WO2015145975A1 - 電子機器、および表示装置 - Google Patents
電子機器、および表示装置 Download PDFInfo
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- WO2015145975A1 WO2015145975A1 PCT/JP2015/000987 JP2015000987W WO2015145975A1 WO 2015145975 A1 WO2015145975 A1 WO 2015145975A1 JP 2015000987 W JP2015000987 W JP 2015000987W WO 2015145975 A1 WO2015145975 A1 WO 2015145975A1
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- ffc
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/08—Flat or ribbon cables
- H01B7/0861—Flat or ribbon cables comprising one or more screens
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Definitions
- the present disclosure relates to an electronic apparatus having a configuration in which a plurality of circuit boards are electrically connected to each other with a flexible flat cable.
- Patent Document 1 discloses a technique related to a flexible flat cable (hereinafter referred to as “FFC”).
- a differential data transmission method may be used when transmitting a signal having a large amount of information such as a video signal.
- LVDS Low Voltage Differential Signaling
- LVDS Low Voltage Differential Signaling
- the transmission rate of LVDS is several hundred Mbps per channel.
- display panels have become higher resolution.
- 4k2k panel a display panel (hereinafter referred to as “4k2k panel”) having about 4000 ⁇ 2000 pixels (pixels).
- the amount of video information increases more than before, so the amount of video signal transmission increases more than before. Therefore, in such a display device, even if LVDS is used for transmission of video signals, it is difficult to suppress an increase in the number of signals (number of channels) to be transmitted. If the number of signal lines (number of channels) included in one FFC is increased in order to cope with the increase in the number of signals, various restrictions and difficulties may occur when designing a circuit board.
- a transmission method capable of changing the signal transmission amount per channel to the gigabit rate (Gpbs) has been proposed as an alternative technique to LVDS.
- This transmission method is, for example, V-BY-One (registered trademark) HS having a maximum transmission rate of 3.75 Gbps, eDP (embedded Display Port) having a maximum transmission rate of 5.4 Gbps, or the like.
- an FFC that is impedance-matched and can maintain the quality of a transmission signal is used as a cable for transmitting a high-frequency signal based on these transmission methods between circuit boards.
- a wiring conductor through which a signal flows is covered with an insulator, and in order to prevent leakage and mixing of electromagnetic noise on one surface (shield surface) of the wiring conductor, A body, a conductor metal foil for GND, and an insulator.
- shield surface one surface (shield surface) in the FFC
- FFC signal surface one surface (shield surface) in the FFC signal surface”.
- the FFC In an electronic device having circuit boards connected to each other by the FFC, when the signal surface of the FFC is in surface contact with a member (metal material) formed of metal, capacitance generated in the contact region, wiring resistance, and the like
- the low-pass filter (LPF) may be formed with the resistance component. And this LPF may attenuate the high frequency signal which flows through FFC. This capacitance increases in proportion to the contact area between the signal surface of the FFC and the metal material, and the attenuation amount of the high-frequency signal flowing through the FFC tends to increase as the capacitance increases.
- the circuit board is generally disposed on a metal material (supporting part that supports the display unit of the liquid crystal panel) that covers the back side of the liquid crystal panel.
- the FFC is disposed so that the shield surface faces the back cover of the display device in order to prevent leakage and mixing of electromagnetic noise. Therefore, when “deflection” or the like occurs in the FFC, the signal surface of the FFC may come into surface contact with the metal material.
- an electronic device configured to transmit and receive a high-frequency signal of a gigabit rate between internal circuit boards, when surface contact occurs between the metal material and the signal surface of the FFC, the signal transmitted through the FFC is attenuated and received.
- the circuit board on the side may not receive the signal normally.
- This disclosure provides an electronic device and a display device that can reduce attenuation when high-frequency signals transmitted and received between a plurality of circuit boards are transmitted through the FFC.
- the electronic apparatus includes a first circuit board on which a first circuit is mounted, a second circuit board on which a second circuit is mounted, a support unit, and a flexible flat cable.
- the flexible flat cable is disposed on the support portion, connects the first circuit board and the second circuit board to each other, and transmits signals transmitted and received between the first circuit and the second circuit. It is configured. And a fold is provided in a flexible flat cable, and a flexible flat cable is installed so that the crease may contact a support part.
- a display device includes a display panel that displays a video and a display panel that includes a support unit that supports the display unit, a first circuit board on which a first circuit is mounted, and a second circuit.
- a second circuit board and a flexible flat cable are provided.
- the flexible flat cable is disposed on the support portion, connects the first circuit board and the second circuit board to each other, and transmits signals transmitted and received between the first circuit and the second circuit. It is configured.
- a fold is provided in a flexible flat cable, and a flexible flat cable is installed so that the crease may contact a support part.
