WO2015045309A1 - プリント基板及びプリント基板への実装方法 - Google Patents
プリント基板及びプリント基板への実装方法 Download PDFInfo
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- WO2015045309A1 WO2015045309A1 PCT/JP2014/004679 JP2014004679W WO2015045309A1 WO 2015045309 A1 WO2015045309 A1 WO 2015045309A1 JP 2014004679 W JP2014004679 W JP 2014004679W WO 2015045309 A1 WO2015045309 A1 WO 2015045309A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/085—Coaxial-line/strip-line transitions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/04—Fixed joints
- H01P1/045—Coaxial joints
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
Definitions
- the present invention relates to a printed circuit board and a mounting method on the printed circuit board, and more particularly to a printed circuit board with reduced deterioration of transmission characteristics and a mounting method to the printed circuit board.
- Patent Document 1 discloses a technique related to a multilayer printed board having desired frequency band rejection characteristics.
- Patent Document 1 does not show a solution for a decrease in impedance due to contact between a terminal of a coaxial connector and a pad of a printed circuit board and a deterioration in transmission characteristics.
- An object of the present invention is to provide a printed circuit board that solves the above-described problem of transmission characteristic degradation.
- the printed circuit board of the present invention includes a substrate, a circular signal pad provided on the substrate, a donut-shaped ground pad sandwiching the substrate surrounding the signal pad in a donut shape, and further surrounding an outer periphery thereof, and the signal And one or more recesses disposed on the substrate surrounding the pad in a donut shape.
- the method for mounting on a printed circuit board includes a substrate, a circular signal pad provided on the substrate, a donut-shaped ground pad sandwiching the substrate surrounding the signal pad in a donut shape and further surrounding an outer periphery thereof And forming at least one concave portion on the substrate surrounding the signal pad in a donut shape.
- impedance mismatch due to stray capacitance at the contact portion between the coaxial connector and the printed circuit board can be suppressed, and good transmission characteristics can be obtained.
- FIG. 7 is a cross-sectional view along AA ′ in FIG. 6.
- FIG. 7 is a cross-sectional view along B-B ′ in FIG. 6.
- FIG. 7 is a cross-sectional view taken along the line C-C ′ in FIG. 6.
- It is the upper side figure and sectional drawing of a printed circuit board when there is no recessed part as a comparative example.
- It is sectional drawing (part) of the printed circuit board in 2nd embodiment of this invention.
- It is sectional drawing (part) which shows the case where a connector is connected to the printed circuit board in 2nd embodiment of this invention.
- It is a figure which shows the upper side figure and sectional drawing of the printed circuit board in other embodiment of this invention.
- FIG. 1 is a top view of a printed circuit board according to the present embodiment and a cross-sectional view along the line XX ′ in the top view.
- the printed circuit board 100 of this embodiment includes a substrate 1, a signal pad 2, a GND (ground) pad 3, a recess 4, a signal through hole 5, and a GND through hole 6.
- the substrate 1 has a donut-shaped GND surrounding the outer periphery of the substrate 1 with a circular signal pad 2 and a substrate 1 surrounding the periphery of the substrate in a donut shape.
- a pad 3 is provided. Since the signal pad 2 and the GND pad 3 are circular, the shape of the substrate 1 surrounding the signal pad 2 also has a shape constituted by a circle.
- a plurality of circular recesses 4 are arranged on the substrate 1 between the signal pad 2 and the GND pad 3 at substantially equal intervals in a substantially concentric manner with respect to the signal pad 2.
- the signal pad 2 is provided on the substrate 1 as shown in the top view of FIG. In addition, as shown in the sectional view of FIG. 1, the signal pad 2 is adjacent to and electrically connected to the end of the signal through hole 5 formed in the thickness direction of the printed circuit board 100.
- the GND pad 3 surrounds the signal pad 2 and the signal pad 2, and surrounds the substrate 1 having a plurality of concave portions provided substantially concentrically with respect to the signal pad 2. Is provided.
- the GND pad 2 is adjacent to and electrically connected to the end of the GND through hole 6 formed in the thickness direction of the printed circuit board 100.
- a plurality of recesses 4 are provided on the substrate 1 so as to surround the signal pad 2 so as to be substantially concentric with the signal pad 2. Further, as shown in the cross-sectional view of FIG. 1, the substrate 1 between the signal pad 2 and the GND pad 3 and between the signal through hole 5 and the GND through hole 6 is predetermined in the thickness direction of the printed circuit board 100. Is provided at a depth of.
