输的损耗，甚至破坏信号传输的完整性。
现有技术中常使用背钻的方法尽可能减少PTH中这一段孔铜部分的长度，并且将少部分金属化孔外围的金属平面掏空，以此减轻其对PCB板信号传输的影响。但是该种方法即增加了通道的相关损耗，又增加了背钻的成本。
以上问题，值得解决。
实用新型内容
为了克服现有的技术的不足,本实用新型提供一种减小通道损耗的PCB板结构。
本实用新型技术方案如下所述：
一种减小通道损耗的PCB板结构，包括若干层金属平面，所述金属平面贯穿设置有金属化孔，其特征在于，所述金属平面包括顶层平面和底层平面，每两个所述金属化孔作为一组，同组的两个所述金属 化孔之间的顶层平面掏空，同组的两个所述金属化孔之间的底层平面掏空，同组的两个所述金属化孔外侧的底层平面分别掏空。
进一步的，同组两个所述金属化孔之间的所述底层平面和所述顶层平面的掏空区域大小相同。
进一步的，与所述顶层平面连接最近的至少一层所述底层平面中，同组的两个所述金属化孔外侧的所述底层平面连接所述金属化孔的部分分别掏空。
根据上述结构的本实用新型，其有益效果在于：将同组的两个金属化孔之间的顶层平面掏空，同组的两个金属化孔之间的底层平面使用与顶层平面相同的掏空大小，剩余的底层平面分别掏空，在保证了金属化孔传输信号部分的阻抗同时，增加了无用孔铜部分的阻抗，从减小了无用孔铜对信号的影响，优化了信号质量，对全通道的信号质量有较大的优化作用，在谐振频率处尤为明显，尤其适用于串行信号，结构简单，成本低廉。
附图说明
图1为本实用新型结构示意图；
图2为本实用新型俯视图；
图3为本实用新型仰视图。
在图中，1、金属化孔；2、金属平面；3、顶层平面；4、底层平面。
具体实施方式
下面结合附图以及实施方式对本实用新型进行进一步的描述：
如图1-3所示，一种减小通道损耗的PCB板结构包括若干层金属平面2，该金属平面2贯穿设置有金属化孔1。金属平面包括顶层平面3和底层平面4，每两个金属化孔1作为一组，同组的两个金属化孔1之间的顶层平面3掏空，同组的两个金属化孔1之间的底层平面4掏空，同组的两个金属化孔1外侧的底层平面4分别掏空，同组两个所述金属化孔1之间的所述底层平面4和所述顶层平面3的掏空区域大小相同。
在本实施例中，与所述顶层平面3连接最近的所述底层平面4A中，同组的两个所述金属化孔1外侧的所述底层平面4A连接所述金属化孔的部分分别掏空，并保留了部分底层平面，且该底层平面4A至少为一层，这样使得金属化孔1在顶层平面3与底层平面4换层后的走线阻抗保持连续。
在保证了金属化孔1传输信号部分的阻抗同时，增加了无用孔铜部分的阻抗，从而减小了无用孔铜对信号的影响，优化了信号质量，结构简单，成本低廉。
应当理解的是，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，而所有这些改进和变换都应属于本实用新型所附权利要求的保护范围。
上面结合附图对本实用新型专利进行了示例性的描述，显然本实用新型专利的实现并不受上述方式的限制，只要采用了本实用新型专利的方法构思和技术方案进行的各种改进，或未经改进将本实用新型专利的构思和技术方案直接应用于其它场合的，均在本实用新型的保 护范围内。

Claims (3)

  1. 一种减小通道损耗的PCB板结构，包括若干层金属平面，所述金属平面贯穿设置有金属化孔，其特征在于，所述金属平面包括顶层平面和底层平面，每两个所述金属化孔作为一组，同组的两个所述金属化孔之间的顶层平面掏空，同组的两个所述金属化孔之间的底层平面掏空，同组的两个所述金属化孔外侧的底层平面分别掏空。
  2. 根据权利要求1所述的减小通道损耗的PCB板结构，其特征在于，同组两个所述金属化孔之间的所述底层平面和所述顶层平面的掏空区域大小相同。
  3. 根据权利要求1所述的减小通道损耗的PCB板结构，其特征在于，与所述顶层平面连接最近的至少一层所述底层平面中，同组的两个所述金属化孔外侧的所述底层平面连接所述金属化孔的部分分别掏空。
PCT/CN2015/074676 2014-11-26 2015-03-20 一种减小通道损耗的pcb板结构 WO2016082382A1 (zh)

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CN201420717339.9U CN204244566U (zh) 2014-11-26 2014-11-26 一种减小通道损耗的pcb板结构
CN201420717339.9 2014-11-26

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1913744A (zh) * 2005-08-12 2007-02-14 鸿富锦精密工业（深圳）有限公司 具有改良过孔的印刷电路板
CN101346037A (zh) * 2007-07-11 2009-01-14 巨擘科技股份有限公司 多层基板及其制造方法
US20090056999A1 (en) * 2007-08-31 2009-03-05 Kazuhiro Kashiwakura Printed wiring board
CN101662882A (zh) * 2005-01-25 2010-03-03 财团法人工业技术研究院 高频宽带阻抗匹配的传输孔
CN102686011A (zh) * 2011-03-15 2012-09-19 鸿富锦精密工业（深圳）有限公司 印刷电路板
CN203884075U (zh) * 2014-05-04 2014-10-15 深圳市一博科技有限公司 一种基于背钻的pcb板结构

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101662882A (zh) * 2005-01-25 2010-03-03 财团法人工业技术研究院 高频宽带阻抗匹配的传输孔
CN1913744A (zh) * 2005-08-12 2007-02-14 鸿富锦精密工业（深圳）有限公司 具有改良过孔的印刷电路板
CN101346037A (zh) * 2007-07-11 2009-01-14 巨擘科技股份有限公司 多层基板及其制造方法
US20090056999A1 (en) * 2007-08-31 2009-03-05 Kazuhiro Kashiwakura Printed wiring board
CN102686011A (zh) * 2011-03-15 2012-09-19 鸿富锦精密工业（深圳）有限公司 印刷电路板
CN203884075U (zh) * 2014-05-04 2014-10-15 深圳市一博科技有限公司 一种基于背钻的pcb板结构

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