WO2015040691A1 - Buse d'écoulement en jet et dispositif d'écoulement en jet - Google Patents

Buse d'écoulement en jet et dispositif d'écoulement en jet Download PDF

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Publication number
WO2015040691A1
WO2015040691A1 PCT/JP2013/075133 JP2013075133W WO2015040691A1 WO 2015040691 A1 WO2015040691 A1 WO 2015040691A1 JP 2013075133 W JP2013075133 W JP 2013075133W WO 2015040691 A1 WO2015040691 A1 WO 2015040691A1
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WIPO (PCT)
Prior art keywords
jet
width
nozzle
molten solder
jet flow
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Application number
PCT/JP2013/075133
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English (en)
Japanese (ja)
Inventor
利彦 六辻
淳 大野田
Original Assignee
千住金属工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 千住金属工業株式会社 filed Critical 千住金属工業株式会社
Priority to CN201380079705.0A priority Critical patent/CN105555453B/zh
Priority to JP2015537463A priority patent/JP5900713B2/ja
Priority to PCT/JP2013/075133 priority patent/WO2015040691A1/fr
Publication of WO2015040691A1 publication Critical patent/WO2015040691A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains

Definitions

  • the present invention relates to a jet nozzle and a jet apparatus applicable to a jet soldering apparatus that jets molten solder toward a soldering surface of a semiconductor wafer or the like by printed circuit board or pallet conveyance and solders an electronic component. .
  • a jet soldering apparatus when soldering an electronic component to a predetermined surface of a printed circuit board, a jet soldering apparatus is often used.
  • a jet soldering device is mounted on the jet soldering device and jets molten solder toward the soldering surface of the printed circuit board.
  • the jet apparatus has a duct, a nozzle, and a pump.
  • the molten solder is sent to the nozzle through the duct by the pump.
  • the nozzle ejects molten solder at a liquid level corresponding to the pump output.
  • the electronic component can be soldered to the printed circuit board by the molten solder ejected from the nozzle.
  • a jet solder device in which a duct is connected to a pump housing covering a screw pump, and molten solder is sent from the pump housing to the duct (see Patent Document 1).
  • a pair of rotating shafts are provided between nozzle side plates, and a nozzle is attached to each of the rotating shafts.
  • the nozzle opening width can be varied by driving the rotating shaft. In this way, when the conveyance speed changes corresponding to the printed circuit board, the contact time between the printed circuit board and the molten solder can be made constant by widening the opening width of the nozzle.
  • Patent Document 2 discloses a jet solder bath. According to this jet solder bath, the secondary jet nozzle is provided, and the fixing positions of the front former and the rear former provided before and after the secondary jet nozzle can be varied.
  • the front former and the rear former are attached to a shaft portion provided between the side plates. The rotation angle of the front former and rear former can be adjusted based on the shaft. By doing so, the opening width of the secondary jet nozzle can be varied.
  • ⁇ A fixed plate is attached between the side plates near the tip of the rear former.
  • the fixed plate is provided with a dam plate movably along the fixed surface, and the dam plate overflows a part of the molten solder flowing down from the rear former.
  • Patent Document 3 discloses a method for soldering a printed circuit board and a jet soldering apparatus.
  • a nozzle base is provided, and a moving block and a fixed block are provided on the nozzle base.
  • An opening width of the nozzle is formed between the moving block and the fixed block.
  • the moving block is slidably mounted on the nozzle table. The moving block can be moved in a direction parallel to the substrate transport direction, and its fixed position can be adjusted. By doing so, the opening width of the nozzle can be adjusted by changing the opening width between the moving block and the fixed block.
  • Patent Document 4 discloses a jet jet nozzle for soldering. According to the nozzle, a pair of flat nozzle plates are attached to the upper portion of the nozzle body, and are fixed to the attachment portion with engaging screws. When the screw is loosened, the nozzle plate is slidable in the horizontal direction with respect to the mounting portion. With this nozzle plate opening / closing structure, the opening width between the nozzle plates can be adjusted.
