WO2016075760A1 - 電子部品装着機の制御装置及びその制御装置へのデータ入力装置 - Google Patents
電子部品装着機の制御装置及びその制御装置へのデータ入力装置 Download PDFInfo
- Publication number
- WO2016075760A1 WO2016075760A1 PCT/JP2014/079866 JP2014079866W WO2016075760A1 WO 2016075760 A1 WO2016075760 A1 WO 2016075760A1 JP 2014079866 W JP2014079866 W JP 2014079866W WO 2016075760 A1 WO2016075760 A1 WO 2016075760A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- split
- board
- mounting
- control device
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
- H05K13/0853—Determination of transport trajectories inside mounting machines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/0882—Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
Definitions
- the present specification relates to a control device for an electronic component mounting machine for mounting electronic components on a printed circuit board, and a data input device for inputting data to the control device.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2001-77596 (hereinafter referred to as Patent Document 1) describes an electronic component mounting machine that mounts electronic components on a printed board including a plurality of split boards.
- electronic components to be mounted on each of the plurality of split substrates are sucked in advance using a plurality of suction nozzles.
- an electronic component to be mounted on the first split substrate and an electronic component to be mounted on the second split substrate are sucked from the electronic component supply device (feeder) using two suction nozzles.
- the mounting head is moved to a predetermined position on the printed board, and electronic components are mounted on both the first and second divided boards.
- the mounting head moves the electronic component between the electronic component supply device and the printed circuit board only once, and the electronic components are placed on the two divided substrates (the first divided substrate and the second divided substrate). Can be installed.
- the electronic component mounting machine of Patent Document 1 does not consider the offset values of a plurality of split boards. For this reason, after moving the mounting head to the position of the printed board, it is necessary to move the mounting head to the mounting position of the electronic component in each divided board. Although the electronic component mounting machine of Patent Document 1 moves by attracting the electronic component to the two suction nozzles, it is necessary to move the mounting head when mounting the electronic component on each split substrate. Efficiency is reduced. It is an object of the present specification to provide a control device for an electronic component mounting machine capable of making the productivity of the electronic component mounting machine higher than before, and a data input device for inputting data to the control device. .
- the control device disclosed in this specification controls the operation of the mounting head of the electronic component mounting machine.
- the electronic component mounting machine mounts an electronic component on a printed circuit board including a plurality of divided substrates using a mounting head having a plurality of suction nozzles.
- some of the plurality of divided boards in the printed board are grouped into one group based on the positions of the plurality of suction nozzles and the positions of the plurality of divided boards in the printed board. Further, the control device simultaneously sucks electronic components to be mounted on the split board in the one group.
- some of the plurality of divided substrates are made into one group based on the positions of the plurality of suction nozzles and the positions of the plurality of divided substrates in the printed circuit board. Since the position of the suction nozzle and the position of the split substrate can be optimized, the electronic component sucked by the suction nozzle can be efficiently mounted on the split substrate. As a result, the productivity of the electronic component mounting machine can be increased as compared with the conventional case.
- the divided boards to be set as one group may be determined by the control device, or the user may select the divided boards to be set as one group and input them to the control device.
- control devices disclosed in this specification control the operation of the mounting head of the electronic component mounting machine.
- the control device controls the operation of the mounting head when mounting an electronic component on a printed board including a plurality of split boards. In the control device, some of the plurality of divided boards in the printed board are made into one group.
- the control device controls the operation of the mounting head based on the mounting position data, the offset data, and the mounting order data.
- the mounting position data is data regarding the mounting position of the electronic component in one of the plurality of divided boards in one group.
- the offset data is data relating to an offset value for the one divided board of the plurality of divided boards in one group.
- the mounting order data is data related to the order of mounting electronic components in one group.
- control device it is not necessary to store all the mounting positions in the group with respect to the mounting positions of the electronic components, but it stores about one split board (reference split board) among a plurality of split boards. Just do it.
- the mounting position of the electronic component on the split board other than the reference split board is determined based on the offset data between the groups and the mounting position data of the electronic component in one split board. Since the control device does not need to store the mounting position data of the electronic components other than the reference board, the memory of the control device can be reduced.
- the data input device disclosed in this specification inputs data to the control device described above.
- the data input device includes display means for displaying an image of a printed circuit board, and selection means for selecting a divided board to be grouped based on the image displayed on the display means.
- the above data input device can determine the data stored in the control device. Specifically, the user can select a divided board to be a group while confirming an image of the printed board displayed on the screen of the display means. That is, the data input device can output not only data stored in the control device but also data stored in the control device or stored in the control device on the display screen.
- the appearance of the electronic component mounting machine is shown.
- the figure explaining the relationship between a data input device and a control apparatus is shown.
- the image shown on the screen of a data input device is shown.
- the printed circuit board and the suction nozzle shown on the screen of the data input device are shown.
- a mounting head and a suction nozzle are schematically shown.
- the figure explaining the positional relationship of a printed circuit board and a suction nozzle is shown.
- a mounting head and a suction nozzle are schematically shown.
- the figure explaining the positional relationship of a printed circuit board and a suction nozzle is shown.
- 2 shows a part of a group of printed circuit boards according to the first embodiment.
- the group coordinate of Example 1 is shown.
- the coordinates of the split board and the mounting order of the electronic components of Example 1 are shown.
