WO2014125912A1 - Liquid resin composition, flip chip assembly, and method for producing said assembly - Google Patents
Liquid resin composition, flip chip assembly, and method for producing said assembly Download PDFInfo
- Publication number
- WO2014125912A1 WO2014125912A1 PCT/JP2014/051702 JP2014051702W WO2014125912A1 WO 2014125912 A1 WO2014125912 A1 WO 2014125912A1 JP 2014051702 W JP2014051702 W JP 2014051702W WO 2014125912 A1 WO2014125912 A1 WO 2014125912A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin composition
- liquid resin
- curing agent
- component
- mass
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 81
- 239000007788 liquid Substances 0.000 title claims abstract description 78
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 57
- 239000004065 semiconductor Substances 0.000 claims abstract description 48
- 239000003822 epoxy resin Substances 0.000 claims abstract description 22
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 22
- ZWAPMFBHEQZLGK-UHFFFAOYSA-N 5-(dimethylamino)-2-methylidenepentanamide Chemical compound CN(C)CCCC(=C)C(N)=O ZWAPMFBHEQZLGK-UHFFFAOYSA-N 0.000 claims abstract description 8
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229920001577 copolymer Polymers 0.000 claims abstract description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 30
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 19
- 239000003566 sealing material Substances 0.000 claims description 18
- 150000001412 amines Chemical class 0.000 claims description 10
- 150000008065 acid anhydrides Chemical class 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 238000003384 imaging method Methods 0.000 abstract description 16
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract description 12
- 230000000740 bleeding effect Effects 0.000 abstract description 12
- 229910052731 fluorine Inorganic materials 0.000 abstract description 12
- 239000011737 fluorine Substances 0.000 abstract description 12
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 19
- 239000000758 substrate Substances 0.000 description 15
- 238000007789 sealing Methods 0.000 description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 9
- 239000000377 silicon dioxide Substances 0.000 description 9
- -1 methylnadic acid anhydride Chemical class 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 150000008064 anhydrides Chemical class 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 230000001629 suppression Effects 0.000 description 3
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 2
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 2
- QCBSYPYHCJMQGB-UHFFFAOYSA-N 2-ethyl-1,3,5-triazine Chemical compound CCC1=NC=NC=N1 QCBSYPYHCJMQGB-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- GOYGTBXFJBGGLI-UHFFFAOYSA-N 7a-but-1-enyl-3a-methyl-4,5-dihydro-2-benzofuran-1,3-dione Chemical compound C1=CCCC2(C)C(=O)OC(=O)C21C=CCC GOYGTBXFJBGGLI-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 125000005591 trimellitate group Chemical group 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 description 1
- RDNPPYMJRALIIH-UHFFFAOYSA-N 3-methylcyclohex-3-ene-1,1,2,2-tetracarboxylic acid Chemical compound CC1=CCCC(C(O)=O)(C(O)=O)C1(C(O)=O)C(O)=O RDNPPYMJRALIIH-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- DRPJWBIHQOHLND-UHFFFAOYSA-N 4-[dimethoxy(methyl)silyl]oxybutyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)OCCCCOC(=O)C(C)=C DRPJWBIHQOHLND-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 229920002732 Polyanhydride Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- ZWLIYXJBOIDXLL-UHFFFAOYSA-N decanedihydrazide Chemical compound NNC(=O)CCCCCCCCC(=O)NN ZWLIYXJBOIDXLL-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- ZONYXWQDUYMKFB-UHFFFAOYSA-N flavanone Chemical compound O1C2=CC=CC=C2C(=O)CC1C1=CC=CC=C1 ZONYXWQDUYMKFB-UHFFFAOYSA-N 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- VANNPISTIUFMLH-UHFFFAOYSA-N glutaric anhydride Chemical compound O=C1CCCC(=O)O1 VANNPISTIUFMLH-UHFFFAOYSA-N 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- FLBJFXNAEMSXGL-UHFFFAOYSA-N het anhydride Chemical compound O=C1OC(=O)C2C1C1(Cl)C(Cl)=C(Cl)C2(Cl)C1(Cl)Cl FLBJFXNAEMSXGL-UHFFFAOYSA-N 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a semiconductor element mounting body, in particular, a flip chip mounting body, in particular a liquid resin composition used for sealing a flip chip mounting body in an image element such as an image sensor module, and the liquid resin composition.
- the present invention relates to a flip chip mounting body to be used and a method for manufacturing the flip chip mounting body.
- flip-chip bonding has been used as a semiconductor chip mounting method that can cope with higher wiring density and higher frequency of electronic devices.
- a gap between a semiconductor chip and a substrate is sealed with a liquid resin composition called an underfill material.
- FIG. 1 an example of the schematic diagram of the cross section of an image sensor module is shown.
- the image sensor module 1 condenses the light that has passed through the lens 8 (indicated by a broken arrow in FIG. 1) with the microlens 4 and detects it with the photodiode 3.
- bleed is one of the problems related to a semiconductor sealing material (underfill material) for sealing a gap between a semiconductor chip such as a photodiode and a substrate.
- Bleed in an image sensor module is a phenomenon in which a liquid component in a semiconductor sealing material, which is a liquid resin composition, spreads from the bottom of a semiconductor chip to the imaging surface (sensor surface) and microlenses of the semiconductor chip. If the bleed occurs, the imaging surface of the semiconductor chip and the microlens are contaminated, so that the image quality of the image sensor module is deteriorated, which is a fatal problem.
- FIG. 2 is a schematic diagram for explaining bleeding in the image sensor module.
- the dispenser 20 is used to attach the semiconductor sealing material 11 to the substrate 12 and the semiconductor. There is a step of filling between the chips 13. At this time, when the liquid component in the semiconductor sealing material 11 oozes out and the bleed 111 is generated, the imaging surface of the semiconductor chip 13 and the microlens 14 are contaminated. In order to suppress this bleed, a method of coating the imaging surface of the semiconductor chip with a fluororesin is used (Patent Document 1), but there is a new problem that the image quality deteriorates due to the fluorine coating.
- a liquid sealing resin composition containing a liquid silicone compound having a carboxyl group or an amino group (Patent Document 2), an insulating paste containing a silicone rubber fine powder (Patent Document 3), A side-fill material (Patent Documents 4 and 5) containing an alkyl methacrylate copolymer, an inorganic filler surface-treated with a non-reactive organosilicon compound, and a modified silicone resin has been reported.
- Patent Document 2 Taking into account the suppression of bleed on the substrate (Patent Document 2) and the substrate used without surface treatment such as plasma (Patent Documents 3 to 5), imaging of semiconductor chips not coated with fluorine There is a problem that bleeding to the surface cannot be suppressed.
- An object of the present invention is to suppress bleeding of the liquid resin composition with respect to the imaging surface of a semiconductor chip not coated with fluorine for the purpose of improving the image quality of an image element such as an image sensor module.
- the objective of this invention is providing the liquid resin composition which can suppress the bleed with respect to the imaging surface of the semiconductor chip which has not carried out fluorine coating for the image quality improvement of image elements, such as an image sensor module.
- the present inventors have intensively studied and developed a liquid resin composition in which no bleeding occurs even on the imaging surface of a semiconductor chip not coated with fluorine by adding a specific additive to the liquid resin composition. did.
- the present invention relates to a liquid resin composition, a semiconductor sealing agent, an image element sealing agent, a flip chip mounting body, and a method of manufacturing a flip chip mounting body that have solved the above problems by having the following configurations.
- a liquid resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) a copolymer of dimethylaminopropylacrylamide and butyl acrylate.
- a semiconductor sealing material comprising the liquid resin composition according to the above [1].
- an image element such as an image sensor with improved image quality can be obtained by using an imaging surface of a semiconductor chip not coated with fluorine.
- the present invention [7] it is possible to provide a flip chip mounting body that uses an imaging surface of a semiconductor chip that is not coated with fluorine and that suppresses bleeding. According to the present invention [8], it is possible to easily obtain a flip chip mounting body sealed using the sealing liquid resin composition of the present invention [5].
- the liquid resin composition of the present invention comprises (A) an epoxy resin, (B) a curing agent, and (C) a copolymer of dimethylaminopropylacrylamide and butyl acrylate.
- Component (A) imparts curability, heat resistance, and adhesiveness to the liquid resin composition, and imparts durability to the liquid resin composition after curing.
- component (A) bisphenol A type epoxy resin, brominated bisphenol A type epoxy resin, bisphenol F type epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin, novolak type epoxy resin, aminophenol type epoxy resin, alicyclic Epoxy resin, ether type or polyether type epoxy resin, oxirane ring-containing epoxy resin, etc., bisphenol F type epoxy resin, aminophenol type epoxy resin, bisphenol A type epoxy resin, naphthalene type epoxy resin are liquid resin composition From the viewpoint of glass transition point, reflow resistance, and moisture resistance of the product.
- the epoxy equivalent of the component (A) is preferably 80 to 250 g / eq from the viewpoint of viscosity adjustment.
- Commercially available products include Nippon Steel Chemical's bisphenol F type epoxy resins (product names: YDF8170, YDF870GS), Nippon Steel Chemical's bisphenol A type epoxy resins (product names: YD-128, YD-825GS), DIC naphthalene type epoxy. Resin (product name: HP4032D) and the like can be mentioned, but the component (A) is not limited to these product names.
- a component may be individual or may use 2 or more types together.
- the component (B) only needs to have the curability of the component (A), and can be used in a solid form as long as the liquid resin composition can maintain fluidity at room temperature.
- the component (B) include phenolic curing agents, acid anhydride curing agents, amine curing agents, imidazole curing agents, carboxylic acid dihydrazide curing agents, phenolic curing agents, amine curing agents, and acids. It is preferable that it is at least one selected from the group consisting of an anhydride-based curing agent and an imidazole-based curing agent.
- a phenolic curing agent is more preferable from the viewpoint of adhesion, and an acid anhydride curing agent is more preferable from the viewpoint of the fluidity of the liquid resin composition and the connectivity between the semiconductor chip and the substrate. From the viewpoint of storage stability, an imidazole curing agent is more preferable.
- phenolic curing agent examples include phenol novolak and cresol novolak, and phenol novolak is preferable.
- phenolic curing agents have a slower curing rate than other curing agents such as acid anhydride curing agents, amine curing agents, imidazole curing agents, etc. When the curing rate of the product becomes too fast, it can be used for the purpose of delaying the curing rate of the liquid resin composition by using a phenolic curing agent in combination.
