WO2015189890A1 - 発熱体 - Google Patents
発熱体 Download PDFInfo
- Publication number
- WO2015189890A1 WO2015189890A1 PCT/JP2014/065218 JP2014065218W WO2015189890A1 WO 2015189890 A1 WO2015189890 A1 WO 2015189890A1 JP 2014065218 W JP2014065218 W JP 2014065218W WO 2015189890 A1 WO2015189890 A1 WO 2015189890A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- resin film
- heating element
- electrode
- conductive layer
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 107
- 239000002184 metal Substances 0.000 claims abstract description 107
- 229920005989 resin Polymers 0.000 claims abstract description 94
- 239000011347 resin Substances 0.000 claims abstract description 94
- 239000000463 material Substances 0.000 claims abstract description 45
- 125000006850 spacer group Chemical group 0.000 claims abstract description 39
- 239000011810 insulating material Substances 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims description 95
- 239000000758 substrate Substances 0.000 claims description 56
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 23
- 229910052799 carbon Inorganic materials 0.000 claims description 22
- 229920001940 conductive polymer Polymers 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 10
- 239000002070 nanowire Substances 0.000 abstract description 60
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 abstract description 46
- 229920001721 polyimide Polymers 0.000 abstract description 27
- 239000009719 polyimide resin Substances 0.000 abstract description 27
- 229920000123 polythiophene Polymers 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 163
- 239000010408 film Substances 0.000 description 130
- 239000011521 glass Substances 0.000 description 42
- 239000005038 ethylene vinyl acetate Substances 0.000 description 18
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 18
- 239000012790 adhesive layer Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000002274 desiccant Substances 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229920001197 polyacetylene Polymers 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000005357 flat glass Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000007710 freezing Methods 0.000 description 2
- 230000008014 freezing Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229920000128 polypyrrole Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- -1 butyl compound Chemical class 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229910001922 gold oxide Inorganic materials 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000012137 tryptone Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10165—Functional features of the laminated safety glass or glazing
- B32B17/10174—Coatings of a metallic or dielectric material on a constituent layer of glass or polymer
- B32B17/1022—Metallic coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10788—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing ethylene vinylacetate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/16—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being mounted on an insulating base
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
- H05B3/86—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields the heating conductors being embedded in the transparent or reflecting material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2214/00—Aspects relating to resistive heating, induction heating and heating using microwaves, covered by groups H05B3/00, H05B6/00
- H05B2214/04—Heating means manufactured by using nanotechnology
Definitions
- the present invention relates to a heating element. Specifically, for example, the present invention relates to a heating element that is installed in a window and suppresses freezing and dew condensation on the window.
- a heating element that generates heat by electricity is widely used.
- a heating element is attached to the outer surface of the container to prevent freezing or heating of the liquid in the container, or a heating element is wrapped around a fluid pipe that needs to be kept warm to prevent the fluid temperature from falling. Yes.
- Patent Document 1 describes a heating portion of a heater as shown in FIG. That is, the heat generating portion 111 described in Patent Document 1 includes a back surface material 111B, a heating wire 111A, and a surface material 111C.
- the heating wire 111A is wired in a predetermined meandering pattern and attached to the upper surface of the back material 111B, and generates heat when energized. Further, the front surface material 111C is formed of the same material as the back surface material 111B, and is bonded to cover the entire upper surface of the back surface material 111B on which the heating wire 111A is wired.
- the present invention has been made in view of the above points, and an object thereof is to provide a heating element capable of raising the temperature to a desired temperature in a short time.
- a heating element of the present invention includes a base material, a conductive layer arranged in a plane along the base material, and formed of a conductive material, and the conductive layer. An electrically connected electrode.
- a current is passed through the conductive layer by a conductive layer arranged in a plane along the substrate and formed of a conductive material, and an electrode electrically connected to the conductive layer. Can generate heat uniformly.
- the base material can be a resin plate or a resin film
- the conductive layer can be a wire mesh
- the heating element can be installed along various shapes of objects. Further, the surface resistance value can be greatly reduced by the wire mesh.
- the conductive material is at least one selected from a mixture of a carbon-containing substance and a metal, a carbon-containing substance, and a conductive polymer. Can be.
- the heating element can be installed along the object of various shapes.
- the heating element of the present invention may be provided with an insulating layer that is disposed on the side of the substrate on which the conductive layer is provided and that is formed of an insulating material.
- the strength increases and it is difficult to break.
- the electrode since the electrode is sandwiched between the base material and the insulating layer, the electrode can be protected and the electrode can be hidden.
- the heating element of the present invention can be disposed between the conductive layer and the insulating layer or between the insulating layers, and can form a sealed space between the conductive layer and the insulating layer or between the insulating layers. It can be provided with a simple spacer portion.
- the heat insulation can be improved and the occurrence of condensation can be suppressed by the sealed space.
- the base material may be a rectangular plate shape, and the electrode may be electrically connected to the conductive layer along the edge of the long side of the base material.
- the resistance value can be reduced.
- the electrode may be electrically connected to the conductive layer through a conductive polymer.
- the adhesion at the interface between the conductive layer and the electrode is integrated and strengthened, and conduction failure is less likely to occur.
- the base material, the conductive layer, and the insulating layer can be permeable.
- a heating element can be installed on an object that requires permeability.
- the heating element according to the present invention can be heated to a desired temperature in a short time.
- FIG. 2 is a schematic cross-sectional view showing a cross section taken along line AA in FIG. 1. It is a schematic sectional drawing which shows the 1st example of the heat generating body of the 2nd embodiment to which this invention is applied. It is a schematic sectional drawing which shows the 2nd example of the heat generating body of the 2nd embodiment to which this invention is applied. It is a schematic sectional drawing which shows the 3rd example of the heat generating body of the 2nd embodiment to which this invention is applied. It is the schematic which shows the general glass with a heating wire which is a comparison object. It is a schematic exploded view which shows the conventional heat generating body.
