WO2014162584A1 - Dispositif de transfert - Google Patents

Dispositif de transfert Download PDF

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Publication number
WO2014162584A1
WO2014162584A1 PCT/JP2013/060431 JP2013060431W WO2014162584A1 WO 2014162584 A1 WO2014162584 A1 WO 2014162584A1 JP 2013060431 W JP2013060431 W JP 2013060431W WO 2014162584 A1 WO2014162584 A1 WO 2014162584A1
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WO
WIPO (PCT)
Prior art keywords
rotary
pickup
rotary pickup
unit
supply unit
Prior art date
Application number
PCT/JP2013/060431
Other languages
English (en)
Japanese (ja)
Inventor
佳明 原
日出夫 南
Original Assignee
上野精機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上野精機株式会社 filed Critical 上野精機株式会社
Priority to JP2014517927A priority Critical patent/JP5697120B1/ja
Priority to PCT/JP2013/060431 priority patent/WO2014162584A1/fr
Publication of WO2014162584A1 publication Critical patent/WO2014162584A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Definitions

  • This invention relates to the transfer apparatus which transfers an electronic component from one side to the other.
  • a transfer device in which an electronic component is taken out from a container and placed on a conveyance path, the electronic component is processed at each processing point set on the conveyance path, and finally mounted on another container. It is actually used in the manufacturing process of electronic parts.
  • a transfer device that takes out a semiconductor element from a wafer sheet, a tray, a tape, or a ball feeder, inverts the front and back, and adheres it to a lead frame or a mounting substrate via an adhesive is called a die bonder device.
  • a transfer device there is a type that has a plurality of transfer tables and forms a single transfer path by delivering electronic components at positions where holding units provided on the transfer table are aligned in a straight line.
  • a transfer device there is a type that has a plurality of transfer tables and forms a single transfer path by delivering electronic components at positions where holding units provided on the transfer table are aligned in a straight line.
  • This transfer device has a plurality of transfer tables such as a forming table, a stamping table, and an insertion table, and transfers one electronic component at a position where holding parts provided on these transfer tables are aligned. Form a pathway.
  • the electronic components are supplied to the transport path by a rotary pickup that rotates vertically just below the transport table (see, for example, Patent Document 2).
  • the electronic components are taken out from a supply unit such as a wafer ring with a rotary pickup. By rotating the rotary pickup, the electronic component is positioned directly below the transport table, and the transport table receives the electronic component.
  • the transfer device has a basic configuration including a supply unit, a single conveyance path formed by a plurality of conveyance tables, and a rotary pickup that interposes between the supply unit and the conveyance path and places electronic components on the conveyance path. Is formed.
  • the electronic component holding means included in the transfer table must be provided upward or downward perpendicular to the transfer path, depending on the weight of the table and the configuration of the surrounding units, and such transfer tables are connected and arranged. In order to form the transport path, the transport tables must be overlapped.
  • the transfer device may perform various types of processing, and may desire to install many processing points on the transfer path. However, it is difficult to place processing points on the overlapping portions of the transfer tables because other transfer tables, motors, and the like become physical obstacles. Therefore, if attempts were made to install many processing points, an increase in the size of the transfer table could not be avoided.
  • the applicant of the present invention installs the holders of the two rotary pickups so that the tips of the holding parts always face outward in the radial direction of the table so that the rotary pickups do not overlap each other and the rotation axes are the same. It was made to arrange adjacent on a plane (refer patent document 3). Both rotary pickups have a common stop position where the leading ends of the holding parts of both the rotary pickups face each other, and the electronic parts are delivered as a delivery point.
  • the rotary pickup which has been conventionally used as an intermediary means for passing electronic parts between each other between the unit and the conveyance path, is redefined as a component of the conveyance path, and the holding means is increased.
  • the conventional transfer table provided in the direction or the downward direction is eliminated, and the supply from the supply of electronic components to the accommodation is accommodated only by the rotary pickup provided with the holding means facing outward in the radial direction.
  • the conveyance means By forming a conveyance path with a plurality of rotary pickups, the conveyance means can be arranged adjacent to each other on the same plane in parallel so that the rotation axes do not overlap each other, and many processing points can be provided around the circumference. There is no need to increase the table diameter, and space can be saved.
  • the conveyance path is extremely compact and space saving is realized.
  • the miniaturization of various units installed at the processing points provided in the conveyance path catches up with the compactness of the conveyance path. The current situation is not.
  • the distance between the lowermost ends of both rotary pickups is 200 mm.
