WO2015063950A1 - Système de support de substrat de circuit - Google Patents

Système de support de substrat de circuit Download PDF

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Publication number
WO2015063950A1
WO2015063950A1 PCT/JP2013/079757 JP2013079757W WO2015063950A1 WO 2015063950 A1 WO2015063950 A1 WO 2015063950A1 JP 2013079757 W JP2013079757 W JP 2013079757W WO 2015063950 A1 WO2015063950 A1 WO 2015063950A1
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WO
WIPO (PCT)
Prior art keywords
substrate
support
base material
substrate support
component
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Application number
PCT/JP2013/079757
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English (en)
Japanese (ja)
Inventor
茂人 大山
淳 飯阪
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to PCT/JP2013/079757 priority Critical patent/WO2015063950A1/fr
Priority to JP2015544741A priority patent/JP6429789B2/ja
Publication of WO2015063950A1 publication Critical patent/WO2015063950A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays

Definitions

  • the present invention relates to a circuit board support system for supporting a circuit board in order to perform a predetermined operation.
  • Patent Document 1 describes a substrate support system in which pressure sensors are provided at four corners of a substrate mounting table to detect the level of the substrate mounting table.
  • the jig nozzle is lowered from the original position in a state where the level of the substrate mounting table is adjusted by a worker using a dial gauge or the like, and is brought into contact with the substrate mounting table. Thereby, the distance from the original position of the jig nozzle at the time of contact is acquired based on the detection value of the pressure sensor becoming a predetermined value. This distance is acquired at three or more positions on the substrate mounting table, and is used for determining the deterioration of the level after the substrate mounting table is used for a certain period.
  • the present invention has been made against the background of the above circumstances, and an object thereof is to provide a circuit substrate support system with higher practicality.
  • the apparatus includes: (a) a plurality of base material support portions whose positions in a direction parallel to one plane are different from each other; and (b) a load in a direction perpendicular to the one plane with respect to each of the plurality of base material support portions. This is solved by including at least one of a plurality of load detection units to be detected and a plurality of position detection units for detecting the positions of each of the plurality of base material support units in the direction perpendicular to the one plane.
  • a circuit substrate support system capable of arbitrarily controlling both the load and the position is particularly useful, and the plurality of load detection units and the plurality of load detection units It is desirable to include both the position detection unit and the position detection unit, but this is not always necessary. For example, those that can arbitrarily control the position regardless of the load, or those that can arbitrarily control the position but the load can be arbitrarily controlled for each base material support part, are also useful.
  • Each of the circuit board support systems may include one of a plurality of position detection units and a plurality of load detection units.
  • a printed wiring board on which an electronic component is not yet mounted (2) an electronic component is mounted on one surface and electrically connected to the circuit substrate, and an electronic component is mounted on the other surface (3) Base material on which a bare chip is mounted and a substrate with a chip is mounted, (4) Base material on which an electronic component having a ball grid array is mounted, (5) And a substrate having a three-dimensional shape, and (6) a substrate on which a die is mounted when an IC package is assembled.
  • the circuit substrate working machine include an electronic component mounting machine, a screen printing machine, an adhesive application machine, and a circuit board inspection machine.
  • the one plane may be a horizontal plane, or a plane inclined or perpendicular to the horizontal plane. When one plane is a horizontal plane, at least one of a load and a position in the vertical direction is detected.
  • the base material support unit at the time of work. It is possible to detect at least one of the load on the substrate and the position of the substrate support portion. Thereby, for example, it is possible to control the load acting on the circuit base material during the work, and to perform the work without causing damage to the circuit base material.
  • FIG.9 (a) is a top view
  • FIG.9 (b) is a front view.
  • FIG. 1 shows an electronic component mounting machine (hereinafter abbreviated as a mounting machine).
  • the mounting machine of the present embodiment includes a mounting machine body 10, a circuit board transfer device 12 as a circuit base material transfer device (hereinafter abbreviated as a board transfer device 12), and a circuit board support system 14 as a circuit base material support system (hereinafter referred to as a circuit board support system).
  • Board mounting system 14 includes component supply device 16, mounting device 18, which is a circuit substrate working device, mark imaging device 20, component imaging device 22, and control device 24 (see FIG. 4).