- Acid anhydrides include tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic acid anhydride, hydrogenated methylnadic acid anhydride, trialkyltetrahydrophthalic anhydride, Methylcyclohexene tetracarboxylic dianhydride, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic dianhydride, ethylene glycol bisanhydro trimellitate, glycerin bis (anhydro trimellitate) mono Acetate, dodecenyl succinic anhydride, aliphatic dibasic polyanhydride, chlorendic anhydride, methylbutenyl tetrahydrophthalic anhydride, alkylated tetrahydrophthalic anhydride, methyl
- Examples of amine-based curing agents include chain aliphatic amines, cycloaliphatic amines, aliphatic aromatic amines, aromatic amines, and the like, and aromatic amines are preferred.
- Examples of the carboxylic acid dihydrazide curing agent include adipic acid dihydrazide, isophthalic acid dihydrazide, sebacic acid dihydrazide, dodecanoic acid dihydrazide, and adipic acid dihydrazide is preferable.
- a microencapsulated imidazole compound curing agent and an amine adduct type curing agent are preferable from the viewpoint of storage stability, and are microencapsulated dispersed in a liquid epoxy resin such as liquid bisphenol A type.
- Imidazole compound curing agents are more preferred from the viewpoints of workability, curing speed, and storage stability.
- imidazole curing agents examples include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2,4- Diamino-6- [2′-methylimidazolyl- (1 ′)] ethyl-s-triazine, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2, And 3-dihydro-1H-pyrrolo [1,2-a] benzimidazole, and the like.
- component (B) Commercially available products of component (B) include Meiwa Kasei phenol curing agents (product names: MEH8000, MEH8005), Mitsubishi Chemical acid anhydrides (grade: YH306, YH307), Hitachi Chemical 3 or 4-methyl-hexahydro anhydride.
- Phthalic acid (Product name: HN-5500), Nippon Kayaku amine curing agent (Product name: Kayahard AA), Nippon Finechem adipic acid dihydrazide (Product name: ADH), Asahi Kasei E-materials microencapsulated imidazole compound curing agent (Product names: HX3722, HX3742, HX3932HP), Ajinomoto Fine Techno's amine adduct type curing agent (product name: PN-40J), and the like, but the component (B) is not limited to these product names.
- a component (B) having a particle size of less than 1 ⁇ m it is preferable to use a component (B) having a particle size of less than 1 ⁇ m.
- a component may be individual or may use 2 or more types together.
- Component (C) improves the wettability of the liquid resin composition and suppresses bleeding of the liquid resin composition.
- Component (C) is represented by chemical formula (1):
- the mass of dimethylaminopropylacrylamide is 1 to 30 parts by mass with respect to 100 parts by mass in total of dimethylaminopropylacrylamide and butyl acrylate.
- quantitative analysis of dimethylaminopropylacrylamide and butyl acrylate is performed by GPC and NMR.
- the component (C) preferably has a weight average molecular weight of 10,000 to 30,000.
- the weight average molecular weight is a value obtained by gel permeation chromatography (GPC) using a standard polystyrene calibration curve.
- GPC gel permeation chromatography
- the mechanism that the component (C) gives to the bleed suppression of the liquid resin composition is not clear, but is presumed to be because the affinity of the semiconductor chip surface with the imaging surface is reduced.
- (C) As a commercial item of a component, the product made by BYK Chemie (Product name: DISPERBYK112, DISPERBYK116) etc. are mentioned, However, (C) component is not limited to these product names.
- the encapsulating resin composition preferably contains 10 to 60 parts by mass of component (A) and more preferably 15 to 55 parts by mass with respect to 100 parts by mass of the encapsulating resin composition.
- the encapsulating resin composition preferably contains 10 to 60 parts by mass of component (B) with respect to 100 parts by mass of the encapsulating resin composition, and more preferably 10 to 55 parts by mass.
- component (B) When the amount is less than 10 parts by mass, the curability tends to be deteriorated due to a decrease in reactivity, and the moisture resistance reliability and migration resistance of the liquid resin composition after curing are easily deteriorated. Viscosity tends to be too high, voids are likely to occur, or ionic impurities increase, resulting in poor reliability.
- curing agent are used with respect to 100 mass parts of sealing resin compositions. It is preferable to contain 5 to 15 parts by mass and to add 1 to 5 parts by mass of the phenolic curing agent with respect to 100 parts by mass of the sealing resin composition.
- the component (C) is preferably 0.001 to 5.0 parts by mass, and 0.02 to 2.5 parts by mass with respect to 100 parts by mass of the liquid resin composition, from the viewpoint of suppressing bleeding of the liquid resin composition. Parts, more preferably 0.03 to 2.1 parts by mass. If it is 0.02 parts by mass, the bleed suppression of the liquid resin composition is good, and if it is 2.5 parts by mass or less, the pot life of the liquid resin composition is remarkably good.
- the liquid resin composition further contains (D) filler
- (D) filler it is preferable from the viewpoint of stress relaxation during heat cycle and adhesion.
- the component (D) include colloidal silica, hydrophobic silica, silica such as spherical silica, talc and the like, and spherical silica is more preferable from the viewpoint of fluidity at the time of coating.
- the component (D) is more preferably silica having an average particle size of 0.01 to 20 ⁇ m, and more preferably silica having an average particle size of 0.02 to 10 ⁇ m.
- Admatex spherical silica Product name: SO-E2
- Admatex spherical silica Product name: SE2300
- Electrochemical industry silica filler Product name: FB5SDX
- Ube Materials calcium carbonate filler Product name: CS 4NA
- the component (D) is not limited to these product names.
- the average particle diameter of the component (D) is measured by a dynamic light scattering nanotrack particle size analyzer.
- a component may be individual or may use 2 or more types together.
- the liquid resin composition further contains a rubber additive as the component (E)
- the component (E) includes acrylic rubber, urethane rubber, silicone rubber, butadiene rubber.
- Etc. (E) A solid thing can be used for a component.
- the form is not particularly limited, and for example, particles, powders, and pellets can be used. In the case of particles, for example, the average particle diameter is 0.01 to 20 ⁇ m, preferably 0.02 to The thickness is 10 ⁇ m, more preferably 0.03 to 5 ⁇ m.
- the component (E) can also be used at room temperature, and examples thereof include polybutadiene, butadiene / acrylonitrile copolymer, polyisoprene, polypropylene oxide, and polydiorganosiloxane having a relatively low average molecular weight.
- what has a group which reacts with an epoxy group at the terminal can be used for (E) component, These may be a solid or liquid form. Examples of commercially available products include CTBN1300, ATBN1300-16, CTBN1008-SP manufactured by Ube Industries, silicone rubber powder (product name: AY) manufactured by Toray Dow Corning, rubber powder manufactured by JSR (product name: XER81), etc.
- Ingredients are not limited to these product names.
- (E) component is not limited to these product names.
- a component may be individual or may use 2 or more types together.
- the liquid resin composition further contains a coupling agent as the component (F), it is preferable from the viewpoint of the adhesiveness of the liquid resin composition.
- a coupling agent as the component (F)
- Examples of commercially available products include KBM403, KBE903, and KBE9103 manufactured by Shin-Etsu Chemical Co., Ltd., but the component (F) is not limited to these product names.
- a component may be individual or may use 2 or more types together.
- the component (D) is preferably contained in an amount of 0.1 to 90 parts by mass, more preferably 0.5 to 50 parts by mass with respect to 100 parts by mass of the liquid resin composition.
- amount is from 0.1 to 90 parts by mass, deterioration of the injection property can be avoided while suppressing an increase in the linear expansion coefficient.
- Component (E) is preferably contained in an amount of 0.1 to 30 parts by mass, more preferably 0.5 to 25 parts by mass, and further preferably 1 to 20 parts by mass with respect to 100 parts by mass of the liquid resin composition. .
- component (E) is 0.1 part by mass or more, the stress of the resin composition is relieved, and when it is 30 parts by mass or less, the moisture resistance reliability is not lowered.
- the component (F) is preferably contained in an amount of 0.05 to 15 parts by mass, more preferably 0.1 to 10 parts by mass with respect to 100 parts by mass of the liquid resin composition. Adhesion improves when it is 0.05 parts by mass or more, and moisture resistance reliability of the liquid resin composition after curing becomes better, and foaming of the liquid resin composition is suppressed when it is 15 parts by mass or less.
- a thixotropic agent for improving workability a pigment such as carbon black, an ion trapping agent, a dye, an antifoaming agent, a foam breakage, if necessary.
- An additive, an antioxidant, other additives, a reactive diluent, an organic solvent, and the like can be further blended.
- carbon black is preferably added so that the cured liquid resin composition after curing blocks light and prevents malfunction of the semiconductor chip.
- the liquid resin composition of the present invention can be prepared by, for example, stirring, melting, mixing, and dispersing components (A) to (C) and other additives simultaneously or separately, with heat treatment as necessary.
- the component (B) is a solid, the resin viscosity increases and the workability is remarkably deteriorated if it is blended as it is. Therefore, it is preferable to liquefy by heating in advance and mix with the component (A).
- the mixing, stirring, dispersing and the like devices are not particularly limited, and a raikai machine equipped with a stirring and heating device, a three-roll mill, a ball mill, a planetary mixer, a bead mill and the like can be used. . Moreover, you may use combining these apparatuses suitably.
- the liquid resin composition of the present invention preferably has a viscosity of 1 to 100 Pa ⁇ s at a temperature of 25 ° C.
- the viscosity is measured with a viscometer manufactured by Brookfield (model number: DV-1).
- the liquid resin composition of the present invention is preferably cured at 80 to 165 ° C. for 1 to 150 minutes.
- the liquid resin composition of the present invention is preferably used as a semiconductor sealing material, and more preferably an image element semiconductor sealing material.
- FIG. 1 shows an example of a schematic diagram of a cross section of an image sensor module.
- the image sensor module 1 collects the light that has passed through the lens 8 (indicated by a broken arrow in FIG. 1) by the microlens 4 and detects it by the photodiode 3.
- FIG. 3 the schematic diagram for demonstrating the usage example of the liquid resin composition of this invention is shown.
- examples of the substrate include, but are not limited to, epoxy resin, glass-epoxy resin, polyimide resin, and the like.