  • the jet nozzle and the jet device according to the conventional example have the following problems.
  • a method of changing the opening width of the nozzle by a rotating shaft or a horizontal slide mechanism is often employed.
  • Patent Documents 1 to 4 Does not disclose means for widening the jet width, which makes it difficult to make fine adjustments.
  • the present invention solves such problems, and enables the effective width of the molten solder jet to be widened back and forth along the board transfer direction, and also reproduced in the pores such as through holes in the board. It is an object of the present invention to provide a jet nozzle and a jet device capable of depositing molten solder with good performance.
  • the jet nozzle according to claim 1 has an inlet and an outlet in a casing having a predetermined shape, and the molten solder flowing in from the inlet is inserted into the substrate from the outlet.
  • a nozzle body composed of a nozzle main body to be jetted to the nozzle, when the jet width in the width direction of the nozzle body at a position lower than a predetermined height from the highest jet position of the molten solder is defined as a jet effective width
  • a width adjusting portion that is provided on both sides of the discharge port of the main body and adjusts the effective jet width. According to the jet nozzle of claim 1, the jet effective width can be adjusted in multiple stages and finely without depending on the jet velocity.
  • the jet nozzle according to claim 2 has a dam portion that dams up the molten solder overflowing from the discharge port of the nozzle main body portion according to claim 1, and the width adjusting portion is arranged before and after the dam portion.
  • An overflow plate is attached so as to be movable up and down along the wall surface and adjusts the height of the molten solder weired by the dam part.
  • the jet nozzle according to claim 3 has an opening variable mechanism for adjusting an opening width of the dam portion.
  • the jet apparatus wherein the pump sucks molten solder and sends it in a predetermined direction, a pump housing that houses the pump, a duct that is connected to the pump housing and guides the molten solder, and the duct.
  • a jet nozzle with a jet width multistage adjustment function according to any one of claims 1 to 3, which is connected to a jet nozzle and jets the molten solder.
  • the jet nozzle according to the present invention is provided with a width adjusting portion that is provided on both side walls of the discharge port in the jet direction of the nozzle body and adjusts the jet effective width.
  • the effective width of the molten solder jet can be adjusted to widen back and forth along the board conveying direction. It becomes like this.
  • the surface pressure of the molten solder against the substrate can be increased.
  • the jet device since the jet nozzle with the jet width multistage adjusting function according to the present invention is provided, the adherend surface of the substrate is exposed to the jet-like molten solder as compared with the case where there is no width adjusting portion. Can be set (maintained) for a long time. Therefore, the molten solder can be satisfactorily applied to the pores such as through holes for connecting the substrates. As a result, the substrate transfer speed can be set higher than that of the conventional method, and the throughput of the apparatus can be improved.
  • FIG. 2 is an exploded perspective view showing an assembly example of a jet nozzle 100.
  • FIG. 2 is a cross-sectional view showing an example of the function of a jet nozzle 100.
  • FIG. It is a perspective view which shows the structural example of the jet soldering apparatus 200.
  • FIG. It is sectional drawing which shows the operation example (the 1) of the jet soldering apparatus.
  • a jet nozzle 100 shown in FIG. 1 is applicable to a primary jet nozzle in a jet soldering apparatus, and has a nozzle body 30 that can adjust the jet width in multiple stages.
  • the nozzle body 30 has an inlet 601 and an outlet 602 as shown in FIG. 2, and jets the molten solder 7 flowing from the inlet 601 through the outlet 602. 2 is a cross-sectional view taken along the line X1-X1 of the jet nozzle 100 shown in FIG.
  • the molten solder 7 is attached to the lower surface of the printed circuit board 1 so as to blow up the molten solder 7 from below the printed circuit board 1.
  • the molten solder 7 is applied to the printed circuit board 1 more than the secondary jet. By doing so, the molten solder 7 can be “wetted up” onto the printed circuit board 1.