- FIG. 1 is a rear view of the display device according to Embodiment 1.
- FIG. FIG. 2 is a schematic diagram of the flexible flat cable in the first embodiment.
- FIG. 3 is a partially enlarged view of an end cross section of the flexible flat cable in the first embodiment.
- FIG. 4A is a plan view of the end portion of the flexible flat cable according to Embodiment 1 as viewed from the signal surface side.
- 4B is a cross-sectional view showing a partially enlarged fold of the flexible flat cable according to Embodiment 1.
- FIG. 5A is a cross-sectional view taken along line AA in FIG.
- FIG. 5B is a plan view partially enlarged showing the vicinity of the flexible flat cable of the display device in the first exemplary embodiment.
- FIG. 6 is a diagram illustrating the relationship between the frequency of the signal flowing through the flexible flat cable installed in the display device according to Embodiment 1 and the amount of attenuation.
- a display device including a liquid crystal panel as a display panel is given as an example of an electronic device including an FFC.
- the present disclosure is not limited to this display device.
- the present disclosure can be applied to an electronic device in which a plurality of circuit boards are connected to each other by an FFC, and a high-frequency signal transmitted and received between the circuit boards is transmitted via the FFC.
- FIG. 1 is a rear view of display device 100 according to the first embodiment.
- FIG. 1 schematically shows a plan view of the display device 100 with the back cover removed as seen from the back side.
- the side on which the video display surface is provided (video display side) is the front side
- the side facing the video display surface (back cover side) is the back side.
- the display device 100 includes a display panel, a signal board 110, a timing controller board (hereinafter referred to as “TCon board”) 120, a power board 102, a plurality of speakers 103 that output sound, and a plurality of module units 104. And FFC200.
- the display panel includes a display unit in which a plurality of display elements for displaying an image are formed between two glass substrates, and a chassis unit 101 that supports the display unit (glass substrate).
- the chassis unit 101 is an example of a support unit.
- the glass substrate is disposed on the front side of the display device 100, and the chassis unit 101 is disposed on the back side of the display device 100. Therefore, FIG. 1 shows the chassis portion 101 of the display panel, and the display portion is not shown.
- the chassis 101 is made of a metal such as aluminum, but may be made of other materials.
- the signal board 110 is a circuit board on which a signal processing circuit (not shown) for performing signal processing on a signal (an input video signal or the like) received from an external video signal generator or a broadcasting station is output.
- the signal processing circuit is an example of a first circuit
- the signal board 110 is an example of a first circuit board.
- the TCon board 120 receives a video signal output from a signal processing circuit mounted on the signal board 110, and generates a drive circuit (not shown) that generates a signal for displaying a video based on the video signal on the display unit of the display panel. )) Is a circuit board on which is mounted.
- the drive circuit is an example of a second circuit
- the TCon board 120 is an example of a second circuit board.
- the power supply board 102 is a circuit board on which a power supply circuit (not shown) for converting an AC household power supply into a DC power supply is mounted.
- the circuit boards of the signal board 110, the TCon board 120, and the power supply board 102 are arranged on the chassis unit 101.
- each circuit board is fixed to the chassis unit 101.
- the present embodiment does not limit the arrangement position and fixing method of each circuit board.
- Each circuit board may be fixed to a member (for example, a housing) other than the support part, and may not be disposed immediately above the chassis part 101.
- the module unit 104 is, for example, a light receiving unit that receives an infrared signal from a remote controller, a Wi-Fi (registered trademark) connection unit, a Bluetooth (registered trademark) connection unit, or the like, but is not limited thereto. Absent.
- Each speaker 103 and signal board 110 and each module unit 104 and signal board 110 are electrically connected to each other by a wire harness 300.
- the FFC 200 is disposed on the chassis unit 101, connects the signal board 110 and the TCon board 120 to each other, and is configured to transmit a high-frequency signal transmitted and received between the signal processing circuit and the drive circuit.
- the signal board 110 has a terminal group 112.
- the terminal group 112 is, for example, an HDMI (registered trademark) terminal, a USB (Universal Serial Bus) terminal, a YUV terminal, a tuner, or the like, but is not limited thereto.
- the signal board 110 has an LSI (Large Scale Integrated circuit) integrated with a signal processing circuit configured to perform demodulation and noise removal processing of video signals and audio signals input from the terminal group 112. (Not shown) is mounted.
- LSI Large Scale Integrated circuit
- the signal processing circuit mounted on the signal board 110 is configured to convert an input video signal into a video signal suitable for the display unit of the display panel, and to output the converted video signal (digital video signal). .
- This signal processing circuit performs various signal processing on the input video signal based on the driving method of the display unit of the display panel, the number of pixels, and the like.
- the signal processing circuit is also configured to control the speaker 103 and each module unit 104.
