WO2018131143A1 - Dispositif de travail d'objet monté - Google Patents

Dispositif de travail d'objet monté Download PDF

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Publication number
WO2018131143A1
WO2018131143A1 PCT/JP2017/001068 JP2017001068W WO2018131143A1 WO 2018131143 A1 WO2018131143 A1 WO 2018131143A1 JP 2017001068 W JP2017001068 W JP 2017001068W WO 2018131143 A1 WO2018131143 A1 WO 2018131143A1
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WO
WIPO (PCT)
Prior art keywords
mounted object
head
mounting
unit
holding
Prior art date
Application number
PCT/JP2017/001068
Other languages
English (en)
Japanese (ja)
Inventor
鈴木　直樹
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to DE112017006815.0T priority Critical patent/DE112017006815T5/de
Priority to PCT/JP2017/001068 priority patent/WO2018131143A1/fr
Priority to JP2018561756A priority patent/JP6753956B2/ja
Publication of WO2018131143A1 publication Critical patent/WO2018131143A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools

Definitions

  • the present invention relates to a mounted work apparatus, and more particularly, to a mounted work apparatus that performs work while holding the mounted object.
  • JP 2012-119634 A As an electronic circuit component mounting device (mounting device working device) that performs work while holding a three-dimensional board (mounting material), for example, JP 2012-119634 A is known.
  • Japanese Patent Application Laid-Open No. 2012-119634 discloses a three-dimensional board holding jig (mounting object holding unit) for holding a three-dimensional board and a mounting head (head) for mounting electronic circuit components on the three-dimensional board held by the three-dimensional board holding jig. ) Including an electronic circuit component mounting apparatus.
  • the three-dimensional board includes a first mounted surface and a second mounted surface on which the electronic circuit component is mounted. The first mounted surface and the second mounted surface are inclined.
  • the three-dimensional substrate holding jig includes a support block (holding unit) that supports the three-dimensional substrate and a first rotation device (tilting mechanism) that tilts the support block about an axis extending in the horizontal direction. Part).
  • the support block is moved up and down by the substrate support lifting device (lifting mechanism unit) and rotated around the axis extending in the vertical direction by the second rotating device (rotating mechanism unit).
  • the position of the support block is moved by the first rotation device, the substrate support lifting device, and the second rotation device. Accordingly, the first rotating device, the substrate supporting lifting device, and the second rotating device move each of the first mounting surface and the second mounting surface to a position where the mounting head can mount the electronic circuit component. be able to.
  • the support block described in the above-mentioned Japanese Patent Application Laid-Open No. 2012-119634 has a first rotating device, a substrate supporting lifting device, and a second rotating device because each of the first mounted surface and the second mounted surface is a horizontal surface. It is moved by.
  • the support block moves so that one mounting head can mount the electronic circuit component on the first mounting surface.
  • another mounting head adjacent to the one mounting head may interfere with the three-dimensional board supported by the moved support block. Therefore, there is a demand for a mounted object working apparatus that can prevent interference between the head and the mounted object held by the holding part of the mounted object holding unit.
  • the present invention has been made to solve the above-described problems, and one object of the present invention is to prevent interference between the head and the mounted object held by the holding portion of the mounted object holding unit. It is providing the to-be-mounted object working apparatus which can do.
  • a mounted object working apparatus includes a mounted object holding unit for holding a mounted object on which a component is mounted, and a mounted object held by the mounted object holding unit.
  • a moving mechanism for moving the mounted object When interference occurs between the mounted object and the head, the mounted object is moved based on the shape of the mounted object held by the holding portion and the moving range of the head unit.
  • the interference avoidance position of the holding portion that holds the mounted product is acquired, and the holding portion is moved to the interference avoidance position by the moving mechanism.
  • the holding unit that holds the mounted object based on the shape of the mounted object held by the holding unit and the movement range of the head unit. Is moved to the interference avoidance position by the moving mechanism. As a result, the holding unit is moved to the interference avoidance position by the moving mechanism, and thus the mounted object held by the holding unit is moved to the interference avoidance position. As a result, it is possible to prevent interference between the head of the head unit and the mounted object held by the holding part of the mounted object holding unit.
  • the interference avoidance position is preferably provided when interference occurs between the head other than the head performing the work and the mounted object due to the movement of the plurality of heads.
  • the holding unit is moved to the interference avoidance position by the moving mechanism. If comprised in this way, by moving a holding
  • the mounted object working apparatus configured to obtain the interference avoidance position of the holding unit based on the shape of the mounted object and the movement range of the head unit, preferably, the shape data of the mounted object and the head unit Based on the movement range data, it is determined whether or not interference occurs between the mounted object and the plurality of heads of the head unit, and when interference occurs, an interference avoidance position is obtained.
  • the shape data of the mounted object and the head unit Based on the movement range data, it is determined whether or not interference occurs between the mounted object and the plurality of heads of the head unit, and when interference occurs, an interference avoidance position is obtained.
  • interference is performed by performing at least one of the operations of rotating, lowering, or tilting the holding unit by the moving mechanism.
  • the holding unit is configured to move to the avoidance position. If comprised in this way, interference with a to-be-mounted object and a some head can be avoided, without moving a holding
  • a mechanism for moving the holding unit to the interference avoiding position in the case where at least one of the operations of moving the holding unit linearly in the horizontal plane and rotating, lowering, or tilting the holding unit is performed) (Linear movement mechanism) can be reduced, and control of movement of the holding unit to the interference avoidance position can be simplified as long as linear movement is not performed.
  • the moving mechanism is attached to the elevating mechanism part for moving the mounted object held by the holding part in the up and down direction, and in the moving direction of the elevating mechanism part.
  • An inclination mechanism part that rotates the holding part around a first rotation axis that extends in a direction perpendicular to the first rotation axis, and a holding part that is attached to the inclination mechanism part and extends around a second rotation axis that extends in a direction perpendicular to the first rotation axis.
  • An interference avoidance position by causing the holding unit to perform a lowering and tilting operation or a corresponding rotation operation using at least one of the elevating mechanism unit, the tilting mechanism unit, and the rotating mechanism unit.
  • maintenance part may be moved to. If comprised in this way, since the rotation mechanism part is attached to the inclination mechanism part, and the inclination mechanism part is attached to the raising / lowering mechanism part, in a state where the object to be mounted is not inclined by the inclination mechanism part, It can be rotated by the rotation mechanism. As a result, the mounted object can be rotated in a state where the mounted object is not tilted, so that the radius of rotation of the mounted object is smaller than that in the case where the mounted object is rotated in a state where the mounted object is tilted. can do. As a result, it is possible to suppress interference between the plurality of heads and the mounted object, rather than a mechanism that rotates the mounted object when the mounted object is inclined.
  • the mounted object is mounted on the substrate having a three-dimensional shape and the substrate.
  • the mounted parts are mounted on the basis of the shape of the mounted object including the mounted parts and the board, and the movement range of the plurality of heads.
  • the holding unit is moved to the interference avoidance position by the moving mechanism.
  • the holding unit is set to the interference avoidance position in consideration of a change in the shape of the mounted object each time a plurality of components are mounted on the board having a three-dimensional shape. Can be moved. Thereby, even if the shape of the mounted object changes for each mounting of the component due to the component mounted on the substrate, interference between the mounted object and the plurality of heads can be avoided.
  • the plurality of heads includes a plurality of mounting heads arranged in a straight line
  • the holding unit is moved to a predetermined interference avoidance position capable of avoiding interference between an object to be mounted and a plurality of mounting heads during one cycle.
  • the configuration is such that one cycle of the mounting operation is performed collectively. If comprised in this way, the mounting operation
  • one cycle indicates a period of a process in a predetermined place on the substrate from when the mounting head starts mounting the component to the mounted object until the mounting of all the components is completed.
