WO2016046956A1 - 処理装置、コントローラ、記録媒体及び処理システム - Google Patents
処理装置、コントローラ、記録媒体及び処理システム Download PDFInfo
- Publication number
- WO2016046956A1 WO2016046956A1 PCT/JP2014/075644 JP2014075644W WO2016046956A1 WO 2016046956 A1 WO2016046956 A1 WO 2016046956A1 JP 2014075644 W JP2014075644 W JP 2014075644W WO 2016046956 A1 WO2016046956 A1 WO 2016046956A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- file
- predetermined
- data
- editing
- edit
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/60—Protecting data
- G06F21/62—Protecting access to data via a platform, e.g. using keys or access control rules
- G06F21/6209—Protecting access to data via a platform, e.g. using keys or access control rules to a single file or object, e.g. in a secure envelope, encrypted and accessed using a key, or with access control rules appended to the object itself
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/60—Protecting data
- G06F21/604—Tools and structures for managing or administering access control systems
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
- G06F21/31—User authentication
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/60—Protecting data
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/60—Protecting data
- G06F21/602—Providing cryptographic facilities or services
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F8/00—Arrangements for software engineering
- G06F8/60—Software deployment
- G06F8/61—Installation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T11/00—2D [Two Dimensional] image generation
- G06T11/20—Drawing from basic elements, e.g. lines or circles
- G06T11/206—Drawing of charts or graphs
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T11/00—2D [Two Dimensional] image generation
- G06T11/60—Editing figures and text; Combining figures or text
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2221/00—Indexing scheme relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F2221/21—Indexing scheme relating to G06F21/00 and subgroups addressing additional information or applications relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F2221/2141—Access rights, e.g. capability lists, access control lists, access tables, access matrices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F8/00—Arrangements for software engineering
- G06F8/30—Creation or generation of source code
- G06F8/33—Intelligent editors
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F8/00—Arrangements for software engineering
- G06F8/30—Creation or generation of source code
- G06F8/36—Software reuse
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2200/00—Indexing scheme for image data processing or generation, in general
- G06T2200/24—Indexing scheme for image data processing or generation, in general involving graphical user interfaces [GUIs]
Definitions
- the present invention relates to management of a specific edit file used in a processing apparatus that processes an object to be processed.
- a processing apparatus such as a substrate processing apparatus for processing a substrate is a recipe (process recipe) in which processing conditions and processing procedures that are also one of editing files are defined as a process of manufacturing a device such as a DRAM or an IC.
- a substrate processing step for processing a substrate based on the above has been performed. The operation of each part of the substrate processing apparatus that performs this process is controlled by the control part.
- the process recipe is composed of a plurality of steps, and each step is created by editing work such as data correction on the operation screen (recipe edit screen). Then, after editing, the contents of editing can be confirmed by displaying a gas flow pattern diagram displaying the supply / discharge status of the processing gas on the operation screen.
- logout processing and screen switching processing are performed when no operation is performed on the operation screen for a predetermined time while editing a process recipe. This prevents third-party data editing work.
- the recipe editing screen is switched to the soft gas pattern screen, and the gas flow pattern diagram corresponding to each step is displayed on the operation screen (soft gas pattern screen). . Thereby, it can be confirmed whether the supply / discharge status of the processing gas is in accordance with the edited content.
- the process recipe is a recipe for processing the substrate, if it is freely edited by a third party, it is not only a defective quality of the processing substrate but also a loss of reliability of the apparatus. Measures are taken to ensure safety.
- editing such as creation and correction of an editing file such as a gas flow pattern diagram is mainly used domestically, and is not particularly restricted or authorized.
- the purpose of the present invention is to prohibit editing work of editing files to unauthorized third parties.
- an operation unit having an operation screen for editing a predetermined edit file, at least a predetermined drawing file, data corresponding to the predetermined data file, and an encryption obtained by encrypting the predetermined data file
- a storage unit for storing the edit file including the encrypted data, a process for comparing the predetermined data file generated by releasing the encrypted data and the predetermined data file, and depending on the comparison result
- a processing device including a control unit that executes processing for displaying the editing file generated by merging the predetermined drawing file and the predetermined data file on the operation screen.
- FIG. 1 is a schematic configuration diagram of a substrate processing system according to an embodiment of the present invention. It is a perspective view of the substrate processing apparatus which concerns on one Embodiment of this invention. It is side surface perspective drawing of the substrate processing apparatus which concerns on one Embodiment of this invention. It is a longitudinal cross-sectional view of the processing furnace of the substrate processing apparatus which concerns on one Embodiment of this invention. It is a block block diagram of the substrate processing controller with which the substrate processing apparatus which concerns on one Embodiment of this invention is provided, and its periphery. It is an example which shows the flow of installation of the edit file displayed on the operation screen of the substrate processing apparatus which concerns on one Embodiment of this invention.
- FIG. 1 is a schematic configuration diagram of a substrate processing system according to an embodiment of the present invention.
- the substrate processing system includes at least one substrate processing apparatus 100 and a group management apparatus 500 connected to the substrate processing apparatus 100 so that data can be exchanged. ing.
- the substrate processing apparatus 100 is configured to execute a processing process based on a recipe in which processing procedures and processing conditions are defined.
- the substrate processing apparatus 100 and the group management apparatus 500 are connected by a network 400 such as a local line (LAN) or a wide area line (WAN).
- LAN local line
- WAN wide area line
- FIG. 2 is a perspective view of the substrate processing apparatus according to one embodiment of the present invention.
- FIG. 3 is a side perspective view of the substrate processing apparatus according to the embodiment of the present invention.
- the substrate processing apparatus 100 according to the present embodiment is configured as a vertical apparatus that performs oxidation, diffusion processing, CVD processing, and the like on a substrate such as a wafer.
- the substrate processing apparatus 100 includes a casing 111 configured as a pressure vessel.
- a front maintenance port 103 serving as an opening provided for maintenance is provided in the front front portion of the front wall 111a of the casing 111.
- the front maintenance port 103 is provided with a pair of front maintenance doors 104 as an access mechanism for opening and closing the front maintenance port 103.
- a pod (substrate container) 110 containing a wafer (substrate) 200 such as silicon is used as a carrier for transporting the wafer 200 into and out of the housing 111.
- a pod loading / unloading port (substrate container loading / unloading port) 112 is opened on the front wall 111 a of the housing 111 so as to communicate between the inside and the outside of the housing 111.
- the pod loading / unloading port 112 is opened and closed by a front shutter (substrate container loading / unloading port opening / closing mechanism) 113.
- a load port (substrate container delivery table) 114 is installed as a mounting portion.
- the pod 110 is placed and aligned.
- the pod 110 is configured to be transferred onto the load port 114 by an in-process transfer device (not shown) such as an OHT (Overhead Hoist Transport).
- a rotary pod shelf (substrate container mounting shelf) 105 is installed at an upper portion of the housing 111 at a substantially central portion in the front-rear direction.
- a plurality of pods 110 are stored on the rotary pod shelf 105.
- the rotary pod shelf 105 includes a support column 116 that is erected vertically and is intermittently rotated in a horizontal plane, and a plurality of shelf plates (substrate containers) that are radially supported by the support column 116 at the upper, middle, and lower positions.
