WO2016052161A1 - Grains abrasifs pour polir un matériau métallique dur, composition de polissage et procédé de fabrication d'un produit en métal dur - Google Patents

Grains abrasifs pour polir un matériau métallique dur, composition de polissage et procédé de fabrication d'un produit en métal dur Download PDF

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Publication number
WO2016052161A1
WO2016052161A1 PCT/JP2015/076036 JP2015076036W WO2016052161A1 WO 2016052161 A1 WO2016052161 A1 WO 2016052161A1 JP 2015076036 W JP2015076036 W JP 2015076036W WO 2016052161 A1 WO2016052161 A1 WO 2016052161A1
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Prior art keywords
polishing
abrasive grains
hard metal
surface plate
polishing composition
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PCT/JP2015/076036
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English (en)
Japanese (ja)
Inventor
直也 三輪
圭史 芦高
小島　隆司
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株式会社フジミインコーポレーテッド
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Publication of WO2016052161A1 publication Critical patent/WO2016052161A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives

Definitions

  • the present invention relates to abrasive grains for polishing a hard metal material and use thereof. Specifically, the present invention relates to the above abrasive grains, a polishing composition containing the abrasive grains, and a method for producing a hard metal product using the polishing composition containing the abrasive grains.
  • This application claims priority based on Japanese Patent Application No. 2014-198273 filed on Sep. 29, 2014, the entire contents of which are incorporated herein by reference.
  • Patent Document 1 describes polishing stainless steel using diamond abrasive grains.
  • Patent Document 2 is a technical document relating to polishing of a silicon carbide single crystal rather than a hard metal material.
  • This invention is made
  • Another object of the present invention is to provide a polishing composition containing the above abrasive grains.
  • Another related object is to provide a method of manufacturing a hard metal product using the abrasive grains.
  • an abrasive for polishing a hard metal material supplied to a polishing surface plate is provided.
  • the abrasive grains have an average particle diameter of 2 to 10 ⁇ m.
  • the abrasive grains have a retention rate of 5 to 60% with respect to the polishing surface plate.
  • Such abrasive grains have an average particle diameter suitable for polishing (particularly lapping) of the hard metal having the above-mentioned retention rate in an appropriate range, and thereby processing force by the abrasive grains is applied to the hard metal material as an object to be polished. It can be made to act efficiently. Therefore, according to the said abrasive grain, practical polishing efficiency can be achieved, suppressing raw material cost.
  • a polishing composition containing any of the abrasive grains disclosed herein. According to the polishing composition, practical polishing efficiency can be achieved while reducing raw material costs in polishing hard metal materials.
  • the polishing composition typically further includes a solvent for dispersing the abrasive grains.
  • the concentration of the abrasive grains in the composition is 0.3 to 10% by weight.
  • the polishing composition having an abrasive grain concentration in the above range it is possible to more suitably achieve both a reduction in raw material costs and a good polishing efficiency.
  • a method for manufacturing a hard metal product typically includes setting a hard metal material as an object to be polished in a polishing apparatus equipped with a polishing platen.
  • the method also includes supplying a polishing composition to the polishing surface plate.
  • a polishing composition containing any of the abrasive grains disclosed herein can be used.
  • the method further includes polishing the polishing object by moving the polishing platen relative to the polishing object. According to this method, a hard metal product having a polished surface can be efficiently produced while suppressing raw material costs.
  • a method for polishing a hard metal material typically includes setting a hard metal material as an object to be polished in a polishing apparatus equipped with a polishing platen.
  • the method also includes supplying a polishing composition to the polishing surface plate.
  • a polishing composition containing any of the abrasive grains disclosed herein can be used.
  • the method further includes polishing the polishing object by moving the polishing platen relative to the polishing object. According to this method, the hard metal material can be efficiently polished while suppressing the raw material cost.
  • the polishing platen may be one whose surface is adjusted with green silicon carbide abrasive grains (hereinafter also referred to as “GC abrasive grains”) having an average particle diameter of 25 to 120 ⁇ m. According to such a polishing surface plate, the processing force by the abrasive grains disclosed herein can be efficiently applied to the hard metal material that is an object to be polished.
  • GC abrasive grains green silicon carbide abrasive grains
  • polishing surface plate in any of the techniques disclosed herein, one having a cast iron surface can be preferably employed. In the polishing using such a polishing surface plate (cast iron surface plate), the effects of the present invention can be suitably exhibited.
  • a preferred example of the abrasive grains in any of the techniques disclosed herein is an abrasive grain substantially composed of titanium diboride. According to such abrasive grains, it is possible to particularly suitably achieve both a reduction in raw material costs and a good polishing efficiency.
  • stainless steel can be cited. That is, the technique disclosed herein can be preferably applied to the polishing of stainless steel. Among these, application to stainless steel wrapping is particularly significant.
  • the hard metal material means a material having a relatively high hardness among metal materials, and specifically refers to a metal material having a Vickers hardness exceeding 100 HV.
  • the Vickers hardness indicates the fastness to the indentation pressure, and specifically is a hardness measured by the method described in JIS Z2244: 2009.
  • the hard metal material may be a simple substance or an alloy. Typical examples of the hard metal material include alloy materials such as titanium alloy, nickel alloy, and stainless steel.