  • the head unit preferably includes a height measuring unit that measures the height position of the mounted object.
  • the height measuring unit measures the height position of the mounted object and confirms whether the holding unit is arranged at the interference avoiding position. Has been. If comprised in this way, it can be confirmed by the height measurement part whether the to-be-mounted object is arrange
  • FIG. 4 is a side view of the mounted object working apparatus showing a simulation of a state in which the dispensing head applies cream solder to the mounted object in the mounted object working apparatus according to the embodiment of the present invention.
  • FIG. 4 is a side view of the mounted object working apparatus showing a simulation of a state in which the mounted object and the mounting head interfere with each other in the mounted object working apparatus according to the embodiment of the present invention.
  • FIG. 10A is a side view of the mounted object working apparatus showing the interference avoidance position of the mounted object.
  • FIG. 10B is a side view of the mounted object working apparatus showing a state in which the height position of the mounted object is measured.
  • Fig.11 (a) is a side view of the to-be-mounted object working apparatus which showed the state in which a dispensing head applies cream solder to an to-be-mounted object.
  • FIG. 11B is a plan view of the mounted object showing the movable range of the dispense head.
  • FIG. 11C is a plan view of the mounted object showing the working range of the dispense head.
  • FIG. 13A is a side view of the mounted object working apparatus showing a simulation of a state in which the mounting head mounts the electronic component on the mounted object.
  • FIG. 13B is a side view of the mounted object working apparatus showing a simulation of a state in which the mounted object and the dispensing head interfere with each other.
  • FIG. 14A is a side view of the mounted object working apparatus showing the interference avoidance position of the mounted object.
  • FIG. 14B is a side view of the mounting object working apparatus showing a state in which the height position of the mounting object is measured.
  • FIG. 15A is a side view of the mounting object working apparatus showing a state in which the mounting head mounts the electronic component on the mounting object.
  • FIG. 15B is a plan view of the mounted object showing the movable range of the mounting head.
  • FIG. 15C is a plan view of the mounted object showing the working range of the mounting head.
  • FIG. 16A is a side view of the mounted object working apparatus showing a simulation of a state in which the mounted object on which the electronic component is mounted on the substrate and the mounting head interfere with each other.
  • FIG. 16B is a side view of the mounted object working apparatus showing a simulation in a state where the mounted object is moved to the interference avoidance position.
  • FIG. 6 is a side view of the mounted object working apparatus showing a simulation of a state in which the head unit moves in the mounted object working apparatus according to the embodiment of the present invention.
  • FIG. 21A is a side view of the mounted object working apparatus showing the interference avoidance position of the mounted object.
  • FIG. 21B is a side view of the mounted object working apparatus showing a state in which the head unit has moved.
  • FIG. 4 is a side view of the mounted object working apparatus showing a simulation of a state in which the mounted object is moved to the interference avoidance position using the tilt mechanism in the mounted object working apparatus according to the embodiment of the present invention.
  • the mounted work apparatus 1 is configured to mount an electronic component 7 such as an IC, a transistor, a capacitor, and a resistor on a substrate 8 or the like.
  • an electronic component 7 such as an IC, a transistor, a capacitor, and a resistor on a substrate 8 or the like.
  • the direction in which the substrate 8 is conveyed is defined as the X direction
  • the direction perpendicular to the X direction in the horizontal direction is defined as the Y direction.
  • a direction perpendicular to the X direction and the Y direction is defined as a Z direction.
  • the electronic component 7 is an example of the “component” in the claims.
  • the mounted object 2 includes a substrate 8, a plurality of electronic components 7 mounted on the substrate 8, and a mounting member 31 on which the substrate 8 is mounted for being transported in the mounted object working apparatus 1.
  • the substrate 8 is a substrate 8 having a three-dimensional shape instead of a flat plate shape.
  • the substrate 8 includes a base portion 21 and a convex portion 22 protruding from the base portion 21.
  • the convex portion 22 is provided over the entire length of one edge portion of the base portion 21.
  • the mounted object 2 has a height in the protruding direction of the convex portion 22.
  • the upper surface of the base portion 21 is a first mounting surface 21a on which the electronic component 7 is mounted, as shown in FIG. Further, the upper surface of the convex portion 22 is a second mounting surface 22a on which the electronic component 7 is mounted.
  • the first mounting surface 21a is formed with a recess 23 that is recessed from other portions of the first mounting surface 21a.
  • the second mounting surface 22a is a flat surface.
  • a position recognition mark ((fiducial mark) FM) (not shown) is attached to the first mounting surface 21a.
  • the workpiece work apparatus 1 transports the substrate 8 to be loaded to the X2 side, and mounts the electronic component 7 on the first mounting surface 21a and the second mounting surface 22a of the substrate 8 at a predetermined position. It has a function to do.
  • the mounting object working apparatus 1 includes a base 10, a mounting object transport unit 11, a tape feeder 12 (see FIG. 3), a mounting object holding unit 13, a head unit 14, and a support unit. 15, a pair of rails 16 (see FIG. 3), a component recognition camera 17 (see FIG. 3), a board recognition camera 18 (see FIG. 4), a laser measuring unit 19 (see FIG. 4), and a control device 20 (see FIG. 5).
  • the mounted product transport unit 11 is configured to carry in the substrate 8, transport it in the transport direction (X2 direction), and carry it out.
  • the mounted object transport unit 11 includes an upstream transport unit 111, a central transport unit 112, and a downstream transport unit 113.
  • the upstream transport unit 111 includes a pair of first conveyor units 111a.
  • a pair of 1st conveyor parts 111a support the both ends of the direction (Y direction) perpendicular
  • the pair of first conveyor units 111 a conveys the loaded substrate 8 to the central conveyance unit 112.
  • the central transport unit 112 is disposed between the upstream transport unit 111 and the downstream transport unit 113.
  • the center conveyance part 112 has a pair of 2nd conveyor part 112a, as shown in FIG.
  • a pair of 2nd conveyor parts 112a support the both ends of the direction (Y direction) perpendicular
  • the pair of second conveyor units 112 a receives the substrate 8 from the upstream transport unit 111 and transports the received substrate 8 to the downstream transport unit 113.
  • the pair of second conveyor portions 112 a moves the substrate 8 to a delivery position to the mounted object holding unit 13.
  • the downstream transport unit 113 includes a pair of third conveyor units 113a.
  • a pair of 3rd conveyor parts 113a support the both ends of the direction (Y direction) perpendicular
  • the pair of third conveyor units 113a receives the substrate 8 on which the electronic component 7 is mounted from the central transport unit 112, and unloads the substrate 8 on which the electronic component 7 is mounted on a downstream transport path (not shown).
  • a feeder arrangement portion 10 a for arranging a plurality of tape feeders 12 is provided at an end portion on the Y2 side of the base 10. Moreover, the feeder arrangement
  • the tape feeder 12 holds a reel 121 around which a tape holding a plurality of electronic components 7 at a predetermined interval is wound.
  • the tape feeder 12 supplies the electronic component 7 from the tip by rotating the reel 121 and sending out a tape that holds the electronic component 7.
  • Each tape feeder 12 is electrically connected to the control device 20 (see FIG. 5) via a connector (not shown) provided in the feeder arrangement portion 10a. Thus, each tape feeder 12 sends out the tape from the reel 121 based on the control signal from the control device 20.
  • the mounted object holding unit 13 is transferred from the mounted object transport unit 11 at the transfer position, and holds the mounted object 2 on which the electronic component 7 is mounted.
  • the mounted object holding unit 13 includes a holding part 132 that holds the mounted object 2 and a moving mechanism 131 that moves the mounted object 2 held by the holding part 132 by moving the holding part 132.