- FIG. 1 is a schematic view showing an example of a heating element according to a first embodiment to which the present invention is applied.
- FIG. 2 is a schematic cross-sectional view showing a cross section taken along line AA of FIG.
- a heating element 1 of the present invention shown in FIGS. 1 and 2 includes a rectangular flat glass substrate 2. Moreover, the thickness of the glass base material 2 is 3 mm.
- the glass substrate is an example of a substrate.
- the heating element 1 of the present invention includes a metal film 4 arranged in a planar shape along one surface of the glass substrate 2.
- the metal layer is an example of a conductive layer.
- the metal film 4 is formed by evaporating metal on the glass substrate 2.
- the metal is an example of a conductive material.
- Examples of the metal used for forming the metal film 4 include indium tin oxide (ITO), gold (Au), silver (Ag), copper (Cu), zinc oxide (ZnO), and tin dioxide (SnO). 2 ).
- ITO indium tin oxide
- Au gold
- Ag silver
- Cu copper
- ZnO zinc oxide
- SnO tin dioxide
- the thickness of the metal film 4 is 800 to 1200 angstroms, more specifically 1000 angstroms. Further, the surface resistance value of the metal film 4 is 50 ⁇ / cm 2 or less, preferably 30 ⁇ / cm 2 or less, more preferably 10 ⁇ / cm 2 .
- the surface resistance value of the metal film is 50 ⁇ / cm 2 or less, electricity easily flows through the metal film, and the temperature can be raised at a low voltage.
- the heating element 1 of the present invention includes an electrode 5 electrically connected to the metal film 4. Moreover, the electrode 5 is comprised with the copper foil. Further, in the example shown in FIG. 1, the electrodes 5 are provided on both sides of the metal film 4 along the opposing long side edges of the glass substrate 2, and are provided at substantially the center of the metal film 4. Yes.
- the electrode does not necessarily have to be provided at the approximate center of the conductive layer.
- the electrode provided in the approximate center of the conductive layer is desirably as thin as possible in order to improve visibility.
- each of the electrodes 5 is electrically connected to the metal film 4 via the polyacetylene resin film layer 9.
- the polyacetylene resin film is an example of a conductive polymer.
- the electrode is electrically connected to the conductive layer through a conductive polymer such as a polyacetylene resin film, the adhesion at the interface between the conductive layer and the electrode is integrated and strengthened, and poor conduction is unlikely to occur.
- a conductive polymer such as a polyacetylene resin film
- a power cable 7 is connected to each electrode 5.
- the power cable 7 is connected to a power source 8 that supplies power to the electrode 5 via the power cable 7.
- the heat generating body 1 is equipped with the glass plate 3 arrange
- the glass plate is an example of an insulating layer.
- the glass plate 3 is a rectangular flat plate shape.
- the glass substrate 2 and the glass plate 3 have substantially the same area.
- a butyl compound can be applied to the end surface of the glass substrate 2 to the end surface of the glass plate 3 for waterproofing.
- an EVA (ethylene vinyl acetate copolymer) resin film adhesive layer 6 is disposed between the glass substrate 2 and the glass plate 3, and the glass substrate 2 to which the metal film 4 and the electrode 5 are attached. And the glass plate 3 are bonded together.
- the metal film 4, the electrode 5, the EVA resin film adhesive layer 6, and the polyacetylene resin film layer 9 are located between the glass substrate 2 and the glass plate 3.
- illustration of the EVA resin film adhesive layer is omitted in a portion where a part of FIG. 1 is cut out.
- a PVA (polyvinyl alcohol) resin film or a PVB (polyvinyl butyral) resin film can be arranged as an adhesive layer.
- a PVA resin film or a PVB (polyvinyl butyral) resin film can be arranged as an adhesive layer.
- the EVA resin film it is preferable to arrange the EVA resin film as an adhesive layer because the water resistance of the heating element can be further improved.
- the conductive layer is not necessarily arranged on only one surface side of the substrate, and may be arranged on both surfaces of the substrate.
- the heating element of the present invention does not necessarily include an insulating layer.
- the heating element of the present invention is provided with an insulating layer, the strength is increased and it is difficult to break, and since the electrode is sandwiched between the base material and the insulating layer, the electrode can be protected, and The electrode can be hidden. Therefore, it is preferable.
- the electrode does not necessarily have to be electrically connected to the conductive layer along the edge of the long side of the substrate.
- the resistance value is inversely proportional to the length of the base material, it is preferable because the resistance value can be made smaller than when the electrode is electrically connected to the conductive layer along the edge of the short side.
- the electrode does not necessarily need to be made of copper foil, and may be made of other metals such as indium tin oxide (ITO) or silver foil.
- ITO indium tin oxide
- the electrode does not necessarily have to be electrically connected to the conductive layer via the conductive polymer, and may be electrically connected to the conductive layer by, for example, thermocompression bonding or an adhesive. However, it is preferable that the electrode is electrically connected to the conductive layer through the conductive polymer, since adhesion at the interface between the conductive layer and the electrode is integrated and strengthened, and poor conduction is unlikely to occur.
- the conductive layer can be in a net-like form such as a wire mesh in addition to a thin-film form such as a metal film.
- the wire mesh is specifically a metal nanowire, for example.
- the metal which comprises a wire mesh is an indium tin oxide (ITO), gold
- ITO indium tin oxide
- a conductive layer is a wire mesh
- the surface resistance value of a conductive layer can be suppressed very low.
- the surface resistance value can be 10 ⁇ / cm 2 or less.
- the wire mesh is resistant to bending and bending, and can withstand 180 ° folding.
- the shape of the wire mesh can be changed by heat, the shape can be changed freely according to the installation location, and the heating element can be installed at various locations.