  • the secondary jet a flat surface that flows in the same direction as the traveling direction of the printed circuit board 1 is formed. This flat surface is used to wipe away the excess molten solder 7.
  • L is the length [mm] of the nozzle body 30
  • W is its width [mm]
  • H is its height [mm].
  • X is the nozzle length direction
  • Y is the nozzle width direction
  • Z is the jet direction of the molten solder 7.
  • the nozzle body 30 is finished by cutting and bending a stainless steel plate into a casing having a predetermined shape.
  • the nozzle main body 30 is provided with the dam portion 10 and the opening variable mechanism 90.
  • the dam portion 10 has a front molding portion 11 (front former) and a rear molding portion 12 (rear former) having a length of about L [mm].
  • the front molding part 11 and the rear molding part 12 constitute an opening variable mechanism 90.
  • the pre-molded portion 11 is attached to the upper part of the pre-molded substrate 13 as shown in FIG.
  • the rear molding portion 12 is also movable to the left and right above the rear molding substrate 14.
  • a long hole 201 is provided on the top plate surface of each of the pre-molded portion 11 and the post-molded portion 12.
  • the elongated hole 201 can be inserted with a screw rotating tool.
  • the screws 613 and 614 shown in FIG. 2 are loosened, and at least one of the front molding portion 11 and the rear molding portion 12 is slid and moved, or these are separated.
  • the opening width of the discharge port 602 can be adjusted (opening variable mechanism 90).
  • the width adjusting part 20 is attached to the dam part 10.
  • the width adjusting unit 20 includes a flat front overflow plate 21 (front plate) and a rear overflow plate 22 (rear plate) having a length of about L [mm].
  • the width adjusting unit 20 finely adjusts the jet width of the molten solder 7 jetted from the discharge port 602.
  • the front overflow plate 21 and the rear overflow plate 22 are used like a river dam plate (gate).
  • the front overflow plate 21 has a mechanism capable of moving up and down in a substantially vertical (vertical) direction along the upstream wall surface of the pre-molded portion 11.
  • the rear overflow plate 22 has a mechanism that can similarly move up and down along the downstream wall surface of the rear molding portion 12.
  • the upstream side refers to the side on which the printed circuit board 1 enters the jet nozzle 100
  • the downstream side refers to the side on which the printed circuit board 1 advances from the jet nozzle 100.
  • a bowl-shaped front return gutter 46 is provided in front of the nozzle main body 30 (upstream side).
  • a hook-like rear return gutter 47 is provided on the rear side (downstream side).
  • the front return garter 46 guides the molten solder 7 overflowing forward from the dam portion 10 in a predetermined direction.
  • the rear return gutter 47 receives the molten solder 7 overflowing from the dam portion 10 and guides it in a predetermined direction.
  • the nozzle body 30 includes side plates 61 and 62 (not shown) and wall plates 63 and 64.
  • the side plates 61 and 62 and the wall surface plates 63 and 64 constitute the nozzle housing 42 (see FIG. 3).
  • the wall plate 63 has an inverted L-shaped portion 603 at the upper portion, and the wall plate 64 also has an inverted L-shaped portion 604 at the upper portion.
  • the dam portion 10 is provided in the inverted L-shaped portions 603 and 604.
  • the dam 10 is used to dam the molten solder 7 overflowed from the discharge port 602 and expand the width, in addition to the pre-molded portion 11 and the post-molded portion 12, a pre-molded substrate 13 (front former base), a post-molded substrate 14 (rear former base), front shim plate 15 and rear shim plate 16.
  • the pre-molded part 11 and the post-molded part 12 have a space inside and a square or inverted trapezoidal cross section.
  • the top plate surface of the pre-molded portion 11 is inclined to form an oblique plate shape.
  • the reason why the top plate surface of the pre-molded portion 11 is formed in an oblique plate shape is to carry the printed board 1 obliquely on the jet solder apparatus.
