WO2015076030A1 - Dispositif d'incinération au plasma et structure de support d'objet à traiter - Google Patents

Dispositif d'incinération au plasma et structure de support d'objet à traiter Download PDF

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Publication number
WO2015076030A1
WO2015076030A1 PCT/JP2014/076688 JP2014076688W WO2015076030A1 WO 2015076030 A1 WO2015076030 A1 WO 2015076030A1 JP 2014076688 W JP2014076688 W JP 2014076688W WO 2015076030 A1 WO2015076030 A1 WO 2015076030A1
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Prior art keywords
processed
light
processing
treated
processing gas
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PCT/JP2014/076688
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English (en)
Japanese (ja)
Inventor
村上　哲也
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ウシオ電機株式会社
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Publication of WO2015076030A1 publication Critical patent/WO2015076030A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Definitions

  • the present invention relates to an ashing apparatus for processing an object to be processed having both surfaces to be processed, such as a multilayer wiring board material, using vacuum ultraviolet rays, and an object holding structure suitably used in the ashing apparatus.
  • an ashing apparatus for processing an object to be processed having both surfaces to be processed, such as a multilayer wiring board material, using vacuum ultraviolet rays, and an object holding structure suitably used in the ashing apparatus.
  • a dry cleaning method using ultraviolet rays is known as a method of performing a desmear (smear removal) process in a substrate manufacturing process.
  • a method using active oxygen such as ozone generated by vacuum ultraviolet rays radiated from an excimer lamp is suitably used because a predetermined treatment can be performed more efficiently and in a short time.
  • Patent Document 1 describes that in dry desmear processing, organic substances are decomposed and removed using active species (active oxygen atoms) decomposed and generated from ozone. Further, it is described that it is preferable to use ozone treatment utilizing the action of ozone and active species and ultraviolet irradiation treatment in combination for decomposition and removal of organic substances.
  • active species active oxygen atoms
  • the vacuum ultraviolet rays from the light source are absorbed by oxygen, when the oxygen concentration of the active species source is increased, the amount of ultraviolet rays absorbed by the active species source increases. Therefore, in order to suppress a decrease in the amount of ultraviolet rays reaching the surface to be processed, it is necessary to reduce the irradiation distance between the ultraviolet light source and the object to be processed.
  • the processing time of the object to be processed is shortened by simultaneously ashing both surfaces of the object to be processed. It is possible.
  • the present invention has been made based on the above circumstances, and an ashing device capable of performing an ashing process on an object to be processed with high processing efficiency and an object holding structure suitably used in the ashing apparatus.
  • the purpose is to provide a body.
  • the ashing device of the present invention includes a pair of light transmission windows facing each of the surfaces to be processed of a plate-like object whose one surface and the other surface are processed surfaces, and each of the surfaces to be processed.
  • a pair of ultraviolet irradiation units including an ultraviolet light source that irradiates vacuum ultraviolet rays through the light transmission window;
  • a frame-shaped holding member that holds the periphery of the object to be processed is sandwiched and held by a housing in the pair of ultraviolet irradiation units, so that the object to be processed is provided on one surface side and the other surface side of the object to be processed.
  • a processing space formed by a gap having a predetermined size formed between a surface to be processed of the object and a light emitting surface of the light transmission window, and a light source arrangement space in which the ultraviolet light source is disposed are the light transmission window. Formed in an airtight manner, and The inside of the light source arrangement space is an inert gas atmosphere, and a processing gas containing an activated species source activated by vacuum ultraviolet light from the ultraviolet light source is circulated in the processing space. To do.
  • each of the pair of ultraviolet irradiation units includes a housing that is open on one side,
  • Each of the light transmissive windows is configured by a plate-like light transmissive window member that is airtightly held at a position on the inner side of the opening edge of the housing.
  • each of the light transmitting windows is configured by a plate-like light transmitting window member held by a holding member that holds an object to be processed. May have a configuration in which a processing gas distribution opening for distributing the processing gas in the processing space is formed.
  • the workpiece holding structure of the present invention is for light irradiation treatment, A pair of plate-like lights disposed on the plate-like object to be processed and on the one surface side and the other surface side of the object to be processed so as to face the one surface and the other surface with a gap of a predetermined size, respectively.