- the conductive material forming the conductive layer is specifically at least one selected from, for example, a mixture of a carbon-containing substance and a metal, a carbon-containing substance, that is, carbon, and a conductive polymer.
- the carbon-containing substance is specifically a carbon nanotube, for example.
- the conductive polymer is specifically, for example, polyethylene dioxythiophene (PEDOT) or polypyrrole (PPy).
- the mixture of a carbon-containing substance and a metal is a paste having adhesiveness.
- the metal used in the mixture of the carbon-containing substance and the metal include gold, silver, copper, nickel, and metal oxide.
- Specific examples of the metal oxide include lead oxide, zinc oxide, silicon oxide, boron oxide, aluminum oxide, yttrium oxide, and titanium oxide.
- the particle diameter of the fine particles is from several nm to several tens of nm. If the particle size is small, fine wiring is possible, and if the particle size is large, the resistance value can be lowered. Specifically, a particle size of 50 nm or less is desirable.
- the conductive layer is other than a metal film, that is, the conductive layer is a wire mesh, or is formed of an adhesive paste that is a mixture of a carbon-containing substance and a metal, a carbon-containing substance, that is, carbon, or a conductive polymer. It is more resistant to impacts than metal films, is less likely to be damaged, and is less likely to increase surface resistance.
- a method of arranging a conductive layer in a planar shape on a base material using a metal constituting a wire mesh, a mixture of a carbon-containing material and a metal, a carbon-containing material, or a conductive polymer the following method is used.
- the following method is used.
- the following method is used.
- a solvent having a relatively low boiling point for example, by dissolving one of these conductive materials in a solvent having a relatively low boiling point, coating the substrate with a solution in which the conductive material is dissolved, and then heating the substrate to the solvent evaporation temperature, or UV curing
- a method of adhering these conductive materials to a substrate in a planar form by a treatment such as a so-called adhesive such as thermosetting or a printing method.
- the film in order to reduce the surface resistance value of the metal film in sputtering, the film must be thickened. If the film is thickened, the metal film is colored yellow and the transmittance is lowered. And if the transmittance falls, it becomes difficult to install in a place where high transmittance is required, such as a window.
- the conductive layer is placed in a planar shape on the substrate using a metal that constitutes the wire mesh, a mixture of carbon-containing material and metal, carbon-containing material, or conductive polymer, the printing method or wet coating
- the conductive layer can be arranged relatively easily using the method. Further, since the printing method and the wet coating method do not make the substrate as hot as sputtering, a resin material such as a resin plate or a resin film can be adopted as the substrate.
- a base material provided with a conductive layer can be freely deformed, and a heating element can be installed along an object to generate heat.
- a window of an automobile is bent three-dimensionally, and cannot be installed in a flat shape that cannot be deformed, such as a heating element including a glass substrate provided with a metal film.
- the heating element has a resin plate substrate or resin film substrate provided with a wire mesh or the like as a conductive layer
- the substrate should be deformed using a heat gun or the like and accurately installed along the window. Can do. This is because both the flexibility of the substrate and the flexibility of the conductive layer are present.
- the base material or the insulating layer is transparent and the conductive layer is a wire mesh
- heat generation with a surface resistance value of 10 ⁇ / cm 2 or less while maintaining a transmittance of 90% or more is possible depending on the mesh width. You can place your body on the window of a car.
- a conductive layer with high permeability can be arranged. If the material or the insulating layer is transparent, the heating element of the present invention can be suitably installed on an object such as a window that requires transparency.
- the electrodes are preferably as thin as possible.
- FIG. 3 is a schematic cross-sectional view showing a first example of the heating element of the second embodiment to which the present invention is applied.
- a heating element 11 of the present invention shown in FIG. 3 includes a polyimide resin film substrate 12.
- the polyimide resin film substrate is an example of a substrate.
- the heating element 11 of the present invention includes a metal nanowire layer 14 arranged in a planar shape along one surface of the polyimide resin film substrate 12.
- the metal nanowire is an example of a wire mesh
- the wire mesh is an example of a conductive layer.
- the metal nanowire layer 14 is formed on the polyimide resin film substrate 12 by a printing method.
- the heating element 11 of the present invention includes the electrode 5 electrically connected to the metal nanowire layer 14. Moreover, the electrode 5 is comprised with the copper foil. The power cable and power supply are omitted.
- the electrodes 5 are provided on both sides of the metal nanowire layer 14 along the opposing edges of the polyimide resin film substrate 12 and are provided at substantially the center of the metal nanowire layer 14.
- Each electrode 5 is electrically connected to the metal nanowire layer 14 via the polythiophene resin film layer 18.
- the polythiophene resin film is an example of a conductive polymer.
- the heating element 11 of the present invention is a triacetate resin film layer 13 which is disposed on the side of the polyimide resin film substrate 12 on which the metal nanowire layer 14 is provided and which is formed of a triacetate resin which is an insulating material. Is provided.
- the triacetate resin film layer is an example of an insulating layer.
- the heating element 11 of the present invention is disposed between the metal nanowire layer 14 and the triacetate resin film layer 13 and can form a sealed space 17 between the metal nanowire layer 14 and the triacetate resin film layer 13.
- the spacer part 16 is provided. Further, as shown in the figure, the spacer portion 16 is disposed outside the electrode 5.
- the EVA resin film adhesive layer 6 is disposed between one side of the spacer portion 16 and the metal nanowire layer 14, and the one side of the spacer portion 16 and the metal nanowire layer 14 are bonded.
- the EVA resin film adhesive layer 6 is also disposed between the other side of the spacer portion 16 and the triacetate resin film layer 13, and the other side of the spacer portion 16 and the triacetate resin film layer 13 are adhered to each other. .
