WO2015076030A1 - Ashing device and object-to-be-treated holding structure - Google Patents

Ashing device and object-to-be-treated holding structure Download PDF

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Publication number
WO2015076030A1
WO2015076030A1 PCT/JP2014/076688 JP2014076688W WO2015076030A1 WO 2015076030 A1 WO2015076030 A1 WO 2015076030A1 JP 2014076688 W JP2014076688 W JP 2014076688W WO 2015076030 A1 WO2015076030 A1 WO 2015076030A1
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Prior art keywords
processed
light
processing
treated
processing gas
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PCT/JP2014/076688
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French (fr)
Japanese (ja)
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村上 哲也
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ウシオ電機株式会社
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Publication of WO2015076030A1 publication Critical patent/WO2015076030A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67115Apparatus for thermal treatment mainly by radiation

Definitions

  • the present invention relates to an ashing apparatus for processing an object to be processed having both surfaces to be processed, such as a multilayer wiring board material, using vacuum ultraviolet rays, and an object holding structure suitably used in the ashing apparatus.
  • an ashing apparatus for processing an object to be processed having both surfaces to be processed, such as a multilayer wiring board material, using vacuum ultraviolet rays, and an object holding structure suitably used in the ashing apparatus.
  • a dry cleaning method using ultraviolet rays is known as a method of performing a desmear (smear removal) process in a substrate manufacturing process.
  • a method using active oxygen such as ozone generated by vacuum ultraviolet rays radiated from an excimer lamp is suitably used because a predetermined treatment can be performed more efficiently and in a short time.
  • Patent Document 1 describes that in dry desmear processing, organic substances are decomposed and removed using active species (active oxygen atoms) decomposed and generated from ozone. Further, it is described that it is preferable to use ozone treatment utilizing the action of ozone and active species and ultraviolet irradiation treatment in combination for decomposition and removal of organic substances.
  • active species active oxygen atoms
  • the vacuum ultraviolet rays from the light source are absorbed by oxygen, when the oxygen concentration of the active species source is increased, the amount of ultraviolet rays absorbed by the active species source increases. Therefore, in order to suppress a decrease in the amount of ultraviolet rays reaching the surface to be processed, it is necessary to reduce the irradiation distance between the ultraviolet light source and the object to be processed.
  • the processing time of the object to be processed is shortened by simultaneously ashing both surfaces of the object to be processed. It is possible.
  • the present invention has been made based on the above circumstances, and an ashing device capable of performing an ashing process on an object to be processed with high processing efficiency and an object holding structure suitably used in the ashing apparatus.
  • the purpose is to provide a body.
  • the ashing device of the present invention includes a pair of light transmission windows facing each of the surfaces to be processed of a plate-like object whose one surface and the other surface are processed surfaces, and each of the surfaces to be processed.
  • a pair of ultraviolet irradiation units including an ultraviolet light source that irradiates vacuum ultraviolet rays through the light transmission window;
  • a frame-shaped holding member that holds the periphery of the object to be processed is sandwiched and held by a housing in the pair of ultraviolet irradiation units, so that the object to be processed is provided on one surface side and the other surface side of the object to be processed.
  • a processing space formed by a gap having a predetermined size formed between a surface to be processed of the object and a light emitting surface of the light transmission window, and a light source arrangement space in which the ultraviolet light source is disposed are the light transmission window. Formed in an airtight manner, and The inside of the light source arrangement space is an inert gas atmosphere, and a processing gas containing an activated species source activated by vacuum ultraviolet light from the ultraviolet light source is circulated in the processing space. To do.
  • each of the pair of ultraviolet irradiation units includes a housing that is open on one side,
  • Each of the light transmissive windows is configured by a plate-like light transmissive window member that is airtightly held at a position on the inner side of the opening edge of the housing.
  • each of the light transmitting windows is configured by a plate-like light transmitting window member held by a holding member that holds an object to be processed. May have a configuration in which a processing gas distribution opening for distributing the processing gas in the processing space is formed.
  • the workpiece holding structure of the present invention is for light irradiation treatment, A pair of plate-like lights disposed on the plate-like object to be processed and on the one surface side and the other surface side of the object to be processed so as to face the one surface and the other surface with a gap of a predetermined size, respectively.
  • a transparent window member, and a common frame-shaped holding member that holds the periphery of the object to be processed and the pair of light-transmissive window members, and each of the gaps includes the holding member.
  • a processing gas distribution opening for allowing the processing gas to flow therethrough is formed.
  • the ashing device is configured to simultaneously process each of the processing surfaces of a plate-shaped processing object whose both surfaces are processing surfaces.
  • a processing space through which the processing gas is circulated and a light source arrangement space that is an inert gas atmosphere, which are airtightly partitioned by a window, constitute a substantially sealed space.
  • the degree of decrease in the amount of vacuum ultraviolet light from the ultraviolet light source can be suppressed to a small level, and the atmosphere of the processing space can be kept substantially constant by the processing gas being circulated. Therefore, according to the ashing device of the present invention, it is possible to increase the amount of vacuum ultraviolet light that contributes to the processing of the object to be processed, and to stably generate active species, thereby reliably processing the active species. Since it can contribute to the processing of the object, the desired ashing process can be performed efficiently.
  • the light-exiting surface of the light-transmitting window member is used for simultaneously processing each of the surfaces to be processed of the flat plate-like object having both surfaces to be processed. Since the atmosphere in the processing space formed by maintaining the state where the surface of the object to be processed and the surface to be processed are in close proximity can be maintained substantially constant, the desired light irradiation process can be performed efficiently and in a short time An object-holding structure that can handle the above is provided.
  • the ashing device is configured so that vacuum ultraviolet light having a wavelength of 220 nm or less from an ultraviolet irradiation unit is irradiated to a surface to be processed through a light transmission window.
  • a transmission window is provided on the ultraviolet irradiation unit side.
  • FIG. 1 is a cross-sectional view schematically showing the configuration of an example of an ashing device according to the first embodiment of the present invention.
  • This ashing apparatus simultaneously processes each of the processing surfaces 12 and 13 of a plate-shaped processing object 11 whose one surface and the other surface are processing surfaces, and the processing object 11 A conveying means (not shown) is provided that conveys (four rounds) with the holding member 15 having a rectangular frame shape, for example.
  • the object to be processed 11 is conveyed in a direction (in a direction perpendicular to the paper surface in FIG. 1) along the surface direction of the surfaces 12 and 13 to be processed while being suspended.
  • the flat light transmissive window member 40a (40b) constituting the light transmissive window is located at a position on the inner side of the opening edge of the casing 21a (21b) in the ultraviolet irradiation unit 20a (20b).
  • the light source arrangement space S1 constituting the sealed space is formed in the housing 21a (21b).
  • an ultraviolet radiation lamp 35 that is long in one direction and that constitutes the ultraviolet light source is arranged with the lamp central axis extending in the vertical direction.
  • the ultraviolet radiation lamp 35 for example, a rectangular lamp having a flat cross-sectional shape by a cross section perpendicular to the longitudinal direction can be used.
  • the number of the ultraviolet radiation lamps 35 is not particularly limited, and can be appropriately set according to the purpose. For example, when a plurality of ultraviolet radiation lamps 35 are used, each lamp central axis is arranged in a state where it is located in the same vertical plane parallel to the processing surfaces 12 and 13 of the processing object 11. .
  • Examples of the ultraviolet radiation lamp 35 include a low-pressure mercury lamp that emits ultraviolet light having a peak at a wavelength of 185 nm, a deuterium lamp that emits ultraviolet light having a wavelength of 180 to 370 nm, and a xenon excimer lamp that emits vacuum ultraviolet light having a center wavelength of 172 nm. Can be used. Among these, it is preferable to use a xenon excimer lamp because the intensity of vacuum ultraviolet rays is high and active species can be generated efficiently.
  • the housing 21a (21b) in the ultraviolet irradiation unit 20a (20b) has a housing main body 22a (22b) that is open on one side, and the end surfaces are in contact with each other on the opening side of the housing main body 22a (22b). It is comprised by the frame-shaped window holding body 25a (25b) provided integrally.
  • An endless seal member 30 made of, for example, an O-ring is provided over the entire circumference of the opening end surface of the housing 21a (21b).
  • the casing main body 22a (22b) has an inert gas supply through-hole 23a and an inert gas discharge through-hole 23b in each of a pair of opposed peripheral walls positioned in the lamp central axis direction. It is formed to extend along the direction.
  • the window holder 25a (25b) has a window member holding portion 26 formed by a stepped portion, and the light transmissive window member 40a (40b) has a light exit surface 42a (42b) to be processed of the object 11 to be processed.
  • the peripheral edge portion of the light incident surface 41a (41b) is supported by the window member holding portion 26 and is airtightly fixed.
  • the projecting edge portions 27 projecting outward from the light exit surface 42a (42b) of the light transmissive window member 40a (40b) in the window holder 25a (25b) are mutually positioned in the lamp central axis direction.
  • a processing gas supply through hole 28a and a processing gas discharge through hole 28b are formed in each of the opposed peripheral walls so as to extend along the lamp central axis direction. An opening is formed.
  • any material can be used as long as it can transmit the vacuum ultraviolet rays from the ultraviolet radiation lamp 35.
  • quartz glass can be used.
  • the thickness of the light transmissive window members 40a and 40b is, for example, 3 to 7 mm.
  • This ashing apparatus supplies a processing gas containing an activated species source activated by vacuum ultraviolet rays from an ultraviolet radiation lamp 35 into a processing space to be described later via a processing gas supply through hole 28a.
  • Active species source supply means (not shown) is provided.
  • the processing gas supplied by the active species source supply means for example, oxygen gas, a mixed gas in which ozone is mixed with oxygen gas, water vapor, or the like can be used.
  • OH radicals hydroxyl radicals
  • the oxygen concentration in the processing gas is preferably 50% by volume or more, for example.
  • this ashing device is a driving means for moving each of the ultraviolet irradiation units 20a and 20b in a direction away from and a direction approaching the conveyance path of the workpiece 11 (indicated by a white arrow in FIG. 1). (Not shown).
  • a plurality of insulating layers and a plurality of wiring layers are alternately laminated, and one or a plurality of insulating layers have via holes or through holes for electrical connection between the wiring layers.
  • a multilayer wiring board material formed so as to extend through in the thickness direction can be exemplified.
  • Such a multilayer wiring board material usually has a smear (residue) due to the material constituting the insulating layer or the conductive layer, which is inevitably generated when forming a via hole or a through hole.