- Mounting stage) 117 The plurality of shelf plates 117 are configured to hold a plurality of pods 110 in a state where they are mounted.
- a pod transfer device (substrate container transfer device) 118 is installed between the load port 114 and the rotary pod shelf 105 in the housing 111.
- the pod transfer device 118 includes a pod elevator (substrate container lifting mechanism) 118a that can be moved up and down while holding the pod 110, and a pod transfer mechanism (substrate container transfer mechanism) 118b as a transfer mechanism.
- the pod transfer device 118 moves the pod 110 between the load port 114, the rotary pod shelf 105, and the pod opener (substrate container lid opening / closing mechanism) 121 by the continuous operation of the pod elevator 118a and the pod transfer mechanism 118b. It is comprised so that it may convey mutually.
- a sub-housing 119 is provided at a lower part in the housing 111 from a substantially central portion in the front-rear direction in the housing 111 to a rear end.
- a pair of wafer loading / unloading ports (substrate loading / unloading ports) 120 that transfer the wafer 200 into and out of the sub-casing 119 are provided on the front wall 119a of the sub-casing 119 so as to be arranged vertically in two stages. Yes.
- Pod openers 121 are respectively installed at the upper and lower wafer loading / unloading ports 120.
- Each pod opener 121 includes a pair of mounting tables 122 on which the pod 110 is mounted, and a cap attaching / detaching mechanism (lid attaching / detaching mechanism) 123 that attaches / detaches the cap (cover) of the pod 110.
- the pod opener 121 is configured to open and close the wafer loading / unloading port of the pod 110 by attaching / detaching the cap of the pod 110 placed on the placing table 122 by the cap attaching / detaching mechanism 123.
- a transfer chamber 124 that is fluidly isolated from a space in which the pod transfer device 118, the rotary pod shelf 105, and the like are installed is configured.
- a wafer transfer mechanism (substrate transfer mechanism) 125 is installed in the front region of the transfer chamber 124.
- the wafer transfer mechanism 125 includes a wafer transfer device (substrate transfer device) 125a that can rotate or linearly move the wafer 200 in the horizontal direction, and a wafer transfer device elevator (substrate transfer device) that moves the wafer transfer device 125a up and down. (Elevating mechanism) 125b. As shown in FIG.
- the wafer transfer device elevator 125 b is installed between the right end of the front area of the transfer chamber 124 of the sub-housing 119 and the right end of the housing 111.
- the wafer transfer device 125 a includes a tweezer (substrate holding body) 125 c as a mounting portion for the wafer 200.
- the wafer 200 can be loaded (charged) and unloaded (discharged) with respect to the boat (substrate holder) 217 by the continuous operation of the wafer transfer device elevator 125b and the wafer transfer device 125a. ing.
- a standby unit 126 that houses and waits for the boat 217 is configured.
- a processing furnace 202 is provided above the standby unit 126.
- the lower end portion of the processing furnace 202 is configured to be opened and closed by a furnace port shutter (furnace port opening / closing mechanism) 147.
- a boat elevator (substrate holder lifting mechanism) 115 that lifts and lowers the boat 217 is installed between the right end of the standby section 126 and the right end of the casing 111 of the sub casing 119.
- An arm 128 as a connecting tool is connected to the elevator platform of the boat elevator 115.
- a seal cap 219 serving as a lid is horizontally installed on the arm 128. The seal cap 219 is configured to support the boat 217 vertically and to close the lower end portion of the processing furnace 202.
- This embodiment is mainly composed of a rotary pod shelf 105, a boat elevator 115, a pod transfer device (substrate container transfer device) 118, a wafer transfer mechanism (substrate transfer mechanism) 125, a boat 217, and a rotation mechanism 254 described later.
- the substrate transfer system according to the above is configured.
- the rotary pod shelf 105, the boat elevator 115, the pod transfer device (substrate container transfer device) 118, the wafer transfer mechanism (substrate transfer mechanism) 125, the boat 217, and the rotation mechanism 254 are transferred as a sub-controller described later.
- the controller 11 is electrically connected.
- the boat 217 includes a plurality of holding members.
- the boat 217 is configured to hold a plurality of (for example, about 50 to 125) wafers 200 in a horizontal state with their centers aligned and vertically aligned.
- a clean unit 134 is installed at the left end of the transfer chamber 124 opposite to the wafer transfer device elevator 125b side and the boat elevator 115 side.
- the clean unit 134 includes a supply fan and a dustproof filter so as to supply a clean atmosphere or clean air 133 that is an inert gas.
- a notch alignment device (not shown) is installed as a substrate alignment device for aligning the circumferential position of the wafer.
- the clean air 133 blown out from the clean unit 134 flows around the boat 217 in the notch alignment device, wafer transfer device 125a, and standby unit 126 (not shown), and is then sucked in by a duct (not shown) to the outside of the casing 111. Or is circulated to the primary side (supply side) that is the suction side of the clean unit 134 and is blown out again into the transfer chamber 124 by the clean unit 134.
- a plurality of device covers are attached to the outer periphery of the case 111 and the sub case 119 as a mechanism for entering the substrate processing apparatus 100. These apparatus covers are removed during maintenance work, and maintenance personnel can enter the substrate processing apparatus 100.
- a door switch 130 is provided as an entrance sensor at the ends of the casing 111 and the sub casing 119 facing the device cover. Also, a door switch 130 is provided as an entrance sensor at the end of the casing 111 facing the front maintenance door 104.
- a substrate detection sensor 140 that detects the placement of the pod 110 is provided on the load port 114. The switches 15 such as the door switch 130 and the substrate detection sensor 140 and the sensors 15 are electrically connected to a substrate processing apparatus controller 240 described later.
- the pod 110 when the pod 110 is supplied to the load port 114 by an in-process transfer device (not shown), the pod 110 is detected by the substrate detection sensor 140, and the pod loading / unloading port 112 is at the front. It is opened by the shutter 113. Then, the pod 110 on the load port 114 is carried into the housing 111 from the pod carry-in / out port 112 by the pod carrying device 118.
- the pod 110 carried into the housing 111 is automatically transferred onto the shelf 117 of the rotary pod shelf 105 by the pod transfer device 118 and temporarily stored. Thereafter, the pod 110 is transferred from the shelf 117 onto the mounting table 122 of one pod opener 121. Note that the pod 110 carried into the housing 111 may be directly transferred onto the mounting table 122 of the pod opener 121 by the pod transfer device 118. At this time, the wafer loading / unloading port 120 of the pod opener 121 is closed by the cap attaching / detaching mechanism 123, and clean air 133 is circulated and filled in the transfer chamber 124.
- the oxygen concentration in the transfer chamber 124 becomes, for example, 20 ppm or less, which is much lower than the oxygen concentration in the casing 111 that is an atmospheric atmosphere. It is set to be.
