WO2015119010A1 - 固定接点 - Google Patents

固定接点 Download PDF

Info

Publication number
WO2015119010A1
WO2015119010A1 PCT/JP2015/052318 JP2015052318W WO2015119010A1 WO 2015119010 A1 WO2015119010 A1 WO 2015119010A1 JP 2015052318 W JP2015052318 W JP 2015052318W WO 2015119010 A1 WO2015119010 A1 WO 2015119010A1
Authority
WO
WIPO (PCT)
Prior art keywords
fixed contact
base material
layer
contact
moving contact
Prior art date
Application number
PCT/JP2015/052318
Other languages
English (en)
French (fr)
Inventor
義貴 伊藤
貴哉 近藤
Original Assignee
矢崎総業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 矢崎総業株式会社 filed Critical 矢崎総業株式会社
Priority to DE112015000681.8T priority Critical patent/DE112015000681T5/de
Priority to CN201580007716.7A priority patent/CN105981230A/zh
Publication of WO2015119010A1 publication Critical patent/WO2015119010A1/ja
Priority to US15/227,013 priority patent/US20160344126A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/04—Co-operating contacts of different material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
    • H01H1/36—Contacts characterised by the manner in which co-operating contacts engage by sliding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
    • H01H2011/046—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion by plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member

