WO2015152076A1 - 長尺のガスバリア性積層体及びその製造方法、電子デバイス用部材、並びに電子デバイス - Google Patents

長尺のガスバリア性積層体及びその製造方法、電子デバイス用部材、並びに電子デバイス Download PDF

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Publication number
WO2015152076A1
WO2015152076A1 PCT/JP2015/059727 JP2015059727W WO2015152076A1 WO 2015152076 A1 WO2015152076 A1 WO 2015152076A1 JP 2015059727 W JP2015059727 W JP 2015059727W WO 2015152076 A1 WO2015152076 A1 WO 2015152076A1
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Prior art keywords
gas barrier
barrier laminate
resin film
layer
long
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PCT/JP2015/059727
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English (en)
French (fr)
Japanese (ja)
Inventor
渉 岩屋
公市 永元
智史 永縄
近藤　健
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リンテック株式会社
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Priority to JP2016511631A priority Critical patent/JPWO2015152076A1/ja
Publication of WO2015152076A1 publication Critical patent/WO2015152076A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133345—Insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption
    • B32B2307/7242—Non-permeable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption
    • B32B2307/7242—Non-permeable
    • B32B2307/7246—Water vapor barrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B32B2307/736—Shrinkable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/12—Photovoltaic modules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a long gas barrier laminate that suppresses generation of wrinkles in a base material and has excellent gas barrier properties, a method for producing the same, a member for an electronic device comprising the gas barrier laminate, and the electronic device
  • the present invention relates to an electronic device including a member.
  • displays such as a liquid crystal display and an electroluminescence (EL) display have a gas barrier on a transparent plastic film instead of a glass plate as a substrate having electrodes in order to realize a reduction in thickness, weight, and flexibility.
  • a so-called gas barrier film in which layers are laminated is used.
  • Patent Literature 1 describes a gas barrier film in which a highly smoothed layer, an intermediate layer, and a gas barrier layer are laminated in this order on a film substrate. This document also describes that a high smoothing layer can be formed using an energy beam curable compound.
  • the present invention has been made in view of the above circumstances, and is composed of a long gas barrier laminate having excellent gas barrier properties while suppressing generation of wrinkles of the base material, a method for producing the same, and the gas barrier laminate.
  • An object of the present invention is to provide an electronic device member and an electronic device including the electronic device member.
  • the present inventors have intensively studied a long gas barrier laminate obtained by laminating a base material, a smoothing layer and a gas barrier layer in this order.
  • the smoothing layer is formed from a cured product of the active energy ray-curable resin composition using a long resin film having a heat shrinkage rate in a specific range as the base material.
  • the inventors have found that a long gas barrier laminate having excellent gas barrier properties with suppressed generation can be obtained, and the present invention has been completed.
  • the following long gas barrier laminates (1) to (6), the production method of the long gas barrier laminates (7) to (11), and the electronic device (12) A member and an electronic device according to (13) are provided.
  • a long gas barrier laminate comprising a cured product of a linear curable resin composition.
  • a method for producing a long gas barrier laminate comprising: (8) The method for producing a long gas barrier laminate according to (7), wherein the annealing temperature in step (I) is 100 to 180 ° C. and the heating time is 30 seconds to 60 minutes.
  • the resin film before annealing treatment has a shrinkage in the longitudinal direction of X 0 (%) when heated at 150 ° C. for 30 minutes, and a shrinkage in the width direction of Y 0 (%). When the shrinkage ratio in the longitudinal direction of the resin film for base material when heated at 150 ° C.
  • X 1 (%) and the shrinkage ratio in the width direction is Y 1 (%)
  • X 1 / X 0 is The method for producing a long gas barrier laminate according to (7), wherein 0.1 to 0.9 and Y 1 / Y 0 is 0.05 to 0.9.
  • the long gas barrier laminate according to (7) which is subjected to heat treatment at 100 to 200 ° C. for 10 seconds to 1 hour in Step (II) and / or Step (III). Production method.
  • step (II) the treatment of step (II) is performed, and the obtained resin film with a smoothing layer is wound up in a roll shape, and then the resin film with a smoothing layer wound up in a roll shape is fed out and conveyed in a certain direction.
  • (12) An electronic device member comprising the long gas barrier laminate according to (1).
  • An electronic device comprising the electronic device member according to (12).