- the pod 110 mounted on the mounting table 122 is pressed against the opening edge of the wafer loading / unloading port 120 in the front wall 119a of the sub-housing 119, and the cap is removed by the cap attaching / detaching mechanism 123. Then, the wafer loading / unloading port is opened. Thereafter, the wafer 200 is picked up from the pod 110 through the wafer loading / unloading port by the tweezer 125c of the wafer transfer device 125a, aligned in the notch alignment device, and then in the standby unit 126 at the rear of the transfer chamber 124. Are loaded into the boat 217 (charging). The wafer transfer device 125 a loaded with the wafer 200 in the boat 217 returns to the pod 110 and loads the next wafer 200 into the boat 217.
- the other (lower or upper) pod opener 121 is placed on the mounting table 122.
- the pod 110 is transferred from the rotary pod shelf 105 by the pod transfer device 118 and transferred, and the opening operation of the pod 110 by the pod opener 121 is simultaneously performed.
- the lower end portion of the processing furnace 202 closed by the furnace port shutter 147 is opened by the furnace port shutter 147. Subsequently, the boat 217 holding the wafer 200 group is loaded into the processing furnace 202 when the seal cap 219 is lifted by the boat elevator 115.
- the boat 217 storing the processed wafers 200 is unloaded from the processing chamber 201 in a procedure almost opposite to the above procedure except for the wafer alignment process in the notch aligner 135, and the processed wafers are processed.
- the pod 110 storing 200 is carried out of the casing 111.
- FIG. 4 is a longitudinal sectional view of the processing furnace 202 of the substrate processing apparatus 100 according to one embodiment of the present invention.
- the processing furnace 202 includes a process tube 203 as a reaction tube.
- the process tube 203 includes an inner tube 204 as an internal reaction tube and an outer tube 205 as an external reaction tube provided on the outside thereof.
- the inner tube 204 is made of a heat resistant material such as quartz (SiO 2 ) or silicon carbide (SiC).
- the inner tube 204 is formed in a cylindrical shape with an upper end and a lower end opened.
- a processing chamber 201 for processing a wafer 200 as a substrate is formed in a hollow cylindrical portion in the inner tube 204.
- the processing chamber 201 is configured to accommodate a boat 217 described later.
- the outer tube 205 is provided concentrically with the inner tube 204.
- the outer tube 205 has an inner diameter larger than the outer diameter of the inner tube 204, is formed in a cylindrical shape with the upper end closed and the lower end opened.
- the outer tube 205 is made of a heat resistant material such as quartz or silicon carbide.
- a heater 206 as a heating mechanism is provided outside the process tube 203 so as to surround the side wall surface of the process tube 203.
- the heater 206 has a cylindrical shape.
- the heater 206 is vertically installed by being supported by a heater base 251 as a holding plate.
- a manifold 209 is disposed below the outer tube 205 so as to be concentric with the outer tube 205.
- the manifold 209 is made of, for example, stainless steel.
- the manifold 209 is formed in a cylindrical shape with an upper end and a lower end opened.
- the manifold 209 is engaged with the lower end portion of the inner tube 204 and the lower end portion of the outer tube 205, respectively.
- the manifold 209 is provided to support the lower end portion of the inner tube 204 and the lower end portion of the outer tube 205.
- An O-ring 220a as a seal member is provided between the manifold 209 and the outer tube 205.
- a processing gas nozzle 230a and a purge gas nozzle 230b as gas introduction portions are connected to a seal cap 219, which will be described later, so as to communicate with the inside of the processing chamber 201.
- a processing gas supply pipe 232a is connected to the processing gas nozzle 230a.
- a processing gas supply source (not shown) or the like is connected to the upstream side of the processing gas supply pipe 232 (the side opposite to the connection side with the processing gas nozzle 230a) via an MFC (mass flow controller) 241a as a gas flow rate controller.
- MFC mass flow controller
- a purge gas supply pipe 232b is connected to the purge gas nozzle 230b.
- a purge gas supply source (not shown) or the like is connected to the upstream side of the purge gas supply pipe 232b (the side opposite to the connection side with the purge gas nozzle 230b) via an MFC (mass flow controller) 241b as a gas flow rate controller.
- MFC mass flow controller
- the processing gas supply system according to this embodiment is mainly configured by the processing gas supply source (not shown), the MFC 241a, the processing gas supply pipe 232a, and the processing gas nozzle 230a.
- a purge gas supply system according to this embodiment is mainly configured by a purge gas supply source (not shown), the MFC 241b, the purge gas supply pipe 232b, and the purge gas nozzle 230b.
- the gas supply system according to this embodiment is mainly constituted by the processing gas supply system and the purge gas supply system.
- a gas supply controller 14 as a sub-controller described later is electrically connected to the MFCs 241a and 241b.
- the manifold 209 is provided with an exhaust pipe 231 for exhausting the atmosphere in the processing chamber 201.
- the exhaust pipe 231 is disposed at the lower end portion of the cylindrical space 250 formed by the gap between the inner tube 204 and the outer tube 205.
- the exhaust pipe 231 communicates with the cylindrical space 250.
- a pressure sensor 245 as a pressure detector, for example, a pressure regulator 242 configured as an APC (Auto Pressure Controller), a vacuum such as a vacuum pump, etc.
- the exhaust device 246 is connected in order from the upstream side.
- the gas exhaust mechanism according to the present embodiment is mainly configured by the exhaust pipe 231, the pressure sensor 245, the pressure adjusting device 242, and the vacuum exhaust device 246.
- a pressure controller 13 as a sub-controller described later is electrically connected to the pressure adjusting device 242 and the pressure sensor 245.
- a seal cap 219 is provided as a furnace opening lid capable of airtightly closing the lower end opening of the manifold 209.
- the seal cap 219 is brought into contact with the lower end of the manifold 209 from the lower side in the vertical direction.
- the seal cap 219 is made of a metal such as stainless steel.
- the seal cap 219 is formed in a disc shape.
- an O-ring 220b is provided as a seal member that comes into contact with the lower end of the manifold 209.
- a rotation mechanism 254 for rotating the boat is installed near the center of the seal cap 219 and on the side opposite to the processing chamber 201.
- the rotation shaft 255 of the rotation mechanism 254 passes through the seal cap 219 and supports the boat 217 from below.
- the rotation mechanism 254 is configured to be able to rotate the wafer 200 by rotating the boat 217.
- the seal cap 219 is configured to be vertically moved by a boat elevator 115 as a substrate holder lifting mechanism vertically installed outside the process tube 203. By moving the seal cap 219 up and down, the boat 217 can be transferred into and out of the processing chamber 201.
- a conveyance controller 11 as a sub-controller described later is electrically connected to the rotation mechanism 254 and the boat elevator 115.
- the boat 217 as a substrate holder is configured to hold a plurality of wafers 200 in a multi-stage by aligning the wafers 200 in a horizontal posture and in a state where their centers are aligned with each other.
- a plurality of heat insulating plates 216 as heat insulating members are arranged in multiple stages in a horizontal posture.
- the heat insulating plate 216 is formed in the same disk shape as the wafer 200.
- the heat insulating plate 216 is configured to make it difficult to transfer heat from the heater 206 to the manifold 209 side.
- a temperature sensor 263 is installed as a temperature detector.
- the heater 206 and the temperature sensor 263 mainly constitute the heating mechanism according to this embodiment.
- a temperature controller 12 as a sub-controller described later is electrically connected to the heater 206 and the temperature sensor 263.