  • the titanium alloy is an alloy mainly composed of titanium, and may include at least one selected from the group consisting of aluminum, iron, vanadium, and the like as a metal species other than the main component.
  • the content of metal species other than the main component may be, for example, 3.5 to 30% by weight of the entire titanium alloy.
  • Examples of the titanium alloy include 11-23 types, 50 types, 60 types, 61 types, and 80 types in the types described in JIS H4600: 2012.
  • the nickel alloy is an alloy containing nickel as a main component, and may include at least one selected from the group consisting of iron, chromium, molybdenum and cobalt as a metal species other than the main component.
  • the content of metal species other than the main component may be, for example, 20 to 75% by weight of the entire nickel alloy.
  • the nickel alloy include NCF600, 601, 625, 750, 800, 800H, 825, NW0276, 4400, 6002, 6022 and the like in the alloy number described in JIS H4551: 2000.
  • Stainless steel is an alloy containing iron as a main component, and may include at least one selected from the group consisting of chromium, nickel, molybdenum, and manganese as a metal species other than the main component.
  • the content of metal species other than the main component may be, for example, 10 to 50% by weight of the entire stainless steel.
  • Examples of stainless steel include SUS201, 303, 303Se, 304, 304L, 304NI, 305, 305JI, 309S, 310S, 316, 316L, 321, 347, 384, in the symbols of the type described in JIS G4303: 2005. XM7, 303F, 303C, 430, 430F, 434, 410, 416, 420J1, 420J2, 420F, 420C, 631J1 and the like.
  • the material of the abrasive grains is not particularly limited.
  • diamond such as titanium diboride, zirconium boride, tantalum boride, chromium boride, molybdenum boride, tungsten boride, lanthanum boride
  • carbide such as boron carbide, silicon carbide
  • aluminum oxide oxidation Abrasive grains substantially composed of any of oxides such as silicon, zirconium oxide, titanium oxide, and cerium oxide
  • nitrides such as boron nitride (typically cubic boron nitride); and the like.
  • abrasive grains having high hardness From the viewpoint of polishing efficiency, it is preferable to use abrasive grains having high hardness.
  • abrasive grain substantially composed of either titanium diboride or diamond is exemplified.
  • composition of the abrasive grains “substantially consisting of X” or “substantially consisting of X” means that the proportion of X in the abrasive grains (the purity of X) is the weight. It is 90% or more on a standard basis, preferably 95% or more, more preferably 97% or more, still more preferably 98% or more, for example 99% or more.
  • abrasive grains in the technology disclosed herein include abrasive grains substantially composed of titanium diboride (hereinafter also referred to as “titanium diboride abrasive grains”). Titanium diboride used as an abrasive is typically a high hardness material having a Vickers hardness (Hv) of 2000 or more. In addition to such high hardness, titanium diboride abrasive grains are also preferable in that they have higher heat resistance (difficult to cause surface alteration due to heat) than diamond abrasive grains.
  • titanium diboride abrasive grains are also preferable in that they have higher heat resistance (difficult to cause surface alteration due to heat) than diamond abrasive grains.
  • titanium diboride abrasive grains include a method in which titanium and boron are directly reacted, a method in which titanium oxide and boron oxide are reduced, and a method in which a titanium and boron halide is vapor-phase reacted. (For example, see Japanese Patent Application Publication No. 5-139725).
  • titanium diboride abrasive grains titanium diboride powder that can be generally obtained or manufactured can be used without particular limitation without being limited by the manufacturing method and form.
  • Titanium diboride is a crystalline component that typically has a hexagonal crystal structure.
  • the size of crystals is not limited, and an amorphous component may be included.
  • an element other than titanium and boron for example, impurities such as carbon, iron, oxygen, nitrogen, silicon, aluminum, and zirconium, may be included as long as the performance of the abrasive grains is not significantly impaired.
  • impurities such as carbon, iron, oxygen, nitrogen, silicon, aluminum, and zirconium, may be included as long as the performance of the abrasive grains is not significantly impaired.
  • the purity of titanium diboride in the titanium diboride abrasive grains is higher.
  • the purity of titanium diboride is preferably 90% by weight or more, preferably 95% by weight or more, and more preferably 99% by weight or more.
  • the purity of titanium diboride can be measured by, for example, the measured value of titanium diboride using a fluorescent X-ray apparatus, or by the intensity of a diffraction peak by a powder X-ray diffraction method.
  • the purity measured by the fluorescent X-ray apparatus and the purity measured based on the powder X-ray diffraction method are different, the measurement result with higher purity is adopted as the purity of the titanium diboride.
  • the average particle diameter of the abrasive grains is typically 1 ⁇ m or more, and usually 2 ⁇ m or more. As the average particle size of the abrasive grains increases, the polishing efficiency tends to improve. From this viewpoint, the average particle diameter of the abrasive grains is preferably 2.2 ⁇ m or more, more preferably 2.5 ⁇ m or more, and further preferably 3 ⁇ m or more. In the present specification, unless otherwise specified, the average particle size of abrasive grains is a particle size (50%) at an integrated value of 50% in a volume-based particle size distribution determined by a laser diffraction / scattering particle size distribution measuring apparatus. Volume average particle diameter). As a laser diffraction / scattering particle size distribution measuring apparatus, for example, “LA-950” manufactured by Horiba, Ltd. can be used.