  • the generation of a long gas barrier laminate excellent in gas barrier properties and the production method thereof, the electronic device member comprising the gas barrier laminate, and the electronic An electronic device comprising a device member is provided.
  • the long gas barrier laminate of the present invention is a long gas barrier laminate in which a substrate, a smoothing layer, and a gas barrier layer are laminated in this order.
  • Material is 150 when heated 30 min at °C longitudinal shrinkage X 1 is 0.0% or more and 0.8% or less, the width direction shrinkage Y 1 is less than 0.5% 0.0% It consists of a long resin film,
  • the said smoothing layer consists of the hardened
  • the “long” means one having a length of at least 5 times the width, preferably 10 times or more, and specifically wound in a roll shape. It has a length that can be taken and stored or transported.
  • “long” means that the shape is a strip shape whose longitudinal direction is longer (preferably 10 times or longer) than the width direction. In the following description, “long” may be omitted.
  • the length of the resin film is not particularly limited, but is usually 400 to 2000 m.
  • the width (length in the width direction) of the resin film is not particularly limited, but is usually 450 to 1300 mm, preferably 530 to 1280 mm.
  • the thickness of the resin film is not particularly limited, but is usually 1 to 60 ⁇ m, preferably 5 to 50 ⁇ m, more preferably 10 to 30 ⁇ m.
  • polyimide polyimide, polyamide, polyamideimide, polyphenylene ether, polyether ketone, polyether ether ketone, polyolefin, polyester, polycarbonate, polysulfone, polyether sulfone, polyphenylene sulfide, acrylic resin, cycloolefin Based polymers, aromatic polymers, and the like.
  • resin components can be used alone or in combination of two or more.
  • polyester, polyamide, polysulfone, polyether sulfone, polyphenylene sulfide, or cycloolefin-based polymer is more preferable, and polyester or cycloolefin-based polymer is more preferable because of excellent transparency and versatility.
  • polyester examples include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and polyarylate.
  • cycloolefin polymers examples include norbornene polymers, monocyclic olefin polymers, cyclic conjugated diene polymers, vinyl alicyclic hydrocarbon polymers, and hydrides thereof.
  • the resin film may contain various additives as long as the effects of the present invention are not hindered.
  • the additive include an ultraviolet absorber, an antistatic agent, a stabilizer, an antioxidant, a plasticizer, a lubricant, a filler, and a coloring pigment. What is necessary is just to determine suitably content of these additives according to the objective.
  • the resin film can be obtained by preparing a resin composition containing predetermined components and molding it into a film.
  • the molding method is not particularly limited, and a known method such as a casting method or a melt extrusion method can be used.
  • Resin film used in the present invention the longitudinal shrinkage X 1 when heated for 30 minutes at 0.99 ° C. 0.8% to 0.0% or less, preferably 0.8% or more 0.01% or less, more preferably below 0.5% 0.1% widthwise shrinkage Y 1 0.5% or more 0.0% or less, preferably 0.5% or 0.01% or less, more preferably 0 .05% or more and 0.3% or less.
  • a resin film having a thermal shrinkage rate in the above range as a base material, even when the smoothing layer is heated, the generation of wrinkles of the base material (resin film) due to the thermal contraction of the smoothing layer is suppressed. be able to.
  • a resin film having such characteristics can be obtained efficiently by subjecting the resin film to an annealing treatment.
  • the smoothing layer which comprises the gas-barrier laminated body of this invention consists of hardened
  • a smoothing layer reduces the unevenness
  • the active energy ray-curable resin composition is a composition that contains a polymerizable compound and is cured by irradiation with active energy rays to give a cured product.
  • the polymerizable compound to be used examples include a polymerizable prepolymer and a polymerizable monomer.
  • the polymerizable prepolymer includes a polyester oligomer having a hydroxyl group at both ends, a polyester acrylate prepolymer obtained by a reaction with (meth) acrylic acid, a low molecular weight bisphenol type epoxy resin or a novolac type epoxy resin, )
  • epoxy acrylate prepolymer polyurethane oligomer obtained by reaction with acrylic acid, urethane acrylate prepolymer, polyether polyol obtained by reaction of (meth) acrylic acid, and (meth) acrylic acid
  • examples thereof include a polyol acrylate prepolymer to be obtained.
  • Examples of the polymerizable monomer include 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, and hydroxypivalic acid.
  • the active energy ray-curable resin composition may contain a polymer resin component that does not have reaction curability, such as an acrylic resin.