- the substrate processing system according to this embodiment is mainly configured by a gas exhaust mechanism, a gas supply system, and a heating mechanism.
- the inside of the processing chamber 201 is evacuated by the evacuation device 246 such that a desired pressure (degree of vacuum) is obtained.
- the pressure adjusting device 242 (the opening degree of the valve) is feedback-controlled.
- the heater 206 is heated so that the inside of the processing chamber 201 has a desired temperature.
- the energization amount to the heater 206 is feedback controlled based on the temperature value detected by the temperature sensor 263. Subsequently, the boat 217 and the wafers 200 are rotated by the rotation mechanism 254.
- the processing gas supplied from the processing gas supply source and controlled to have a desired flow rate by the MFC 241a flows through the gas supply pipe 232a and is introduced into the processing chamber 201 from the nozzle 230a.
- the introduced processing gas rises in the processing chamber 201, flows out from the upper end opening of the inner tube 204 into the cylindrical space 250, and is exhausted from the exhaust pipe 231.
- the gas comes into contact with the surface of the wafer 200 when passing through the processing chamber 201, and at this time, a thin film is deposited on the surface of the wafer 200 by a thermal CVD reaction.
- purge gas supplied from a purge gas supply source and controlled to have a desired flow rate by the MFC 241b is supplied into the processing chamber 201, and the processing chamber 201 is replaced with an inert gas. At the same time, the pressure in the processing chamber 201 is returned to normal pressure.
- the seal cap 219 is lowered by the boat elevator 115 to open the lower end of the manifold 209, and the boat 217 holding the processed wafer 200 is carried out from the lower end of the manifold 209 to the outside of the process tube 203 (boat unloading). Loading). Thereafter, the processed wafer 200 is taken out from the boat 217 and stored in the pod 110 (wafer discharge).
- FIG. 5 is a block diagram of a substrate processing controller and its surroundings provided in the substrate processing apparatus according to an embodiment of the present invention.
- the substrate processing device controller 240 includes a CPU (Central Processing Unit) 1a as a control unit, a memory (RAM) 1b as a temporary storage unit, and a hard disk (HDD as a fixed storage unit as a storage unit). 1c, a transmission / reception module 1d as a communication control unit, and a computer having a clock function (not shown).
- a hard disk 1c in addition to an editing file such as a substrate processing recipe as a process recipe and a recipe file such as a cleaning recipe as a maintenance recipe, various program files such as a display program file, various screen files, various icon files, etc. (Not shown) are stored.
- the storage unit stores an edit file for editing a gas flow pattern diagram, an item file as a data file for displaying the gas flow pattern diagram, and a bitmap file as a drawing file.
- process recipes and cleaning recipes are referred to as recipe files
- edit files created by a dedicated data editing tool for creating a gas flow pattern diagram are simply referred to as edit files for distinction.
- the substrate processing recipe is a recipe in which processing conditions and processing procedures for processing the wafer 200 are defined.
- setting values (control values) to be transmitted to sub controllers such as the transport controller 11, the temperature controller 12, the pressure controller 13, and the gas supply controller 14 and transmission timing are set for each step of the substrate processing. ing.
- the touch panel 7 as an operation unit is connected to the substrate processing apparatus controller 240.
- the touch panel 7 is configured to display an operation screen (display unit) that receives an input of an operation command to the above-described substrate transport system and substrate processing system.
- the operation screen as such a display unit includes various display fields and operation buttons for confirming the state of the substrate transfer system and the substrate processing system and for inputting operation instructions to the substrate transfer system and the substrate processing system. Yes.
- the operation unit is not limited to being configured as the touch panel 7, and may be configured by a monitor (display unit) and a keyboard (input unit) like an operation terminal (terminal device) such as a personal computer.
- a CPU (Central Processing Unit) 1a constitutes the center of the substrate processing apparatus controller 240, executes a control program stored in a ROM (not shown), and stores it in the HDD 1c as a recipe storage unit in accordance with an instruction from the operation panel 7. Execute a recipe (for example, a process recipe).
- the ROM is a recording medium that includes an EEPROM, a flash memory, a hard disk, and the like, and stores an operation program of the CPU 1a.
- the memory (RAM) 1b functions as a work area (temporary storage unit) of the CPU 1a.
- the controller for substrate processing apparatus 240 according to the embodiment of the present invention can be realized using a normal computer system, not a dedicated system.
- a controller 240 can be configured.
- the means for supplying these programs is arbitrary. In addition to being able to be supplied via a predetermined recording medium as described above, for example, it may be supplied via a communication line, a communication network, a communication system, or the like. In this case, for example, the program may be posted on a bulletin board of a communication network and provided by being superimposed on a carrier wave via the network. Then, the above-described processing can be executed by starting the program thus provided and executing it in the same manner as other application programs under the control of the OS.
- the transmission / reception module 1d of the substrate processing apparatus controller 240 is connected to the group management apparatus 500 such as a host computer or a monitor server via the network 400 so as to be communicable. Yes.
- the transceiver module 1d is configured to control communication with the group management device 500.
- the transmission / reception module 1d of the controller for substrate processing apparatus 240 includes a transport controller 11, a temperature controller 12, a pressure controller 13, a gas supply controller 14, and a switch as sub-controllers. Sensors 15 are connected to each other.
- the transfer controller 11 includes a rotary pod shelf 105, a boat elevator 115, a pod transfer device (substrate container transfer device) 118, a wafer transfer mechanism (substrate transfer mechanism) 125, a boat 217, and a rotation mechanism that constitute a substrate transfer system. It is configured to control each of the 254 transport operations. Although not shown, a rotary pod shelf 105, a boat elevator 115, a pod transfer device (substrate container transfer device) 118, a wafer transfer mechanism (substrate transfer mechanism) 125, a boat 217, and a rotation mechanism constituting a substrate transfer system. Each sensor 254 has a built-in sensor. The transport controller 11 is configured to notify the substrate processing apparatus controller 240 when these sensors indicate predetermined values, abnormal values, or the like.
- the temperature controller 12 controls the temperature of the heater 206 of the processing furnace 202 to adjust the temperature in the processing furnace 202, and when the temperature sensor 263 indicates a predetermined value, an abnormal value, or the like, the substrate processing apparatus The controller 240 is notified to that effect.
- the pressure controller 13 controls the pressure adjustment device 242 based on the pressure value detected by the pressure sensor 245 so that the pressure in the processing chamber 201 becomes a desired pressure at a desired timing, and the pressure sensor 245. Is configured to notify the substrate processing apparatus controller 240 when a predetermined value or an abnormal value is indicated.
- the gas supply controller 14 is configured to control the supply and stop of gas from the processing gas supply pipe 232a and the purge gas supply pipe 232b by opening and closing a gas valve (not shown). Further, the gas supply controller 14 is configured to control the MFCs 241a and 241b so that the flow rate of the gas supplied into the processing chamber 201 becomes a desired flow rate at a desired timing. The gas supply controller 14 notifies the substrate processing apparatus controller 240 when a gas valve (not shown) or a sensor (not shown) included in the MFCs 241a and 241b shows a predetermined value or an abnormal value. Is configured to do.
