WO2015151329A1 - アンテナ整合装置 - Google Patents
アンテナ整合装置 Download PDFInfo
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- WO2015151329A1 WO2015151329A1 PCT/JP2014/080711 JP2014080711W WO2015151329A1 WO 2015151329 A1 WO2015151329 A1 WO 2015151329A1 JP 2014080711 W JP2014080711 W JP 2014080711W WO 2015151329 A1 WO2015151329 A1 WO 2015151329A1
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- terminal
- inductor
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- antenna matching
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
- H03H7/40—Automatic matching of load impedance to source impedance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/29—Combinations of different interacting antenna units for giving a desired directional characteristic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/30—Combinations of separate antenna units operating in different wavebands and connected to a common feeder system
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/30—Arrangements for providing operation on different wavebands
- H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
- H01Q5/314—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors
- H01Q5/335—Individual or coupled radiating elements, each element being fed in an unspecified way using frequency dependent circuits or components, e.g. trap circuits or capacitors at the feed, e.g. for impedance matching
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- H—ELECTRICITY
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- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/46—Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
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- H—ELECTRICITY
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- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
- H04B1/0064—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with separate antennas for the more than one band
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Definitions
- the present invention relates to an antenna matching device.
- multiband mobile communication terminals corresponding to a plurality of frequency bands
- the multiband is configured by combining, for example, a relatively low frequency band (low band) and a relatively high frequency band (high band).
- a portable communication terminal is required to have good transmission / reception characteristics in each of a low band and a high band.
- Patent Document 1 discloses an antenna element having a configuration in which a matching circuit is switched. With this configuration, the antenna element is matched to one of a plurality of bands.
- Patent Document 2 discloses a receiving apparatus that is matched with any of a plurality of bands. This receiver adjusts the impedance of the matching circuit following the impedance change of the antenna.
- carrier aggregation defined by LTE (Long Term Evolution) Advanced standard ("LTE" is a registered trademark).
- LTE Long Term Evolution
- carrier aggregation each band, for example, a low band and a high band are used simultaneously.
- Patent Document 1 Both the antenna element described in Japanese Patent Application Laid-Open No. 2006-246070 (Patent Document 1) and the receiving device described in Japanese Patent Application Laid-Open No. 2008-160226 (Patent Document 2) are provided for one of the bands. It is configured to adjust the matching circuit appropriately. At the time of carrier aggregation, if the matching circuit is adjusted for one band, appropriate matching is not performed for the other bands. As a result, transmission / reception characteristics and the like in other bands are degraded, so that communication performance achieved by carrier aggregation is impaired.
- An object of the present invention is to provide an antenna matching apparatus that can suppress a decrease in transmission / reception characteristics in each band at the time of carrier aggregation.
- the present invention provides a first terminal, a second terminal, a third terminal, a fourth terminal, a fifth terminal, a high-pass filter, a low-pass filter, and a first switch.
- a second switch has one end connected to the first terminal.
- the high pass filter is a filter for passing a signal in the first frequency band.
- the second terminal is connected to the other end of the high pass filter.
- the first switch has one end connected to the other end of the high-pass filter.
- the third terminal is connected to the other end of the first switch.
- the low-pass filter has one end connected to the first terminal.
- the low-pass filter is a filter for passing a signal in a second frequency band lower than the first frequency band.
- the fourth terminal is connected to the other end of the low pass filter.
- the second switch has one end connected to the other end of the low-pass filter.
- the fifth terminal is connected to the other end of the second switch.
- the antenna matching device having the above configuration is mounted on a mobile communication terminal, for example, and used as follows.
- the first terminal is connected to a transmission / reception circuit of the mobile communication terminal.
- a high band antenna is connected to one of the second and third terminals.
- a matching element for the high-band antenna is connected to the second and third terminals.
- a low band antenna is connected to one of the fourth and fifth terminals.
- a matching element for the low-band antenna is connected to the fourth and fifth terminals.
- the transmission / reception circuit of the mobile communication terminal and the high-band antenna are connected via the matching element and the high-pass filter (or the high-pass filter and the first switch).
- the transmission / reception circuit of the mobile communication terminal and the low-band antenna are connected via a matching element and a low-pass filter (or a low-pass filter and a second switch).
- the matching element achieves good matching in both the high band and the low band. Therefore, even if, for example, a low band and a high band are simultaneously used during carrier aggregation, communication performance by carrier aggregation is realized.
- FIG. 3 is a diagram illustrating a layer L1 of the multilayer substrate 21.
- FIG. 3 is a diagram showing a layer L2 of the multilayer substrate 21.
- FIG. 3 is a diagram showing a layer L3 of the multilayer substrate 21.
- FIG. 3 is a diagram showing a layer L4 of the multilayer substrate 21.
- FIG. 3 is a diagram showing a layer L5 of the multilayer substrate 21.
- FIG. 3 is a diagram illustrating a layer L6 of the multilayer substrate 21.
- FIG. 3 is a diagram showing a layer L7 of the multilayer substrate 21.
- FIG. 3 is a diagram illustrating a layer L8 of the multilayer substrate 21.
- FIG. 3 is a diagram showing a layer L9 of the multilayer substrate 21.
- FIG. 3 is a diagram illustrating a layer L10 of the multilayer substrate 21.
- FIG. 3 is a diagram illustrating a layer L11 of the multilayer substrate 21.
- FIG. 3 is a diagram showing a layer L12 of the multilayer substrate 21.
- FIG. 3 is a diagram showing a layer L4 of the multilayer substrate 21.