  • the mounted object holding unit 13 can move the held mounted object 2 in the vertical direction (Z direction) by the moving mechanism 131.
  • the mounted object holding unit 13 can tilt the held mounted object 2 by the moving mechanism 131.
  • “inclination” means that the workpiece 2 is rotated in the Y1 direction or the Y2 direction with respect to the Z direction.
  • the mounted object holding unit 13 can rotate the held mounted object 2 by the moving mechanism 131.
  • the mounted object holding unit 13 can adjust the posture of the mounted object 2 by performing at least one of the movement mechanism 131 to move, tilt, and rotate the holding portion 132 in the vertical direction. It has become. The detailed configuration of the mounted object holding unit 13 will be described later.
  • the substrate 8 is transported by the mounting object transport unit 11 as the mounting object 2 while being held by the mounting member 31.
  • the mounting member 31 is a member for transporting the substrate 8 by the mounted object transport unit 11.
  • the mounting member 31 holds the substrate 8 in a detachable manner.
  • the mounting member 31 is configured to be held by the mounted object holding unit 13.
  • the placement member 31 has a placement portion 311 formed in a plate shape and a held portion 312 provided on the lower surface of the placement portion 311.
  • a slightly adhesive layer is formed on the upper surface (the surface on the Z1 side).
  • the mounting portion 311 holds the mounted object 2 detachably on the upper surface by bonding the mounted object 2 to the adhesive layer.
  • a held portion 312 for holding the mounting member 31 by the mounted object holding unit 13 is provided on the lower surface (the surface on the Z2 side) of the mounting portion 311.
  • the held portion 312 is provided near the center in the X direction of the mounting member 31 in a state where the mounted object 2 is held by the mounting portion 311.
  • the held portion 312 protrudes downward (Z2 direction) from the lower surface of the placement portion 311.
  • the mounted object holding unit 13 holds the mounting member 31 by sandwiching the held portion 312 of the mounting member 31. Thereby, the substrate 8 is held by the mounted object holding unit 13 via the mounting member 31.
  • an opening 10 b having a rectangular shape in plan view is formed at the center of the base 10.
  • An accommodating portion 10 c is attached to the opening 10 b of the base 10.
  • the accommodating portion 10 c is formed in a concave shape that is recessed downward (Z2 direction) from the upper surface (Z1 side surface) of the base 10.
  • the mounted object holding unit 13 is disposed so that a part thereof is accommodated in the accommodating portion 10c.
  • the rail portion 16 is configured to be able to move the support portion 15 in a direction (Y direction) perpendicular to the transport direction.
  • the pair of rail portions 16 are formed so as to extend in the Y direction, respectively.
  • the pair of rail portions 16 are fixed to both ends of the base 10 in the X direction.
  • Each of the pair of rail portions 16 includes a ball screw shaft 16a extending in the Y direction, a plurality of Y axis motors 16b provided on the ball screw shaft 16a, and a guide rail (not shown).
  • Each Y-axis motor 16b rotates the corresponding ball screw shaft 16a.
  • the support portion 15 moves along a pair of rail portions 16 in a direction (Y direction) perpendicular to the conveyance direction.
  • the support unit 15 is configured to be able to move the head unit 14 in the transport direction (X direction).
  • the support portion 15 includes a ball screw shaft 15a extending in the X direction, an X axis motor 15b for rotating the ball screw shaft 15a, and a guide rail (not shown) extending in the X direction.
  • the head unit 14 moves in the transport direction (X direction) along the support portion 15 when the ball screw shaft 15a is rotated by the X-axis motor 15b.
  • the head unit 14 is configured to be movable in the horizontal direction (X direction and Y direction) above the base 10. Thereby, the head unit 14 can move, for example, above the tape feeder 12 to suck the electronic component 7 supplied from the tape feeder 12. Further, the head unit 14 can be moved above the substrate 8 in a state of being held by the mounted object holding unit 13, for example, so that the sucked electronic component 7 can be mounted on the substrate 8.
  • the head unit 14 is configured to perform work on the mounted object 2 held by the mounted object holding unit 13.
  • the head unit 14 is attached to the base 10 via a support portion 15 and a pair of rail portions 16.
  • the head unit 14 is disposed above (the Z1 direction) the mounting object transport unit 11, the mounting object holding unit 13, and the tape feeder 12.
  • the head unit 14 performs the mounting operation of the electronic component 7 on the mounted object 2 held by the mounted object holding unit 13.
  • the mounting operation is an operation in which the head unit 14 sucks the electronic component 7 supplied from the tape feeder 12 and mounts the sucked electronic component 7 on the substrate 8.
  • the head unit 14 includes a dispensing head 141, a mounting head 142, a plurality of ball screw shafts 143, a Z-axis motor 144, and an R-axis motor 145 (see FIG. 5). .
  • the dispense head 141 and the mounting head 142 are arranged in a line in a straight line along the transport direction (X direction).
  • the ball screw shaft 143 and the Z-axis motor 144 are provided in each of the dispense head 141 and the mounting head 142.
  • the dispense head 141 and the mounting head 142 are examples of “a plurality of heads” in the claims.
  • the dispensing head 141 has a nozzle attached to the tip, as shown in FIG.
  • the dispense head 141 is configured to discharge cream solder supplied from a syringe (not shown) from a nozzle at the tip and apply the cream solder to the first mounting surface 21 a and the second mounting surface 22 a of the mounted object 2.
  • the mounting head 142 has a nozzle attached to the tip (lower end) as shown in FIG.
  • the mounting head 142 is configured to be able to suck and hold the electronic component 7 supplied from the tape feeder 12 by the negative pressure generated at the tip of the nozzle by a negative pressure generator (not shown). Further, the mounting head 142 causes the electronic component 7 held by the positive pressure generated at the tip of the nozzle by a positive pressure generator (not shown) to be applied to the first mounting surface 21 a and the second mounting surface 22 a of the mounted object 2. It is configured to be mountable.
  • the R-axis motor 145 is configured to rotate the mounting head 142 around the center axis of the nozzle (around the Z axis).
  • Each ball screw shaft 143 extends vertically as shown in FIG.
  • Each Z-axis motor 144 rotates a corresponding ball screw shaft 143.
  • the mounting head 142 and the dispense head 141 are movable in the vertical direction along the ball screw shaft 143 when the ball screw shaft 143 is rotated by the Z-axis motor 144. Accordingly, the mounting head 142 has a first height position where the electronic component 7 can be sucked and mounted (mounted), and a second height position where the head unit 14 can move in the horizontal direction. It is possible to move in the up and down direction.
  • the dispense head 141 can move in the vertical direction between a third height position at which cream solder can be applied and a fourth height position at which the head unit 14 can move in the horizontal direction. It has become.
  • the component recognition camera 17 is configured to take an image of the electronic component 7 sucked by the nozzles of the mounting head 142 before mounting the electronic component 7 from below (Z2 direction). Specifically, the component recognition camera 17 is provided in the vicinity of the tape feeder 12 in the base 10.
  • the board recognition camera 18 is configured to take an image of the position recognition mark attached to the mounted object 2 from above (Z1 direction) prior to mounting the electronic component 7.
  • the position recognition mark is a mark for recognizing the position of the mounted object 2.
  • the board recognition camera 18 is provided at the lower end (Z2 direction) of the back surface (Y1 direction) of the head unit 14.
  • the board recognition camera 18 is movable in the horizontal direction (X direction and Y direction) on the base 10 together with the head unit 14.
  • the laser measuring unit 19 is configured to measure the height position H ⁇ b> 1 of the mounted object 2 prior to mounting the electronic component 7. Specifically, the laser measurement unit 19 measures the height position H ⁇ b> 1 of the mounted object 2 by irradiating the mounted object 2 with laser light and receiving the reflected light reflected from the mounted object 2. To do.