- the sealed space 17 is a space surrounded by the metal nanowire layer 14, the triacetate resin film layer 13, and the spacer portion 16.
- a desiccant is placed inside the spacer portion 16.
- the air in the sealed space 17 is dried by this desiccant.
- the sealed space 17 By forming the sealed space 17, it is possible to improve heat insulation and suppress the occurrence of condensation.
- argon gas or tryptone gas which is an inert gas, may be sealed in the sealed space 17 or the inside of the sealed space 17 may be evacuated to improve heat insulation.
- FIG. 4 is a schematic cross-sectional view showing a second example of the heating element of the second embodiment to which the present invention is applied.
- a heating element 11 of the present invention shown in FIG. 4 includes a polyimide resin film substrate 12.
- the heating element 11 of the present invention has a first metal nanowire layer 14 ⁇ / b> A arranged in a planar shape along one surface of the polyimide resin film substrate 12, and the other surface of the polyimide resin film substrate 12. And a second metal nanowire layer 14B arranged in a plane.
- first metal nanowire layer 14A and the second metal nanowire layer 14B are formed on the polyimide resin film substrate 12 by a printing method.
- the heating element 11 of the present invention was bonded to the first metal nanowire layer 14 ⁇ / b> A arranged in a planar shape along one surface of the polyimide resin film substrate 12 via the EVA resin film adhesive layer 6.
- a first triacetate resin film layer 13A is provided.
- the heating element 11 of the present invention includes the electrode 5 electrically connected to the second metal nanowire layer 14 ⁇ / b> B arranged in a planar shape along the other surface of the polyimide resin film substrate 12. Moreover, the electrode 5 is comprised with the copper foil. The power cable and power supply are omitted.
- the electrodes 5 are provided on both sides of the second metal nanowire layer 14B along the opposing edges of the polyimide resin film substrate 12, and are provided at substantially the center of the second metal nanowire layer 14B.
- the electrodes 5 are electrically connected to the second metal nanowire layer 14B via the polythiophene resin film layer 18, respectively.
- the heating element 11 of the present invention includes a second triacetate resin film layer 13B disposed on the second metal nanowire layer 14B side of the polyimide resin film substrate 12 on which the electrode 5 is provided.
- an EVA resin film adhesive layer 6 is disposed between the second metal nanowire layer 14B provided with the electrode 5 and the second triacetate resin film layer 13B. And the 2nd metal nanowire layer 14B provided with the electrode 5 and the 2nd triacetate resin film layer 13B are adhere
- the second metal nanowire layer 14B, the polythiophene resin film layer 18, the electrode 5, and the EVA resin film adhesive layer 6 are positioned between the polyimide resin film substrate 12 and the second triacetate resin film layer 13B. To do.
- the heating element 11 of the present invention was disposed on the opposite side of the second triacetate resin film layer 13B bonded to the second metal nanowire layer 14B provided with the electrode 5 from the side facing the electrode 5.
- a third triacetate resin film layer 13C is provided.
- the heating element 11 of the present invention includes a spacer portion 16 disposed between the second triacetate resin film layer 13B and the third triacetate resin film layer 13C.
- an EVA resin film adhesive layer 6 is disposed between one side of the spacer portion 16 and the second triacetate resin film layer 13B, and one side of the spacer portion 16 and the second triacetate resin film layer 13B. And are adhered.
- the EVA resin film adhesive layer 6 is also disposed between the other side of the spacer portion 16 and the third triacetate resin film layer 13C, and the other side of the spacer portion 16 and the third triacetate resin film layer 13C. And are adhered.
- spacer part 16 can form the sealed space 17 between the second triacetate resin film layer 13B and the third triacetate resin film layer 13C.
- the sealed space 17 is a space surrounded by the second triacetate resin film layer 13B, the third triacetate resin film layer 13C, and the spacer portion 16.
- a desiccant is placed inside the spacer portion 16.
- the air in the sealed space 17 is dried by this desiccant.
- FIG. 5 is a schematic cross-sectional view showing a third example of the heating element of the second embodiment to which the present invention is applied.
- a heating element 11 of the present invention shown in FIG. 5 includes a polyimide resin film substrate 12.
- the heating element 11 of the present invention has a first metal nanowire layer 14 ⁇ / b> A arranged in a planar shape along one surface of the polyimide resin film substrate 12, and the other surface of the polyimide resin film substrate 12. And a second metal nanowire layer 14B arranged in a plane.
- the first metal nanowire layer 14A and the second metal nanowire layer 14B are formed on the polyimide resin film substrate 12 by a printing method.
- the heating element 11 of the present invention includes the first triacetate resin film layer 13A disposed on the first metal nanowire layer 14A side disposed in a planar shape along one surface of the polyimide resin film substrate 12. Prepare.
- the heating element 11 of the present invention includes a first spacer portion 16A disposed between the first metal nanowire layer 14A and the first triacetate resin film layer 13A.
- an EVA resin film adhesive layer 6 is disposed between one side of the first spacer portion 16A and the first metal nanowire layer 14A, and one side of the first spacer portion 16A and the first metal nanowire layer 14A.
- the metal nanowire layer 14A is bonded.
- the EVA resin film adhesive layer 6 is also disposed between the other side of the first spacer portion 16A and the first triacetate resin film layer 13A, and the first side of the first spacer portion 16A and the first side The triacetate resin film layer 13A is adhered.
- the first spacer portion 16A can form a first sealed space 17A between the first metal nanowire layer 14A and the first triacetate resin film layer 13A.
- the first sealed space 17A is a space surrounded by the first metal nanowire layer 14A, the first triacetate resin film layer 13A, and the first spacer portion 16A.
- the heating element 11 of the present invention includes the electrode 5 electrically connected to the second metal nanowire layer 14B.
- the electrode 5 is comprised with the copper foil. The power cable and power supply are omitted.
