WO2014125912A1 - Composition liquide de résine, ensemble puce à protubérances et procédé pour la production dudit ensemble - Google Patents

Composition liquide de résine, ensemble puce à protubérances et procédé pour la production dudit ensemble Download PDF

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Publication number
WO2014125912A1
WO2014125912A1 PCT/JP2014/051702 JP2014051702W WO2014125912A1 WO 2014125912 A1 WO2014125912 A1 WO 2014125912A1 JP 2014051702 W JP2014051702 W JP 2014051702W WO 2014125912 A1 WO2014125912 A1 WO 2014125912A1
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Prior art keywords
resin composition
liquid resin
curing agent
component
mass
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PCT/JP2014/051702
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English (en)
Japanese (ja)
Inventor
理恵子 加藤
一希 岩谷
洋平 細野
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ナミックス株式会社
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Publication of WO2014125912A1 publication Critical patent/WO2014125912A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a semiconductor element mounting body, in particular, a flip chip mounting body, in particular a liquid resin composition used for sealing a flip chip mounting body in an image element such as an image sensor module, and the liquid resin composition.
  • the present invention relates to a flip chip mounting body to be used and a method for manufacturing the flip chip mounting body.
  • flip-chip bonding has been used as a semiconductor chip mounting method that can cope with higher wiring density and higher frequency of electronic devices.
  • a gap between a semiconductor chip and a substrate is sealed with a liquid resin composition called an underfill material.
  • FIG. 1 an example of the schematic diagram of the cross section of an image sensor module is shown.
  • the image sensor module 1 condenses the light that has passed through the lens 8 (indicated by a broken arrow in FIG. 1) with the microlens 4 and detects it with the photodiode 3.
  • bleed is one of the problems related to a semiconductor sealing material (underfill material) for sealing a gap between a semiconductor chip such as a photodiode and a substrate.
  • Bleed in an image sensor module is a phenomenon in which a liquid component in a semiconductor sealing material, which is a liquid resin composition, spreads from the bottom of a semiconductor chip to the imaging surface (sensor surface) and microlenses of the semiconductor chip. If the bleed occurs, the imaging surface of the semiconductor chip and the microlens are contaminated, so that the image quality of the image sensor module is deteriorated, which is a fatal problem.
  • FIG. 2 is a schematic diagram for explaining bleeding in the image sensor module.
  • the dispenser 20 is used to attach the semiconductor sealing material 11 to the substrate 12 and the semiconductor. There is a step of filling between the chips 13. At this time, when the liquid component in the semiconductor sealing material 11 oozes out and the bleed 111 is generated, the imaging surface of the semiconductor chip 13 and the microlens 14 are contaminated. In order to suppress this bleed, a method of coating the imaging surface of the semiconductor chip with a fluororesin is used (Patent Document 1), but there is a new problem that the image quality deteriorates due to the fluorine coating.
  • a liquid sealing resin composition containing a liquid silicone compound having a carboxyl group or an amino group (Patent Document 2), an insulating paste containing a silicone rubber fine powder (Patent Document 3), A side-fill material (Patent Documents 4 and 5) containing an alkyl methacrylate copolymer, an inorganic filler surface-treated with a non-reactive organosilicon compound, and a modified silicone resin has been reported.
  • Patent Document 2 Taking into account the suppression of bleed on the substrate (Patent Document 2) and the substrate used without surface treatment such as plasma (Patent Documents 3 to 5), imaging of semiconductor chips not coated with fluorine There is a problem that bleeding to the surface cannot be suppressed.
  • An object of the present invention is to suppress bleeding of the liquid resin composition with respect to the imaging surface of a semiconductor chip not coated with fluorine for the purpose of improving the image quality of an image element such as an image sensor module.
  • the objective of this invention is providing the liquid resin composition which can suppress the bleed with respect to the imaging surface of the semiconductor chip which has not carried out fluorine coating for the image quality improvement of image elements, such as an image sensor module.
  • the present inventors have intensively studied and developed a liquid resin composition in which no bleeding occurs even on the imaging surface of a semiconductor chip not coated with fluorine by adding a specific additive to the liquid resin composition. did.
  • the present invention relates to a liquid resin composition, a semiconductor sealing agent, an image element sealing agent, a flip chip mounting body, and a method of manufacturing a flip chip mounting body that have solved the above problems by having the following configurations.
  • a liquid resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) a copolymer of dimethylaminopropylacrylamide and butyl acrylate.