  • a transparent window member, and a common frame-shaped holding member that holds the periphery of the object to be processed and the pair of light-transmissive window members, and each of the gaps includes the holding member.
  • a processing gas distribution opening for allowing the processing gas to flow therethrough is formed.
  • the ashing device is configured to simultaneously process each of the processing surfaces of a plate-shaped processing object whose both surfaces are processing surfaces.
  • a processing space through which the processing gas is circulated and a light source arrangement space that is an inert gas atmosphere, which are airtightly partitioned by a window, constitute a substantially sealed space.
  • the degree of decrease in the amount of vacuum ultraviolet light from the ultraviolet light source can be suppressed to a small level, and the atmosphere of the processing space can be kept substantially constant by the processing gas being circulated. Therefore, according to the ashing device of the present invention, it is possible to increase the amount of vacuum ultraviolet light that contributes to the processing of the object to be processed, and to stably generate active species, thereby reliably processing the active species. Since it can contribute to the processing of the object, the desired ashing process can be performed efficiently.
  • the light-exiting surface of the light-transmitting window member is used for simultaneously processing each of the surfaces to be processed of the flat plate-like object having both surfaces to be processed. Since the atmosphere in the processing space formed by maintaining the state where the surface of the object to be processed and the surface to be processed are in close proximity can be maintained substantially constant, the desired light irradiation process can be performed efficiently and in a short time An object-holding structure that can handle the above is provided.
  • the ashing device is configured so that vacuum ultraviolet light having a wavelength of 220 nm or less from an ultraviolet irradiation unit is irradiated to a surface to be processed through a light transmission window.
  • a transmission window is provided on the ultraviolet irradiation unit side.
  • FIG. 1 is a cross-sectional view schematically showing the configuration of an example of an ashing device according to the first embodiment of the present invention.
  • This ashing apparatus simultaneously processes each of the processing surfaces 12 and 13 of a plate-shaped processing object 11 whose one surface and the other surface are processing surfaces, and the processing object 11 A conveying means (not shown) is provided that conveys (four rounds) with the holding member 15 having a rectangular frame shape, for example.
  • the object to be processed 11 is conveyed in a direction (in a direction perpendicular to the paper surface in FIG. 1) along the surface direction of the surfaces 12 and 13 to be processed while being suspended.
  • the flat light transmissive window member 40a (40b) constituting the light transmissive window is located at a position on the inner side of the opening edge of the casing 21a (21b) in the ultraviolet irradiation unit 20a (20b).
  • the light source arrangement space S1 constituting the sealed space is formed in the housing 21a (21b).
  • an ultraviolet radiation lamp 35 that is long in one direction and that constitutes the ultraviolet light source is arranged with the lamp central axis extending in the vertical direction.
  • the ultraviolet radiation lamp 35 for example, a rectangular lamp having a flat cross-sectional shape by a cross section perpendicular to the longitudinal direction can be used.
  • the number of the ultraviolet radiation lamps 35 is not particularly limited, and can be appropriately set according to the purpose. For example, when a plurality of ultraviolet radiation lamps 35 are used, each lamp central axis is arranged in a state where it is located in the same vertical plane parallel to the processing surfaces 12 and 13 of the processing object 11. .
  • Examples of the ultraviolet radiation lamp 35 include a low-pressure mercury lamp that emits ultraviolet light having a peak at a wavelength of 185 nm, a deuterium lamp that emits ultraviolet light having a wavelength of 180 to 370 nm, and a xenon excimer lamp that emits vacuum ultraviolet light having a center wavelength of 172 nm. Can be used. Among these, it is preferable to use a xenon excimer lamp because the intensity of vacuum ultraviolet rays is high and active species can be generated efficiently.
  • the housing 21a (21b) in the ultraviolet irradiation unit 20a (20b) has a housing main body 22a (22b) that is open on one side, and the end surfaces are in contact with each other on the opening side of the housing main body 22a (22b). It is comprised by the frame-shaped window holding body 25a (25b) provided integrally.
  • An endless seal member 30 made of, for example, an O-ring is provided over the entire circumference of the opening end surface of the housing 21a (21b).
  • the casing main body 22a (22b) has an inert gas supply through-hole 23a and an inert gas discharge through-hole 23b in each of a pair of opposed peripheral walls positioned in the lamp central axis direction. It is formed to extend along the direction.