- the signal through hole 5 is provided in the thickness direction of the printed circuit board 100.
- the signal through hole 5 is adjacent to and electrically connected to the signal pad 2 provided on one surface of the printed circuit board 100.
- the GND through hole 6 is provided in the thickness direction of the printed circuit board 100.
- the GND through hole 6 is adjacent to and electrically connected to the GND pad 3 provided on one surface of the printed circuit board 100.
- FIG. 1 showing the printed circuit board 100 of the present embodiment and FIG. 8 showing the printed circuit board 200 without the recesses 4 will be compared.
- the characteristic impedance Z0 [ ⁇ ] of the connection portion of the printed circuit board 100 is determined by the diameter (Ds) of the signal pad 2 and the inner diameter (Dg) of the GND pad 3.
- Z0 [ ⁇ ] 60 / ⁇ r ⁇ log e (Dg / Ds) ⁇ Expression (1) It can be calculated with This calculation is the same for the printed circuit board 200 having no recess 4 in FIG.
- ⁇ r is the relative dielectric constant of the substrate 1.
- Z0 [ ⁇ ] is designed to be 50 ⁇ in order to match this value (impedance matching).
- FIG. 2 shows a signal reflection characteristic indicating a state in which the characteristic impedance does not match between the coaxial connector and the printed circuit board 100 (impedance is not matched).
- a Gaussian pulse is applied as a signal from the coaxial connector side, and the reflection amount (%) with respect to the elapsed time after application is calculated.
- the dimensions around the connection part of the printed circuit board used for the measurement with the coaxial connector are as follows: Ds is 0.6 to 0.7 mm, Dg is 1 to 2 mm, the diameter of the recess 4 is 0.2 to 0.3 mm, and the GND pad The outer diameter is 5 mm, the inner diameter of the signal through hole and the GND through hole is 0.3 to 0.4 mm, the distance between the signal through hole and the GND through hole is about 1 to 2 mm, and the material is a glass epoxy material with ⁇ r of about 4 is there.
- the value indicated by the broken line in FIG. 2 is the reflection amount 9 when there is no recess 4, and the solid line is the reflection amount 10 when there is the recess 4.
- the impedance is matched between the coaxial connector and the printed circuit board 100, and the amount of signal reflection is reduced.
- the frequency dependence of reflection loss (Return Loss, return loss) before and after the formation of the recess 4 in the substrate 1 surrounding the signal pad 2 in a donut shape is shown in FIG. 3, and insertion loss (Insertion Loss, insertion loss). The frequency dependence of is shown in FIG. In FIG.
- the broken line indicates the reflection loss 11 when there is no recess 4
- the solid line indicates the reflection loss 12 when there is the recess 4.
- the broken line indicates the insertion loss 13 when there is no recess 4
- the solid line indicates the reflection loss 14 when there is the recess 4. 2 to 4, it can be seen that the printed circuit board 100 of this embodiment has less reflection amount and insertion loss and better transmission characteristics than the printed circuit board without the recess 4.
- the relative dielectric constant of the substrate 1 which is an insulator is about 3 to 5
- FIG. 5 shows an image of the printed circuit board 300 and the coaxial connector 101 to be mounted in this embodiment.
- a coaxial cable is connected to the coaxial connector 101, and the apparatus is connected to a measuring instrument or apparatuses.
- the coaxial connector 101 used here is assumed to be connected to the printed circuit board 300 by crimping with a screw or the like.
- FIG. 6 is a cross-sectional structure taken along the plane S in FIG. 5 (the coaxial connector 101 has a portion other than a portion having a screw hole). In particular, the contact portion between the coaxial connector 101 and the printed board 300 is enlarged. Further, cross sections along AA ′, BB ′, and CC ′ in FIG. 6 are shown in FIGS. 7A, 7B, and 7C. As shown in FIGS. 7A, 7B, and 7C, the cross-sections along AA ′ and BB ′ have a coaxial cross-sectional structure.
- impedance matching between the coaxial connector 101 indicated by the cross section along AA ′ and the signal pad 2 and the GND pad 3 indicated by the cross section along BB ′ can be said to be easy in designing the characteristic impedance. .
- these characteristic impedances are designed at 50 ⁇ .
- the CC ′ section is also a pseudo coaxial structure, and it is easy to design with a characteristic impedance of 50 ⁇ .