  • a semiconductor sealing material comprising the liquid resin composition according to the above [1].
  • an image element such as an image sensor with improved image quality can be obtained by using an imaging surface of a semiconductor chip not coated with fluorine.
  • the present invention [7] it is possible to provide a flip chip mounting body that uses an imaging surface of a semiconductor chip that is not coated with fluorine and that suppresses bleeding. According to the present invention [8], it is possible to easily obtain a flip chip mounting body sealed using the sealing liquid resin composition of the present invention [5].
  • the liquid resin composition of the present invention comprises (A) an epoxy resin, (B) a curing agent, and (C) a copolymer of dimethylaminopropylacrylamide and butyl acrylate.
  • Component (A) imparts curability, heat resistance, and adhesiveness to the liquid resin composition, and imparts durability to the liquid resin composition after curing.
  • component (A) bisphenol A type epoxy resin, brominated bisphenol A type epoxy resin, bisphenol F type epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin, novolak type epoxy resin, aminophenol type epoxy resin, alicyclic Epoxy resin, ether type or polyether type epoxy resin, oxirane ring-containing epoxy resin, etc., bisphenol F type epoxy resin, aminophenol type epoxy resin, bisphenol A type epoxy resin, naphthalene type epoxy resin are liquid resin composition From the viewpoint of glass transition point, reflow resistance, and moisture resistance of the product.
  • the epoxy equivalent of the component (A) is preferably 80 to 250 g / eq from the viewpoint of viscosity adjustment.
  • Commercially available products include Nippon Steel Chemical's bisphenol F type epoxy resins (product names: YDF8170, YDF870GS), Nippon Steel Chemical's bisphenol A type epoxy resins (product names: YD-128, YD-825GS), DIC naphthalene type epoxy. Resin (product name: HP4032D) and the like can be mentioned, but the component (A) is not limited to these product names.
  • a component may be individual or may use 2 or more types together.
  • the component (B) only needs to have the curability of the component (A), and can be used in a solid form as long as the liquid resin composition can maintain fluidity at room temperature.
  • the component (B) include phenolic curing agents, acid anhydride curing agents, amine curing agents, imidazole curing agents, carboxylic acid dihydrazide curing agents, phenolic curing agents, amine curing agents, and acids. It is preferable that it is at least one selected from the group consisting of an anhydride-based curing agent and an imidazole-based curing agent.
  • a phenolic curing agent is more preferable from the viewpoint of adhesion, and an acid anhydride curing agent is more preferable from the viewpoint of the fluidity of the liquid resin composition and the connectivity between the semiconductor chip and the substrate. From the viewpoint of storage stability, an imidazole curing agent is more preferable.
  • phenolic curing agent examples include phenol novolak and cresol novolak, and phenol novolak is preferable.
  • phenolic curing agents have a slower curing rate than other curing agents such as acid anhydride curing agents, amine curing agents, imidazole curing agents, etc. When the curing rate of the product becomes too fast, it can be used for the purpose of delaying the curing rate of the liquid resin composition by using a phenolic curing agent in combination.
  • Acid anhydrides include tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic acid anhydride, hydrogenated methylnadic acid anhydride, trialkyltetrahydrophthalic anhydride, Methylcyclohexene tetracarboxylic dianhydride, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic dianhydride, ethylene glycol bisanhydro trimellitate, glycerin bis (anhydro trimellitate) mono Acetate, dodecenyl succinic anhydride, aliphatic dibasic polyanhydride, chlorendic anhydride, methylbutenyl tetrahydrophthalic anhydride, alkylated tetrahydrophthalic anhydride, methyl
  • Examples of amine-based curing agents include chain aliphatic amines, cycloaliphatic amines, aliphatic aromatic amines, aromatic amines, and the like, and aromatic amines are preferred.
  • Examples of the carboxylic acid dihydrazide curing agent include adipic acid dihydrazide, isophthalic acid dihydrazide, sebacic acid dihydrazide, dodecanoic acid dihydrazide, and adipic acid dihydrazide is preferable.
  • a microencapsulated imidazole compound curing agent and an amine adduct type curing agent are preferable from the viewpoint of storage stability, and are microencapsulated dispersed in a liquid epoxy resin such as liquid bisphenol A type.
  • Imidazole compound curing agents are more preferred from the viewpoints of workability, curing speed, and storage stability.