- the coordinates of the split board and the mounting order of the electronic components of Example 1 are shown.
- the mounting coordinates of the electronic component in the reference division board of Example 1 are shown.
- 7 shows a part of a group of printed circuit boards according to a second embodiment.
- the coordinate of the split board of Example 2, and the mounting order of an electronic component are shown.
- the mounting coordinates of the electronic component in the reference division board of Example 2 are shown.
- the group coordinate of Example 3 is shown.
- the coordinate of the split substrate of Example 3, and the mounting order of an electronic component are shown.
- the mounting coordinates of the electronic component in the reference division board of Example 3, and the kind of adsorption nozzle to be used are shown.
- the mounting order, type, and group of the electronic component of Example 3 are shown.
- the electronic component mounting machine mounts (mounts) electronic components on a printed circuit board having a plurality of split substrates.
- the electronic component mounting machine includes a mounting head having a plurality of suction nozzles.
- the operation of the mounting head and the suction nozzle is controlled by a control device.
- the execution program for the control device (the operation program for the mounting head and the suction nozzle) may be created by the control device according to the coordinates of the split substrate in the printed circuit board, the position of the suction nozzle, etc.
- the user may create (data input).
- the control device may be integrated with the electronic component mounting machine, or may be separate from the electronic component mounting machine.
- some of the plurality of divided boards in the printed board may be made into one group.
- the control device itself may have a function of making a plurality of divided boards into one group and creating a plurality of the groups. There may be one group or a plurality of groups for one printed circuit board.
- the control device may have a function of creating a plurality of groups and causing each of the divided boards to belong to one of those groups.
- the control device may determine the one group based on the positions of the plurality of suction nozzles and the positions of the plurality of divided boards in the printed board.
- the control device may store the order of mounting the electronic components sucked by the suction nozzle in one group.
- the control device itself may determine the order of mounting the electronic components sucked by the suction nozzles in one group.
- the control device includes the position information of each group in the printed circuit board, the offset value information between the groups, the position information of each divided board in each group, the type of electronic component to be mounted on the divided board, and the divided board information in each group.
- a storage device (memory) for storing the mounting order and the like may be provided.
- the control device includes position data of one divided board among a plurality of divided boards in one group, offset data for the one divided board in the plurality of divided boards in one group, A function of storing the order of mounting the electronic components in one group may be provided.
- one split board in the group is regarded as a reference split board, and the position data (coordinates) of the reference split board and the offset value of the other split boards with respect to the reference split board position data are stored.
- the position data of all the divided boards can be obtained. If the position data of all the split boards in the group can be obtained from the position data of the reference split board and the offset data of the other split boards with respect to the reference split board, the position data of all the split boards is not stored.
- electronic components can be mounted on all the split boards.
- the split substrates included in one group may be selected so that the movement of the mounting head is minimized.
- the difference between the distance between the suction nozzles and the distance between the divided boards in one group (the offset value of the other divided board with respect to the reference divided board) is minimized.
- Some of the plurality of split substrates may be made into one group. More preferably, the divided substrates included in one group may be selected so that the intervals between the suction nozzles and the intervals between the divided substrates coincide with each other.
- one group may be formed on a single printed board, or a plurality of groups may be formed.
- one electronic component may be mounted on one split substrate, or a plurality of electronic components may be mounted on one split substrate.
- the control device may store offset data between the groups.
- the offset data between groups is an offset value of another group with respect to position data (coordinates) of the reference group when one group is regarded as a reference group.
- the control device uses offset data between the groups (hereinafter referred to as first offset data) and one Stores offset data between a plurality of divided boards in a group (hereinafter referred to as second offset data) and electronic component mounting position data (hereinafter referred to as divided board mounting position data) in one divided board. You can do it.
- the second offset data is an offset value of another split board with respect to the position data of the reference split board.
- the second offset data and the mounting position data in the split board are used to generate electronic data for all the split boards included in one group.
- Component mounting position data can be obtained.
- the first offset data it is possible to obtain position data for mounting electronic components on all the divided boards included in one printed board.
- each group includes 10 divided boards, and 10 electronic components are mounted on each divided board, the position data for mounting the electronic components is 1000.
- the control device originally needs to store 1000 pieces of position data.
- only the first offset data, the ten second offset data, and the ten split board mounting position data are stored. Obtainable. The capacity of the storage device (memory) mounted on the control device can be reduced.
- the control device includes offset data between the groups (first offset data), offset data between the plurality of divided boards in one group (second offset data), and a plurality of electronic components in one divided board.
- the mounting order of the electronic components may be determined based on the mounting position data (the mounting position data in the split board). In this case, the control device may determine the order of mounting the electronic components so that the moving distance of the mounting head, the number of times of replacement of the suction nozzle, and the like are reduced.
- the control device may store an order of mounting electronic components (hereinafter referred to as mounting order data).
- the mounting order data includes at least one piece from each of the split boards included in each group.
- the mounting position of the electronic component may be selected, and a plurality of suction nozzles may be used to determine that the electronic component is mounted continuously at the selected mounting position.
- the selected mounting position may be the same position in each split substrate. That is, in one group, the mounting position selected from each divided board may be offset by the same offset value as the second offset data.
- the mounting order data may select a mounting position of at least one electronic component from each group.