  • a supply unit that supplies electronic components and a storage unit that stores the electronic components are disposed immediately below the lowermost end. However, if each of the supply unit and the accommodation unit having a length of 110 mm from the lowermost end portion is arranged, these units protrude from each other by 10 mm from the lateral end portions of both rotary pickups. It will cause.
  • the present invention has been proposed in order to solve the above-described problems of the prior art, and is capable of realizing downsizing while removing the limitation of the size of the units disposed around. It is an object to provide a mounting device.
  • the transfer device for solving the above-mentioned problem is a transfer device that transfers an electronic component from one to the other, a supply unit that supplies the electronic component, a storage unit that stores the electronic component, A holding part that holds and removes one surface of the electronic component at the tip, and a plurality of the holding parts that are arranged around the rotation axis, and the rotation shaft so that the tip faces outward.
  • a first rotary pickup for pick-up that rotates intermittently at a predetermined angle around the center, and is disposed immediately above the housing unit, and has a plurality of the holding portions around the rotation axis so that the tip faces outward.
  • a second rotary pickup for accommodation that rotates intermittently by a predetermined angle around the rotation axis, and the first and second rotary pickups are vertically placed and are arranged in the vertical direction. It has a surface of revolution, to be arranged at different heights of the lowermost portion, and wherein.
  • the third rotary pickup may be further provided, and the first and second rotary pickups may be separated from each other by the intervention of the third rotary pickup.
  • the third rotary pickup may have a lowermost end portion having the same height as the first rotary pickup or between the lowermost end portions of the first and second rotary pickups.
  • a plurality of the third rotary pickups may be arranged in series between the first and second rotary pickups.
  • the lowermost end portion of the second rotary pickup is lower than the lowermost end portion of the supply unit, the supply unit is installed on an installation base having an opening facing the storage unit, and the storage unit is You may make it extend to the inside of the said installation stand.
  • the lowermost end portion of the first rotary pickup is lower than the lowermost end portion of the housing unit, the housing unit is installed on an installation base having an opening facing the supply unit, and the supply unit is You may make it extend to the inside of the said installation stand.
  • the total number of the rotary pickups may be an odd number.
  • the total number may be three.
  • this transfer device can maintain the miniaturization while removing the limitation of the size of the units arranged around.
  • the transfer device 1 takes out an electronic component from one supply unit 2 and passes it to the other storage unit 3.
  • the supply unit 2 includes a container 4 on which electronic components are placed. Between the storage unit 3 and the supply unit 2, an electronic component transport path 11 is formed. Various points of the electronic component may be provided at each point on the transport path 11.
  • Electronic parts are parts used in electrical products, and can include semiconductor elements and resistors and capacitors other than semiconductor elements.
  • semiconductor element include discrete semiconductors such as transistors, diodes, LEDs, and thyristors, and integrated circuits such as ICs and LSIs.
  • the supply unit 2 is a device that moves an electronic component to be picked up to a pickup position.
  • a pickup position For example, an XY stage that horizontally moves a tray on a flat plate in which electronic components are arranged in a two-dimensional array is input.
  • Examples thereof include a parts feeder that moves individual electronic components in alignment and moves them to a take-out position, and a ring holder that horizontally moves electronic components in a two-dimensional direction.
  • the accommodation unit 3 is a device that moves the placement location of the electronic component to a planned delivery position. Examples thereof include an XY stage and a taping unit that sequentially feeds out a tape in which a pocket for accommodating the electronic component is formed.
  • Examples of the container 4 that houses the electronic components include lead frames, organic substrates, inorganic substrates, adhesive trays, substrates, and packaging containers such as sorting bins. A device suitable for these containers 4 can also be obtained.
  • an electronic component is taken out from one tray and transferred to the other tray.
  • the supply unit 2 and the accommodation unit 3 are both XY stages.
  • the XY stage has stages 21 and 31 that are horizontal with respect to the installation surface, and the container 4 is placed on the stages 21 and 31 and moved horizontally in two dimensions.
  • the stages 21 and 31 are fixed to sleeves 23 and 33 fitted to ball screws 22 and 32 extending in the X axis, which is a two-dimensional uniaxial direction.
  • the ball screws 22 and 32 are connected to the rotary motors 24 and 34 so as to be rotatable.
  • the stages 21 and 31 move along the ball screws 22 and 32 as the ball screws 22 and 32 rotate.
  • the ball screws 22 and 32 are pivotally supported by the frames 25 and 35.
  • the frames 25 and 35 are fitted and fixed to ball screws 26 and 36 extending on the Y axis which is the two-dimensional other axis direction. Yes.
  • the ball screws 26 and 36 are also connected to the rotation motors 27 and 37 so as to be rotatable.