  • the average particle diameter of the abrasive grains is typically 20 ⁇ m or less, and it is usually preferably 10 ⁇ m or less because the preferable retention disclosed herein is easily obtained.
  • the average particle size of the abrasive grains decreases, the dispersion stability of the abrasive grains in the polishing composition tends to improve.
  • the surface accuracy of the hard metal material after polishing tends to be improved. For example, the generation of scratches on the hard metal material due to polishing is suppressed, and the roughness of the hard material surface after polishing (arithmetic average roughness (Ra)) also tends to decrease. From these circumstances, the average particle diameter of the abrasive grains is preferably 8 ⁇ m or less, and more preferably 5 ⁇ m or less.
  • the technique disclosed herein can be preferably implemented in a mode in which the retention rate of the abrasive grains with respect to the polishing surface plate is 5% or more.
  • the retention rate is more preferably 10% or more, and further preferably 15% or more. Note that how to obtain the retention rate will be described later. Further, the polishing efficiency tends to decrease even if the retention rate of the abrasive grains with respect to the polishing surface plate is too high. Therefore, the retention is suitably 60% or less, preferably 55% or less, more preferably 40% or less, and even more preferably 35% or less.
  • abrasive grains having the above-mentioned retention in the range of 5 to 60% can be mentioned.
  • the processing force by the abrasive grains can be efficiently applied to the hard metal material.
  • practical polishing efficiency can be achieved not only in the polishing mode using diamond abrasive grains but also in the polishing mode using other abrasive grains such as titanium diboride abrasive grains. Therefore, it is possible to suitably achieve both a reduction in raw material cost and a practical polishing efficiency. Better results can be achieved with abrasive grains having a retention rate in the range of 15-35%.
  • the polishing composition disclosed herein contains at least abrasive grains, and typically contains abrasive grains and a solvent for dispersing the abrasive grains.
  • abrasive grain 1 type can be used individually or in combination of 2 or more types among the abrasive grains mentioned above.
  • a polishing composition containing at least titanium diboride abrasive grains as abrasive grains is preferable. In such a polishing composition, it is possible to suitably achieve both a reduction in raw material costs and a good polishing efficiency.
  • the polishing composition disclosed herein may contain a combination of titanium diboride and other abrasive grains.
  • the other abrasive grains include diamond; borides such as zirconium boride, tantalum boride, chromium boride, molybdenum boride, tungsten boride, and lanthanum boride; carbides such as boron carbide and silicon carbide; Abrasive grains substantially composed of any of oxides such as aluminum, silicon oxide, zirconium oxide, titanium oxide, and cerium oxide; nitrides such as boron nitride (typically cubic boron nitride); Can be mentioned. Quartz etc.
  • the abrasive grain which consists of silicon oxide substantially is mentioned as an example of the abrasive grain which consists of silicon oxide substantially. From the viewpoint of polishing efficiency, it is generally advantageous that the proportion of titanium diboride abrasive grains in the entire abrasive grains contained in the polishing composition is high.
  • the proportion of titanium diboride abrasive grains in the entire abrasive grains contained in the polishing composition is preferably 70% by weight or more, and more preferably 90% by weight or more.
  • the solvent used in the polishing composition is not particularly limited as long as it can disperse the abrasive grains.
  • water, and organic solvents such as alcohols, ethers, glycols, and various oils can be used.
  • the oils include mineral oil, synthetic oil, vegetable oil and the like.
  • Such a solvent can be used individually by 1 type or in combination of 2 or more types.
  • water or a mixed solvent containing water as a main component can be preferably employed.
  • 90% by volume or more of the solvent contained in the polishing composition is preferably water, and more preferably 95% by volume or more (typically 99 to 100% by volume) is water.
  • ion exchange water deionized water
  • pure water, or the like can be used.
  • the abrasive grain concentration in the polishing composition is not particularly limited.
  • the abrasive concentration can be 0.05% by weight or more, and usually 0.1% by weight or more is appropriate. As the abrasive concentration increases, a higher polishing efficiency tends to be obtained. From this viewpoint, the abrasive concentration is preferably 0.3% by weight or more, and more preferably 0.5% by weight or more. From the viewpoint of raw material cost, the abrasive concentration in the polishing composition is usually 20% by weight or less, preferably 10% by weight or less. In a preferred embodiment, the abrasive concentration can be 5% by weight or less, and may be 3% by weight or less.
  • the abrasive concentration of the polishing composition is preferably 0.5 to 5% by weight, more preferably 0.5 to 3% by weight.
  • the processing force by the abrasive grains can be efficiently applied to the hard metal material.
  • the abrasive concentration can be 2% by weight or less (eg 0.5 to 2% by weight), further 1% by weight or less (eg 0.5 to 1% by weight). In this case, a practical polishing efficiency can be achieved. According to this aspect, it is possible to achieve both high cost reduction and raw material cost reduction.
  • a polishing agent may be added to the polishing composition as necessary for the purpose of improving dispersion stability.
  • the dispersant include polyphosphates such as sodium hexametaphosphate and sodium pyrophosphate.
  • Other examples of the dispersant include water-soluble polymers and salts thereof.