- the execution program is input to the control device using a data input device.
- the data input device may include display means and selection means.
- the display means may display an image of the printed board.
- the display means may display each divided board included in the printed board.
- the display means may display the divided boards in the printed board for each group.
- the display unit may display an image of the printed circuit board, the group, or the divided board together with their coordinate data (typically XY coordinate data).
- the display means may display the mounting head having a plurality of suction nozzles at an arbitrary position on the screen displaying the printed circuit board.
- the control device and the data input device may be integrated or separate.
- the control device may be integrated with the electronic component mounting machine, and the data input device may be separate from the electronic component mounting machine. That is, the control device may be disposed inside the electronic component device, and the data input device may be disposed outside the electronic component mounting machine.
- the selection means may be able to select a divided board as a group based on the image displayed on the display means.
- the selection means may be able to select one of the plurality of divided boards in the group.
- the group or split board selected by the selection means may be displayed on the display means separately from the unselected group or split board.
- the electronic component mounting machine 100 is a device that mounts (mounts) electronic components on a printed circuit board.
- the electronic component mounting machine 100 may be referred to as a surface mounter or a chip mounter.
- two electronic component mounting machines 10 a and 10 b are fixed to the system base 12.
- the direction in which the electronic component mounting machines 10b and 10b are arranged is defined as the X direction, and the horizontal direction perpendicular thereto is defined as the Y direction.
- the electronic component mounting machines 10a and 10b have substantially the same structure. Therefore, in the following description, the electronic component mounting machine 10a will be described, and the description of the electronic component mounting machine 10b will be omitted.
- the electronic component mounting machine 10 a includes a frame 20 and a plurality of first feeders 30 fixed to the frame 20.
- the plurality of first feeders 30 are detachably attached to the frame 20.
- Each first feeder 30 accommodates a plurality of electronic components.
- the first feeder 30 supplies electronic components to the mounting head 22.
- the first feeder 30 is a tape feeder that accommodates a plurality of electronic components on a carrier tape.
- the electronic component mounting machine 10a includes two board transfer devices 26. Each board conveyance device 26 conveys a printed circuit board in the X direction. Each board conveyance device 26 is connected in series with the board conveyance device 26 of the electronic component mounting machine 10b.
- the electronic component mounting machine 10a includes a mounting head 22 and a head moving device 24 that moves the mounting head 22 in the X direction and the Y direction. The head moving device 24 moves the mounting head 22 in a predetermined order with respect to the plurality of first feeders 30 and the printed circuit board on the substrate transport device 26.
- the mounting head 22 is provided with a plurality of suction nozzles. The plurality of suction nozzles pick up and hold electronic components from the first feeder 30 and transport and mount them on a printed circuit board on the substrate transport device 26.
- the board transfer device 26 sends out the printed circuit board on which the electronic component has been mounted to the board transfer device of the electronic component mounting machine 10b.
- a data input device 32 is provided above the electronic component mounting machine 10b. Various settings for the electronic component mounting machines 10 a and 10 b can be input to the control device using the data input device 32. Further, the data input device 32 can select / display a split board, which will be described later.
- the control device 40 controls the operation of the mounting head 22 and controls the mounting position and mounting order of electronic components on the printed circuit board 34.
- information programmed in the control device 40 can be displayed on the screen 32 a of the data input device 32.
- a board / group selection unit 50 On the screen 32a, a board / group selection unit 50, a display division board selection unit 52, a board layout display unit 54, a coordinate display unit 56, an intra-group offset amount display unit 58, and an inter-group offset amount display unit 60 are displayed.
- the display of the board layout display unit 54 and the coordinate display unit 56 can be switched between a board unit and a group unit.
- the tab of the display split board selection unit 52 is changed from “Block 1, 2,...” To “Group 1, 2,.
- the display of the board layout display section 54 and the coordinate display section 56 can be switched between the entire printed board (ALL) and the selected group (or block).
- the entire printed circuit board (ALL) is selected, an image of the entire printed circuit board is displayed on the circuit board layout display unit 54, and all the coordinates of the electronic components mounted on the printed circuit board are displayed on the coordinate display unit 56.
- the display split board selection unit 52 the split boards in the selected group are displayed on the board layout display part 54, and electronic components to be mounted on the split boards in the selected group are displayed.
- the coordinates are displayed on the coordinate display unit 56, and the offset amount of each group tube is displayed on the intra-group offset amount display unit 58.
- the user wants to set one group among the plurality of divided boards displayed on the board layout display unit 54.
- One group can be determined by selecting several divided substrates and selecting a group determining unit (not shown).
- the selected divided board is displayed in a color different from that of the other divided boards, and the coordinate display unit 56 displays the selected divided board.
- the background color of the coordinates indicating the corresponding split board being displayed is displayed in a color different from the background color of the coordinates of the other split boards.
- the board layout display unit 54 can display an image of the printed board and an image of the mounting head 22 in an overlapping manner.
- the positions of the suction nozzles 42a to 42d are also displayed.
- the user can move the image of the mounting head 22 while maintaining the interval between the suction nozzles 42a to 42d. Therefore, the user can determine the position of the suction nozzles 42a to 42d.
- One group can be set while checking the position of the split board on the screen.