  • the stages 21 and 31 move along the ball screws 26 and 36 as the ball screws 26 and 36 rotate.
  • the conveyance path 11 is configured by a rotary pickup having the same diameter in which a plurality are connected in series.
  • the three rotary pick-ups 5a, 5b, 5c having a rotation surface perpendicular to the installation surface do not overlap each other with the rotation surfaces being coincident with the same vertical surface. They are connected in series in the direction.
  • one rotary pickup 5a is disposed immediately above the supply unit 2 for pickup of electronic components. Further, one rotary pickup 5b is disposed immediately above the accommodation unit 3 for accommodation. The third rotary pickup 5c is arranged between the pickup rotary pickup 5a and the accommodating rotary pickup 5b in order to relay delivery of electronic components.
  • Each rotary pickup conveys electronic components along the outer periphery by intermittent shaft rotation.
  • the triple rotary pickups 5a, 5c, and 5b share the first half, the middle, and the second half of the electronic component transport path 11, and form a series of transport paths 11 by the delivery of the electronic components.
  • the rotary pickups 5a, 5b, and 5c are provided with a plurality of holding portions 51 that hold and release the electronic components at the tips.
  • the holding portions 51 are installed at equal circumferential positions on the same circumference around the table rotation axis, and extend radially from the circumference center along the radial direction.
  • the holding portion 51 is arranged with the tip always facing outward.
  • the rotary pickups 5a, 5b, and 5c rotate the holding unit 51 that holds the electronic component by a predetermined angle about an axis orthogonal to the radial direction through the circumferential center of the holding unit 51.
  • the pickup rotary pickup 5a and the relay rotary pickup 5c holding portion 51 are positioned so that the tips thereof face each other, and the relay rotary pickup 5c and the holding rotary pickup 5b holding portion 51 face each other.
  • the combined positions are the electronic parts delivery points A and B, respectively.
  • the position where the holding portion 51 of the rotary pickup 5a for pickup is directed downward is the pickup position C, and the electronic components are taken out from the supply unit 2 and placed on the transport path 11. Further, the position where the holding portion 51 of the housing rotary pickup 5b faces directly downward is the housing position D, and the electronic component is detached from the transport path 11 and placed on the tray of the housing unit 3.
  • the rotary pickups 5a, 5b, and 5c are the same product assembled with the same parts based on the same design drawing, and have the same shape, structure, and size. This is because the tips of the holding portions are arranged on the same line at the delivery points A and B with high accuracy. Since this rotary pickup is small, it can be placed vertically, and its radius is about 5 to 30 cm.
  • the rotary pickups 5 a, 5 b, and 5 c have a shaft frame 53 that is connected to the motor 52 by a rotating shaft, and a holding portion 51 is attached to the shaft frame 53.
  • the shaft frame 53 is a cylinder whose one end is expanded in a substantially disk shape, the rotation shaft of the motor 52 is fitted into the cylindrical portion of the shaft frame 53 and fastened with a bolt or the like, and a holding portion 51 is provided around the substantially disk-shaped portion. It is attached.
  • the motor 52 is, for example, a servo motor having a rotation shaft, and alternately repeats rotation at a certain angle and stop for a certain time.
  • the motor 52 is positioned at any of the holding points 51 at the delivery points A and B, the pickup point C, and the accommodation point D.
  • the holding portion 51 is installed on the shaft frame 53 via a bearing, and moves outward along the radial direction of the rotary pickups 5a, 5b, and 5c, in other words, away from the center of the rotary pickups 5a, 5b, and 5c. It is possible to advance and retreat in the direction. Further, at the delivery points A and B, the pick-up point C, and the accommodation point D, an advancing / retreating drive device 54 that provides a propelling force to advance and retract with respect to the holding unit is disposed.
  • the holding unit 51 is, for example, a suction nozzle having an axis along the radial direction of the rotary pickups 5a, 5b, and 5c.
  • the suction nozzle is a hollow cylinder having an opening at the tip of the nozzle, the tip of the nozzle is directed outward in the radial direction of the table, and the inside of the nozzle communicates with a pneumatic circuit of a vacuum generator via a tube.
  • the suction nozzle sucks an electronic component by generating a negative pressure by a vacuum generator and releases the electronic component by generating a vacuum break or generating a positive pressure.
  • the advancing / retreating drive device 54 is, for example, a device that abuts the end portion on the rotation center side of the holding portion 51 and protrudes the holding portion 51 outward in the table radial direction. And a rod that linearly moves toward the end of the holding portion 51 on the rotation center side.
  • the rotary pickup 5a for pickup and the rotary pickup 5c for relay are arranged side by side at the same height.