  • the object to be processed 11 held by the holding member 15 is transported along the transport path by the transport means and arranged at a predetermined position. Then, each of the pair of ultraviolet irradiation units 20a and 20b is sequentially moved in the direction approaching the workpiece 11 by the driving means, and as shown in FIG. 2, the holding member 15 and each ultraviolet irradiation unit 20a. , 20b with the end faces of the casings 21a, 21b in contact with each other via the seal members 30, 30, the holding member 15 is held and held by the casings 21a, 21b of the respective ultraviolet irradiation units 20a, 20b. Is done.
  • the working space S2 is formed, and the processing surface 12 (13) of the processing object 11 and the light emitting surface 42a (42b) of the light transmissive window member 40a (40b) are arranged close to each other.
  • the distance d between the treated surface 12 (13) of the workpiece 11 and the light emitting surface 42a (42b) of the light transmissive window member 40a (40b) is, for example, 3 mm or less, preferably 1 mm. It is as follows.
  • an inert gas such as nitrogen gas (indicated by a broken arrow in FIG. 2) is inactivated by an inert gas supply means (not shown) in the light source arrangement space S1 in the ultraviolet irradiation unit 20a (20b).
  • the inert gas is supplied through the active gas supply through hole 23a, and the inert gas is circulated in the light source arrangement space S1, whereby the atmosphere in the light source arrangement space S1 is replaced with the inert gas atmosphere.
  • the active species source supplying means supplies the processing space S2 by the gap between the processing surface 12 (13) of the processing object 11 and the light emitting surface 42a (42b) of the light transmissive window member 40a (40b).
  • a processing gas having an oxygen concentration of 50% by volume or more is supplied through the processing gas supply through hole 28a.
  • the processing gas is circulated in the processing space S2 along the processing surface 12 (13) of the processing object 11 and the light emitting surface 42a (42b) of the light transmissive window member 40a (40b), and the processing gas. It is discharged from the discharge through hole 28b.
  • the illuminance of the ultraviolet rays irradiated to the object 11 is, for example, 10 to 200 mW / cm 2 .
  • the ultraviolet irradiation time for the object 11 is appropriately set in consideration of the illuminance of ultraviolet rays, the residual state of smear, and the like, for example, 50 to 300 seconds.
  • the ashing process is performed while the inert gas and the processing gas are continuously supplied.
  • each of the processing surfaces 12 and 13 of the processing object 11 is processed at the same time.
  • the light source arrangement space S1 that is an inert gas atmosphere and the processing space S2 in which the processing gas is circulated, hermetically partitioned by the member 40a (40b), constitutes a substantially sealed space. Accordingly, the degree of decrease in the amount of vacuum ultraviolet light from the ultraviolet radiation lamp 35 can be suppressed to a small level, and the atmosphere of the processing space S2 can be kept substantially constant by the processing gas being circulated. .
  • the amount of vacuum ultraviolet light contributing to the ashing process of the workpiece 11 can be increased, and active species (oxygen radicals) can be stably generated. Since the active species can surely contribute to the ashing process of the workpiece 11, the intended ashing process can be performed efficiently and in a short time. Further, since the object 11 is processed in a vertical posture, it is possible to prevent the object 11 from being bent due to its own weight and to perform uniform processing.
  • the ashing device has a configuration in which vacuum ultraviolet light having a wavelength of 220 nm or less from an ultraviolet irradiation unit is irradiated to a surface to be processed through a light transmission window.
  • a transmission window is provided on the workpiece side.
  • FIG. 3 is a cross-sectional view schematically showing the configuration of an example of the ashing device according to the second embodiment of the present invention.
  • the ashing apparatus is for processing each of the processing surfaces 12 and 13 of a flat plate-like object 11 whose one surface and the other surface are processing surfaces, and includes the object 11 to be processed.
  • Conveying means (not shown) for conveying the workpiece holding structure 10 is provided.
  • the workpiece holding structure 10 is in a suspended state in a direction along the surface direction of the workpiece surfaces 12 and 13 of the workpiece 11 (in FIG. 3, a direction perpendicular to the paper surface). It is conveyed to.
  • the workpiece holding structure 10 has a plate-like workpiece 11 and a predetermined size on each of the workpiece surfaces 12 and 13 of the workpiece 11 on one side and the other side of the workpiece 11.
  • a pair of flat light-transmitting window members 40a and 40b disposed in parallel with each other through a gap d, and the workpiece 11 and the pair of light-transmitting window members 40a and 40b are held.
  • a common frame-shaped holding member 15a On the one surface side and the other surface side of the object to be processed 11, the surface to be processed 12 (13) of the object to be processed 11 and the light emitting surface 42 a (42 b) of the light transmissive window member 40 a (40 b) constituting the sealed space.
  • a processing space S ⁇ b> 2 is formed by a gap between them.
  • the holding member 15a is formed with a processing gas distribution opening for distributing a processing gas containing an active species source activated by vacuum ultraviolet rays from the ultraviolet radiation lamp 35 to the processing space S2.
  • the holding member 15a includes a base body 16 made of a rectangular frame body and a cover made of a U-shaped frame body integrally provided in an embedded state on the inner surface side of the base body 16.
  • the workpiece holder 17 is constituted.
  • process gas is introduce
  • An opening 18 constituting the processing gas distribution opening is formed to extend in the longitudinal direction of the peripheral wall (a direction perpendicular to the paper surface in FIG. 3).
  • the object to be processed 11 is fixed by holding the three sides around the object to be processed by the object holder 17, and each of the light transmissive window members 40 a and 40 b is held by the base 16 at the periphery (four sides). Has been fixed.
  • a material constituting the base 16 in the holding member 15a for example, a metal material such as aluminum, stainless steel, or copper can be used.
  • resin materials such as fluorine resins, such as Teflon (trademark), and PEEK (polyetheretherketone) resin, can be used, for example.
  • the workpiece holder 17 is made of a resin material, the workpiece holder 17 can function as a scratch prevention material or a buffer material for the workpiece 11.
  • a pair of ultraviolet irradiation units 20a and 20b are arranged opposite to each other on both sides of the conveyance path of the workpiece holding structure 10.
  • Each of the ultraviolet irradiation units 20a (20b) is configured by a casing 21a (21b) that is open at one side (conveyance path direction) and an ultraviolet light source disposed inside the casing 21a (21b).
  • the ultraviolet light source has the same configuration as the ultraviolet light source in the ashing device according to the first embodiment, and is configured by one or a plurality of rod-shaped ultraviolet radiation lamps 35.
  • the casing 21a (21b) has an inert gas supply through-hole 23a and an inert gas discharge through-hole 23b in each of a pair of opposed peripheral walls positioned in the lamp central axis direction, in the lamp central axis direction. It is formed to extend along.
  • an endless seal member 30 made of, for example, an O-ring is provided on the open end surface of the casing 21a (21b) over the entire circumference of the open end surface.
  • This ashing device includes active species source supply means (not shown) for supplying the processing gas into the processing space S2 in the workpiece holding structure 10.
  • the active species source supply means has the same configuration as the active species source supply means in the ashing device according to the first embodiment.
  • the ashing apparatus moves each of the ultraviolet irradiation units 20a and 20b in a direction away from and a direction approaching the conveyance path of the workpiece holding structure 10 (indicated by white arrows in FIG. 3).
  • Driving means (not shown) to be provided.
  • the workpiece holding structure 10 is transported along the transport path by the transport means and arranged at a predetermined position. Then, each of the pair of ultraviolet irradiation units 20a and 20b is sequentially moved in the direction of approaching the workpiece holding structure 10 by the driving means, so that the workpiece holding structure 10 as shown in FIG. In the state in which the end surfaces of the holding members 15a and the housings 21a and 21b of the respective ultraviolet irradiation units 20a and 20b are in contact with each other via the seal members 30 and 30, the workpiece holding structure 10 is irradiated with the respective ultraviolet rays. The units 20a and 20b are sandwiched and held by the casings 21a and 21b.
  • the light source arrangement space S1 constituting the sealed space which is hermetically partitioned by the processing space S2 and the light transmissive window members 40a and 40b in the workpiece holding structure 10, is a housing in the ultraviolet irradiation units 20a and 20b. It is formed inside 21a, 21b.
  • an inert gas such as nitrogen gas (indicated by a dashed arrow in FIG. 4) is inactivated by an inert gas supply means (not shown) in the light source arrangement space S1 in the ultraviolet irradiation unit 20a (20b).
  • the inert gas is supplied through the active gas supply through hole 23a, and the inert gas is circulated in the light source arrangement space S1, whereby the atmosphere in the light source arrangement space S1 is replaced with the inert gas atmosphere.
  • a processing gas having an oxygen concentration of 50% by volume or more is opened 18 in the processing space S2 in the workpiece holding structure 10 by the active species source supply means. Is supplied through.
  • each ultraviolet irradiation unit 20a (20b) is turned on, so that the vacuum ultraviolet light from the ultraviolet radiation lamp 35 is applied to the object 11 to be processed via the light transmissive window member 40a (40b). Irradiation is directed toward the processing surface 12 (13).
  • vacuum ultraviolet rays that reach the surface 12 (13) of the object 11 to be processed, and ozone and active species (oxygen radicals) that are generated by irradiating the processing gas with the vacuum ultraviolet rays are processed. Smear formed on the processing surfaces 12 and 13 of the object 11 is decomposed and removed.
  • the light emitting surface 42a (42b) of the light transmissive window member 40a (40b) and the workpiece 12 of the workpiece 11 (13) are close to each other.
  • the atmosphere in the processing space S2 can be kept substantially constant by the processing gas flowing through the processing space S2 formed in such a state. For this reason, it is possible to stably generate active species (oxygen radicals) by irradiating the processing gas with the vacuum ultraviolet rays from the ultraviolet radiation lamp 35, and the workpiece holding structure 10 itself can be The ashing process can be efficiently performed in a short time.
  • the ashing device having the above-described configuration for performing the ashing process on the workpiece in the workpiece holding structure 10 is formed with the light transmissive window member 40a (
  • the light source arrangement space S1 that is an inert gas atmosphere and the processing space S2 through which the processing gas is circulated in an airtight manner by 40b) constitutes a substantially sealed space. Accordingly, the degree of decrease in the amount of vacuum ultraviolet light from the ultraviolet radiation lamp 35 can be suppressed to a small level, and the atmosphere of the processing space S2 can be kept substantially constant by the processing gas being circulated. .