Definitions

  • the present invention relates to a fixed contact on which a moving contact slides.
  • the moving contact and the fixed contact on which the moving contact slides are often covered with a plating layer.
  • the surface of the fixed contact is plated with tin (Sn) for the purpose of reducing the frictional resistance between the two contacts so that the moving contact slides smoothly with respect to the fixed contact.
  • silver (Ag) having a lower electrical resistivity than tin (Sn) is frequently used for the purpose of lowering the electrical resistance between the moving contact and the fixed contact (see Patent Document 1).
  • JP2013-189680A JP 2013-189680 A
  • the plating using silver which is a noble metal
  • has a high material cost and in order to avoid the high material cost, an attempt is made to increase the contact area between the moving contact and the fixed contact to lower the electrical resistance. Leads to an increase in the size of the contact and the connector having the contact.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a fixed contact that can keep the electric resistance with a moving contact low without causing an increase in cost and size.
  • a fixed contact according to the first aspect of the present invention is a fixed contact on which a moving contact slides, and includes a base material and a coating layer covering the base material, and the base material is a coating layer. It is made of a material having a higher electrical resistivity.
  • the base material Since the base material has a higher electrical resistivity than the covering layer, the current flowing in the fixed contact spreads in a wider range in the covering layer than in the base material. Therefore, even if the base material is covered with a coating layer using a non-noble metal material instead of a noble metal material having a low electrical resistivity, the current flowing range is diffused over a wide range in the coating layer, and a wide range in the base material is Can flow.
  • the electric current flow rate of the fixed contact can be reduced by expanding the current flow range in the base material, and the moving contact can be performed without increasing the cost and size.
  • the electrical resistance (contact resistance) can be kept low.
  • the covering layer may be configured by laminating a plurality of layers having different materials.
  • the layer closer to the base material may be made of a material having a higher electrical resistivity than the layer closer to the surface of the coating layer.
  • the coating layer may be configured using tin (Sn).
  • the electrical resistance (contact resistance) between the movable contact and the mobile contact can be kept low without causing an increase in cost and an increase in size.
  • FIG. 1 is an explanatory diagram illustrating a fixed contact according to the first embodiment.
  • FIG. 2 is an explanatory view showing the moving contact of the first comparative example in which the contact area with respect to the fixed contact is increased.
  • FIG. 3 is an explanatory view showing a moving contact of a second comparative example in which the electric resistivity of the plating layer is higher than the electric resistivity of the base material.
  • FIG. 4 is an explanatory view showing a fixed contact according to the second embodiment.
  • the fixed contact according to the embodiment will be described with reference to the drawings.
  • the embodiment will be described by taking as an example the case of a stationary contact in which a large current flows between the moving contact, such as an electric vehicle (EV) or a hybrid vehicle (HEV, a vehicle in which an engine and a motor-generator are combined).
  • a stationary contact in which a large current flows between the moving contact
  • EV electric vehicle
  • HEV hybrid vehicle
  • a vehicle in which an engine and a motor-generator are combined such as an electric vehicle (EV) or a hybrid vehicle (HEV, a vehicle in which an engine and a motor-generator are combined).
  • EV electric vehicle
  • HEV hybrid vehicle
  • the fixed contact 1 is configured by covering the surface of a base material 3 with a plating layer (covering layer) 5 and accommodated in a male connector housing (not shown). Yes.
  • the surface 5 a of the plating layer 5 is covered with an antioxidant coating 7.
  • the antioxidant coating 7 constitutes a sliding surface 1a of the fixed contact 1 on which a moving contact 9 having an arcuate cross section housed in a female connector housing (not shown) slides when the male connector is fitted to the female connector.
  • the contact resistance (electrical resistance) R between the plating layer 5 and the moving contact 9 is ⁇ as the electric resistivity (volume resistivity) of the plating layer 5, the contact radius between the fixed contact 1 and the moving contact 9 is a,
  • the base material 3 is made of a plate material such as an alloy of copper (Cu) or aluminum (Al) or stainless steel, and the plating layer 5 is more electrically than the base material 3.
  • tin (Sn) having a low resistivity is formed by plating the surface of the base material 3.
  • the base material 3 has a higher electrical resistivity than the plating layer 5, and thus the current flowing through the fixed contact 1 is schematically shown by the broken-line arrows in FIG. 1.
  • the current flowing through the fixed contact 1 is schematically shown by the broken-line arrows in FIG. 1.
  • the current flowing range is diffused in a wide range in the plating layer 5.
  • the current can flow in a wider range in the base material 3 than when the moving contact 9 slides directly on the base material 3.
  • the moving contact 9A is not configured to increase the contact area with respect to the fixed contact 1A as in the first comparative example shown in FIG.
  • the fixed contact 1B which is a plating layer 5A having a higher electrical resistivity than the base material 3 as in the second comparative example shown in FIG.
  • the electrical resistance with respect to the moving contact 9 can be kept low without causing an increase in cost and size.
  • the coating layer is formed on the surface of the fixed contact 1 by forming the plating layer 5 on the surface of the base material 3.
  • a method of forming the coating layer on the surface of the fixed contact 1 a method such as vapor deposition or sputtering can be used in addition to plating.
  • the surface of the base material 3 is covered with the first layer 5b, and the surface of the first layer 5b is further covered with the second layer 5c.
  • a laminated body (covering layer) 5d composed of the first layer 5b and the second layer 5c is used instead of the plating layer (covering layer) 5 in the fixed contact 1 according to the first embodiment shown in FIG. It is good also as a structure.
  • a material having a lower electrical resistivity (volume resistivity) than the base material 3 is used for the first layer 5b.
  • a material having a lower electrical resistivity (volume resistivity) than that of the first layer 5b is used for the second layer 5c.
  • stacking method of the 1st layer 5b and the 2nd layer 5c is good also by vapor deposition and sputtering other than plating.
  • a laminated body 5d that is a clad material formed by bonding the first layer 5b and the second layer 5c may be laminated on the surface of the base material 3.
  • the moving contact 9 of the female connector housing slides on the sliding surface 1a of the fixed contacts 1 and 1C accommodated in the male connector housing when the male connector is fitted to the female connector.
  • the present invention is not limited to this, and can be widely applied to a fixed contact having a sliding surface on which a moving contact slides.
  • the present invention is extremely useful when applied to a stationary contact on which a moving contact slides.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Contacts (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

　移動接点（９）が摺動する固定接点（１）は、母材（３）と、母材（３）を覆うめっき層５（スズ：Ｓｎ等）とを備え、母材（３）はめっき層（５）よりも電気抵抗率が高い銅やアルミニウムの合金、ステンレス鋼等の板材で構成されている。