  • water-soluble polymers that can be used as dispersants include polycarboxylic acids, polycarboxylic acid salts, polysulfonic acid, polysulfonic acid salts, polyamines, polyamides, polyols, polysaccharides, and their derivatives and copolymers. Etc.
  • polystyrenesulfonic acid and its salt polyisoprenesulfonic acid and its salt, polyacrylic acid and its salt, polymaleic acid, polyitaconic acid, polyvinyl acetate, polyvinyl alcohol, polyglycerin, polyvinylpyrrolidone, isoprenesulfonic acid And acrylic acid copolymer, polyvinylpyrrolidone-polyacrylic acid copolymer, polyvinylpyrrolidone-vinyl acetate copolymer, salt of naphthalenesulfonic acid formalin condensate, copolymer of diallylamine hydrochloride and sulfur dioxide, carboxymethylcellulose Carboxymethylcellulose salts, hydroxyethylcellulose, hydroxypropylcellulose, pullulan, chitosan, chitosan salts and the like.
  • the weight average molecular weight (Mw) of the water-soluble polymer is not particularly limited. From the viewpoint of sufficiently exerting the effect of improving dispersion stability, it is usually appropriate that Mw is about 10,000 or more (for example, more than 50,000).
  • the upper limit of Mw is not particularly limited, but it is usually about 800,000 or less (eg, 600,000 or less, typically 300,000 or less) from the viewpoints of filterability and detergency.
  • Mw of the water-soluble polymer a value based on gel permeation chromatography (GPC) (aqueous, converted to polyethylene oxide) can be adopted.
  • GPC gel permeation chromatography
  • the content of the dispersant is, for example, 0.001% by weight or more, preferably 0.005% by weight. Above, more preferably 0.01% by weight or more, still more preferably 0.02% by weight or more.
  • the content is usually suitably 10% by weight or less, preferably 5% by weight or less, for example 1% by weight or less.
  • the surfactant here is typically a compound having a lower molecular weight than that of the dispersant, and preferably a compound having a molecular weight of less than 10,000.
  • the surfactant in the polishing composition is adsorbed on the surface of abrasive grains and hard metal materials to change their surface state, change the dispersibility of abrasive grains, and form a protective film on the surface of hard metal materials You can make it. By this, the effect of suppressing generation
  • any of anionic, nonionic, and cationic surfactants can be used. Usually, either one or both of an anionic surfactant and a nonionic surfactant can be preferably used.
  • the nonionic surfactant include a polymer having a plurality of the same or different types of oxyalkylene units, and a compound in which an alcohol, hydrocarbon or aromatic ring is bonded to the polymer.
  • polyoxyethylene alkyl ether polyoxyethylene polyoxypropylene alkyl ether, polyoxyethylene polyoxybutylene alkyl ether, polyoxyethylene polyoxypropylene polyoxybutylene alkyl ether, polyoxyethylene carboxylic acid ester, polyoxyethylene Oxyethylene carboxylic acid diester, polyoxyethylene polyoxypropylene carboxylic acid ester, polyoxyethylene polyoxybutylene carboxylic acid ester, polyoxyethylene polyoxypropylene polyoxybutylene carboxylic acid ester, polyoxyethylene polyoxypropylene copolymer, polyoxyethylene Polyoxybutylene copolymer, polyoxyethylene polyoxypropylene polyoxybutylene copolymer , Polyoxyethylene sorbitan fatty acid ester and polyoxyethylene sorbite fatty acid ester, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan monooleate, polyoleic
  • anionic surfactants include sulfonic acid surfactants, and more specifically alkyl sulfonic acids, alkyl ether sulfonic acids, polyoxyethylene alkyl ether sulfonic acids, alkyl aromatic sulfonic acids, alkyl ether aromatics. Examples thereof include sulfonic acid and polyoxyethylene alkyl ether aromatic sulfonic acid.
  • the content of the surfactant is, for example, 0.001% by weight or more, preferably 0.005. % By weight or more, more preferably 0.01% by weight or more, still more preferably 0.02% by weight or more.
  • the content is usually suitably 10% by weight or less, preferably 5% by weight or less, for example 1% by weight or less.
  • the pH of the polishing composition is not particularly limited. Usually, it is appropriate to adjust the pH of the polishing composition to 1 or more and 14 or less. When the pH of the polishing composition is within the above range, practical polishing efficiency is easily achieved. It is preferable to use a polishing composition having an appropriate pH in consideration of the vulnerability of the polishing object to pH.
  • the pH of the polishing composition can be 1 or more and 8 or less, and more preferably 1 or more and 5 or less (for example, 2 or more and 4 or less).
  • various acids, bases or salts thereof can be used.
  • organic acids such as citric acid and other organic carboxylic acids, organic phosphonic acids and organic sulfonic acids, inorganic acids such as phosphoric acid, phosphorous acid, sulfuric acid, nitric acid, hydrochloric acid, boric acid and carbonic acid, tetramethoxyammonium
  • organic bases such as oxide, trimethanolamine and monoethanolamine
  • inorganic bases such as potassium hydroxide, sodium hydroxide and ammonia, and salts thereof can be used.
  • acids and bases in particular, when a weak acid and a strong base, a strong acid and a weak base, or a combination of a weak acid and a weak base, a buffering action of pH can be expected. Moreover, when it is set as the combination of a strong acid and a strong base among said acids and bases, not only pH but electrical conductivity can be adjusted with a small amount.