  • the top plate surface of the rear molding portion 12 has a plate shape (flat shape) in order to obtain a jet width.
  • a pre-formed substrate 13 is provided below the pre-formed portion 11, and a front shim plate 15 is provided below the pre-formed substrate 13.
  • the front shim plate 15 has a thickness of about 1 mm, and adjusts the height of the pre-formed substrate 13.
  • the pre-molded portion 11 is fixed to the inverted L-shaped portion 603 with screws 613 in a form in which the pre-molded substrate 13 and the front shim plate 15 are interposed.
  • the screw hole of the pre-formed substrate 13 is formed in a long hole shape, and can be moved to the left and right with the screw 613 loosened.
  • a rear molded substrate 14 is provided below the rear molded portion 12, and a rear shim plate 16 is provided below the rear molded substrate 14.
  • the rear shim plate 16 has a thickness of about 2 mm so as to be inclined, and the height of the rear molded substrate 14 is adjusted to be higher than that of the front molded substrate 13. This is also because the printed board 1 is transported obliquely.
  • the rear molding portion 12 is fixed to the inverted L-shaped portion 604 with screws 614 in a form in which the rear molding substrate 14 and the rear shim plate 16 are interposed.
  • the screw hole of the post-molded substrate 14 is also formed in a long hole shape, and can be moved left and right with the screw 614 loosened (opening variable mechanism 90).
  • the opening adjusting mechanism 90 is provided with a width adjusting unit 20.
  • the width adjusting unit 20 includes a front overflow plate 21 and a rear overflow plate 22.
  • the front overflow plate 21 is provided in the front molding part 11, and the rear overflow plate 22 is provided in the rear molding part 12.
  • the front overflow plate 21 is attached so as to be movable up and down along the wall surface in front of the front molding portion 11, and has a wetting height ⁇ 1 (see FIG. 4) of the molten solder 7 weired by the front molding portion 11. adjust.
  • the front overflow plate 21 is fixed to the front molding part 11 with three screws 611.
  • the screw hole of the front overflow plate 21 is formed in a long U shape, and can move up and down with the screw 611 loosened.
  • the rear overflow plate 22 is attached so as to be movable up and down along the rear wall surface of the rear molding portion 12 and adjusts the weir height ⁇ 2 (see FIG. 4) of the molten solder 7 weired by the rear molding portion 12. To do.
  • the rear overflow plate 22 is also fixed to the rear molding portion 12 with three screws 612.
  • the screw hole of the rear overflow plate 22 is also formed in a long U shape, and can be moved up and down with the screw 612 loosened.
  • ⁇ 5 °
  • the lifting heights ⁇ 1 and ⁇ 2 of the molten solder 7 ⁇ 1 ⁇ ⁇ 2 is set.
  • the inclination angle ⁇ is an angle formed by a direction in which the printed circuit board 1 is conveyed and a horizontal line segment.
  • the width adjusting unit 20 can finely adjust the jet width of the molten solder 7 jetted from the discharge port 602.
  • the length L of the jet nozzle 100 is about 400 to 450 mm, its width W is about 70 to 80 mm, and its height H is about 120 to 125 mm.
  • a nozzle housing 42 having a reverse hopper shape is prepared.
  • the nozzle housing 42 is provided with side plates 61 and 62 and wall plates 63 and 64.
  • the side plates 61 and 62 and the wall plates 63 and 64 are formed by cutting and bending a stainless plate having a predetermined thickness (about 1.5 to 2.0 mm). By joining the corners of the side plates 61 and 62 and the wall surface plates 63 and 64, the inverted hopper shape of the nozzle body 30 is obtained.
  • the lower part of the nozzle housing 42 constitutes an inlet 601 and the upper part thereof constitutes an outlet 602.
  • the upper portion of the wall surface plate 63 is bent into an inverted L shape to form an inverted L-shaped portion 603.