- the TCon board 120 is configured to receive a digital video signal output from the signal processing circuit on the signal board 110 and convert the video signal into a signal that matches the specifications of the display unit of the display panel.
- An IC Integrated circuit, not shown
- the drive circuit mounted on the TCon substrate 120 receives the video signal output from the signal processing circuit mounted on the signal substrate 110, and displays the video based on the video signal on the display unit of the display panel.
- the video signal is in a format suitable for the display unit of the display panel, and is output at an appropriate timing.
- the drive circuit displays signals for driving the display elements (liquid crystal cells) of the display unit in order to display the video based on the video signal output from the signal processing circuit on the display unit of the display panel. Output based on
- the signal board 110 and the TCon board 120 are electrically connected to each other by two FFCs 200.
- two receptacle connectors 111 for electrically connecting the FFC 200 to a signal processing circuit on the signal board 110 are mounted.
- Two receptacle connectors 121 for electrically connecting the FFC 200 to the drive circuit on the TCon substrate 120 are also mounted on the TCon substrate 120.
- each receptacle connector is simply referred to as a “connector”.
- the connector 111 is connected to one end of the FFC 200, and the connector 121 is connected to the other end of the FFC 200.
- the signal processing circuit on the signal board 110 and the drive circuit on the TCon board 120 are electrically connected to each other.
- a high-frequency digital video signal is transmitted and received at high speed (for example, at a gigabit rate) via the FFC 200.
- the number of FFCs 200 that connect the signal board 110 and the TCon board 120 to each other is not limited to two.
- the number of FFCs 200 may be one or three or more.
- the signal board 110 has a connector 113 that electrically connects the wire harness 300 to the signal processing circuit.
- the wire harness 300 having one end connected to the connector 113 and the other end connected to the module unit 104 or the speaker 103 is connected between the signal processing circuit on the signal board 110 and the module unit 104 or the speaker 103. Transmit signals to be sent and received.
- the wire harness 300 is disposed so as to sandwich the FFC 200 with the chassis portion 101 of the display panel. Therefore, as shown in FIG. 1, the wire harness 300 intersects with the FFC 200. Since the wire harness 300 has a relatively long length and different lengths, the wire harness 300 is easily dispersed.
- the wire harnesses 300 are gathered together and fixed on the chassis portion 101 of the display panel with an adhesive tape 400 so that the wire harnesses 300 are not dispersed.
- the FFC 200 is pressed against the chassis unit 101 by the wire harness 300 fixed on the chassis unit 101 with the adhesive tape 400.
- the signal board 110 has a connector 114 for connecting the cable 350.
- the power supply board 102 has a connector 115 for connecting the cable 350. With the cable 350 having one end connected to the connector 114 and the other end connected to the connector 115, the power supply and ground potential on the signal board 110 are the power supply and ground potential of the power supply circuit on the power supply board 102, respectively. And electrically connected. As a result, a properly set voltage is supplied from the power supply circuit on the power supply board 102 to the signal processing circuit on the signal board 110.
- each circuit included in the display device 100 is substantially the same as that of a display device such as a commonly used liquid crystal television, and thus detailed description thereof is omitted.
- FIG. 2 is a schematic diagram of the FFC 200 in the first embodiment.
- FIG. 2 shows an example of the FFC 200 before being connected to the connector 111 of the signal board 110 and the connector 121 of the TCon board 120.
- FFC200 has a front surface and a back surface.
- the front surface of the FFC 200 is the shield surface 206 and the back surface is the signal surface 207.
- the FFC 200 is formed to have a certain degree of flexibility and durability that can withstand repeated bending. Therefore, FFC200 can maintain the state bent in arbitrary shapes. For example, the FFC 200 can maintain a crease provided in the FFC 200. The crease will be described later.
- FIG. 2 shows, as an example, a state in which the FFC 200 is repeatedly bent at a length of about X mm (millimeters, for example, about 50 mm). Since the FFC 200 can maintain the folded state as described above, the volume required for storage and transportation can be reduced, for example.
- FIG. 3 is a partially enlarged view of the end section of the FFC 200 in the first embodiment.
- FIG. 3 is an enlarged partial sectional view of a region indicated by a broken line in FIG.
- the FFC 200 described in this embodiment is formed by laminating a plurality of material layers and has a thickness of about 0.5 to 1 mm.
- the FFC 200 includes six layers of an insulator film 202 a, a conductor 201, an insulator film 202 b, a dielectric 203, a conductor 204, and an insulator 205 in order from the back surface (signal surface 207). Configured. Therefore, one surface of the insulator film 202a is exposed to the outside as the back surface (signal surface 207), and one surface of the insulator 205 is exposed to the outside as the front surface (shield surface 206).