  • the polishing composition can contain components other than those described above, if necessary.
  • such components include anticorrosives, chelating agents, preservatives, antifungal agents and the like.
  • corrosion inhibitor include amines, pyridines, tetraphenylphosphonium salts, benzotriazoles, triazoles, tetrazoles, benzoic acid and the like.
  • chelating agents include carboxylic acid chelating agents such as gluconic acid, amine chelating agents such as ethylenediamine, diethylenetriamine, and trimethyltetraamine, ethylenediaminetetraacetic acid, nitrilotriacetic acid, hydroxyethylethylenediaminetriacetic acid, triethylenetetraminehexaacetic acid.
  • Polyaminopolycarboxylic chelating agents such as diethylenetriaminepentaacetic acid, 2-aminoethylphosphonic acid, 1-hydroxyethylidene-1,1-diphosphonic acid, aminotri (methylenephosphonic acid), ethylenediaminetetrakis (methylenephosphonic acid), diethylenetriaminepenta ( Methylenephosphonic acid), ethane-1,1-diphosphonic acid, ethane-1,1,2-triphosphonic acid, methanehydroxyphosphonic acid, 1-phosphonobutane-2,3,4-to Organic phosphonic acid chelating agents such as carboxylic acid, phenol derivatives, 1,3-diketones and the like.
  • preservatives include sodium hypochlorite and the like.
  • antifungal agents include oxazolines such as oxazolidine-2,5-dione.
  • the method for producing the polishing composition disclosed herein is not particularly limited, and a known method can be appropriately employed.
  • a polishing composition can be produced by mixing abrasive grains, a solvent, and other components used as necessary.
  • the polishing composition as described above is typically used in the polishing of a hard metal material as an object to be polished in the form of a polishing liquid containing the polishing composition.
  • the polishing liquid may be prepared, for example, by diluting a polishing composition. Or you may use polishing composition as polishing liquid as it is. That is, the concept of the polishing composition in the technology disclosed herein includes both the polishing liquid (working slurry) supplied to the object to be polished and the concentrated liquid diluted and used as the polishing liquid. .
  • the polishing composition disclosed herein may be in a concentrated form (in the form of a concentrated liquid) before being supplied to the object to be polished.
  • a polishing composition in the form of a concentrated solution is advantageous from the viewpoints of convenience, cost reduction, etc. during production, distribution, storage and the like.
  • the concentration factor can be, for example, about 1.5 to 50 times. From the viewpoint of storage stability of the concentrate, a concentration ratio of about 2 to 20 times (typically 2 to 10 times) is usually appropriate.
  • the polishing composition in the form of a concentrated liquid can be suitably used in a mode in which a polishing liquid is prepared by diluting at a desired timing and the polishing liquid is supplied to a polishing object.
  • the abrasive grains disclosed herein or the polishing composition containing the abrasive grains can be used for polishing an object to be polished (here, a hard metal material) using a general polishing apparatus.
  • the present invention can be applied to both polishing using a single-side polishing apparatus and polishing using a double-side polishing apparatus.
  • a single-side polishing apparatus a polishing object is held by using a holder called a carrier, and the surface plate is rotated by pressing the surface plate against one side of the polishing object while supplying the polishing composition. Polish one side.
  • a polishing object is held using a holder called a carrier, a surface plate is pressed against the opposite surface of the polishing object while supplying the polishing composition from above, and they are rotated in a relative direction.
  • lapping the method of directly polishing the polishing object using the surface of the surface plate.
  • a polishing pad is attached to the surface of the surface plate, and polishing is performed between the attached polishing pad surface and the polishing object. This method is called policing.
  • the abrasive grains disclosed herein or a polishing composition containing the abrasive grains are typically supplied to a metal polishing platen for polishing a hard metal material, that is, used for wrapping a hard metal material. It is done.
  • the polishing surface plate used for lapping is required to have a property that can be easily processed in order to maintain the accuracy of the surface surface (surface facing the object to be polished). For this reason, a polishing surface plate in which at least the surface plate surface is made of a metal such as cast iron, tin, copper, or a copper alloy is preferably used.
  • a plate having a groove on the surface of the platen may be used for the purpose of stably supplying the polishing composition and adjusting the processing pressure.
  • the shape and depth of the groove are arbitrary, and for example, a groove in which a groove is engraved in a lattice shape or a radial shape can be used.
  • the surface of the polishing surface plate (surface plate surface) preferably has a surface state in which the retention rate of abrasive grains applied to the polishing of the hard metal material by the polishing surface plate is in the above-described preferable range.
  • the retention rate is a guideline for determining how much of the fine grooves on the surface plate have a shape and size suitable for holding abrasive grains (hereinafter also referred to as “effective grooves”) on the surface plate surface.
  • effective grooves As a useful index.
  • the shape of the minute groove is not particularly limited.
  • the aspect ratio of the fine groove is not particularly limited.
  • the concept of the microgroove here may include a shape generally called a dent or a dent.
  • the width is a value of “average particle diameter + 0.1 ⁇ m” or more and the depth is a value of 1/2 or more of the average particle diameter in relation to the average particle diameter of the abrasive grains.