  • the accommodating rotary pickup 5b is arranged at a position one step lower than the pickup rotary pickup 5a.
  • the heights of the lowermost ends of the rotary pickup 5a for pickup and the rotary pickup 5b for storage are different.
  • the lowermost end is the tip of the holding portion 51 located directly below.
  • the accommodating rotary pickup 5b is attached to the relay rotary pickup 5c obliquely downward by 45 degrees. That is, the delivery point A is a position directly between the rotary pickup 5a for pickup and the rotary pickup 5c for relay, and the delivery point B is obliquely 45 degrees below the relay rotary pickup 5c and for accommodation. It is 45 degrees above the rotary pickup 5b.
  • the supply unit 2 and the accommodation unit 3 are arranged such that the stages 21 and 31 are horizontal with respect to the installation surface.
  • the pickup rotary pickup 5 a is one step higher than the accommodating rotary pickup 5 b
  • the supply unit 2 is installed on the installation table 13 by further providing an installation table 13 on the mount 12. Therefore, the supply unit 2 and the accommodation unit 3 have different installation heights.
  • the height of the supply unit 2 and the storage unit 3 arranged immediately below the rotary pickup 5a for pickup and the rotary pickup 5b for storage is the same, a colliding portion is generated.
  • the lowermost end portions of the rotary pickup 5a for pickup and the rotary pickup 5b for storage are provided with a difference in height that is higher than the height at which this collision is eliminated by changing the height. That is, a height difference equal to or greater than the maximum thickness of the collision portion is provided.
  • this transfer apparatus 1 a tray on which electronic components are mounted is placed in advance on the stage 21 of the supply unit 2, and an empty tray is placed on the stage 31 of the storage unit 3.
  • the supply unit 2 sequentially drives the electronic components to be taken out in synchronization with the drive of the rotary pickup 5a so that the electronic component to be taken out is located immediately below the pickup point C of the rotary pickup 5a for pickup.
  • the stage 21 moves in a direction approaching and moving away from the storage unit 3, in other words, in a direction approaching and moving away from the storage rotary pickup 5b, and further in a direction orthogonal to the rotation surface of the rotary pickup 5a.
  • the holding portion 51 directed downward is advanced toward the tray by the advance / retreat drive device 54.
  • the holding unit 51 comes into contact with the electronic component at the tip, and sucks the electronic component by the negative pressure generated inside.
  • the advancing / retreating drive device 54 releases the thrust, and the holding unit 51 returns toward the center of the table radius by releasing the thrust.
  • the holding unit 51 holding the electronic component moves along the outer periphery of the rotary pickup 5a with the intermittent rotation of the pickup rotary pickup 5a and reaches the delivery point A.
  • the rotation direction of the rotary pick-up 5a for pick-up may be any, but when a processing point is installed on the outer periphery of the rotary pick-up 5a, it is directed away from the delivery point A, in other words, toward the outside of the transfer device 1. It is good to rotate.
  • the holding / retreating drive device 54 brings the holding unit 51 closer to the holding unit 51 of the relay rotary pickup 5c.
  • the holding portion 51 of the relay rotary pickup 5c sucks the electronic component by the negative pressure generated inside.
  • the holding part 51 of the rotary pickup 5a for pick-up releases the electronic component by blowing the electronic component with the positive pressure generated inside.
  • the advancing / retracting drive device 54 is arranged on the side of the pickup rotary pickup 5a and advances the holding portion 51 provided in the rotary pickup 5a so that the electronic components are delivered to the relay rotary pickup 5c.
  • the electronic component may be picked up by the pickup rotary pickup 5a by arranging the rotary pickup 5c on the relay rotary pickup 5c side and advancing the holding portion 51 provided in the rotary pickup 5c.
  • the holding unit 51 of the relay rotary pickup 5c moves along the outer periphery of the rotary pickup 5c while holding the electronic component with the intermittent rotation of the rotary pickup 5c, and reaches the delivery point B.
  • the rotation direction of the relay rotary pickup 5c may be any, but when a processing point is installed on the outer periphery of the rotary pickup 5c, it is rotated away from the delivery point B or toward the outside of the transfer device 1. It is good to let them.
  • the electronic parts When transported by the relay rotary pickup 5c, the electronic parts are reversed. That is, the mounting surface of the supply unit 2 on the tray faces outward in the table transport direction in the transport stage with the pickup rotary pickup 5a, and faces inward in the table transport direction in the transport stage with the relay rotary pickup 5c. It becomes.
  • the holding / retreating drive device 54 brings the holding unit 51 close to the holding unit 51 of the accommodating rotary pickup 5b.