- FIG. 3 is a diagram showing a layer L5 of the multilayer substrate 21.
- FIG. 3 is a diagram
- FIG. 3 is a diagram showing a layer L13 of the multilayer substrate 21.
- FIG. 3 is a diagram showing a layer L14 of the multilayer substrate 21.
- FIG. 3 is a diagram illustrating a layer L15 of the multilayer substrate 21.
- FIG. 3 is a diagram illustrating a layer L16 of the multilayer substrate 21.
- FIG. 7 is a diagram for explaining an experiment result of an isolation characteristic of a configuration including the diplexer 100A, the switch circuit 11, and the switch circuit 12 illustrated in FIG. It is a figure for demonstrating the experimental result of the isolation characteristic as a comparative example.
- FIG. 1 is a diagram for explaining an antenna matching apparatus according to an embodiment.
- antenna matching apparatus 20 includes terminals T1 to T6, diplexer 100, phase circuits 210 and 220, and switches 310, 320, and 330.
- the diplexer 100 includes a high pass filter (HPF) 110 and a low pass filter (LPF) 120.
- HPF 110 is used to pass a high-band (first frequency band) signal.
- LPF 120 is used to pass a low-band (second frequency band) signal.
- the low band frequency is lower than the high band frequency.
- the high band frequency band is, for example, about 1500 MHz to 3500 MHz, and the low band frequency band is, for example, about 600 MHz to 1200 MHz.
- the diplexer 100 is connected to the terminal T1 (first terminal). More specifically, HPF 110 and LPF 120 are connected to terminal T1. That is, the HPF 110 has one end connected to the terminal T1. The LPF 120 has one end connected to the terminal T1.
- the phase circuit 210 shifts (rotates) the phase of the high-band signal. If it is not necessary to shift the phase, the antenna matching device 20 may be configured without including the phase circuit 210.
- the phase circuit 220 (second phase circuit) is used to shift the phase of the low-band signal. When it is not necessary to shift the phase, the antenna matching device 20 may be configured without including the phase circuit 220.
- the phase circuit will be described in detail later with reference to FIG.
- the terminal T2 (second terminal) is connected to the other end of the HPF 110 via the phase circuit 210.
- the terminal T2 is directly connected to the HPF 110.
- the switch 310 (first switch) is connected to the other end of the HPF 110 via the phase circuit 210.
- the switch 310 is directly connected to the other end of the HPF 110. That is, switch 310 has one end connected to the other end of HPF 110.
- the terminal T3 (third terminal) is connected to the other end of the switch 310.
- the terminal T4 (fourth terminal) is connected to the other end of the LPF 120 via the phase circuit 220.
- the terminal T4 is directly connected to the other end of the LPF 120.
- the switch 320 (second switch) is connected to the other end of the LPF 120 via the phase circuit 220.
- the switch 320 is directly connected to the other end of the LPF 120. That is, switch 320 has one end connected to the other end of LPF 120.
- the terminal T5 (fifth terminal) is connected to the other end of the switch 320.
- the switch 330 (third switch) is connected to the other end of the switch 320. In other words, switch 330 has one end connected to the other end of switch 320.
- the terminal T6 (sixth terminal) is connected to the other end of the switch 330.
- the antenna matching device 20 is used for a mobile communication terminal (not shown in FIG. 1), for example.
- the antenna matching device 20 is suitably used for a mobile communication terminal that supports carrier aggregation.
- FIG. 2 is a diagram for explaining an application example of the antenna matching apparatus 20.
- the antenna matching device 20 is connected to the transmission / reception circuit 30 of the mobile communication terminal 40.
- the terminal T1 is connected to the transmission / reception circuit 30.
- the transmission / reception circuit 30 can simultaneously process a low-band signal and a high-band signal. For example, the communication speed of the mobile communication terminal 40 is improved by the carrier aggregation.
- a high band signal from the HPF 110 is input to the terminal T1, and a high band signal from the transmission / reception circuit 30 is output to the terminal T1.
- a low-band signal from the LPF 120 is input to the terminal T1, and a low-band signal from the transmission / reception circuit 30 is output to the terminal T1. That is, a high-band signal is input and output to the terminal T1, and at the same time, a low-band frequency signal is input and output.
- the high-band signal from the HPF 110 is a high-frequency reception frequency signal
- the high-band signal from the transmission / reception circuit 30 is a high-band transmission frequency signal
- the low band signal from the LPF 120 is a signal having a reception frequency in the low band
- the low band signal from the transmission / reception circuit 30 is a signal having a transmission frequency in the low band.
- only the low-band or high-band signal may be output from the transmission / reception circuit 30 to the terminal T1.
- a low-band or high-band signal may be input to the terminal T1.
- ANT1 is connected to the terminal T3.
- ANT1 is a high band antenna for transmitting and receiving high band signals.
- An inductor 410 is provided between the terminal T2 and the terminal T3.
- the inductor 410 is a matching element for ANT1.
- the switch 310 When the switch 310 is turned off (OFF), the inductor 410 functions as a matching element of the ANT1.
- the switch 310 When the switch 310 is turned on (ON), the inductor 410 is bypassed by the switch 310 and thus does not function as a matching element of the ANT1. If not required for ANT1 matching, the inductor 410 can be omitted.
- the transmission / reception circuit 30 and the ANT1 can be connected via a matching element (inductor 410).
- inductor 410 may be connected in series with ANT1.