  • a minute groove is recognized as an “effective groove” for the abrasive grains. If the width of the minute groove is a value of “average particle diameter + 0.1 ⁇ m” or more, it is considered that the opening has a sufficient opening size to fit the abrasive grains. Further, if the depth of the minute groove is a value of 1/2 or more of the average particle diameter, the fitted abrasive grains can be held to a certain degree of stability, and the polishing power of the abrasive grains is effective for the object to be polished. It is thought that it can act. Specifically, the retention rate is determined according to “retention rate measurement” described in Examples described later.
  • the width of the micro-grooves recognized as effective grooves may be a value equal to or greater than “average particle diameter + 0.1 ⁇ m” (that is, a value larger than the average particle diameter by 0.1 ⁇ m or more), and the upper limit of the width is not particularly limited. . From the viewpoint of the stability of holding the abrasive grains, a micro-groove whose width is 7 times or less (preferably 5 times or less, for example, 3 times or less) of “average particle diameter +0.1 ⁇ m” is preferable.
  • the depth of the fine groove to be recognized as an effective groove may be a value that is 1/2 or more of the average particle diameter (that is, 0.5 times or more of the average particle diameter), and the upper limit of the depth is not particularly limited.
  • the value of the depth of the fine groove is preferably 0.5 times or more and 1.5 times or less of the average particle diameter, and more than 0.5 times and less than 1 time. More preferably, it is 0.5 times or more and less than 0.9 times.
  • the technology disclosed herein is a value that is 1 to 5 times the width of “average particle size + 0.1 ⁇ m”, and the depth is a value that is 0.5 to 1 time less than the average particle size.
  • the micro groove is recognized as a groove particularly suitable for holding abrasive grains (hereinafter also referred to as “high effective groove”), and can be preferably implemented in a mode in which the retention calculated for the high effective groove is within the above-described preferable range. .
  • the retention rate can be adjusted to be within a preferable range disclosed herein, for example, by changing one or both of the average particle diameter of the abrasive grains used and the surface condition of the polishing surface plate.
  • a method of changing the average particle diameter of the abrasive grains a method of changing the abrasive grains used to one having a different average particle diameter or a method of blending two or more kinds of abrasive grains having different particle diameters at an appropriate ratio Etc. can be adopted.
  • the surface state of the polishing surface plate can be changed by adjusting the surface state of the polishing surface plate (that is, performing surface adjustment).
  • the surface adjustment of the polishing surface plate can be performed, for example, by polishing the surface of the polishing surface plate using a surface adjustment slurry containing abrasive grains having an appropriate average particle diameter and roughening the surface to a certain roughness. it can. Therefore, it is desirable to use a material that easily roughens the polishing surface plate as the abrasive.
  • abrasive grains that can be preferably used for surface adjustment of the polishing surface plate include high-hardness abrasive grains such as GC abrasive grains, titanium diboride abrasive grains, and boron carbide abrasive grains. Among these, GC abrasive grains are preferable.
  • the size of the abrasive grains used for the surface adjustment of the polishing surface plate can be selected according to the average particle diameter of the abrasive grains used for polishing the hard metal material and the target retention value.
  • abrasive grains for example, GC abrasive grains
  • it can employ
  • the surface-adjusting abrasive grains two or more kinds of abrasive grains having different one or both of size and material may be blended and used.
  • the abrasive concentration in the surface adjustment slurry and the polishing conditions in the surface adjustment of the polishing surface plate using the slurry are not particularly limited, and can be appropriately set so as to obtain a desired surface state.
  • the abrasive concentration in the surface conditioning slurry can be about 5 to 20% by weight (for example, 10 to 15% by weight).
  • the matters disclosed by the present specification include abrasive grains used for surface adjustment of the polishing surface plate in any of the techniques disclosed herein. . Moreover, the slurry for surface adjustment containing this abrasive grain is contained.
  • the surface adjusting abrasive an abrasive having an average particle diameter of 25 to 120 ⁇ m (more preferably 45 to 75 ⁇ m) can be preferably used.
  • the abrasive grains may include at least one of GC abrasive grains, titanium diboride abrasive grains, and boron carbide abrasive grains. Among these, GC abrasive grains are preferable.
  • the method for producing a hard metal product disclosed herein may further include a step of adjusting the surface of the polishing surface plate using the surface adjustment slurry.
  • a hard metal material polishing comprising any of the hard metal material polishing compositions disclosed herein and any of the surface conditioning slurries disclosed herein.
  • a composition set is included. This polishing composition set may be an embodiment containing abrasive grains constituting the composition instead of the hard metal material polishing composition. Further, the hard metal material polishing composition set may include an abrasive grain constituting the slurry instead of the surface conditioning slurry.
  • the polishing conditions of the object to be polished are not particularly limited.
  • the polishing pressure per 1 cm 2 of the processing area of the object to be polished is preferably 50 g or more, more preferably 100 g or more.
  • the polishing pressure per 1 cm 2 of processing area is 1000 g or less.
  • the linear velocity can generally vary due to the influence of the platen rotation speed, the carrier rotation speed, the size of the polishing object, the number of polishing objects, and the like.
  • the linear velocity is preferably 10 m / min or more, and more preferably 30 m / min or more. Higher polishing efficiency tends to be obtained by increasing the linear velocity.