  • the window holder 25a (25b) has a window member holding portion 26 formed by a stepped portion, and the light transmissive window member 40a (40b) has a light exit surface 42a (42b) to be processed of the object 11 to be processed.
  • the peripheral edge portion of the light incident surface 41a (41b) is supported by the window member holding portion 26 and is airtightly fixed.
  • the projecting edge portions 27 projecting outward from the light exit surface 42a (42b) of the light transmissive window member 40a (40b) in the window holder 25a (25b) are mutually positioned in the lamp central axis direction.
  • a processing gas supply through hole 28a and a processing gas discharge through hole 28b are formed in each of the opposed peripheral walls so as to extend along the lamp central axis direction. An opening is formed.
  • any material can be used as long as it can transmit the vacuum ultraviolet rays from the ultraviolet radiation lamp 35.
  • quartz glass can be used.
  • the thickness of the light transmissive window members 40a and 40b is, for example, 3 to 7 mm.
  • This ashing apparatus supplies a processing gas containing an activated species source activated by vacuum ultraviolet rays from an ultraviolet radiation lamp 35 into a processing space to be described later via a processing gas supply through hole 28a.
  • Active species source supply means (not shown) is provided.
  • the processing gas supplied by the active species source supply means for example, oxygen gas, a mixed gas in which ozone is mixed with oxygen gas, water vapor, or the like can be used.
  • OH radicals hydroxyl radicals
  • the oxygen concentration in the processing gas is preferably 50% by volume or more, for example.
  • this ashing device is a driving means for moving each of the ultraviolet irradiation units 20a and 20b in a direction away from and a direction approaching the conveyance path of the workpiece 11 (indicated by a white arrow in FIG. 1). (Not shown).
  • a plurality of insulating layers and a plurality of wiring layers are alternately laminated, and one or a plurality of insulating layers have via holes or through holes for electrical connection between the wiring layers.
  • a multilayer wiring board material formed so as to extend through in the thickness direction can be exemplified.
  • Such a multilayer wiring board material usually has a smear (residue) due to the material constituting the insulating layer or the conductive layer, which is inevitably generated when forming a via hole or a through hole.
  • the object to be processed 11 held by the holding member 15 is transported along the transport path by the transport means and arranged at a predetermined position. Then, each of the pair of ultraviolet irradiation units 20a and 20b is sequentially moved in the direction approaching the workpiece 11 by the driving means, and as shown in FIG. 2, the holding member 15 and each ultraviolet irradiation unit 20a. , 20b with the end faces of the casings 21a, 21b in contact with each other via the seal members 30, 30, the holding member 15 is held and held by the casings 21a, 21b of the respective ultraviolet irradiation units 20a, 20b. Is done.
  • the working space S2 is formed, and the processing surface 12 (13) of the processing object 11 and the light emitting surface 42a (42b) of the light transmissive window member 40a (40b) are arranged close to each other.
  • the distance d between the treated surface 12 (13) of the workpiece 11 and the light emitting surface 42a (42b) of the light transmissive window member 40a (40b) is, for example, 3 mm or less, preferably 1 mm. It is as follows.
  • an inert gas such as nitrogen gas (indicated by a broken arrow in FIG. 2) is inactivated by an inert gas supply means (not shown) in the light source arrangement space S1 in the ultraviolet irradiation unit 20a (20b).
  • the inert gas is supplied through the active gas supply through hole 23a, and the inert gas is circulated in the light source arrangement space S1, whereby the atmosphere in the light source arrangement space S1 is replaced with the inert gas atmosphere.
  • the active species source supplying means supplies the processing space S2 by the gap between the processing surface 12 (13) of the processing object 11 and the light emitting surface 42a (42b) of the light transmissive window member 40a (40b).
  • a processing gas having an oxygen concentration of 50% by volume or more is supplied through the processing gas supply through hole 28a.
  • the processing gas is circulated in the processing space S2 along the processing surface 12 (13) of the processing object 11 and the light emitting surface 42a (42b) of the light transmissive window member 40a (40b), and the processing gas. It is discharged from the discharge through hole 28b.
  • the illuminance of the ultraviolet rays irradiated to the object 11 is, for example, 10 to 200 mW / cm 2 .
