WO2015053329A1 - 基板処理方法および基板処理装置 - Google Patents
基板処理方法および基板処理装置 Download PDFInfo
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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Abstract
Description
3 スピンチャック(基板保持ユニット)
5 リンス液ノズル(リンス液供給ユニット)
7 スピンモータ(基板回転ユニット)
14 薬液バルブ(薬液供給ユニット)
16 リンス液バルブ(リンス液供給ユニット)
20 制御装置(制御ユニット)
71 ノズル(リンス液供給ユニット)
82 ノズル(リンス液供給ユニット)
91 ノズル(リンス液供給ユニット)
101 天井ノズル(リンス液供給ユニット)
A1 回転軸線
W 基板
Claims (9)
- 基板保持ユニットによって水平姿勢に保持されている基板の上面に薬液を供給する薬液工程と、
前記基板の回転速度を零または低速に保持しながら、前記基板の上面にパドル状のリンス液の液膜を保持することにより、前記基板の上面に付着している薬液を洗い流すパドルリンス工程とを含み、
前記薬液工程は、前記基板の回転速度を零または低速に保持しながら前記基板の上面にパドル状の薬液の液膜を保持する薬液パドル工程を含み、前記薬液パドル工程の終了に引き続いて、前記パドルリンス工程が実行されるようになっており、
前記パドルリンス工程は、前記基板の上面にリンス液を供給して、前記基板の上面に保持されている薬液の液膜をリンス液で置換する工程を含む、基板処理方法。 - 前記薬液はエッチング液である、請求項1に記載の基板処理方法。
- 前記パドルリンス工程前の基板の上面は疎水性を示している、請求項1または2に記載の基板処理方法。
- 前記薬液パドル工程は、前記薬液工程の全期間に亘って実行される、請求項1~3のいずれか一項に記載の基板処理方法。
- 前記薬液パドル工程の実行に先立って、前記基板の上面に水を供給して、当該上面に水の液膜を保持する前供給工程を含み、前記薬液パドル工程は、前記基板の上面に薬液を供給して、前記基板の上面に保持されている水の液膜を薬液で置換する工程を含む、請求項1~4のいずれか一項に記載の基板処理方法。
- 前記パドルリンス工程の後、前記リンス液よりも表面張力の低い低表面張力液を前記基板の上面に供給して、前記基板の上面に保持されているパドル状のリンス液の液膜を低表面張力液で置換する低表面張力液置換工程をさらに含む、請求項5の基板処理方法。
- 前記薬液パドル工程に並行して、前記基板の上面における薬液の供給位置を移動させる薬液供給位置移動工程をさらに含む、請求項1~6のいずれか一項に記載の基板処理方法。
- 前記パドルリンス工程に並行して、前記基板の上面におけるリンス液の供給位置を移動させるリンス液供給位置移動工程をさらに含む、請求項1~7のいずれか一項に記載の基板処理方法。
- 基板を水平姿勢に保持する基板保持ユニットと、
前記基板を鉛直な回転軸線まわりに回転させるための基板回転ユニットと、
前記基板の表面に薬液を供給するための薬液供給ユニットと、
前記基板の表面にリンス液を供給するためのリンス液供給ユニットと、
前記基板回転ユニット、前記薬液供給ユニットおよび前記リンス液供給ユニットを制御して、前記基板の回転速度を零または低速に保持しながら、前記基板の上面に薬液を供給して、当該基板の上面にパドル状の薬液の液膜を保持する薬液パドル工程と、前記薬液パドル工程の終了に引き続いて実行され、前記基板の回転速度を零または低速に保持しながら、前記基板の上面にパドル状のリンス液の液膜を保持することにより、前記基板の上面に付着している薬液を洗い流すパドルリンス工程とを実行し、かつ前記パドルリンス工程において、前記基板の上面にリンス液を供給して、前記基板の上面に保持されている薬液の液膜をリンス液で置換する工程を実行する制御ユニットを含む、基板処理方法。
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US15/028,243 US10312114B2 (en) | 2013-10-10 | 2014-10-08 | Substrate processing method, and substrate processing device |
KR1020167011823A KR101838418B1 (ko) | 2013-10-10 | 2014-10-08 | 기판 처리 방법 및 기판 처리 장치 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107591315A (zh) * | 2016-05-27 | 2018-01-16 | 细美事有限公司 | 用于处理基板的装置和方法 |
CN108722790A (zh) * | 2017-04-24 | 2018-11-02 | 株式会社斯库林集团 | 涂敷方法 |
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KR20180003109A (ko) * | 2016-06-30 | 2018-01-09 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
JP6868991B2 (ja) * | 2016-09-26 | 2021-05-12 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
US10766054B2 (en) | 2016-09-27 | 2020-09-08 | SCREEN Holdings Co., Ltd. | Substrate processing method and substrate processing apparatus |
JP6575538B2 (ja) * | 2017-01-23 | 2019-09-18 | 信越半導体株式会社 | 半導体ウェーハの洗浄方法 |
JP6910164B2 (ja) * | 2017-03-01 | 2021-07-28 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
KR102073339B1 (ko) * | 2017-03-02 | 2020-02-05 | 무진전자 주식회사 | 웨이퍼 세정방법 |
JP7390837B2 (ja) | 2019-09-27 | 2023-12-04 | 東京エレクトロン株式会社 | 基板処理方法および基板処理装置 |
JP7386700B2 (ja) * | 2019-12-27 | 2023-11-27 | 株式会社Screenホールディングス | 基板処理方法 |
JP2023094445A (ja) * | 2021-12-23 | 2023-07-05 | 株式会社Sumco | 半導体ウェーハの洗浄方法および半導体ウェーハの製造方法 |
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- 2014-10-08 WO PCT/JP2014/076976 patent/WO2015053329A1/ja active Application Filing
- 2014-10-08 US US15/028,243 patent/US10312114B2/en active Active
- 2014-10-09 TW TW103135181A patent/TWI607500B/zh active
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Cited By (4)
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CN107591315A (zh) * | 2016-05-27 | 2018-01-16 | 细美事有限公司 | 用于处理基板的装置和方法 |
CN107591315B (zh) * | 2016-05-27 | 2020-12-29 | 细美事有限公司 | 用于处理基板的装置和方法 |
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CN108722790A (zh) * | 2017-04-24 | 2018-11-02 | 株式会社斯库林集团 | 涂敷方法 |
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KR101838418B1 (ko) | 2018-03-13 |
TW201523720A (zh) | 2015-06-16 |
JP6256828B2 (ja) | 2018-01-10 |
US20160247698A1 (en) | 2016-08-25 |
JP2015076558A (ja) | 2015-04-20 |
US10312114B2 (en) | 2019-06-04 |
KR20160067216A (ko) | 2016-06-13 |
TWI607500B (zh) | 2017-12-01 |
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