  • the height position H ⁇ b> 1 measured by the laser measurement unit 19 is calculated based on the distance from the lower end position of the laser measurement unit 19 to the measurement position on the upper surface of the mounted object 2.
  • the laser measuring unit 19 is an example of the “height measuring unit” in the claims.
  • the height position H1 is an example of the “height position” in the claims.
  • the laser measuring unit 19 is attached to the back side (Y1 direction) of the head unit 14.
  • the laser measuring unit 19 can move in the horizontal direction (X direction and Y direction) on the base 10 together with the head unit 14. Further, the laser measuring unit 19 moves on the base 10 in the horizontal direction and irradiates the laser beam from above the component mounting position on the mounted object 2.
  • the control device 20 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like, and controls the operation of the mounted work apparatus 1. It is configured. Specifically, the control device 20 includes a mounted object transport unit 11, a mounted object holding unit 13, a head unit 14, a support unit 15, a pair of rail units 16, a component recognition camera 17, a board recognition camera 18, and laser measurement. The unit 19 and the tape feeder 12 are controlled according to a program stored in advance. For example, the control device 20 acquires the measurement result of the height position H1 of the mounted object 2 of the laser measurement unit 19.
  • a CPU Central Processing Unit
  • ROM Read Only Memory
  • RAM Random Access Memory
  • the control device 20 adjusts the height position H1 of the mounted object 2 by the mounted object holding unit 13 based on the measurement result of the height position H1 of the mounted object 2. Further, the control device 20 adjusts the descending amounts of the mounting head 142 and the dispensing head 141 based on the measurement result of the height position of the mounted object 2.
  • the mounted object holding unit 13 includes a moving mechanism 131, a holding part 132, and a fixing part 133.
  • the moving mechanism 131 includes an elevating mechanism part 131a, a tilting mechanism part 131b, and a rotating mechanism part 131c.
  • the elevating mechanism 131 a is configured to move the holding portion 132 in the vertical direction along an axis A ⁇ b> 1 (indicated by a dashed line) extending in the vertical direction.
  • the elevating mechanism 131 a includes a drive motor 41, a belt pulley mechanism 42, a ball screw shaft 43, and an attachment 44.
  • the drive motor 41 rotates the ball screw shaft 43 via the belt pulley mechanism 42.
  • the ball screw shaft 43 rotates around the axis A ⁇ b> 1 by the driving force of the driving motor 41 transmitted via the belt pulley mechanism portion 42.
  • the attachment portion 44 is a member for attaching the tilt mechanism portion 131b, the rotation mechanism portion 131c, and the holding portion 132 to the lifting mechanism portion 131a.
  • On the Y1 side of the attachment portion 44 an inclination mechanism portion 131b is attached.
  • a rotation mechanism part 131c and a holding part 132 are attached to the X2 side of the tilting mechanism part 131b.
  • the mounting portion 44 is movable in the vertical direction along the ball screw shaft 43 when the ball screw shaft 43 is rotated by the drive motor 41.
  • the raising / lowering mechanism part 131a can move the inclination mechanism part 131b, the rotation mechanism part 131c, and the holding
  • the axis A1 is an axis passing through the center of the ball screw shaft 43.
  • the tilt mechanism 131b is configured to tilt the holding portion 132 by rotating the holding portion 132 around an axis A2 extending in a direction perpendicular to the axis A1.
  • the tilt mechanism portion 131 b includes a drive motor 51, a belt pulley mechanism portion 52, and a rotating shaft portion 53.
  • the axis A2 is an example of the “first rotation axis” in the claims.
  • the drive motor 51 rotates the rotating shaft portion 53 via the belt pulley mechanism portion 52.
  • the drive motor 51 can be rotated forward (clockwise) and reverse (counterclockwise).
  • the rotating shaft 53 rotates around the axis A2 by the driving force of the driving motor 51 transmitted through the belt pulley mechanism 52.
  • the axis A2 is an axis that passes through the center of the rotary shaft 53.
  • a rotation mechanism 131c is attached to the end of the rotation shaft 53 on the X2 side.
  • the rotation mechanism 131c can rotate about the axis A2 together with the rotation shaft 53 when the rotation shaft 53 is rotated by the drive motor 51.
  • the tilting mechanism 131b rotates the rotating mechanism 131c around the axis A2 together with the holding part 132 to tilt in the YZ plane.
  • the tilt mechanism portion 131b can tilt the rotation mechanism portion 131c from the reference state to the Y1 direction side or the Y2 direction side perpendicular to the transport direction in an angle range of 0 degrees or more and 90 degrees or less.
  • the rotation mechanism portion 131 c is configured to rotate the holding portion 132 around an axis A ⁇ b> 3 extending in a direction perpendicular to the axis A ⁇ b> 2.
  • the rotation mechanism part 131 c includes a drive motor 61 and a belt pulley mechanism part 62.
  • the axis A3 is an example of the “second rotating shaft” in the claims.
  • the drive motor 61 rotates the holding part 132 via the belt pulley mechanism part 62.
  • the drive motor 61 can be rotated forward (clockwise) and reverse (counterclockwise).
  • the holding part 132 rotates around the axis A ⁇ b> 3 by the driving force of the driving motor 61 transmitted via the belt pulley mechanism part 62.
  • the holding unit 132 is configured to hold the mounted object 2 via the mounting member 31.
  • the holding portion 132 includes a main body portion having a cylindrical shape and a plurality (three) claw portions 63.
  • the main body is attached to the rotation mechanism 131c.
  • the plurality of (three) claw portions 63 are arranged at equiangular intervals (120 degree intervals) on the main body portion.
  • the plurality of pawls 63 are movable in the radial direction of the main body.
  • the plurality of pawl portions 63 can grip the held portion 312 of the placement member 31 by moving toward the center of the main body portion in the radial direction.
  • the plurality of pawls 63 can release the grip of the held portion 312 of the mounting member 31 by moving toward the opposite side of the center of the main body in the radial direction.
  • the fixing part 133 is a member for attaching and fixing the mounting object holding unit 13 to the base 10 as shown in FIG.
  • the mounted object holding unit 13 is fixed to the base 10 by inserting, for example, a screw or the like through the fixing portion 133 into the upper edge portion of the accommodating portion 10c.
  • the head unit 14 moves in the horizontal plane using the rail portion 16 and the support portion 15.
  • the head unit 14 moves to the vicinity of the mounted object 2.
  • the dispensing head 141 and the mounting head 142 of the head unit 14 may interfere with the mounted object 2 depending on the height position H1 of the mounted object 2.
  • the mounting object 2 is moved and changed in posture so that the cream solder can be applied to the surface of the mounting object 2 by the dispensing head 141 of the head unit 14.
  • the mounted object 2 may interfere with the mounting head 142.
  • the mounted object working apparatus 1 of the present embodiment is configured to avoid interference between the mounted object 2 held by the holding unit 132 and the nozzles of the head unit 14.
  • avoidance of interference between the head (the dispensing head 141 and the mounting head 142) of the head unit 14 and the mounted object 2 held by the holding unit 132 by the mounted object holding unit 13 will be described.
  • interference between the mounted object 2 (particularly the substrate 8) held by the holding part 132 of the mounted object holding unit 13 and the mounting head 142 is performed based on the processing shown in FIG. 7. To avoid.
  • step S1 the control device 20 acquires data on the shape of the electronic component 7, the substrate 8, the head unit 14, and the head. Specifically, the control device 20 acquires the three-dimensional data of the electronic component 7, the three-dimensional data of the substrate 8, the three-dimensional data of the head unit 14, and the three-dimensional data of the dispense head 141.