- a solder alloy made of tin, lead, copper, bismuth, silver, zinc, indium, or the like can be used, and a lead-free solder alloy is preferable from an environmental problem, but is not limited thereto.
- liquid resin composition of the present invention can easily produce a flip chip mounting body in which bleeding is suppressed.
- Examples 1 to 12 have a bleed length of 10 ⁇ m or less.
- Examples 1 to 6 and 8 to 12 using a phenolic curing agent as the component (B) The bleed length was found to be even better at 0-5 ⁇ m.
- the viscosity increase within 24 hours is 5 times or less, the pot life is good, and the component (C) is in the range of 0.02 to 2.5 parts by mass.
- the pot life was remarkably good, with the viscosity increase within 24 hours being twice or less.
- Comparative Examples 1 to 6 containing no component (C) had a long bleed length of 30 to 50 ⁇ m.
- the liquid resin composition of the present invention suppresses bleed and has a long pot life, it is used as a sealing material for semiconductor elements, particularly for flip chip mounting bodies, especially for sealing flip chip mounting bodies used for image elements. Very suitable for fastening materials.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Wire Bonding (AREA)
- Epoxy Resins (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
The present invention addresses the problem of preventing the bleeding of a liquid resin composition into an imaging area on a semiconductor chip that does not undergo fluorine coating, for the purpose of improving the image quality of a picture element of an image sensor module or the like.
A liquid resin composition characterized by comprising (A) an epoxy resin, (B) a curing agent and (C) a copolymer of dimethylaminopropylacrylamide and butyl acrylate. It is preferred that the component (B) comprises at least one component selected from the group consisting of a phenol-type curing agent, an amine-type curing agent, an acid-anhydride-type curing agent and an imidazole-type curing agent.
Description
本発明は、半導体素子の実装体、詳しくは、フリップチップ実装体、特に、イメージセンサーモジュール等の画像素子でのフリップチップ実装体の封止に用いる液状樹脂組成物、ならびにこの液状樹脂組成物を用いるフリップチップ実装体およびフリップチップ実装体の製造方法に関する。
The present invention relates to a semiconductor element mounting body, in particular, a flip chip mounting body, in particular a liquid resin composition used for sealing a flip chip mounting body in an image element such as an image sensor module, and the liquid resin composition. The present invention relates to a flip chip mounting body to be used and a method for manufacturing the flip chip mounting body.
近年、電子機器のさらなる配線等の高密度化、高周波化に対応可能な半導体チップの実装方式として、フリップチップボンディングが利用されている。一般的に、フリップチップボンディングでは、半導体チップと基板の間隙を、アンダーフィル材と呼ばれる液状樹脂組成物で封止する。
In recent years, flip-chip bonding has been used as a semiconductor chip mounting method that can cope with higher wiring density and higher frequency of electronic devices. Generally, in flip chip bonding, a gap between a semiconductor chip and a substrate is sealed with a liquid resin composition called an underfill material.
画像素子の１種であるイメージセンサーモジュールにおいても、薄型化を目的にフリップチップ構造が採用されたモデルが増加している。図１に、イメージセンサーモジュールの断面の模式図の一例を示す。イメージセンサーモジュール１は、レンズ８を通過した光（図１に、破線の矢印で示す）を、マイクロレンズ４で集光してフォトダイオード３で検出する。
Also in the image sensor module which is a kind of image element, a model employing a flip chip structure for the purpose of thinning is increasing. In FIG. 1, an example of the schematic diagram of the cross section of an image sensor module is shown. The image sensor module 1 condenses the light that has passed through the lens 8 (indicated by a broken arrow in FIG. 1) with the microlens 4 and detects it with the photodiode 3.
ここで、フォトダイオード等の半導体チップと基板との間隙を封止する半導体用封止材（アンダーフィル材）に関する問題の一つにブリードがある。イメージセンサーモジュールでのブリードとは、液状樹脂組成物である半導体用封止材中の液状成分が、半導体チップ下から半導体チップの撮像面（センサー面）やマイクロレンズに広がって染み出す現象であり、ブリードが発生すると、半導体チップの撮像面やマイクロレンズを汚染してしまうため、イメージセンサーモジュールの画質が悪くなり、致命的な問題となる。図２に、イメージセンサーモジュールでのブリードを説明するための模式図を示す。イメージセンサーモジュールの製造工程では、イメージセンサーモジュールで使用される基板１２と半導体チップ１３に形成されたパッド１３１を接合した後、ディスペンサー２０を用いて、半導体用封止材１１を、基板１２と半導体チップ１３間に充填する工程がある。このとき、半導体用封止材１１中の液状成分が染み出し、ブリード１１１が発生すると、半導体チップ１３の撮像面やマイクロレンズ１４を汚染してしまう。このブリードを抑制するために、半導体チップの撮像面をフッ素樹脂でコーティングする方法が用いられている（特許文献１）が、フッ素コーティングが原因で画質が落ちてしまう、という新たな問題がある。
Here, bleed is one of the problems related to a semiconductor sealing material (underfill material) for sealing a gap between a semiconductor chip such as a photodiode and a substrate. Bleed in an image sensor module is a phenomenon in which a liquid component in a semiconductor sealing material, which is a liquid resin composition, spreads from the bottom of a semiconductor chip to the imaging surface (sensor surface) and microlenses of the semiconductor chip. If the bleed occurs, the imaging surface of the semiconductor chip and the microlens are contaminated, so that the image quality of the image sensor module is deteriorated, which is a fatal problem. FIG. 2 is a schematic diagram for explaining bleeding in the image sensor module. In the manufacturing process of the image sensor module, after the substrate 12 used in the image sensor module and the pad 131 formed on the semiconductor chip 13 are joined, the dispenser 20 is used to attach the semiconductor sealing material 11 to the substrate 12 and the semiconductor. There is a step of filling between the chips 13. At this time, when the liquid component in the semiconductor sealing material 11 oozes out and the bleed 111 is generated, the imaging surface of the semiconductor chip 13 and the microlens 14 are contaminated. In order to suppress this bleed, a method of coating the imaging surface of the semiconductor chip with a fluororesin is used (Patent Document 1), but there is a new problem that the image quality deteriorates due to the fluorine coating.
したがって、近年、イメージセンサーモジュールの画質向上のために、半導体チップの撮像面にフッ素コーティングをしない方法が、検討されている。しかしながら、フッ素コーティングしていない半導体チップの撮像面に、既存の半導体用封止材を使用した場合には、上述のように、ブリードが発生し、問題となってしまう。
Therefore, in recent years, in order to improve the image quality of the image sensor module, a method in which the imaging surface of the semiconductor chip is not coated with fluorine is being studied. However, when an existing semiconductor sealing material is used on the imaging surface of a semiconductor chip that is not coated with fluorine, bleeding occurs as described above, which causes a problem.
一方、基板に対するブリードを解決するために、カルボキシル基またはアミノ基を有する液状シリコーン化合物を含む液状封止樹脂組成物（特許文献２）、シリコーンゴム微粉末を含む絶縁性ペースト（特許文献３）、メタクリル酸アルキル共重合体、非反応性有機ケイ素化合物で表面処理された無機充填剤、変性シリコーン樹脂を含有するサイドフィル材（特許文献４、５）が報告されているが、これらは、プラズマ処理した基板（特許文献２）や、プラズマ等の表面処理をせずに用いる基板（特許文献３～５）に対してのブリードの抑制を考慮しており、フッ素コーティングをしていない半導体チップの撮像面に対するブリードを抑制することはできない、という問題がある。
On the other hand, in order to solve bleeding against the substrate, a liquid sealing resin composition containing a liquid silicone compound having a carboxyl group or an amino group (Patent Document 2), an insulating paste containing a silicone rubber fine powder (Patent Document 3), A side-fill material (Patent Documents 4 and 5) containing an alkyl methacrylate copolymer, an inorganic filler surface-treated with a non-reactive organosilicon compound, and a modified silicone resin has been reported. Taking into account the suppression of bleed on the substrate (Patent Document 2) and the substrate used without surface treatment such as plasma (Patent Documents 3 to 5), imaging of semiconductor chips not coated with fluorine There is a problem that bleeding to the surface cannot be suppressed.
本発明は、イメージセンサーモジュール等の画像素子の画質向上の目的でフッ素コーティングをしていない半導体チップの撮像面に対する液状樹脂組成物のブリードを抑制することを課題とする。本発明の目的は、イメージセンサーモジュール等の画像素子の画質向上のためにフッ素コーティングをしていない半導体チップの撮像面に対するブリードを抑制することができる液状樹脂組成物を提供することである。
An object of the present invention is to suppress bleeding of the liquid resin composition with respect to the imaging surface of a semiconductor chip not coated with fluorine for the purpose of improving the image quality of an image element such as an image sensor module. The objective of this invention is providing the liquid resin composition which can suppress the bleed with respect to the imaging surface of the semiconductor chip which has not carried out fluorine coating for the image quality improvement of image elements, such as an image sensor module.
本発明者らは、鋭意検討を行い、液状樹脂組成物に、特定の添加剤を加えることにより、フッ素コーティングされていない半導体チップの撮像面であってもブリードが発生しない液状樹脂組成物を開発した。本発明は、以下の構成を有することによって上記問題を解決した液状樹脂組成物、半導体用封止剤、画像素子用封止剤、フリップチップ実装体、およびフリップチップ実装体の製造方法に関する。
〔１〕（Ａ）エポキシ樹脂、（Ｂ）硬化剤、および（Ｃ）ジメチルアミノプロピルアクリルアミドとアクリル酸ブチルの共重合体を含むことを特徴とする、液状樹脂組成物。
〔２〕（Ｂ）成分が、フェノール系硬化剤、アミン系硬化剤、酸無水物系硬化剤およびイミダゾール系硬化剤からなる群より選択される少なくとも１種である、上記〔１〕記載の液状樹脂組成物。
〔３〕（Ｃ）成分が、液状樹脂組成物１００質量部に対して、０．０２～２．５質量部である、上記〔１〕記載の液状樹脂組成物。
〔４〕（Ｂ）成分がフェノール系硬化剤を含有し、含有されるフェノール系硬化剤が、液状樹脂組成物１００質量部に対して、１～５０質量部である、上記〔２〕記載の液状樹脂組成物。
〔５〕上記〔１〕記載の液状樹脂組成物を含む、半導体用封止材。
〔６〕上記〔５〕記載の半導体用封止材を用いる、画像素子用封止材。
〔７〕上記〔１〕記載の液状樹脂組成物の硬化物を有する、フリップチップ実装体。
〔８〕上記〔５〕記載の半導体用封止材を用いて封止する、フリップチップ実装体の製造方法。 The present inventors have intensively studied and developed a liquid resin composition in which no bleeding occurs even on the imaging surface of a semiconductor chip not coated with fluorine by adding a specific additive to the liquid resin composition. did. The present invention relates to a liquid resin composition, a semiconductor sealing agent, an image element sealing agent, a flip chip mounting body, and a method of manufacturing a flip chip mounting body that have solved the above problems by having the following configurations.