  • the amount of vacuum ultraviolet light that contributes to the ashing process of the workpiece 11 can be increased, and the generated active species can be surely contributed to the ashing process of the workpiece 11. Therefore, the desired ashing process can be performed efficiently and in a short time.
  • the to-be-processed surfaces 12 and 13 of the to-be-processed object 11 are covered by the light transmissive window members 40a and 40b, the to-be-processed object 11 is damaged, for example at the time of conveyance of the to-be-processed object holding structure 10. Can be prevented. Further, since the object 11 is processed in a vertical posture, it is possible to prevent the object 11 from being bent due to its own weight and to perform uniform processing.
  • the window holding body that holds the light transmissive window member may be formed integrally with the housing body.
  • the ashing process is performed in a state where the temperature of the surface to be processed of the object to be processed is raised.
  • the heating means for heating the surface to be processed of the object to be processed is disposed at a position upstream of the light irradiation processing region by the ultraviolet irradiation unit in the conveyance path of the object to be processed or the object holding structure. It can be set as the structure made. According to such a configuration, the action of ozone and active species can be promoted as the temperature of the surface to be processed of the object to be processed increases, so that the ashing process can be performed with higher efficiency. .
  • a heating means may be provided in the workpiece holding structure to raise the temperature of the workpiece surface of the workpiece. Furthermore, the same effect can be obtained even if the temperature of the surface to be processed of the object to be processed is increased by circulating the processing space in a state where the temperature of the processing gas is raised by heating. .
  • the heating condition is preferably such that the temperature of the surface to be processed of the object to be processed is, for example, 80 ° C. or higher and 340 ° C. or lower, more preferably the temperature of the surface to be processed of the object to be processed is 80 ° C.
  • the conditions are 200 ° C. or lower.
  • the ashing device of the present invention can be configured to be provided with physical vibration processing means for applying physical vibration to the workpiece during the light irradiation process.
  • the active species generated in the processing space can be easily supplied into, for example, a via hole or a through hole in the wiring board material, so that the ashing process can be performed more reliably.
  • the ashing device of the present invention is not only for removing smears such as multilayer wiring boards, but also for example, from the surface of a substrate in the manufacturing process of a substrate such as a semiconductor substrate or a liquid crystal panel, or a dry cleaning treatment of a template surface in a nanoimprinting device. It can be used for various ashing processes such as a process for removing the resist and a process for removing the resist residue attached to the substrate on which the resist removal process has been performed.

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Abstract

The purpose of the present invention is to provide an ashing device capable of efficiently performing ashing treatment on an object to be treated, and an object-to-be-treated holding structure. An ashing device, wherein by putting and holding a frame-shaped holding member for holding the periphery of a plate-shaped object to be treated having both surfaces as surfaces to be treated between casings of a pair of ultraviolet irradiation units each provided with an ultraviolet light source for irradiation with vacuum ultraviolet light, on each of one surface side and the other surface side of the object to be treated, a treatment space through which treatment gas containing an active species source to be activated by the vacuum ultraviolet light flows, and a light source disposition space which is under an inert gas atmosphere are formed, the spaces being airtightly demarcated from each other by a light transmission window disposed to face the surface to be treated with a gap having a predetermined size therebeetween. An object-to-be-treated holding structure is configured by holding a flat plate-shaped object to be treated and flat-shaped light transmissive window members disposed on one surface side and the other end side of the object to be treated so as to face the object to be treated with a gap having a predetermined size therebetween by a common frame-shaped holding member.

Description

アッシング装置および被処理物保持構造体Ashing apparatus and workpiece holding structure
 本発明は、例えば、多層配線基板材料などの、両面に被処理面を有する被処理物を、真空紫外線を利用して処理するアッシング装置および当該アッシング装置において好適に用いられる被処理物保持構造体に関する。 The present invention relates to an ashing apparatus for processing an object to be processed having both surfaces to be processed, such as a multilayer wiring board material, using vacuum ultraviolet rays, and an object holding structure suitably used in the ashing apparatus. About.
 現在、例えば、基板製造工程におけるデスミア(スミアの除去)処理を行う方法として、紫外線を用いたドライ洗浄方法が知られている。特に、エキシマランプから放射される真空紫外線により生成されるオゾン等の活性酸素を利用した方法は、より効率良く短時間で所定の処理を行うことができることから、好適に利用されている。 Currently, for example, a dry cleaning method using ultraviolet rays is known as a method of performing a desmear (smear removal) process in a substrate manufacturing process. In particular, a method using active oxygen such as ozone generated by vacuum ultraviolet rays radiated from an excimer lamp is suitably used because a predetermined treatment can be performed more efficiently and in a short time.
 例えば、特許文献1には、ドライデスミア処理において、オゾンから分解発生した活性種(活性酸素原子)を利用して有機物の分解、除去が行われることが記載されている。また、有機物の分解、除去にあっては、オゾンおよび活性種の作用を利用したオゾン処理と、紫外線照射処理とを併用することが好ましいことが記載されている。 For example, Patent Document 1 describes that in dry desmear processing, organic substances are decomposed and removed using active species (active oxygen atoms) decomposed and generated from ozone. Further, it is described that it is preferable to use ozone treatment utilizing the action of ozone and active species and ultraviolet irradiation treatment in combination for decomposition and removal of organic substances.
特開平8-180757号公報JP-A-8-180757
 近年、基板製造工程におけるデスミア処理においては、被処理物の処理時間の短縮化が要望されている。
 このような要請に対して、上記のような活性種を利用した処理方法にあっては、被処理物の処理に寄与する活性種の量を増加させれば、被処理物の処理時間の短縮化することができる。活性種は、通常、真空紫外線を所定濃度の酸素を含む処理用ガスに照射して発生させており、従って、活性種の量を増加させるためには、高濃度の酸素を含む処理用ガスを活性種源として供給することが考えられる。
 しかしながら、光源からの真空紫外線は酸素に吸収されるものであることから、活性種源の酸素濃度を高くすると、活性種源に吸収される紫外線量が大きくなる。従って、被処理面に到達する紫外線量が減少することを抑制するために、紫外線光源と被処理物との照射距離を小さくすることが必要とされる。
In recent years, in the desmear process in the substrate manufacturing process, there is a demand for shortening the processing time of an object to be processed.
In response to such a request, in the processing method using active species as described above, if the amount of active species contributing to the processing of the object to be processed is increased, the processing time of the object to be processed is shortened. Can be The active species are usually generated by irradiating a processing gas containing a predetermined concentration of oxygen with vacuum ultraviolet rays. Therefore, in order to increase the amount of active species, a processing gas containing a high concentration of oxygen is used. Supplying as an active species source is conceivable.
However, since the vacuum ultraviolet rays from the light source are absorbed by oxygen, when the oxygen concentration of the active species source is increased, the amount of ultraviolet rays absorbed by the active species source increases. Therefore, in order to suppress a decrease in the amount of ultraviolet rays reaching the surface to be processed, it is necessary to reduce the irradiation distance between the ultraviolet light source and the object to be processed.
 また、例えば多層配線基板材料などの、両面に被処理面を有する被処理物を処理する場合には、被処理物の両面を同時にアッシング処理することにより、被処理物の処理時間を短縮化することが考えられる。 Further, when processing an object to be processed having both surfaces to be processed, such as a multilayer wiring board material, the processing time of the object to be processed is shortened by simultaneously ashing both surfaces of the object to be processed. It is possible.
 本発明は、以上のような事情に基づいてなされたものであって、被処理物に対するアッシング処理を高い処理効率で行うことができるアッシング装置および当該アッシング装置において好適に用いられる被処理物保持構造体を提供することを目的とする。 The present invention has been made based on the above circumstances, and an ashing device capable of performing an ashing process on an object to be processed with high processing efficiency and an object holding structure suitably used in the ashing apparatus. The purpose is to provide a body.
 本発明のアッシング装置は、一面および他面が被処理面とされた板状の被処理物の当該被処理面の各々にそれぞれ対向する一対の光透過窓と、前記被処理面の各々にそれぞれ前記光透過窓を介して真空紫外線を照射する紫外線光源を備えた一対の紫外線照射ユニットとを備えてなり、
 前記被処理物の周囲を保持する枠状の保持部材が前記一対の紫外線照射ユニットにおける筐体によって挟持されて保持されることにより、当該被処理物の一面側および他面側において、前記被処理物の被処理面と前記光透過窓の光出射面との間に形成される所定の大きさの間隙による処理用空間と、前記紫外線光源が配置された光源配置空間とが、前記光透過窓によって気密に区画された状態で、形成され、
 当該光源配置空間内が不活性ガス雰囲気とされると共に、当該処理用空間内に、前記紫外線光源からの真空紫外線によって活性化される活性種源を含む処理用ガスが流通されることを特徴とする。
The ashing device of the present invention includes a pair of light transmission windows facing each of the surfaces to be processed of a plate-like object whose one surface and the other surface are processed surfaces, and each of the surfaces to be processed. A pair of ultraviolet irradiation units including an ultraviolet light source that irradiates vacuum ultraviolet rays through the light transmission window;
A frame-shaped holding member that holds the periphery of the object to be processed is sandwiched and held by a housing in the pair of ultraviolet irradiation units, so that the object to be processed is provided on one surface side and the other surface side of the object to be processed. A processing space formed by a gap having a predetermined size formed between a surface to be processed of the object and a light emitting surface of the light transmission window, and a light source arrangement space in which the ultraviolet light source is disposed are the light transmission window. Formed in an airtight manner, and
The inside of the light source arrangement space is an inert gas atmosphere, and a processing gas containing an activated species source activated by vacuum ultraviolet light from the ultraviolet light source is circulated in the processing space. To do.
 本発明のアッシング装置においては、前記一対の紫外線照射ユニットは、各々一方が開口する筐体を備えており、
 前記光透過窓の各々は、前記筐体の開口端縁より内方側の位置において気密に保持された板状の光透過性窓部材により構成されており、
 当該筐体の各々における当該光透過性窓部材より外方側に突出する突出縁部分には、前記処理用空間に処理用ガスを流通させるための処理用ガス流通用開口部が形成された構成とすることができる。
In the ashing device of the present invention, each of the pair of ultraviolet irradiation units includes a housing that is open on one side,
Each of the light transmissive windows is configured by a plate-like light transmissive window member that is airtightly held at a position on the inner side of the opening edge of the housing.
A configuration in which a processing gas flow opening for flowing a processing gas in the processing space is formed at a protruding edge portion protruding outward from the light transmissive window member in each of the casings. It can be.