- the switches 15 such as the door switch 130 and the substrate detection sensor 140 detect the opening / closing of the casing 111, the sub casing 119, the front maintenance door 104, etc., and the placement of the pod 110 on the load port 114.
- the substrate processing apparatus controller 240 is notified to that effect.
- FIG. 6 shows a flow from creation of an edit file with an editing tool for editing a gas flow pattern diagram to display of an apparatus operation unit.
- the edit file is installed in the substrate processing apparatus controller 240 of the substrate processing apparatus, and the edit file is separated into a bitmap file and an item file, and the separated bitmap file and item file are stored in the substrate. It is installed in the substrate processing apparatus controller 240 of the processing apparatus.
- the restart of the substrate processing apparatus controller 240 is initialized, it is detected that the gas flow pattern diagram has been changed (data change detection process) and an authentication process is performed. If it is determined that the password authentication process is OK, the operation display unit is activated and a gas flow pattern diagram is displayed by executing the display program.
- the operation display unit is configured not to be activated when it is determined as NG in the password authentication process.
- the data change detection process the item file saved at the last time is copied, and the data portion (data portion corresponding to the item file) of this item file and the edited file is compared, and the gas flow pattern diagram This is a process for detecting the data change. In this way, it is possible to detect that the edit file for editing the gas flow pattern diagram has been modified.
- the password authentication process will be described later.
- FIG. 8 is an example showing a mechanism (display method of the apparatus operation unit) in which the substrate processing apparatus controller 240 displays a gas flow pattern diagram by the display program.
- the file separated into the bitmap file and the item file is merged (synthesized) to create a gas flow pattern diagram, which is displayed on the operation display unit.
- the display program may be activated by the login process of the operator.
- the display program may be configured not to be executed when an unauthorized operator logs in.
- the third-party edited file can be obtained by performing a password authentication process. Since the editing work can be prevented, data leakage can be prevented.
- the data change detection process is performed even if the data editing tool is lost, and the password authentication process is performed if the data of the edit file is changed. Since it is possible to prevent editing work of third-party editing files, data leakage can be prevented.
- the new format is a file obtained by encrypting data.
- data is compressed.
- the editing file created by the new version of the editing tool includes a header, a predetermined data file (item file), a data portion including at least a portion corresponding to a predetermined drawing file (bitmap file), and the predetermined data file. It has a data structure (format) including an encrypted data portion including encrypted data. Therefore, when the editing file is stored (installed) in the substrate processing apparatus controller 240, the editing file is stored (installed) in a state where the editing file is separated into an item file and a bitmap file.
- the item file is composed of character and numerical data, and includes items (items) such as an MFC, a valve, and a processing furnace.
- the bitmap file includes icons such as pipes, furnace ports, and vaporizers.
- the format of the edit file is changed by encrypting the data in the edit file. Since the editing work of the three parties can be prevented, data leakage can be prevented.
- version management prevents the new version of the edit file from being read even when the old version of the gas pattern data editing tool is started. As a result, the risk of abuse of older versions of editing tools is kept low.
- FIG. 9 is a diagram showing operations from installation of the new editing tool to the device to activation by the operation unit.
- a password is input (S01).
- an inquiry key is configured to be displayed on the screen (S02).
- S02 For example, in order to obtain a password, an inquiry key is input to a predetermined part on our Web.
- This password is a password per second. Further, since it changes in units of seconds, it is impossible to divert the acquired second password (S03).
- this password enables installation from the personal computer to the apparatus (S04). A daily password is required every time the new editing tool is activated in the operation unit of the apparatus.
- the new editing tool will not be operated by a third party (S05), and When the daily password acquired from our website is input, the new editing tool is successfully activated (S06). Needless to say, when the new editing tool is started for the first time, the password may be changed every day instead of the password changed every second. However, since the editing tool (file for displaying the gas flow pattern diagram) is created on the personal computer (PC) and created, it may be installed in the device in one day. The password to be entered and the password to be entered when starting up on the device should be different. Therefore, in this embodiment, the second unit password and the daily password are combined.
- the keyword is determined in a predetermined location (for example, it has a process of inputting to a keyword input screen. Since login to our website requires password authentication, it is possible for employees to obtain these passwords (for example, passwords in seconds or daily passwords) without any problem, but login after leaving the company. It is difficult to obtain a password for use, and it is difficult to access our website. This makes it impossible for a third party to operate the editing tool. Therefore, even if the former employee obtains the new editing tool illegally, it is difficult for the former employee to operate the new editing tool without permission.
- the new editing tool is started and an edit file (for example, a file for displaying a gas flow pattern diagram) is created and installed and displayed on the operation unit. If you do, you will be asked to enter your password. In order to obtain this password, a password that can only be obtained on our website is required, so even if a third party who cannot access our website illegally obtains a new editing tool, the password cannot be obtained. Therefore, a gas flow pattern diagram created by a new editing tool by a third party is not displayed, and a third party other than employees cannot edit the gas flow pattern diagram.
- an edit file for example, a file for displaying a gas flow pattern diagram
- the password of the new version of the editing tool is always input when starting up.
- This password is only available on our internet site and is valid for one day on a daily basis. Therefore, even if the employee leaves the company and diverts the password that he has obtained, he cannot access our site and enter. Therefore, the editing tool is not allowed to work by a third party.
- the new editing tool cannot be operated without obtaining the password, and the password can be obtained only from our intranet.
- people other than our company cannot use the editing tools illegally. Therefore, since the new editing tool cannot be operated without obtaining the password, for example, a third party cannot edit the gas flow pattern diagram accompanying the modification of the piping.
- a third party other than an employee must enter a password so that the third party does not display a gas flow pattern diagram created with the new editing tool. Since it is difficult to obtain, it is not possible to work on edit files created with the new editing tool unless a password is obtained by building a mechanism that does not affect the third party's unauthorized acquisition of the new editing tool. As a result, a third party cannot edit the gas flow pattern diagram accompanying the modification of the piping.
- the only way to obtain a password is to access our site, so any employee can obtain it without any problem. It is difficult to obtain a password and it is difficult to access our site. Therefore, even if the former employee acquires the new editing tool illegally, the former employee cannot operate the new editing tool without permission. This can prevent malicious business using our new editing tools.
- a third party operates a new editing tool without permission so that the gas flow pattern diagram cannot be edited. Can not be used without permission.
- the gas piping is not modified by a third party other than an expert on the apparatus, so that a security (safety) risk can be suppressed.
- a third party cannot edit the gas flow pattern diagram without permission. Risk is reduced.
- a gas flow pattern diagram through which a gas used for a third party to process the substrate in the semiconductor manufacturing apparatus flows is not easily changed.
- the gas used to process substrates in semiconductor manufacturing equipment is often a gas that needs to be handled with care (hazardous gas, flammable gas, etc.). It is particularly effective because it is not performed.
- (l) According to the present embodiment (third embodiment), it is configured so that a third party cannot edit (manipulate) the editing tool for the gas flow pattern diagram without permission.
- Security safety
- the gas used to process substrates in semiconductor manufacturing equipment is often a gas that needs to be handled with care (hazardous gas, flammable gas, etc.). For example, it may lead to an accident due to a fatal mistake, such as not knowing that the content displayed in the gas flow pattern diagram is different from the actual gas piping pattern. It is particularly effective because it is not possible to edit it without permission.