- the electrodes 5 are provided on both sides of the second metal nanowire layer 14B along the opposing edges of the polyimide resin film substrate 12, and are provided at substantially the center of the second metal nanowire layer 14B.
- the electrodes 5 are electrically connected to the second metal nanowire layer 14B via the polythiophene resin film layer 18, respectively.
- the heating element 11 of the present invention includes a second triacetate resin film layer 13B disposed on the second metal nanowire layer 14B side of the polyimide resin film substrate 12 on which the electrode 5 is provided.
- the heating element 11 of the present invention includes the second spacer portion 16B disposed between the second metal nanowire layer 14B and the second triacetate resin film layer 13B. Further, as shown in the figure, the second spacer portion 16 ⁇ / b> B is disposed outside the electrode 5.
- an EVA resin film adhesive layer 6 is disposed between one side of the second spacer portion 16B and the second metal nanowire layer 14B, and one side of the second spacer portion 16B and the second metal nanowire layer 14B.
- the metal nanowire layer 14B is bonded.
- the EVA resin film adhesive layer 6 is also disposed between the other side of the second spacer portion 16B and the second triacetate resin film layer 13B, and the second side of the second spacer portion 16B and the second side.
- the triacetate resin film layer 13B is adhered.
- the second spacer portion 16B can form the second sealed space 17B between the second metal nanowire layer 14B and the second triacetate resin film layer 13B.
- the second sealed space 17B is a space surrounded by the second metal nanowire layer 14B, the second triacetate resin film layer 13B, and the second spacer portion 16B.
- a desiccant is placed inside the first spacer portion 16A and the second spacer portion 16B.
- the desiccant dries the air in the first sealed space 17A and the air in the second sealed space 17B.
- FIG. 6 is a schematic view showing a general glass with heating wire as a comparison target.
- the heater plate 203 is provided with a meandering heating wire 202.
- a power cable 204 for supplying power to the heating wire 202 from a power source (not shown) is connected to the heating wire 202 via a connector 205.
- the area of the glass plate 3 of the heating element 1 of the present invention and the area of the glass plate 201 of the glass 200 with heating wire were the same.
- the applied voltage to the heating element 1 of the present invention was 30V, and the applied voltage to the glass with heating wire 200 was 100V.
- the temperature of the glass plate 3 exceeded 30 ° C. after 5 minutes from the start of power supply, but the glass with heating wire 200 supplied power.
- the temperature of the glass plate 201 did not exceed 30 ° C. even after 20 minutes had passed since the start of the process.
- the heating element of the present invention includes a conductive layer arranged in a planar shape along a base material and formed of a conductive material, and an electrode electrically connected to the conductive layer. Therefore, it is possible to generate heat uniformly in the surface direction by passing a current through the conductive layer.
- the heating element of the present invention can be heated to a desired temperature in a shorter time than a heating element using a conventional heating wire.
- a base material a resin plate or resin film is used, and a metal constituting a wire mesh, a mixture of a carbon-containing material and a metal, a carbon-containing material, or a conductive polymer is used. If the conductive layer is arranged in a planar shape on the substrate, the heating element of the present invention can be installed along the three-dimensionally bent object.