 また、本発明のアッシング装置においては、前記光透過窓の各々は、それぞれ、被処理物を保持する保持部材によって保持された板状の光透過性窓部材により構成されており、当該保持部材には、前記処理用空間に処理用ガスを流通させるための処理用ガス流通用開口部が形成された構成とすることもできる。 In the ashing device of the present invention, each of the light transmitting windows is configured by a plate-like light transmitting window member held by a holding member that holds an object to be processed. May have a configuration in which a processing gas distribution opening for distributing the processing gas in the processing space is formed.
 本発明の被処理物保持構造体は、光照射処理用のものであって、
 板状の被処理物と、当該被処理物の一面側および他面側において、それぞれ、当該一面および他面と所定の大きさの間隙を介して対向して配置された一対の板状の光透過性窓部材と、当該被処理物および当該一対の光透過性窓部材の各々の周囲を保持する共通の枠状の保持部材とにより構成されており、当該保持部材には、前記間隙の各々に処理用ガスを流通させるための処理用ガス流通用開口部が形成されていることを特徴とする。
The workpiece holding structure of the present invention is for light irradiation treatment,
A pair of plate-like lights disposed on the plate-like object to be processed and on the one surface side and the other surface side of the object to be processed so as to face the one surface and the other surface with a gap of a predetermined size, respectively. A transparent window member, and a common frame-shaped holding member that holds the periphery of the object to be processed and the pair of light-transmissive window members, and each of the gaps includes the holding member. A processing gas distribution opening for allowing the processing gas to flow therethrough is formed.
 本発明のアッシング装置は、両面が被処理面とされた板状の被処理物の当該被処理面の各々を同時に処理するものにおいて、被処理物の処理を行うに際して形成される、互いに光透過窓によって気密に区画された、処理用ガスが流通される処理用空間および不活性ガス雰囲気とされる光源配置空間が、実質的に密閉された空間を構成する。このため、紫外線光源からの真空紫外線の光量の低下の程度を小さく抑制することができると共に、処理用ガスが流通されることによって処理用空間の雰囲気を略一定に保持することができる。従って、本発明のアッシング装置によれば、被処理物の処理に寄与する真空紫外線の光量を増加させることができると共に活性種を安定して生成することができて当該活性種を確実に被処理物の処理に寄与させることができるため、所期のアッシング処理を効率よく行うことができる。 The ashing device according to the present invention is configured to simultaneously process each of the processing surfaces of a plate-shaped processing object whose both surfaces are processing surfaces. A processing space through which the processing gas is circulated and a light source arrangement space that is an inert gas atmosphere, which are airtightly partitioned by a window, constitute a substantially sealed space. For this reason, the degree of decrease in the amount of vacuum ultraviolet light from the ultraviolet light source can be suppressed to a small level, and the atmosphere of the processing space can be kept substantially constant by the processing gas being circulated. Therefore, according to the ashing device of the present invention, it is possible to increase the amount of vacuum ultraviolet light that contributes to the processing of the object to be processed, and to stably generate active species, thereby reliably processing the active species. Since it can contribute to the processing of the object, the desired ashing process can be performed efficiently.
 本発明の被処理物保持構造体によれば、両面が被処理面とされた平板状の被処理物の当該被処理面の各々を同時に処理するものにおいて、光透過性窓部材の光出射面と被処理物の被処理面が近接した状態が保持されて形成された処理用空間内の雰囲気を略一定に保持することができるので、所期の光照射処理を効率よく短時間で行うことができる被処理物保持構造体が提供される。 According to the object-holding structure of the present invention, the light-exiting surface of the light-transmitting window member is used for simultaneously processing each of the surfaces to be processed of the flat plate-like object having both surfaces to be processed. Since the atmosphere in the processing space formed by maintaining the state where the surface of the object to be processed and the surface to be processed are in close proximity can be maintained substantially constant, the desired light irradiation process can be performed efficiently and in a short time An object-holding structure that can handle the above is provided.
本発明の第1の実施の形態に係るアッシング装置の一例における構成の概略を示す断面図である。It is sectional drawing which shows the outline of a structure in an example of the ashing apparatus which concerns on the 1st Embodiment of this invention. 図1に示すアッシング装置の動作状態を示す断面図である。It is sectional drawing which shows the operation state of the ashing apparatus shown in FIG. 本発明の第2の実施の形態に係るアッシング装置の一例における構成の概略を示す断面図である。It is sectional drawing which shows the outline of a structure in an example of the ashing apparatus which concerns on the 2nd Embodiment of this invention. 図3に示すアッシング装置の動作状態を示す断面図である。It is sectional drawing which shows the operation state of the ashing apparatus shown in FIG.
 以下、本発明の実施の形態について詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail.
〔第1の実施の形態〕
 本発明の第1の実施の形態に係るアッシング装置は、紫外線照射ユニットからの波長220nm以下の真空紫外線が光透過窓を介して被処理物の被処理面に照射される構成のものにおいて、光透過窓が紫外線照射ユニット側に設けられてなるものである。
[First Embodiment]
The ashing device according to the first embodiment of the present invention is configured so that vacuum ultraviolet light having a wavelength of 220 nm or less from an ultraviolet irradiation unit is irradiated to a surface to be processed through a light transmission window. A transmission window is provided on the ultraviolet irradiation unit side.
 図1は、本発明の第1の実施の形態に係るアッシング装置の一例における構成の概略を示す断面図である。
 このアッシング装置は、一面および他面が被処理面とされた平板状の被処理物11の当該被処理面12,13の各々を同時に処理するものであって、被処理物11を、その周囲(四周)が例えば矩形枠状の保持部材15によって保持された状態で、搬送する搬送手段(図示せず)を備えている。この例においては、被処理物11は、垂立された状態で、被処理面12,13の面方向に沿った方向(図1において紙面に垂直な方向)に搬送される。
FIG. 1 is a cross-sectional view schematically showing the configuration of an example of an ashing device according to the first embodiment of the present invention.
This ashing apparatus simultaneously processes each of the processing surfaces 12 and 13 of a plate-shaped processing object 11 whose one surface and the other surface are processing surfaces, and the processing object 11 A conveying means (not shown) is provided that conveys (four rounds) with the holding member 15 having a rectangular frame shape, for example. In this example, the object to be processed 11 is conveyed in a direction (in a direction perpendicular to the paper surface in FIG. 1) along the surface direction of the surfaces 12 and 13 to be processed while being suspended.
 被処理物11の搬送路の両側には、各々一方が開口する筐体21a,21bを備えた一対の紫外線照射ユニット20a,20bが互いに対向して配置されている。
 この例においては、光透過窓を構成する平板状の光透過性窓部材40a(40b)が、紫外線照射ユニット20a(20b)における筐体21a(21b)の開口端縁より内方側の位置において気密に保持されており、これにより、密閉空間を構成する光源配置空間S1が筐体21a(21b)の内部に形成されている。
A pair of ultraviolet irradiation units 20a and 20b provided with housings 21a and 21b, one of which is open, are disposed opposite to each other on both sides of the conveyance path of the object 11 to be processed.
In this example, the flat light transmissive window member 40a (40b) constituting the light transmissive window is located at a position on the inner side of the opening edge of the casing 21a (21b) in the ultraviolet irradiation unit 20a (20b). Thus, the light source arrangement space S1 constituting the sealed space is formed in the housing 21a (21b).
 各々の紫外線照射ユニット20a,20bにおける光源配置空間S1の内部には、紫外線光源を構成する一方向に長尺な紫外線放射ランプ35が、ランプ中心軸が鉛直方向に延びる姿勢で、配置されている。紫外線放射ランプ35としては、例えば長手方向に垂直な断面による断面形状が扁平な矩形状のものを用いることができる。ここに、紫外線放射ランプ35の数は、特に限定されるものではなく、目的に応じて適宜に設定することができる。例えば複数本の紫外線放射ランプ35が用いられる場合には、各々のランプ中心軸が、被処理物11の被処理面12,13と平行な同一の垂直面内に位置された状態で配置される。 Inside the light source arrangement space S1 in each of the ultraviolet irradiation units 20a and 20b, an ultraviolet radiation lamp 35 that is long in one direction and that constitutes the ultraviolet light source is arranged with the lamp central axis extending in the vertical direction. . As the ultraviolet radiation lamp 35, for example, a rectangular lamp having a flat cross-sectional shape by a cross section perpendicular to the longitudinal direction can be used. Here, the number of the ultraviolet radiation lamps 35 is not particularly limited, and can be appropriately set according to the purpose. For example, when a plurality of ultraviolet radiation lamps 35 are used, each lamp central axis is arranged in a state where it is located in the same vertical plane parallel to the processing surfaces 12 and 13 of the processing object 11. .
 紫外線放射ランプ35としては、例えば、波長185nmにピークを有する紫外線を放射する低圧水銀ランプ、波長180~370nmの紫外線を放射する重水素ランプ、中心波長が172nmの真空紫外線を放射するキセノンエキシマランプを用いることができる。これらのうちでも、真空紫外線の強度が高く、活性種を効率よく生成することができることから、キセノンエキシマランプを用いることが好ましい。 Examples of the ultraviolet radiation lamp 35 include a low-pressure mercury lamp that emits ultraviolet light having a peak at a wavelength of 185 nm, a deuterium lamp that emits ultraviolet light having a wavelength of 180 to 370 nm, and a xenon excimer lamp that emits vacuum ultraviolet light having a center wavelength of 172 nm. Can be used. Among these, it is preferable to use a xenon excimer lamp because the intensity of vacuum ultraviolet rays is high and active species can be generated efficiently.
 紫外線照射ユニット20a(20b)における筐体21a(21b)は、一方が開口する筐体本体22a(22b)と、この筐体本体22a(22b)の開口側に端面同士が対接された状態で一体に設けられた枠状の窓保持体25a(25b)とにより構成されている。そして、筐体21a(21b)の開口端面には、例えばO-リングよりなる無端状のシール部材30が当該開口端面の全周にわたって設けられている。 The housing 21a (21b) in the ultraviolet irradiation unit 20a (20b) has a housing main body 22a (22b) that is open on one side, and the end surfaces are in contact with each other on the opening side of the housing main body 22a (22b). It is comprised by the frame-shaped window holding body 25a (25b) provided integrally. An endless seal member 30 made of, for example, an O-ring is provided over the entire circumference of the opening end surface of the housing 21a (21b).