- the user can input an operation program for the mounting head 22 to the control device 40 using the data input device 32.
- the user can input all of the operation program of the mounting head 22 to the control device 40, or a part of the operation program (for example, setting the origin of the printed circuit board 34, the electronic components in one divided circuit board) It is also possible to input a mounting order or the like.
- FIGS. 5 to 8 schematically show the shapes of the printed circuit board 34 and the suction nozzle 42.
- FIG. 6 and FIG. 8 show some of the divided boards included in the printed board 34.
- FIG. 5 to 8 schematically show the shapes of the printed circuit board 34 and the suction nozzle 42.
- FIG. 6 and FIG. 8 show some of the divided boards included in the printed board 34.
- the mounting head 22 includes four suction nozzles 42a to 42d. Further, as shown in FIG. 6, one group 134 is constituted by four divided boards 134a to 134d of the printed board 34. In this case, when the same electronic component is attracted to all of the suction nozzles 42a to 42d and the mounting head 22 is moved to a predetermined position on the printed circuit board 34, the suction nozzles 42a to 42d are moved to the divided substrates 134a to 134d. Of the same position. Therefore, after the mounting head 22 is moved to a predetermined position on the printed circuit board 34, electronic components can be mounted on each of the divided boards 134a to 134d without further moving the mounting head 22.
- FIG. 7 shows a mounting head 122 including two suction nozzles 142a and 142b.
- the suction nozzles 142a and 142b are arranged in the X-axis direction.
- the suction nozzles 142a and 142b are positioned on the divided board 134a and the divided board 234d. Therefore, when the electronic component is mounted on the printed circuit board 34 using the mounting head 122, the divided boards 134a and 234d located at three positions are set as one group 1034. Similarly, the divided boards 134b and 234d are grouped into one group 1134.
- the mounting head 122 When the same electronic component is sucked by the suction nozzles 142a and 142b and the mounting head 122 is moved to a predetermined position on the printed circuit board 34, the mounting head 122 is not moved further, and the divided boards in one group are moved. Electronic components can be installed.
- the reference split board and the split board to be a group are selected by the following procedures (1) to (3).
- (1) When the interval between the suction heads is an interval A and the interval between adjacent split substrates is an interval B, a coefficient ⁇ satisfying the interval A ⁇ 0.5 ⁇ interval B ⁇ coefficient ⁇ (count ⁇ is an integer) is set. calculate.
- a reference split board (split board 134a) and a split board (split board 234d) at positions D apart from the reference split board in the X-axis direction are grouped into one group.
- FIG. 9 shows the group 134 and the group 234 adjacent to the group 134 in the printed circuit board 34 shown in FIG.
- group 134 is referred to as group 1
- group 234 is referred to as group 2.
- the numbers 1 to 8 given to the split boards are the split board numbers stored in the control device 40. In the following description, they are referred to as split substrates 1 to 8.
- the control device 40 stores data shown in FIGS.
- the coordinates of group 1 and group 2 can also be referred to as the origin of group 1 and group 2, respectively.
- the coordinates of group 2 correspond to offset data (first offset data) for group 1 (reference group).
- FIG. 11 shows the coordinates of the divided boards 1 to 4 stored in the control device 40 and the mounting order of the electronic components. That is, FIG. 11 shows the coordinates and mounting order of the divided boards included in the group 1.
- the coordinates of the split substrates 1 to 4 can also be referred to as the origins of the split substrates 1 to 4, respectively.
- the coordinates of the split substrates 2 to 4 correspond to offset data (second offset data) with respect to the split substrate 1 (reference split substrate).
- FIG. 12 shows the coordinates of the split substrates 5 to 8 and the mounting order of the electronic components.
- the coordinates and mounting order of the split substrates 5 to 8 are not stored in the control device 40.
- the coordinates and mounting order shown in FIG. 12 are obtained from the data shown in FIGS. Specifically, the numerical value of the coordinate shown in FIG. 11 is added with the numerical value of the coordinate (first offset data) of group 2 shown in FIG.
- the mounting order shown in FIG. 12 is the mounting order through group 1 and group 2.
- the numerical values shown in parentheses are the mounting order of electronic components in group 2, and are the same as the mounting order of electronic components in group 1 shown in FIG.
- FIG. 13 shows the type of electronic component (component A) to be mounted on the split substrate 1 and the center coordinates of the electronic component when the electronic component is mounted on the split substrate 1. Specifically, the coordinates where the center of the electronic component is located with respect to the coordinates (origin) of the split substrate 1 are shown.
- the control device 40 stores data shown in FIGS.
- the group number is D
- the number of split boards included in the group is E
- the reference group number assigned to the split boards in group 1 corresponding to the split boards in the group is F
- ( D-1) ⁇ E + F is calculated. Based on this calculation result, in the case of FIG. 9, numbers 5 to 8 are assigned to the divided boards in the group 2.
- one group 101 is constituted by the divided substrates 1 to 8. That is, the number of split substrates included in the group 101 is larger than the number of suction nozzles (four) provided in the mounting head 22.
- FIG. 15 shows the coordinates (origin) of the split boards 1 to 8 stored in the control device 40 and the mounting order of the electronic components. That is, FIG. 15 shows the coordinates and mounting order of the divided boards included in the group 101.