  • the upper portion of the wall surface plate 64 is also bent in an inverted L shape to form an inverted L-shaped portion 604.
  • the inverted L-shaped portions 603 and 604 serve as attachment reference allowances (bases) for the dam portion 10.
  • Female screws or screw through holes are formed at predetermined positions of the inverted L-shaped portions 603 and 604.
  • a pre-molded part 11, a post-molded part 12, a pre-molded substrate 13, a post-molded substrate 14, a front shim plate 15, a rear shim plate 16, and screws 613 and 614 are prepared.
  • the pre-molded portion 11 and the post-molded portion 12 are formed by bending a stainless steel plate having a predetermined thickness into a space or a square or inverted trapezoidal shape. Each top plate surface is formed in a plate shape to obtain a jet width. A slot 201 for inserting a screw rotating tool is also formed on the top plate surface.
  • a stainless member having a length of L mm and a thickness of 1 mm is prepared.
  • a stainless steel member having a length of Lmm and a thickness of 2 mm is prepared for the rear shim plate 16.
  • a square bar member made of stainless steel having a length of Lmm, a trapezoidal cross section and a predetermined thickness is prepared. Screw through holes and female screws are formed at predetermined positions on the pre-molded substrate 13 and the post-molded substrate 14.
  • pre-molded portion 11, post-molded portion 12, pre-molded substrate 13, post-molded substrate 14, front shim plate 15, rear shim plate 16, and screws 613 and 614 are prepared, first, along nozzle length direction X In this way, the pre-formed substrate 13 and the front shim plate 15 are overlapped.
  • the two pre-molded substrates 13 and the front shim plate 15 are fixed to the inverted L-shaped portion 603 with screws (not shown). Thereby, the attachment reference cost of the front side of the opening variable mechanism 90 is obtained.
  • the rear molded substrate 14 and the rear shim plate 16 are overlapped.
  • the two rear molded substrates 14 and the rear shim plate 16 are fixed to the inverted L-shaped portion 604 with screws (not shown). Thereby, the attachment reference allowance (base) on the rear side of the opening variable mechanism 90 is obtained.
  • the pre-molded portion 11 is fixed to the pre-molded substrate 13 with screws 613.
  • the pre-molded portion 11 is fixed by screwing a screw 613 into a female screw formed on the pre-molded substrate 13.
  • the front side of the opening variable mechanism 90 is obtained.
  • the rear molding portion 12 is fixed to the rear molding substrate 14 with screws 614.
  • the rear molding portion 12 is fixed by screwing a screw 614 to a female screw formed on the rear molding substrate 14. Thereby, the rear side of the opening variable mechanism 90 is obtained and the dam portion 10 is obtained.
  • two front overflow plates 21 and a rear overflow plate 22 are prepared.
  • a stainless plate having a predetermined thickness about 1.5 to 2.0 mm
  • notch portions 621 and 622 having reverse-length U shapes are formed at predetermined positions on the front overflow plate 21 and the rear overflow plate 22.
  • the front overflow plate 21 and the rear overflow plate 22 are prepared, the front overflow plate 21 is attached to the front molding portion 11 through the notch portion 621 with three screws 611. Similarly, the rear overflow plate 22 is attached to the rear molding part 12 through the notch part 622 with three screws 612.
  • the width adjusting part 20 can be formed by attaching the front overflow plate 21 and the rear overflow plate 22 to the opening variable mechanism 90 (see FIG. 1).
  • the side guide 44 is attached to the side plate 61 with screws (not shown), and the side guide 45 is attached to the side plate 62 in the same manner.
  • the front return gutter 46 is attached to the wall surface plate 63 with screws (not shown), and the rear return gutter 47 is similarly attached to the wall surface plate 64.
  • the jet opening width W ⁇ is adjusted to the maximum (MAX) by the variable opening mechanism 90.
  • W ⁇ MAX
  • the screws 613 and 614 are loosened, the front molding part 11 and the rear molding part 12 are slid apart to the maximum on both sides, and the screw is again It is obtained by fixing 613,614 to the inverted L-shaped portion 603,604.