- the lines having the same characteristic impedance are connected, the impedance is matched and the transmission characteristics are not affected.
- impedance mismatching occurs. To do. As shown in FIGS. 6 and 7, this can be interpreted as a non-uniform physical structure at the boundary surface and stray capacitance added as shown in FIG. 6 as an example.
- FIG. 9 shows a cross-sectional view of a printed circuit board 400 according to the second embodiment of the present invention.
- This embodiment is different from the first embodiment in that the recess 4 is provided in the substrate 1 between a plurality of lands (signal lands 15 or GND lands 16) on the substrate 1.
- FIG. 10 shows a cross-sectional view of a state in which the connector 103 having a plurality of connector terminals 103a is installed on the printed circuit board 400.
- the connector 103 has a connector terminal 103a and a mold 103b.
- the configuration of the printed circuit board 400 is the same as that of the first embodiment except that the concave portion 4 is arranged on the substrate 1 between a plurality of lands (the signal land 15 or the GND land 16). That is, the recess 4 can be disposed between the two signal lands 15, between the two GND lands 16, and between the signal land 15 and the GND lands 16.
- This configuration has the effect of reducing stray capacitance and maintaining good transmission characteristics as in the case where the coaxial connector 101 in the first embodiment is installed.
- a connector for connecting a backplane or a sub board can be used as the connector 103.
- the example in which the connector 103 having a plurality of connector terminals is installed has been shown. However, even when a plurality of connectors having one connector terminal are installed, the recesses 4 are formed in the substrate 1 between the plurality of lands. If provided, the same effect can be obtained.
- the printed circuit board 100 includes the substrate 1, the signal pad 2, the GND pad 3, the concave portion 4, the signal through hole 5, and the GND through hole 6.
- the substrate 100 may appropriately include various members and structures such as the GND layer 8.
- a signal through hole 7 is provided in the signal land 7 inside the printed circuit board 100.
- the GND through hole 6 is physically and electrically connected to the GND layer 8.
- a plurality of circular recesses 4 are arranged substantially concentrically with the signal pad 2 in the substrate 1 between the signal pad 2 and the GND pad 3 at substantially equal intervals. .
- Capacitive coupling can be suppressed if at least one recess 4 is arranged, but this is effective. However, if the recess 4 is arranged substantially concentrically with respect to the signal pad 2, the electromagnetic wave at the connection portion between the coaxial connector and the printed circuit boards 100 and 200 is effective. It is more preferable because the distribution of the field is not changed as much as possible, and an effect can be obtained by suppressing the characteristic deterioration of the transmitted signal. Even if it is not substantially concentric, any arrangement that suppresses the change in the distribution of the electromagnetic field described above may be used. For example, it can be arranged so as to be substantially point-symmetric or line-symmetric with respect to the signal pad 2.
- the recess 4 can be formed in a donut shape so as to surround the signal pad 2.
- the number and size of the places where the recesses 4 are arranged can be appropriately changed according to the stray capacitance generated.
- the shape at the time of seeing in the cross section of the depth direction of the recessed part 4 can be formed so that it may become a bowl shape and a column shape.
- the recess 4 may be a drill hole.
- Appendix 2 The printed circuit board according to appendix 1, wherein the recess is disposed so as to be substantially point-symmetric or line-symmetric with respect to the signal pad.
- Appendix 3 The printed circuit board according to appendix 1 or 2, wherein the recesses are arranged substantially concentrically with the signal pad at substantially equal intervals.
- Appendix 4 The printed circuit board according to any one of appendices 1 to 3, wherein the concave portion is arranged so as not to change a distribution of an electromagnetic field generated when the coaxial connector is connected to the signal pad.
- Appendix 7 The printed circuit board according to appendix 1, wherein the recess is formed in a donut shape surrounding the signal pad.
- a substrate A printed circuit board comprising: one or more recesses disposed in the substrate between a plurality of donut-shaped lands provided on the substrate.
- Appendix 9 The printed circuit board according to appendix 8, wherein the plurality of lands are signal lands, ground lands, or both.
- Appendix 10 The printed circuit board according to appendix 8 or 9, wherein the recess is a recess formed in a bowl shape or a column shape from above the substrate.
- a substrate A circular signal pad provided on the substrate;
- a printed circuit board comprising a donut-shaped ground pad sandwiching the substrate surrounding the signal pad in a donut shape and further surrounding the outer periphery thereof, A mounting method on a printed circuit board, wherein one or more concave portions are formed on the substrate surrounding the signal pad in a donut shape.