  • the viscosity of the composition can be adjusted by adding a polymer resin component.
  • active energy rays examples include ultraviolet rays, electron beams, ⁇ rays, ⁇ rays, ⁇ rays, and the like. Among these, ultraviolet rays are preferable as the active energy rays because they can be generated using a relatively simple apparatus.
  • the active energy ray curable resin composition that is, the ultraviolet curable resin composition
  • the active energy ray curable resin composition preferably contains a photopolymerization initiator.
  • a photoinitiator will not be specifically limited if a polymerization reaction is started by irradiation of an ultraviolet-ray.
  • the photopolymerization initiator include benzoin-based polymerization initiators such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin-n-butyl ether, and benzoin isobutyl ether; acetophenone, 4′-dimethylaminoacetophenone, 2,2 -Dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- [ 4- (Methylthio) phenyl] -2-morpholino-propan-1-one, 2-hydroxy-1- ⁇ 4- [4- (2-hydroxy-2-methyl-propionyl) -
  • the active energy ray-curable resin composition may contain other components as long as the effects of the present invention are not hindered.
  • other components include an antistatic agent, a stabilizer, an antioxidant, a plasticizer, a lubricant, a filler, and a color pigment. What is necessary is just to determine these content suitably according to the objective.
  • the method for forming the smoothing layer is not particularly limited.
  • an active energy ray-curable resin composition and, if necessary, a coating liquid containing a solvent was prepared, and then this coating liquid was coated on a substrate by a known method, and obtained.
  • a smoothing layer made of a cured product of the active energy ray-curable resin composition can be formed.
  • Solvents used for preparing the coating liquid include aromatic hydrocarbon solvents such as benzene and toluene; ester solvents such as ethyl acetate and butyl acetate; ketone solvents such as acetone, methyl ethyl ketone, and methyl isobutyl ketone; n-pentane And aliphatic hydrocarbon solvents such as n-hexane and n-heptane; and alicyclic hydrocarbon solvents such as cyclopentane and cyclohexane. These solvents can be used alone or in combination of two or more.
  • Examples of the coating method include a bar coating method, a spin coating method, a dipping method, a roll coating, a gravure coating, a knife coating, an air knife coating, a roll knife coating, a die coating, a screen printing method, a spray coating, and a gravure offset method.
  • drying method When the coating film is dried, conventionally known drying methods such as hot air drying, hot roll drying, and infrared irradiation can be adopted as the drying method.
  • the drying temperature is usually in the range of 60 to 130 ° C.
  • the drying time is usually several seconds to several tens of minutes.
  • the coating film can be cured by irradiating the coating film with active energy rays.
  • active energy rays include ultraviolet rays, electron beams, ⁇ rays, ⁇ rays, ⁇ rays, and the like.
  • ultraviolet rays are preferable as the active energy rays because they can be generated using a relatively simple apparatus.
  • light sources such as an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a low pressure mercury lamp, a carbon arc, a black light lamp, and a metal halide lamp can be used as the ultraviolet ray source.
  • No particular restrictions on the quantity of ultraviolet light it is usually 100mJ / cm 2 ⁇ 1,000mJ / cm 2.
  • the irradiation time is usually several seconds to several hours, and the irradiation temperature is usually room temperature to 100 ° C.
  • the thickness of the smoothing layer is usually 20 ⁇ m or less, preferably 0.1 to 20 ⁇ m, more preferably 0.5 to 10 ⁇ m.
  • the arithmetic average roughness (Ra) of the surface of the smoothing layer is preferably 5 nm or less, more preferably 0.1 to 5 nm, still more preferably 0.1 to 4 nm, and particularly preferably 1 to 4 nm. .
  • the maximum cross-sectional height (Rt) of the roughness curve is preferably 100 nm or less, more preferably 1 to 100 nm, still more preferably 20 to 80 nm, and particularly preferably 30 to 65 nm.
  • Gas barrier layer which comprises the gas barrier laminated body of this invention is a layer which has the characteristic (gas barrier property) which suppresses permeation
  • the gas barrier layer for example, a layer obtained by subjecting an inorganic vapor deposition film or a layer containing a polymer compound (hereinafter, also referred to as “polymer layer”) to a modification treatment [in this case, the gas barrier layer is In addition, it means not only a region modified by ion implantation treatment or the like, but a “polymer layer including a modified region”. ] Etc. are mentioned.