- the heating element of the present invention includes a highly transparent resin film such as a polyimide resin film or a triacetate resin film, and also includes a metal nanowire layer having high transmittance and high flexibility as a conductive layer. Therefore, the heating element of the present invention can be installed on a car window or the like bent three-dimensionally, and can prevent icing and condensation on the car window in cold districts and cold periods to ensure visibility and improve safety. it can.
- the heating element of the present invention is, for example, a window glass of a building, a partition, a bathroom mirror, an automobile window, a railway vehicle window, a ship window, a motorcycle windshield, a meter panel, and a thermal insulation window of a physics and chemistry equipment device. Applicable to heaters for physics and chemistry equipment.
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- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
Abstract
Description
例えば、容器内の液体の凍結防止もしくは加熱のために容器の外側面に発熱体が取付けられたり、保温が必要な流体用配管に発熱体が巻き付けられて流体温度の下降を防止したりしている。
例えば特許文献1には、図7に示すようなヒーターの発熱部が記載されている。
すなわち、特許文献1に記載の発熱部111は、裏面材111Bと、電熱線111Aと、表面材111Cとを備える。
また、電熱線の曲げられた箇所が断線するおそれがあった。
また、ワイヤーメッシュによって、表面抵抗値を大きく下げることができる。
また、基材と絶縁層とで電極を挟む構造となるので、電極を保護することができ、かつ、電極を隠すことができる。
図1は、本発明を適用した第1の実施態様の発熱体の一例を示す概略図である。また、図2は、図1のA-A線に沿った断面を示す概略断面図である。
また、金属膜4は、ガラス基材2に金属を蒸着して形成されたものである。ここで、金属は、導電性材料の一例である。
また、金属膜4の表面抵抗値は、50Ω/cm2以下、好ましくは30Ω/cm2以下、さらに好ましくは10Ω/cm2である。
また、図1に示す例では、電極5は、ガラス基材2の対向する長辺の縁それぞれに沿って金属膜4の両側に設けられていると共に、金属膜4の略中央に設けられている。
ここで、ポリアセチレン樹脂フィルムは、導電性ポリマーの一例である。
ここで、ガラス板は、絶縁層の一例である。
また、ガラス基材2とガラス板3は、互いに略同じ面積を有する。
また、ガラス基材2の端面からガラス板3の端面にまで、例えばブチル化合物を付与して防水することもできる。
しかし、EVA樹脂フィルムを接着層として配置した方が、発熱体の耐水性をより向上させることができるので好ましい。
しかし、本発明の発熱体が絶縁層を備えていれば、強度が高まり破損し難くなり、また、基材と絶縁層とで電極を挟む構造となるので、電極を保護することができ、かつ、電極を隠すことができる。よって、好ましい。
しかし、抵抗値は基材の長さに反比例するので、短辺の縁に沿って導電層に電気的に電極を接続する場合よりも抵抗値を小さくできるので好ましい。
しかし、電極が、導電性ポリマーを介して導電層に電気的に接続されていれば、導電層と電極との界面での密着が一体化して強固となり、導通不良が起こり難くなるので好ましい。
また、ワイヤーメッシュは、具体的には例えばメタルナノワイヤである。また、ワイヤーメッシュを構成する金属は、例えばインジウム錫酸化物(ITO)、金、銀、銅、ニッケルである。
また、ワイヤーメッシュは曲げや折れに強く、180°の折り返しにも耐えることができる。
また、ワイヤーメッシュは熱で形を変えることができるので、設置場所に合わせて形を自由に変えることができ、様々な場所に発熱体を設置できる。
また、導電性高分子は、具体的には例えばポリエチレンジオキシチオフェン(PEDOT)、ポリピロール(PPy)である。
また、炭素含有物質と金属との混合物に使用される金属としては、具体的には例えば、金、銀、銅、ニッケル、金属酸化物である。
また、金属酸化物は、具体的には例えば、酸化鉛、酸化亜鉛、酸化ケイ素、酸化ホウ素、酸化アルミニウム、酸化イットリウム、酸化チタンである。
また、微細粒子の粒径は、数nmから数十nmである。粒径が小さければ微細な配線が可能であり、粒径が大きければ抵抗値を下げることができる。具体的には、50nm以下の粒径が望ましい。
例えば、比較的沸点の低い溶媒に、これら導電性材料のいずれかを溶かし込み、導電性材料が溶けた溶液を基材にコーティングした後、溶媒蒸発温度まで基材を加熱する方法や、UV硬化および熱硬化などいわゆる接着剤のような処理で、これら導電性材料を基材に面状に接着する方法や、印刷方法である。
また、金属膜を形成する際に用いられるスパッタリングは、基材を高温にしてしまうので、樹脂製の基材に金属膜を形成しようとすると基材が不本意に変形してしまうおそれがある。
また、金属膜を形成する場合には、比較的規模の大きい装置を使用する必要がある。
そして、透過率が下がってしまうと、窓など高い透過率が要求される箇所に設置することが困難となる。
また、印刷法やウェットコーティング法は、スパッタリングほど基材を高温にしないので、基材として、樹脂板や樹脂フィルムなど樹脂製のものを採用できる。
一方、導電層としてワイヤーメッシュなどが設けられた樹脂板基材や樹脂フィルム基材を備える発熱体であれば、ヒートガンなどを使って基材を変形させて、窓に沿って正確に設置することができる。これは、基材のフレキシブル性と導電層のフレキシブル性の両方があるからである。
図3に示す本発明の発熱体11は、ポリイミド樹脂フィルム基材12を備える。ここで、ポリイミド樹脂フィルム基材は、基材の一例である。
また、メタルナノワイヤ層14は、ポリイミド樹脂フィルム基材12に印刷法で形成されたものである。
なお、電源ケーブルおよび電源は省略する。
ここで、ポリチオフェン樹脂フィルムは、導電性ポリマーの一例である。
また、トリアセテート樹脂フィルム層は、絶縁層の一例である。
また、図に示すように、スペーサ部16は、電極5よりも外側に配置されている。
この乾燥剤によって、密閉空間17内の空気を乾燥させている。
図4に示す本発明の発熱体11は、ポリイミド樹脂フィルム基材12を備える。
なお、電源ケーブルおよび電源は省略する。
そして、電極5が設けられた第2のメタルナノワイヤ層14Bと第2のトリアセテート樹脂フィルム層13Bとが接着されている。
この乾燥剤によって、密閉空間17内の空気を乾燥させている。
図5に示す本発明の発熱体11は、ポリイミド樹脂フィルム基材12を備える。
また、第1のメタルナノワイヤ層14Aおよび第2のメタルナノワイヤ層14Bは、ポリイミド樹脂フィルム基材12に印刷法で形成されたものである。
なお、電源ケーブルおよび電源は省略する。
また、図に示すように、第2のスペーサ部16Bは、電極5よりも外側に配置されている。
この乾燥剤によって、第1の密閉空間17A内の空気および第2の密閉空間17B内の空気を乾燥させている。
次に、本発明の第1の実施態様の発熱体1と、一般の電熱線付きガラスとについて、ガラス板を電熱してガラス板の5分毎の温度を測定した。
また、図6は、比較対象である一般の電熱線付きガラスを示す概略図である。
また、電熱線202には、図示していない電源から電熱線202に電力を供給するための電源ケーブル204が、コネクタ205を介して接続されている。
また、電熱線付きガラス200の電熱線202に電力を供給してガラス板201を20分間熱し、5分毎にガラス板201の温度を測定した。結果を比較例として表1に示す。
従って、3次元に曲がった自動車の窓などに本発明の発熱体を設置でき、寒冷地や寒冷時期における自動車の窓などの氷結や結露を抑制して視界を確保し、安全性を高めることができる。
2 ガラス基材
3 ガラス板
4 金属膜
5 電極
6 EVA樹脂フィルム接着層
7 電源ケーブル
8 電源