Description

固定接点
　本発明は、移動接点が摺動する固定接点に関する。
　移動接点や移動接点が摺動する固定接点は、表面をめっき層で覆う場合が多い。特に、移動接点が固定接点に対してスムーズに摺動するように両接点間の摩擦抵抗を減らす目的で、固定接点の表面をスズ（Ｓｎ）でめっきすることはよく知られている。一方、移動接点と固定接点との間の電気抵抗を下げる目的のめっきには、スズ（Ｓｎ）よりも電気抵抗率の低い銀（Ａｇ）が多用される（特許文献１参照）。
特開２０１３－１８９６８０号公報(JP 2013-189680 A)
　しかし、貴金属である銀を材料に用いるめっきは材料コストが高くついてしまい、高い材料コストがかかるのを避けるために移動接点と固定接点との接触面積を増やして電気抵抗を下げようとすると、今度は、接点やそれを有するコネクタ等の大型化を招いてしまう。
　本発明は前記事情に鑑みなされたもので、本発明の目的は、高コスト化や大型化を招くことなく移動接点との電気抵抗を低く抑えることができる固定接点を提供することにある。
　上記目的を達成するため、本発明の第１の態様に係る固定接点は、移動接点が摺動する固定接点であって母材と、母材を覆う被覆層とを備え、母材は被覆層よりも電気抵抗率が高い材料で構成されている。
　被覆層よりも母材の方が電気抵抗率が高いために、固定接点内を流れる電流は、母材内よりも被覆層内において広い範囲に拡散する。したがって、低電気抵抗率の貴金属材料でなく非貴金属材料を用いた被覆層で母材を覆っても、電流が流れる範囲を被覆層において広い範囲に拡散させて、母材においても広い範囲を電流が流れるようにすることができる。
　これにより、移動接点の固定接点に対する接触面積を増やさなくても、母材において電流が流れる範囲を拡げて固定接点の電気抵抗率を低く抑え、高コスト化や大型化を招くことなく移動接点との電気抵抗（接触抵抗）を低く抑えることができる。
　被覆層は、互いに材料が異なる複数の層を積層して構成されていてもよい。この場合、母材に近い層ほど、被覆層の表面に近い層よりも電気抵抗率が高い材料で構成すればよい。
　このような構成により、電気抵抗率の低さの度合いが大きい材料を各層に用いなくても、各層において電流が流れる範囲を徐々に拡大して、母材において電流が流れる範囲を大きい範囲に拡げ電気抵抗率を低く抑えることができる。
　被覆層は、スズ（Ｓｎ）を用いて構成されていてもよい。
　本発明の態様に係る固定接点によれば、高コスト化や大型化を招くことなく移動接点との間の電気抵抗（接触抵抗）を低く抑えることができる。
図１は、第１実施形態に係る固定接点を示す説明図である。 図２は、固定接点に対する接触面積を増やした第１比較例の移動接点を示す説明図である。 図３は、めっき層の電気抵抗率が母材の電気抵抗率よりも高い第２比較例の移動接点を示す説明図である。 図４は、第２実施形態に係る固定接点を示す説明図である。
　以下、実施形態に係る固定接点について図面を参照して説明する。実施形態では、電気自動車（ＥＶ）やハイブリッド車（ＨＥＶ、エンジンとモータ－ジェネレータの併用車）等の大電流が移動接点との間を流れる固定接点の場合を例に取って説明する。
　図１に示すように、第１実施形態に係る固定接点１は、母材３の表面をめっき層（被覆層）５で覆って構成されており、雄コネクタハウジング（不図示）に収容されている。
　めっき層５の表面５ａは、酸化防止被膜７によって覆われている。酸化防止被膜７は、雌コネクタハウジング（不図示）に収容された断面円弧状の移動接点９が雄コネクタの雌コネクタに対する嵌合時に摺動する固定接点１の摺動面１ａを構成する。