- Appendix 12 The printed circuit board according to appendix 8 or 9, wherein the recess is formed in a donut shape surrounding the signal pad.
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Abstract
Description
次に、本実施形態について図面を参照して詳細に説明する。図1は本実施形態のプリント基板の上面図及び上面図におけるX-X‘に沿った断面図である。図1に示すように、本実施形態のプリント基板100は基板1、信号パッド2、GND(グラウンド)パッド3、凹部4、信号スルーホール5、GNDスルーホール6を備えている。
次に、本実施形態におけるプリント基板100の作用について、同軸コネクタとの接触を例に説明する。
Z0[Ω]=60/{√εr × loge(Dg/Ds)}・・・式(1)
で計算できる。この計算は、図8の凹部4のないプリント基板200においても同様である。ここでεrは基板1の比誘電率である。一般的には、接続予定の同軸コネクタの特性インピーダンスが50Ωであるため、この値と一致させる(インピーダンス整合する)ため、Z0[Ω]は50Ωとなるよう設計される。
このように、信号パッド2の周囲の基板1に凹部4を設けることにより浮遊容量によるインピーダンス不整合を抑制でき、良好な伝送特性を得られる。
次に、第一の実施形態における本発明を適用した実施例を示す。図5は、本実施例におけるプリント基板300と、実装される同軸コネクタ101のイメージを示している。同軸コネクタ101には同軸ケーブルを接続し、装置と測定器や装置同士などの接続を行う。ここで使用する同軸コネクタ101は、プリント基板300との接続をネジ等による圧着で行うものを想定している。
図7A、図7B、図7Cに示すように、A-A’およびB-B‘に沿った断面は同軸断面構造を有している。
つまり、A-A’に沿った断面が示す同軸コネクタ101とB-B‘に沿った断面が示す信号パッド2及びGNDパッド3との間のインピーダンス整合は、特性インピーダンスの設計上は容易と言える。通常、これらの特性インピーダンスは50Ωで設計される。C-C’断面についても擬似的な同軸構造で、特性インピーダンスを50Ωで設計することは容易である。一般に、同一の特性インピーダンスの線路を接続すれば、インピーダンス整合され伝送特性に何ら影響を及ぼすことはないが、同軸コネクタ101とプリント基板300のような異種形状の線路を接続するとインピーダンス不整合が発生する。これは図6および図7に示すように、境界面では不均一な物理構造となり、図6中に例として示したように浮遊容量が付加されるためと解釈することができる。
図9に本発明の第二の実施形態のプリント基板400の断面図を示す。本実施形態は、基板1上の複数のランド(信号ランド15またはGNDランド16)の間の基板1に凹部4を設ける点で第一の実施形態と異なる。
第一の実施形態において、プリント基板100は基板1、信号パッド2、GNDパッド3、凹部4、信号スルーホール5、GNDスルーホール6を備えているとしたが、図11に示すように、プリント基板100は、GND層8など、種々の部材・構造を適宜備えていてよい。プリント基板100の内部では、信号ランド7内に信号スルーホール7が設けられる。同様に、GNDスルーホール6はGND層8と物理的・電気的に接続している。
また、第一の実施形態においては信号パッド2とGNDパッド3の間の基板1に円形の複数の凹部4が信号パッド2に対し略同心円状に略等間隔で配置されている例を示した。凹部4は少なくとも1つ配置されていれば容量性結合を抑制できるため効果があるが、信号パッド2に対して略同心円状に配置すると、同軸コネクタとプリント基板100、200との接続部分の電磁界の分布を極力変化させず、伝送する信号の特性劣化を抑制して効果を得ることができ、より好ましい。略同心円状でなくても、前述の電磁界の分布の変化を抑制した配置であればよく、例えば、信号パッド2に対して略点対称、略線対称となるよう配置することができる。他にも、信号パッド2を取り囲むようにドーナツ状に凹部4を形成することができる。凹部4を配置する箇所の数や大きさは、生じている浮遊容量などに合わせて適宜変更できる。また、凹部4の深さ方向の断面で見た場合の形状は、お椀状、円柱状となるよう形成できる。また、凹部4はドリル穴であってもよい。
基板と、
前記基板上に設けられた円形の信号パッドと、
前記信号パッドをドーナツ状に取り囲む前記基板を挟み、さらにその外周を取り囲むドーナツ状のグラウンドパッドと、
前記信号パッドをドーナツ状に取り囲む前記基板上に、一つ以上配置された凹部と、を備えるプリント基板。
前記凹部は、前記信号パッドに対し略点対称または略線対称となるよう配置されている、付記1に記載のプリント基板。
前記凹部は、前記信号パッドに対し略同心円状に、かつ略等間隔に配置されている、付記1または2に記載のプリント基板。
前記凹部は、前記信号パッドに対し、同軸コネクタ接続時に生じる電磁界の分布を変化させないよう配置されている、付記1から3のいずれかに記載のプリント基板。
前記凹部は、前記基板上から基板の厚さ方向にお椀状または円柱状に形成されている凹みである、付記1から4のいずれかに記載のプリント基板。
前記凹部がドリル穴である、付記1から5のいずれかに記載のプリント基板。
前記凹部は、前記信号パッドを取り囲むドーナツ状に形成されている、付記1に記載のプリント基板。
基板と、
前記基板上に設けられたドーナツ形の複数のランドの間の前記基板に、一つ以上配置された凹部と、を備えるプリント基板。
前記複数のランドは、信号ランド、グラウンドランド、もしくはその両方である、付記8に記載のプリント基板。