9 ポリアセチレン樹脂フィルム層
11 発熱体
12 ポリイミド樹脂フィルム基材
13 トリアセテート樹脂フィルム層
13A 第1のトリアセテート樹脂フィルム層
13B 第2のトリアセテート樹脂フィルム層
13C 第3のトリアセテート樹脂フィルム層
14 メタルナノワイヤ層
14A 第1のメタルナノワイヤ層
14B 第2のメタルナノワイヤ層
16 スペーサ部
16A 第1のスペーサ部
16B 第2のスペーサ部
17 密閉空間
17A 第1の密閉空間
17B 第2の密閉空間
18 ポリチオフェン樹脂フィルム層
Claims (8)
- 基材と、
該基材に沿って面状に配置された、かつ、導電性材料で形成された導電層と、
該導電層と電気的に接続された電極とを備える
発熱体。 - 前記基材は、樹脂板または樹脂フィルムであり、
前記導電層はワイヤーメッシュである
請求項1に記載の発熱体。 - 前記導電性材料は、炭素含有物質と金属との混合物、炭素含有物質、および導電性高分子から選ばれる少なくとも1種である
請求項1に記載の発熱体。 - 前記基材の、前記導電層が設けられた側に配置された、かつ、絶縁性材料で形成された絶縁層を備える
請求項2に記載の発熱体。 - 前記導電層と前記絶縁層との間または前記絶縁層同士の間に配置された、かつ、同導電層と同絶縁層との間または同絶縁層同士の間に密閉空間を形成可能なスペーサ部を備える
請求項4に記載の発熱体。 - 前記基材は長方形の板状であり、
前記電極は、前記基材の長辺の縁に沿って前記導電層に電気的に接続された
請求項1に記載の発熱体。 - 前記電極は、導電性ポリマーを介して前記導電層に電気的に接続された
請求項5に記載の発熱体。 - 前記基材、前記導電層および前記絶縁層は透過性を有する
請求項4に記載の発熱体。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES14894535T ES2904881T3 (es) | 2014-06-09 | 2014-06-09 | Cuerpo generador de calor |
CA2951509A CA2951509C (en) | 2014-06-09 | 2014-06-09 | Heat generating body |
US15/317,095 US10149349B2 (en) | 2014-06-09 | 2014-06-09 | Heat generating body |
JP2016527508A JP6530389B2 (ja) | 2014-06-09 | 2014-06-09 | 発熱体 |
KR1020167034679A KR101871965B1 (ko) | 2014-06-09 | 2014-06-09 | 발열체 |
PCT/JP2014/065218 WO2015189890A1 (ja) | 2014-06-09 | 2014-06-09 | 発熱体 |
CN201480079761.9A CN106465480B (zh) | 2014-06-09 | 2014-06-09 | 发热体 |
EP14894535.5A EP3154312B1 (en) | 2014-06-09 | 2014-06-09 | Heat generating body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2014/065218 WO2015189890A1 (ja) | 2014-06-09 | 2014-06-09 | 発熱体 |
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US (1) | US10149349B2 (ja) |
EP (1) | EP3154312B1 (ja) |
JP (1) | JP6530389B2 (ja) |
KR (1) | KR101871965B1 (ja) |
CN (1) | CN106465480B (ja) |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017149782A1 (ja) * | 2016-03-04 | 2017-09-08 | 日立化成株式会社 | 転写型硬化性導電性フィルム、ヒーターの製造方法及びヒーター |
JP2017195182A (ja) * | 2016-04-15 | 2017-10-26 | 三菱製紙株式会社 | 発熱シート及びそれを用いた加熱剥離型粘着シート |
WO2018015698A1 (fr) * | 2016-07-22 | 2018-01-25 | Saint-Gobain Glass France | Paroi de douche chauffante |
EP3606283A4 (en) * | 2017-03-24 | 2020-12-30 | CAM Holding Corporation | PLANAR HEATING STRUCTURE |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101637920B1 (ko) * | 2015-01-06 | 2016-07-08 | 연세대학교 산학협력단 | 투명필름히터 및 그의 제조방법 |
KR101812024B1 (ko) * | 2016-06-10 | 2017-12-27 | 한국기계연구원 | 열선 및 이를 포함하는 면상 발열 시트 |
KR101888513B1 (ko) * | 2018-03-14 | 2018-08-14 | 양영제 | 스팀 세척기가 장착된 자동차 |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62237690A (ja) * | 1986-04-07 | 1987-10-17 | 松下冷機株式会社 | 面状発熱体 |
JPH11314943A (ja) * | 1999-02-05 | 1999-11-16 | Tatsuguchi Kogyo Glass Kk | 除曇ガラス |
JP2007102002A (ja) * | 2005-10-06 | 2007-04-19 | Sekisui Chem Co Ltd | 透明発熱パネル |
JP4470024B2 (ja) * | 2004-09-24 | 2010-06-02 | 株式会社村上開明堂 | 発熱素子 |
JP2010251230A (ja) * | 2009-04-20 | 2010-11-04 | Fujifilm Corp | 電熱窓ガラス |
WO2012073474A1 (ja) * | 2010-11-30 | 2012-06-07 | ナガセケムテックス株式会社 | 透明面発熱体形成用導電性コーティング剤及び透明面発熱体 |
JP2013251064A (ja) * | 2012-05-30 | 2013-12-12 | Toppan Printing Co Ltd | 面状発熱体及びその製造方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3947618A (en) * | 1972-10-31 | 1976-03-30 | General Electric Company | Electrically heated transparent panel |
JPS5347633U (ja) | 1976-12-27 | 1978-04-22 | ||
US4691486A (en) | 1982-04-29 | 1987-09-08 | Frank Niekrasz | Glass assembly for refrigerator doors and method of manufacture |
JPS6184064U (ja) | 1984-11-07 | 1986-06-03 | ||
FR2646966B1 (fr) * | 1989-05-10 | 1996-02-02 | Elf Aquitaine | Procede de chauffage rapide et uniforme d'un ensemble multicouche comportant au moins une couche mince a base d'un materiau macromoleculaire a conduction ionique intercalee entre deux structures a conduction electronique elevee |
US6906287B2 (en) * | 2001-09-06 | 2005-06-14 | Centre Luxembourgeois De Recherches Pour Le Verre Et La Ceramique S.A. (C.R.V.C.) | Connector structure for bus bars in heatable vehicle window |