- the inductor 410 functions as a matching element of ANT1, thereby improving the matching in the high band. As a result, good matching is achieved in the high band.
- ANT2 is connected to terminal T5.
- ANT2 is a low band antenna for transmitting and receiving low band signals.
- An inductor 420 is provided between the terminal T4 and the terminal T5.
- the inductor 420 is a matching element for ANT2.
- the switch 320 When the switch 320 is turned off, the inductor 420 functions as a matching element of ANT2.
- the switch 320 is turned on, the inductor 420 is bypassed by the switch 320 and thus does not function as a matching element of the ANT2. If not necessary for ANT2 matching, the inductor 420 can be omitted.
- One end of the inductor 430 is connected to the terminal T6.
- the other end of the inductor 430 is connected to the ground (GND).
- the ground has a reference potential.
- the inductor 430 when the switch 330 is turned on, the inductor 430 functions as a matching element of the ANT2. When the switch 330 is turned off, the inductor 430 does not function as a matching element for the ANT2. If not required for matching ANT2, the inductor 430 can be omitted and the terminal T6 can be left open.
- the transmission / reception circuit 30 and the ANT2 can be connected via matching elements (inductor 420 and inductor 430).
- inductor 420 may be connected in series with ANT2, and inductor 430 may be connected in a shunt with ANT2.
- the inductor 420 and the inductor 430 function as matching elements of the ANT2, thereby improving the matching in the low band. As a result, good matching is achieved in the low band.
- the antenna matching device 20 realizes good matching in both the high band and the low band. Therefore, even if the low band and the high band are used at the same time during carrier aggregation, the mobile communication terminal 40 can achieve good communication performance.
- an inductor is shown as a matching element, but the matching element is not limited to an inductor.
- the matching element may be a capacitor, for example. The same applies to FIGS. 3 and 4 described later.
- FIG. 3 is a diagram for explaining another application example of the antenna matching apparatus 20. Note that illustration of the mobile communication terminal is omitted in FIG. 3 and FIG. 4 described later.
- ANT1 is connected to the terminal T2.
- One end of an inductor 440 is connected to the terminal T3.
- the other end of the inductor 440 is connected to the ground.
- the switch 310 When the switch 310 is turned on, the inductor 440 functions as a matching element of ANT1.
- the switch 310 is turned off, the inductor 440 does not function as a matching element of the ANT1. If not necessary for matching ANT1, the inductor 440 can be omitted and the terminal T3 can be left open.
- the transmission / reception circuit 30 and the ANT1 may include a matching element (inductor 440).
- the inductor 440 may be connected to the shunt with respect to ANT1.
- the inductor 440 functions as a matching element of the ANT1, thereby improving the matching in the high band. As a result, good matching is achieved in the high band.
- ANT2 is connected to the terminal T4.
- One end of an inductor 450 is connected to the terminal T5.
- the other end of the inductor 450 is connected to the ground.
- the switch 320 When the switch 320 is turned on, the inductor 450 functions as a matching element of the ANT2.
- the switch 320 When the switch 320 is turned off, the inductor 450 does not function as a matching element of the ANT2. If not necessary for matching ANT2, the inductor 450 can be omitted and the terminal T5 can be left open.
- the one end of the inductor 460 is connected to the terminal T6.
- the other end of the inductor 460 is connected to the ground.
- the inductor 460 is connected to the ground.
- the transceiver circuit 30 and the ANT2 can be connected via matching elements (inductor 450 and inductor 460).
- inductor 450 and inductor 460 can be connected in a shunt to ANT2.
- the inductor 450 and the inductor 460 function as matching elements, thereby improving the matching in the low band. As a result, good matching is achieved in the low band.
- the antenna matching device 20 achieves good matching in both the high band and the low band. Therefore, even if the low band and the high band are simultaneously used during carrier aggregation, good communication performance is realized in the mobile communication terminal.
- the inductor 410 is connected in series with ANT1, and the inductor 420 is connected in series with ANT2.
- the inductor 440 is connected to the shunt with respect to ANT1
- the inductor 450 is connected to the shunt with respect to ANT2.
- FIG. 4 is a diagram for explaining a modification of the antenna matching apparatus according to the embodiment.
- antenna matching device 20A is different from antenna matching device 20 (FIG. 1 and the like) in that it further includes terminals T7 and T8 and switches 340 and 350. Since the configuration of other parts of antenna matching apparatus 20A is the same as the corresponding part of antenna matching apparatus 20 shown in FIG. 1 and the like, description thereof will not be repeated here.
- Switch 340 (fourth switch) is connected to the other end of LPF 120 via phase circuit 220.
- the switch 340 is directly connected to the other end of the LPF 120. That is, switch 340 has one end connected to the other end of LPF 120.
- the terminal T7 (seventh terminal) is connected to the other end of the switch 340.
- One end of an inductor 470 is connected to the terminal T7.
- the other end of the inductor 470 is connected to the ground.
- the switch 340 When the switch 340 is turned on, the inductor 470 functions as a matching element for ANT2.
- the switch 340 is turned off, the inductor 470 does not function as a matching element for the ANT2. If the inductor 470 is not required for the matching of ANT2, the inductor 470 can be omitted and the terminal T7 can be left open.
- the transmission / reception circuit 30 and the ANT2 can be connected via matching elements (inductor 420, inductor 460 and inductor 470).
- inductor 420 may be connected in series with ANT2
- inductor 460 and inductor 470 may be connected in a shunt with ANT2. Since the antenna matching device 20A includes the three matching elements of the inductor 420, the inductor 460, and the inductor 470, the matching is further improved in the low band as compared with the configuration of FIG. 2 or FIG.