　ここで、めっき層５と移動接点９との接触抵抗（電気抵抗）Ｒは、めっき層５の電気抵抗率（体積抵抗率）をρ、固定接点１と移動接点９との接触半径をａ、酸化防止被膜７の電気抵抗率（体積抵抗率）をρｆ、酸化防止被膜７の膜厚をｄとした場合、Ｒ＝（ρ／２ａ）＋ρｆｄ／πａ＾２で表すことができる。
　第１実施形態に係る固定接点１では、母材３を、例えば、銅（Ｃｕ）やアルミニウム（Ａｌ）の合金、ステンレス鋼等の板材で構成し、めっき層５を、母材３よりも電気抵抗率が低い例えばスズ（Ｓｎ）を母材３の表面にめっきして形成している。
　このように構成された固定接点１では、めっき層５よりも母材３の方が電気抵抗率が高いので、固定接点１内を流れる電流は、図１中の破線の矢印で模式的に示すように、母材３内よりもめっき層５内において広い範囲に拡散する。したがって、めっき層５に、銀（Ａｇ）等の低電気抵抗率の貴金属材料でなく、非貴金属材料であるスズ（Ｓｎ）を用いても、電流が流れる範囲がめっき層５において広い範囲に拡散し、移動接点９が母材３上を直接摺動する場合よりも、母材３において広い範囲を電流が流れるようにすることができる。
　これにより、図１に示す第１実施形態に係る固定接点１では、図２に示す第１比較例のように固定接点１Ａに対する接触面積が増えるように移動接点９Ａを構成しなくても、図３に示す第２比較例のように母材３よりも電気抵抗率が高いめっき層５Ａとする固定接点１Ｂに比べて、母材３において電流が流れる範囲を拡げて固定接点１の電気抵抗率を低く抑え、高コスト化や大型化を招くことなく移動接点９との電気抵抗を低く抑えることができる。
　なお、第１実施形態では、母材３の表面にめっき層５を形成することで、固定接点１の表面に被覆層を形成するものとした。しかし、固定接点１の表面に被覆層を形成する方法としては、めっきの他、蒸着やスパッタリング等の方法を用いることができる。また、母材の表面に、母材よりも電気抵抗率が低い薄板を貼り合わせたクラッド材で固定接点を構成することで、被覆層を形成してもよい。
　また、図４に示す第２実施形態に係る固定接点１Ｃのように、母材３の表面を第１の層５ｂで覆い、第１の層５ｂの表面を第２の層５ｃでさらに覆って、第１の層５ｂと第２の層５ｃにより構成される積層体（被覆層）５ｄを、図１に示す第１実施形態に係る固定接点１におけるめっき層（被覆層）５の代わりとする構成としてもよい。
　このとき、第１の層５ｂには、母材３よりも電気抵抗率（体積抵抗率）が低い材料を用いる。また、第２の層５ｃには、第１の層５ｂよりも電気抵抗率（体積抵抗率）が低い材料を用いる。
　これにより、母材３に対する電気抵抗率の低さの度合いが大きい単一の材料で母材３の表面を覆わなくても、図４中の破線の矢印で模式的に示すように、第１の層５ｂと第２の層５ｃにおいて電流が流れる範囲を徐々に拡大して、母材３において電流が流れる範囲を大きい範囲に拡げ固定接点１Ｃの電気抵抗率を低く抑えることができる。
　なお、第１の層５ｂや第２の層５ｃの積層方法は、めっきの他、蒸着やスパッタリングによってもよい。また、第１の層５ｂと第２の層５ｃとを貼り合わせてクラッド材とした積層体５ｄを、母材３の表面に積層してもよい。
　また、第１実施形態および第２実施形態では、雄コネクタの雌コネクタに対する嵌合時に雌コネクタハウジングの移動接点９が雄コネクタハウジングに収容された固定接点１，１Ｃの摺動面１ａ上を摺動するものとしたが、これには限定されず、移動接点が摺動する摺動面を有する固定接点に広く適用可能である。
　本発明は、移動接点が摺動する固定接点に適用して極めて有用である。
 