前記凹部は、前記基板上からお椀状または円柱状に形成されている凹みである、付記8または9に記載のプリント基板。
基板と、
前記基板上に設けられた円形の信号パッドと、
前記信号パッドをドーナツ状に取り囲む前記基板を挟み、さらにその外周を取り囲むドーナツ状のグラウンドパッドと、を備えるプリント基板に、
前記信号パッドをドーナツ状に取り囲む前記基板上に、一つ以上配置された凹部を形成する、プリント基板への実装方法。
前記凹部は、前記信号パッドを取り囲むドーナツ状に形成されている、付記8または9に記載のプリント基板。
2 信号パッド
3 GNDパッド
4 凹部
5 信号スルーホール
6 GNDスルーホール
7 信号ランド
8 GND層
9 凹部が無い場合の反射量
10 凹部がある場合の反射量
11 凹部が無い場合の反射損失
12 凹部がある場合の反射損失
13 凹部が無い場合の挿入損失
14 凹部がある場合の挿入損失
15 信号ランド
16 GNDランド
100 プリント基板
101 同軸コネクタ
103 コネクタ
103a コネクタ端子
103b モールド
200 プリント基板
300 プリント基板
400 プリント基板
Claims (10)
- 基板と、
前記基板上に設けられた円形の信号パッドと、
前記信号パッドをドーナツ状に取り囲む前記基板を挟み、さらにその外周を取り囲むドーナツ状のグラウンドパッドと、
前記信号パッドをドーナツ状に取り囲む前記基板上に、一つ以上配置された凹部と、を備えるプリント基板。 - 前記凹部は、前記信号パッドに対し略点対称または略線対称となるよう配置されている、請求項1に記載のプリント基板。
- 前記凹部は、前記信号パッドに対し略同心円状に、かつ略等間隔に配置されている、請求項1または2に記載のプリント基板。
- 前記凹部は、前記信号パッドに対し、同軸コネクタ接続時に生じる電磁界の分布を変化させないよう配置されている、請求項1から3のいずれかに記載のプリント基板。
- 前記凹部は、前記基板上から基板の厚さ方向にお椀状または円柱状に形成されている凹みである、請求項1から4のいずれかに記載のプリント基板。
- 前記凹部がドリル穴である、請求項1から5のいずれかに記載のプリント基板。
- 基板と、
前記基板上に設けられたドーナツ形の複数のランドの間の前記基板に、一つ以上配置された凹部と、を備えるプリント基板。 - 前記複数のランドは、信号ランド、グラウンドランド、もしくはその両方である、請求項7に記載のプリント基板。
- 前記凹部は、前記基板上からお椀状または円柱状に形成されている凹みである、請求項7または8に記載のプリント基板。
- 基板と、
前記基板上に設けられた円形の信号パッドと、
前記信号パッドをドーナツ状に取り囲む前記基板を挟み、さらにその外周を取り囲むドーナツ状のグラウンドパッドと、を備えるプリント基板に、
前記信号パッドをドーナツ状に取り囲む前記基板上に、一つ以上配置された凹部を形成する、プリント基板への実装方法。
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CN201480052769.6A CN105580196A (zh) | 2013-09-24 | 2014-09-11 | 印刷电路板及在印刷电路板上安装的方法 |
US14/912,677 US9980370B2 (en) | 2013-09-24 | 2014-09-11 | Printed circuit board having a circular signal pad surrounded by a ground pad and at least one recess section disposed therebetween |
JP2015538876A JP6327254B2 (ja) | 2013-09-24 | 2014-09-11 | プリント基板及びプリント基板への実装方法 |
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JP2013197419 | 2013-09-24 | ||
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PCT/JP2014/004679 WO2015045309A1 (ja) | 2013-09-24 | 2014-09-11 | プリント基板及びプリント基板への実装方法 |
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US (1) | US9980370B2 (ja) |
JP (1) | JP6327254B2 (ja) |
CN (1) | CN105580196A (ja) |
WO (1) | WO2015045309A1 (ja) |
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WO2022176631A1 (ja) * | 2021-02-17 | 2022-08-25 | 株式会社ヨコオ | 接続装置 |
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JP2016213089A (ja) * | 2015-05-11 | 2016-12-15 | 株式会社オートネットワーク技術研究所 | 熱収縮チューブ取付治具、熱収縮チューブ付電線の製造方法及び熱収縮チューブ付電線 |
US10276282B2 (en) * | 2017-07-28 | 2019-04-30 | Raytheon Company | Coaxial transmission line structure |