- the coordinates of the split substrate 2 to the split substrate 8 correspond to offset data (second offset data) for the split substrate 1 (reference split substrate).
- FIG. 16 shows the type of electronic component (component A) to be mounted on the split substrate 1 and the center coordinates of the electronic component when the electronic component is mounted on the split substrate 1. Specifically, the coordinates of the center position of the electronic component with respect to the coordinates (origin) of the split substrate 1 are shown.
- the electronic components can be mounted in the same order as in the first embodiment by providing the data shown in FIGS.
- the same number of split substrates as the number of suction nozzles may be made into one group (Example 1).
- Many divided substrates may be made into one group (Example 2).
- FIG. 17 shows the coordinates of the groups 1 and 2 (the origins of the groups 1 and 2) stored in the control device 40.
- FIG. 18 shows the coordinates of the divided boards 1 to 4 stored in the control device 40 and the mounting order of the electronic components.
- FIG. 19 shows the center coordinates of electronic components A and B when electronic components A and B are mounted on split board 1 (reference split board), the types of electronic components to be mounted on split board 1 (part A and component B), and The type of suction nozzle used is shown. As shown in FIG. 19, in this embodiment, three electronic components are mounted in the split board.
- nozzles A and B two types of suction nozzles (nozzles A and B) are used to complete the mounting of the electronic components (components A and B) on one split board. It is necessary. If the suction nozzle is frequently replaced, the productivity decreases (the time required for mounting the electronic component increases). For this reason, in the present embodiment, mounting of electronic components is executed in an order that reduces the replacement of the suction nozzle.
- FIG. 20 shows the order in which the electronic components are mounted, the mounting position of the electronic components in the split board, and the group in which the electronic components are mounted.
- the component A is mounted at the in-board position “2” of the groups 1 and 2 (FIG. 20). 19).
- the component B is mounted at the position “3” in the board of the groups 1 and 2. That is, before all the components (components A and B) are mounted on the group 1, the component A is mounted on the group 2 and the component B is mounted on the group 1 again. More specifically, a position corresponding to the in-board position “1” shown in FIG.
- the component A is continuously mounted on the in-board position “1” of the divided boards 5 to 8 included in the group 2, and the component A is attached to the in-board position “2” of the divided boards 5 to 8. It mounts continuously (mounting order 3 and 4 of FIG. 20). Thereafter, all four suction nozzles are replaced from nozzle A to nozzle B. After that, the component B is continuously mounted on the board position “3” of the boards 1 to 4 (group 1), and the part B is placed on the board position “3” of the boards 5 to 8 (group 2). Mounting is performed continuously (mounting order 5, 6 in FIG. 20).
- the mounting order of the electronic components shown in FIG. 20 is the same as the offset data (first offset data) of group 2 with respect to the reference group (group 1) shown in FIG. 17 and the reference split board (split board 1) shown in FIG. It is determined based on the offset data (second offset data) of the split substrates 2 to 4, the type of electronic components to be mounted on the reference split substrate shown in FIG. 19, and the type of suction nozzle to be used.