- the switch 350 (fifth switch) is connected to the other end of the switch 310. That is, switch 350 has one end connected to the other end of switch 310.
- the terminal T8 (eighth terminal) is connected to the other end of the switch 350.
- One end of an inductor 480 is connected to the terminal T8.
- the other end of the inductor 480 is connected to the ground.
- the switch 350 When the switch 350 is turned on, the inductor 480 functions as a matching element of ANT1.
- the switch 350 is turned OFF, the inductor 480 does not function as a matching element of ANT1. If the inductor 480 is not required for the matching of ANT1, the inductor 480 can be omitted and the terminal T8 can be left open.
- the transceiver circuit 30 and the ANT1 can be connected via matching elements (inductor 410 and inductor 480).
- inductor 410 can be connected in series with ANT1
- inductor 480 can be connected in a shunt with ANT1.
- the antenna matching device 20A includes the two matching elements of the inductor 410 and the inductor 480, so that better matching is achieved in the high band as compared with the configuration of FIG. 2 or FIG.
- a variable capacitance element may be arranged instead of the switch 340. Adjusting the capacitance of the variable capacitor increases the degree of matching freedom.
- the function of the inductor 470 as a matching element can be suppressed by adjusting the capacitance of the variable capacitor to the minimum and setting the impedance of the variable capacitor to high impedance. The same applies to the switch 350.
- the antenna matching device 20A includes more matching elements than the antenna matching device 20 shown in FIG. Thereby, in the high band and the low band, the matching is further improved as compared with the antenna matching device 20. Therefore, even if the low band and the high band are simultaneously used during carrier aggregation, good communication performance is realized in the mobile communication terminal.
- the antenna matching device 20 may include a phase circuit (the phase circuit 210 and the phase circuit 220).
- FIG. 5 is a diagram for conceptually explaining the effect brought about by the phase circuit.
- FIG. 5 shows terminals T1, T3 and T5, diplexer 100, phase circuit 220, and switches 310 and 320 of antenna matching apparatus 20, and the other configurations are not shown.
- the transmission / reception circuit 30 is connected to the terminal T1.
- ANT1 is connected to the terminal T3.
- ANT2 is connected to the terminal T5.
- the transmission / reception circuit 30 supplies (outputs) the low-band transmission signal to the terminal T1, and simultaneously receives the low-band and high-band reception signals from the terminal T1.
- the transmission / reception circuit 30 may supply (output) a further high-band transmission signal to the terminal T1, and simultaneously receive low-band and high-band reception signals from the terminal T1.
- the low-band transmission signal from the transmission / reception circuit 30 is transmitted from the ANT 2 through the LPF 120 and the switch 320.
- the switch 320 may generate a harmonic that is an integral multiple of the transmission signal as spurious.
- the third harmonic of the transmission signal is generated as spurious.
- the spurious generated by switch 320 is transmitted by ANT2 (illustrated as “3fo”). Specifically, a part of the spurious generated by the switch 320 passes through the terminal T5 and reaches the ANT2 and is transmitted, and the remaining spurious is reflected at one end (120-L) of the LPF 120 and then passed through the switch 320 and the terminal T5. It arrives at ANT2 and is transmitted. This phenomenon also occurs with integer multiples of harmonics.
- Spurious frequencies can overlap with high-band frequencies.
- the low band is about 600 MHz to 1200 MHz
- the high band is about 1500 MHz to 3500 MHz.
- the frequency of the third harmonic of the frequency of 600 MHz to 1167 MHz in the low band overlaps with the frequency of 1800 MHz to 3500 MHz in the high band.
- the spurious transmitted by the ANT 2 is received by the ANT 1 and reaches the transmission / reception circuit 30. Due to the effect of spurious reaching the transmission / reception circuit 30, communication performance (for example, reception sensitivity) in the high band is lowered.
- the same problem occurs when a frequency that is an integral multiple of the low band frequency overlaps with the high band frequency.
- the antenna matching device 20 includes the phase circuit 220
- some spurious generated by the switch 320 directly reaches the ANT2 and is transmitted.
- the remaining spurious passes through the phase circuit 220, is reflected at one end (120-L) of the LPF 120, and then passes through the phase circuit 220 again to reach ANT2 and be transmitted.
- some spurious components that directly reach the ANT2 and other spurious components that reach the ANT2 after being reflected by the LPF 120 cancel each other. As a result, almost no spurious is transmitted from ANT2, and a decrease in communication performance (for example, reception sensitivity) in the high band is suppressed.
- the phase circuit 220 is configured to shift (rotate) the phase of a signal having a predetermined frequency in the high band by 90 degrees.
- the phase circuit 220 includes a distributed constant line such as a microstrip line.
- the phase circuit 220 may include a lumped constant circuit including an inductor and a capacitor.
- a phase circuit 210 may be provided between the switch 310 and the HPF 110.
- spurious can be caused by the switch 310 when a high-band signal is transmitted from the ANT1.
- the spurious can be suppressed.
- the antenna matching apparatus according to the embodiment is configured using, for example, a substrate.
- the substrate can be, for example, a multilayer substrate.
- An example of a multilayer substrate that realizes the antenna matching apparatus according to the embodiment will be described with reference to FIGS.
- FIG. 6 is a diagram for explaining an example of an antenna matching device provided on the multilayer substrate.
- each element included in antenna matching apparatus 20 ⁇ / b> B is provided on multilayer substrate 21.