  • the linear velocity is usually preferably 300 m / min or less, and more preferably 200 m / min or less.
  • the supply amount of the polishing composition at the time of polishing is not particularly limited.
  • the supply amount is preferably set so that the polishing composition is sufficiently supplied between the object to be polished and the polishing surface plate so as to be supplied to the entire surface without unevenness.
  • a suitable supply amount may vary depending on the material of the object to be polished, the configuration of the polishing apparatus, and other polishing conditions. A person skilled in the art can find an appropriate supply amount without undue burden based on the description in the present specification and common general technical knowledge.
  • the polishing composition disclosed herein may be recovered after use and reused (circulated). More specifically, the used polishing composition discharged from the polishing apparatus may be once collected in a tank and supplied from the tank to the polishing apparatus again. In this case, the amount of the used polishing composition as a waste liquid can be reduced. This is preferable from the viewpoint of reducing environmental burden and cost.
  • the replenishing components may be added individually to the used polishing composition, or may be added to the used polishing composition in the form of a mixture containing two or more components in any concentration. .
  • any of the abrasive grains disclosed herein or the abrasive grains it is preferable to perform further polishing after polishing (lapping) with a polishing surface plate using a polishing composition containing.
  • the abrasive grains of the polishing composition used for the polishing are preferably those having an average particle diameter of 0.30 ⁇ m or less, more preferably from the viewpoint of reducing waviness, roughness, defects, etc. of the surface of the object to be polished. It is 0.25 ⁇ m or less, more preferably 0.20 ⁇ m or less.
  • the average particle size of the abrasive grains contained in the polishing composition is preferably 0.01 ⁇ m or more, more preferably 0.02 ⁇ m or more.
  • Abrasive grains suitably used in the polishing composition can be colloidal oxide particles such as colloidal silica.
  • the average particle diameter of the abrasive grains in the polishing composition can be measured by a dynamic light scattering method using, for example, “Nanotrac UPA-UT151” manufactured by Nikkiso Co., Ltd.
  • the pH of the polishing composition is not particularly limited, but is preferably 1 to 4 or 8 to 11.
  • the pH of the polishing composition can be adjusted using various acids, bases or salts thereof as in the polishing composition used for polishing (lapping) with a polishing platen.
  • the polishing composition may contain additives such as a chelating agent, a water-soluble polymer, a surfactant, an antiseptic, an antifungal agent, and an antirust agent as necessary.
  • the polishing composition may be prepared by diluting a stock solution of the composition with water.
  • Adjustment condition A As a polishing machine for adjusting the surface of the polishing surface plate, a lens polishing machine “AL-2” manufactured by Udagawa Seiko Co., Ltd. was used. The polishing surface plate as a processing object was set on the cast iron surface plate of the polishing machine, and the surface plate was rotated while supplying the surface adjustment slurry to adjust the surface. As the slurry for surface adjustment, a slurry containing GC abrasive grains having an average particle diameter of 48 ⁇ m and GC abrasive grains having an average particle diameter of 74 ⁇ m at a weight ratio of 1: 1 at a total concentration of 13% by weight was used.
  • the slurry supply rate was 14 mL / min, and the platen speed was 130 rpm.
  • the surface adjustment time was set in the range of 1.5 to 2 hours so that the in-plane flatness of the polishing platen was within ⁇ 5 ⁇ m.
  • In-plane flatness of the polishing surface plate is measured along four lines intersecting at an angle of 45 degrees through the center of the object to be processed using a micro gauge “HYPREZ DIVISION” manufactured by Nippon Engis Co., Ltd. It was evaluated by performing.
  • Adjustment conditions B to E The surface adjustment of the polishing surface plate was performed in the same manner as in the adjustment condition A, except that the average particle diameter of the abrasive grains contained in the surface adjustment slurry was changed as follows. All the abrasive grains used were GC abrasive grains manufactured by Fujimi Incorporated Co., Ltd., and the concentration of the abrasive grains in the surface adjustment slurry was 13 wt%. Adjustment condition B: average particle size 74 ⁇ m Adjustment condition C: average particle size 100 ⁇ m Condition D: Average particle size 48 ⁇ m Condition E: Average particle size 15 ⁇ m
  • the surface of the polishing surface plate adjusted under the above conditions was observed with a shape measurement laser microscope “VK-X200” manufactured by Keyence Corporation.
  • the observation locations were selected so that the portions other than the central portion of the polishing surface plate were increased along the radial direction of the polishing surface plate by 5 points and the distance from the center increased at substantially equal intervals.
  • the width and depth of the microgrooves existing on the surface of the polishing surface plate were measured for a range on a line segment having a length of 100 ⁇ m along the radial direction of the polishing surface plate.
  • the width of the fine groove is not less than “average particle diameter + 0.1 ⁇ m” and the depth is 1 of the average particle diameter.
  • the minute groove having a value of / 2 or more is detected as an effective groove, and the retention ratio is calculated by calculating the ratio of the total width of the effective grooves to the total measurement length (that is, 500 ⁇ m) in the above five observation fields. Asked.
  • variety of each microgroove was measured along the said line segment.