[1] A liquid resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) a copolymer of dimethylaminopropylacrylamide and butyl acrylate.
[2] The liquid according to [1], wherein the component (B) is at least one selected from the group consisting of a phenolic curing agent, an amine curing agent, an acid anhydride curing agent, and an imidazole curing agent. Resin composition.
[3] The liquid resin composition according to the above [1], wherein the component (C) is 0.02 to 2.5 parts by mass with respect to 100 parts by mass of the liquid resin composition.
[4] The component according to [2] above, wherein the component (B) contains a phenolic curing agent, and the phenolic curing agent contained is 1 to 50 parts by mass with respect to 100 parts by mass of the liquid resin composition. Liquid resin composition.
[5] A semiconductor sealing material comprising the liquid resin composition according to the above [1].
[6] An image element sealing material using the semiconductor sealing material according to [5].
[7] A flip chip mounting body having a cured product of the liquid resin composition according to [1].
[8] A method for manufacturing a flip chip mounting body, wherein sealing is performed using the semiconductor sealing material according to [5].
〔１〕（Ａ）エポキシ樹脂、（Ｂ）硬化剤、および（Ｃ）ジメチルアミノプロピルアクリルアミドとアクリル酸ブチルの共重合体を含むことを特徴とする、液状樹脂組成物。
〔２〕（Ｂ）成分が、フェノール系硬化剤、アミン系硬化剤、酸無水物系硬化剤およびイミダゾール系硬化剤からなる群より選択される少なくとも１種である、上記〔１〕記載の液状樹脂組成物。
〔３〕（Ｃ）成分が、液状樹脂組成物１００質量部に対して、０．０２～２．５質量部である、上記〔１〕記載の液状樹脂組成物。
〔４〕（Ｂ）成分がフェノール系硬化剤を含有し、含有されるフェノール系硬化剤が、液状樹脂組成物１００質量部に対して、１～５０質量部である、上記〔２〕記載の液状樹脂組成物。
〔５〕上記〔１〕記載の液状樹脂組成物を含む、半導体用封止材。
〔６〕上記〔５〕記載の半導体用封止材を用いる、画像素子用封止材。
〔７〕上記〔１〕記載の液状樹脂組成物の硬化物を有する、フリップチップ実装体。
〔８〕上記〔５〕記載の半導体用封止材を用いて封止する、フリップチップ実装体の製造方法。 The present inventors have intensively studied and developed a liquid resin composition in which no bleeding occurs even on the imaging surface of a semiconductor chip not coated with fluorine by adding a specific additive to the liquid resin composition. did. The present invention relates to a liquid resin composition, a semiconductor sealing agent, an image element sealing agent, a flip chip mounting body, and a method of manufacturing a flip chip mounting body that have solved the above problems by having the following configurations.
[1] A liquid resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) a copolymer of dimethylaminopropylacrylamide and butyl acrylate.
[2] The liquid according to [1], wherein the component (B) is at least one selected from the group consisting of a phenolic curing agent, an amine curing agent, an acid anhydride curing agent, and an imidazole curing agent. Resin composition.
[3] The liquid resin composition according to the above [1], wherein the component (C) is 0.02 to 2.5 parts by mass with respect to 100 parts by mass of the liquid resin composition.
[4] The component according to [2] above, wherein the component (B) contains a phenolic curing agent, and the phenolic curing agent contained is 1 to 50 parts by mass with respect to 100 parts by mass of the liquid resin composition. Liquid resin composition.
[5] A semiconductor sealing material comprising the liquid resin composition according to the above [1].
[6] An image element sealing material using the semiconductor sealing material according to [5].
[7] A flip chip mounting body having a cured product of the liquid resin composition according to [1].
[8] A method for manufacturing a flip chip mounting body, wherein sealing is performed using the semiconductor sealing material according to [5].
本発明〔１〕によれば、フッ素コーティングされていない半導体チップの撮像面に対してブリードを抑制することができる液状樹脂組成物を提供することができる。
According to the present invention [1], it is possible to provide a liquid resin composition capable of suppressing bleed on the imaging surface of a semiconductor chip not coated with fluorine.
本発明〔５〕によれば、フッ素コーティングされていない半導体チップの撮像面に対してブリードを抑制することが可能な半導体用封止材を提供することができる。本発明〔６〕によれば、フッ素コーティングされていない半導体チップの撮像面を用いることにより、画質の向上したイメージセンサー等の画像素子を得ることができる。
According to the present invention [5], it is possible to provide a semiconductor sealing material capable of suppressing bleed on the imaging surface of a semiconductor chip not coated with fluorine. According to the present invention [6], an image element such as an image sensor with improved image quality can be obtained by using an imaging surface of a semiconductor chip not coated with fluorine.
本発明〔７〕によれば、フッ素コーティングされていない半導体チップの撮像面を用い、かつブリードが抑制されたフリップチップ実装体を提供することができる。本発明〔８〕によれば、本発明〔５〕の封止用液状樹脂組成物を用いて封止されるフリップチップ実装体を容易に得ることができる。
According to the present invention [7], it is possible to provide a flip chip mounting body that uses an imaging surface of a semiconductor chip that is not coated with fluorine and that suppresses bleeding. According to the present invention [8], it is possible to easily obtain a flip chip mounting body sealed using the sealing liquid resin composition of the present invention [5].
本発明の液状樹脂組成物は、（Ａ）エポキシ樹脂、（Ｂ）硬化剤、および（Ｃ）ジメチルアミノプロピルアクリルアミドとアクリル酸ブチルの共重合体を含むことを特徴とする。
The liquid resin composition of the present invention comprises (A) an epoxy resin, (B) a curing agent, and (C) a copolymer of dimethylaminopropylacrylamide and butyl acrylate.
（Ａ）成分は、液状樹脂組成物に、硬化性、耐熱性、接着性を付与し、硬化後の液状樹脂組成物に、耐久性を付与する。（Ａ）成分としては、ビスフェノールＡ型エポキシ樹脂、臭素化ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ナフタレン型エポキシ樹脂、ビフェニル型エポキシ樹脂、ノボラック型エポキシ樹脂、アミノフェノール系エポキシ樹脂、脂環式エポキシ樹脂、エーテル系またはポリエーテル系エポキシ樹脂、オキシラン環含有エポキシ樹脂等が挙げられ、ビスフェノールＦ型エポキシ樹脂、アミノフェノール系エポキシ樹脂、ビスフェノールＡ型エポキシ樹脂、ナフタレン型エポキシ樹脂が、液状樹脂組成物のガラス転移点、耐リフロー性、および耐湿性の観点から好ましい。（Ａ）成分のエポキシ当量は、粘度調整の観点から、８０～２５０ｇ／ｅｑが好ましい。市販品としては、新日鐵化学製ビスフェノールＦ型エポキシ樹脂（品名：ＹＤＦ８１７０、ＹＤＦ８７０ＧＳ）、新日鐵化学製ビスフェノールＡ型エポキシ樹脂（品名：ＹＤ－１２８、ＹＤ－８２５ＧＳ）、ＤＩＣ製ナフタレン型エポキシ樹脂（品名：ＨＰ４０３２Ｄ）等が挙げられるが、（Ａ）成分は、これら品名に限定されるものではない。（Ａ）成分は、単独でも２種以上を併用してもよい。
Component (A) imparts curability, heat resistance, and adhesiveness to the liquid resin composition, and imparts durability to the liquid resin composition after curing. As component (A), bisphenol A type epoxy resin, brominated bisphenol A type epoxy resin, bisphenol F type epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin, novolak type epoxy resin, aminophenol type epoxy resin, alicyclic Epoxy resin, ether type or polyether type epoxy resin, oxirane ring-containing epoxy resin, etc., bisphenol F type epoxy resin, aminophenol type epoxy resin, bisphenol A type epoxy resin, naphthalene type epoxy resin are liquid resin composition From the viewpoint of glass transition point, reflow resistance, and moisture resistance of the product. The epoxy equivalent of the component (A) is preferably 80 to 250 g / eq from the viewpoint of viscosity adjustment. Commercially available products include Nippon Steel Chemical's bisphenol F type epoxy resins (product names: YDF8170, YDF870GS), Nippon Steel Chemical's bisphenol A type epoxy resins (product names: YD-128, YD-825GS), DIC naphthalene type epoxy. Resin (product name: HP4032D) and the like can be mentioned, but the component (A) is not limited to these product names. (A) A component may be individual or may use 2 or more types together.
（Ｂ）成分は、（Ａ）成分の硬化能を有するものであればよく、液状樹脂組成物としたときに、室温で流動性を保てることができれば、固形状でも使用可能である。（Ｂ）成分としては、フェノール系硬化剤、酸無水物系硬化剤、アミン系硬化剤、イミダゾール系硬化剤、カルボン酸ジヒドラジド硬化剤等が挙げられ、フェノール系硬化剤、アミン系硬化剤、酸無水物系硬化剤およびイミダゾール系硬化剤からなる群より選択される少なくとも１種であると好ましい。また、接着性の観点から、フェノール系硬化剤がより好ましく、また、液状樹脂組成物の流動性、半導体チップと基板の接続性の観点から、酸無水物系硬化剤がより好ましい。保存安定性の観点からは、イミダゾール系硬化剤がより好ましい。
The component (B) only needs to have the curability of the component (A), and can be used in a solid form as long as the liquid resin composition can maintain fluidity at room temperature. Examples of the component (B) include phenolic curing agents, acid anhydride curing agents, amine curing agents, imidazole curing agents, carboxylic acid dihydrazide curing agents, phenolic curing agents, amine curing agents, and acids. It is preferable that it is at least one selected from the group consisting of an anhydride-based curing agent and an imidazole-based curing agent. Also, a phenolic curing agent is more preferable from the viewpoint of adhesion, and an acid anhydride curing agent is more preferable from the viewpoint of the fluidity of the liquid resin composition and the connectivity between the semiconductor chip and the substrate. From the viewpoint of storage stability, an imidazole curing agent is more preferable.
