WO2015145848A1 - 導電配線の製造方法および導電配線 - Google Patents
導電配線の製造方法および導電配線 Download PDFInfo
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- WO2015145848A1 WO2015145848A1 PCT/JP2014/078381 JP2014078381W WO2015145848A1 WO 2015145848 A1 WO2015145848 A1 WO 2015145848A1 JP 2014078381 W JP2014078381 W JP 2014078381W WO 2015145848 A1 WO2015145848 A1 WO 2015145848A1
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- conductive
- insulating substrate
- conductive wiring
- conductive powder
- manufacturing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0522—Using an adhesive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
Definitions
- the present invention relates to a conductive wiring manufacturing method and a conductive wiring, and more particularly to a conductive wiring manufacturing method and a conductive wiring formed of conductive powder.
- a photolithography method in which a copper foil formed on an insulating substrate is etched and then sintered, or after a conductive paste is screen printed on an insulating substrate
- a printing method that sinters after ink jet printing.
- a metal material having a particle size on the order of microns for the purpose of solving both the problem that the number of steps in the photolithography method is large and the problem that the metal particles used in the conductive paste are easily oxidized in the printing method.
- a circuit board manufacturing method using a conductive paste containing metal microparticles and metal nanoparticles having a particle size of nanometer order is disclosed (for example, see Patent Document 1).
- a conductive paste containing metal micron particles and metal nanoparticles is supplied to an insulating substrate by screen printing, and fired in a low oxygen atmosphere to sinter the metal nanoparticles. It is something to be made. For this reason, there has been a problem that it is difficult to select a conductive paste that satisfies both securing fluidity suitable for screen printing and suppressing increase in electrical resistance. That is, the material and particle size of metal micron particles, the material and particle size of metal nanoparticles, the type of solvent, and the amount of each (the proportion of each in the conductive paste) are the characteristics of the conductive wiring formed on the insulating substrate. It took a lot of tests and a long time to set according to the conditions.
- the present invention solves the above-described problem, and a method of manufacturing a conductive wiring capable of easily forming a conductive wiring having desired characteristics on an insulating substrate without supplying the conductive paste to the insulating substrate by screen printing. And providing a conductive wiring formed by the method of manufacturing the conductive wiring.
- a method for producing a conductive wiring according to the present invention includes a step of printing ink so as to form a predetermined pattern on an insulating substrate, and a conductive powder on the ink before the printed ink is dried. , A step of pressing the conductive powder placed on the insulating substrate and compressing the conductive powder, and a step of heating and sintering the compressed conductive powder. (2) Moreover, the said heating is performed by irradiating an ultraviolet-ray or a laser beam toward the said compressed electroconductive powder. (3) The conductive powder is a fine particle of 1 to 50 microns. (4) The insulating substrate is white or transparent, and the laser beam is a YAG laser beam. (5) Furthermore, the conductive wiring according to the present invention is formed by the method for manufacturing a conductive wiring according to any one of (1) to (4).
- the material of the conductive powder is not limited and is copper, copper alloy, silver, silver alloy, or the like.
- the conductive powder is a fine particle of 1 to 50 microns ( ⁇ m)
- sintering is promoted, the density of the conductive wiring can be further increased, and the conductivity can be further improved.
- the insulating substrate is white or transparent and YAG laser light having a property of passing through the white or transparent base material is irradiated to the white or transparent insulating substrate, heat generation of the insulating substrate can be suppressed. it can.
- the conductive wiring according to the present invention is formed by the method for manufacturing a conductive wiring having the effect described in any one of (i) to (iv), the conductive wiring has a good conductivity, Inexpensive.
- Sectional drawing of the side view which shows typically the process of pressing and compressing the electroconductive powder in the manufacturing method of the electrically conductive wiring which concerns on Embodiment 1 of this invention against an insulated substrate.
- Sectional drawing of the side view which shows typically the process of heating and sintering the compressed conductive powder 3 in the manufacturing method of the electrically conductive wiring which concerns on Embodiment 1 of this invention.
- Sectional drawing of the side view which shows typically the electrically conductive wiring which concerns on Embodiment 2 of this invention.
- FIG. 1 and 2 illustrate a method for manufacturing a conductive wiring according to Embodiment 1 of the present invention and a conductive wiring manufactured by the method for manufacturing the conductive wiring.
- FIG. 1 is a flowchart
- FIG. FIG. 2E is a side sectional view schematically showing each step. 2A to 2E schematically show partly exaggerated, and the present invention is not limited to the illustrated form (size and quantity).