- the insulator film 202a, the insulator film 202b, and the insulator 205 are formed of a material having a relatively high insulating property such as a synthetic resin.
- the conductor 201 is a signal transmission path, and is formed of a material having relatively high conductivity such as copper so that a high-frequency signal can be transmitted.
- a signal (for example, a high-frequency digital video signal) transmitted between the signal board 110 and the TCon board 120 passes through the conductor 201.
- the conductor 201 is divided into a plurality of lines, and the FFC 200 can pass a number of signals corresponding to the number of lines.
- the display device 100 in the present embodiment uses two FFCs 200 having 51 conductors and 41 conductors, but the number of conductors 201 is not limited to these numerical values.
- the other surface of the insulator coating 202a is in close contact with one surface of the conductor 201, and the other surface of the conductor 201 is in close contact with one surface of the insulator coating 202b.
- both surfaces of the conductor 201 are covered with the insulator film 202a and the insulator film 202b having relatively high insulation properties.
- the conductor 204 is formed of a material having relatively high conductivity such as copper, and is connected to a ground potential (a ground line, hereinafter also referred to as “GND”).
- the other surface of the conductor 204 is in close contact with the other surface of the insulator 205.
- each end 208 of the FFC 200 is not covered with the insulator coating 202a and the insulator 205 so that it can be electrically connected to the connectors 111 and 121, and the conductor 201, the insulator coating 202b, the dielectric 203, The region where the conductor 204 is laminated is exposed.
- One end 208 is connected to the connector 111, and the other end 208 is connected to the connector 121, whereby the conductor 201, the connector 111, and the connector 121 are electrically connected, and the conductor 204, the connector 111, and the connector are connected.
- 121 is electrically connected.
- the ground potential of the signal board 110 and the ground potential of the TCon board 120 are substantially the same, and transmission / reception of signals between the signal processing circuit on the signal board 110 and the drive circuit on the TCon board 120 is performed. It can be carried out.
- the material and thickness of the dielectric 203 and / or the conductor 204 are adjusted, and the impedance of the conductor 201 and the conductor 204 is matched to 100 ⁇ .
- the FFC 200 is not limited to the six-layer structure, and the thickness and impedance are not limited to the numerical values described above.
- the shield surface 206 and the signal surface 207 have different electromagnetic noise shielding properties (ability to prevent leakage and mixing of electromagnetic noise).
- the distance from the shield surface 206 to the conductor 201 that is a signal transmission path is larger than the distance from the signal surface 207 to the conductor 201.
- a plurality of physical layers including the conductor 204 connected to the ground potential are sandwiched between the conductor 201 and the shield surface 206, and the conductor 204 functions as a shield layer that shields electromagnetic waves.
- the FFC 200 is arranged so that the shield surface 206 is on the back side of the display device 100 and the signal surface 207 is on the chassis unit 101 side of the display panel. This is to prevent electromagnetic wave noise due to a high-frequency signal passing through the FFC 200 from leaking to the outside of the display device 100.
- FIG. 4A is a plan view of the end portion 208 of the FFC 200 according to Embodiment 1 as viewed from the signal surface 207 side.
- a part of the FFC 200 is omitted.
- the conductor 201 wired under the insulator film 202a is indicated by a broken line.
- each shape of the FFC 200 is set so that one end 208 can be connected to the connector 111 and the other end 208 can be connected to the connector 121.
- the conductor 201 is not covered with the insulator film 202a, and the conductor 204 is not covered with the insulator 205. Therefore, on the signal surface 207 side of the end 208, as shown in FIG. 4A, the conductor 201 and the insulator coating 202b are alternately exposed.
- the insulating film 202b is exposed in a region where the conductor 201 is not provided.
- the FFC 200 shown in this embodiment is provided with a plurality of folds 210.
- Each fold 210 is formed such that the shield surface 206 side is a valley fold and the signal surface 207 side is a mountain fold. Therefore, in the FFC 200 installed in the display device 100, an area in which the crease 210 and the crease 210 protrude in an arch shape on the shield surface 206 side (the back cover side of the display device 100) is generated.
- nine folds 210 are provided in the FFC 200 at intervals (indicated by “Wa” in FIG. 4A) set to about 50 to 70 mm.
- FIG. 4B is a cross-sectional view showing a partially enlarged fold line 210 of the FFC 200 in the first embodiment. 4B shows the chassis portion 101 of the display panel, and the display portion is omitted.
- the fold line 210 is provided with a fold set to a width of about 5 to 40 mm (indicated by “Wd” in FIG. 4B).
- the FFC 200 is installed in the display device 100 so that the folded portion of the fold line 210 (the region of the signal surface 207 folded in a mountain) is in contact with the chassis portion 101 of the display panel.
- the number of folds 210 provided in the above-described FFC 200, the interval between the folds 210, and the width of the folds are merely examples, and are not limited to the above-described numerical values.