  • the holding portion 51 of the housing rotary pickup 5b sucks the electronic component by the negative pressure generated inside.
  • the holding part 51 of the relay rotary pickup 5c blows the electronic component with the positive pressure generated inside, thereby releasing the electronic component.
  • the electronic component is inherited from the relay rotary pickup 5c to the accommodating rotary pickup 5b.
  • the holding part 51 of the rotary pickup 5b for accommodation moves along the outer periphery of the rotary pickup 5b while holding the electronic component with the intermittent rotation of the rotary pickup 5b, and reaches the accommodation point D.
  • the rotating direction of the rotary pickup 5b for accommodation may be any, but when a processing point is installed on the outer periphery of the rotary pickup 5b, it is rotated away from the accommodation point D or toward the outside of the transfer device 1. It is good to let them.
  • the front and back of the electronic component are reversed again and returned to the direction in which the electronic component is conveyed by the pickup rotary pickup 5a. That is, the mounting surface of the supply unit 2 on the tray faces inward in the table transport direction in the transport stage with the relay rotary pickup 5c, but returns to the outside in the table transport direction in the transport stage with the accommodating rotary pickup 5b. It will be.
  • the holding part 51 holding the electronic component reaches the accommodation point D, the holding part 51 is brought close to the tray of the accommodation unit 3 by the advance / retreat driving device 54.
  • the holding unit 51 of the housing rotary pickup 5b blows the electronic component with the positive pressure generated inside, thereby releasing the electronic component. .
  • the accommodation unit 3 sequentially drives in synchronization with the drive of the rotary pickup 5b so that the planned placement location of the electronic component is located immediately below the accommodation point D of the rotary pickup 5b for accommodation.
  • the stage 31 moves in a direction toward and away from the supply unit 2 and further in a direction perpendicular to the rotation surface of the rotary pickup.
  • electronic components are placed in the same direction as the supply unit 2.
  • the electronic component is transferred from the tray of the supply unit 2 to the tray of the housing unit 3 via a triple rotary pickup.
  • the apparatus is an apparatus provided with a pickup rotary pickup 5a and a supply rotary pickup in parallel in two.
  • the supply unit 2 and the accommodation unit 3 protrude from the rotary pickup 5 a for pickup and the rotary pickup for supply by 10 mm each when an electronic component is placed on the end of the tray.
  • the rotary pickup 5a for pickup and the rotary pickup for supply are arranged adjacent to each other at the same height, the supply unit 2 and the accommodation unit 3 physically collide and cannot be arranged.
  • a device in which a rotary pickup 5a for pickup and a rotary pickup 5b for accommodation are arranged in two rows with different heights at the bottom end.
  • This is an apparatus excluding the relay rotary pickup 5c from the first embodiment.
  • the pickup rotary pickup 5a and the accommodating rotary pickup 5b are brought close to each other while maintaining the height from the apparatus of the first embodiment, and the electronic components are directly received from the pickup rotary pickup 5a by the accommodating rotary pickup 5b. To pass.
  • the installation height of the supply unit 2 and the storage unit 3 is also different, and physical collision between these units is avoided.
  • a pickup rotary pickup 5a having a radius of 100 mm and an accommodating rotary pickup 5b are connected at an angle of 45 degrees
  • the lowermost end of the accommodating rotary pickup 5b is connected from the lowermost end of the pickup rotary pickup 5a.
  • the height of the pickup rotary pickup 5a is different from the height of the storage rotary pickup 5b, physical contact between the supply unit 2 and the storage unit 3 can be prevented, but the storage rotary pickup 5b.
  • a supply unit 2 may cause a physical collision.
  • the pickup rotary pickup 5a when a pickup rotary pickup 5a having a radius of 100 mm and an accommodation rotary pickup 5b are arranged adjacent to each other at an angle of 45 degrees, the pickup rotary pickup 5a is positioned directly from the lower end of the pickup rotary pickup 5a. This is a case in which the supply unit 2 protrudes 40 mm or more from the lowermost end of the pickup rotary pickup 5a toward the housing rotary pickup 5b, although there is an interval of 40 mm up to the outer end of the position. In this case, when the 110 mm supply unit 2 is arranged, the supply unit 2 and the accommodating rotary pickup 5b physically overlap each other over a length of 70 mm.
  • the relay rotary pickup 5c is provided between the pickup rotary pickup 5a and the accommodating rotary pickup 5b, and the presence of the relay rotary pickup 5c The distance between the accommodating rotary pickup 5b and the supply unit 2 is increased.
  • the accommodating rotary pickup 5b is connected from the lowermost end of the pickup rotary pickup 5a.