- the conductive wiring manufacturing method includes a step (S1, FIG. 2B in FIG. 1) of printing ink 2 so as to form a predetermined pattern on the insulating substrate 1 (FIG. 2A), and printing.
- the step of placing (spreading) the conductive powder 3 on the ink 2 (having a predetermined pattern) (S2 in FIG. 1, FIG. 2C) and the placed conductive
- S3 in FIG. 1, FIG. 2D the compressive powder 3 against the insulating substrate 1 and compressing it
- S4 in FIG. 1, FIG. 2E The conductive wiring 20 is manufactured through such a series of steps (S1 to S4).
- the compressing step (S3) and the heating and sintering step (S4) are not limited to those performed continuously, and may be performed simultaneously.
- the conductive powder 3 is, for example, fine particles of copper or a copper alloy, and has an average particle diameter of 1 to 200 microns, for example.
- the present invention limits the range of the average particle diameter of the conductive powder 3. It is not limited. However, if the conductive powder 3 is made into a fine particle having an average particle diameter in the range of 1 to 50 microns, sintering is promoted, the density of the conductive wiring 20 can be further increased, and the conductivity can be further improved. it can.
- the conductive powder 3 Since the conductive powder 3 is sprayed on the insulating substrate 1 before the printed ink 2 dries, the conductive powder 3 adheres to the ink 2 (shown by a single oblique line) before drying, and the ink 2
- the conductive powder 3 adhering to has a predetermined pattern.
- the heating is performed by irradiating the compressed conductive powder 3 with a laser beam (for example, YAG laser beam) 30.
- the conductive powder 3 adhered to the ink 2 is compressed before the laser light irradiation (the ink 2 and the conductive powder 3 are collectively indicated by a double oblique line), the interval between the conductive powders 3 (accurately) The size of the pores (pores) is reduced and the density is increased, whereby the sintering is promoted and the heating operation can be performed more quickly at a lower temperature (sintered conductive powder 4). Filled in) The heating may be performed by irradiating with ultraviolet rays (cannon light) instead of the laser light 30.
- ultraviolet rays cannon light
- the method for producing a conductive wiring of the present invention does not supply the conductive paste to the insulating substrate 1 by screen printing or the like, so that the ink 2 suitable for printing a predetermined pattern can be easily selected. Since the conductive powder 3 can be easily selected according to the characteristics of the conductive wiring, the printing accuracy can be increased, the density of the sintered conductive powder 4 can be increased, and the conductivity can be improved. Further, there is no need to select a conductive paste satisfying both screen printing properties and electrical conductivity as in the prior art, and the work is quickened.
- the conductive powder 3 is made into a fine particle of 1 to 50 microns, sintering is promoted by irradiation with ultraviolet rays or laser light, so that a highly conductive conductive wiring (sintered conductive powder 4) can be made inexpensively. Can be manufactured.
- the insulating substrate 1 is made white or transparent and YAG laser light is irradiated as laser light, the YAG laser light has a property of passing through the white or transparent base material, so that heat generation of the insulating substrate 1 is suppressed. be able to. Therefore, it is not necessary to limit the insulating substrate 1 to a heat-resistant material such as a ceramic plate. Therefore, the choice of the insulating substrate is expanded, and the conductive wiring 20 (Embodiment 2) is used by using an inexpensive insulating substrate. Can be manufactured inexpensively.
- the granular conductive powder 3 adheres on the part with double diagonal lines (ink 2 and conductive powder 3), and the thicknesses thereof are substantially the same.
- the present invention is not limited to this, and any thickness may be used, and the conductive powder 3 deposited on the portion with double diagonal lines is further limited. is not. Furthermore, there may be no conductive powder 3 attached on the part with double diagonal lines, and only the part with double diagonal lines may be provided.
- FIG. 3 is a side sectional view showing the conductive wiring according to the second embodiment of the present invention. 2 that are the same as those in FIG.
- the conductive wiring 20 has a predetermined pattern drawn by the conductive powder 4 sintered on the insulating substrate 1.
- the insulating substrate 1 is not limited to a flat surface and may be a curved surface.
- the pattern drawn by the conductive powder 3 is not limited, and the material (component) of the conductive powder 3 is not limited.
- a conductive wiring having a desired pattern can be manufactured easily and inexpensively, it can be widely used as a method for manufacturing a conductive wiring on an insulating substrate having various shapes.