  • the substrate transfer device 12 includes a belt conveyor 30 (hereinafter, abbreviated as a conveyor 30), which is a type of conveyor, as shown in FIG.
  • the conveyor 30 rotates a pair of conveyor belts 32 by means of a belt rotating device 34 (see FIG. 4), whereby a circuit board 36 (hereinafter abbreviated as a board 36) placed on the conveyor belt 32 is in a horizontal direction.
  • a circuit board 36 hereinafter abbreviated as a board 36 placed on the conveyor belt 32 is in a horizontal direction.
  • “circuit board” is a general term for a printed wiring board and a printed circuit board.
  • the substrate 36 has a flat plate shape, which is an upper surface, ie, a mounting surface 38 as a work surface on which electronic components are to be mounted, and a lower surface thereof, a supported surface 39 supported by the substrate support system 14.
  • the transport direction of the substrate 36 (hereinafter abbreviated as “substrate transport direction”) is a plane parallel to the mounted surface 38 of the substrate 36 transported by the conveyor 30 in the X axis direction, and is horizontal.
  • a direction orthogonal to the X-axis direction in one plane is a Y-axis direction, a direction orthogonal to the X-axis direction and the Y-axis direction, and a vertical direction or a vertical direction is a Z-axis direction.
  • the component supply device 16 includes a plurality of tape feeders 40 (hereinafter abbreviated as feeders 40) that are component feeders.
  • the mounting device 18 includes a component mounting head 50 as a work head and a head moving device 52 that can move the component mounting head 50 to an arbitrary position in a horizontal plane that is a single plane defined by the X axis and the Y axis.
  • the head moving device 52 is moved in the Y-axis direction by the Y-axis driving device 60 on the X-axis slide 56 and the X-axis slide 56 moved on the mounting machine main body 10 in the X-axis direction by the X-axis driving device 54.
  • Y-axis slide 62 to be included.
  • the component mounting head 50 is held by a Y-axis slide 62.
  • FIG. 1 An example of the component mounting head 50 is shown in FIG.
  • a rotating body 72 is held in the head body 70 of the component mounting head 50 so as to be rotatable around a vertical rotation axis.
  • the rotating body 72 is rotated as a component holder holding member at a plurality of positions at an appropriate interval on one circumference around the rotation axis, in this embodiment, at six equiangular intervals.
  • the elevating shaft 74 is held so as to be slidable and rotatable in a direction parallel to the axis thereof and parallel to the rotation axis of the rotating body 72.
  • two rotary lift shafts 74 are representatively shown, and the other rotary lift shafts 74 are not shown.
  • Each of the six rotary elevating shafts 74 includes a nozzle holding portion 78 as a holder holding portion, and concentrically and detachably holds a suction nozzle 80 which is a kind of component holder as a working tool.
  • the suction nozzle 80 includes a suction pipe 82 and a suction pipe holder 84 that holds the suction pipe 82 so as to be relatively movable in the axial direction.
  • the adsorption pipe 82 is urged in a direction protruding downward from the adsorption pipe holding body 84 by a compression coil spring (not shown), and a projection limit is defined by a stopper (not shown).
  • a suction surface 88 for sucking an electronic component 86 (hereinafter, abbreviated as a component 86) of the suction nozzle 60 forms a single plane perpendicular to the axis of the suction nozzle 80.
  • the components 86 include, for example, passive components such as resistors and capacitors, active components such as ICs, and dies.
  • the rotary lift shaft 74 is biased upward by a compression coil spring 89 (hereinafter abbreviated as a spring 89), and a snap ring 90 attached in the vicinity of the lower end of the rotary lift shaft 74 contacts the lower surface of the rotating body 72. Therefore, it is kept at the rising end position.
  • the rotating body 72 can be rotated at an arbitrary angle in both forward and reverse directions by a rotating body rotation driving device 92 using the electric motor 91 as a driving source, and the six suction nozzles 80 are swung around the rotation axis of the rotating body 72.
  • a rotating body rotation driving device 92 using the electric motor 91 as a driving source, and the six suction nozzles 80 are swung around the rotation axis of the rotating body 72.