Claims (3)

  1. 　移動接点が摺動する固定接点であって、
    　母材と、
    　前記母材を覆う被覆層と
    を備え、
    　前記母材は、前記被覆層よりも電気抵抗率が高い材料で構成されている
    ことを特徴とする固定接点。
  2. 　請求項１に記載の固定接点であって、
    　前記被覆層は、互いに材料が異なる複数の層を積層して構成されており、前記母材に近い層ほど、前記被覆層の表面に近い層よりも電気抵抗率が高い材料で構成されている
    ことを特徴とする固定接点。
  3. 　請求項１又は２に記載の固定接点であって、
    　前記被覆層はスズを用いて構成されている
    ことを特徴とする固定接点。
     
PCT/JP2015/052318 2014-02-07 2015-01-28 固定接点 WO2015119010A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE112015000681.8T DE112015000681T5 (de) 2014-02-07 2015-01-28 Festkontakt
CN201580007716.7A CN105981230A (zh) 2014-02-07 2015-01-28 固定接点
US15/227,013 US20160344126A1 (en) 2014-02-07 2016-08-03 Fixed contact

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-022144 2014-02-07
JP2014022144A JP2015149218A (ja) 2014-02-07 2014-02-07 固定接点

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US15/227,013 Continuation US20160344126A1 (en) 2014-02-07 2016-08-03 Fixed contact

Publications (1)

Publication Number Publication Date
WO2015119010A1 true WO2015119010A1 (ja) 2015-08-13

Family

ID=53777817

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/052318 WO2015119010A1 (ja) 2014-02-07 2015-01-28 固定接点

Country Status (5)

Country Link
US (1) US20160344126A1 (ja)
JP (1) JP2015149218A (ja)
CN (1) CN105981230A (ja)
DE (1) DE112015000681T5 (ja)
WO (1) WO2015119010A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6423383B2 (ja) * 2016-03-31 2018-11-14 日新製鋼株式会社 接続部品用材料

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06187867A (ja) * 1992-12-17 1994-07-08 Sannou:Kk 接点材料及びその製造方法
JP2004300489A (ja) * 2003-03-31 2004-10-28 Nisshin Steel Co Ltd ステンレス鋼製電気接点
JP2013227645A (ja) * 2011-08-25 2013-11-07 Nisshin Steel Co Ltd めっき密着性の良好なＳｎめっきステンレス鋼板およびその製造法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5916695A (en) * 1995-12-18 1999-06-29 Olin Corporation Tin coated electrical connector
JP3286560B2 (ja) * 1997-04-28 2002-05-27 株式会社オートネットワーク技術研究所 嵌合型接続端子
DE19881091B4 (de) * 1997-07-02 2007-01-04 Mabuchi Motor Co., Ltd., Matsudo Verwendung eines plattierten Verbundmaterials für elektrische Schleifkontakte
TW521896U (en) * 2000-01-03 2003-02-21 Molex Inc Connector
DE10025106A1 (de) * 2000-05-20 2001-11-22 Stolberger Metallwerke Gmbh Elektrisch leitfähiges Metallband und Steckverbinder hieraus
DE10025107A1 (de) * 2000-05-20 2001-11-22 Stolberger Metallwerke Gmbh Elektrisch leifähiges Metallband und Steckverbinder
EP1281789B1 (en) * 2001-07-31 2006-05-31 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) A plated copper alloy material and process for production thereof
DE10146274A1 (de) * 2001-09-19 2003-04-10 Bosch Gmbh Robert Metallische Oberfläche eines Körpers, Verfahren zur Herstellung einer strukturierten metallischen Oberfläche eines Körpers und dessen Verwendung
JP4302392B2 (ja) * 2002-11-28 2009-07-22 三菱伸銅株式会社 コネクタ端子、コネクタおよびコネクタ端子の製造方法、並びに、コネクタ用条
DE10261303B3 (de) * 2002-12-27 2004-06-24 Wieland-Werke Ag Verbundmaterial zur Herstellung elektrischer Kontakte und Verfahren zu dessen Herstellung
CN100407503C (zh) * 2003-08-30 2008-07-30 富士康(昆山)电脑接插件有限公司 端子及其电镀方法
US7094117B2 (en) * 2004-02-27 2006-08-22 Micron Technology, Inc. Electrical contacts with dielectric cores
JP5215305B2 (ja) * 2007-07-06 2013-06-19 第一電子工業株式会社 電子部品の製造方法及び該方法により製造する電子部品
JP5025387B2 (ja) * 2007-08-24 2012-09-12 株式会社神戸製鋼所 接続部品用導電材料及びその製造方法
CN101978561B (zh) * 2008-03-19 2016-04-06 古河电气工业株式会社 连接器用端子及其制造方法
WO2009123157A1 (ja) * 2008-03-31 2009-10-08 古河電気工業株式会社 接続部品用金属材料およびその製造方法
EP2620275B1 (en) * 2012-01-26 2019-10-02 Mitsubishi Materials Corporation Tin-plated copper-alloy material for terminal and method for producing the same
CN202585830U (zh) * 2012-04-06 2012-12-05 杭州赛贝电子有限公司 一种车用线束的连接件