US6919536B2 (en) * | 2002-04-05 | 2005-07-19 | Guardian Industries Corp. | Vehicle window with ice removal structure thereon |
AU2003278267A1 (en) * | 2002-09-10 | 2004-04-30 | Saint-Gobain Glass France | Connecting device for a multilayer flat element equipped with electrical functional elements and flat element |
ES2277289T3 (es) * | 2003-05-28 | 2007-07-01 | Saint-Gobain Glass France | Elemento estratificado dotado de una capa calentadora. |
JP3890334B2 (ja) | 2004-03-02 | 2007-03-07 | Necラミリオンエナジー株式会社 | フィルム外装電気デバイスおよび内圧開放システム |
US7728260B2 (en) * | 2005-06-07 | 2010-06-01 | Johnson Steven X | Warm window system |
US7180031B1 (en) * | 2005-09-19 | 2007-02-20 | Automotive Components Holdings, Llc | Electrical connection in glazing operations |
WO2009116786A2 (ko) | 2008-03-17 | 2009-09-24 | 주식회사 엘지화학 | 발열체 및 이의 제조방법 |
JP5425459B2 (ja) * | 2008-05-19 | 2014-02-26 | 富士フイルム株式会社 | 導電性フイルム及び透明発熱体 |
JP5409094B2 (ja) * | 2008-07-17 | 2014-02-05 | 富士フイルム株式会社 | 曲面状成形体及びその製造方法並びに車両灯具用前面カバー及びその製造方法 |
US9266307B2 (en) * | 2008-09-10 | 2016-02-23 | Solutia Inc. | Heated multiple layer glazings |
JP2010103041A (ja) * | 2008-10-27 | 2010-05-06 | Konica Minolta Holdings Inc | 透明フィルムヒーター、ヒーター機能付きガラス、ヒーター機能付き合わせガラスおよび自動車用窓ガラス |
CN102111926B (zh) * | 2009-12-29 | 2012-12-19 | 北京富纳特创新科技有限公司 | 除霜玻璃及应用该除霜玻璃的汽车 |
JP2013073807A (ja) * | 2011-09-28 | 2013-04-22 | Tokyo Cosmos Electric Co Ltd | 面状発熱体及びその製造方法 |
-
2014
- 2014-06-09 US US15/317,095 patent/US10149349B2/en active Active
- 2014-06-09 CN CN201480079761.9A patent/CN106465480B/zh active Active
- 2014-06-09 CA CA2951509A patent/CA2951509C/en active Active
- 2014-06-09 WO PCT/JP2014/065218 patent/WO2015189890A1/ja active Application Filing
- 2014-06-09 ES ES14894535T patent/ES2904881T3/es active Active
- 2014-06-09 JP JP2016527508A patent/JP6530389B2/ja active Active
- 2014-06-09 EP EP14894535.5A patent/EP3154312B1/en active Active
- 2014-06-09 KR KR1020167034679A patent/KR101871965B1/ko active IP Right Grant
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62237690A (ja) * | 1986-04-07 | 1987-10-17 | 松下冷機株式会社 | 面状発熱体 |
JPH11314943A (ja) * | 1999-02-05 | 1999-11-16 | Tatsuguchi Kogyo Glass Kk | 除曇ガラス |
JP4470024B2 (ja) * | 2004-09-24 | 2010-06-02 | 株式会社村上開明堂 | 発熱素子 |
JP2007102002A (ja) * | 2005-10-06 | 2007-04-19 | Sekisui Chem Co Ltd | 透明発熱パネル |
JP2010251230A (ja) * | 2009-04-20 | 2010-11-04 | Fujifilm Corp | 電熱窓ガラス |
WO2012073474A1 (ja) * | 2010-11-30 | 2012-06-07 | ナガセケムテックス株式会社 | 透明面発熱体形成用導電性コーティング剤及び透明面発熱体 |
JP2013251064A (ja) * | 2012-05-30 | 2013-12-12 | Toppan Printing Co Ltd | 面状発熱体及びその製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP3154312A4 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017149782A1 (ja) * | 2016-03-04 | 2017-09-08 | 日立化成株式会社 | 転写型硬化性導電性フィルム、ヒーターの製造方法及びヒーター |
JP2017195182A (ja) * | 2016-04-15 | 2017-10-26 | 三菱製紙株式会社 | 発熱シート及びそれを用いた加熱剥離型粘着シート |
WO2018015698A1 (fr) * | 2016-07-22 | 2018-01-25 | Saint-Gobain Glass France | Paroi de douche chauffante |
FR3054120A1 (fr) * | 2016-07-22 | 2018-01-26 | Saint Gobain | Paroi de douche chauffante |
EP3606283A4 (en) * | 2017-03-24 | 2020-12-30 | CAM Holding Corporation | PLANAR HEATING STRUCTURE |
US11432378B2 (en) | 2017-03-24 | 2022-08-30 | Cambrios Film Solutions Corporation | Planar heating structure |
Also Published As
Publication number | Publication date |
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US20170118800A1 (en) | 2017-04-27 |
CA2951509C (en) | 2019-09-24 |
KR20170007386A (ko) | 2017-01-18 |
ES2904881T3 (es) | 2022-04-06 |
CN106465480A (zh) | 2017-02-22 |
JP6530389B2 (ja) | 2019-06-12 |
EP3154312A1 (en) | 2017-04-12 |
JPWO2015189890A1 (ja) | 2017-04-20 |
US10149349B2 (en) | 2018-12-04 |
EP3154312A4 (en) | 2018-03-14 |
KR101871965B1 (ko) | 2018-07-31 |
CN106465480B (zh) | 2019-05-31 |
EP3154312B1 (en) | 2021-12-01 |
CA2951509A1 (en) | 2015-12-17 |
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