フェノール系硬化剤としては、フェノールノボラック、クレゾールノボラック等が挙げられ、フェノールノボラックが好ましい。また、フェノール系硬化剤は、酸無水物系硬化剤、アミン系硬化剤、イミダゾール系硬化剤等の他の硬化剤より、硬化速度が遅いので、他の硬化剤を使用して、液状樹脂組成物の硬化速度が速くなり過ぎる場合には、フェノール系硬化剤を併用して、液状樹脂組成物の硬化速度を遅延する目的で使用することができる。
Examples of the phenolic curing agent include phenol novolak and cresol novolak, and phenol novolak is preferable. In addition, phenolic curing agents have a slower curing rate than other curing agents such as acid anhydride curing agents, amine curing agents, imidazole curing agents, etc. When the curing rate of the product becomes too fast, it can be used for the purpose of delaying the curing rate of the liquid resin composition by using a phenolic curing agent in combination.
酸無水物としては、テトラヒドロ無水フタル酸、ヘキサヒドロ無水フタル酸、メチルテトラヒドロ無水フタル酸、メチルヘキサヒドロ無水フタル酸、メチルナジック酸無水物、水素化メチルナジック酸無水物、トリアルキルテトラヒドロ無水フタル酸、メチルシクロヘキセンテトラカルボン酸二無水物、無水フタル酸、無水トリメリット酸、無水ピロメリット酸、ベンゾフェノンテトラカルボン酸二無水物、エチレングリコールビスアンヒドロトリメリテート、グリセリンビス（アンヒドロトリメリテート）モノアセテート、ドデセニル無水コハク酸、脂肪族二塩基酸ポリ無水物、クロレンド酸無水物、メチルブテニルテトラヒドロフタル酸無水物、アルキル化テトラヒドロフタル酸無水物、メチルハイミック酸無水物、アルケニル基で置換されたコハク酸無水物、グルタル酸無水物等が挙げられ、メチルブテニルテトラヒドロフタル酸無水物が好ましい。
Acid anhydrides include tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic acid anhydride, hydrogenated methylnadic acid anhydride, trialkyltetrahydrophthalic anhydride, Methylcyclohexene tetracarboxylic dianhydride, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic dianhydride, ethylene glycol bisanhydro trimellitate, glycerin bis (anhydro trimellitate) mono Acetate, dodecenyl succinic anhydride, aliphatic dibasic polyanhydride, chlorendic anhydride, methylbutenyl tetrahydrophthalic anhydride, alkylated tetrahydrophthalic anhydride, methyl hymic anhydride, alkenyl group Succinic anhydride, glutaric anhydride and the like, methyl butenyl tetrahydrophthalic acid anhydride are preferred.
アミン系硬化剤としては、鎖状脂肪族アミン、環状脂肪族アミン、脂肪芳香族アミン、芳香族アミン等が挙げられ、芳香族アミンが好ましい。カルボン酸ジヒドラジド硬化剤としては、アジピン酸ジヒドラジド、イソフタル酸ジヒドラジド、セバチン酸ジヒドラジド、ドデカン酸ジヒドラジド等が挙げられ、アジピン酸ジヒドラジドが好ましい。
Examples of amine-based curing agents include chain aliphatic amines, cycloaliphatic amines, aliphatic aromatic amines, aromatic amines, and the like, and aromatic amines are preferred. Examples of the carboxylic acid dihydrazide curing agent include adipic acid dihydrazide, isophthalic acid dihydrazide, sebacic acid dihydrazide, dodecanoic acid dihydrazide, and adipic acid dihydrazide is preferable.
イミダゾール系硬化剤としては、マイクロカプセル化されたイミダゾール化合物硬化剤、アミンアダクト型硬化剤が、保存安定性の観点から好ましく、液状ビスフェノールＡ型等の液状エポキシ樹脂中に分散された、マイクロカプセル化イミダゾール化合物硬化剤が、作業性、硬化速度、保存安定性の点からより好ましい。イミダゾール硬化剤としては、２－メチルイミダゾール、２－ウンデシルイミダゾール、２－ヘプタデシルイミダゾール、２－エチル－４－メチルイミダゾール、２－フェニルイミダゾール、２－フェニル－４－メチルイミダゾール、２，４－ジアミノ－６－〔２’－メチルイミダゾリル－（１’）］エチル－ｓ－トリアジン、２－フェニル－４，５－ジヒドロキシメチルイミダゾール、２－フェニル－４－メチル－５－ヒドロキシメチルイミダゾール、２，３－ジヒドロ－１Ｈ－ピロロ［１，２－ａ］ベンズイミダゾール等を挙げることができ、２，４－ジアミノ－６－〔２’－メチルイミダゾリル－（１’）］エチル－ｓ－トリアジン、２，４－ジアミノ－６－［２’－ウンデシルイミダゾリル－（１）－エチル－ｓ－トリアジン、２，４－ジアミノ－６－［２’－エチル－４’－メチルイミダゾリル－（１’）］－エチル－ｓ－トリアジン等が、硬化速度、作業性、耐湿性の観点から好ましい。
As the imidazole-based curing agent, a microencapsulated imidazole compound curing agent and an amine adduct type curing agent are preferable from the viewpoint of storage stability, and are microencapsulated dispersed in a liquid epoxy resin such as liquid bisphenol A type. Imidazole compound curing agents are more preferred from the viewpoints of workability, curing speed, and storage stability. Examples of imidazole curing agents include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2,4- Diamino-6- [2′-methylimidazolyl- (1 ′)] ethyl-s-triazine, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2, And 3-dihydro-1H-pyrrolo [1,2-a] benzimidazole, and the like. 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)] ethyl-s-triazine, 2 , 4-Diamino-6- [2'-undecylimidazolyl- (1) -ethyl-s-triazine, 2, - diamino-6- [2'-ethyl-4'-methylimidazolyl- - (1 ')] - ethyl -s- triazine, and curing rate, workability, preferable from the viewpoint of moisture resistance.
（Ｂ）成分の市販品としては、明和化成製フェノール硬化剤（品名：ＭＥＨ８０００、ＭＥＨ８００５）、三菱化学製酸無水物（グレード：ＹＨ３０６、ＹＨ３０７）、日立化成工業製３ ｏｒ ４－メチル－ヘキサヒドロ無水フタル酸（品名：ＨＮ－５５００）、日本化薬製アミン硬化剤（品名：カヤハードＡ－Ａ）、日本ファインケム製アジピン酸ジヒドラジド（品名：ＡＤＨ）、旭化成イーマテリアルズ製マイクロカプセル化イミダゾール化合物硬化剤（品名：ＨＸ３７２２、ＨＸ３７４２、ＨＸ３９３２ＨＰ）、味の素ファインテクノ製アミンアダクト型硬化剤（品名：ＰＮ－４０Ｊ）等が挙げられるが、（Ｂ）成分は、これら品名に限定されるものではない。ここで、液状樹脂組成物の成分を配合した後、メッシュサイズ１μｍのフィルタを用いて配合物をろ過する場合には、（Ｂ）成分の粒径が１μｍ未満のものを用いると好ましい。（Ｂ）成分は、単独でも２種以上を併用してもよい。
Commercially available products of component (B) include Meiwa Kasei phenol curing agents (product names: MEH8000, MEH8005), Mitsubishi Chemical acid anhydrides (grade: YH306, YH307), Hitachi Chemical 3 or 4-methyl-hexahydro anhydride. Phthalic acid (Product name: HN-5500), Nippon Kayaku amine curing agent (Product name: Kayahard AA), Nippon Finechem adipic acid dihydrazide (Product name: ADH), Asahi Kasei E-materials microencapsulated imidazole compound curing agent (Product names: HX3722, HX3742, HX3932HP), Ajinomoto Fine Techno's amine adduct type curing agent (product name: PN-40J), and the like, but the component (B) is not limited to these product names. Here, after blending the components of the liquid resin composition, when the blend is filtered using a filter having a mesh size of 1 μm, it is preferable to use a component (B) having a particle size of less than 1 μm. (B) A component may be individual or may use 2 or more types together.
（Ｃ）成分は、液状樹脂組成物の濡れ性を良好にし、かつ液状樹脂組成物のブリードを抑制する。（Ｃ）成分は、化学式（１）：
Component (C) improves the wettability of the liquid resin composition and suppresses bleeding of the liquid resin composition. Component (C) is represented by chemical formula (1):
で表されるジメチルアミノプロピルアクリルアミドと、化学式（２）：
And dimethylaminopropylacrylamide represented by the chemical formula (2):
で表されるアクリル酸ブチルの共重合体であり、ジメチルアミノプロピルアクリルアミドの質量が、ジメチルアミノプロピルアクリルアミドとアクリル酸ブチルの合計１００質量部に対して、１～３０質量部であると好ましい。ここで、ジメチルアミノプロピルアクリルアミドとアクリル酸ブチルの定量分析は、ＧＰＣとＮＭＲで行う。
It is preferable that the mass of dimethylaminopropylacrylamide is 1 to 30 parts by mass with respect to 100 parts by mass in total of dimethylaminopropylacrylamide and butyl acrylate. Here, quantitative analysis of dimethylaminopropylacrylamide and butyl acrylate is performed by GPC and NMR.
また、（Ｃ）成分は、重量平均分子量が１０，０００～３０，０００のものが、より好ましい。ここで、重量平均分子量は、ゲルパーミエーションクロマトグラフィー法（ＧＰＣ）により、標準ポリスチレンによる検量線を用いた値とする。（Ｃ）成分が液状樹脂組成物のブリード抑制に与える機構は、明確ではないが、半導体チップ面の撮像面との親和性が低下するためである、と推測される。（Ｃ）成分の市販品としては、ビックケミー製（品名：ＤＩＳＰＥＲＢＹＫ１１２、ＤＩＳＰＥＲＢＹＫ１１６）等が挙げられるが、（Ｃ）成分は、これら品名に限定されるものではない。
The component (C) preferably has a weight average molecular weight of 10,000 to 30,000. Here, the weight average molecular weight is a value obtained by gel permeation chromatography (GPC) using a standard polystyrene calibration curve. The mechanism that the component (C) gives to the bleed suppression of the liquid resin composition is not clear, but is presumed to be because the affinity of the semiconductor chip surface with the imaging surface is reduced. (C) As a commercial item of a component, the product made by BYK Chemie (Product name: DISPERBYK112, DISPERBYK116) etc. are mentioned, However, (C) component is not limited to these product names.