- the antenna matching device 20B includes terminals T1 to T6 and T8, a diplexer 100A, switch circuits 11 and 12, a phase circuit 220A, control terminals CTL1 to CTL4, and voltage supply lines PL0 to PL4 (at least part of them). And capacitors 13-17. Capacitors 13 to 17 serve as bypass capacitors for removing noise on voltage supply lines PL0 to PL4.
- Terminals T1 to T6 and T8 are terminals similar to the terminals T1 to T6 and T8 of the antenna matching apparatus 20 described with reference to FIGS. 1 to 3 and the antenna matching apparatus 20A described with reference to FIG. Therefore, the description will not be repeated here.
- the diplexer 100A includes a high-pass filter (HPF) 110A and a low-pass filter (LPF) 120A.
- HPF high-pass filter
- LPF low-pass filter
- the diplexer 100A, HPF 110A, and LPF 120A in FIG. 6 correspond to, for example, the diplexer 100, HPF 110, and LPF 120 in FIG. 4, respectively.
- HPF 110A includes capacitor 1 and capacitor 4, inductor 2 and inductor 3.
- the capacitor 1 and the inductor 2 are arranged in an L shape so as to pass a high-band signal, and one end of the inductor 2 is connected to the ground.
- the inductor 3 and the capacitor 4 are connected in series to the terminal T2, and are disposed so as to attenuate a low-band signal having a predetermined frequency by parallel resonance.
- the HPF 110A may be realized by, for example, a SAW (Surface Accouustic Wave) filter.
- LPF 120A includes an inductor 5 and an inductor 7, a capacitor 6 and a capacitor 8.
- the inductor 5 and the capacitor 6 are arranged in an L shape so as to pass a low-band frequency, and one end of the capacitor 6 is connected to the ground.
- the inductor 7 and the capacitor 8 are connected in series to the inductor 9 and are arranged so as to attenuate a high-frequency signal having a predetermined frequency by parallel resonance.
- LPF 120A may be realized by, for example, a SAW filter.
- the phase circuit 220A shifts the phase of the low band signal.
- the phase circuit 220A in FIG. 6 corresponds to the phase circuit 220 in FIG.
- Phase circuit 220 ⁇ / b> A includes inductor 9 and capacitor 10.
- inductor 9 and capacitor 10 are arranged in an L shape so as to rotate (shift) the phase of a signal having a predetermined frequency in the high band by 90 degrees, and one end of capacitor 10 is connected to the ground. ing.
- the switch circuit 11 includes a switch 11-1 and a switch 11-2.
- As the switch 11-1 and the switch 11-2 for example, an SPDT (Single Pole Double Through) switch is used.
- the switch circuit 11 is integrated on one chip and can be realized as an IC (Integrated Circuit).
- the switch 11-1 and the switch 11-2 in FIG. 6 correspond to, for example, the switches 310 and 350 in FIG. 4, respectively.
- the voltage supply lines PL0, PL3 and PL4 are provided for supplying a voltage to the switch circuit 11.
- the switch circuit 11 is supplied with the power supply voltage VDD, the control signal from the control terminal CTL3, and the control signal from the control terminal CTL4 via any of the voltage supply lines PL0, PL3, and PL4.
- the power supply voltage VDD is supplied to the switch 11-1 and the switch 11-2.
- the switch 11-1 is controlled by a control signal from the control terminal CTL3, and the switch 11-2 is controlled by a control signal from the control terminal CTL4.
- the switch circuit 12 includes a switch 12-1 and a switch 12-2. Similar to the switches 11-1 and 11-2, for example, SPDT switches are used as the switches 12-1 and 12-2. Similar to the switch circuit 11, the switch circuit 12 may be integrated on one chip and realized as an IC.
- the switch 12-1 and the switch 12-2 in FIG. 6 correspond to, for example, the switches 320 and 330 in FIG. 4, respectively.
- the voltage supply lines PL0, PL1, and PL2 are provided for supplying voltage to the switch circuit 12.
- the switch circuit 12 is supplied with the power supply voltage VDD, the control signal from the control terminal CLT1, and the control signal from the control terminal CLT2 via any one of the voltage supply lines PL0, PL1, and PL2.
- the power supply voltage VDD is supplied to the switch 12-1 and the switch 12-2.
- the switch 12-1 is controlled by a control signal from the control terminal CTL1
- the switch 12-2 is controlled by a control signal from the control terminal CTL2.
- the voltage supply lines PL0 to PL4 are connected to the ground via any of the capacitors 13 to 17.
- Capacitors 13 to 17 can stabilize the voltage of voltage supply lines PL0 to PL4, for example, and can suppress noise of the power supply or noise from the switch. Therefore, the operations of the switches 11-1, 11-2, 12-1, and 12-2 are stabilized.
- the capacitors 4, 6, 8, 10, 14, 15, 16, and 17 are formed in the inner layer of the multilayer substrate 21.
- the material of the multilayer substrate 21 is not particularly limited, and examples thereof include a dielectric (insulator) such as ceramic or resin.
- a desired dielectric constant can be obtained in the multilayer substrate 21 by selecting an appropriate material.
- FIG. 7 to 22 are diagrams for explaining the wiring patterns (layouts) of the respective layers of the multilayer substrate 21.
- the multilayer substrate 21 is configured by stacking layers L1 (FIG. 7) to L16 (FIG. 22) in this order.
- the layers L1 to L16 are stacked along the thickness direction of the multilayer substrate 21.