  • the inorganic vapor deposition film examples include vapor deposition films of inorganic compounds and metals.
  • inorganic oxides such as silicon oxide, aluminum oxide, magnesium oxide, zinc oxide, indium oxide and tin oxide
  • inorganic nitrides such as silicon nitride, aluminum nitride and titanium nitride
  • inorganic carbides Inorganic sulfides
  • inorganic oxynitrides such as silicon oxynitride
  • Examples of the raw material for the metal vapor deposition film include aluminum, magnesium, zinc, and tin. These can be used singly or in combination of two or more. Among these, an inorganic vapor-deposited film using an inorganic oxide, inorganic nitride or metal as a raw material is preferable from the viewpoint of gas barrier properties, and further, an inorganic material using an inorganic oxide or inorganic nitride as a raw material from the viewpoint of transparency. A vapor deposition film is preferred.
  • a PVD (physical vapor deposition) method such as a vacuum vapor deposition method, a sputtering method, or an ion plating method, a thermal CVD (chemical vapor deposition) method, a plasma CVD method, a photo CVD method, etc.
  • the CVD method is mentioned.
  • the thickness of the inorganic vapor deposition film varies depending on the inorganic compound to be used, but is preferably in the range of 50 to 300 nm, more preferably 50 to 200 nm from the viewpoint of gas barrier properties and handling properties.
  • the polymer compound used is a silicon-containing polymer compound, polyimide, polyamide, polyamideimide, polyphenylene ether, polyetherketone, polyetheretherketone, polyolefin, Examples thereof include polyester, polycarbonate, polysulfone, polyethersulfone, polyphenylene sulfide, polyarylate, acrylic resin, cycloolefin polymer, and aromatic polymer. These polymer compounds can be used alone or in combination of two or more.
  • a silicon-containing polymer compound is preferable because a gas barrier layer having better gas barrier properties can be formed.
  • silicon-containing polymer compounds include polysilazane compounds, polycarbosilane compounds, polysilane compounds, and polyorganosiloxane compounds.
  • a polysilazane compound is preferable because a gas barrier layer having excellent gas barrier properties can be formed even if it is thin.
  • the polysilazane compound is a polymer compound having a repeating unit containing —Si—N— bond (silazane bond) in the molecule. Specifically, the formula (1)
  • the compound which has a repeating unit represented by these is preferable.
  • the number average molecular weight of the polysilazane compound to be used is not particularly limited, but is preferably 100 to 50,000.
  • n represents arbitrary natural numbers.
  • Rx, Ry, and Rz each independently represent a hydrogen atom, an unsubstituted or substituted alkyl group, an unsubstituted or substituted cycloalkyl group, an unsubstituted or substituted alkenyl group, unsubstituted or substituted Represents a non-hydrolyzable group such as an aryl group having a group or an alkylsilyl group;
  • alkyl group of the unsubstituted or substituted alkyl group examples include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, a t-butyl group, Examples thereof include alkyl groups having 1 to 10 carbon atoms such as n-pentyl group, isopentyl group, neopentyl group, n-hexyl group, n-heptyl group and n-octyl group.
  • Examples of the unsubstituted or substituted cycloalkyl group include cycloalkyl groups having 3 to 10 carbon atoms such as a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, and a cycloheptyl group.
  • alkenyl group of an unsubstituted or substituted alkenyl group examples include, for example, a vinyl group, 1-propenyl group, 2-propenyl group, 1-butenyl group, 2-butenyl group, 3-butenyl group and the like having 2 to 2 carbon atoms. 10 alkenyl groups are mentioned.
  • substituents for the alkyl group, cycloalkyl group and alkenyl group include halogen atoms such as fluorine atom, chlorine atom, bromine atom and iodine atom; hydroxyl group; thiol group; epoxy group; glycidoxy group; (meth) acryloyloxy group
  • halogen atoms such as fluorine atom, chlorine atom, bromine atom and iodine atom
  • hydroxyl group such as hydroxyl group; thiol group; epoxy group; glycidoxy group; (meth) acryloyloxy group
  • An unsubstituted or substituted aryl group such as a phenyl group, a 4-methylphenyl group, and a 4-chlorophenyl group;
  • aryl group of an unsubstituted or substituted aryl group examples include aryl groups having 6 to 10 carbon atoms such as a phenyl group, a 1-naphthyl group, and a 2-naphthyl group.