  • the ultraviolet irradiation time for the object 11 is appropriately set in consideration of the illuminance of ultraviolet rays, the residual state of smear, and the like, for example, 50 to 300 seconds.
  • the ashing process is performed while the inert gas and the processing gas are continuously supplied.
  • each of the processing surfaces 12 and 13 of the processing object 11 is processed at the same time.
  • the light source arrangement space S1 that is an inert gas atmosphere and the processing space S2 in which the processing gas is circulated, hermetically partitioned by the member 40a (40b), constitutes a substantially sealed space. Accordingly, the degree of decrease in the amount of vacuum ultraviolet light from the ultraviolet radiation lamp 35 can be suppressed to a small level, and the atmosphere of the processing space S2 can be kept substantially constant by the processing gas being circulated. .
  • the amount of vacuum ultraviolet light contributing to the ashing process of the workpiece 11 can be increased, and active species (oxygen radicals) can be stably generated. Since the active species can surely contribute to the ashing process of the workpiece 11, the intended ashing process can be performed efficiently and in a short time. Further, since the object 11 is processed in a vertical posture, it is possible to prevent the object 11 from being bent due to its own weight and to perform uniform processing.
  • the ashing device has a configuration in which vacuum ultraviolet light having a wavelength of 220 nm or less from an ultraviolet irradiation unit is irradiated to a surface to be processed through a light transmission window.
  • a transmission window is provided on the workpiece side.
  • FIG. 3 is a cross-sectional view schematically showing the configuration of an example of the ashing device according to the second embodiment of the present invention.
  • the ashing apparatus is for processing each of the processing surfaces 12 and 13 of a flat plate-like object 11 whose one surface and the other surface are processing surfaces, and includes the object 11 to be processed.
  • Conveying means (not shown) for conveying the workpiece holding structure 10 is provided.
  • the workpiece holding structure 10 is in a suspended state in a direction along the surface direction of the workpiece surfaces 12 and 13 of the workpiece 11 (in FIG. 3, a direction perpendicular to the paper surface). It is conveyed to.
  • the workpiece holding structure 10 has a plate-like workpiece 11 and a predetermined size on each of the workpiece surfaces 12 and 13 of the workpiece 11 on one side and the other side of the workpiece 11.
  • a pair of flat light-transmitting window members 40a and 40b disposed in parallel with each other through a gap d, and the workpiece 11 and the pair of light-transmitting window members 40a and 40b are held.
  • a common frame-shaped holding member 15a On the one surface side and the other surface side of the object to be processed 11, the surface to be processed 12 (13) of the object to be processed 11 and the light emitting surface 42 a (42 b) of the light transmissive window member 40 a (40 b) constituting the sealed space.
  • a processing space S ⁇ b> 2 is formed by a gap between them.
  • the holding member 15a is formed with a processing gas distribution opening for distributing a processing gas containing an active species source activated by vacuum ultraviolet rays from the ultraviolet radiation lamp 35 to the processing space S2.
  • the holding member 15a includes a base body 16 made of a rectangular frame body and a cover made of a U-shaped frame body integrally provided in an embedded state on the inner surface side of the base body 16.
  • the workpiece holder 17 is constituted.
  • process gas is introduce
  • An opening 18 constituting the processing gas distribution opening is formed to extend in the longitudinal direction of the peripheral wall (a direction perpendicular to the paper surface in FIG. 3).
  • the object to be processed 11 is fixed by holding the three sides around the object to be processed by the object holder 17, and each of the light transmissive window members 40 a and 40 b is held by the base 16 at the periphery (four sides). Has been fixed.
  • a material constituting the base 16 in the holding member 15a for example, a metal material such as aluminum, stainless steel, or copper can be used.
  • resin materials such as fluorine resins, such as Teflon (trademark), and PEEK (polyetheretherketone) resin, can be used, for example.
  • the workpiece holder 17 is made of a resin material, the workpiece holder 17 can function as a scratch prevention material or a buffer material for the workpiece 11.
  • a pair of ultraviolet irradiation units 20a and 20b are arranged opposite to each other on both sides of the conveyance path of the workpiece holding structure 10.
  • Each of the ultraviolet irradiation units 20a (20b) is configured by a casing 21a (21b) that is open at one side (conveyance path direction) and an ultraviolet light source disposed inside the casing 21a (21b).