  • the electric motor 91 for example, a servo motor with an encoder, which is a kind of electric rotary motor capable of controlling the rotation angle, is used.
  • a pulse motor or a linear motor may be used as the electric motor. The same applies to other electric motors described later.
  • the suction nozzle 80 can be rotated at an arbitrary angle by the nozzle rotation driving device 96.
  • Integrated gears 98 and 100 are fitted on the outer peripheral surface of the rotating body 72 so as to be relatively rotatable, and are rotated by an electric motor 104 through a pinion 102, and six gears are connected through a plurality of pinions 106.
  • the rotary elevating shaft 74 is rotated all at once, and the six suction nozzles 80 are rotated all at once.
  • the reception of the component 86 from the feeder 40 and the mounting of the component 86 on the substrate 36 are performed at the same position on the swiveling locus of the suction nozzle 80.
  • This position is referred to as a parts receiving / mounting position.
  • the six rotary lift shafts 74 the one rotated to the component receiving / mounting position by the rotation of the rotating body 72 is moved up and down with respect to the head main body 70 by the lift drive device 120, and the suction nozzle 80 is moved in the vertical direction. Can be moved to any position.
  • the elevating drive device 120 is moved up and down while the elevating drive member 130 fixed to the nut 128 is guided by the guide rod 132 when the feed screw 126 is rotated by the electric motor 124.
  • the engaging part 134 of the elevating drive member 130 engages (contacts) the upper end surface of the rotary elevating shaft 74 located at the ascending end position, and lowers the rotary elevating shaft 74 against the urging force of the spring 89, The rise of the rotary lift shaft 74 is allowed by the rise.
  • the mark imaging device 20 is held by a Y-axis slide 62 and moved together with the component mounting head 50 to image the reference mark 138 provided on the mounting surface 38 of the substrate 36.
  • the component imaging device 22 is provided with a fixed position between the substrate transport device 12 and the component supply device 16 of the bed 140 constituting the mounting machine body 10, and the components 86 held by the six suction nozzles 80 are arranged. It is supposed to take an image at a time.
  • the substrate support system 14 includes a base 150 constituting a system main body and a substrate support device 152 as a base material support device in the present embodiment.
  • the substrate support device 152 includes a plurality of substrate support units 154 that are, for example, three or more substrate support units in the present embodiment.
  • the base 150 and the four substrate support units 154 are provided below the transport path of the substrate 36.
  • the base 150 is provided on the bed 140 with a fixed position.
  • the base 150 is an upper surface of the base 150.
  • a support unit 154 is provided.
  • the four unit arrangement positions include three positions defining one plane, and are positions corresponding to each of the four corners of the substrate 36, as schematically shown in FIG.
  • the suction nozzle 80 and the substrate support unit 154 are moved closer to and away from each other by raising and lowering the suction nozzle 80.
  • the approaching / separating direction is a vertical direction and intersects the unit arrangement surface 156 at a right angle.
  • the direction perpendicular to the one plane on which the four substrate support units 154 are arranged is the vertical direction and is sometimes referred to as the height direction.
  • the support lifting / lowering device 164 includes an actuator as a drive source.
  • the actuator is an electric motor 166 that is provided on the base 150 and rotates around the vertical axis, and the rotation of the electric motor 166 is converted into a linear motion by the motion converter 168.
  • the motion conversion device 168 includes a feed screw 170 extending in the vertical direction and a nut 172 screwed thereto.
  • the elevating member 162 has a bottomed cylindrical shape, and a nut 172 is fixed to the inside thereof.
  • the elevating member 162 is covered with the feed screw 170 with its bottom facing up, and a nut 172 is screwed into the feed screw 170.
  • the feed screw 170 is rotated around the vertical axis by the electric motor 166, the elevating member 162 moves to an arbitrary position in the vertical direction concentrically with the feed screw 170 while being guided by the guide block 176 and the guide rail 178. Be made.
  • the feed screw 170 and the nut 172 are screwed together via a large number of balls 174 to constitute a ball screw.
  • the lead screw 170 has a large lead, and the moving distance of the nut 172 with respect to the unit rotation angle is large.