  • the three-dimensional data of the mounted object 2 representing the shape of the electronic component 7 is stored in the RAM using the three-dimensional coordinates constituted by the coordinates in the horizontal plane and the coordinates in the vertical direction.
  • the three-dimensional data of the substrate 8 representing the shape of the substrate 8 is stored in the RAM using the three-dimensional coordinates.
  • the three-dimensional data of the head unit 14 representing the shape of the head unit 14 is stored in the RAM using the three-dimensional coordinates. Further, in the control device 20, the three-dimensional data of the dispense head 141 and the mounting head 142 representing the shapes of the dispensing head 141 and the mounting head 142 are stored in the RAM using the three-dimensional coordinates.
  • the three-dimensional data of the electronic component 7 and the three-dimensional data of the substrate 8 are examples of “shape data of the mounted object” in the claims.
  • control device 20 acquires data of the movement range R1 of the mounted object holding unit 13 and the head unit 14. Specifically, the control device 20 is determined in advance based on the three-dimensional data of the entire configuration of the mounted work apparatus 1 as the data of the movement ranges R1 of the mounted object holding unit 13 and the head unit 14. The data of each moving range R1 is acquired. The data of the movement ranges R1 of the mounted object holding unit 13, the head unit 14, the dispensing head 141, and the mounting head 142 are stored in the RAM.
  • step S2 the control device 20 determines interference based on the movement range R1 of the head unit 14 and the shape of the mounted object 2. Specifically, the control device 20 performs a simulation based on the three-dimensional data of the shapes of the mounted object holding unit 13, the mounted object 2, the head unit 14, the dispensing head 141, and the mounting head 142. Here, the simulation is based on the data of the movement range R1 of the mounted object holding unit 13 and the head unit 14, and the mounted object holding unit 13 and the head unit 14 are respectively mounted at the mounting position where the electronic component 7 is mounted on the substrate 8. This is done by virtually moving.
  • control device 20 determines that interference occurs when the three-dimensional data of the head unit 14 and the three-dimensional data of the mounted object 2 held by the mounted object holding unit 13 overlap. If no interference occurs between the three-dimensional data of the head unit 14 and the three-dimensional data of the mounted object 2 in step S2, the process proceeds to step S9.
  • step S2 it is assumed that the dispense head 141 applies cream solder to the first mounting surface 21a of the mounted object 2 on the three-dimensional data as shown in FIGS.
  • the convex portion 22 of the mounted object 2 is located below the mounting head 142.
  • FIG. 9 it is assumed that the head unit 14 is moved in the Z2 direction, and the head unit 14 is virtually moved to the mounting position I1 (third height position).
  • the interference or non-interference between the mounted object 2 and the head unit 14 is expressed as shown in Table 1 based on the shape data of the substrate 8 and the movement range R1 of the head unit 14.
  • the movement range R1 is a distance from the actual position of the head unit 14 to the position of the head unit 14 that is virtually moved.
  • the shape data of the substrate 8 is stored in advance in the RAM of the control device 20.
  • the shape data of the substrate 8 is the shape of the second row from the top.
  • the movement range R1 is the mounting position I1, it is the second column.
  • the dispensing head 141 is disposed at the mounting position I1 where the cream solder can be applied to the first mounting surface 21a, the projection 22 of the mounted object 2 and the mounting head 142 interfere with each other ( (See FIG. 9). In this case, the process proceeds to step S3.
  • the movement range R1 is an example of “movement range data” in the claims.
  • step S ⁇ b> 3 the control device 20 acquires an interference avoidance position I ⁇ b> 2 where the mounting head 142 and the mounted object 2 can avoid interference. Specifically, the control device 20 causes the holding unit 132 to perform a corresponding operation such as rotation, tilt, or lift using at least one of the rotation mechanism 131c, the tilt mechanism 131b, and the lift mechanism 131a. Move to the interference avoidance position.
  • the control device 20 rotates the mounted object 2 as shown in FIG. 10A by about 180 ° by the rotation mechanism 131c.
  • a simulation result of the interference avoidance position I2 of movement to the position is acquired.
  • the control device 20 determines the position and orientation of the mounted object 2 where the mounted object 2 and the mounting head 142 do not interfere with each other by simulation.
  • the interference avoidance position I2 is an example of the “interference avoidance position” in the claims.
  • step S4 the control device 20 moves the mounted object 2 up and down, rotates, and tilts based on the interference avoidance position I2 calculated in step S3. That is, the control device 20 outputs a command necessary for moving the lifting mechanism 131a, the tilting mechanism 131b, and the rotating mechanism 131c to the interference avoidance position I2.
  • the control device 20 outputs a command to rotate about 180 ° to the rotation mechanism unit 131c. Thereby, the to-be-mounted object 2 will be in the state rotated about 180 degrees by the rotation mechanism part 131c, as shown in FIG.10 (b).
  • step S5 the control device 20 measures the height position H1 of the workpiece 2 by the laser measuring unit 19, as shown in FIG.
  • the laser measurement unit 19 moves in the transport direction (X direction) with the movement of the head unit 14 in the transport direction (X direction) by the support unit 15. Further, the laser measuring unit 19 moves in a direction (Y direction) perpendicular to the transport direction as the rail unit 16 moves in a direction (Y direction) perpendicular to the transport direction of the head unit 14.
  • the laser measuring unit 19 can move in the horizontal plane by the support unit 15 and the rail unit 16 and irradiate the entire upper surface of the mounted object 2 with the laser beam.
  • the height position H ⁇ b> 1 measured by the laser measuring unit 19 is transmitted to the control device 20 and stored in a RAM that is a storage medium of the control device 20. In this way, the control device 20 can obtain the height position H1 of the actual top surface of the mounted object 2.
  • step S6 the control device 20 confirms whether the measured height position H1 is the interference avoidance position I2. Specifically, the data of the interference avoidance position I2 acquired in step S3 is compared with the data of the height position H1 of the mounted object 2 acquired in step S5. In step S6, when the data of the interference avoidance position I2 and the data of the height position H1 of the mounted object 2 do not match, the process returns to step S4. If it is determined in step S6 that the data at the interference avoidance position I2 matches the data at the height position H1 of the mounted object 2, the process proceeds to step S7.
  • step S7 the control device 20 calculates the movable range P1 of the dispense head 141 in a state where the mounted object 2 is fixed at the interference avoidance position I2. That is, as shown in FIG. 11B, in the data on the upper surface of the mounted object 2 measured by the laser measuring unit 19, the range in which the dispensing head 141 can access without interfering with the mounted object 2 is calculated. .
  • the range accessible by the dispensing head 141 is calculated based on the three-dimensional data of the mounted object 2, the three-dimensional data of each shape of the dispensing head 141, and the data of the movement range R1 of the head unit 14.
  • step S8 the control device 20 calculates the work range P2 of the dispense head 141 in a state where the mounted object 2 is fixed at the interference avoidance position I2. That is, as shown in FIG. 11C, the control device 20 uses the support portion 15 and the rail portion 16 without moving the mounted object 2 within the range (movable range P1) that can be accessed by the dispensing head 141. By moving the head unit 14, the work range P2 in which the dispense head 141 can work without interfering with the mounted object 2 is calculated. The working range P2 of the dispensing head 141 is calculated based on the three-dimensional data of the shape of the mounted object 2 that has been moved to the interference avoidance position I2 and the data of the moving range R1 of the head unit 14.
  • step S9 the dispensing head 141 applies cream solder to the mounted object 2. That is, the dispense head 141 applies the cream solder to the application point in the work range P2 where the dispense head 141 in the mounted object 2 can work, calculated in step S8.
  • step S10 the control device 20 determines whether or not the application of cream solder to the substrate 8 of the dispense head 141 in the working range P2 of the dispense head 141 is completed.