封止樹脂組成物は、封止樹脂組成物１００質量部に対して、（Ａ）成分を１０～６０質量部含有すると好ましく、１５～５５質量部含有すると、より好ましい。
The encapsulating resin composition preferably contains 10 to 60 parts by mass of component (A) and more preferably 15 to 55 parts by mass with respect to 100 parts by mass of the encapsulating resin composition.
封止樹脂組成物は、封止樹脂組成物１００質量部に対して、（Ｂ）成分を１０～６０質量部含有すると好ましく、１０～５５質量部含有すると、より好ましい。１０質量部未満になると、反応性が低下することにより硬化性が悪くなり易くなり、硬化後の液状樹脂組成物の耐湿信頼性、耐マイグレーション性が劣化し易く、６０質量部を超えると、増粘倍率が高くなり過ぎ易い、ボイドが発生し易い、またはイオン性不純物が増加し、信頼性が悪くなり易くなってしまう。ここで、フェノール系硬化剤を、液状樹脂組成物の硬化速度を遅延する目的で使用する場合には、フェノール系硬化剤以外の（Ｂ）成分を、封止樹脂組成物１００質量部に対して、５～１５質量部含有させ、かつフェノール系硬化剤を、封止樹脂組成物１００質量部に対して、１～５質量部含有させると好ましい。
The encapsulating resin composition preferably contains 10 to 60 parts by mass of component (B) with respect to 100 parts by mass of the encapsulating resin composition, and more preferably 10 to 55 parts by mass. When the amount is less than 10 parts by mass, the curability tends to be deteriorated due to a decrease in reactivity, and the moisture resistance reliability and migration resistance of the liquid resin composition after curing are easily deteriorated. Viscosity tends to be too high, voids are likely to occur, or ionic impurities increase, resulting in poor reliability. Here, when using a phenol type hardening | curing agent in order to delay the hardening rate of a liquid resin composition, (B) components other than a phenol type hardening | curing agent are used with respect to 100 mass parts of sealing resin compositions. It is preferable to contain 5 to 15 parts by mass and to add 1 to 5 parts by mass of the phenolic curing agent with respect to 100 parts by mass of the sealing resin composition.
（Ｃ）成分は、液状樹脂組成物１００質量部に対して、液状樹脂組成物のブリード抑制の観点から、０．００１～５．０質量部であると好ましく、０．０２～２．５質量部であるとより好ましく、０．０３～２．１質量部であると、さらに好ましい。０．０２質量部であると、液状樹脂組成物のブリード抑制が良好であり、２．５質量部以下であると、液状樹脂組成物のポットライフが著しく良好である。
The component (C) is preferably 0.001 to 5.0 parts by mass, and 0.02 to 2.5 parts by mass with respect to 100 parts by mass of the liquid resin composition, from the viewpoint of suppressing bleeding of the liquid resin composition. Parts, more preferably 0.03 to 2.1 parts by mass. If it is 0.02 parts by mass, the bleed suppression of the liquid resin composition is good, and if it is 2.5 parts by mass or less, the pot life of the liquid resin composition is remarkably good.
液状樹脂組成物は、さらに、（Ｄ）フィラーを含有すると、ヒートサイクル時等の応力緩和、密着性の観点から、好ましい。（Ｄ）成分としては、コロイダルシリカ、疎水性シリカ、球状シリカ等のシリカ、タルク等が挙げられ、球状シリカが、塗布時の流動性の観点から、より好ましい。（Ｄ）成分は、平均粒径：０．０１～２０μｍのシリカが、より好ましく、平均粒径：０．０２～１０μｍのシリカがさらに好ましい。市販品としては、アドマテックス製球状シリカ（品名：ＳＯ－Ｅ２）、アドマテックス製球状シリカ（品名：ＳＥ２３００）、電気化学工業製シリカフィラー（品名：ＦＢ５ＳＤＸ）、宇部マテリアルズ製炭酸カルシウムフィラー（品名：ＣＳ ４ＮＡ）が挙げられるが、（Ｄ）成分は、これら品名に限定されるものではない。ここで、（Ｄ）成分の平均粒径は、動的光散乱式ナノトラック粒度分析計により測定する。（Ｄ）成分は、単独でも２種以上を併用してもよい。
When the liquid resin composition further contains (D) filler, it is preferable from the viewpoint of stress relaxation during heat cycle and adhesion. Examples of the component (D) include colloidal silica, hydrophobic silica, silica such as spherical silica, talc and the like, and spherical silica is more preferable from the viewpoint of fluidity at the time of coating. The component (D) is more preferably silica having an average particle size of 0.01 to 20 μm, and more preferably silica having an average particle size of 0.02 to 10 μm. Commercially available products include Admatex spherical silica (Product name: SO-E2), Admatex spherical silica (Product name: SE2300), Electrochemical industry silica filler (Product name: FB5SDX), Ube Materials calcium carbonate filler (Product name) : CS 4NA), but the component (D) is not limited to these product names. Here, the average particle diameter of the component (D) is measured by a dynamic light scattering nanotrack particle size analyzer. (D) A component may be individual or may use 2 or more types together.
液状樹脂組成物は、さらに、（Ｅ）成分であるゴム添加物を含有すると、樹脂組成物の応力緩和の観点から好ましく、（Ｅ）成分としては、アクリルゴム、ウレタンゴム、シリコーンゴム、ブタジエンゴム等が挙げられる。（Ｅ）成分は、固体のものを使用することができる。形態は特に限定されず、例えば粒子状、粉末状、ペレット状のものを使用することができ、粒子状の場合は、例えば、平均粒径が、０．０１～２０μｍ、好ましくは０．０２～１０μｍ、より好ましくは、０．０３～５μｍである。（Ｅ）成分は、常温で液状のものも使用することもでき、例えば、平均分子量が比較的低いポリブタジエン、ブタジエン・アクリロニトリルコポリマー、ポリイソプレン、ポリプロピレンオキシド、ポリジオルガノシロキサンが挙げられる。また、（Ｅ）成分は、末端にエポキシ基と反応する基を有するものを使用することができ、これらは固体、液状いずれの形態であってもよい。市販品としては、宇部興産製ＣＴＢＮ１３００、ＡＴＢＮ１３００－１６、ＣＴＢＮ１００８－ＳＰ、東レ・ダウコーニング製シリコーンゴムパウダー（品名：ＡＹ）、ＪＳＲ製ゴムパウダー（品名：ＸＥＲ８１）等が挙げられるが、（Ｅ）成分は、これら品名に限定されるものではない。また、（Ｅ）成分は、これら品名に限定されるものではない。（Ｅ）成分は、単独でも２種以上を併用してもよい。
When the liquid resin composition further contains a rubber additive as the component (E), it is preferable from the viewpoint of stress relaxation of the resin composition, and the component (E) includes acrylic rubber, urethane rubber, silicone rubber, butadiene rubber. Etc. (E) A solid thing can be used for a component. The form is not particularly limited, and for example, particles, powders, and pellets can be used. In the case of particles, for example, the average particle diameter is 0.01 to 20 μm, preferably 0.02 to The thickness is 10 μm, more preferably 0.03 to 5 μm. The component (E) can also be used at room temperature, and examples thereof include polybutadiene, butadiene / acrylonitrile copolymer, polyisoprene, polypropylene oxide, and polydiorganosiloxane having a relatively low average molecular weight. Moreover, what has a group which reacts with an epoxy group at the terminal can be used for (E) component, These may be a solid or liquid form. Examples of commercially available products include CTBN1300, ATBN1300-16, CTBN1008-SP manufactured by Ube Industries, silicone rubber powder (product name: AY) manufactured by Toray Dow Corning, rubber powder manufactured by JSR (product name: XER81), etc. (E) Ingredients are not limited to these product names. Moreover, (E) component is not limited to these product names. (E) A component may be individual or may use 2 or more types together.
液状樹脂組成物は、さらに、（Ｆ）成分であるカップリング剤を含有すると、液状樹脂組成物の密着性の観点から好ましく、（Ｆ）成分としては、３－グリシドキシプロピルトリメトキシシラン、３－アミノプロピルトリメトキシシラン、ビニルトリメトキシシラン、ｐ－スチリルトリメトキシシラン、３－メタクリロキシプロピルメチルトリメトキシシラン、３－アクリロキシプロピルトリメトキシシラン、３－ウレイドプロピルトリエトキシシラン、３－メルカプトプロピルトリメトキシシラン、ビス（トリエトキシシリルプロピル）テトラスルフィド、３－イソシアネートプロピルトリエトキシシラン等が挙げられ、３－グリシドキシプロピルトリメトキシシラン、３－アミノプロピルトリメトキシシランが、液状樹脂組成物密着性の観点から好ましい。市販品としては、信越化学工業製ＫＢＭ４０３、ＫＢＥ９０３、ＫＢＥ９１０３等が挙げられるが、（Ｆ）成分は、これら品名に限定されるものではない。（Ｆ）成分は、単独でも２種以上を併用してもよい。
When the liquid resin composition further contains a coupling agent as the component (F), it is preferable from the viewpoint of the adhesiveness of the liquid resin composition. As the component (F), 3-glycidoxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, vinyltrimethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-mercapto Propyltrimethoxysilane, bis (triethoxysilylpropyl) tetrasulfide, 3-isocyanatopropyltriethoxysilane and the like, and 3-glycidoxypropyltrimethoxysilane and 3-aminopropyltrimethoxysilane are liquid resin compositions. Adhesion From the viewpoint. Examples of commercially available products include KBM403, KBE903, and KBE9103 manufactured by Shin-Etsu Chemical Co., Ltd., but the component (F) is not limited to these product names. (F) A component may be individual or may use 2 or more types together.