  • the lead is a double thread that is three times the nominal diameter of the lead screw.
  • a ball screw of the support part raising / lowering apparatus which raises / lowers the base material support part
  • a ball screw capable of precise positioning that has a large rotation angle with respect to a unit movement distance of the nut and can easily control a small movement distance may be used. From the viewpoint of increasing the detection sensitivity of the load acting on the base material support part, it is desirable to increase the lead of the feed screw, and from the viewpoint of increasing the position control accuracy of the base material support part, the lead of the feed screw must be reduced. It is desirable to do.
  • the substrate support 160 is provided on the elevating member 162, and each substrate support 160 of the four substrate support units 154 is different in position in a direction parallel to the unit arrangement surface 156 which is one plane.
  • the substrate support 160 includes a sphere 180 and a rubber cup 182 as support members.
  • the spherical body 180 is rotatably supported by a partially concave spherical surface 184 provided on the elevating member 162, and the upper portion projects upward from the upper surface of the elevating member 162.
  • the rubber cup 182 includes a cup-shaped suction portion 188 and a cylindrical holding portion 190 that extends downward from the lower end portion of the suction portion 188.
  • the rubber cup 182 is fixed to the elevating member 162 at the lower end portion of the holding portion 190, and at the flange portion 192 that protrudes inward in the radial direction from the portion between the suction portion 188 and the holding portion 190, the rubber cup 182 is formed on the spherical body 180. It is fixed by bonding. Thereby, the spherical body 180 is held by the rubber cup 182, and is prevented from being detached from the elevating member 162 while being allowed to rotate at a small angle relative to the elevating member 162 due to elastic deformation of the rubber cup 182.
  • the holding portion 190 and the flange portion 192 of the rubber cup 182 prevent leakage of the lubricant put between the spherical body 180 and the partially concave spherical surface 184.
  • the suction portion 188 is connected to the negative pressure source 196 by a rubber hose 194.
  • the control device 24 is composed mainly of a computer 220, and controls the drive source of the belt circulator 34 and the notification device 224 via the drive circuit 222.
  • the notification device 224 for example, at least one of a display device that displays data or the like on the display screen using characters, graphics, or the like, a voice notification device, a buzzer, a lamp, or the like is used.
  • the computer 220 includes an image processing computer 230 that processes data obtained by imaging of the mark imaging device 20 and the component imaging device 22, an encoder 232 provided in each electric motor 166 of the four board support units 154, and the like.
  • An ammeter 236 for measuring the current supplied to each of the encoder 234 and the four electric motors 166 provided in the electric motor 91 is connected.
  • the types of the six suction nozzles 80 and the plurality of components 86 mounted on the substrate 36 are all the same, and the suction surface 88 of the suction nozzle 80 is All are accurate horizontal planes, and there is no relative inclination between the upper and lower surfaces of the component 86.
  • the substrate 36 is carried into the mounting machine by the substrate transfer device 12 and stopped on the four substrate support units 154. At the time of loading the substrate, as shown in FIG.
  • each substrate support 160 is located at the lower end position, no negative pressure is supplied to the rubber cup 182, and the upper end surface that is the suction surface of the suction portion 188 is from the sphere 180. Located above. In this state, the elevating members 162 of the four substrate support units 154 are raised. Although each substrate support 160 is raised independently of each other, all the substrate supports 160 are positioned at a preset rising end position as shown in FIG. At that time, the rubber cup 182 first comes into contact with the supported surface 39 of the substrate 36 and lifts the substrate 36 from the conveyor belt 32.
  • the substrate support 160 In a state where the substrate support 160 is raised to the rising end position, negative pressure is supplied to the suction portion 188, the substrate 36 is sucked and brought into contact with the sphere 180, and is sucked by the substrate support 160 at the four corners. It is supported from below in a horizontal position.
  • the rising end position of the substrate support 160 is such that the supported surface 39 of the substrate 36 supported from below by the sphere 180 is located at a preset position in the height direction, and the substrate 36 is located at the reference height. Is set.
  • the lower end position and the upper end position of the substrate support 160 are stored as values of the encoder 232.