- a format determination is performed. That is, the device operation unit determines whether the format is the new format or the old format (S10). When the old format is determined, a gas flow pattern diagram is displayed by the display program.
- the encrypted part is decrypted.
- data is compressed by a predetermined method.
- the decoded data and the edited file data (item file) are compared (S20). If the data match as a result of the comparison, a gas flow pattern diagram is displayed by the display program. If the data do not match, it is determined that the data (item file) has been illegally edited, and therefore the gas flow pattern diagram is not displayed.
- the gas flow pattern diagram is displayed on the operation unit of the apparatus, the change of data is detected when the new editing tool is started, and the password needs to be input. Even if password authentication is OK, processing for checking unauthorized editing of data (item file) is added by encryption, so even if a new editing tool is passed to a third party, the gas flow pattern diagram is It is configured not to be displayed on the operation unit.
- the gas flow pattern diagram was displayed on the operation screen without checking the validity of the item file. Since the validity check of the item file is performed, only the items that have been determined to be OK in the data authentication process are displayed. This prevents the item file (data) from being displayed on the screen even if it has been illegally edited, so that it is possible to prevent data modification of the edited file by a third party.
- the data editing tool according to the present invention (the first to fourth embodiments) is mainly used in Japan, but may also be used at overseas bases, and may be lost at that time.
- the editing tool is passed to an irrelevant third party for some reason, the risk of editing data can be suppressed.
- the present invention (the first to third embodiments), even if the editing tool for the gas flow pattern diagram passes to a third party, the risk of editing the data can be suppressed. Therefore, it is possible to prevent a third party other than the device expert from modifying the gas piping that the device expert should pay close attention to.
- the editing tool for the gas flow pattern diagram passes to a third party, and a third party other than the device expert modifies the gas piping. Can reduce this risk.
- the gas used for processing a substrate in a semiconductor manufacturing apparatus is often a gas that needs to be handled with care (hazardous gas, flammable gas, etc.). Special effects such as prevention of accidents due to differences in gas flow pattern diagrams can be obtained.
- the operation terminal provided with the data editing tool separately from the substrate processing apparatus has been described in detail.
- the present invention is not limited to this. The present invention can be applied even when the substrate processing apparatus controller 240 includes a data editing tool.
- a semiconductor manufacturing apparatus is shown as an example of a substrate processing apparatus.
- the present invention is not limited to a semiconductor manufacturing apparatus, and may be an apparatus for processing a glass substrate such as an LCD device. Further, the specific content of the substrate processing is not questioned, and it may be processing such as annealing processing, oxidation processing, nitriding processing, and diffusion processing as well as film forming processing.
- the film formation process may be, for example, a process for forming a CVD, PVD, oxide film, or nitride film, or a process for forming a film containing a metal.
- an edit file that constitutes a data structure including at least a predetermined drawing file, data corresponding to the predetermined data file, and encrypted data obtained by encrypting the predetermined data file.
- the storage unit for storing, the process of comparing the predetermined data file (corresponding data) and the predetermined data file (corresponding data) generated by releasing the encrypted data, and the comparison
- Supplementary Note 3 the processing device according to Supplementary Note 1 or Supplementary Note 2, wherein the predetermined screen file and the predetermined data file are configured so that they cannot be edited individually.
- the processing device Preferably, there is provided the processing device according to Supplementary Note 1, wherein the encrypted data is data (compressed data) obtained by compressing data corresponding to the predetermined data file.
- Additional remark 6 Preferably, it is the processing apparatus according to additional remark 5, and the data corresponding to the predetermined data file stored in the editing file and the data after the process of returning the compressed data is executed A processing device is provided that is configured to be compared.
- an edit file constituting a data structure including at least a predetermined drawing file, data corresponding to the predetermined data file, and encrypted data obtained by encrypting the predetermined data file
- Storing the storage unit processing for comparing the predetermined data file (corresponding data) and the predetermined data file (corresponding data) generated by releasing the encrypted data, and the comparison
- a process for generating the editing file by merging the predetermined drawing file (corresponding data) and the predetermined data file (corresponding data) into one according to the result , A controller is provided.
- an edit that constitutes a data structure including at least a predetermined drawing file, data corresponding to the predetermined data file, and encrypted data obtained by encrypting the predetermined data file A process of storing a file, a process of comparing the predetermined data file generated by releasing the encrypted data and the predetermined data file, the predetermined drawing file according to the comparison result, and the There is provided a program for causing a computer to execute processing for merging predetermined data files into one and generating the editing file, and a recording medium capable of reading the program.
- an edit that constitutes a data structure including at least a predetermined drawing file, data corresponding to the predetermined data file, and encrypted data obtained by encrypting the predetermined data file
- a storage unit for storing a file; a process for comparing the predetermined data file generated by releasing the encrypted data with the predetermined data file; and the predetermined drawing file according to the comparison result.
- a processing system including a processing unit including a control unit that executes processing for generating the editing file by merging the predetermined data files into one.
- the process which memorize stores the edit file which comprises the data structure containing at least the predetermined drawing file, the data equivalent to a predetermined data file, and the encryption data which encrypted the said predetermined data file, The said encryption data And comparing the data corresponding to the data file generated by canceling the data and the data corresponding to the predetermined data file, and combining the predetermined drawing file and the predetermined data file according to the comparison result. And a step of displaying the edit file generated by merging the two on the operation screen.
- An operation unit having an operation screen for editing a predetermined edit file, the edit file is stored in a state of being separated into a predetermined drawing file and a predetermined data file, respectively, and the predetermined data
- a process for comparing the predetermined data file, a process for merging the predetermined screen file and the predetermined data file in accordance with the comparison result, and the edit file generated by the merge Is provided on the operation screen, and a control unit is provided.
- the processing device Preferably, there is provided the processing device according to supplementary note 12, wherein the predetermined drawing file is a bitmap file and the predetermined data file is an item file.
- Supplementary Note 14 a processing device according to Supplementary Note 12 or Supplementary Note 13, wherein the predetermined drawing file and the predetermined data file are configured so that they cannot be edited independently is provided.
- the processing device Preferably, there is provided the processing device according to Supplementary Note 12, wherein the encrypted data is data (compressed data) obtained by compressing data corresponding to the predetermined data file.
- Supplementary Note 17 Preferably, there is provided the processing device according to Supplementary Note 1 or Supplementary Note 12, wherein the editing file is a file created by starting a data editing tool dedicated to a gas flow pattern diagram.
- the processing apparatus according to additional remark 13, wherein the data corresponding to the bitmap file includes a processing apparatus including a pipe constituting a gas supply line or a gas exhaust line.
- the processing device according to supplementary note 13, wherein the data corresponding to the bitmap file is icon data indicating a processing furnace, a vaporizer, a pump, or the like, is provided.
- the processing device Preferably, the processing device according to supplementary note 13, wherein the data corresponding to the item file is various data relating to valves, MFC, and the like, is provided.