（Ｄ）成分は、液状樹脂組成物：１００質量部に対して、好ましくは０．１～９０質量部、より好ましくは０．５～５０質量部含有される。０．１～９０質量部であると、線膨張係数の上昇を抑制しながら注入性の悪化を避けることができる。
The component (D) is preferably contained in an amount of 0.1 to 90 parts by mass, more preferably 0.5 to 50 parts by mass with respect to 100 parts by mass of the liquid resin composition. When the amount is from 0.1 to 90 parts by mass, deterioration of the injection property can be avoided while suppressing an increase in the linear expansion coefficient.
（Ｅ）成分は、液状樹脂組成物：１００質量部に対して、好ましくは０．１～３０質量部、より好ましくは０．５～２５質量部、さらに好ましくは１～２０質量部含有される。（Ｅ）成分が０．１質量部以上であると、樹脂組成物の応力を緩和し、３０質量部以下であると耐湿信頼性が低下しない。
Component (E) is preferably contained in an amount of 0.1 to 30 parts by mass, more preferably 0.5 to 25 parts by mass, and further preferably 1 to 20 parts by mass with respect to 100 parts by mass of the liquid resin composition. . When the component (E) is 0.1 part by mass or more, the stress of the resin composition is relieved, and when it is 30 parts by mass or less, the moisture resistance reliability is not lowered.
（Ｆ）成分は、液状樹脂組成物：１００質量部に対して、好ましくは０．０５～１５質量部、より好ましくは０．１～１０質量部含有される。０．０５質量部以上であると、密着性が向上し、硬化後の液状樹脂組成物の耐湿信頼性がより良好になり、１５質量部以下であると、液状樹脂組成物の発泡が抑制される。
The component (F) is preferably contained in an amount of 0.05 to 15 parts by mass, more preferably 0.1 to 10 parts by mass with respect to 100 parts by mass of the liquid resin composition. Adhesion improves when it is 0.05 parts by mass or more, and moisture resistance reliability of the liquid resin composition after curing becomes better, and foaming of the liquid resin composition is suppressed when it is 15 parts by mass or less. The
液状樹脂組成物には、本発明の目的を損なわない範囲で、更に必要に応じ、作業性向上のための揺変剤、カーボンブラックなどの顔料、イオントラップ剤、染料、消泡剤、破泡剤、酸化防止剤、その他の添加剤等、更に反応性希釈剤、有機溶剤等を配合することができる。特に、カーボンブラックは、硬化後の封止用液状樹脂組成物が光を遮断し、半導体チップの誤動作を防ぐために、添加されることが好ましい。ただし、本発明においては、液状樹脂組成物のブリードを抑制する観点から、低沸点の有機溶媒は含まないことが好ましい。
In the liquid resin composition, as long as the purpose of the present invention is not impaired, a thixotropic agent for improving workability, a pigment such as carbon black, an ion trapping agent, a dye, an antifoaming agent, a foam breakage, if necessary. An additive, an antioxidant, other additives, a reactive diluent, an organic solvent, and the like can be further blended. In particular, carbon black is preferably added so that the cured liquid resin composition after curing blocks light and prevents malfunction of the semiconductor chip. However, in the present invention, from the viewpoint of suppressing bleeding of the liquid resin composition, it is preferable not to include an organic solvent having a low boiling point.
本発明の液状樹脂組成物は、例えば、（Ａ）成分～（Ｃ）成分およびその他の添加剤等を同時にまたは別々に、必要により加熱処理を加えながら、撹拌、溶融、混合、分散させることにより得ることができる。特に、成分（Ｂ）が固形の場合には、そのまま配合すると樹脂粘度が上昇し、作業性が著しく悪くなるため、予め加熱により液状化して、成分（Ａ）と混合することが好ましい。これらの混合、撹拌、分散等の装置としては、特に限定されるものではないが、撹拌、加熱装置を備えたライカイ機、３本ロールミル、ボールミル、プラネタリーミキサー、ビーズミル等を使用することができる。また、これら装置を適宜組み合わせて使用してもよい。
The liquid resin composition of the present invention can be prepared by, for example, stirring, melting, mixing, and dispersing components (A) to (C) and other additives simultaneously or separately, with heat treatment as necessary. Obtainable. In particular, when the component (B) is a solid, the resin viscosity increases and the workability is remarkably deteriorated if it is blended as it is. Therefore, it is preferable to liquefy by heating in advance and mix with the component (A). The mixing, stirring, dispersing and the like devices are not particularly limited, and a raikai machine equipped with a stirring and heating device, a three-roll mill, a ball mill, a planetary mixer, a bead mill and the like can be used. . Moreover, you may use combining these apparatuses suitably.
本発明の液状樹脂組成物は、温度：２５℃での粘度が１～１００Ｐａ・ｓであると、好ましい。ここで、粘度は、Ｂｒｏｏｋｆｉｅｌｄ社製粘度計（型番：ＤＶ－１）で測定する。
The liquid resin composition of the present invention preferably has a viscosity of 1 to 100 Pa · s at a temperature of 25 ° C. Here, the viscosity is measured with a viscometer manufactured by Brookfield (model number: DV-1).
本発明の液状樹脂組成物の硬化は、８０～１６５℃で、１～１５０分間行うことが好ましい。
The liquid resin composition of the present invention is preferably cured at 80 to 165 ° C. for 1 to 150 minutes.
本発明の液状樹脂組成物は、半導体用封止材として使用すると好ましく、画像素子半導体用封止材を用いると、より好ましい。
The liquid resin composition of the present invention is preferably used as a semiconductor sealing material, and more preferably an image element semiconductor sealing material.
図１に、イメージセンサーモジュールの断面の模式図の一例を示す。イメージセンサーモジュール１は、レンズ８を通過した光（図１では、破線の矢印で示す）を、マイクロレンズ４で集光してフォトダイオード３で検出する。図３に、本発明の液状樹脂組成物の使用例を説明するための模式図を示す。イメージセンサーモジュールで使用される基板２２と半導体チップ２３に形成されたパッド２３１を接合した後、ディスペンサー３０を用いて、半導体用封止材２１を、基板２２と半導体チップ２３間に充填する。半導体用封止材２１を充填した後、加熱硬化させることにより、基板２２と半導体チップ２３間を封止することができる。
FIG. 1 shows an example of a schematic diagram of a cross section of an image sensor module. The image sensor module 1 collects the light that has passed through the lens 8 (indicated by a broken arrow in FIG. 1) by the microlens 4 and detects it by the photodiode 3. In FIG. 3, the schematic diagram for demonstrating the usage example of the liquid resin composition of this invention is shown. After bonding the substrate 22 used in the image sensor module and the pad 231 formed on the semiconductor chip 23, the semiconductor sealing material 21 is filled between the substrate 22 and the semiconductor chip 23 using the dispenser 30. After the semiconductor sealing material 21 is filled, the space between the substrate 22 and the semiconductor chip 23 can be sealed by heating and curing.
ここで、基板には、エポキシ樹脂、ガラス－エポキシ樹脂、ポリイミド樹脂等が挙げられるが、これらに限定されない。パッド（バンプ）には、錫、鉛、銅、ビスマス、銀、亜鉛、インジウム等からなるハンダ合金等を使用することができ、環境問題から、鉛フリーハンダ合金が好ましいが、これらに限定されない。
Here, examples of the substrate include, but are not limited to, epoxy resin, glass-epoxy resin, polyimide resin, and the like. For the pad (bump), a solder alloy made of tin, lead, copper, bismuth, silver, zinc, indium, or the like can be used, and a lead-free solder alloy is preferable from an environmental problem, but is not limited thereto.
このように、本発明の液状樹脂組成物は、ブリードが抑制されたフリップチップ実装体を容易に製造することができる。
Thus, the liquid resin composition of the present invention can easily produce a flip chip mounting body in which bleeding is suppressed.
本発明について、実施例により説明するが、本発明はこれらに限定されるものではない。なお、以下の実施例において、部、％はことわりのない限り、重量部、重量％を示す。
The present invention will be described with reference to examples, but the present invention is not limited thereto. In the following examples, parts and% represent parts by weight and% by weight unless otherwise specified.
〔実施例１～１２、比較例１～６〕
表１、２に示す配合で、液状樹脂組成物を調整した。 [Examples 1 to 12, Comparative Examples 1 to 6]
Liquid resin compositions were prepared with the formulations shown in Tables 1 and 2.
表１、２に示す配合で、液状樹脂組成物を調整した。 [Examples 1 to 12, Comparative Examples 1 to 6]
Liquid resin compositions were prepared with the formulations shown in Tables 1 and 2.
〔ブリード長さの測定〕
鏡面研磨したＳｉ基板に、Ｏ２プラズマ処理（４００Ｗ、５分間）を行い、その後、デシケーター中で２～２４時間放置した。このＯ２プラズマ処理を行ったＳｉ基板上に、シリンジに充填された液状樹脂組成物を、２３Ｇのニードルにて０．２５ｍｇ吐出してポッティングし、１２０℃で３０分間硬化させた。硬化後、光学顕学顕微鏡を用いて、ブリードの長さを測定した。結果を表１、２に示す。 [Bleed length measurement]
The mirror-polished Si substrate was subjected to O 2 plasma treatment (400 W, 5 minutes) and then left in a desiccator for 2 to 24 hours. On the Si substrate subjected to the O 2 plasma treatment, 0.25 mg of the liquid resin composition filled in the syringe was discharged with a 23G needle, potted, and cured at 120 ° C. for 30 minutes. After curing, the length of the bleed was measured using an optical microscope. The results are shown in Tables 1 and 2.
鏡面研磨したＳｉ基板に、Ｏ２プラズマ処理（４００Ｗ、５分間）を行い、その後、デシケーター中で２～２４時間放置した。このＯ２プラズマ処理を行ったＳｉ基板上に、シリンジに充填された液状樹脂組成物を、２３Ｇのニードルにて０．２５ｍｇ吐出してポッティングし、１２０℃で３０分間硬化させた。硬化後、光学顕学顕微鏡を用いて、ブリードの長さを測定した。結果を表１、２に示す。 [Bleed length measurement]
The mirror-polished Si substrate was subjected to O 2 plasma treatment (400 W, 5 minutes) and then left in a desiccator for 2 to 24 hours. On the Si substrate subjected to the O 2 plasma treatment, 0.25 mg of the liquid resin composition filled in the syringe was discharged with a 23G needle, potted, and cured at 120 ° C. for 30 minutes. After curing, the length of the bleed was measured using an optical microscope. The results are shown in Tables 1 and 2.