  • the component mounting head 50 is moved to the component supply device 16, and the six suction nozzles 80 are sequentially moved to the component receiving / mounting position. To be lowered.
  • the suction nozzle 80 sucks the component 86 by supplying negative pressure and takes it out from the feeder 40.
  • the component mounting head 50 is moved above the component imaging device 22, and after the component 86 is imaged, the component mounting head 50 is moved above the substrate 36 supported by the substrate support device 152 and set on the mounting surface 38.
  • the component 86 is mounted at the mounting position. At the time of mounting, the rotary lift shaft 74 is lowered, and the component 86 held by the suction nozzle 80 is placed on the mounting surface 38.
  • the lowering distance of the rotary lifting shaft 74 is the distance between the bottom surface (lower surface) of the component 86 held by the suction nozzle 80 positioned at the rising end position and the mounting surface 38 of the substrate 36 positioned at the reference height.
  • the distance is set to be slightly larger, in this embodiment, 0.3 mm larger.
  • the rotary lift shaft 74 is further lowered by a small distance from the state where the component 86 is in contact with the mounted surface 38.
  • This downward movement causes the adsorption pipe 82 to move relative to the adsorption pipe holding body 84 against the urging force of a compression coil spring (not shown) disposed between the adsorption pipe holding body 84.
  • the component 86 is pressed against the mounting surface 38 by a pressing force within a predetermined range against the substrate 36. Even if the thickness (dimension in the height direction) of at least one of the component 86 and the substrate 36 varies, if the variation is within an allowable range, the component 86 is placed on the pad of the substrate 36, It can be pressed with a predetermined pressing force.
  • the control of the substrate support system 14 for that purpose will be described.
  • the component 86 when the component 86 is mounted at an arbitrary point A on the substrate 36, the sum of the supporting forces of the four substrate support units 154 that support the four corners of the substrate 36 is the component 86.
  • the operating force of the four electric motors 166 is controlled to be equal to the appropriate pressing force to the substrate 36 and the sum of the rotational moments acting on the substrate 36 based on these supporting forces becomes zero, the component 86
  • the pressing force to the substrate 36 becomes an appropriate magnitude.
  • the support force of each substrate support unit 154 for satisfying this condition changes even if the appropriate pressing force of the component 86 against the substrate 36 is constant, and changes if the position of the point A changes.
  • the support force of each substrate support unit 154 is calculated in advance for each mounting position on 36, and is stored in the RAM of the computer 220 before starting the mounting operation.
  • each board support unit 154 when the component 86 is mounted is proportional to the drive current to the electric motor 166 in this embodiment. Since the lead screw 170 has a large lead angle and is a ball screw, the load acting on the substrate 36 due to the pressing of the component 86 is substantially the rotational moment applied to the feed screw 170, that is, the electric motor 166. It is proportional to the load torque and proportional to the drive current supplied to the electric motor 166 to counter the load torque. Therefore, when the component 86 is mounted, the drive current to each electric motor 166 has a magnitude corresponding to the support force of each board support unit 154 stored in the RAM of the computer 220 described above, and each board support unit 154.
  • the substrate 36 is maintained in a horizontal posture and the component 86 with respect to the substrate 36 is maintained.
  • the pressing force is controlled to an appropriate magnitude. As a result, even if the thickness of at least one of the component 86 and the substrate 36 is larger than the set thickness, the component 86 is pressed against the substrate 36 with the set appropriate pressing force, and the component 86 and the substrate 36 are damaged. Is avoided.
  • each substrate support 160 of the four substrate support units 154 is returned to the rising end position after the suction nozzle 80 is lifted, and the substrate 36 is positioned at the reference height.
  • the negative pressure supply to each substrate support 160 of the four substrate support units 154 is performed.
  • each substrate support 160 is returned to the lowered position, and the substrate 36 is supported by the substrate transfer device 12 and carried out.
  • the substrate 36 may vibrate due to an impact when the component 86 is placed on the mounting surface 38.
  • the substrate support 160 is moved up and down by vibration.
  • the vibration can be reduced. Therefore, an experiment is performed in advance for each of all the component mounting positions scheduled on the substrate 36, and vibrations (vertical movement) of the substrate supporters 160 of the four substrate support units 154 at the time of component mounting for each component mounting position. Is detected, and vibration suppression data is created.