 筐体本体22a(22b)には、ランプ中心軸方向に位置される互いに対向する一対の周壁の各々に、不活性ガス供給用貫通孔23aおよび不活性ガス排出用貫通孔23bが、ランプ中心軸方向に沿って延びるよう形成されている。 The casing main body 22a (22b) has an inert gas supply through-hole 23a and an inert gas discharge through-hole 23b in each of a pair of opposed peripheral walls positioned in the lamp central axis direction. It is formed to extend along the direction.
 窓保持体25a(25b)には、段部による窓部材保持部26が形成されており、光透過性窓部材40a(40b)は、光出射面42a(42b)が被処理物11の被処理面12(13)と平行に延びる姿勢で、光入射面41a(41b)における周縁部が窓部材保持部26によって支持されて気密に固定されている。
 また、窓保持体25a(25b)における光透過性窓部材40a(40b)の光出射面42a(42b)より外方側に突出する突出縁部分27には、ランプ中心軸方向に位置される互いに対向する一対の周壁の各々に、処理用ガス供給用貫通孔28aおよび処理用ガス排出用貫通孔28bが、ランプ中心軸方向に沿って延びるよう形成されており、これにより、処理用ガス流通用開口部が形成されている。
The window holder 25a (25b) has a window member holding portion 26 formed by a stepped portion, and the light transmissive window member 40a (40b) has a light exit surface 42a (42b) to be processed of the object 11 to be processed. In a posture extending in parallel with the surface 12 (13), the peripheral edge portion of the light incident surface 41a (41b) is supported by the window member holding portion 26 and is airtightly fixed.
Further, the projecting edge portions 27 projecting outward from the light exit surface 42a (42b) of the light transmissive window member 40a (40b) in the window holder 25a (25b) are mutually positioned in the lamp central axis direction. A processing gas supply through hole 28a and a processing gas discharge through hole 28b are formed in each of the opposed peripheral walls so as to extend along the lamp central axis direction. An opening is formed.
 光透過性窓部材40a,40bを構成する材料としては、紫外線放射ランプ35からの真空紫外線を透過し得るものであればよく、例えば石英ガラスを用いることができる。
 光透過性窓部材40a,40bの厚みは、例えば3~7mmである。
As a material constituting the light transmissive window members 40a and 40b, any material can be used as long as it can transmit the vacuum ultraviolet rays from the ultraviolet radiation lamp 35. For example, quartz glass can be used.
The thickness of the light transmissive window members 40a and 40b is, for example, 3 to 7 mm.
 このアッシング装置は、後述する処理用空間内に、紫外線放射ランプ35からの真空紫外線によって活性化される活性種源を含む処理用ガスを、処理用ガス供給用貫通孔28aを介して、供給する活性種源供給手段(図示せず)を備えている。
 活性種源供給手段により供給される処理用ガスとしては、例えば、酸素ガスまたは酸素ガスにオゾンが混合された混合ガス、水蒸気などを用いることができる。ここに、処理用ガスとして水蒸気を用いた場合には、活性種として、酸素ラジカルに加えて、水酸化ラジカル(OHラジカル)が生成される。
 処理用ガスにおける酸素濃度は、例えば50体積%以上であることが好ましい。酸素濃度が50体積%以上である処理用ガスが用いられることにより、真空紫外線によって生成されるオゾンおよび活性種(酸素ラジカル)の量を多くすることができて所期の処理を確実に行うことができる。
This ashing apparatus supplies a processing gas containing an activated species source activated by vacuum ultraviolet rays from an ultraviolet radiation lamp 35 into a processing space to be described later via a processing gas supply through hole 28a. Active species source supply means (not shown) is provided.
As the processing gas supplied by the active species source supply means, for example, oxygen gas, a mixed gas in which ozone is mixed with oxygen gas, water vapor, or the like can be used. Here, when water vapor is used as the processing gas, hydroxyl radicals (OH radicals) are generated as active species in addition to oxygen radicals.
The oxygen concentration in the processing gas is preferably 50% by volume or more, for example. By using a processing gas having an oxygen concentration of 50% by volume or more, the amount of ozone and active species (oxygen radicals) generated by vacuum ultraviolet rays can be increased, and the intended processing can be performed reliably. Can do.
 また、このアッシング装置は、紫外線照射ユニット20a,20bの各々を被処理物11の搬送路に対して離間する方向および接近する方向(図1において白抜きの矢印で示す。)に移動させる駆動手段(図示せず)を備えている。 Further, this ashing device is a driving means for moving each of the ultraviolet irradiation units 20a and 20b in a direction away from and a direction approaching the conveyance path of the workpiece 11 (indicated by a white arrow in FIG. 1). (Not shown).
 以上において、被処理物11としては、例えば、複数の絶縁層と複数の配線層が交互に積層されてなり、配線層間の電気的接続のためのビアホールやスルーホールが1つの若しくは複数の絶縁層を厚み方向に貫通して延びるよう形成された多層配線基板材料などを例示することができる。このような多層配線基板材料は、通常、ビアホールやスルーホールの形成に際して不可避的に生じる、絶縁層や導電層を構成する材料に起因するスミア(残渣)を有しているものである。 In the above, as the object 11 to be processed, for example, a plurality of insulating layers and a plurality of wiring layers are alternately laminated, and one or a plurality of insulating layers have via holes or through holes for electrical connection between the wiring layers. A multilayer wiring board material formed so as to extend through in the thickness direction can be exemplified. Such a multilayer wiring board material usually has a smear (residue) due to the material constituting the insulating layer or the conductive layer, which is inevitably generated when forming a via hole or a through hole.
 而して、上記のアッシング装置においては、保持部材15によって保持された被処理物11が搬送手段によって搬送路に沿って搬送されて所定の位置に配置される。そして、一対の紫外線照射ユニット20a,20bの各々が駆動手段によって被処理物11に接近する方向に順次に移動されることにより、図2に示すように、保持部材15と各々の紫外線照射ユニット20a,20bにおける筐体21a,21bの端面同士がシール部材30,30を介して対接された状態で、保持部材15が各々の紫外線照射ユニット20a,20bの筐体21a,21bによって挟持されて保持される。これにより、被処理物11の一面側および他面側において、紫外線放射ランプ35が配置された光源配置空間S1と光透過性窓部材40a,40bによって気密に区画された、密閉空間を構成する処理用空間S2が形成されると共に、被処理物11の被処理面12(13)と光透過性窓部材40a(40b)の光出射面42a(42b)とが近接して配置された状態とされる。ここに、被処理物11の被処理面12(13)と光透過性窓部材40a(40b)の光出射面42a(42b)との離間距離の大きさdは、例えば3mm以下、好ましくは1mm以下とされる。 Thus, in the above ashing apparatus, the object to be processed 11 held by the holding member 15 is transported along the transport path by the transport means and arranged at a predetermined position. Then, each of the pair of ultraviolet irradiation units 20a and 20b is sequentially moved in the direction approaching the workpiece 11 by the driving means, and as shown in FIG. 2, the holding member 15 and each ultraviolet irradiation unit 20a. , 20b with the end faces of the casings 21a, 21b in contact with each other via the seal members 30, 30, the holding member 15 is held and held by the casings 21a, 21b of the respective ultraviolet irradiation units 20a, 20b. Is done. As a result, on one side and the other side of the object 11 to be processed, a process for forming a sealed space that is airtightly partitioned by the light source arrangement space S1 in which the ultraviolet radiation lamp 35 is arranged and the light transmissive window members 40a and 40b. The working space S2 is formed, and the processing surface 12 (13) of the processing object 11 and the light emitting surface 42a (42b) of the light transmissive window member 40a (40b) are arranged close to each other. The Here, the distance d between the treated surface 12 (13) of the workpiece 11 and the light emitting surface 42a (42b) of the light transmissive window member 40a (40b) is, for example, 3 mm or less, preferably 1 mm. It is as follows.
 次いで、紫外線照射ユニット20a(20b)における光源配置空間S1内に、不活性ガス供給手段(図示せず)によって、例えば窒素ガスなどの不活性ガス(図2において破線の矢印で示す。)が不活性ガス供給用貫通孔23aを介して供給され、当該不活性ガスが光源配置空間S1内に流通されることにより光源配置空間S1内の雰囲気が不活性ガス雰囲気に置換される。一方、被処理物11の被処理面12(13)と光透過性窓部材40a(40b)の光出射面42a(42b)との間の間隙による処理用空間S2に、活性種源供給手段によって、例えば酸素濃度が50体積%以上である処理用ガス(図2において実線の矢印で示す。)が処理用ガス供給用貫通孔28aを介して供給される。処理用ガスは、被処理物11の被処理面12(13)および光透過性窓部材40a(40b)の光出射面42a(42b)に沿って処理用空間S2内を流通されて処理用ガス排出用貫通孔28bから排出される。 Next, an inert gas such as nitrogen gas (indicated by a broken arrow in FIG. 2) is inactivated by an inert gas supply means (not shown) in the light source arrangement space S1 in the ultraviolet irradiation unit 20a (20b). The inert gas is supplied through the active gas supply through hole 23a, and the inert gas is circulated in the light source arrangement space S1, whereby the atmosphere in the light source arrangement space S1 is replaced with the inert gas atmosphere. On the other hand, the active species source supplying means supplies the processing space S2 by the gap between the processing surface 12 (13) of the processing object 11 and the light emitting surface 42a (42b) of the light transmissive window member 40a (40b). For example, a processing gas having an oxygen concentration of 50% by volume or more (indicated by a solid arrow in FIG. 2) is supplied through the processing gas supply through hole 28a. The processing gas is circulated in the processing space S2 along the processing surface 12 (13) of the processing object 11 and the light emitting surface 42a (42b) of the light transmissive window member 40a (40b), and the processing gas. It is discharged from the discharge through hole 28b.