- the number of folds 210 provided in the FFC 200, the interval between the folds 210, the width of the folds, and the like depend on the specifications and size of the electronic device (or display device) using the FFC 200 and the material and size of the FFC 200. It is desirable to set appropriately.
- the area where the signal surface 207 of the FFC 200 is in contact with the chassis portion 101 of the display panel made of metal is desirably as small as possible. Therefore, it is preferable that the number of creases 210 provided in the FFC 200 is smaller, and it is preferable that the folding width is narrower.
- FIG. 5A is a cross-sectional view taken along line AA in FIG.
- FIG. 5B is a plan view partially enlarged showing the vicinity of FFC 200 of display device 100 in the first exemplary embodiment.
- 5A and 5B show a state in which the FFC 200 is connected to the signal board 110 and the TCon board 120 using a cross-sectional view and a plan view.
- FIG. 5A shows the chassis portion 101 of the display panel, and the display portion is omitted.
- the separation distance between the signal board 110 and the TCon board 120 is “Wb”.
- the FFC 200 that electrically connects the signal board 110 and the TCon board 120 is disposed on the chassis portion 101 of the display panel.
- the length of the FFC 200 is set to be longer than the separation distance Wb between the signal board 110 and the TCon board 120. Therefore, stress toward the center direction from both ends 208 is applied to the FFC 200 in which each end 208 is connected to the signal board 110 and the TCon board 120 due to the elastic force of the FFC 200. This stress acts as a force for pressing each fold 210 of the FFC 200 against the chassis portion 101 of the display panel.
- each fold 210 of the FFC 200 is pressed against the chassis 101 of the display panel.
- the FFC 200 comes into contact with the chassis portion 101 of the display panel at the interval Wc in which the folds 210 are folded back shorter than the interval Wa between the folds 210.
- the FFC 200 is installed such that the interval Wc between the fold of the fold 210 and the contact portion between the chassis 101 is shorter than the interval Wa between the adjacent folds 210.
- the FFC that electrically connects the signal board 110 and the TCon board 120 is set to a length substantially equal to the separation distance Wb between the connector 111 and the connector 121 without providing the fold 210.
- This configuration is ideal because the FFC is less likely to contact the chassis portion 101 of the display panel.
- the length of the FFC varies, and the FFC having a shorter length than the separation distance Wb between the connector 111 and the connector 121 may be manufactured.
- Such an FFC cannot be used for the display device 100.
- the FFC that is simply increased in length and not provided with the fold line 210 causes “bending” when the signal board 110 and the TCon board 120 are electrically connected, and the FFC and the chassis portion 101 of the display panel Unexpected surface contact may occur.
- the FFC 200 is set to a size longer than the separation distance Wb and the fold line 210 is provided. Thereby, the problem that the short FFC which cannot connect a connector electrically by the variation at the time of manufacture is manufactured can be prevented. Furthermore, when the signal board 110 and the TCon board 120 are electrically connected by the FFC 200, the FFC 200 can cause the FFC 200 to generate a force for pressing the folds 210 against the chassis portion 101 of the display panel due to the elastic force of the FFC 200. .
- the FFC 200 is formed with an arch-shaped region on the back side starting from the crease 210 between the crease 210 and the crease 210, and the fold of the crease 210 is pressed against the chassis portion 101 of the display panel. Therefore, in the display device 100, the fold 210 is supported, and the FFC 200 is maintained in a stable state on the chassis 101 of the display panel.
- the wire harness 300 is further disposed at the position of the fold 210 of the FFC 200, and the fold 210 is sandwiched between the chassis 101 of the display panel and the wire harness 300.
- the force which presses the fold 210 to the chassis part 101 of the display panel is applied to the FFC 200 by the wire harness 300, and the fold 210 of the FFC 200 is prevented from being lifted from the chassis part 101. Therefore, the FFC 200 can be maintained on the chassis portion 101 in a more stable state.
- FIG. 6 is a diagram showing the relationship between the frequency of the signal flowing through the FFC 200 installed in the display device 100 according to Embodiment 1 and the attenuation.
- the horizontal axis indicates the signal frequency (GHz).
- the vertical axis indicates the signal attenuation (dB), and the lower the value (the greater the negative value), the greater the attenuation.
- the graph shown in FIG. 6 shows that the signal board 110 and the TCon board 120 are electrically connected by the FFC 200 having a length of about 400 mm, and the amplitude of the input signal and the output signal is changed while changing the frequency of the signal transmitted through the FFC 200. It summarizes the results of experiments to measure the ratio.
- FIG. 6 shows graphs Q, R1, and R2 for comparison with the graph P that shows the experimental results based on the configuration shown in the present embodiment.