  • the control apparatus 20 returns to step S9, when application
  • step S11 the control device 20 determines whether or not the application of the cream solder to the mounted object 2 of the dispensing head 141 in all the parts of the mounted object 2 is completed.
  • the control device 20 ends the operation when the application of the cream solder to the cream solder mounting object 2 has been completed.
  • step S12 the control device 20 acquires data on the electronic component 7, the substrate 8, the head unit 14, and the shape of the head.
  • the control device 20 acquires data of the movement range R2 of the mounted object holding unit 13, the head unit 14, and the head (the dispensing head 141 and the mounting head 142).
  • step S13 the control device 20 determines interference based on the movement range R2 of the head unit 14 and the shape of the mounted object 2. Specifically, the control device 20 performs a simulation based on the three-dimensional data of the shapes of the mounted object holding unit 13, the mounted object 2, the head unit 14, the dispensing head 141, and the mounting head 142. Here, the simulation is performed by virtually moving each to the mounting position where the electronic component 7 is mounted on the substrate 8 based on the data of the movement range R2 of the mounted object holding unit 13 and the head unit 14. At this time, the control device 20 determines that interference occurs when the three-dimensional data of the head unit 14 and the three-dimensional data of the mounted object 2 held by the mounted object holding unit 13 overlap. If no interference occurs between the three-dimensional data of the head unit 14 and the three-dimensional data of the mounted object 2 in step S13, the process proceeds to step S9.
  • the movement range R2 is an example of “movement range data” in the claims.
  • step S13 As an example of the simulation of step S13, as shown in FIGS. 13 and 14, it is assumed that the mounting head 142 mounts the electronic component 7 on the first mounting surface 21a of the mounted object 2 on the three-dimensional data. .
  • the convex portion 22 of the mounted object 2 is located below the dispensing head 141.
  • the head unit 14 is moved in the Z2 direction, and the head unit 14 is virtually moved to the mounting position I3 (first height position).
  • the interference or non-interference between the object to be mounted 2 and the head unit 14 is expressed as shown in Table 2 based on the shape data of the substrate 8 and the movement range R2 of the head unit 14.
  • the moving range R2 is a distance from the actual position of the head unit 14 to the position of the head unit 14 that is virtually moved.
  • the shape data of the substrate 8 is stored in advance in the RAM of the control device 20.
  • the shape data of the substrate 8 is the shape of the second row from the top.
  • the movement range R2 is the mounting position I2, it is the second column.
  • the mounting head 142 is disposed at a position where the electronic component 7 can be mounted on the first mounting surface 21a, the convex portion 22 of the mounted object 2 and the dispensing head 141 interfere ( (See FIG. 13B). In this case, the process proceeds to step S14.
  • step S14 the control device 20 acquires an interference avoidance position I4 that can avoid interference between the dispense head 141 and the mounted object 2. Specifically, the control device 20 causes the holding unit 132 to perform a corresponding operation such as rotation, tilt, or lift using at least one of the rotation mechanism 131c, the tilt mechanism 131b, and the lift mechanism 131a. Move to the interference avoidance position I4.
  • the interference avoidance position I4 is an example of the “interference avoidance position” in the claims.
  • step S14 based on the simulation result shown in FIG. 13B, the control device 20 causes the mounted object 2 as shown in FIG.
  • the simulation result of the interference avoidance position I4 that is the movement to the rotated position is acquired.
  • the control device 20 determines the position and orientation of the mounted object 2 where the mounted object 2 and the mounting head 142 do not interfere with each other by simulation.
  • step S15 the control device 20 moves the mounted object 2 up and down, rotates, and tilts based on the interference avoidance position I4 calculated in step S14. That is, the control device 20 outputs a command necessary for moving the lifting mechanism 131a, the tilting mechanism 131b, and the rotating mechanism 131c to the interference avoidance position I4.
  • the control device 20 outputs a command to rotate about 180 ° to the rotation mechanism unit 131c. Thereby, the to-be-mounted object 2 will be in the state rotated about 180 degrees by the rotation mechanism part 131c, as shown in FIG.14 (b).
  • step S ⁇ b> 16 the control device 20 measures the height position H ⁇ b> 1 of the mounted object 2 by the laser measuring unit 19.
  • the height position H1 of the upper surface of the workpiece 2 measured by the laser measuring unit 19 is transmitted to the control device 20 and stored in a RAM that is a storage medium of the control device 20.
  • step S17 the control device 20 confirms whether the measured height position H1 is the interference avoidance position I4. Specifically, the data of the interference avoidance position I4 acquired in step S14 is compared with the data of the height position H1 of the mounted object 2 acquired in step S16. If it is determined in step S17 that the data at the interference avoidance position I4 does not match the data at the height position H1 of the mounted object 2, the process returns to step S15. If the data at the interference avoidance position I4 matches the data at the height position H1 of the mounted object 2, the process proceeds to step S18.
  • step S18 the control device 20 calculates a movable range P3 of the mounting head 142 in a state where the mounting object 2 is fixed at the interference avoidance position I4 as shown in FIG. That is, as shown in FIG. 15B, in the data on the upper surface of the mounted object 2 measured by the laser measuring unit 19, the range in which the mounting head 142 can access without interfering with the mounted object 2 is calculated. .
  • the range that the mounting head 142 can access is calculated based on the three-dimensional data of the mounted object 2, the three-dimensional data of each shape of the mounting head 142, and the data of the movement range R ⁇ b> 2 of the head unit 14.
  • step S19 the control device 20 calculates a work range P4 of the mounting head 142 in a state where the mounted object 2 is fixed at the interference avoidance position I4. That is, as shown in FIG. 15C, the control device 20 uses the support portion 15 and the rail portion 16 without moving the mounted object 2 in the range (movable range P3) that the mounting head 142 can access.
  • the work range P ⁇ b> 4 in which the mounting head 142 can work without interfering with the mounted object 2 is calculated.
  • the work range P4 of the mounting head 142 is calculated based on the three-dimensional data of the shape of the mounted object 2 that has been moved to the interference avoidance position I4 and the data of the movement range R2 of the head unit 14.
  • step S20 the mounting head 142 mounts the electronic component 7 on the mounted object 2. That is, the mounting head 142 mounts the electronic component 7 on the mounting portion within the work range P4 in which the mounting head 142 in the mounted object 2 can work, calculated in step S19.
  • step S21 the control device 20 determines whether or not the mounting of the electronic component 7 by the mounting head 142 is completed in the work range P2 of the mounting head 142. If the mounting of the electronic component 7 by the mounting head 142 has not been completed, the control device 20 proceeds to step S20.
  • step S22 the control device 20 determines whether or not the mounting of the electronic component 7 by the mounting head 142 has been completed in all parts of the mounted object 2. If the mounting of the electronic component 7 by the mounting head 142 has been completed, the control device 20 ends the operation.
  • the electronic component 7 is mounted on the substrate 8 even when the electronic component 7 is mounted on the substrate 8 as shown in FIG.
  • the interference avoidance position is calculated by the method described above. That is, in step S2 or step S13, the control device 20 performs a simulation based on the three-dimensional data of the mounted object 2, the head unit 14, the dispense head 141, and the mounting head 142 on which the electronic component 7 is mounted on the substrate 8. .
  • the interference avoidance position is calculated by the method described above.
  • the control device 20 uses the two mounting heads 142 for the mounting operation at the interference avoidance position.
  • the electronic component 7 may be mounted on the substrate 8. Further, the control device 20 may continuously perform the mounting operation of mounting the electronic component 7 on the substrate 8 by the mounting head of one cycle by using the two mounting heads 142 for the mounting operation at the interference avoidance position.