  • the relay rotary pickup 5c is also taken into consideration and has an interval of 240 mm. That is, even if the supply unit 2 is relatively large compared to the rotary pickup, the supply unit 2 and the accommodating rotary pickup can be installed without physical collision if the protrusion is within 240 mm.
  • the transfer device 1 includes the supply unit 2, the storage unit 3, the pickup rotary pickup 5a, and the storage rotary pickup 5b.
  • the supply unit 2 supplies electronic components.
  • the accommodation unit 3 accommodates electronic components.
  • Each of the rotary pickups 5a and 5b is disposed immediately above the supply unit 2 and immediately above the storage unit 3, and has a plurality of holding portions 51 around the rotation axis. It is intermittently rotated by a predetermined angle to the center.
  • the holding unit 51 holds and removes one surface of the electronic component at the tip.
  • the rotary pickup 5a for pickup and the rotary pickup 5b for storage are placed vertically and have a vertical rotation surface, and are arranged with different heights at the bottom end.
  • the transfer device 1 can maintain the size reduction while removing the limitation of the size of the units arranged around.
  • the transfer apparatus 1 further includes a relay rotary pickup 5c disposed between the pickup and the storage rotary pickup 5b, whereby the pickup rotary pickup 5a and the storage rotary pick-up are arranged.
  • the pickup 5b is separated from the distance by the intermediate rotary pickup 5c.
  • the supply unit 2 and the storage unit 3 have different arrangement heights, and even if they are horizontally long, there is no physical collision, and the distance between the supply unit 2 and the rotary pickup 5b for storage can be increased.
  • the physical collision between the supply unit 2 and the accommodating rotary pickup 5b is also eliminated, and the increase in the overall length of the continuous rotary pickups 5a and 5b can be minimized. Therefore, the transfer apparatus 1 can maintain the downsizing while further removing the limitation of the size of the units arranged around.
  • the total number of rotary pickups arranged in series is three.
  • the electronic components taken out from the supply unit 2 are accommodated in the same direction in the accommodation unit 3 through reversal and re-inversion of the front and back. If the total number is an odd number, the electronic parts are in the same direction in the supply unit 2 and the accommodation unit 3, so that the number is not limited to three and an odd number may be installed.
  • the storage rotary pickup 5b is lower than the pickup rotary pickup 5a, and both the supply unit 2 and the storage unit 3 are XY stages.
  • the present invention is not limited to this.
  • the pickup rotary pickup 5a is one step lower than the storage rotary pickup 5b
  • the supply unit 2 is a parts feeder
  • the storage unit 3 is an XY stage
  • the storage unit 3 is installed. You may make it install in the base 13.
  • the parts feeder includes a bowl-shaped bowl portion in which a spiral groove reaching the edge is formed on the inner surface, and a chute portion that extends linearly from the edge of the bowl portion, and by swinging the bowl portion and the chute portion, The electronic parts put in the bowl part are conveyed to the tip of the chute part while being aligned and conveyed.
  • the tip of the chute is positioned directly below the pickup rotary pickup 5a, and the electronic component positioned at the tip of the chute is adsorbed by the holding unit 51 that faces directly below the pickup rotary pickup 5a and is transported. On.
  • the supply unit 2 may be a parts feeder
  • the storage unit 3 may be a taping unit
  • the supply unit 2 may be installed on an installation table 13.
  • the taping unit feeds the tape with the pockets embossed along the extending direction of the belt one pitch at a time by the sprocket, and positions the empty pockets directly below the accommodating rotary pickup 5b.
  • the holding portion 51 facing directly downward proceeds to the inside of the pocket while holding the electronic component, and causes the electronic component to be detached inside the pocket.
  • the pickup rotary pickup 5a is one step lower than the housing rotary pickup 5b
  • the supply unit 2 is a wafer holder
  • the housing unit 3 is an XY stage
  • the housing unit 3 is the installation base. 13 may be installed.
  • the number of relay rotary pickups 5d may be increased by one to make a total even number, so that electronic parts may be intentionally reversed and housed.
  • the wafer holder holds the wafer ring to which the electronic component is attached horizontally, and moves the wafer ring in the XY direction so that the electronic component to be taken out is located immediately below the pickup point C and is provided on the back side of the wafer ring.
  • the projecting pin With the projecting pin, the electronic component is pushed out toward the holding portion 51 facing directly below the pickup rotary pickup 5a.
  • the electronic component pushed by the ejecting pin is attracted by the holding portion 51 lowered by the advance / retreat driving device and is placed on the transport path 11.