CN107624004A (zh) * | 2017-08-22 | 2018-01-23 | 努比亚技术有限公司 | 一种印刷电路板的贴合方法及一种印刷电路板 |
US11166374B2 (en) | 2018-03-15 | 2021-11-02 | Huawei Technologies Co., Ltd. | Connection plate, circuit board assembly, and electronic device |
US11818833B2 (en) * | 2021-11-15 | 2023-11-14 | Unimicron Technology Corp. | Circuit board structure |
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US20020101723A1 (en) * | 1999-03-09 | 2002-08-01 | International Business Machines Corporation | Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality |
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US2983884A (en) * | 1957-07-01 | 1961-05-09 | Research Corp | Transmission line matching structure |
US3757272A (en) * | 1972-07-12 | 1973-09-04 | Raytheon Co | Strip transmission line coupler |
JPS6193003A (ja) | 1984-10-11 | 1986-05-12 | キユーピー株式会社 | 充填密封方法 |
JPH07102531B2 (ja) | 1987-08-12 | 1995-11-08 | 株式会社ノダ | 化粧板 |
JP2004107830A (ja) * | 2002-09-19 | 2004-04-08 | Mas Fab Rieter Ag | 集束装置を備えた紡績機 |
JP4652230B2 (ja) | 2003-06-02 | 2011-03-16 | 日本電気株式会社 | プリント回路基板用コンパクトビア伝送路およびその設計方法 |
JP5088135B2 (ja) | 2005-10-18 | 2012-12-05 | 日本電気株式会社 | 垂直信号経路、それを有するプリント基板及びそのプリント基板と半導体素子とを有する半導体パッケージ |
JP4535995B2 (ja) * | 2005-12-05 | 2010-09-01 | 日本電気株式会社 | 多層プリント回路基板のビア構造、それを有する帯域阻止フィルタ |
JP4325885B1 (ja) | 2009-03-27 | 2009-09-02 | 株式会社アイペックス | 同軸コネクタ装置 |
JP5322177B2 (ja) | 2009-11-06 | 2013-10-23 | 日立電線株式会社 | 電磁結合器及びそれを用いた情報通信機器 |
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2014
- 2014-09-11 CN CN201480052769.6A patent/CN105580196A/zh active Pending
- 2014-09-11 WO PCT/JP2014/004679 patent/WO2015045309A1/ja active Application Filing
- 2014-09-11 JP JP2015538876A patent/JP6327254B2/ja not_active Expired - Fee Related
- 2014-09-11 US US14/912,677 patent/US9980370B2/en not_active Expired - Fee Related
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US20020101723A1 (en) * | 1999-03-09 | 2002-08-01 | International Business Machines Corporation | Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality |
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Publication number | Priority date | Publication date | Assignee | Title |
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WO2022176631A1 (ja) * | 2021-02-17 | 2022-08-25 | 株式会社ヨコオ | 接続装置 |
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JP6327254B2 (ja) | 2018-05-23 |
JPWO2015045309A1 (ja) | 2017-03-09 |
CN105580196A (zh) | 2016-05-11 |
US20160205768A1 (en) | 2016-07-14 |
US9980370B2 (en) | 2018-05-22 |
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