  • the front overflow plate 21 and the rear overflow plate 22 are adjusted to the uppermost position by the width adjusting unit 20.
  • the uppermost state of the front overflow plate 21 and the rear overflow plate 22 is loosened from the lowest state of the front overflow plate 21 and the rear overflow plate 22 shown in FIG.
  • the front overflow plate 21 and the rear overflow plate 22 are each slid upward, and the screws 611 and 612 are fixed to the wall surfaces of the front molding portion 11 and the rear molding portion 12 again.
  • the thick line of the dashed-two dotted line in a figure is an imaginary line of the jet waveform of the molten solder 7.
  • Wr is the effective jet width, and refers to the jet width in the width direction of the nozzle body 30 at a position lower than the highest jet flow position pmax of the molten solder 7 on the dam 10 by a predetermined height ⁇ .
  • ⁇ is a reference index for defining the jet effective width Wr, and is arbitrarily set depending on the depth of the through hole of the printed circuit board 1 (the thickness of the printed circuit board 1) and the like.
  • the jet effective width Wr is roughly adjusted by the opening variable mechanism 90 and can be finely adjusted by the width adjusting unit 20.
  • h is the height of the jet, for example, the distance from the top plate surface of the rear molding portion 12 to the highest jet position pmax.
  • ⁇ 1 and ⁇ 2 are the weir heights of the front overflow plate 21 and the rear overflow plate 22, respectively, and are the difference distances between the lowest position and the highest position.
  • the weir heights ⁇ 1, ⁇ 2 are set to be, for example, ⁇ 1 / 2, ⁇ 2 / 2, ⁇ 1 / 3, ⁇ 2 / 3, ⁇ 1 / 4, ⁇ 2 / 4, ... when finely adjusting the effective jet width Wr.
  • the width adjusting unit 20 is provided on the opening variable mechanism 90 (on both sides of the dam portion 10) of the discharge port 602 of the nozzle body 30, and the jet is flown by the width adjusting unit 20.
  • the effective width Wr is adjusted.
  • the weir heights ⁇ 1 and ⁇ 2 of the front overflow plate 21 and the rear overflow plate 22 can be adjusted in spite of the fact that the jet height h is substantially constant.
  • the width Wr can be adjusted to be widened forward and backward along the nozzle width direction (substrate transport direction).
  • the surface pressure of the molten solder against the substrate can be increased.
  • the optimum nozzle structure for long lead parts and pallet transport was obtained.
  • a jet soldering apparatus 200 shown in FIG. 5 constitutes an example of a jet apparatus, and jets molten solder 7 onto a predetermined surface of the printed circuit board 1 to solder electronic components to the printed circuit board 1.
  • y is the substrate transport direction, which is the same direction as the nozzle width direction Y shown in FIG.
  • the jet soldering apparatus 200 includes a duct 41, a pump housing 43, a pump 50, a solder bath 51, a motor 60, and a jet nozzle 100.
  • the solder tank 51 has a housing with an open top surface, and accommodates the molten solder 7.
  • the solder tank 51 is provided with a heater (not shown) to keep the molten solder 7 at a constant temperature.
  • a duct 41 and a pump housing 43 are mounted in the solder bath 51 in a form immersed in the molten solder 7.
  • the duct 41 has a main body portion 401 having an elongated casing, and a nozzle connection portion 402 is provided on the upper portion of the main body portion 401.
  • a pump housing 43 is connected to the main body 401, and a pump 50 is housed in the pump housing 43, and operates to suck in the molten solder 7 and send it in a predetermined direction.
  • a pulley 52 is attached to the rotation shaft of the pump 50.
  • an impeller type pump is used in addition to a screw type pump.
  • a motor 60 is disposed at a predetermined position outside the solder tank 51, and a pulley 53 is attached to the shaft portion.