  • imidazole curing agents examples include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2,4- Diamino-6- [2′-methylimidazolyl- (1 ′)] ethyl-s-triazine, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2, And 3-dihydro-1H-pyrrolo [1,2-a] benzimidazole, and the like.
  • component (B) Commercially available products of component (B) include Meiwa Kasei phenol curing agents (product names: MEH8000, MEH8005), Mitsubishi Chemical acid anhydrides (grade: YH306, YH307), Hitachi Chemical 3 or 4-methyl-hexahydro anhydride.
  • Phthalic acid (Product name: HN-5500), Nippon Kayaku amine curing agent (Product name: Kayahard AA), Nippon Finechem adipic acid dihydrazide (Product name: ADH), Asahi Kasei E-materials microencapsulated imidazole compound curing agent (Product names: HX3722, HX3742, HX3932HP), Ajinomoto Fine Techno's amine adduct type curing agent (product name: PN-40J), and the like, but the component (B) is not limited to these product names.
  • a component (B) having a particle size of less than 1 ⁇ m it is preferable to use a component (B) having a particle size of less than 1 ⁇ m.
  • a component may be individual or may use 2 or more types together.
  • Component (C) improves the wettability of the liquid resin composition and suppresses bleeding of the liquid resin composition.
  • Component (C) is represented by chemical formula (1):
  • the mass of dimethylaminopropylacrylamide is 1 to 30 parts by mass with respect to 100 parts by mass in total of dimethylaminopropylacrylamide and butyl acrylate.
  • quantitative analysis of dimethylaminopropylacrylamide and butyl acrylate is performed by GPC and NMR.
  • the component (C) preferably has a weight average molecular weight of 10,000 to 30,000.
  • the weight average molecular weight is a value obtained by gel permeation chromatography (GPC) using a standard polystyrene calibration curve.
  • GPC gel permeation chromatography
  • the mechanism that the component (C) gives to the bleed suppression of the liquid resin composition is not clear, but is presumed to be because the affinity of the semiconductor chip surface with the imaging surface is reduced.
  • (C) As a commercial item of a component, the product made by BYK Chemie (Product name: DISPERBYK112, DISPERBYK116) etc. are mentioned, However, (C) component is not limited to these product names.
  • the encapsulating resin composition preferably contains 10 to 60 parts by mass of component (A) and more preferably 15 to 55 parts by mass with respect to 100 parts by mass of the encapsulating resin composition.
  • the encapsulating resin composition preferably contains 10 to 60 parts by mass of component (B) with respect to 100 parts by mass of the encapsulating resin composition, and more preferably 10 to 55 parts by mass.
  • component (B) When the amount is less than 10 parts by mass, the curability tends to be deteriorated due to a decrease in reactivity, and the moisture resistance reliability and migration resistance of the liquid resin composition after curing are easily deteriorated. Viscosity tends to be too high, voids are likely to occur, or ionic impurities increase, resulting in poor reliability.
  • curing agent are used with respect to 100 mass parts of sealing resin compositions. It is preferable to contain 5 to 15 parts by mass and to add 1 to 5 parts by mass of the phenolic curing agent with respect to 100 parts by mass of the sealing resin composition.
  • the component (C) is preferably 0.001 to 5.0 parts by mass, and 0.02 to 2.5 parts by mass with respect to 100 parts by mass of the liquid resin composition, from the viewpoint of suppressing bleeding of the liquid resin composition. Parts, more preferably 0.03 to 2.1 parts by mass. If it is 0.02 parts by mass, the bleed suppression of the liquid resin composition is good, and if it is 2.5 parts by mass or less, the pot life of the liquid resin composition is remarkably good.
  • the liquid resin composition further contains (D) filler
  • (D) filler it is preferable from the viewpoint of stress relaxation during heat cycle and adhesion.
  • the component (D) include colloidal silica, hydrophobic silica, silica such as spherical silica, talc and the like, and spherical silica is more preferable from the viewpoint of fluidity at the time of coating.
  • the component (D) is more preferably silica having an average particle size of 0.01 to 20 ⁇ m, and more preferably silica having an average particle size of 0.02 to 10 ⁇ m.
  • Admatex spherical silica Product name: SO-E2
  • Admatex spherical silica Product name: SE2300
  • Electrochemical industry silica filler Product name: FB5SDX
  • Ube Materials calcium carbonate filler Product name: CS 4NA
  • the component (D) is not limited to these product names.
  • the average particle diameter of the component (D) is measured by a dynamic light scattering nanotrack particle size analyzer.