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Abstract
Description
そして、フォトリソグラフィ工法では工程数が多いという問題、また、印刷工法では導電ペーストに用いられている金属粒子が表面酸化し易いという問題を共に解消する目的で、ミクロンオーダの粒径を持つ金属材料である金属ミクロン粒子とナノメータオーダの粒径を持つ金属材料である金属ナノ粒子とが含まれた導電ペーストを使用する回路基板の製造方法が開示されている(例えば、特許文献1参照)。
(2)また、前記加熱は、前記圧縮された導電性粉末に向けて、紫外線またはレーザ光を照射して行う。
(3)また、前記導電性粉末は、1~50ミクロンの細粒である。
(4)また、前記絶縁基板は白色または透明で、前記レーザ光はYAGレーザ光である。
(5)さらに、本発明に係る導電配線は、前記(1)~(4)の何れかに記載の導電配線の製造方法によって形成されている。
(ii)また、紫外線またはレーザ光の照射によって焼結されるから、導電配線を安価に製造することができる。なお、導電性粉末の材質は限定するものではなく、銅や銅合金、あるいは銀や銀合金等である。
(iii)また、導電性粉末は1~50ミクロン(μm)の細粒であるから、焼結が促進され、導電配線の密度をさらに高めることができ、導電性をさらに良くすることができる。
(iv)また、絶縁基板を白色または透明にして、白色または透明の基材を通過する性質を有するYAGレーザ光を、白色または透明の絶縁基板に照射するから、絶縁基板の発熱を抑えることができる。したがって、絶縁基板を、耐熱性を有する材料、例えばセラミック板等に限定する必要がなくなるため、絶縁基板の選択肢が拡がり、安価な絶縁基板を用いることによって、導電配線を安価に製造することができる。
(v)また、本発明に係る導電配線は、前記(i)~(iv)の何れかに記載の効果を有する導電配線の製造方法によって形成されているから、良好な導電率を有し、安価である。
図1および図2は本発明の実施の形態1に係る導電配線の製造方法と、かかる導電配線の製造方法によって製造された導電配線とを説明するものであって、図1はフローチャート、図2A~図2Eは各工程を模式的に示す側面視の断面図である。なお、図2A~図2Eは、模式的に一部を誇張して示すものであって、本発明は、図示された形態(大きさや数量)に限定するものではない。
なお、本発明は、圧縮する工程(S3)と加熱して焼結させる工程(S4)とは、連続して行うものに限定するものではなく、同時に行ってもよい。
そして、印刷されたインキ2が乾燥する前に、絶縁基板1に導電性粉末3を散布するから、導電性粉末3は乾燥する前のインキ2(単斜線にて示す)に付着し、インキ2に付着した導電性粉末3は所定のパターンを描くことになる。
また、前記加熱は、圧縮された導電性粉末3に向けてレーザ光(例えば、YAGレーザ光)30を照射して行う。
なお、レーザ光照射の前に、インキ2に付着した導電性粉末3は圧縮される(インキ2および導電性粉末3をまとめて複斜線にて示す)から、導電性粉末3同士の間隔(正確には、空孔(ポアー)の大きさ)が小さくなって密度が上がることによって、焼結が促進され、より低温でより迅速に加熱作業を実施することができる(焼結した導電性粉末4を塗りつぶして示す)。なお、加熱は、レーザ光30に代えて、紫外線(キャノン光)を照射してもよい。
また、導電性粉末3は、1~50ミクロンの細粒にすると、紫外線またはレーザ光の照射によって焼結が促進されるから、高い導電性の導電配線(焼結した導電粉末4)を安価に製造することができる。
なお、図2の(d)において、複斜線を付した部分(インキ2および導電性粉末3)の上に、粒状の導電性粉末3が付着し、それぞれの厚さが略同じになっているが、本発明はこれに限定されるものではなく、それぞれの厚さは何れを厚くてもよく、また、複斜線を付した部分の上に付着した導電性粉末3は一層に限定されるものではない。さらに、複斜線を付した部分の上に付着した導電性粉末3がなく、複斜線を付した部分のみであってもよい。
図3は本発明の実施の形態2に係る導電配線を示す側面視の断面図である。なお、図2と同じ部分には同じ符号を付し、一部の説明を省略する。
図3において、導電配線20は、絶縁基板1上に焼結した導電性粉末4によって描かれた所定のパターンを呈している。このとき、導電配線20は、導電配線の製造方法によって形成されたものであるから、良好な導電率を有し、安価である。
なお、絶縁基板1は平面に限定されるものではなく、曲面であってもよい。また、導電性粉末3によって描かれたパターンは限定されるものではなく、導電性粉末3の材質(成分)も限定するものではない。
2 インキ
3 導電性粉末
4 焼結した導電性粉末
20 導電配線
30 レーザ光
Claims (5)
- 絶縁基板に所定のパターンになるようにインキを印刷する工程と、
前記印刷されたインキが乾燥する前に、前記インキの上に導電性粉末を載置する工程と、
前記載置された導電性粉末を前記絶縁基板に押し付けて圧縮する工程と、
前記圧縮された導電性粉末を加熱して焼結させる工程と、
を有することを特徴とする導電配線の製造方法。 - 前記加熱は、前記圧縮された導電性粉末に向けて、紫外線またはレーザ光を照射して行うことを特徴とする請求項1記載の導電配線の製造方法。
- 前記導電性粉末は、1~50ミクロンの細粒であることを特徴とする請求項2記載の導電配線の製造方法。
- 前記絶縁基板は白色または透明で、前記レーザ光はYAGレーザ光であることを特徴とする請求項2または3記載の導電配線の製造方法。
- 請求項1~4の何れか一項に記載の導電配線の製造方法によって形成されたことを特徴とする導電配線。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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EP14887505.7A EP2991463B1 (en) | 2014-03-28 | 2014-10-24 | Method for manufacturing conductive line and conductive line |