  • the belt 54 is wound between the pulley 52 of the pump 50 and the pulley 53 of the motor 60.
  • the motor 60 rotates in a predetermined direction
  • the belt 54 is wound and the pump 50 rotates.
  • the pump 50 operates to push the molten solder 7 into the duct 41.
  • the duct 41 leads the molten solder 7 toward the jet nozzle 100.
  • the jet nozzle 100 is connected to the nozzle connecting portion 402 described above. As the jet nozzle 100, one having a jet width multistage adjusting function according to the present invention is used. The jet nozzle 100 takes in the molten solder 7 from below and ejects the molten solder 7 upward. In this example, the molten solder 7 is jetted onto the printed circuit board 1 at the dam portion 10 attached to the upper portion of the nozzle housing 42. Thus, the jet soldering apparatus 200 is configured.
  • the jet soldering apparatus 200 shown in FIGS. 6 to 8 is a cross-sectional view in which the upper part of the duct 41 and the periphery of the jet nozzle 100 are extracted from the jet soldering apparatus 200 shown in FIG.
  • the width adjustment unit 20 is used when the conveyance speed of the printed circuit board 1 is made constant and the jet width of the molten solder 7 is varied to adjust the jet width (conventional method). Then, the operation and effect will be discussed by comparing with the case where the jet effective width Wr is adjusted (the present invention method).
  • the lowest position of the rear overflow plate 22 is a position where the rear molding portion 12 forms a reference surface having a jet height h.
  • the lowest position of the front overflow plate 21 is the position of the front end of the front molding portion 11. This setting is the same state as a conventional jet nozzle in which the front overflow plate 21 and the rear overflow plate 22 do not function.
  • the motor 60 is driven so that the output of the pump 50 is constant in the three operation examples (parts 1 to 3). Therefore, the jet height h is constant.
  • the discharge port 602 diverges toward the front molding portion 11 and the rear molding portion 12 and jets. Since both the front overflow plate 21 and the rear overflow plate 22 are fixed at the lowest position, the jet effective width Wr is Wr1.
  • the width adjusting unit 20 so that the front overflow plate 21 is in the middle position and the rear overflow plate 22 is in the uppermost position ( ⁇ 2).
  • the front overflow plate 21 is fixed at a height protruding from the end of the pre-molded portion 11 by ⁇ 1 / 2.
  • the width adjusting unit 20 remains the operation example (No. 2), and the opening variable mechanism 90 includes both the front molding unit 11 and the rear molding unit 12.
  • the effective jet width Wr is Wr3.
  • FIG. 5 the effective jet width Wr is Wr (max).
  • Wr1 ⁇ Wr2 ⁇ Wr3 ⁇ Wr (max) is obtained between these jet effective widths Wr.
  • the center of the jet effective width Wr as well as the widening of the jet effective width Wr is shifted to the upstream side or the downstream side depending on the height of the front overflow plate 21 and the rear overflow plate 22. It became clear.
  • the jet pressure was increased and the jet velocity was increased, but the jet effective width Wr did not expand for the increase in the jet height h.
  • the jet velocity was kept constant without increasing the jet pressure.
  • the weir heights ⁇ 1 and ⁇ 2 can be adjusted, so that the effective jet width Wr can be expanded back and forth along the substrate transport direction. Became.
  • the jet soldering apparatus 200 since the jet nozzle 100 with the jet width multistage adjustment function according to the present invention is provided, the printed circuit board 1 is covered as compared with the case where the width adjustment unit 20 is not provided. It is possible to set (maintain) a state in which the contact surface is exposed to the jet-like molten solder 7 for a long time.
  • the molten solder 7 can be satisfactorily applied to the pores such as through holes and contact holes for connecting the printed circuit board 1.
  • the conveyance speed of the printed circuit board 1 can be set to be higher than that of the conventional method, and the throughput of the apparatus can be improved.
  • the present invention is not limited to this. Similar effects can be obtained even when the semiconductor wafer is pallet-transferred.