  • substituent of the aryl group examples include halogen atoms such as fluorine atom, chlorine atom, bromine atom and iodine atom; alkyl groups having 1 to 6 carbon atoms such as methyl group and ethyl group; carbon numbers such as methoxy group and ethoxy group 1-6 alkoxy groups; nitro groups; cyano groups; hydroxyl groups; thiol groups; epoxy groups; glycidoxy groups; (meth) acryloyloxy groups; unsubstituted phenyl groups, 4-methylphenyl groups, 4-chlorophenyl groups, etc.
  • alkylsilyl group examples include a trimethylsilyl group, a triethylsilyl group, a triisopropylsilyl group, a tri-t-butylsilyl group, a methyldiethylsilyl group, a dimethylsilyl group, a diethylsilyl group, a methylsilyl group, and an ethylsilyl group.
  • Rx, Ry, and Rz a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group is preferable, and a hydrogen atom is particularly preferable.
  • Examples of the polysilazane compound having a repeating unit represented by the formula (1) include inorganic polysilazanes in which Rx, Ry, and Rz are all hydrogen atoms, and organic polysilazanes in which at least one of Rx, Ry, and Rz is not a hydrogen atom. It may be.
  • a modified polysilazane compound can also be used as the polysilazane compound.
  • Examples of the modified polysilazane include, for example, JP-A-62-195024, JP-A-2-84437, JP-A-63-81122, JP-A-1-138108, and JP-A-2-175726.
  • JP-A-5-238827, JP-A-5-238827, JP-A-6-122852, JP-A-6-306329, JP-A-6-299118, JP-A-9-31333 Examples thereof include those described in Kaihei 5-345826 and JP-A-4-63833.
  • the polysilazane compound perhydropolysilazane in which Rx, Ry, and Rz are all hydrogen atoms is preferable from the viewpoint of easy availability and the ability to form an ion-implanted layer having excellent gas barrier properties.
  • a polysilazane compound a commercially available product as a glass coating material or the like can be used as it is.
  • the polysilazane compounds can be used alone or in combination of two or more.
  • the polymer layer may contain other components in addition to the polymer compound described above as long as the object of the present invention is not impaired.
  • other components include a curing agent, an anti-aging agent, a light stabilizer, and a flame retardant.
  • the content of the polymer compound in the polymer layer is preferably 50% by mass or more and more preferably 70% by mass or more because a gas barrier layer having better gas barrier properties can be obtained.
  • the thickness of the polymer layer is not particularly limited, but is preferably in the range of 50 to 300 nm, more preferably 50 to 200 nm. In the present invention, even if the thickness of the polymer layer is nano-order, a gas barrier laminate having a sufficient gas barrier property can be obtained.
  • the method for forming the polymer layer is not particularly limited. For example, preparing a polymer layer forming solution containing at least one polymer compound, optionally other components, a solvent, etc., and then applying this polymer layer forming solution by a known method, A polymer layer can be formed by drying the obtained coating film.
  • Solvents used for the polymer layer forming solution include aromatic hydrocarbon solvents such as benzene and toluene; ester solvents such as ethyl acetate and butyl acetate; ketone solvents such as acetone, methyl ethyl ketone and methyl isobutyl ketone; n- And aliphatic hydrocarbon solvents such as pentane, n-hexane, and n-heptane; and alicyclic hydrocarbon solvents such as cyclopentane and cyclohexane. These solvents can be used alone or in combination of two or more.
  • Coating methods for the polymer layer forming solution include bar coating, spin coating, dipping, roll coating, gravure coating, knife coating, air knife coating, roll knife coating, die coating, screen printing, spray coating, and gravure. Examples include an offset method.
  • drying the formed coating film As a method for drying the formed coating film, conventionally known drying methods such as hot air drying, hot roll drying, and infrared irradiation can be employed.
  • the heating temperature is usually in the range of 60 to 130 ° C.
  • the heating time is usually several seconds to several tens of minutes.
  • Examples of the polymer layer modification treatment include ion implantation treatment, plasma treatment, ultraviolet irradiation treatment, and heat treatment.
  • the ion implantation process is a method of modifying the polymer layer by implanting ions into the polymer layer, as will be described later.
  • the plasma treatment is a method for modifying the polymer layer by exposing the polymer layer to plasma.
  • plasma treatment can be performed according to the method described in Japanese Patent Application Laid-Open No. 2012-106421.