 そして、各々の紫外線照射ユニット20a(20b)における紫外線放射ランプ35が点灯されることにより、紫外線放射ランプ35からの真空紫外線(図2において白抜きの矢印で示す。)が光透過性窓部材40a(40b)を介して被処理物11の被処理面12(13)に向かって照射される。これにより、被処理物11の被処理面12(13)に到達する真空紫外線、並びに、真空紫外線が処理用ガスに照射されることにより生成されるオゾンおよび活性種(酸素ラジカル)によって、被処理物11の被処理面12,13に形成されたスミア(例えば有機物樹脂)が分解、除去される。
 以上において、被処理物11に照射される紫外線の照度は、例えば10~200mW/cmである。また、被処理物11に対する紫外線照射時間は、紫外線の照度やスミアの残留状態などを考慮して適宜設定されるが、例えば50~300秒間である。なお、アッシング処理は、不活性ガスおよび処理用ガスが継続して供給されながら、行われる。
Then, when the ultraviolet radiation lamp 35 in each ultraviolet radiation unit 20a (20b) is turned on, vacuum ultraviolet light (shown by a white arrow in FIG. 2) from the ultraviolet radiation lamp 35 is transmitted through the light transmitting window member 40a. It irradiates toward the to-be-processed surface 12 (13) of the to-be-processed object 11 via (40b). As a result, vacuum ultraviolet rays that reach the surface 12 (13) of the object 11 to be processed, and ozone and active species (oxygen radicals) that are generated by irradiating the processing gas with the vacuum ultraviolet rays are processed. Smear (for example, organic resin) formed on the treated surfaces 12 and 13 of the object 11 is decomposed and removed.
In the above, the illuminance of the ultraviolet rays irradiated to the object 11 is, for example, 10 to 200 mW / cm 2 . Further, the ultraviolet irradiation time for the object 11 is appropriately set in consideration of the illuminance of ultraviolet rays, the residual state of smear, and the like, for example, 50 to 300 seconds. The ashing process is performed while the inert gas and the processing gas are continuously supplied.
 而して、上記構成のアッシング装置は、被処理物11の被処理面12,13の各々を同時に処理するものにおいて、被処理物11のアッシング処理を行うに際して形成される、互いに光透過性窓部材40a(40b)によって気密に区画された、不活性ガス雰囲気とされる光源配置空間S1および処理用ガスが流通される処理用空間S2が、実質的に密閉された空間を構成する。これにより、紫外線放射ランプ35からの真空紫外線の光量の低下の程度を小さく抑制することができると共に、処理用ガスが流通されることによって処理用空間S2の雰囲気を略一定に保持することができる。従って、上記構成のアッシング装置によれば、被処理物11のアッシング処理に寄与する真空紫外線の光量を増加させることができると共に、活性種(酸素ラジカル)を安定して生成することができて当該活性種を被処理物11のアッシング処理に確実に寄与させることができるため、所期のアッシング処理を効率よく短時間で行うことができる。
 また、被処理物11が垂立した姿勢で処理されるので、被処理物11の自重によるたわみが生ずることを防止することができて均一な処理を行うことができる。
Thus, in the ashing apparatus having the above-described structure, each of the processing surfaces 12 and 13 of the processing object 11 is processed at the same time. The light source arrangement space S1 that is an inert gas atmosphere and the processing space S2 in which the processing gas is circulated, hermetically partitioned by the member 40a (40b), constitutes a substantially sealed space. Accordingly, the degree of decrease in the amount of vacuum ultraviolet light from the ultraviolet radiation lamp 35 can be suppressed to a small level, and the atmosphere of the processing space S2 can be kept substantially constant by the processing gas being circulated. . Therefore, according to the ashing device having the above-described configuration, the amount of vacuum ultraviolet light contributing to the ashing process of the workpiece 11 can be increased, and active species (oxygen radicals) can be stably generated. Since the active species can surely contribute to the ashing process of the workpiece 11, the intended ashing process can be performed efficiently and in a short time.
Further, since the object 11 is processed in a vertical posture, it is possible to prevent the object 11 from being bent due to its own weight and to perform uniform processing.
〔第2の実施の形態〕
 本発明の第2の実施の形態に係るアッシング装置は、紫外線照射ユニットからの波長220nm以下の真空紫外線が光透過窓を介して被処理物の被処理面に照射される構成のものにおいて、光透過窓が被処理物側に設けられてなるものである。
[Second Embodiment]
The ashing device according to the second embodiment of the present invention has a configuration in which vacuum ultraviolet light having a wavelength of 220 nm or less from an ultraviolet irradiation unit is irradiated to a surface to be processed through a light transmission window. A transmission window is provided on the workpiece side.
 図3は、本発明の第2の実施の形態に係るアッシング装置の一例における構成の概略を示す断面図である。
 このアッシング装置は、一面および他面が被処理面とされた平板状の被処理物11の当該被処理面12,13の各々を同時に処理するものであって、当該被処理物11を備えた被処理物保持構造体10を搬送する搬送手段(図示せず)を備えている。この例においては、被処理物保持構造体10は、垂立された状態で、被処理物11の被処理面12,13の面方向に沿った方向(図3においては紙面に垂直な方向)に搬送される。
FIG. 3 is a cross-sectional view schematically showing the configuration of an example of the ashing device according to the second embodiment of the present invention.
The ashing apparatus is for processing each of the processing surfaces 12 and 13 of a flat plate-like object 11 whose one surface and the other surface are processing surfaces, and includes the object 11 to be processed. Conveying means (not shown) for conveying the workpiece holding structure 10 is provided. In this example, the workpiece holding structure 10 is in a suspended state in a direction along the surface direction of the workpiece surfaces 12 and 13 of the workpiece 11 (in FIG. 3, a direction perpendicular to the paper surface). It is conveyed to.
 被処理物保持構造体10は、平板状の被処理物11と、被処理物11の一面側および他面側において、それぞれ、被処理物11の被処理面12,13の各々と所定の大きさdの間隙を介して互いに平行に対向して配置された一対の平板状の光透過性窓部材40a,40bと、被処理物11および一対の光透過性窓部材40a,40bの各々を保持する共通の枠状の保持部材15aとにより構成されている。そして、被処理物11の一面側および他面側において、密閉空間を構成する、被処理物11の被処理面12(13)と光透過性窓部材40a(40b)の光出射面42a(42b)との間の間隙による処理用空間S2が形成されている。
 保持部材15aには、紫外線放射ランプ35からの真空紫外線によって活性化される活性種源を含む処理用ガスを処理用空間S2に流通させるための処理用ガス流通用開口部が形成されている。
The workpiece holding structure 10 has a plate-like workpiece 11 and a predetermined size on each of the workpiece surfaces 12 and 13 of the workpiece 11 on one side and the other side of the workpiece 11. A pair of flat light-transmitting window members 40a and 40b disposed in parallel with each other through a gap d, and the workpiece 11 and the pair of light-transmitting window members 40a and 40b are held. And a common frame-shaped holding member 15a. Then, on the one surface side and the other surface side of the object to be processed 11, the surface to be processed 12 (13) of the object to be processed 11 and the light emitting surface 42 a (42 b) of the light transmissive window member 40 a (40 b) constituting the sealed space. A processing space S <b> 2 is formed by a gap between them.
The holding member 15a is formed with a processing gas distribution opening for distributing a processing gas containing an active species source activated by vacuum ultraviolet rays from the ultraviolet radiation lamp 35 to the processing space S2.
 この例における保持部材15aは、矩形状の枠体よりなる基体16と、この基体16の内面側において当該基体16に埋設された状態で一体に設けられたコの字状の枠体よりなる被処理物保持体17とにより構成されている。そして、被処理物11の面方向に沿った断面において、被処理物保持体17の開放方向(この例では上方向)に位置される基体16の周壁には、処理用ガスを導入および排出する処理用ガス流通用開口部を構成する開口18が当該周壁の長手方向(図3において紙面に垂直な方向)に延びるよう形成されている。
 そして、被処理物11はその周囲の三辺が被処理物保持体17によって保持されて固定されており、光透過性窓部材40a,40bの各々は、その周囲(四周)が基体16によって保持されて固定されている。
In this example, the holding member 15a includes a base body 16 made of a rectangular frame body and a cover made of a U-shaped frame body integrally provided in an embedded state on the inner surface side of the base body 16. The workpiece holder 17 is constituted. And in the cross section along the surface direction of the to-be-processed object 11, process gas is introduce | transduced and discharged | emitted to the surrounding wall of the base | substrate 16 located in the open direction (in this example, upward direction) of the to-be-processed object holding body 17. An opening 18 constituting the processing gas distribution opening is formed to extend in the longitudinal direction of the peripheral wall (a direction perpendicular to the paper surface in FIG. 3).
The object to be processed 11 is fixed by holding the three sides around the object to be processed by the object holder 17, and each of the light transmissive window members 40 a and 40 b is held by the base 16 at the periphery (four sides). Has been fixed.
 保持部材15aにおける基体16を構成する材料としては、例えばアルミニウム、ステンレス鋼、銅などの金属材料を用いることができる。
 また、保持部材15aにおける被処理物保持体17を構成する材料としては、例えばテフロン(登録商標)などのフッ素樹脂、PEEK(ポリエーテルエーテルケトン)樹脂などの樹脂材料を用いることができる。被処理物保持体17が樹脂材料よりなることにより、当該被処理物保持体17を被処理物11の傷発生防止材または緩衝材として機能させることができる。
As a material constituting the base 16 in the holding member 15a, for example, a metal material such as aluminum, stainless steel, or copper can be used.
Moreover, as a material which comprises the to-be-processed object holding body 17 in the holding member 15a, resin materials, such as fluorine resins, such as Teflon (trademark), and PEEK (polyetheretherketone) resin, can be used, for example. When the workpiece holder 17 is made of a resin material, the workpiece holder 17 can function as a scratch prevention material or a buffer material for the workpiece 11.
 被処理物保持構造体10の搬送路の両側には、一対の紫外線照射ユニット20a,20bが互いに対向して配置されている。各々の紫外線照射ユニット20a(20b)は、一方(搬送路方向)が開口する筐体21a(21b)と、この筐体21a(21b)の内部に配置された紫外線光源とにより構成されている。ここで、紫外線光源は、第1の実施の形態に係るアッシング装置における紫外線光源と同一の構成を有するものであって、一または複数の棒状の紫外線放射ランプ35により構成されている。 A pair of ultraviolet irradiation units 20a and 20b are arranged opposite to each other on both sides of the conveyance path of the workpiece holding structure 10. Each of the ultraviolet irradiation units 20a (20b) is configured by a casing 21a (21b) that is open at one side (conveyance path direction) and an ultraviolet light source disposed inside the casing 21a (21b). Here, the ultraviolet light source has the same configuration as the ultraviolet light source in the ashing device according to the first embodiment, and is configured by one or a plurality of rod-shaped ultraviolet radiation lamps 35.