  • the present invention is extremely suitable when applied to a jet soldering apparatus that jets molten solder toward a printed circuit board, a semiconductor wafer or the like by pallet conveyance.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne une buse d'écoulement en jet (100) comprenant un corps principal de buse (30) comme illustré dans la Figure 2. Le corps principal de buse (30) possède un orifice d'entrée (601) et un orifice de décharge (602) dans un châssis qui présente une forme prescrite, avec de la brasure en fusion (7) s'écoulant depuis l'orifice d'entrée (601) et étant éjectée vers l'extérieur depuis l'orifice de décharge (602) vers un substrat imprimé (1). La buse d'écoulement en jet (100) est équipée d'une unité de réglage de la largeur (20), laquelle est montée des deux côtés de l'orifice de décharge (602) du corps principal de buse (30) et règle la largeur effective de l'écoulement en jet. Ladite largeur effective de l'écoulement en jet est la largeur de l'écoulement en jet pour le corps principal de buse (30) dans le sens de la largeur à une position plus basse d'une distance prescrite que la position la plus haute de l'écoulement en jet de la brasure en fusion (7). La largeur effective de l'écoulement en jet peut être réglée en de multiples paliers et avec précision, indépendamment de la vitesse de l'écoulement en jet. Par conséquent, la largeur effective de l'écoulement en jet de la brasure en fusion peut être réglée sur une large plage entre l'avant et l'arrière le long du sens de transport du substrat et la brasure en fusion peut être amenée en adhérence avec de minces trous de connexion du substrat avec une bonne reproductibilité.
PCT/JP2013/075133 2013-09-18 2013-09-18 Buse d'écoulement en jet et dispositif d'écoulement en jet WO2015040691A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201380079705.0A CN105555453B (zh) 2013-09-18 2013-09-18 喷流喷嘴以及喷流装置
JP2015537463A JP5900713B2 (ja) 2013-09-18 2013-09-18 噴流ノズル及び噴流装置
PCT/JP2013/075133 WO2015040691A1 (fr) 2013-09-18 2013-09-18 Buse d'écoulement en jet et dispositif d'écoulement en jet

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WO2018080627A1 (fr) * 2016-10-26 2018-05-03 Illinois Tool Works Inc. Buse de brasage tendre à la vague à largeur de col réglable automatiquement
US10780516B2 (en) 2018-06-14 2020-09-22 Illinois Tool Works Inc. Wave solder nozzle with automated adjustable sliding plate to vary solder wave width
US11389888B2 (en) 2020-08-17 2022-07-19 Illinois Tool Works Inc. Wave solder nozzle with automated exit wing

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JPH09323165A (ja) * 1996-06-04 1997-12-16 Sharp Corp 噴流半田槽ノズル
JP2000357865A (ja) * 1999-06-15 2000-12-26 Matsushita Electric Ind Co Ltd 溶融はんだの供給調整方法および供給調整用治具
JP2002033573A (ja) * 2000-07-13 2002-01-31 Seiko Epson Corp 噴流半田槽
JP2003188520A (ja) * 2001-12-17 2003-07-04 Senju Metal Ind Co Ltd プリント基板のはんだ付け方法およびはんだ付け装置
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018080627A1 (fr) * 2016-10-26 2018-05-03 Illinois Tool Works Inc. Buse de brasage tendre à la vague à largeur de col réglable automatiquement
US10029326B2 (en) 2016-10-26 2018-07-24 Illinois Tool Works Inc. Wave soldering nozzle having automatic adjustable throat width
US10780516B2 (en) 2018-06-14 2020-09-22 Illinois Tool Works Inc. Wave solder nozzle with automated adjustable sliding plate to vary solder wave width
US11389888B2 (en) 2020-08-17 2022-07-19 Illinois Tool Works Inc. Wave solder nozzle with automated exit wing

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JP5900713B2 (ja) 2016-04-13

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