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06187867A (ja) * 1992-12-17 1994-07-08 Sannou:Kk 接点材料及びその製造方法
JP2004300489A (ja) * 2003-03-31 2004-10-28 Nisshin Steel Co Ltd ステンレス鋼製電気接点
JP2013227645A (ja) * 2011-08-25 2013-11-07 Nisshin Steel Co Ltd めっき密着性の良好なＳｎめっきステンレス鋼板およびその製造法

Also Published As

Publication number Publication date
JP2015149218A (ja) 2015-08-20
CN105981230A (zh) 2016-09-28
DE112015000681T5 (de) 2016-12-29
US20160344126A1 (en) 2016-11-24

Similar Documents

Publication Publication Date Title
US10177478B2 (en) Board terminal and board connector
JP6601276B2 (ja) 電気接点およびコネクタ端子対
JP2006245231A5 (ja)
GB2456120A (en) A metallization layer stack without a terminal aluminium metal layer
EP2242086A3 (en) PDP filter and manufacturing method thereof
JP2014519548A5 (ja)
TW200711038A (en) Method of forming a semiconductor device having a diffusion barrier stack and structure thereof
JP6332043B2 (ja) コネクタ用端子対
US20170331205A1 (en) Electrical contact element, press-in pin, bushing, and leadframe
WO2014140430A3 (en) Multi shell metal particles and uses thereof
WO2015119010A1 (ja) 固定接点
KR20140145870A (ko) 방열 복합시트
RU2016133611A (ru) Монтажный электрический провод
US20180026385A1 (en) Electrical contact pair and connector terminal pair
JP5741934B2 (ja) Ｍｇ合金部材、および電気機器の筐体
JP2017201686A5 (ja)
JP6357640B2 (ja) 積層部品
US20190141867A1 (en) Shielding film and method of manufacturing the same
JP2015153489A (ja) 固定接点
US10077809B2 (en) Rolling bearing comprising an electric circuit, and method for producing an electric circuit for a rolling bearing
WO2016147894A1 (ja) 電気接点対およびコネクタ用端子対
WO2017200650A3 (en) Weatherstrip assembly and method of isolating dissimilar metals in the weatherstrip assembly
JP6876025B2 (ja) 端子金具
JP6282205B2 (ja) 電気接点材料の製造方法
JP2016195049A (ja) 雌端子

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15746321

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 112015000681

Country of ref document: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15746321

Country of ref document: EP

Kind code of ref document: A1