- the graph P is provided with five folds 210 in the FFC 200 at intervals of about 50 mm, the folding width Wd of each fold 210 is set to several mm (about 5 mm), and the five folds 210 are the same as described above. It is a graph which shows the relationship between the frequency of the signal which flows through FFC200, and the amount of attenuation when it is made to contact with chassis part 101 of a display panel by composition.
- the fold 210 is not provided in the FFC 200, the “deflection” is generated in the FFC 200, and a continuous area of about 200 mm in the FFC 200 is brought into surface contact with the chassis portion 101 of the display panel by using the elastic force of the FFC 200.
- the graph R2 is a graph showing the relationship between the frequency of the signal flowing through the FFC 200 and the amount of attenuation when the FFC 200 is not provided with the fold 210 and is fixed to the chassis portion 101 of the display panel with an adhesive tape having a length of 200 mm. .
- a reference line indicating a lower limit of the attenuation that does not substantially affect the image displayed on the display unit of the display device 100 is indicated by a broken line. Therefore, from the graph shown in FIG. 6, when the amount of attenuation is larger than this reference line (there is a graph below the reference line), there is a possibility of some influence on the video displayed on the display unit. When the attenuation is smaller than the reference line (the graph is above the reference line), it can be seen that the image displayed on the display unit is not substantially affected.
- each of the graph R1 and the graph R2 has a region where the attenuation amount exceeds the reference line (region below the reference line).
- the difference between the experimental results shown by the graph Q and the experimental results shown by the graphs R1 and R2 is that the FFC 200 and the chassis portion 101 of the display panel are in discrete contact (graph Q) or are in continuous contact. (Graphs R1 and R2).
- graph Q discrete contact
- Graphs R1 and R2 the total sum of the lengths of the FFCs 200 that are in contact with the chassis unit 101 is 200 mm, which are equal to each other.
- the attenuation of the signal is larger when the FFC 200 and the chassis 101 are in continuous contact, and the signal is more discrete when they are in contact with each other. It can be seen that the amount of attenuation becomes smaller.
- the graph P will be described. As shown in FIG. 6, when the graph P and the graph Q are compared, the graph Q has a slightly larger attenuation than the graph P.
- the difference between the experimental result indicated by the graph P and the experimental result indicated by the graph Q is caused by a difference in contact area between the FFC 200 and the chassis portion 101 of the display panel.
- the width of the fold provided in the crease 210 is several mm (about 5 mm).
- the width of the fold provided in the fold line 210 is about 40 mm. Comparison between the graph P and the graph Q shows that the smaller the contact area between the FFC 200 and the chassis portion 101, the smaller the attenuation.
- both the experiment of the graph P and the experiment of the graph Q display video.
- the folding width provided in the crease 210 is allowed up to about 40 mm (does not substantially affect the display image).
- the fold 210 is provided in the FFC 200 that electrically connects the signal board 110 and the TCon board 120, and the folds provided in the fold 210 are dispersed in the chassis portion 101 of the display panel.
- FFC200 is installed in the display apparatus 100 so that it may touch.
- the contact area between the FFC 200 and the chassis 101 is made discrete and the contact area is relatively reduced.
- the width of the fold provided in the crease 210 is desirably as narrow as possible as described above, but cannot be physically set to “0”.
- the lower limit of the folding width provided in the fold line 210 is determined based on the physical properties of the material forming the FFC 200. For these reasons, the width of the fold provided in the fold 210 is about 5 to 40 mm here, but this embodiment does not limit the width of the fold provided in the fold 210 to this value.
- the electronic device includes a first circuit board on which a first circuit is mounted, a second circuit board on which a second circuit is mounted, a support portion, and a flexible portion.
- a flat cable is disposed on the support portion, connects the first circuit board and the second circuit board to each other, and transmits signals transmitted and received between the first circuit and the second circuit. It is configured.
- a fold is provided in a flexible flat cable, and a flexible flat cable is installed so that the crease may contact a support part.
- the flexible flat cable may be installed such that a region protruding in an arch shape is generated starting from a fold that contacts the support portion.
- the flexible flat cable may have a plurality of folds, and may be installed such that the interval between the contact portions between the folds and the support portion is shorter than the interval between adjacent folds.
- the flexible flat cable may include a shield surface and a signal surface, and the fold may be formed so that the shield surface is a valley fold and the signal surface is a mountain fold.
- the display device includes a display panel that displays a video and a support panel that supports the display unit, a first circuit board on which a first circuit is mounted, a second circuit board, and a second circuit board.
- the flexible flat cable is disposed on the support portion, connects the first circuit board and the second circuit board to each other, and transmits signals transmitted and received between the first circuit and the second circuit. It is configured.
- a fold is provided in a flexible flat cable, and a flexible flat cable is installed so that the crease may contact a support part.