- An operation unit having an operation screen for editing a predetermined edit file, the edit file is stored in a state of being separated into a predetermined screen file and a predetermined data file, respectively, and the predetermined data
- a process for comparing the predetermined data file with the data file a process for merging the predetermined screen file and the predetermined data file in accordance with the comparison result, and the edit file generated by the merging with the operation screen
- a controller that executes the process of displaying the information on the controller.
- an operation unit having an operation screen for editing a predetermined edit file, and an edit file are divided into two, a predetermined screen file and a predetermined data file, respectively.
- the predetermined data file generated when the edit file is separated, and the predetermined screen file and the predetermined data file are compared with each other according to the comparison result.
- a display method for a substrate processing apparatus which merges them into one and displays the edit file on the operation screen.
- the predetermined data generated when the data file generated by decrypting the encrypted data and the edit file are separated If the data file does not match the predetermined data file as a result of comparison with the data file, it is determined that the predetermined data file has been illegally edited and the edited file is not displayed on the operation screen.
- a substrate process configured to merge the predetermined screen file and the predetermined data file into one and display the edit file on the operation screen when the data file matches the predetermined data file
- a device display method is provided.
- a procedure for creating a predetermined edit file and the edit file are stored in a state of being separated into a predetermined screen file and a predetermined data file. And a procedure for storing the edit file including encrypted data obtained by encrypting the predetermined data file, and a data file generated by deciphering the encrypted data and generated when the edit file is separated.
- a step of comparing the predetermined data file, a step of merging the predetermined screen file and the predetermined data file into one according to the comparison result, and the merged and generated There are provided a program for causing a computer to have a procedure for displaying an edit file on an operation screen, and a recording medium capable of reading the program. It is.
- an operation device having an operation screen for editing a predetermined edit file, and the edit file are divided into a predetermined screen file and a predetermined data file, respectively. And storing the edited file including encrypted data obtained by encrypting the predetermined data file, the predetermined data file generated by releasing the encrypted data, and the editing A process of comparing the predetermined data file generated when the files are separated, a process of merging the predetermined screen file and the predetermined data file into one according to the comparison result, and the merging A processing system comprising: a control unit that executes a process for displaying the edit file generated in step 1 on the operation screen; That.
- the operation device includes a data editing tool, and the processing system configured to start the data editing tool and create the editing file is provided. Provided.
- the processing system according to supplementary note 27 which is configured to require a first input password when the data editing tool is started for the first time, is provided.
- the processing system according to supplementary note 27, wherein the first input password is a password that is changed in units of seconds.
- a keyword displayed on the operation screen when the data editing tool is activated for the first time.
- a processing system is provided that has a process of inputting the keyword into a predetermined location (screen) determined in advance.
- the process of acquiring the second password is a process of displaying a predetermined screen after logging in to a predetermined Web (for example, our Web).
- a predetermined Web for example, our Web.
- the storage unit further stores the item file (data corresponding to the edited file when the edited file was edited in the past), and the operation
- the processing unit includes a data change detection process that compares a predetermined data file (corresponding data) and the item file (corresponding data) included in the editing file when the editing file is displayed. Is provided.
- Additional remark 35 Preferably, it is the processing apparatus of Additional remark 34, Comprising: It has the said operation part which receives the 2nd password changed on a daily basis, The said operation part WHEREIN: In the said data change detection process, When a change in data is detected, a processing apparatus is further provided that further includes a password authentication process that requests input of the second password.
- the operation unit further includes a process of checking validity of an item file (and data corresponding thereto), and a process of merging an item file and a bitmap file And a process for displaying the edit file generated by the merging.
- the process of checking the validity of the item file (corresponding data) is encrypted data obtained by encrypting the item file (corresponding data) in advance.
- a processing device including a process of comparing a predetermined data file generated by canceling the process and a predetermined data file indicating the item file (corresponding to the item file) included in the editing file.
- the processing device includes a process of determining the format (data structure) of the edit file Is provided.
- an editing tool dedicated to the gas flow pattern is not used in the process of checking the validity of the item file (corresponding data).
- a processing device for confirming whether the item file (corresponding data) has been tampered with is provided.
- the edit file includes data including at least a header, a predetermined data file (item file), and a portion corresponding to a predetermined drawing file (bitmap file). And a processing device having a data structure including an encrypted data portion including data obtained by encrypting the predetermined data file.
- the present invention relates to management of a specific editing file used in a processing apparatus that processes an object to be processed, and is particularly applied to a substrate processing apparatus that performs predetermined processing on a predetermined substrate.