- the wiring pattern shown in FIG. 22 shows the wiring pattern on the surface of the layer L16 opposite to the layer L15 side when stacked. That is, the layer L16 shown in FIG.
- Layer L1 (FIG. 7) includes a mounting surface on which discrete components such as a capacitor and a switch are mounted among the elements included in antenna matching apparatus 20B.
- Layer L16 (FIG. 22) includes a terminal for accessing the outside of antenna matching apparatus 20B (for example, another substrate on which multilayer substrate 21 is mounted).
- Layer L2 (FIG. 8) to layer L15 (FIG. 21) are inner layers of the multilayer substrate 21.
- a necessary wiring pattern is formed on the inner layer according to the arrangement of the discrete components mounted on the layer L1 and the arrangement of the terminals provided on the layer L16.
- a portion represented by a white circle “ ⁇ ” indicates a via hole (via).
- the via electrically connects the wiring pattern of each layer of the multilayer substrate 21.
- capacitors 1 and 13 inductors 2, 3, 5, 7, and 9 and switch circuits 11 and 12 are provided as discrete components.
- the switch circuit 11 shown in FIG. 7 includes a logic circuit section 11-3 not shown in FIG.
- the logic circuit unit 11-3 includes logic circuits for the switches 11-1 and 11-2.
- the power supply voltage VDD and control signals for controlling the switches 11-1 and 11-2 are input to the logic circuit unit 11-3.
- the switch circuit 12 includes a logic circuit unit 12-3 not shown in FIG.
- the logic circuit unit 12-3 includes a logic circuit for the switches 12-1 and 12-2.
- the power supply voltage VDD and control signals for controlling the switches 12-1 and 12-2 are input to the logic circuit unit 12-3.
- a part of voltage supply line PL0, a part of voltage supply line PL2, and a part of voltage supply line PL3 are formed as wiring patterns.
- a part of voltage supply line PL1 and a part of voltage supply line PL4 are formed as a wiring pattern.
- a part of voltage supply line PL3 is formed as a wiring pattern in layer L4.
- a part of the electrode of capacitor 4 and a ground plane (GND) are formed as a wiring pattern.
- GND ground plane
- part of the electrode of capacitor 4 part of the electrode of capacitor 6, and one electrode of capacitor 10 are formed as a wiring pattern.
- a part of the electrode of capacitor 4 and the electrode of capacitor 8 are formed as a wiring pattern.
- a part of the electrode of capacitor 4 and a part of the electrode of capacitor 6 are formed as a wiring pattern.
- a ground plane is formed as a wiring pattern in layer L9.
- the layer L9 has the ground plane, for example, isolation between the layers is ensured.
- the layer L10 may be used as a spare layer for increasing the wiring pattern.
- a ground plane is formed as a wiring pattern in layer L11.
- the layer L11 has the ground plane, for example, isolation between the layers is ensured.
- an electrode of capacitor 14 an electrode of capacitor 15, a part of voltage supply line PL1, and a part of voltage supply line PL3 are formed as a wiring pattern.
- a ground plane is formed as a wiring pattern on layer L13.
- the layer L13 has the ground plane, for example, isolation between the layers is ensured.
- an electrode of capacitor 16 an electrode of capacitor 17, a part of voltage supply line PL2, and a part of PL4 are formed as a wiring pattern.
- a ground plane is formed as a wiring pattern in layer L15.
- the layer L15 has the ground plane, for example, isolation between the layers is ensured.
- terminals T1 to T6 and T8 are provided in layer L16.
- the layer L16 is provided with various terminals for accessing the outside of the antenna matching device 20B.
- the terminal “VDD” is a terminal for supplying the power supply voltage VDD to the switches 11-1, 11-2, 12-1, and 12-2.
- Terminals “CTL1”, “CTL2”, “CTL3”, and “CTL4” are used to supply control signals for controlling the switches 12-1, 12-2, 11-1, and 11-2.
- the terminal “GND” is a terminal for supplying a reference potential (GND) to the antenna matching device 20B.
- Some capacitors included in the antenna matching device 20B have a plurality of wiring patterns that are formed on different layers of the multilayer substrate 21 and face each other.
- one electrode of the capacitor 4 is formed on the layer L5 (FIG. 11) and the layer L7 (FIG. 13), and the other electrode is formed on the layer L6 (FIG. 12) and the layer L8 (FIG. 14).
- One electrode of capacitor 6 is formed on layer L6 (FIG. 12) and layer L8 (FIG. 14), and the other electrode is included on the ground plane of layer L5 (FIG. 11) and the ground plane of layer L9 (FIG. 15).
- One electrode of the capacitor 8 is formed in the layer L7 (FIG. 13), and the other electrode is included in the electrode of the capacitor 6 in the layer L6 (FIG. 12) and the layer L8 (FIG. 14).
- Each of capacitors 14 and 15 has one electrode formed on layer L12 (FIG. 18) and the other electrode included in the ground plane of layers L11 (FIG. 17) and layer L13 (FIG. 19).
- Each of capacitors 16 and 17 has one electrode formed on layer L14 (FIG. 20) and the other electrode included on the ground plane of layers L13 (FIG. 19) and layer L15 (FIG. 21).
- one end of the switch 11-1 is disposed above the terminal T2 and connected to the terminal T2, and the other end is disposed above the terminal T3 and is connected to the terminal T3.
- One end of the switch 11-2 is arranged above the terminal T3 and connected to the terminal T3, and the other end is arranged above the terminal T8 and connected to the terminal T8.