  • abrasive grains As abrasive grains, four types of titanium diboride (TiB 2 ) powders having an average particle diameter of 2.1 ⁇ m, 2.6 ⁇ m, 3.7 ⁇ m, and 7.7 ⁇ m were prepared. After adding a certain amount of 20 g / L citric acid and 5 g / L polyacrylic acid as additives to these abrasive grains, the above-mentioned abrasive grains were added at a concentration of 0.2 to 20% by weight (the respective concentrations shown in Table 1). It was prepared so that it might become the polishing liquid contained in. The pH of the polishing liquid thus prepared was about 3.3 to 3.5.
  • the average particle size of the titanium diboride powder is a value measured by a laser diffraction / scattering particle size distribution measuring apparatus “LA-950” manufactured by Horiba, Ltd.
  • Examples 1 to 23 A polishing platen whose surface was adjusted under the conditions shown in Table 1 was attached to a polishing machine “Fact 200” manufactured by Nanofactor. Three stainless steel plates (disks made of SUS304 and having a diameter of 25.4 mm) as an object to be polished were set in this polishing machine. The polishing liquid having the composition shown in Table 1 was supplied to the polishing machine, and lapping was performed under the following conditions. [Wrapping conditions] Polishing load: 170 g / cm 2 Surface plate rotation speed: 75 rpm (linear speed 47 m / min) Polishing liquid supply rate: 7 mL / min
  • Examples 24-26 A polishing pad was attached to a polishing surface plate whose surface was not adjusted, and polishing liquids having the compositions shown in Table 1 were supplied from the polishing liquids prepared above, and lapping was performed under the above conditions.
  • a polishing pad a hard urethane pad “NP-3100N / Perforation” manufactured by Toyo Advanced Technology Co., Ltd. was used.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Cette invention concerne des grains abrasifs destinés à alimenter une table de polissage pour polir un matériau métallique dur à une efficacité plus élevée. Les grains abrasifs ont une taille moyenne de grain de 2 à 10 µm et présentent un taux de retenue dans la table de polissage de 5 à 60 %. Une composition de polissage comprenant les grains abrasifs et un procédé de fabrication d'un matériau métallique dur à l'aide de la composition sont en outre décrits.
PCT/JP2015/076036 2014-09-29 2015-09-14 Grains abrasifs pour polir un matériau métallique dur, composition de polissage et procédé de fabrication d'un produit en métal dur WO2016052161A1 (fr)

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JP2014-198273 2014-09-29
JP2014198273A JP2016069450A (ja) 2014-09-29 2014-09-29 硬質金属材料研磨用砥粒、研磨用組成物および硬質金属製品製造方法

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CN112538623A (zh) * 2020-12-01 2021-03-23 上海易慧机电科技有限公司 一种不锈钢表面钝化工艺
CN113646126A (zh) * 2019-04-04 2021-11-12 马自达汽车株式会社 双曲面齿轮的制造方法

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JP2002283218A (ja) * 2001-03-23 2002-10-03 Noritake Super Abrasive:Kk 研磨布用ドレッサ
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WO2009034924A1 (fr) * 2007-09-10 2009-03-19 Bando Chemical Industries, Ltd. Composition de pâte de polissage magnétorhéologique
JP2010522093A (ja) * 2007-03-21 2010-07-01 スリーエム イノベイティブ プロパティズ カンパニー 表面の欠陥を除去する方法
JP2012166326A (ja) * 2011-02-16 2012-09-06 Nihon Micro Coating Co Ltd 結晶材料からなる被研磨物を研磨するための研磨盤とその製造方法、及び研磨方法
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JP2002060777A (ja) * 2000-08-22 2002-02-26 Ishii Hyoki Corp ワイヤーソー用水性スラリー
JP2004508947A (ja) * 2000-09-08 2004-03-25 スリーエム　イノベイティブ　プロパティズ　カンパニー 研磨材物品、ならびにその製造方法および使用方法
JP2002283218A (ja) * 2001-03-23 2002-10-03 Noritake Super Abrasive:Kk 研磨布用ドレッサ
JP2005518091A (ja) * 2002-02-11 2005-06-16 キャボット マイクロエレクトロニクス コーポレイション Ｃｍｐのための正電荷高分子電解質で処理したアニオン性研磨粒子
JP2010522093A (ja) * 2007-03-21 2010-07-01 スリーエム イノベイティブ プロパティズ カンパニー 表面の欠陥を除去する方法
WO2009034924A1 (fr) * 2007-09-10 2009-03-19 Bando Chemical Industries, Ltd. Composition de pâte de polissage magnétorhéologique
JP2012166326A (ja) * 2011-02-16 2012-09-06 Nihon Micro Coating Co Ltd 結晶材料からなる被研磨物を研磨するための研磨盤とその製造方法、及び研磨方法
JP2014117794A (ja) * 2012-12-19 2014-06-30 Fujibo Holdings Inc ダイヤモンドラッピング用樹脂定盤及びそれを用いたラッピング方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113646126A (zh) * 2019-04-04 2021-11-12 马自达汽车株式会社 双曲面齿轮的制造方法
CN113646126B (zh) * 2019-04-04 2023-10-20 马自达汽车株式会社 双曲面齿轮的制造方法
CN112538623A (zh) * 2020-12-01 2021-03-23 上海易慧机电科技有限公司 一种不锈钢表面钝化工艺

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