- the display device 100 is an example of the above-described electronic device or display device
- the chassis portion 101 is an example of the above-described support portion
- the signal processing circuit is an example of the above-described first circuit.
- the drive circuit is an example of the above-described second circuit
- the signal board 110 is an example of the above-described first circuit board
- the TCon board 120 is an example of the above-described second circuit board
- the FFC 200 is It is an example of the above-described flexible flat cable
- the fold 210 is an example of the above-mentioned fold
- the interval Wc is an example of the above-mentioned “interval between the contact portions between the fold and the support portion”
- the interval Wa is the above-mentioned “
- the shield surface 206 is an example of the shield surface described above
- the signal surface 207 is an example of the signal surface described above.
- the FFC is supported by a resin clamper or the like in order to prevent surface contact between the support portion formed of a metal material and FFC.
- a measure is taken to provide a gap between the support portion and the FFC by sandwiching an insulating member such as a sponge between the support portion and the FFC.
- measures may be taken such as using a double-sided shield type FFC provided with a shield layer for shielding electromagnetic wave noise on both sides, a thin coaxial cable, or the like so that the signal is not attenuated even when in surface contact.
- a countermeasure is not desirable because the number of parts used in an electronic device increases or parts become expensive.
- the fold line 210 provided in the FFC 200 is in contact with the chassis unit 101 to support the FFC 200, so that the configuration of the related art as described above can be used.
- the FFC 200 can be maintained on the chassis unit 101 in a stable state while preventing surface contact between the FFC 200 and the chassis unit 101.
- the contact area between the FFC 200 and the chassis unit 101 is discrete and the contact area is relatively small, the FFC 200 transmits the high-frequency signal even if the signal transmitted and received between the circuit boards is a high frequency (several GHz). Attenuation amount can be reduced.
- an FFC is transmitted even in an electronic device configured to transmit and receive high-frequency signals between circuit boards, such as a liquid crystal television having a large-screen 4k2k panel, and which has a relatively large separation distance between circuit boards.
- the attenuation amount of the high frequency signal can be reduced. Therefore, transmission / reception of high-frequency signals between circuit boards can be performed stably via the FFC without using the configuration of the prior art as described above.
- the first embodiment has been described as an example of the technique disclosed in the present application.
- the technology in the present disclosure is not limited to this, and can also be applied to embodiments in which changes, replacements, additions, omissions, and the like are performed.
- the display device 100 has been described as an example of an electronic device.
- the electronic device is not limited to the display device 100.
- the electronic device may be configured such that a plurality of circuit boards are connected to each other by FFC, and signals are transmitted and received between the circuit boards via FFC.
- electronic devices include display devices including panels other than liquid crystals (for example, EL (Electro Luminescence) panels, etc.), video signal recording devices such as video cameras, portable terminal devices, measuring devices, manufacturing devices, personal computers. Or a server computer.
- the chassis unit 101 has been described as an example of the support unit.
- the support unit is not limited to the chassis unit 101. If the electronic device has a plate-like object (a metal plate or the like) formed of a metal material as a support portion, it is possible to obtain the same effect as the effect described in this embodiment.
- the signal transmitted through the FFC may not be a high frequency signal in the GHz band.
- the signal transmitted through the FFC may be a MHz band signal or a kHz band signal.
- the first circuit may be a circuit other than the signal processing circuit
- the second circuit may be a circuit other than the drive circuit
- the numerical values such as the number of folds 210 provided in the FFC 200 shown in the embodiment, the interval between the folds 210, and the width of the fold are merely examples, and are not limited to the numerical values described above.
- the number of folds provided in the FFC, the interval between the folds, the width of the folds, etc. are appropriately determined according to the specifications and size of the electronic device (or display device) using the FFC, and the material and size of the FFC. It is desirable to set.
- the present disclosure is applicable to electronic devices that transmit high-frequency signals transmitted and received between circuit boards through FFC.
- the present disclosure can be applied to display devices such as television receivers and monitor devices, video signal recording devices such as video cameras, portable terminal devices, measuring devices, manufacturing devices, personal computers and server computers, etc. It is.