- One end of the switch 12-1 is disposed above the terminal T4 and connected to the terminal T4, and the other end is disposed above the terminal T5 and connected to the terminal T5.
- One end of the switch 12-2 is arranged above the terminal T5 and connected to the terminal T5, and the other end is arranged above the terminal T6 and connected to the terminal T6.
- the terminals of the switches 11-1, 11-2, 12-1 and 12-2 arranged in the layer L1 are almost at the shortest distance in the multilayer substrate 21 without almost any wiring pattern. It is connected to each terminal in FIG. Thereby, for example, the parasitic inductance caused by the length of the wiring pattern is reduced.
- the antenna matching device 20B is realized using the multilayer substrate 21 with reference to FIGS. 7 to 22. However, by appropriately changing the wiring pattern of the multilayer substrate 21, the antenna matching device shown in FIG. Similarly, the antenna matching device 20A shown in FIG. 20 and FIG.
- FIG. 23 is a diagram for explaining pass characteristics (insertion loss) of the diplexer 100A shown in FIG.
- “H” indicates the pass characteristic of the route on the high band side
- “L” indicates the pass characteristic of the route on the low band side.
- “H” is a pass characteristic between the terminal T1 and the terminal T2 shown in FIG.
- “L” is a pass characteristic between the terminal T1 and the terminal T4 shown in FIG. 6 (the characteristic of the phase circuit 220A is not considered).
- the high band-side pass characteristic H shows a good pass characteristic in the high band (1500 MHz or higher) and a good attenuation characteristic in the low band (1200 MHz or lower).
- the low band side pass characteristic L shows a good pass characteristic in the low band and a good attenuation characteristic in the high band.
- FIG. 24 is a diagram for explaining the experimental results of the isolation characteristics of the configuration including the diplexer 100A, the switch circuit 11, and the switch circuit 12 shown in FIG.
- the isolation characteristics shown in FIG. 24 correspond to, for example, the insertion loss between terminals T3 and T5 (the characteristics of phase circuit 220A are not considered). At this time, the isolation characteristic is measured with the switch 11-1 and the switch 12-1 being turned on. In the example shown in FIG. 24, as shown in FIG. 7, the switch circuit 11 and the switch circuit 12 are provided separately.
- the maximum attenuation (ie, isolation) of about ⁇ 50 dB is obtained in the high band (1500 MHz or more) and the low band (1200 MHz or less). This isolation is larger than the comparative example described below. Therefore, according to the embodiment, good isolation characteristics are realized.
- FIG. 25 is a diagram for explaining an isolation characteristic as a comparative example.
- FIG. 25 shows the experimental results of the isolation characteristics when the switch circuit 11 and the switch circuit 12 shown in FIG. 6 are integrated on one chip.
- the high-band switch 12-1 and the switch 12-2 and the low band switch 11-1 and the switch 11-2 are separately provided as in the antenna matching device 20B illustrated in FIG. In addition, isolation between the high band and the low band is ensured.
- any switch included in the antenna matching device may be replaced with a variable capacitance element. That is, similarly to the switches 340 and 350 described above with reference to FIG. 4, in the configuration shown in FIGS. 1 to 5, a variable capacitance element can be arranged in place of the switches 310, 320, and 330. is there. Similarly, in the configuration shown in FIG. 6, variable capacitance elements can be arranged in place of the switches 11-1, 11-2, 12-1 and 12-2.