- replacement of the suction nozzle can be minimized, and the production time can be shortened.
- Example 3 four divided substrates were made into one group.
- a mounting head in which four suction nozzles are arranged to form a quadrangle
- a mounting head rotary head
- the numerical value I the number of divided boards included in one group
- one group is calculated based on the number of divided boards included in the printed board and the number of electronic components mounted on one divided board. Determine the number of split boards to be included. Accordingly, when the suction nozzle sucks the last electronic component to be mounted in one group, the electronic component is sucked by all of the plurality of suction nozzles, and the electronic component can be sucked efficiently.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Automation & Control Theory (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
(1)吸着ヘッドの間隔を間隔Aとし、隣り合う割り基板の間隔を間隔Bとしたときに、間隔A<0.5×間隔B×係数β(計数βは整数)を満足する係数βを算出する。
(2)基準となる割り基板(例えば、割り基板134a)と同じグループにする割り基板が、基準割り基板に対してC個離れているとしたときに、個数C=0.5×βを算出し、個数Cの整数部分である整数Dを抽出する。
(3)基準割り基板(割り基板134a)と、基準割り基板に対してX軸方向のD個離れた位置の割り基板(割り基板234d)を、1つのグループとする。
図9~図13を参照し、制御装置40に記憶されているデータと、プリント基板34に電子部品を装着する順序について説明する。本実施例では、図5に示す装着ヘッド22を用いて、図6に示すプリント基板34に電子部品を装着する例について説明する。なお、本実施例では、各々の割り基板に1個の電子部品を装着する例について説明する。
(1)グループ1に含まれる割り基板の各々に、原点(X,Y=0)に近い順に番号を付す。グループ1内の割り基板に付した番号を、基準グループ内番号とする。なお、図9の場合、X軸の座標の数値が原点に近い割り基板(割り基板1及び2)の全てに番号を付した後、X軸の座標の数値が次に原点に近い割り基板(割り基板3及び4)の全てに番号を付している。
(2)グループ番号をDとし、そのグループに含まれる割り基板の数をEとし、そのグループ内の割り基板に対応するグループ1内の割り基板に付された基準グループ内番号をFとし、(D-1)×E+Fを算出する。この算出結果に基づいて、図9の場合、グループ2内の割り基板に番号5~8が付与される。
図14~図16を参照し、制御装置40に記憶されているデータの他の形態について説明する。本実施例でも、図5に示す装着ヘッド22を用いて、図6に示すプリント基板34に電子部品を装着する例について説明する。なお、本実施例でも、各々の割り基板に1個の電子部品を装着する例について説明する。また、実施例1で説明した特徴と同じ特徴については、説明を省略することがある。
図17~20を参照し、制御装置40に記憶されているデータと、プリント基板34に電子部品を装着する順序の他の形態について説明する。本実施例でも、図5に示す装着ヘッド22を用いて、図6に示すプリント基板34に電子部品を装着する例について説明する。なお、本実施例では、1つの割り基板に複数の部品を装着する形態について説明する。また、実施例1又は2で説明した特徴と同じ特徴については、説明を省略することがある。
(1)1つの割り基板に装着する電子部品の数をGとし、装着ヘッドが備える吸着ノズルの数をHとし、1つのグループに含める割り基板の数をIとしたときに、数値Gと数値Hの最小公倍数Jを算出する。
(2)数値I=最小公倍数J/数値Gを算出し、1つのグループとする。
Claims (11)
- 複数の吸着ノズルを有している装着ヘッドを用いて複数の割り基板を含むプリント基板に対して電子部品を装着するときの、装着ヘッドの動作を制御する電子部品装着機の制御装置であり、
その制御装置は、複数の吸着ノズルの位置とプリント基板内における複数の割り基板の位置とに基づいてプリント基板内における複数の割り基板のうちの幾つかが1つのグループとされており、
前記複数の吸着ノズルは、前記1つのグループ内の割り基板に装着する電子部品を同時に吸着する電子部品装着機の制御装置。 - 前記1つのグループ内における複数の割り基板のうちの1個の割り基板の位置データと、
前記1つのグループ内における複数の割り基板の前記1個の割り基板に対するオフセットデータと、
前記複数の吸着ノズルが吸着した電子部品を装着する順序と、を記憶する請求項1に記載の制御装置。 - 各々の吸着ノズルの間隔と前記1つのグループ内における各々の割り基板の間隔との差が最小になるように、プリント基板内における複数の割り基板のうちの幾つかが1つのグループとされている請求項1又は2に記載の制御装置。
- 複数のグループが形成されており、
各グループ間のオフセットデータを記憶する、請求項1から3のいずれか一項に記載の制御装置。 - 複数のグループが形成されているとともに1個の割り基板に複数の電子部品を装着するときに、
各グループ間のオフセットデータと、
前記1つのグループ内における複数の割り基板間のオフセットデータと、
1個の割り基板内における前記複数の電子部品の装着位置データと、を記憶する請求項1から3のいずれか一項に記載の制御装置。 - 前記各グループ間のオフセットデータと、
前記1つのグループ内における複数の割り基板間のオフセットデータと、
前記1個の割り基板内における前記複数の電子部品の装着位置データと、に基づいて、電子部品を装着する順序を決定する請求項5に記載の制御装置。 - 前記各グループに含まれる割り基板の各々から少なくとも1個の電子部品の装着位置を選択し、
複数の吸着ノズルを用いて、選択した装着位置に対して連続して電子部品が装着されるように、前記装着順序データが決定されている、請求項6に記載の制御装置。 - 複数の割り基板を含むプリント基板に対して電子部品を装着するときの装着ヘッドの動作を制御する電子部品装着機の制御装置であり、
プリント基板内における複数の割り基板のうちの幾つかが1つのグループとされており、
前記1つのグループ内における複数の割り基板のうちの1個の割り基板内における、電子部品の装着位置データと、
前記1つのグループ内における複数の割り基板の前記1個の割り基板に対するオフセットデータと、
前記1つのグループ内における電子部品の装着順序データと、に基づいて装着ヘッドの動作を制御する電子部品装着機の制御装置。 - 請求項1から8のいずれか一項に記載の制御装置にデータを入力するデータ入力装置であり、
プリント基板の画像を表示する表示手段と、
表示手段に表示された画像に基づいて、グループとする割り基板を選択する選択手段と、を備えているデータ入力装置。 - グループ内の複数の割り基板のうちの1つを選択することが可能であり、
選択した割り基板を、選択していない割り基板と区別して表示する、請求項9に記載のデータ入力装置。 - 選択した割り基板の座標データを、プリント基板の画像と併せて表示する、請求項9又は10に記載のデータ入力装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201480083216.7A CN107079617B (zh) | 2014-11-11 | 2014-11-11 | 电子元件安装机的控制装置及向该控制装置输入数据的数据输入装置 |
PCT/JP2014/079866 WO2016075760A1 (ja) | 2014-11-11 | 2014-11-11 | 電子部品装着機の制御装置及びその制御装置へのデータ入力装置 |