  • the relay rotary pickup 5c is preferably disposed between the rotary pickups connected obliquely, and is positioned immediately above the rotary pickup that is lowered one step and directly beside the rotary pickup that is one step higher. This is for space saving of the transfer device 1.
  • the relay In the transportation of electronic parts, in the fourth embodiment, after passing through the pickup rotary pickup 5a, the relay is picked up by the additional relay rotary pickup 5d, and then the relay rotary pickup 5c next to the relay is used. It relays, finally moves to the rotary pick-up 5b for accommodation, and is accommodated in the accommodation unit 3.
  • this transfer apparatus 1 whether to include the additional rotary rotary pickup 5d in the transport path 11 is optional. That is, when it is desired to store the electronic component by reversing the front and back of the electronic component, the additional rotary rotary pickup 5d is used. Electronic parts are not delivered at locations where the holding unit 51 and the holding unit 51 of the additional relay rotary pickup 5d face each other.
  • the relay rotary pick-up 5c has a distance between these units and the rotary pickup in order to avoid a physical collision between the supply unit 2 or the storage unit 3 and the rotary pickup lowered by one stage.
  • the relay rotary pickup 5c may be given a role in which the heights of the supply unit 2 and the accommodation unit 3 are different.
  • the lowermost end portion of the relay rotary pickup 5c is also set higher than the lowermost end portions of the pickup rotary pickup 5a and the accommodating rotary pickup 5b. It is wrong. Specifically, a rotary pickup 5a for pickup is arranged at the uppermost stage, a rotary pickup 5c for relay is arranged at the middle position, and a rotary pickup 5b for accommodation is arranged at the lowermost stage, so that the rotary rotary for relaying is arranged. The lowermost end of the pickup 5c is located between the lowermost ends of the pickup rotary pickup 5a and the accommodating rotary pickup 5b.
  • the relay rotary pickup 5c is connected to the rotary pickup 5a for pickup at an angle of 45 degrees and connected to the rotary pickup 5b for storage at an angle of 45 degrees, and the three rotary pickups are directed obliquely downward as a whole. Are arranged in a straight line.
  • the lowermost end portion of the pickup rotary pickup 5a and the lowermost end portion of the accommodating rotary pickup 5b are higher than the relay rotary pickup 5c by one step. Will be different.
  • the supply unit 2 or the storage unit 3 has a height that cannot be eliminated by simply lowering one of the rotary pickup 5a for pickup and the rotary pickup 5b for accommodation, the overlap is eliminated. It can mount in the transfer apparatus 1 comprised by these.
  • the relay rotary pickup 5c is arranged at a different height from the pickup rotary pickup 5a, so that the lowermost end of the accommodating rotary pickup 5b is placed at the bottom of the supply unit 2. It can be located below the lower end. Thereby, the supply unit 2 installed in a high position can be arrange
  • the installation stand 13 is installed in a box shape with the housing unit 3 facing the opening. Accordingly, the housing unit 3 installed at a low position can be arranged so as to enter the inside of the installation table 13, or the stage 31 can be moved so as to enter the inside of the installation table 13.
  • the height of the lowermost end of the relay rotary pickup 5c is between the lowermost ends of the pickup and storage rotary pickups 5b. I made it. That is, the relay rotary pick-up 5c is also arranged at a position lower than the pick-up or housing rotary pick-up 5b positioned at the upper stage. Thereby, even if it is the tall supply unit 2 and the accommodation unit 3, the physical collision of these units 2 and 3 will be lost, and the increase in the full length in which the rotary pick-ups 5a and 5b continue will be suppressed to the minimum. Therefore, the transfer device 1 can maintain the size reduction while removing the restriction on the total height of the units arranged in the periphery.
  • the lowermost end portion of the accommodating rotary pickup 5b is positioned below the lowermost end portion of the supply unit 2, and the supply unit 2 is installed on an installation base 13 having an opening facing the accommodation unit 3. It was to so. Thereby, the accommodation unit 3 can extend to the inside of the installation table 13. Therefore, since the supply unit 2 and the accommodation unit 3 can be arranged substantially overlapping, further downsizing of the transfer device 1 can be achieved.
  • the housing rotary pickup 5b is lower than the pickup rotary pickup 5a.
  • the present invention is not limited to this.
  • the rotary pickup 5b for accommodation is arranged at a high position, and the rotary pickup 5a for pickup is arranged at a low position.
  • the relay rotary pickup 5c is arranged at a different height from the housing rotary pickup 5b.
  • the lowermost end portion of the rotary pickup 5a for pickup can be positioned below the lowermost end portion of the storage unit 3.
  • the accommodation unit 3 installed at a high position can be arranged at a height exceeding the total height of the supply unit 2 installed at a low position.