  • the ultraviolet light source has the same configuration as the ultraviolet light source in the ashing device according to the first embodiment, and is configured by one or a plurality of rod-shaped ultraviolet radiation lamps 35.
  • the casing 21a (21b) has an inert gas supply through-hole 23a and an inert gas discharge through-hole 23b in each of a pair of opposed peripheral walls positioned in the lamp central axis direction, in the lamp central axis direction. It is formed to extend along.
  • an endless seal member 30 made of, for example, an O-ring is provided on the open end surface of the casing 21a (21b) over the entire circumference of the open end surface.
  • This ashing device includes active species source supply means (not shown) for supplying the processing gas into the processing space S2 in the workpiece holding structure 10.
  • the active species source supply means has the same configuration as the active species source supply means in the ashing device according to the first embodiment.
  • the ashing apparatus moves each of the ultraviolet irradiation units 20a and 20b in a direction away from and a direction approaching the conveyance path of the workpiece holding structure 10 (indicated by white arrows in FIG. 3).
  • Driving means (not shown) to be provided.
  • the workpiece holding structure 10 is transported along the transport path by the transport means and arranged at a predetermined position. Then, each of the pair of ultraviolet irradiation units 20a and 20b is sequentially moved in the direction of approaching the workpiece holding structure 10 by the driving means, so that the workpiece holding structure 10 as shown in FIG. In the state in which the end surfaces of the holding members 15a and the housings 21a and 21b of the respective ultraviolet irradiation units 20a and 20b are in contact with each other via the seal members 30 and 30, the workpiece holding structure 10 is irradiated with the respective ultraviolet rays. The units 20a and 20b are sandwiched and held by the casings 21a and 21b.
  • the light source arrangement space S1 constituting the sealed space which is hermetically partitioned by the processing space S2 and the light transmissive window members 40a and 40b in the workpiece holding structure 10, is a housing in the ultraviolet irradiation units 20a and 20b. It is formed inside 21a, 21b.
  • an inert gas such as nitrogen gas (indicated by a dashed arrow in FIG. 4) is inactivated by an inert gas supply means (not shown) in the light source arrangement space S1 in the ultraviolet irradiation unit 20a (20b).
  • the inert gas is supplied through the active gas supply through hole 23a, and the inert gas is circulated in the light source arrangement space S1, whereby the atmosphere in the light source arrangement space S1 is replaced with the inert gas atmosphere.
  • a processing gas having an oxygen concentration of 50% by volume or more is opened 18 in the processing space S2 in the workpiece holding structure 10 by the active species source supply means. Is supplied through.
  • each ultraviolet irradiation unit 20a (20b) is turned on, so that the vacuum ultraviolet light from the ultraviolet radiation lamp 35 is applied to the object 11 to be processed via the light transmissive window member 40a (40b). Irradiation is directed toward the processing surface 12 (13).
  • vacuum ultraviolet rays that reach the surface 12 (13) of the object 11 to be processed, and ozone and active species (oxygen radicals) that are generated by irradiating the processing gas with the vacuum ultraviolet rays are processed. Smear formed on the processing surfaces 12 and 13 of the object 11 is decomposed and removed.
  • the light emitting surface 42a (42b) of the light transmissive window member 40a (40b) and the workpiece 12 of the workpiece 11 (13) are close to each other.
  • the atmosphere in the processing space S2 can be kept substantially constant by the processing gas flowing through the processing space S2 formed in such a state. For this reason, it is possible to stably generate active species (oxygen radicals) by irradiating the processing gas with the vacuum ultraviolet rays from the ultraviolet radiation lamp 35, and the workpiece holding structure 10 itself can be The ashing process can be efficiently performed in a short time.
  • the ashing device having the above-described configuration for performing the ashing process on the workpiece in the workpiece holding structure 10 is formed with the light transmissive window member 40a (
  • the light source arrangement space S1 that is an inert gas atmosphere and the processing space S2 through which the processing gas is circulated in an airtight manner by 40b) constitutes a substantially sealed space. Accordingly, the degree of decrease in the amount of vacuum ultraviolet light from the ultraviolet radiation lamp 35 can be suppressed to a small level, and the atmosphere of the processing space S2 can be kept substantially constant by the processing gas being circulated. .