  • a component may be individual or may use 2 or more types together.
  • the liquid resin composition further contains a rubber additive as the component (E)
  • the component (E) includes acrylic rubber, urethane rubber, silicone rubber, butadiene rubber.
  • Etc. (E) A solid thing can be used for a component.
  • the form is not particularly limited, and for example, particles, powders, and pellets can be used. In the case of particles, for example, the average particle diameter is 0.01 to 20 ⁇ m, preferably 0.02 to The thickness is 10 ⁇ m, more preferably 0.03 to 5 ⁇ m.
  • the component (E) can also be used at room temperature, and examples thereof include polybutadiene, butadiene / acrylonitrile copolymer, polyisoprene, polypropylene oxide, and polydiorganosiloxane having a relatively low average molecular weight.
  • what has a group which reacts with an epoxy group at the terminal can be used for (E) component, These may be a solid or liquid form. Examples of commercially available products include CTBN1300, ATBN1300-16, CTBN1008-SP manufactured by Ube Industries, silicone rubber powder (product name: AY) manufactured by Toray Dow Corning, rubber powder manufactured by JSR (product name: XER81), etc.
  • Ingredients are not limited to these product names.
  • (E) component is not limited to these product names.
  • a component may be individual or may use 2 or more types together.
  • the liquid resin composition further contains a coupling agent as the component (F), it is preferable from the viewpoint of the adhesiveness of the liquid resin composition.
  • a coupling agent as the component (F)
  • Examples of commercially available products include KBM403, KBE903, and KBE9103 manufactured by Shin-Etsu Chemical Co., Ltd., but the component (F) is not limited to these product names.
  • a component may be individual or may use 2 or more types together.
  • the component (D) is preferably contained in an amount of 0.1 to 90 parts by mass, more preferably 0.5 to 50 parts by mass with respect to 100 parts by mass of the liquid resin composition.
  • amount is from 0.1 to 90 parts by mass, deterioration of the injection property can be avoided while suppressing an increase in the linear expansion coefficient.
  • Component (E) is preferably contained in an amount of 0.1 to 30 parts by mass, more preferably 0.5 to 25 parts by mass, and further preferably 1 to 20 parts by mass with respect to 100 parts by mass of the liquid resin composition. .
  • component (E) is 0.1 part by mass or more, the stress of the resin composition is relieved, and when it is 30 parts by mass or less, the moisture resistance reliability is not lowered.
  • the component (F) is preferably contained in an amount of 0.05 to 15 parts by mass, more preferably 0.1 to 10 parts by mass with respect to 100 parts by mass of the liquid resin composition. Adhesion improves when it is 0.05 parts by mass or more, and moisture resistance reliability of the liquid resin composition after curing becomes better, and foaming of the liquid resin composition is suppressed when it is 15 parts by mass or less.
  • a thixotropic agent for improving workability a pigment such as carbon black, an ion trapping agent, a dye, an antifoaming agent, a foam breakage, if necessary.
  • An additive, an antioxidant, other additives, a reactive diluent, an organic solvent, and the like can be further blended.
  • carbon black is preferably added so that the cured liquid resin composition after curing blocks light and prevents malfunction of the semiconductor chip.
  • the liquid resin composition of the present invention can be prepared by, for example, stirring, melting, mixing, and dispersing components (A) to (C) and other additives simultaneously or separately, with heat treatment as necessary.
  • the component (B) is a solid, the resin viscosity increases and the workability is remarkably deteriorated if it is blended as it is. Therefore, it is preferable to liquefy by heating in advance and mix with the component (A).
  • the mixing, stirring, dispersing and the like devices are not particularly limited, and a raikai machine equipped with a stirring and heating device, a three-roll mill, a ball mill, a planetary mixer, a bead mill and the like can be used. . Moreover, you may use combining these apparatuses suitably.
  • the liquid resin composition of the present invention preferably has a viscosity of 1 to 100 Pa ⁇ s at a temperature of 25 ° C.
  • the viscosity is measured with a viscometer manufactured by Brookfield (model number: DV-1).
  • the liquid resin composition of the present invention is preferably cured at 80 to 165 ° C. for 1 to 150 minutes.
  • the liquid resin composition of the present invention is preferably used as a semiconductor sealing material, and more preferably an image element semiconductor sealing material.
  • FIG. 1 shows an example of a schematic diagram of a cross section of an image sensor module.