US15/525,813 US11140801B2 (en) | 2014-11-11 | 2014-11-11 | Data input and control devices of an electronic component mounting machine |
EP14905944.6A EP3220730B1 (en) | 2014-11-11 | 2014-11-11 | Control device for electronic component attaching device |
JP2016558479A JP6522644B2 (ja) | 2014-11-11 | 2014-11-11 | 電子部品装着機の制御装置及びその制御装置へのデータ入力装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2014/079866 WO2016075760A1 (ja) | 2014-11-11 | 2014-11-11 | 電子部品装着機の制御装置及びその制御装置へのデータ入力装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016075760A1 true WO2016075760A1 (ja) | 2016-05-19 |
Family
ID=55953873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2014/079866 WO2016075760A1 (ja) | 2014-11-11 | 2014-11-11 | 電子部品装着機の制御装置及びその制御装置へのデータ入力装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11140801B2 (ja) |
EP (1) | EP3220730B1 (ja) |
JP (1) | JP6522644B2 (ja) |
CN (1) | CN107079617B (ja) |
WO (1) | WO2016075760A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6356222B2 (ja) * | 2014-03-25 | 2018-07-11 | 株式会社Fuji | 部品装着装置 |
WO2017081809A1 (ja) * | 2015-11-13 | 2017-05-18 | ヤマハ発動機株式会社 | 部品実装装置、部品実装方法、及び、表面実装機 |
CN111713185B (zh) * | 2018-02-21 | 2022-02-11 | 株式会社富士 | 元件安装系统及元件保持方法 |
CN113508651B (zh) * | 2019-03-05 | 2022-09-20 | 株式会社富士 | 校正量计算装置、元件安装机及校正量计算方法 |
CN116095980B (zh) * | 2022-11-08 | 2023-08-22 | 哈尔滨工业大学 | 一种基于最大二分配的贴片机吸嘴分配方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63133700A (ja) * | 1986-11-26 | 1988-06-06 | シチズン時計株式会社 | 電子部品自動挿入機における部品挿入位置補正方法 |
JP2001077596A (ja) * | 1999-08-31 | 2001-03-23 | Sanyo Electric Co Ltd | 電子部品装着装置 |
JP2002252499A (ja) * | 2001-02-23 | 2002-09-06 | Matsushita Electric Ind Co Ltd | 部品実装方法、部品実装機、部品実装順序決定装置、及び、部品実装順序決定プログラム |
JP2003124693A (ja) * | 2001-10-09 | 2003-04-25 | Matsushita Electric Ind Co Ltd | 部品実装方法及び部品実装装置、並びに実装データ作成プログラム及び記録媒体 |
JP2007306040A (ja) * | 1999-09-27 | 2007-11-22 | Matsushita Electric Ind Co Ltd | 部品実装方法及び部品実装装置 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09204454A (ja) * | 1996-01-26 | 1997-08-05 | Matsushita Electric Ind Co Ltd | 部品電子カタログ |
JP3562325B2 (ja) * | 1998-07-16 | 2004-09-08 | 松下電器産業株式会社 | 電子部品の実装方法 |
US6571462B1 (en) * | 1999-04-27 | 2003-06-03 | Matsushita Electric Industrial Co., Ltd | Electronic component mounting apparatus using duplicate sources of components |
DE60024375T2 (de) * | 1999-09-03 | 2006-06-14 | Matsushita Electric Ind Co Ltd | Bauteilen-bestückungsverfahren und Einrichtung |
DE60039547D1 (de) * | 1999-09-27 | 2008-08-28 | Matsushita Electric Ind Co Ltd | Bestückungsverfahren und Bestückungsvorrichtung |
JP3531586B2 (ja) * | 2000-06-12 | 2004-05-31 | 松下電器産業株式会社 | 表示パネルの組立装置および組立方法 |
JP3877501B2 (ja) * | 2000-07-07 | 2007-02-07 | 松下電器産業株式会社 | 部品認識データ作成方法及び作成装置並びに電子部品実装装置及び記録媒体 |
KR100581427B1 (ko) * | 2000-08-22 | 2006-05-17 | 마츠시타 덴끼 산교 가부시키가이샤 | 부품 실장 장치 및 방법 |
DE60142604D1 (de) * | 2000-08-29 | 2010-09-02 | Panasonic Corp | Verfahren und Einrichtung zur Montage von Bauteilen |
JP4514321B2 (ja) * | 2000-12-08 | 2010-07-28 | パナソニック株式会社 | 部品実装装置 |
JP2002368495A (ja) * | 2001-06-08 | 2002-12-20 | Matsushita Electric Ind Co Ltd | 部品実装装置及び部品実装方法 |
JP3589658B2 (ja) * | 2001-09-28 | 2004-11-17 | 松下電器産業株式会社 | 最適化装置、装着装置及び電子部品装着システム |
JP3997101B2 (ja) * | 2002-03-18 | 2007-10-24 | 富士機械製造株式会社 | 電子回路部品装着システム |
JP4255267B2 (ja) * | 2002-11-22 | 2009-04-15 | 富士機械製造株式会社 | 作業プログラム適否判定装置を含む対基板作業システムおよび作業プログラム適否判定プログラム |
TW200419640A (en) * | 2003-02-25 | 2004-10-01 | Matsushita Electric Ind Co Ltd | Electronic component placement machine and electronic component placement method |
WO2005022433A2 (en) * | 2003-09-01 | 2005-03-10 | Matsushita Electric Industrial Co., Ltd. | Method for optimization of an order for component mounting and apparatus for optimization of an order for component mounting |