  • step S23 the control device 20 acquires data on the shapes of the electronic component 7, the substrate 8, the head unit 14, and the head (the dispensing head 141 and the mounting head 142). In addition, the control device 20 acquires data of the movement range R3 of the mounted object holding unit 13 and the head unit 14.
  • step S24 the control device 20 determines interference based on the movement range R3 of the head unit 14 and the shape of the mounted object 2. Specifically, the control device 20 performs a simulation based on the three-dimensional data of the shapes of the mounted object holding unit 13, the mounted object 2, the head unit 14, the dispensing head 141, and the mounting head 142. Here, the simulation is performed by moving the head unit 14 in the X direction or the Y direction based on the data of the movement range R3 of the head unit 14. At this time, the control device 20 determines that interference occurs when the three-dimensional data of the head unit 14 and the three-dimensional data of the mounted object 2 held by the mounted object holding unit 13 overlap. If no interference occurs between the three-dimensional data of the head unit 14 and the three-dimensional data of the mounted object 2 in step S24, the process proceeds to step S27.
  • the movement range R3 is an example of “movement range data” in the claims.
  • step S24 As an example of the simulation of step S24, as shown in FIG. 19, a case is assumed in which the dispense head 141 and the convex portion 22 of the mounted object 2 interfere on the three-dimensional data.
  • the convex portion 22 of the mounted object 2 is located below the mounting head 142.
  • FIG. 20 it is assumed that the head unit 14 is moved in the X1 direction, and the head unit 14 is virtually moved to the passing position P1.
  • the interference or non-interference between the mounted object 2 and the head unit 14 is expressed as shown in Table 3 based on the shape data of the substrate 8 and the movement range R3 of the head unit 14.
  • the movement range R3 is a distance from the actual position of the head unit 14 to the position of the head unit 14 that is virtually moved.
  • the shape data of the substrate 8 is stored in advance in the RAM of the control device 20.
  • the shape data of the substrate 8 is the shape of the second row from the top. Further, in Table 3, when the movement range R3 is the passing position P1, it is the second column. At this time, as shown in Table 3, if the head unit 14 is moved in the X1 direction as it is by the support portion 15, the dispense head 141 interferes with the convex portion 22 of the mounted object 2. In this case, the process proceeds to step S25.
  • step S25 the control device 20 acquires an interference avoidance position I5 where the dispense head 141 and the mounted object 2 do not interfere with each other. Specifically, the control device 20 causes the holding unit 132 to perform a corresponding operation such as rotation, tilt, or lift using at least one of the rotation mechanism 131c, the tilt mechanism 131b, and the lift mechanism 131a. Move to the interference avoidance position I5.
  • the interference avoidance position I5 is an example of the “interference avoidance position” in the claims.
  • the control device 20 avoids the interference as shown in FIG. 21 (b) by lowering the mounted object 2 by the lifting mechanism 131a.
  • the position I5 is acquired.
  • the control apparatus 20 may output the interference avoidance position I5 which inclines the to-be-mounted object 2 with a tilting machine rear part as shown in FIG.
  • step S ⁇ b> 26 the control device 20 raises, lowers, rotates, and tilts the mounted object 2 based on the interference avoidance position I ⁇ b> 5 calculated in step S ⁇ b> 17. That is, the control device 20 outputs a command for driving the elevating mechanism 131a, the tilting mechanism 131b, and the rotating mechanism 131c. At the interference avoidance position I5 based on the simulation described above, the control device 20 outputs a command to lower or tilt the mounted object 2 to the lifting mechanism 131a.
  • step S27 the control device 20 determines whether or not the movement or posture change of the mounted object 2 is completed. The control device 20 ends the work when the movement or the posture change of the mounted object 2 has been completed.
  • the control device 20 of the mounted object working device 1 causes the mounted object 2 and the head to interfere with the mounted object 2 when the head (dispensing head 141 or mounting head 142) works.
  • the interference avoidance position (I2, I4, I5) of the holding unit 132 is acquired.
  • the control device 20 is configured to move the holding unit 132 to the interference avoidance positions (I2, I4, I5) by the moving mechanism 131.
  • the control apparatus 20 can move the holding
  • the control device 20 causes the interference avoidance position (I2) when interference occurs between the dispensing head 141 or the mounting head 142 and the mounted object 2. , I4, I5), and the holding mechanism 132 is moved to the interference avoidance position (I2, I4, I5) by the moving mechanism 131.
  • the holding mechanism 132 is moved to the interference avoidance position (I2, I4, I5) by the moving mechanism 131, so that the dispensing head 141 or the mounting head 142 and the mounted object 2 are moved. Interference can be avoided.
  • the control device 20 performs the mounting object 2 based on the three-dimensional shape data of the mounting object 2 and the movement range data (R1, R2, R3) of the head unit 14. And whether or not there is interference between the head and the head.
  • the control apparatus 20 is comprised so that interference avoidance position (I2, I4, I5) may be acquired when interference arises in the to-be-mounted object 2 and a head. Thereby, it is possible to determine whether or not interference between the mounted object 2 and the head occurs on the three-dimensional data. As a result, it is possible to easily and quickly determine the presence or absence of interference between the mounted object 2 and the plurality of heads, rather than determining whether or not interference occurs by actually moving the mounted object 2 and the head. it can.
  • the control device 20 performs at least one of the operations of rotating, lowering, or tilting the holding unit 132 by the moving mechanism 131, so that the interference avoidance position (I2, I4). , I5), the holding unit 132 is moved.
  • the control apparatus 20 can avoid interference with the to-be-mounted object 2 and a head, without moving the holding
  • the holding unit 132 is moved in a horizontal plane in a straight line, and the holding unit 132 is moved to the interference avoidance position (I2, I4, I5), compared to the case where at least one of the operations of rotating, lowering or tilting the holding unit 132 is performed. ) Can be reduced (linear movement mechanism).
  • the moving mechanism 131 includes the elevating mechanism 131a, the tilt mechanism 131b, and the rotating mechanism 131c.
  • the control device 20 causes the holding unit 132 to perform a corresponding operation of rotating, lowering, or tilting using at least one of the rotation mechanism unit 131c, the lifting mechanism unit 131a, and the tilting mechanism unit 131b, thereby avoiding interference.
  • the holding part 132 is moved to positions (I2, I4, I5).
  • the rotation mechanism 131c is attached to the tilting mechanism 131b
  • the tilting mechanism 131b is attached to the lifting mechanism 131a, so that the mounted object 2 is tilted by the tilting mechanism 131b and then mounted.
  • the object 2 can be rotated by the rotation mechanism 131c.
  • the rotation mechanism part 131c is attached to the inclination mechanism part 131b and the inclination mechanism part 131b is attached to the elevating mechanism part 131a, the mounted object 2 is not inclined by the inclination mechanism part 131b.
  • the object 2 can be rotated by the rotation mechanism 131c.
  • the to-be-mounted object 2 can be rotated in the state in which the to-be-mounted object 2 is not inclined, the to-be-mounted object 2 is compared with the case where the to-be-mounted object 2 is rotated in the state in which the to-be-mounted object 2 is inclined.
  • the turning radius can be reduced. As a result, it is possible to suppress interference between the mounted object 2 and the dispensing head 141 and the mounting head 142 rather than a mechanism that rotates the mounted object 2 in a state where the mounted object 2 is inclined.
  • the mounted object 2 includes the substrate 8 having a three-dimensional shape and the plurality of electronic components 7 mounted on the substrate 8. Further, each time a plurality of electronic components 7 are mounted on the substrate 8, the control device 20 determines the shape of the mounted object 2 including the electronic components 7 and the substrate 8 and the movement range of the head (R 1, R 2, Based on R3), when interference occurs between the mounted object 2 and the plurality of heads, the holding unit 132 is moved to the interference avoidance position (I2, I4, I5) by the moving mechanism 131.