  • the ultraviolet irradiation treatment is a method for modifying the polymer layer by irradiating the polymer layer with ultraviolet rays.
  • the ultraviolet modification treatment can be performed according to the method described in JP2013-226757A.
  • the ion implantation treatment is preferable because the gas barrier layer can be efficiently modified to the inside without roughening the surface of the polymer layer and more excellent in gas barrier properties.
  • ions implanted into the polymer layer ions of rare gases such as argon, helium, neon, krypton, and xenon; ions of fluorocarbon, hydrogen, nitrogen, oxygen, carbon dioxide, chlorine, fluorine, sulfur, etc .; methane, ethane, etc.
  • rare gases such as argon, helium, neon, krypton, and xenon
  • fluorocarbon hydrogen, nitrogen, oxygen, carbon dioxide, chlorine, fluorine, sulfur, etc .
  • Ion of alkane gases such as ethylene and propylene
  • Ions of alkadiene gases such as pentadiene and butadiene
  • Ions of alkyne gases such as acetylene
  • Aromatic carbonization such as benzene and toluene
  • Examples include ions of hydrogen-based gases; ions of cycloalkane-based gases such as cyclopropane; ions of cycloalkene-based gases such as cyclopentene; ions of metals; ions of organosilicon compounds. These ions can be used alone or in combination of two or more.
  • ions of rare gases such as argon, helium, neon, krypton, and xenon are preferable because ions can be more easily implanted and a gas barrier layer having better gas barrier properties can be obtained.
  • the ion implantation amount can be appropriately determined according to the purpose of use of the gas barrier laminate (necessary gas barrier properties, transparency, etc.).
  • Examples of the method of implanting ions include a method of irradiating ions accelerated by an electric field (ion beam), a method of implanting ions in plasma, and the like.
  • the latter method of implanting plasma ions is preferable because the desired barrier layer can be easily obtained.
  • plasma is generated in an atmosphere containing a plasma generation gas such as a rare gas, and a negative high voltage pulse is applied to the polymer layer, whereby ions (positive ions) in the plasma are It can be performed by injecting into the surface portion of the polymer layer.
  • a plasma generation gas such as a rare gas
  • the thickness of the region into which ions are implanted can be controlled by implantation conditions such as ion type, applied voltage, and processing time, and is determined according to the thickness of the polymer layer, the purpose of use of the laminate, etc. Usually, it is 10 to 300 nm.
  • the long gas barrier laminate of the present invention is formed by laminating the base material, the smoothing layer, and the gas barrier layer in this order.
  • the long gas barrier laminate of the present invention may have a layer other than the base material, the smoothing layer, and the gas barrier layer.
  • layers other than the base material, the smoothing layer, and the gas barrier layer include a hard code layer, a conductor layer, a shock absorbing layer, an adhesive layer, and a process sheet.
  • seat has a role which protects a laminated body, when a laminated body is preserve
  • Examples of the layer structure of the gas barrier laminate of the present invention include the following.
  • the thickness is 0.5. It is -3 ⁇ m, preferably 0.5-2 ⁇ m.
  • the gas barrier laminate of the present invention can be produced by the method described later.
  • the thickness of the gas barrier laminate of the present invention is not particularly limited, but is preferably 5 to 100 ⁇ m, more preferably 10 to 50 ⁇ m, and still more preferably 20 to 40 ⁇ m.
  • the gas barrier layered product of the present invention is preferably 0.1g / (m 2 ⁇ day) or less, more preferably 0.05g / (m 2 ⁇ day ) Or less, and more preferably 0.03 g / (m 2 ⁇ day) or less.
  • the water vapor transmission rate can be measured by the method described in the examples.
  • the manufacturing method of the present invention is a manufacturing method of the long gas barrier laminate of the present invention, in which a long resin film is annealed at 150 ° C. longitudinal shrinkage X 1 when heated for 30 minutes of 0.0% to 0.8% or less, the resin film for the width direction of shrinkage Y 1 is at least 0.5% 0.0% or less of the base material Applying the coating liquid containing the active energy ray-curable resin composition on the resin film for a substrate obtained in Step (I) and Step (I), and curing the obtained coating film A step (II) for forming a smoothing layer and a step (III) for forming a gas barrier layer on the smoothing layer formed in step (II) are characterized.