  • the image sensor module 1 collects the light that has passed through the lens 8 (indicated by a broken arrow in FIG. 1) by the microlens 4 and detects it by the photodiode 3.
  • FIG. 3 the schematic diagram for demonstrating the usage example of the liquid resin composition of this invention is shown.
  • examples of the substrate include, but are not limited to, epoxy resin, glass-epoxy resin, polyimide resin, and the like.
  • a solder alloy made of tin, lead, copper, bismuth, silver, zinc, indium, or the like can be used, and a lead-free solder alloy is preferable from an environmental problem, but is not limited thereto.
  • liquid resin composition of the present invention can easily produce a flip chip mounting body in which bleeding is suppressed.
  • Examples 1 to 12 have a bleed length of 10 ⁇ m or less.
  • Examples 1 to 6 and 8 to 12 using a phenolic curing agent as the component (B) The bleed length was found to be even better at 0-5 ⁇ m.
  • the viscosity increase within 24 hours is 5 times or less, the pot life is good, and the component (C) is in the range of 0.02 to 2.5 parts by mass.
  • the pot life was remarkably good, with the viscosity increase within 24 hours being twice or less.
  • Comparative Examples 1 to 6 containing no component (C) had a long bleed length of 30 to 50 ⁇ m.
  • the liquid resin composition of the present invention suppresses bleed and has a long pot life, it is used as a sealing material for semiconductor elements, particularly for flip chip mounting bodies, especially for sealing flip chip mounting bodies used for image elements. Very suitable for fastening materials.

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Abstract

La présente invention a pour objet d'empêcher la migration d'une composition liquide de résine dans une zone d'imagerie sur une puce à semi-conducteur qui n'est pas soumise à un enrobage par un matériau contenant du fluor, dans le but d'améliorer la qualité d'image d'un pixel d'un module de capteur d'image ou similaire. A cet effet, la composition liquide de résine selon l'invention est caractérisée en ce qu'elle comprend (A) une résine époxyde, (B) un agent durcisseur et (C) un copolymère de diméthylaminopropylacrylamide et d'acrylate de butyle. On préfère que le composant (B) comprenne au moins un composant choisi parmi un agent durcisseur de type phénol, un agent durcisseur de type amine, un agent durcisseur de type anhydride d'acide et un agent durcisseur de type imidazole.
PCT/JP2014/051702 2013-02-14 2014-01-27 Composition liquide de résine, ensemble puce à protubérances et procédé pour la production dudit ensemble WO2014125912A1 (fr)

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JP2013-026998 2013-02-14
JP2013026998A JP6071612B2 (ja) 2013-02-14 2013-02-14 液状樹脂組成物、フリップチップ実装体およびその製造方法

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JP7413804B2 (ja) * 2020-02-03 2024-01-16 三菱ケミカル株式会社 粘接着剤組成物、粘接着剤、粘接着シート、及び積層体
KR20240101857A (ko) 2021-11-19 2024-07-02 나믹스 가부시끼가이샤 경화성 수지 조성물

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11255867A (ja) * 1998-03-13 1999-09-21 Nippon Kayaku Co Ltd エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JPH11335649A (ja) * 1998-05-27 1999-12-07 Nitto Denko Corp 熱硬化型接着剤組成物とその接着シ―ト類
JP2006206731A (ja) * 2005-01-28 2006-08-10 Nippon Soda Co Ltd エポキシ樹脂組成物
JP2008144070A (ja) * 2006-12-12 2008-06-26 Shinto Paint Co Ltd カチオン性電着塗料組成物
JP2010016173A (ja) * 2008-07-03 2010-01-21 Panasonic Corp 固体撮像素子、その製造方法、及び固体撮像装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11255867A (ja) * 1998-03-13 1999-09-21 Nippon Kayaku Co Ltd エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JPH11335649A (ja) * 1998-05-27 1999-12-07 Nitto Denko Corp 熱硬化型接着剤組成物とその接着シ―ト類
JP2006206731A (ja) * 2005-01-28 2006-08-10 Nippon Soda Co Ltd エポキシ樹脂組成物
JP2008144070A (ja) * 2006-12-12 2008-06-26 Shinto Paint Co Ltd カチオン性電着塗料組成物
JP2010016173A (ja) * 2008-07-03 2010-01-21 Panasonic Corp 固体撮像素子、その製造方法、及び固体撮像装置

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TW201439190A (zh) 2014-10-16
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