  • the control device 20 determines the shape of the mounted object 2 including the electronic components 7 and the substrate 8 and the movement range of the head (R 1, R 2, Based on R3), when interference occurs between the mounted object 2 and the plurality of heads, the holding unit 132 is moved to the interference avoidance position (I2, I4, I5) by the moving mechanism 131.
  • the holding unit 132 is moved to the interference avoidance position (I2, I4, I5) in consideration of a change in the shape of the mounted object 2 mounted each time the plurality of electronic components 7 are mounted on the substrate 8. ).
  • the interference avoidance position I2, I4, I5
  • the holding unit 132 is moved to the interference avoidance position (I2, I4, I5) in consideration of a change in the shape of the mounted object 2 mounted each time the plurality of electronic components 7 are mounted on the substrate 8.
  • the control device 20 when the electronic device 7 is mounted on the substrate 8 using the two mounting heads 142, the control device 20 performs one cycle at the interference avoidance position (I2, I4). It is configured to perform the mounting operation collectively. Thereby, the mounting operation of one cycle can be performed collectively by the mounting heads 142 arranged in a straight line without moving the mounted object 2 by the holding unit 132 from the interference avoidance position (I2, I4). As a result, it is possible to minimize the movement of the mounted object 2 by the holding unit 132 for the two mounting heads 142 to perform the mounting operation on the mounted object 2.
  • the head unit 14 includes the laser measurement unit 19 that measures the height position H1 of the mounted object 2.
  • the control device 20 measures the height position H1 of the mounted object 2 by the laser measuring unit 19 in a state where the holding unit 132 is moved to the interference avoidance position (I2, I4, I5), and the holding unit 132. Is located at the interference avoidance position (I2, I4, I5). Thereby, it can be confirmed by the laser measurement part 19 whether the to-be-mounted object 2 is arrange
  • the head unit 14 includes the dispense head 141 and the mounting head 142, but the present invention is not limited to this. That is, according to the present invention, the head unit may include a plurality of either the dispensing head or the mounting head. The head unit may include a plurality of dispensing heads and mounting heads. Moreover, the head which performs work other than a dispensing head and a mounting head may be included.
  • the dispense head 141 is configured to apply cream solder on the substrate 8, but the present invention is not limited to this. That is, the present invention may be configured such that the dispensing head applies an adhesive or a conductive paste on the substrate.
  • the control device 20 mounts the electronic component 7 on all the mounting parts on the substrate 8 by the mounting head 142 after the dispensing head 141 applies the cream solder to all the application parts on the substrate 8.
  • the present invention is not limited to this. That is, in the present invention, the application of cream solder on the substrate by the dispense head and the mounting of the electronic component by the mounting head may be alternately performed.
  • the mounted object 2 includes the three-dimensional board 8, but the present invention is not limited to this. That is, in the present invention, the substrate may be a planar substrate.
  • the control device 20 calculates the interference avoidance positions (I2, I4, I5) by simulation using a figure represented using virtual space coordinates.
  • the present invention is not limited to this. Not. That is, according to the present invention, the control device may calculate the interference avoidance position by numerical calculation using the dimensions of the dispense head, the mounting head, and the mounting object.
  • the control device 20 performs the operation of the mounting head 142 during one cycle of mounting the electronic component 7 on the substrate 8 by using the two mounting heads 142. It is not limited to. In other words, in the present invention, the control device may perform the operation of the mounting head for one cycle using three or more mounting heads 142.
  • the control device 20 places the mounted object 2 at the interference avoidance position (I2, I4, I5) using any one of the elevating mechanism 131a, the tilting mechanism 131b, and the rotating mechanism 131c.
  • the present invention is not limited to this. That is, according to the present invention, the control device may move the mounted object to the interference avoidance position by using two or more of the elevating mechanism unit, the tilting mechanism unit, and the rotating mechanism unit.
  • the laser measuring unit 19 is used as the “height measuring unit” in the claims, but the present invention is not limited to this. That is, the present invention may use a touch sensor as the “height measurement unit” in the claims.
  • the processing operation of the control unit has been described using a flow-driven flowchart in which processing is performed in order along the processing flow.
  • the processing operation of the control unit may be performed by event-driven (event-driven) processing that executes processing in units of events. In this case, it may be performed by a complete event drive type or a combination of event drive and flow drive.

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Abstract

Ce dispositif de travail d'objet monté (1) est conçu de telle sorte que : des positions d'évitement d'interférence (I2, I4, I5) d'une partie de maintien (132) sont acquises sur la base de la forme d'un objet monté (2) maintenu dans la partie de maintien (132) et de plages de déplacement (R1, R2, R3) d'une unité de tête (14) lorsqu'une interférence se produit entre l'objet monté (2) et les têtes (141, 142) ; et la partie de maintien (132) se déplace vers les positions d'évitement d'interférence (I2, I4, I5) au moyen d'un mécanisme de déplacement (131).
PCT/JP2017/001068 2017-01-13 2017-01-13 Dispositif de travail d'objet monté WO2018131143A1 (fr)

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DE112017006815.0T DE112017006815T5 (de) 2017-01-13 2017-01-13 Bestückungskörperarbeitsvorrichtung
PCT/JP2017/001068 WO2018131143A1 (fr) 2017-01-13 2017-01-13 Dispositif de travail d'objet monté
JP2018561756A JP6753956B2 (ja) 2017-01-13 2017-01-13 被実装物作業装置

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CN112123928A (zh) * 2020-10-16 2020-12-25 深圳市品诚伟创电子有限公司 一种厚膜导体浆料的印刷装置及其工艺
CN113710082A (zh) * 2021-08-09 2021-11-26 深圳市埃尔法光电科技有限公司 一种电路板加工设备及其加工方法
CN113843103A (zh) * 2021-10-21 2021-12-28 洛阳富道生物科技有限公司 一种细胞工厂加工用点胶装置
WO2022013941A1 (fr) * 2020-07-14 2022-01-20 株式会社Fuji Dispositif de simulation et procédé de simulation

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JP2009123904A (ja) * 2007-11-14 2009-06-04 Panasonic Corp 部品実装装置、制御方法、およびプログラム
JP2012119643A (ja) * 2010-12-03 2012-06-21 Fuji Mach Mfg Co Ltd 電子回路部品装着方法，電子回路部品装着機および立体被装着体保持治具
JP2017005206A (ja) * 2015-06-15 2017-01-05 パナソニックＩｐマネジメント株式会社 実装装置

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JP2009123904A (ja) * 2007-11-14 2009-06-04 Panasonic Corp 部品実装装置、制御方法、およびプログラム
JP2012119643A (ja) * 2010-12-03 2012-06-21 Fuji Mach Mfg Co Ltd 電子回路部品装着方法，電子回路部品装着機および立体被装着体保持治具
JP2017005206A (ja) * 2015-06-15 2017-01-05 パナソニックＩｐマネジメント株式会社 実装装置

Cited By (5)

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Publication number Priority date Publication date Assignee Title
WO2022013941A1 (fr) * 2020-07-14 2022-01-20 株式会社Fuji Dispositif de simulation et procédé de simulation
JP7429293B2 (ja) 2020-07-14 2024-02-07 株式会社Fuji シミュレーション装置およびシミュレーション方法
CN112123928A (zh) * 2020-10-16 2020-12-25 深圳市品诚伟创电子有限公司 一种厚膜导体浆料的印刷装置及其工艺
CN113710082A (zh) * 2021-08-09 2021-11-26 深圳市埃尔法光电科技有限公司 一种电路板加工设备及其加工方法
CN113843103A (zh) * 2021-10-21 2021-12-28 洛阳富道生物科技有限公司 一种细胞工厂加工用点胶装置

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