  • Step (I) is subjected to annealing treatment in the resin film of the elongated 0.8% 30 minutes longitudinal shrinkage X 1 when heated is 0.0% or more at 0.99 ° C. or less, in the width direction shrinkage
  • This is a step of obtaining a resin film for a substrate in which Y 1 is 0.0% or more and 0.5% or less.
  • the method for performing the annealing process is not particularly limited.
  • annealing treatment can be performed by heating a long film to a predetermined temperature while being conveyed in a heating furnace.
  • the heating temperature is not particularly limited, but is usually 100 to 180 ° C., preferably 110 to 160 ° C.
  • the heating time is not particularly limited, but is usually 30 seconds to 60 minutes, preferably 1 minute to 30 minutes.
  • the shrinkage ratio in the longitudinal direction when the resin film before annealing is heated at 150 ° C. for 30 minutes is X 0 (%)
  • the shrinkage ratio in the width direction is Y 0 (%)
  • X 1 the shrinkage rate in the longitudinal direction of the resin film for a substrate after annealing treatment at 150 ° C. for 30 minutes
  • X 1 It is preferable to carry out the annealing treatment so that / X 0 is 0.1 to 0.9 and Y 1 / Y 0 is 0.05 to 0.9.
  • X 1 / X 0 is preferably 0.1 to 0.6, more preferably 0.1 to 0.5
  • Y 1 / Y 0 is preferably 0.05 to 0.6, more preferably 0.05 to 0.5.
  • step (II) a coating liquid containing an active energy ray-curable resin composition is applied onto the substrate resin film obtained in step (I), and the resulting coating film is cured. It is a step of forming a smoothing layer.
  • the smoothing layer is formed, the smoothing layer forming method described above can be used.
  • Step (III) is a step of forming a gas barrier layer on the smoothing layer formed in step (II).
  • the gas barrier layer forming method described above can be used.
  • steps (I) to (III) may be performed continuously, or after finishing each step, the treated resin film is once wound into a roll, and if necessary, The resin film may be fed out and the subsequent steps may be performed.
  • steps (I) to (III) may be performed continuously, or after finishing each step, the treated resin film is once wound into a roll, and if necessary, The resin film may be fed out and the subsequent steps may be performed.
  • the smoothing layer and the barrier layer are formed in step (II) and step (III)
  • generation of wrinkles of the base material can be suppressed, and a long gas barrier laminate can be efficiently produced.
  • the treated resin film is once wound up in a roll shape, and if necessary, the resin film is unrolled to perform the subsequent steps. .
  • step (I) the obtained substrate resin film is wound up in a roll shape, and then the substrate resin film wound up in a roll shape is fed out in a certain direction.
  • step (II) is carried out while being conveyed, and the obtained resin film with a smoothing layer is wound up in a roll shape, and then the resin film with a smoothing layer wound up in a roll shape is fed out in a certain direction.
  • the long gas barrier laminate in which the generation of wrinkles of the substrate is suppressed by carrying out the treatment of step (III) while being conveyed and winding up the obtained gas barrier layer and the resin film with a smoothing layer in a roll shape. Can be manufactured efficiently.
  • step (II) or step (III) wrinkles were generated on the substrate.
  • the method of the present invention performs an annealing process in step (I). For this reason, even if the smoothing layer is heated in step (II) or step (III) and a contraction force is generated, the base material does not follow and deform as a result. The generation of wrinkles is suppressed.
  • the conditions for the heat treatment in step (II) and / or step (III) are, for example, 100 to 200 ° C., 10 seconds to 1 hour, preferably 100 to 150 ° C., 30 seconds to 30 minutes.
  • the long gas barrier laminate of the present invention can be produced efficiently.
  • the electronic device member of the present invention comprises the long gas barrier laminate of the present invention.
  • “consisting of a long gas barrier laminate” includes not only a long gas barrier laminate but also a laminate obtained by cutting the laminate into a predetermined shape.
  • the electronic device member of the present invention is excellent in colorless transparency as well as preventing deterioration of the element due to gas such as water vapor because it has suppressed the generation of wrinkles of the base material and has excellent gas barrier properties. . Therefore, the electronic device member of the present invention is suitable as a display member such as a liquid crystal display or an EL display.
  • the electronic device of the present invention includes the electronic device member of the present invention. Specific examples include a liquid crystal display, an organic EL display, an inorganic EL display, electronic paper, and a solar battery. Since the electronic device of the present invention includes the electronic device member comprising the gas barrier laminate of the present invention, it has excellent appearance and durability against water vapor and the like.