  • the vibration suppression data is created so that the substrate support 160 is moved up and down in the opposite direction with the same amplitude as the substrate vibration caused by component contact.
  • the vibration suppression control is started together with the contact of the component 86 with the substrate 36 and is performed together with the load control.
  • the ammeter 236 and the part for obtaining the detected current of the ammeter 236 of the control device 24 constitute a support force detection unit or a load detection unit
  • the encoder 232 And the part which acquires the output value of the encoder 232 of the control apparatus 24 comprises the height detection part as a support position detection part thru
  • the elevating member 162 and the support elevating device 164 serve as a substrate support unit moving device that is a base material support unit moving device that moves the substrate support 160 in a direction perpendicular to a plane on which the four substrate supports 160 are located. It is composed.
  • the portion that suppresses the vibration of the substrate 36 by raising and lowering the substrate support 160 of the control device 24 constitutes a vibration suppression unit, and supports the substrate support 160 based on the detection of the support position and the support force of the control device 24.
  • a substrate supporting unit movement control device as a base material supporting unit movement control device is configured.
  • the support force detection unit and the support position detection unit may be provided separately from the drive mechanism of the base material support unit.
  • the support force detection unit can include a load cell provided between the movable member driven by the drive mechanism and the substrate support unit, inside the substrate support unit, or the like.
  • the substrate support may clamp the circuit substrate.
  • the embodiment which is the example is demonstrated based on FIG. 7 and FIG.
  • the substrate support apparatus 302 of the substrate support system 300 of this embodiment includes four substrate support units 303.
  • Each substrate support unit 303 is configured in the same manner as the substrate support unit 154 except for the substrate support 304 shown in FIG.
  • the substrate support unit 303 is provided outside the pair of conveyor belts 32 of the belt conveyor 30 in the width direction (a direction perpendicular to the substrate transport direction in a plane parallel to the work surface). ing.
  • the substrate support 304 includes a fixed clamp member 310, a movable clamp member 312 and a clamp member driving device 314.
  • the fixed clamp member 310 includes a vertical guide portion 316 and a horizontal clamp portion 318 that protrudes upward in the substrate transfer path.
  • the clamp member driving device 314 is configured by an air cylinder 320 provided upward, and a movable clamp member 312 is fixed to the tip of the piston rod 322.
  • the substrate support 304 When the substrate is conveyed, the substrate support 304 is positioned at the rising end position, and the substrate 36 placed on the conveyor belt 32 is conveyed while being guided by the guide surface 324 of the guide unit 316. After the conveyance of the substrate 36 is stopped, the movable clamp member 312 is raised by the air cylinder 320, and the substrate 36 is lifted from the conveyor belt 32 and held between the clamp unit 318 and the substrate 36. In this state, the board 36 is positioned at the reference height, and component mounting, load control, and vibration suppression control are performed as in the above embodiment.
  • the clamp member driving device may lower the movable clamp member and sandwich the substrate with the fixed clamp member.
  • clamp-type substrate support is not limited to the outside of the conveyor belt, and may be provided at the same position as the conveyor belt in the width direction, for example.
  • the belt conveyor is divided into three parts in the base material transport direction, and the base material support is disposed between the conveyor belts of two belt conveyors adjacent in the base material transport direction.
  • the clamp-type base material support may be configured to hold both edges parallel to the transport direction of the substrate 36 long along the transport direction.
  • the substrate support device of the substrate support system includes two substrate support units, and each substrate support of each substrate support unit is such that the fixed clamp member and the movable clamp member are long in a direction parallel to the transport direction. .
  • the circuit board 370 is a circuit board as illustrated in FIG. It is supported by the substrate support unit while being supported by the support member 372, and work, load control, and the like are performed.
  • the circuit board support member 372 has, for example, a container shape, is fitted with the circuit board 370, is positioned in a direction parallel to the work surface, and the bottom surface of the recess of the circuit board support member 372 is on the back surface of the circuit board 370. It contacts and prevents the circuit board 370 from bending.