Abstract
Description
以下、図1~図6を用いて、実施の形態1を説明する。なお、本実施の形態では、FFCを備えた電子機器の一例として、液晶パネルを表示パネルとして備える表示装置を挙げているが、本開示は何らこの表示装置に限定されるものではない。本開示は、複数の回路基板をFFCで互いに接続し、回路基板間で送受信する高周波信号をFFCを介して伝送する電子機器に適用可能である。
図1は、実施の形態1における表示装置100の背面図である。図1には、バックカバーを外した表示装置100を背面側から見た平面図を概略的に示している。なお、本実施の形態では、表示装置100において、映像の表示面が設けられた側(映像表示側)を正面とし、映像の表示面に対向する側(バックカバー側)を背面とする。
以上のように構成された表示装置100において、FFC200を伝送する信号の周波数と減衰量との関係を説明する。
以上のように、本実施の形態において、電子機器は、第1の回路が搭載された第1の回路基板と、第2の回路が搭載された第2の回路基板と、支持部と、フレキシブルフラットケーブルと、を備える。フレキシブルフラットケーブルは、支持部上に配置され、第1の回路基板と第2の回路基板とを互いに接続し、第1の回路と第2の回路との間で送受信される信号を伝送するように構成されている。そして、フレキシブルフラットケーブルに折り目を設け、その折り目が支持部に接触するようにフレキシブルフラットケーブルは設置される。
以上のように、本出願において開示する技術の例示として、実施の形態1を説明した。しかしながら、本開示における技術は、これに限定されず、変更、置き換え、付加、省略等を行った実施の形態にも適用できる。また、上記実施の形態1で説明した各構成要素を組み合わせて、新たな実施の形態とすることも可能である。
101 シャーシ部
102 電源基板
103 スピーカー
104 モジュール部
110 信号基板
111,121 コネクタ(レセプタクルコネクタ)
112 端子群
113,114,115 コネクタ
120 TCon基板(タイミングコントローラ基板)
200 FFC
201 導体
202a,202b 絶縁体皮膜
203 誘電体
204 導体
205 絶縁体
206 シールド面
207 信号面
208 端部
210 折り目
300 ワイヤーハーネス
350 ケーブル
400 接着テープ
Claims (5)
- 第1の回路が搭載された第1の回路基板と、
第2の回路が搭載された第2の回路基板と、
支持部と、
前記支持部上に配置され、前記第1の回路基板と前記第2の回路基板とを互いに接続し、前記第1の回路と前記第2の回路との間で送受信される信号を伝送するように構成されたフレキシブルフラットケーブルと、を備え、
前記フレキシブルフラットケーブルに折り目を設け、前記折り目が前記支持部に接触するように前記フレキシブルフラットケーブルが設置された、
電子機器。 - 前記フレキシブルフラットケーブルは、前記支持部と接触する前記折り目を起点としてアーチ状に突出した領域が生じるように設置された、
請求項1に記載の電子機器。 - 前記フレキシブルフラットケーブルは、複数の前記折り目を有し、前記折り目と前記支持部との接触部間の間隔が、隣り合う前記折り目間の間隔よりも短くなるように設置された、
請求項1に記載の電子機器。 - 前記フレキシブルフラットケーブルは、シールド面と信号面とを備え、前記シールド面が谷折りとなり前記信号面が山折りとなるように前記折り目が形成され、前記信号面の前記山折りされた領域が前記支持部に接触するように設置された、
請求項1に記載の電子機器。 - 映像を表示する表示部および前記表示部を支える支持部を有する表示パネルと、
第1の回路が搭載された第1の回路基板と、
第2の回路が搭載された第2の回路基板と、
前記支持部上に配置され、前記第1の回路基板と前記第2の回路基板とを互いに接続し、前記第1の回路と前記第2の回路との間で送受信される信号を伝送するように構成されたフレキシブルフラットケーブルと、を備え、
前記フレキシブルフラットケーブルに折り目を設け、前記折り目が前記支持部に接触するように前記フレキシブルフラットケーブルが設置された、
表示装置。
Priority Applications (4)
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EP15768610.6A EP3125656B1 (en) | 2014-03-26 | 2015-02-26 | Electronic device and display unit |
CN201580004044.4A CN105900537B (zh) | 2014-03-26 | 2015-02-26 | 电子设备以及显示装置 |
JP2016509946A JP6442713B2 (ja) | 2014-03-26 | 2015-02-26 | 電子機器、および表示装置 |
US15/110,734 US10455700B2 (en) | 2014-03-26 | 2015-02-26 | Electronic device and display unit |
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JP2014-063499 | 2014-03-26 | ||
JP2014063499 | 2014-03-26 |
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US (1) | US10455700B2 (ja) |
EP (1) | EP3125656B1 (ja) |
JP (1) | JP6442713B2 (ja) |
CN (1) | CN105900537B (ja) |
WO (1) | WO2015145975A1 (ja) |
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Also Published As
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JPWO2015145975A1 (ja) | 2017-04-13 |
EP3125656A4 (en) | 2017-03-29 |
JP6442713B2 (ja) | 2018-12-26 |
US20160338197A1 (en) | 2016-11-17 |
US10455700B2 (en) | 2019-10-22 |
EP3125656A1 (en) | 2017-02-01 |
CN105900537B (zh) | 2018-11-13 |
CN105900537A (zh) | 2016-08-24 |
EP3125656B1 (en) | 2020-02-19 |
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