- substrate processing apparatus 200 wafer (substrate) 240 substrate controller processing controller (control unit) 500 management apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Security & Cryptography (AREA)
- General Engineering & Computer Science (AREA)
- Software Systems (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Bioethics (AREA)
- Automation & Control Theory (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
Description
Claims (4)
- 所定の編集ファイルを編集する操作画面を備えた操作部と、少なくとも所定の図面ファイルと所定のデータファイルに相当するデータと前記所定のデータファイルを暗号化した暗号化データを含む前記編集ファイルを記憶する記憶部と、前記暗号化データを解除して生成される前記所定のデータファイルと前記所定のデータファイルとを比較する処理と、前記比較した結果に応じて前記所定の図面ファイルと前記所定のデータファイルを一つにマージして生成される前記編集ファイルを前記操作画面に表示する処理と、を実行する制御部と、を含む処理装置。
- 所定の編集ファイルを編集する操作画面を備えた操作部と、少なくとも所定の図面ファイルと所定のデータファイルに相当するデータと前記所定のデータファイルを暗号化した暗号化データを含む前記編集ファイルを記憶する記憶部と、前記暗号化データを解除して生成される前記所定のデータファイルと前記所定のデータファイルとを比較する処理と、前記比較した結果に応じて前記所定の図面ファイルと前記所定のデータファイルを一つにマージして生成される前記編集ファイルを前記操作画面に表示する処理と、を実行する制御部と、を含むコントローラ。
- 所定の編集ファイルを作成する処理と、少なくとも所定の図面ファイルと所定のデータファイルに相当するデータと前記所定のデータファイルを暗号化した暗号化データを含む前記編集ファイルを記憶する処理と、前記暗号化データを解除して生成される前記所定のデータファイルと前記所定のデータファイルとを比較する処理と、前記比較した結果に応じて前記所定の図面ファイルと前記所定のデータファイルを一つにマージして前記編集ファイルを生成する処理と、をコンピュータに実行させるプログラムを読取可能に記録した記録媒体。
- 所定の編集ファイルを編集する操作画面を備えた操作装置と、少なくとも所定の図面ファイルと所定のデータファイルに相当するデータと前記所定のデータファイルを暗号化した暗号化データを含む前記編集ファイルを記憶する記憶部と、前記暗号化データを解除して生成される前記所定のデータファイルと前記所定のデータファイルとを比較する処理と、前記比較した結果に応じて前記所定の図面ファイルと前記所定のデータファイルを一つにマージして生成される前記編集ファイルを前記操作画面に表示する処理と、を実行する制御部と、を含む処理装置と、を有する処理システム。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020177004422A KR101965151B1 (ko) | 2014-09-26 | 2014-09-26 | 처리 장치, 컨트롤러, 프로그램, 처리 장치의 제어 방법, 처리 장치의 표시 방법 및 처리 시스템 |
PCT/JP2014/075644 WO2016046956A1 (ja) | 2014-09-26 | 2014-09-26 | 処理装置、コントローラ、記録媒体及び処理システム |
CN201480081361.1A CN106575339B (zh) | 2014-09-26 | 2014-09-26 | 处理装置、控制器、处理系统、处理装置的控制方法以及基板处理装置的显示方法 |
JP2016549857A JP6484639B2 (ja) | 2014-09-26 | 2014-09-26 | 処理装置、コントローラ及びプログラム |
US15/460,603 US10452856B2 (en) | 2014-09-26 | 2017-03-16 | Processing apparatus, controller and processing system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2014/075644 WO2016046956A1 (ja) | 2014-09-26 | 2014-09-26 | 処理装置、コントローラ、記録媒体及び処理システム |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/460,603 Continuation US10452856B2 (en) | 2014-09-26 | 2017-03-16 | Processing apparatus, controller and processing system |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016046956A1 true WO2016046956A1 (ja) | 2016-03-31 |
Family
ID=55580515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2014/075644 WO2016046956A1 (ja) | 2014-09-26 | 2014-09-26 | 処理装置、コントローラ、記録媒体及び処理システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US10452856B2 (ja) |
JP (1) | JP6484639B2 (ja) |
KR (1) | KR101965151B1 (ja) |
CN (1) | CN106575339B (ja) |
WO (1) | WO2016046956A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6653722B2 (ja) * | 2018-03-14 | 2020-02-26 | 株式会社Kokusai Electric | 基板処理装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005347867A (ja) * | 2004-05-31 | 2005-12-15 | Victor Co Of Japan Ltd | 電子文書改ざん検出方法及び電子文書改ざん検出装置並びにコンピュータプログラム |
JP2014041976A (ja) * | 2012-08-23 | 2014-03-06 | Toshiba Corp | レシピ管理装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010045458A1 (en) * | 1998-07-27 | 2001-11-29 | Stephen T. Polansky | Biometeric system for verifying the user of a credit/identification card by a miniature autonomous fingerprint capture and verification system |
JP4081980B2 (ja) * | 2000-12-26 | 2008-04-30 | ヤマハ株式会社 | コンテンツ提供サービスシステム、およびサーバ装置、クライアント装置 |
US7292369B2 (en) * | 2000-12-28 | 2007-11-06 | Seiko Epson Corporation | Logo data generating method and system |
US20020184494A1 (en) * | 2001-06-04 | 2002-12-05 | Awadalla Emad M. | Methods for using embedded printer description language as a security tool and printers and systems with whcih the method may be used |
CA2391719A1 (en) * | 2002-06-26 | 2003-12-26 | Ibm Canada Limited-Ibm Canada Limitee | Editing files of remote systems using an integrated development environment |
JP2006093494A (ja) | 2004-09-27 | 2006-04-06 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP5224744B2 (ja) | 2006-10-04 | 2013-07-03 | 株式会社日立国際電気 | 基板処理装置 |
KR101698851B1 (ko) * | 2008-11-07 | 2017-01-24 | 주식회사 솔리데오시스템즈 | 시설물 관리 시스템과 이의 작동 방법 |
JP2011150693A (ja) * | 2009-12-22 | 2011-08-04 | Tani Electronics Corp | 情報管理システム、情報管理の方法および装置、暗号化の方法およびプログラム |
CN103136459B (zh) * | 2013-01-09 | 2018-12-21 | 上海威客网络科技有限公司 | 一种加密数字内容的版权标识方法和系统 |
CN103985078A (zh) * | 2014-05-14 | 2014-08-13 | 北京邮电大学 | 一种抗打印扫描图文混合的数字水印嵌入与提取方法 |
-
2014
- 2014-09-26 WO PCT/JP2014/075644 patent/WO2016046956A1/ja active Application Filing
- 2014-09-26 CN CN201480081361.1A patent/CN106575339B/zh active Active
- 2014-09-26 KR KR1020177004422A patent/KR101965151B1/ko active IP Right Grant
- 2014-09-26 JP JP2016549857A patent/JP6484639B2/ja active Active
-
2017
- 2017-03-16 US US15/460,603 patent/US10452856B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005347867A (ja) * | 2004-05-31 | 2005-12-15 | Victor Co Of Japan Ltd | 電子文書改ざん検出方法及び電子文書改ざん検出装置並びにコンピュータプログラム |
JP2014041976A (ja) * | 2012-08-23 | 2014-03-06 | Toshiba Corp | レシピ管理装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20170032423A (ko) | 2017-03-22 |
US10452856B2 (en) | 2019-10-22 |
JPWO2016046956A1 (ja) | 2017-07-27 |
KR101965151B1 (ko) | 2019-04-03 |
CN106575339B (zh) | 2020-02-28 |
US20170193243A1 (en) | 2017-07-06 |
CN106575339A (zh) | 2017-04-19 |
JP6484639B2 (ja) | 2019-03-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6403431B2 (ja) | 基板処理装置、流量監視方法及び半導体装置の製造方法並びに流量監視プログラム | |
JP4555881B2 (ja) | 基板処理装置及び表示方法 | |
JP5224744B2 (ja) | 基板処理装置 | |
US20080210162A1 (en) | Substrate Processing Apparatus and Substrate Processing System | |
JP6222810B2 (ja) | 管理装置、基板処理装置、基板処理システム、基板処理装置のファイル管理方法及びファイル転送方法 | |
JP5275641B2 (ja) | 基板処理装置、基板処理装置の表示方法、基板処理装置の制御方法及び半導体装置の製造方法 | |
WO2011115249A1 (ja) | 基板処理装置 | |
JP2011100968A (ja) | 基板処理装置、基板処理装置の制御方法、半導体デバイスの製造方法及び装置状態遷移方法 | |
US20190221460A1 (en) | Method of manufacturing a semiconductor device | |
JPWO2007102582A1 (ja) | 基板処理装置システム | |
WO2016098887A1 (ja) | 処理装置 | |
JP6484639B2 (ja) | 処理装置、コントローラ及びプログラム | |
WO2011021635A1 (ja) | 基板処理システム、群管理装置及び基板処理システムにおける表示方法 | |
JP5566032B2 (ja) | 基板処理装置、半導体装置の製造方法および入力禁止プログラム | |
WO2016111352A1 (ja) | 端末装置及び記録媒体 | |
JP5622334B2 (ja) | 基板処理装置及びその制御方法並びにプログラム | |
JP4933809B2 (ja) | 基板処理装置及び基板処理方法及び基板処理装置の判定プログラム | |
JP2013115189A (ja) | 基板処理システム | |
JP2013074039A (ja) | 群管理装置 | |
JP5531003B2 (ja) | 基板処理装置、基板処理装置のメンテナンス方法および半導体装置の製造方法 | |
JP2010102430A (ja) | 基板処理システム | |
JP2010183068A (ja) | 基板処理装置 | |
JP2012104701A (ja) | 基板処理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14902625 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20177004422 Country of ref document: KR Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 2016549857 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 14902625 Country of ref document: EP Kind code of ref document: A1 |