  • the installation stand 13 is installed in a box shape with the supply unit 2 facing the opening. Accordingly, the supply unit 2 installed at a low position can be arranged so as to enter the inside of the installation table 13, or the stage 31 can be moved so as to enter the inside of the installation table 13.
  • the lowermost end portion of the relay rotary pickup 5c is positioned below the lowermost end portion of the storage unit 3, and the storage unit 3 faces the supply unit 2. It was made to install in the installation base 13 which opened. Thereby, the supply unit 2 can extend inside the installation base 13. Therefore, since the supply unit 2 and the accommodation unit 3 can be arranged substantially overlapping, further downsizing of the transfer device 1 can be achieved.
  • Processing points include visual inspection, adhesive application, posture confirmation, forced discharge of defective products, electrical property inspection, temperature adjustment such as heating or cooling, shape processing of terminals extending from electronic components, posture correction, marking, and other various types. Can be provided.
  • an electrostatic chucking method in addition to a suction nozzle that sucks and detaches the electronic component W by generating and breaking vacuum or generating positive pressure, an electrostatic chucking method, a Bernoulli chuck method, or a chuck that mechanically clamps the electronic component W A mechanism may be arranged.

Abstract

La présente invention se rapporte à un dispositif de transfert pour lequel une réduction de la taille peut être obtenue tout en éliminant la limitation de la taille d'une unité disposée en périphérie. Le dispositif de transfert (1) comprend une unité d'alimentation (2), une unité de stockage (3), un élément de préhension rotatif (5a) utilisé pour la prise et un élément de préhension rotatif (5b) utilisé pour le stockage. Les éléments de préhension rotatifs (5a, 5b) sont disposés presque directement au-dessus de l'unité d'alimentation (2) et presque directement au-dessus de l'unité de stockage (3), respectivement. Chaque élément de préhension rotatif (5a, 5b) comprend une pluralité de parties de support (51) autour d'un axe de rotation et les parties de support (51) sont tournées par intermittence autour de l'axe de rotation selon des incréments angulaires prédéterminés de sorte que les extrémités distales soient orientées vers l'extérieur. L'élément de préhension rotatif (5a) utilisé pour la prise et l'élément de préhension rotatif (5b) utilisé pour le stockage sont orientés de manière longitudinale, présentent des plans de rotation verticaux et sont disposés de sorte que leurs extrémités les plus basses aient une hauteur différente.
PCT/JP2013/060431 2013-04-05 2013-04-05 Dispositif de transfert WO2014162584A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014517927A JP5697120B1 (ja) 2013-04-05 2013-04-05 移載装置
PCT/JP2013/060431 WO2014162584A1 (fr) 2013-04-05 2013-04-05 Dispositif de transfert

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/060431 WO2014162584A1 (fr) 2013-04-05 2013-04-05 Dispositif de transfert

Publications (1)

Publication Number Publication Date
WO2014162584A1 true WO2014162584A1 (fr) 2014-10-09

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Application Number Title Priority Date Filing Date
PCT/JP2013/060431 WO2014162584A1 (fr) 2013-04-05 2013-04-05 Dispositif de transfert

Country Status (2)

Country Link
JP (1) JP5697120B1 (fr)
WO (1) WO2014162584A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018152980A (ja) * 2017-03-13 2018-09-27 三菱電機株式会社 巻線装置及びステータの製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62252999A (ja) * 1986-04-25 1987-11-04 正和産業株式会社 リ−ド線付電子部品の方向整列装置
JPS63126325U (fr) * 1987-02-06 1988-08-18
JPH0275524A (ja) * 1988-09-09 1990-03-15 Hitachi Electron Eng Co Ltd 電子部品の搬送移載装置
JPH0750156A (ja) * 1993-08-03 1995-02-21 Toshiba Battery Co Ltd 円筒型電池の整列装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62252999A (ja) * 1986-04-25 1987-11-04 正和産業株式会社 リ−ド線付電子部品の方向整列装置
JPS63126325U (fr) * 1987-02-06 1988-08-18
JPH0275524A (ja) * 1988-09-09 1990-03-15 Hitachi Electron Eng Co Ltd 電子部品の搬送移載装置
JPH0750156A (ja) * 1993-08-03 1995-02-21 Toshiba Battery Co Ltd 円筒型電池の整列装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018152980A (ja) * 2017-03-13 2018-09-27 三菱電機株式会社 巻線装置及びステータの製造方法

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JPWO2014162584A1 (ja) 2017-02-16
JP5697120B1 (ja) 2015-04-08

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