Abstract
Description
端子T4(第4の端子)は、位相回路220を介して、LPF120の他方端に接続される。アンテナ整合装置20が位相回路220を含まない場合、端子T4は、LPF120の他方端に直接接続される。
スイッチ330(第3のスイッチ)は、スイッチ320の他方端に接続される。すなわち、スイッチ330は、スイッチ320の他方端に接続される一方端を有する。
アンテナ整合装置20は、たとえば携帯通信端末(図1には図示しない)に用いられる。とくに、アンテナ整合装置20は、キャリア・アグリゲーションに対応した携帯通信端末に好適に用いられる。
図2は、アンテナ整合装置20の応用例を説明するための図である。アンテナ整合装置20は、携帯通信端末40の送受信回路30に接続される。具体的に、端子T1が送受信回路30に接続される。キャリア・アグリゲーション時、送受信回路30は、ローバンドの信号とハイバンドの信号を同時に処理することができる。キャリア・アグリゲーションによって、たとえば携帯通信端末40の通信速度が向上する。
図3は、アンテナ整合装置20の別の応用例を説明するための図である。なお、図3および後述の図4においては携帯通信端末の図示は省略する。
端子T3にはインダクタ440の一方端が接続される。インダクタ440の他方端は、グランドに接続される。スイッチ310がONとされると、インダクタ440は、ANT1の整合素子として機能する。スイッチ310がOFFとされると、インダクタ440は、ANT1の整合素子としては機能しない。ANT1の整合に必要でない場合には、インダクタ440を省略し、端子T3をオープンとすることも可能である。
端子T5にはインダクタ450の一方端が接続される。インダクタ450の他方端は、グランドに接続される。スイッチ320がONとされると、インダクタ450は、ANT2の整合素子として機能する。スイッチ320がOFFとされると、インダクタ450は、ANT2の整合素子としては機能しない。ANT2の整合に必要でない場合には、インダクタ450を省略し、端子T5をオープンとすることも可能である。
図4は、実施の形態に係るアンテナ整合装置の変形例を説明するための図である。図4を参照して、アンテナ整合装置20Aは、端子T7,T8と、スイッチ340,350とをさらに含む点でアンテナ整合装置20(図1など)と異なる。アンテナ整合装置20Aの他の部分の構成は、図1などに示すアンテナ整合装置20の対応する部分と同様であるので、ここでは説明を繰り返さない。
端子T7にはインダクタ470の一方端が接続される。インダクタ470の他方端は、グランドに接続される。スイッチ340がONとされると、インダクタ470は、ANT2の整合素子として機能する。スイッチ340がOFFとされると、インダクタ470は、ANT2の整合素子としては機能しない。ANT2の整合にインダクタ470が必要でない場合には、インダクタ470を省略し、端子T7をオープンとすることも可能である。
端子T8にはインダクタ480の一方端が接続される。インダクタ480の他方端は、グランドに接続される。スイッチ350がONとされると、インダクタ480はANT1の整合素子として機能する。スイッチ350がOFFとされると、インダクタ480はANT1の整合素子としては機能しない。ANT1の整合にインダクタ480が必要でない場合には、インダクタ480を省略し、端子T8をオープンとすることも可能である。
図1を参照して説明したように、アンテナ整合装置20は位相回路(位相回路210および位相回路220)を含んでもよい。
実施の形態に係るアンテナ整合装置は、たとえば基板を利用して構成される。基板は、たとえば多層基板とすることができる。実施の形態に係るアンテナ整合装置を実現する多層基板の例について、図6から図22を参照して説明する。
再び図6を参照して、アンテナ整合装置20Bでは、ハイバンドにおけるスイッチ12-1およびスイッチ12-2と、ローバンドにおけるスイッチ11-1およびスイッチ11-2との間のアイソレーションを大きくすることが好ましい。先に述べたように、各スイッチにはたとえばSPDTスイッチが用いられ、それらは1チップに集積化され得る。しかし、ハイバンドにおけるスイッチ12-1およびスイッチ12-2と、ローバンドにおけるスイッチ11-1およびスイッチ11-2とのすべてを1チップに集積化すると、両バンドの間のアイソレーションの確保が困難になる。そこで、アンテナ整合装置20Bでは、図7に示すように、ハイバンドにおけるスイッチ12-1およびスイッチ12-2を含むスイッチ回路12と、ローバンドにおけるスイッチ11-1およびスイッチ11-2を含むスイッチ回路11とを個別に設けている。この構成の効果について、次に図23~図25を参照して説明する。
Claims (11)
- 第1の端子と、
前記第1の端子に接続される一方端を有し、第1の周波数帯域の信号を通過させるためのハイパスフィルタと、
前記第1の端子に接続される一方端を有し、前記第1の周波数帯域よりも低い第2の周波数帯域の信号を通過させるためのローパスフィルタと、
前記ハイパスフィルタの他方端に接続される第2の端子と、
前記ハイパスフィルタの前記他方端に接続される一方端を有する第1のスイッチと、
前記第1のスイッチの他方端に接続される第3の端子と、
前記ローパスフィルタの他方端に接続される第4の端子と、
前記ローパスフィルタの前記他方端に接続される一方端を有する第2のスイッチと、
前記第2のスイッチの他方端に接続される第5の端子とを備える、アンテナ整合装置。 - 前記第1の端子には、前記第1の周波数帯域の信号が入力および出力されると同時に前記第2の周波数帯域の信号が入力および出力される、請求項1に記載のアンテナ整合装置。
- 前記第2のスイッチの前記他方端に接続される一方端を有する第3のスイッチと、
前記第3のスイッチの他方端に接続される第6の端子とをさらに備える、請求項1または請求項2に記載のアンテナ整合装置。 - 前記ローパスフィルタの前記他方端に接続される一方端を有する第4のスイッチと、
前記第4のスイッチの他方端に接続される第7の端子とをさらに備える、請求項3に記載のアンテナ整合装置。 - 前記ローパスフィルタの前記他方端と前記第2のスイッチの前記一方端との間に設けられる位相回路をさらに備える、請求項1~請求項4のいずれか1項に記載のアンテナ整合装置。
- 前記ローパスフィルタおよび前記ハイパスフィルタは、インダクタおよびキャパシタを含む、請求項1~請求項4のいずれか1項に記載のアンテナ整合装置。
- 前記インダクタは、基板に設けられる配線パターンを有する、請求項6に記載のアンテナ整合装置。
- 前記基板は、多層基板であり、
前記多層基板は、少なくとも1つの前記スイッチに電圧を供給するための電圧供給ラインと、前記電圧供給ラインに設けられるバイパスコンデンサとを含み、
前記バイパスコンデンサは、前記多層基板の異なる層に形成されて互いに対向する複数の配線パターンを有する、請求項7に記載のアンテナ整合装置。 - 前記位相回路は、前記第2の周波数帯域内の所定の周波数を有する信号の位相を90度回転させるように構成される、請求項5に記載のアンテナ整合装置。
- 少なくとも1つの前記位相回路は、分布定数線路を含む、請求項5に記載のアンテナ整合装置。
- 少なくとも1つの前記位相回路は、集中定数回路を含む、請求項5に記載のアンテナ整合装置。
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US20170012599A1 (en) | 2017-01-12 |
KR101866281B1 (ko) | 2018-06-11 |
US9774312B2 (en) | 2017-09-26 |
JP6350649B2 (ja) | 2018-07-04 |
JPWO2015151329A1 (ja) | 2017-04-13 |
KR20160129062A (ko) | 2016-11-08 |
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