  • the mounting surface 38 of the substrate 36 is exactly perpendicular to the approaching / separating direction of the suction nozzle 80.
  • the bottom surface of the component 86 held by the suction nozzle 80 is slightly tilted from a state perpendicular to the approaching / separating direction of the suction nozzle 80 due to the inclination of the suction surface 88 of the suction nozzle 80 or the like.
  • the mounted surface 38 is tilted so as to be parallel to the bottom surface of the component 86, the mounting position shift can be reduced.
  • the inclination of the adsorption surface 88 is also caused by the inclination of the adsorption tube 82 with respect to the adsorption tube holding body 84 and the inclination of the adsorption nozzle 80 with respect to the rotary lift shaft 74, but here it is caused by wear of the adsorption surface 88 to simplify the explanation. I will do it.
  • the inclination angle is preferably 10 degrees or less, and more preferably 5 degrees or less and 3 degrees or less. This is because the larger the inclination is, the easier the part is to slip when the part is placed. If the inclination of the suction surface 88 is larger than the desired range, it is considered as defective.
  • a distance sensor is provided at a position between the substrate transfer device 12 and the component supply device 16 of the bed 140. Then, the suction nozzle 80 is moved above the distance sensor by the head moving device 52 and the rotary body rotation driving device 92, and at least three portions of the suction surface 88 are directly opposed to the distance sensor. The distance is detected, and the tilt direction and tilt angle of the suction surface 88 are calculated based on the detection result.
  • the height position of the substrate support 160 of the four substrate support units 154 is controlled so that the mounted surface 38 of the substrate 36 is parallel to the suction surface 88, and the state is the reference state. It is said. As a result, mounting is performed in a state where the bottom surface of the component 86 is parallel to the mounted surface 38 of the substrate 36, and mounting position deviation is reduced.
  • the substrate support unit may be moved closer to or away from the work head by movement thereof. This movement may be performed by movement of each base material support part, or may be performed by movement of the whole base material support unit.
  • the relative approach / separation direction between the work tool of the work head and the base material support portion may be a direction other than the vertical direction, and intersects at an angle other than a right angle with a plane on which a plurality of base material support portions are arranged. The direction to do.
  • Circuit board support system 24 Control device 36: Circuit board 50: Component mounting head 52: Head moving device 80: Adsorption nozzle 152: Substrate support device 154: Substrate support unit 160: Substrate support 166: Electric motor 300: Circuit Substrate support system 302: Substrate support device 303: Substrate support unit 304: Substrate support

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'invention concerne un système de support de substrat de circuit plus pratique. Lorsqu'il prend et tient un substrat (36), chaque support (160) de substrat provenant des quatre unités (154) de support de substrat est soulevé et abaissé par un dispositif (164) de soulèvement et d'abaissement de support. Pendant le montage de composants, si la force qui appuie un composant contre un substrat est sur le point d'augmenter tout en dépassant une plage autorisée, un moteur électrique (166) est commandé sur la base d'une valeur de sortie provenant d'un codeur installé sur le moteur électrique (166) et d'une valeur de détection provenant d'un ampèremètre mesurant le courant fourni au moteur électrique (166), ce qui amène les quatre unités (154) de support de substrat à avoir des forces de support respectives commandées à une même grandeur prédéfinie pendant que les positions de hauteur associées sont égalisées, de sorte que le composant (86) est monté au moyen d'une force de pression appropriée sur le substrat (36) déposé horizontalement. Une commande ascendante et descendante du support (160) de substrat permet également la suppression des vibrations qui surviennent lorsque le composant vient buter contre le substrat (36). Il est également possible d'amener les quatre supports (160) de substrat à supporter le substrat (36) dans une position inclinée par rapport au plan horizontal, de sorte qu'un montage de composant est réalisé pendant que le substrat est parallèle à un côté inférieur du composant incliné.
PCT/JP2013/079757 2013-11-01 2013-11-01 Système de support de substrat de circuit WO2015063950A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2013/079757 WO2015063950A1 (fr) 2013-11-01 2013-11-01 Système de support de substrat de circuit
JP2015544741A JP6429789B2 (ja) 2013-11-01 2013-11-01 回路基材支持システム

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