  • the amount of vacuum ultraviolet light that contributes to the ashing process of the workpiece 11 can be increased, and the generated active species can be surely contributed to the ashing process of the workpiece 11. Therefore, the desired ashing process can be performed efficiently and in a short time.
  • the to-be-processed surfaces 12 and 13 of the to-be-processed object 11 are covered by the light transmissive window members 40a and 40b, the to-be-processed object 11 is damaged, for example at the time of conveyance of the to-be-processed object holding structure 10. Can be prevented. Further, since the object 11 is processed in a vertical posture, it is possible to prevent the object 11 from being bent due to its own weight and to perform uniform processing.
  • the window holding body that holds the light transmissive window member may be formed integrally with the housing body.
  • the ashing process is performed in a state where the temperature of the surface to be processed of the object to be processed is raised.
  • the heating means for heating the surface to be processed of the object to be processed is disposed at a position upstream of the light irradiation processing region by the ultraviolet irradiation unit in the conveyance path of the object to be processed or the object holding structure. It can be set as the structure made. According to such a configuration, the action of ozone and active species can be promoted as the temperature of the surface to be processed of the object to be processed increases, so that the ashing process can be performed with higher efficiency. .
  • a heating means may be provided in the workpiece holding structure to raise the temperature of the workpiece surface of the workpiece. Furthermore, the same effect can be obtained even if the temperature of the surface to be processed of the object to be processed is increased by circulating the processing space in a state where the temperature of the processing gas is raised by heating. .
  • the heating condition is preferably such that the temperature of the surface to be processed of the object to be processed is, for example, 80 ° C. or higher and 340 ° C. or lower, more preferably the temperature of the surface to be processed of the object to be processed is 80 ° C.
  • the conditions are 200 ° C. or lower.
  • the ashing device of the present invention can be configured to be provided with physical vibration processing means for applying physical vibration to the workpiece during the light irradiation process.
  • the active species generated in the processing space can be easily supplied into, for example, a via hole or a through hole in the wiring board material, so that the ashing process can be performed more reliably.
  • the ashing device of the present invention is not only for removing smears such as multilayer wiring boards, but also for example, from the surface of a substrate in the manufacturing process of a substrate such as a semiconductor substrate or a liquid crystal panel, or a dry cleaning treatment of a template surface in a nanoimprinting device. It can be used for various ashing processes such as a process for removing the resist and a process for removing the resist residue attached to the substrate on which the resist removal process has been performed.

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

Le but de la présente invention est de fournir un dispositif d'incinération au plasma conçu pour effectuer efficacement un traitement d'incinération au plasma sur un objet à traiter, ainsi qu'une structure de support d'objet à traiter. L'invention concerne un dispositif d'incinération au plasma. En plaçant et en tenant un élément de support en forme de cadre pour tenir la périphérie d'un objet à traiter en forme de plaque, dont les deux surfaces sont à traiter, entre les enveloppes d'une paire d'unités d'irradiation ultraviolette, étant chacune pourvue d'une source de lumière ultraviolette pour une irradiation avec une lumière ultraviolette sous vide, sur chacun d'un côté de surface et de l'autre côté de surface de l'objet à traiter, un espace de traitement à travers lequel s'écoule un gaz de traitement contenant une source de substance active devant être activée par la lumière ultraviolette sous vide, et un espace de disposition de source de lumière, qui est dans une atmosphère de gaz inerte, sont formés, les espaces étant délimités de manière hermétique l'un par rapport à l'autre par une fenêtre de transmission de lumière disposée en face de la surface à traiter avec un espacement ayant une taille prédéterminée entre celles-ci. La structure de support d'objet à traiter est configurée en tenant, par un élément de support en forme de cadre commun, un objet à traiter en forme de plaque plate et des éléments de fenêtre de transmission de lumière de forme plate disposés sur un côté de surface et l'autre côté de surface de l'objet à traiter de façon à faire face de l'objet à traiter, un espacement ayant une taille prédéterminée étant interposé entre ceux-ci.
PCT/JP2014/076688 2013-11-19 2014-10-06 Dispositif d'incinération au plasma et structure de support d'objet à traiter WO2015076030A1 (fr)

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JP2013-238608 2013-11-19
JP2013238608A JP6123649B2 (ja) 2013-11-19 2013-11-19 アッシング装置および被処理物保持構造体

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