WO2005039268A1 (ja) * | 2003-10-15 | 2005-04-28 | Matsushita Electric Industrial Co., Ltd. | 部品装着装置 |
JP4417779B2 (ja) * | 2004-05-31 | 2010-02-17 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置及び電子部品装着方法 |
JP4563205B2 (ja) * | 2005-02-08 | 2010-10-13 | 富士機械製造株式会社 | 実装された電子部品の検査方法及び装置 |
JP4887234B2 (ja) * | 2007-07-31 | 2012-02-29 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
KR101649855B1 (ko) * | 2010-11-12 | 2016-08-23 | 한화테크윈 주식회사 | 가변 피치 헤드를 이용한 부품 실장 최적화 방법 및 그 방법을 이용한 부품 실장기 |
JP5645681B2 (ja) * | 2011-01-24 | 2014-12-24 | 株式会社日立ハイテクインスツルメンツ | 部品実装装置の設定を算出する演算装置、部品実装装置、及びプログラム |
DE102013207599A1 (de) * | 2013-04-25 | 2014-10-30 | Finetech Gmbh & Co.Kg | Platziervorrichtung und Platzierverfahren zum lagegenauen Ausrichten und /oder Bestücken eines Substrates mit einem Bauelement |
JP6031679B2 (ja) * | 2013-07-30 | 2016-11-24 | パナソニックIpマネジメント株式会社 | 部品実装システムにおける段取り替え作業の指示方法および部品実装システム |
DE102015220746A1 (de) * | 2015-10-23 | 2017-04-27 | Ersa Gmbh | Verfahren und Vorrichtung zur Platzierung elektronischer Bauteile |
-
2014
- 2014-11-11 CN CN201480083216.7A patent/CN107079617B/zh active Active
- 2014-11-11 EP EP14905944.6A patent/EP3220730B1/en active Active
- 2014-11-11 WO PCT/JP2014/079866 patent/WO2016075760A1/ja active Application Filing
- 2014-11-11 US US15/525,813 patent/US11140801B2/en active Active
- 2014-11-11 JP JP2016558479A patent/JP6522644B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63133700A (ja) * | 1986-11-26 | 1988-06-06 | シチズン時計株式会社 | 電子部品自動挿入機における部品挿入位置補正方法 |
JP2001077596A (ja) * | 1999-08-31 | 2001-03-23 | Sanyo Electric Co Ltd | 電子部品装着装置 |
JP2007306040A (ja) * | 1999-09-27 | 2007-11-22 | Matsushita Electric Ind Co Ltd | 部品実装方法及び部品実装装置 |
JP2002252499A (ja) * | 2001-02-23 | 2002-09-06 | Matsushita Electric Ind Co Ltd | 部品実装方法、部品実装機、部品実装順序決定装置、及び、部品実装順序決定プログラム |
JP2003124693A (ja) * | 2001-10-09 | 2003-04-25 | Matsushita Electric Ind Co Ltd | 部品実装方法及び部品実装装置、並びに実装データ作成プログラム及び記録媒体 |
Non-Patent Citations (1)
Title |
---|
See also references of EP3220730A4 * |
Also Published As
Publication number | Publication date |
---|---|
US20170325371A1 (en) | 2017-11-09 |
EP3220730A4 (en) | 2017-12-13 |
EP3220730A1 (en) | 2017-09-20 |
US11140801B2 (en) | 2021-10-05 |
JP6522644B2 (ja) | 2019-05-29 |
EP3220730B1 (en) | 2020-12-23 |
JPWO2016075760A1 (ja) | 2017-08-24 |
CN107079617B (zh) | 2019-08-06 |
CN107079617A (zh) | 2017-08-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2016075760A1 (ja) | 電子部品装着機の制御装置及びその制御装置へのデータ入力装置 | |
JP5440483B2 (ja) | 電子部品実装システムおよび電子部品実装方法 | |
JP4996634B2 (ja) | 実装条件決定方法および実装条件決定装置 | |
JP5845399B2 (ja) | 電子部品実装システムおよび電子部品実装方法 | |
JP2012124350A (ja) | 電子部品実装システムおよび電子部品実装方法 | |
US10743445B2 (en) | Electronic circuit component pick-up instruction data generating device | |
JP5700694B2 (ja) | 製造支援システム | |
JP2008218970A (ja) | 部品実装装置のフィーダ配置方法 | |
JP2012124348A (ja) | 電子部品実装システムおよび電子部品実装方法 | |
JP5970659B2 (ja) | 電子部品実装システムおよび電子部品実装方法 | |
JP4995848B2 (ja) | 実装条件決定方法 | |
JP5038970B2 (ja) | 実装条件決定方法、実装条件決定装置、部品実装方法、部品実装機およびプログラム | |
JP6254004B2 (ja) | フィーダ位置の決定装置とそれを有する電子部品装着装置 | |
CN107114007B (zh) | 电子元件供给系统 | |
US10729048B2 (en) | Optimization program and mounting work system | |
JP2006171916A (ja) | 生産計画方法 | |
EP3021652B1 (en) | Method for allocating electronic components and electronic component mounting system | |
JP6475245B2 (ja) | 基板生産方法及び基板生産の条件決定方法 | |
JP4891290B2 (ja) | 実装条件決定方法 | |
JP2006049545A (ja) | 電子部品の装着方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14905944 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2016558479 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15525813 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
REEP | Request for entry into the european phase |
Ref document number: 2014905944 Country of ref document: EP |