 筐体21a(21b)には、ランプ中心軸方向に位置される互いに対向する一対の周壁の各々に、不活性ガス供給用貫通孔23aおよび不活性ガス排出用貫通孔23bが、ランプ中心軸方向に沿って延びるよう形成されている。
 また、筐体21a(21b)の開口端面には、例えばO-リングよりなる無端状のシール部材30が当該開口端面の全周にわたって設けられている。
The casing 21a (21b) has an inert gas supply through-hole 23a and an inert gas discharge through-hole 23b in each of a pair of opposed peripheral walls positioned in the lamp central axis direction, in the lamp central axis direction. It is formed to extend along.
In addition, an endless seal member 30 made of, for example, an O-ring is provided on the open end surface of the casing 21a (21b) over the entire circumference of the open end surface.
 このアッシング装置は、処理用ガスを被処理物保持構造体10における処理用空間S2内に供給する活性種源供給手段(図示せず)を備えている。ここで、活性種源供給手段は、第1の実施の形態に係るアッシング装置における活性種源供給手段と同一の構成である。 This ashing device includes active species source supply means (not shown) for supplying the processing gas into the processing space S2 in the workpiece holding structure 10. Here, the active species source supply means has the same configuration as the active species source supply means in the ashing device according to the first embodiment.
 また、このアッシング装置は、紫外線照射ユニット20a,20bの各々を被処理物保持構造体10の搬送路に対して離間する方向および接近する方向(図3において白抜きの矢印で示す。)に移動させる駆動手段(図示せず)を備えている。 Further, the ashing apparatus moves each of the ultraviolet irradiation units 20a and 20b in a direction away from and a direction approaching the conveyance path of the workpiece holding structure 10 (indicated by white arrows in FIG. 3). Driving means (not shown) to be provided.
 而して、上記のアッシング装置においては、被処理物保持構造体10が搬送手段によって搬送路に沿って搬送されて所定の位置に配置される。そして、一対の紫外線照射ユニット20a,20bの各々が駆動手段によって被処理物保持構造体10に接近する方向に順次に移動されることにより、図4に示すように、被処理物保持構造体10における保持部材15aと各々の紫外線照射ユニット20a,20bにおける筐体21a,21bの端面同士がシール部材30,30を介して対接された状態で、被処理物保持構造体10が各々の紫外線照射ユニット20a,20bの筐体21a,21bによって挟持されて保持される。これにより、被処理物保持構造体10における処理用空間S2と光透過性窓部材40a,40bによって気密に区画された、密閉空間を構成する光源配置空間S1が紫外線照射ユニット20a,20bにおける筐体21a,21bの内部に形成される。 Thus, in the above ashing apparatus, the workpiece holding structure 10 is transported along the transport path by the transport means and arranged at a predetermined position. Then, each of the pair of ultraviolet irradiation units 20a and 20b is sequentially moved in the direction of approaching the workpiece holding structure 10 by the driving means, so that the workpiece holding structure 10 as shown in FIG. In the state in which the end surfaces of the holding members 15a and the housings 21a and 21b of the respective ultraviolet irradiation units 20a and 20b are in contact with each other via the seal members 30 and 30, the workpiece holding structure 10 is irradiated with the respective ultraviolet rays. The units 20a and 20b are sandwiched and held by the casings 21a and 21b. As a result, the light source arrangement space S1 constituting the sealed space, which is hermetically partitioned by the processing space S2 and the light transmissive window members 40a and 40b in the workpiece holding structure 10, is a housing in the ultraviolet irradiation units 20a and 20b. It is formed inside 21a, 21b.
 次いで、紫外線照射ユニット20a(20b)における光源配置空間S1内に、不活性ガス供給手段(図示せず)によって、例えば窒素ガスなどの不活性ガス(図4において破線の矢印で示す。)が不活性ガス供給用貫通孔23aを介して供給され、当該不活性ガスが光源配置空間S1内に流通されることにより光源配置空間S1内の雰囲気が不活性ガス雰囲気に置換される。一方、被処理物保持構造体10における処理用空間S2に、活性種源供給手段によって、例えば酸素濃度が50体積%以上である処理用ガス(図4において実線の矢印で示す。)が開口18を介して供給される。 Next, an inert gas such as nitrogen gas (indicated by a dashed arrow in FIG. 4) is inactivated by an inert gas supply means (not shown) in the light source arrangement space S1 in the ultraviolet irradiation unit 20a (20b). The inert gas is supplied through the active gas supply through hole 23a, and the inert gas is circulated in the light source arrangement space S1, whereby the atmosphere in the light source arrangement space S1 is replaced with the inert gas atmosphere. On the other hand, a processing gas having an oxygen concentration of 50% by volume or more (indicated by a solid line arrow in FIG. 4) is opened 18 in the processing space S2 in the workpiece holding structure 10 by the active species source supply means. Is supplied through.
 そして、各々の紫外線照射ユニット20a(20b)における紫外線放射ランプ35が点灯されることにより、紫外線放射ランプ35からの真空紫外線が光透過性窓部材40a(40b)を介して被処理物11の被処理面12(13)に向かって照射される。これにより、被処理物11の被処理面12(13)に到達する真空紫外線、並びに、真空紫外線が処理用ガスに照射されることにより生成されるオゾンおよび活性種(酸素ラジカル)によって、被処理物11の被処理面12,13に形成されたスミアが分解、除去される。 Then, the ultraviolet radiation lamp 35 in each ultraviolet irradiation unit 20a (20b) is turned on, so that the vacuum ultraviolet light from the ultraviolet radiation lamp 35 is applied to the object 11 to be processed via the light transmissive window member 40a (40b). Irradiation is directed toward the processing surface 12 (13). As a result, vacuum ultraviolet rays that reach the surface 12 (13) of the object 11 to be processed, and ozone and active species (oxygen radicals) that are generated by irradiating the processing gas with the vacuum ultraviolet rays are processed. Smear formed on the processing surfaces 12 and 13 of the object 11 is decomposed and removed.
 而して、上記構成の被処理物保持構造体10によれば、光透過性窓部材40a(40b)の光出射面42a(42b)と被処理物11の被処理面12(13)が近接した状態が保持されて形成された処理用空間S2に処理用ガスが流通されることによって処理用空間S2内の雰囲気を略一定に保持することができる。このため、紫外線放射ランプ35からの真空紫外線が処理用ガスに照射されることによって活性種(酸素ラジカル)を安定に生成することができ、被処理物保持構造体10それ自体を、所期のアッシング処理を効率よく短時間で行うことができるものとして構成することができる。 Thus, according to the workpiece holding structure 10 configured as described above, the light emitting surface 42a (42b) of the light transmissive window member 40a (40b) and the workpiece 12 of the workpiece 11 (13) are close to each other. The atmosphere in the processing space S2 can be kept substantially constant by the processing gas flowing through the processing space S2 formed in such a state. For this reason, it is possible to stably generate active species (oxygen radicals) by irradiating the processing gas with the vacuum ultraviolet rays from the ultraviolet radiation lamp 35, and the workpiece holding structure 10 itself can be The ashing process can be efficiently performed in a short time.
 このような被処理物保持構造体10における被処理物に対してアッシング処理を行う上記構成のアッシング装置は、被処理物11のアッシング処理を行うに際して形成される、互いに光透過性窓部材40a(40b)によって気密に区画された、不活性ガス雰囲気とされる光源配置空間S1および処理用ガスが流通される処理用空間S2が、実質的に密閉された空間を構成する。これにより、紫外線放射ランプ35からの真空紫外線の光量の低下の程度を小さく抑制することができると共に、処理用ガスが流通されることによって処理用空間S2の雰囲気を略一定に保持することができる。従って、上記構成のアッシング装置によれば、被処理物11のアッシング処理に寄与する真空紫外線の光量を増加させることができると共に、生成される活性種を被処理物11のアッシング処理に確実に寄与させることができるため、所期のアッシング処理を効率よく短時間で行うことができる。 The ashing device having the above-described configuration for performing the ashing process on the workpiece in the workpiece holding structure 10 is formed with the light transmissive window member 40a ( The light source arrangement space S1 that is an inert gas atmosphere and the processing space S2 through which the processing gas is circulated in an airtight manner by 40b) constitutes a substantially sealed space. Accordingly, the degree of decrease in the amount of vacuum ultraviolet light from the ultraviolet radiation lamp 35 can be suppressed to a small level, and the atmosphere of the processing space S2 can be kept substantially constant by the processing gas being circulated. . Therefore, according to the ashing device having the above-described configuration, the amount of vacuum ultraviolet light that contributes to the ashing process of the workpiece 11 can be increased, and the generated active species can be surely contributed to the ashing process of the workpiece 11. Therefore, the desired ashing process can be performed efficiently and in a short time.
 また、被処理物11の被処理面12,13が光透過性窓部材40a,40bによってカバーされているので、例えば被処理物保持構造体10の搬送時などにおいて、被処理物11が傷つくことを防止することができる。
 また、被処理物11が垂立した姿勢で処理されるので、被処理物11の自重によるたわみが生ずることを防止することができて均一な処理を行うことができる。
Moreover, since the to- be-processed surfaces 12 and 13 of the to-be-processed object 11 are covered by the light transmissive window members 40a and 40b, the to-be-processed object 11 is damaged, for example at the time of conveyance of the to-be-processed object holding structure 10. Can be prevented.
Further, since the object 11 is processed in a vertical posture, it is possible to prevent the object 11 from being bent due to its own weight and to perform uniform processing.
 以上、本発明の実施の形態について説明したが、本発明は上記の実施の形態に限定されるものではなく、種々の変更を加えることができる。
 例えば、第1の実施の形態に係るアッシング装置においては、光透過性窓部材を保持する窓保持体は筐体本体と一体に形成された構成とされていてもよい。
As mentioned above, although embodiment of this invention was described, this invention is not limited to said embodiment, A various change can be added.
For example, in the ashing device according to the first embodiment, the window holding body that holds the light transmissive window member may be formed integrally with the housing body.