KR1020157032601A KR20150143742A (ko) | 2014-03-28 | 2014-10-24 | 도전 배선의 제조 방법 및 도전 배선 |
US14/897,862 US9585251B2 (en) | 2014-03-28 | 2014-10-24 | Method of manufacturing conductive wiring and conductive wiring |
CN201480033522.XA CN105393650B (zh) | 2014-03-28 | 2014-10-24 | 导电布线的制造方法以及导电布线 |
Applications Claiming Priority (6)
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JP2014068487 | 2014-03-28 | ||
JP2014-068487 | 2014-03-28 | ||
JP2014-159602 | 2014-08-05 | ||
JP2014159588A JP2015195329A (ja) | 2014-03-28 | 2014-08-05 | 導電配線の製造方法および導電配線 |
JP2014159602A JP2016039171A (ja) | 2014-08-05 | 2014-08-05 | 導電配線の製造方法および導電配線 |
JP2014-159588 | 2014-08-05 |
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WO2015145848A1 true WO2015145848A1 (ja) | 2015-10-01 |
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PCT/JP2014/078381 WO2015145848A1 (ja) | 2014-03-28 | 2014-10-24 | 導電配線の製造方法および導電配線 |
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US (1) | US9585251B2 (ja) |
EP (1) | EP2991463B1 (ja) |
KR (1) | KR20150143742A (ja) |
CN (1) | CN105393650B (ja) |
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JPH11307910A (ja) * | 1998-04-21 | 1999-11-05 | Mitsumura Printing Co Ltd | 導電性パターン及びその形成方法 |
JP2002033566A (ja) * | 2000-07-18 | 2002-01-31 | Oki Electric Ind Co Ltd | プリント配線板の配線パターン形成方法 |
JP2010529667A (ja) * | 2007-06-07 | 2010-08-26 | フィニッシュ・エンヴァイアメント・テクノロジー・オーイュー | 回路基板の製造方法 |
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TW583503B (en) | 2000-12-01 | 2004-04-11 | Kansai Paint Co Ltd | Method of forming conductive pattern |
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JP2005167980A (ja) * | 2003-11-12 | 2005-06-23 | Shuho:Kk | アンテナパターンおよびそれを有する電磁波エネルギー処理装置 |
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WO2009045239A2 (en) * | 2007-06-08 | 2009-04-09 | Rolls-Royce Corporation | System and method for component material addition |
CN101835554B (zh) * | 2007-10-26 | 2012-08-22 | 松下电器产业株式会社 | 金属粉末烧结部件的制造装置及制造方法 |
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JPH11307910A (ja) * | 1998-04-21 | 1999-11-05 | Mitsumura Printing Co Ltd | 導電性パターン及びその形成方法 |
JP2002033566A (ja) * | 2000-07-18 | 2002-01-31 | Oki Electric Ind Co Ltd | プリント配線板の配線パターン形成方法 |
JP2010529667A (ja) * | 2007-06-07 | 2010-08-26 | フィニッシュ・エンヴァイアメント・テクノロジー・オーイュー | 回路基板の製造方法 |
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US20160128189A1 (en) | 2016-05-05 |
CN105393650A (zh) | 2016-03-09 |
CN105393650B (zh) | 2018-04-10 |
EP2991463A4 (en) | 2017-02-08 |
EP2991463A1 (en) | 2016-03-02 |
EP2991463B1 (en) | 2022-04-13 |
US9585251B2 (en) | 2017-02-28 |
TWI578867B (zh) | 2017-04-11 |
TW201538042A (zh) | 2015-10-01 |
KR20150143742A (ko) | 2015-12-23 |
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