  • Resin film (1) Polyethylene terephthalate film (manufactured by Teijin DuPont, trade name: Teijin Tetron film HB3, thickness: 25 ⁇ m)
  • Example 1 The resin film (1) is fed out from the roll of the resin film (1), and the resin film (1) is heated at 130 ° C. for 2 minutes while being conveyed in the heating furnace, and subjected to an annealing treatment, and then wound into a roll. I took it. Next, the annealed resin film (1) is fed out from the roll, and the smoothing layer forming solution (1) obtained in Production Example 1 is applied to the annealed resin film (1) by the bar coating method. The obtained coating film was heated and dried at 70 ° C.
  • the resulting resin film with a smoothing layer was wound into a roll. Subsequently, the resin film with a smoothing layer was fed out from the roll, and perhydropolysilazane (manufactured by AZ Electronic Materials, trade name: AZNL110A-20) was applied to the surface of the smoothing layer by a bar coating method. Was heated at 120 ° C.
  • argon (Ar) is ion-implanted on the surface of the perhydropolysilazane layer using a plasma ion implantation apparatus to form a gas barrier layer, and then the obtained gas barrier layer and resin with a smoothing layer are obtained.
  • a long gas barrier laminate 1 having a layer structure of base material [resin film (1)] / smoothing layer / gas barrier layer was obtained.
  • the plasma ion implantation apparatus and plasma ion implantation conditions used for forming the gas barrier layer are as follows.
  • RF power supply Model number “RF” 56000
  • JEOL high voltage pulse power supply “PV-3-HSHV-0835”, Kurita Manufacturing Co., Ltd.
  • Plasma generated gas Ar ⁇ Gas flow rate: 100sccm ⁇ Duty ratio: 0.5% ⁇ Repetition frequency: 1000Hz ⁇ Applied voltage: -10kV ⁇ RF power supply: frequency 13.56 MHz, applied power 1000 W -Chamber internal pressure: 0.2 Pa ⁇ Pulse width: 5 ⁇ sec ⁇ Processing time (ion implantation time): 5 minutes ⁇ Conveying speed: 0.2 m / min
  • Example 2 In Example 1, a gas barrier laminate 2 was obtained by the same method as in Example 1 except that the annealing treatment was performed at 110 ° C. for 2 minutes.
  • Example 1 A gas barrier laminate 3 was obtained in the same manner as in Example 1 except that the annealing process was not performed in Example 1.
  • Example 2 the gas barrier laminate 4 was obtained by the same method as in Example 1 except that the annealing treatment was performed at 80 ° C. for 2 minutes.
  • the gas barrier laminates 1 to 4 obtained in Examples 1 and 2 and Comparative Examples 1 and 2 were measured and evaluated as follows.
  • the resin film (1) was cut into 10 cm ⁇ 10 cm so that the longitudinal direction and the width direction were the respective sides, and a test piece was obtained. Next, using a hot air oven, the test piece was heated at 150 ° C. for 30 minutes, and then the test piece was taken out. The side length A 0 (cm) in the longitudinal direction and the length B 0 (cm in the width direction) ) Were measured respectively. The following formula to determine the longitudinal shrinkage X 0 and the width direction shrinkage Y 0 of the resin film.
  • the resin film (1) after the annealing treatment [hereinafter referred to as the resin film (1 ′)] is cut into 10 cm ⁇ 10 cm so that the longitudinal direction and the width direction thereof are the respective sides, and a test piece is obtained. Obtained and heat-treated.
  • the length A 1 (cm) of the side in the longitudinal direction and the length B 1 (cm) of the side in the width direction are measured, respectively, and the shrinkage ratio X 1 in the longitudinal direction of the resin film (1 ′) is It was determined in the width direction shrinkage Y 1.
  • Table 1 shows the following.
  • the gas barrier laminates of Examples 1 and 2 are excellent in gas barrier properties and have no wrinkles on the base material.
  • the gas barrier laminate of Comparative Example 1 uses a resin film that has not been annealed as a substrate
  • the gas barrier laminate of Comparative Example 2 uses a resin film that is not sufficiently annealed as a substrate. Thus, wrinkles are formed on the base material of the obtained gas barrier laminate.

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JP2018098009A (ja) * 2016-12-12 2018-06-21 住友化学株式会社 有機電子デバイスの製造方法、電極付き基板及び有機電子デバイス
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