 また、本発明のアッシング装置においては、アッシング処理が被処理物における被処理面の温度を上昇させた状態で行われる構成とされていることが好ましい。具体的には例えば、被処理物の被処理面を加熱する加熱手段が、被処理物または被処理物保持構造体の搬送路における、紫外線照射ユニットによる光照射処理領域の上流側の位置に配置された構成とすることができる。このような構成によれば、被処理物の被処理面の温度が上昇されることに伴ってオゾンおよび活性種による作用を促進させることができるので、アッシング処理を一層高い効率で行うことができる。また、第3の実施の形態に係るアッシング装置においては、被処理物保持構造体に加熱手段を設けて被処理物の被処理面の温度を上昇させる構成とすることもできる。
 さらにまた、処理用ガスを加熱して昇温させた状態で処理用空間を流通させることにより、被処理物の被処理面の温度を上昇させるようにしても、同様の効果を得ることができる。
 加熱条件としては、被処理物の被処理面の温度が、例えば80℃以上、340℃以下となる条件であることが好ましく、より好ましくは、被処理物の被処理面の温度が、80℃以上、200℃以下となる条件である。
In the ashing apparatus of the present invention, it is preferable that the ashing process is performed in a state where the temperature of the surface to be processed of the object to be processed is raised. Specifically, for example, the heating means for heating the surface to be processed of the object to be processed is disposed at a position upstream of the light irradiation processing region by the ultraviolet irradiation unit in the conveyance path of the object to be processed or the object holding structure. It can be set as the structure made. According to such a configuration, the action of ozone and active species can be promoted as the temperature of the surface to be processed of the object to be processed increases, so that the ashing process can be performed with higher efficiency. . In the ashing device according to the third embodiment, a heating means may be provided in the workpiece holding structure to raise the temperature of the workpiece surface of the workpiece.
Furthermore, the same effect can be obtained even if the temperature of the surface to be processed of the object to be processed is increased by circulating the processing space in a state where the temperature of the processing gas is raised by heating. .
The heating condition is preferably such that the temperature of the surface to be processed of the object to be processed is, for example, 80 ° C. or higher and 340 ° C. or lower, more preferably the temperature of the surface to be processed of the object to be processed is 80 ° C. The conditions are 200 ° C. or lower.
 さらにまた、本発明のアッシング装置においては、光照射処理時において、被処理物に物理的振動を与える物理的振動処理手段が設けられた構成とすることができる。このような構成によれば、処理用空間内において生成された活性種が、例えば配線基板材料におけるビアホールまたはスルーホール内に供給されやすくなるので、アッシング処理を一層確実に行うことができる。 Furthermore, the ashing device of the present invention can be configured to be provided with physical vibration processing means for applying physical vibration to the workpiece during the light irradiation process. According to such a configuration, the active species generated in the processing space can be easily supplied into, for example, a via hole or a through hole in the wiring board material, so that the ashing process can be performed more reliably.
 本発明のアッシング装置は、多層配線基板などのスミアの除去処理だけでなく、例えば、ナノインプリント装置におけるテンプレートの表面のドライ洗浄処理や、半導体基板あるいは液晶パネル用基板などの製造過程における基板の表面からのレジストの除去処理、および、レジスト除去処理が行われた基板に付着したレジスト残渣の除去処理などの各種のアッシング処理に用いることができる。 The ashing device of the present invention is not only for removing smears such as multilayer wiring boards, but also for example, from the surface of a substrate in the manufacturing process of a substrate such as a semiconductor substrate or a liquid crystal panel, or a dry cleaning treatment of a template surface in a nanoimprinting device. It can be used for various ashing processes such as a process for removing the resist and a process for removing the resist residue attached to the substrate on which the resist removal process has been performed.
 10 被処理物保持構造体
 11 被処理物
 12,13 被処理面
 15,15a 保持部材
 16 基体
 17 被処理物保持体
 18 開口
 20a,20b 紫外線照射ユニット
 21a,21b 筐体
 22a,22b 筐体本体
 23a 不活性ガス供給用貫通孔
 23b 不活性ガス排出用貫通孔
 25a,25b 窓保持体
 26 窓部材保持部
 27 突出縁部分
 28a 処理用ガス供給用貫通孔
 28b 処理用ガス排出用貫通孔
 30 シール部材
 35 紫外線放射ランプ
 40a,40b 光透過性窓部材
 41a,41b 光入射面
 42a,42b 光出射面
 S1 光源配置空間
 S2 処理用空間
DESCRIPTION OF SYMBOLS 10 Processed object holding structure 11 Processed object 12, 13 Processed surface 15, 15a Holding member 16 Base | substrate 17 Processed object holding body 18 Opening 20a, 20b Ultraviolet irradiation unit 21a, 21b Case 22a, 22b Case main body 23a Inert gas supply through hole 23b Inert gas discharge through hole 25a, 25b Window holder 26 Window member holding portion 27 Projecting edge portion 28a Processing gas supply through hole 28b Processing gas discharge through hole 30 Seal member 35 Ultraviolet radiation lamps 40a and 40b Light transmissive window members 41a and 41b Light incident surfaces 42a and 42b Light emitting surfaces S1 Light source arrangement space S2 Processing space

Claims (4)

  1.  一面および他面が被処理面とされた板状の被処理物の当該被処理面の各々にそれぞれ対向する一対の光透過窓と、前記被処理面の各々にそれぞれ前記光透過窓を介して真空紫外線を照射する紫外線光源を備えた一対の紫外線照射ユニットとを備えてなり、
     前記被処理物の周囲を保持する枠状の保持部材が前記一対の紫外線照射ユニットにおける筐体によって挟持されて保持されることにより、当該被処理物の一面側および他面側において、前記被処理物の被処理面と前記光透過窓の光出射面との間に形成される所定の大きさの間隙による処理用空間と、前記紫外線光源が配置された光源配置空間とが、前記光透過窓によって気密に区画された状態で、形成され、
     当該光源配置空間内が不活性ガス雰囲気とされると共に、当該処理用空間内に、前記紫外線光源からの真空紫外線によって活性化される活性種源を含む処理用ガスが流通されることを特徴とするアッシング装置。
    A pair of light transmission windows facing each of the surfaces to be processed of the plate-like object to be processed whose one surface and the other surface are the surfaces to be processed, and each of the surfaces to be processed via the light transmission windows, respectively. A pair of ultraviolet irradiation units equipped with an ultraviolet light source for irradiating vacuum ultraviolet rays,
    A frame-shaped holding member that holds the periphery of the object to be processed is sandwiched and held by a housing in the pair of ultraviolet irradiation units, so that the object to be processed is provided on one surface side and the other surface side of the object to be processed. A processing space formed by a gap having a predetermined size formed between a surface to be processed of the object and a light emitting surface of the light transmission window, and a light source arrangement space in which the ultraviolet light source is disposed are the light transmission window. Formed in an airtight manner, and
    The inside of the light source arrangement space is an inert gas atmosphere, and a processing gas containing an activated species source activated by vacuum ultraviolet light from the ultraviolet light source is circulated in the processing space. Ashing device.
  2.  前記一対の紫外線照射ユニットは、各々一方が開口する筐体を備えており、
     前記光透過窓の各々は、前記筐体の開口端縁より内方側の位置において気密に保持された板状の光透過性窓部材により構成されており、
     当該筐体の各々における当該光透過性窓部材より外方側に突出する突出縁部分には、前記処理用空間に処理用ガスを流通させるための処理用ガス流通用開口部が形成されていることを特徴とする請求項1に記載のアッシング装置。
    Each of the pair of ultraviolet irradiation units includes a housing that is open on one side,
    Each of the light transmissive windows is configured by a plate-like light transmissive window member that is airtightly held at a position on the inner side of the opening edge of the housing.
    A processing gas flow opening for flowing a processing gas into the processing space is formed at a protruding edge portion protruding outward from the light transmissive window member in each of the casings. The ashing device according to claim 1.
  3.  前記光透過窓の各々は、それぞれ、被処理物を保持する保持部材によって保持された板状の光透過性窓部材により構成されており、当該保持部材には、前記処理用空間に処理用ガスを流通させるための処理用ガス流通用開口部が形成されていることを特徴とする請求項1に記載のアッシング装置。 Each of the light transmission windows is configured by a plate-like light transmission window member held by a holding member that holds an object to be processed, and the holding member includes a processing gas in the processing space. The ashing device according to claim 1, wherein a processing gas circulation opening for circulating the gas is formed.
  4.  光照射処理用の被処理物保持構造体であって、
     板状の被処理物と、当該被処理物の一面側および他面側において、それぞれ、当該一面および他面と所定の大きさの間隙を介して対向して配置された一対の板状の光透過性窓部材と、当該被処理物および当該一対の光透過性窓部材の各々の周囲を保持する共通の枠状の保持部材とにより構成されており、当該保持部材には、前記間隙の各々に処理用ガスを流通させるための処理用ガス流通用開口部が形成されていることを特徴とする被処理物保持構造体。
    A workpiece holding structure for light irradiation treatment,
    A pair of plate-like lights disposed on the plate-like object to be processed and on the one surface side and the other surface side of the object to be processed so as to face the one surface and the other surface with a gap of a predetermined size, respectively. A transparent window member, and a common frame-shaped holding member that holds the periphery of the object to be processed and the pair of light-transmissive window members, and each of the gaps includes the holding member. An object to be processed holding structure is characterized in that a processing gas distribution opening for allowing the processing gas to flow therethrough is formed.
PCT/JP2014/076688 2013-11-19 2014-10-06 Ashing device and object-to-be-treated holding structure WO2015076030A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01111331A (en) * 1987-10-26 1989-04-28 Hitachi Ltd Removing device
JP2001129391A (en) * 2000-08-08 2001-05-15 Ushio Inc Apparatus for treatment using dielectric barrier discharge lamp
JP2002148396A (en) * 2000-11-14 2002-05-22 Techno Plex:Kk Ultraviolet-ray irradiation apparatus
JP2008060221A (en) * 2006-08-30 2008-03-13 Tokyo Electron Ltd Antistatic device and antistatic method of substrate
JP2011091386A (en) * 2009-09-24 2011-05-06 Semiconductor Energy Lab Co Ltd Heat treatment apparatus, heat treatment method and method for manufacturing semiconductor device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0612766B2 (en) * 1983-03-04 1994-02-16 株式会社精密エンタプライズ Light irradiation device
JP2005129733A (en) * 2003-10-23 2005-05-19 Sumitomo Precision Prod Co Ltd Method and device for improving quality of surface

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01111331A (en) * 1987-10-26 1989-04-28 Hitachi Ltd Removing device
JP2001129391A (en) * 2000-08-08 2001-05-15 Ushio Inc Apparatus for treatment using dielectric barrier discharge lamp
JP2002148396A (en) * 2000-11-14 2002-05-22 Techno Plex:Kk Ultraviolet-ray irradiation apparatus
JP2008060221A (en) * 2006-08-30 2008-03-13 Tokyo Electron Ltd Antistatic device and antistatic method of substrate
JP2011091386A (en) * 2009-09-24 2011-05-06 Semiconductor Energy Lab Co Ltd Heat treatment apparatus, heat treatment method and method for manufacturing semiconductor device

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