〔ポットライフの測定〕
実施例１～１２、比較例１、５、６で得られた５ｇの封止用液状樹脂組成物の初期粘度を、Ｂｒｏｏｋｆｉｅｌｄ社製粘度計（型番：ＤＶ－１）を用い、２５℃で測定した。室温で２４時間保持後の５ｇの封止用液状樹脂組成物の２５℃での粘度変化を同じ粘度計で測定した。（２４時間保持後の粘度）／（初期粘度）が２倍未満を○、２～５倍を△、５倍を超えたときを×とした。結果を表１、２に示す。 [Measurement of pot life]
The initial viscosity of 5 g of the liquid resin composition for sealing obtained in Examples 1 to 12 and Comparative Examples 1, 5, and 6 was measured at 25 ° C. using a Brookfield viscometer (model number: DV-1). did. The viscosity change at 25 ° C. of 5 g of the liquid resin composition for sealing after being kept at room temperature for 24 hours was measured with the same viscometer. When (viscosity after holding for 24 hours) / (initial viscosity) is less than 2 times, ◯, 2 to 5 times is Δ, and when it exceeds 5 times, ×. The results are shown in Tables 1 and 2.
実施例１～１２、比較例１、５、６で得られた５ｇの封止用液状樹脂組成物の初期粘度を、Ｂｒｏｏｋｆｉｅｌｄ社製粘度計（型番：ＤＶ－１）を用い、２５℃で測定した。室温で２４時間保持後の５ｇの封止用液状樹脂組成物の２５℃での粘度変化を同じ粘度計で測定した。（２４時間保持後の粘度）／（初期粘度）が２倍未満を○、２～５倍を△、５倍を超えたときを×とした。結果を表１、２に示す。 [Measurement of pot life]
The initial viscosity of 5 g of the liquid resin composition for sealing obtained in Examples 1 to 12 and Comparative Examples 1, 5, and 6 was measured at 25 ° C. using a Brookfield viscometer (model number: DV-1). did. The viscosity change at 25 ° C. of 5 g of the liquid resin composition for sealing after being kept at room temperature for 24 hours was measured with the same viscometer. When (viscosity after holding for 24 hours) / (initial viscosity) is less than 2 times, ◯, 2 to 5 times is Δ, and when it exceeds 5 times, ×. The results are shown in Tables 1 and 2.
表１、２からわかるように、実施例１～１２は、ブリード長さが１０μｍ以下であり、特に、（Ｂ）成分としてフェノール系硬化剤を用いた実施例１～６、８～１２は、ブリード長さが０～５μｍとさらに良好であることがわかった。また、実施例１～１２で、２４時間以内での粘度上昇が５倍以下とポットライフが良好であり、（Ｃ）成分が０．０２～２．５質量部の範囲内である実施例２～１２では、２４時間以内での粘度上昇が２倍以下と、著しくポットライフが良好であった。これに対して、（Ｃ）成分を含有していない比較例１～６は、ブリード長さが３０～５０μｍと長かった。
As can be seen from Tables 1 and 2, Examples 1 to 12 have a bleed length of 10 μm or less. In particular, Examples 1 to 6 and 8 to 12 using a phenolic curing agent as the component (B) The bleed length was found to be even better at 0-5 μm. In Examples 1 to 12, the viscosity increase within 24 hours is 5 times or less, the pot life is good, and the component (C) is in the range of 0.02 to 2.5 parts by mass. In ~ 12, the pot life was remarkably good, with the viscosity increase within 24 hours being twice or less. In contrast, Comparative Examples 1 to 6 containing no component (C) had a long bleed length of 30 to 50 μm.
本発明の液状樹脂組成物は、ブリードを抑制し、かつポットライフが長いので、半導体素子用の封止材として、特に、フリップチップ実装体、中でも画像素子に使用されるフリップチップ実装体の封止材に非常に適している。
Since the liquid resin composition of the present invention suppresses bleed and has a long pot life, it is used as a sealing material for semiconductor elements, particularly for flip chip mounting bodies, especially for sealing flip chip mounting bodies used for image elements. Very suitable for fastening materials.
１ イメージセンサーモジュール
２、１２、２２ 基板
３、１３、２３ 半導体チップ
３１、１３１、２３１ パッド
４、１４、２４ マイクロレンズ
５ ホルダー
６ ホルダー接着剤
７ ＩＲフィルター
８ レンズ
９ レンズバレル
１０、１１、２１ 半導体用封止剤
１１１ ブリード
２０、３０ ディスペンサー
DESCRIPTION OFSYMBOLS 1 Image sensor module 2, 12, 22 Substrate 3, 13, 23 Semiconductor chip 31, 131, 231 Pad 4, 14, 24 Micro lens 5 Holder 6 Holder adhesive 7 IR filter 8 Lens 9 Lens barrel 10, 11, 21 Semiconductor Sealant 111 Bleed 20, 30 Dispenser
２、１２、２２ 基板
３、１３、２３ 半導体チップ
３１、１３１、２３１ パッド
４、１４、２４ マイクロレンズ
５ ホルダー
６ ホルダー接着剤
７ ＩＲフィルター
８ レンズ
９ レンズバレル
１０、１１、２１ 半導体用封止剤
１１１ ブリード
２０、３０ ディスペンサー
DESCRIPTION OF
Claims (8)
- （Ａ）エポキシ樹脂、（Ｂ）硬化剤、および（Ｃ）ジメチルアミノプロピルアクリルアミドとアクリル酸ブチルの共重合体を含むことを特徴とする、液状樹脂組成物。 A liquid resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) a copolymer of dimethylaminopropylacrylamide and butyl acrylate.
- （Ｂ）成分が、フェノール系硬化剤、アミン系硬化剤、酸無水物系硬化剤およびイミダゾール系硬化剤からなる群より選択される少なくとも１種である、請求項１記載の液状樹脂組成物。 The liquid resin composition according to claim 1, wherein the component (B) is at least one selected from the group consisting of a phenolic curing agent, an amine curing agent, an acid anhydride curing agent, and an imidazole curing agent.
- （Ｃ）成分が、液状樹脂組成物１００質量部に対して、０．０２～２．５質量部である、請求項１記載の液状樹脂組成物。 The liquid resin composition according to claim 1, wherein the component (C) is 0.02 to 2.5 parts by mass with respect to 100 parts by mass of the liquid resin composition.
- （Ｂ）成分がフェノール系硬化剤を含有し、含有されるフェノール系硬化剤が、液状樹脂組成物１００質量部に対して、１～５０質量部である、請求項２記載の液状樹脂組成物。 The liquid resin composition according to claim 2, wherein the component (B) contains a phenolic curing agent, and the phenolic curing agent contained is 1 to 50 parts by mass with respect to 100 parts by mass of the liquid resin composition. .
- 請求項１記載の液状樹脂組成物を含む、半導体用封止材。 A semiconductor encapsulant comprising the liquid resin composition according to claim 1.
- 請求項５記載の半導体用封止材を用いる、画像素子用封止材。 An image element sealing material using the semiconductor sealing material according to claim 5.
- 請求項１記載の液状樹脂組成物の硬化物を有する、フリップチップ実装体。 A flip chip mounting body having a cured product of the liquid resin composition according to claim 1.
- 請求項５記載の半導体用封止材を用いて封止する、フリップチップ実装体の製造方法。 A method for manufacturing a flip chip mounting body, which is sealed using the semiconductor sealing material according to claim 5.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-026998 | 2013-02-14 | ||
| JP2013026998A JP6071612B2 (en) | 2013-02-14 | 2013-02-14 | Liquid resin composition, flip chip mounting body and method for producing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2014125912A1 true WO2014125912A1 (en) | 2014-08-21 |
Family
ID=51353922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2014/051702 WO2014125912A1 (en) | 2013-02-14 | 2014-01-27 | Liquid resin composition, flip chip assembly, and method for producing said assembly |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6071612B2 (en) |
| TW (1) | TWI612096B (en) |
| WO (1) | WO2014125912A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7413804B2 (en) * | 2020-02-03 | 2024-01-16 | 三菱ケミカル株式会社 | Adhesive composition, adhesive, adhesive sheet, and laminate |
| TW202330702A (en) | 2021-11-19 | 2023-08-01 | 日商納美仕有限公司 | Curable resin composition |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11255867A (en) * | 1998-03-13 | 1999-09-21 | Nippon Kayaku Co Ltd | Epoxy resin, epoxy resin composition and cured product thereof |
| JPH11335649A (en) * | 1998-05-27 | 1999-12-07 | Nitto Denko Corp | Thermosetting adhesive composition and its adhesive sheets |
| JP2006206731A (en) * | 2005-01-28 | 2006-08-10 | Nippon Soda Co Ltd | Epoxy resin composition |
| JP2008144070A (en) * | 2006-12-12 | 2008-06-26 | Shinto Paint Co Ltd | Cationic electrodeposition coating composition |
| JP2010016173A (en) * | 2008-07-03 | 2010-01-21 | Panasonic Corp | Solid-state image pickup element and method of manufacturing the same, and solid-state imaging device |
-
2013
- 2013-02-14 JP JP2013026998A patent/JP6071612B2/en active Active
-
2014
- 2014-01-27 WO PCT/JP2014/051702 patent/WO2014125912A1/en active Application Filing
- 2014-02-10 TW TW103104221A patent/TWI612096B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11255867A (en) * | 1998-03-13 | 1999-09-21 | Nippon Kayaku Co Ltd | Epoxy resin, epoxy resin composition and cured product thereof |
| JPH11335649A (en) * | 1998-05-27 | 1999-12-07 | Nitto Denko Corp | Thermosetting adhesive composition and its adhesive sheets |
| JP2006206731A (en) * | 2005-01-28 | 2006-08-10 | Nippon Soda Co Ltd | Epoxy resin composition |
| JP2008144070A (en) * | 2006-12-12 | 2008-06-26 | Shinto Paint Co Ltd | Cationic electrodeposition coating composition |
| JP2010016173A (en) * | 2008-07-03 | 2010-01-21 | Panasonic Corp | Solid-state image pickup element and method of manufacturing the same, and solid-state imaging device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6071612B2 (en) | 2017-02-01 |
| TWI612096B (en) | 2018-01-21 |
| TW201439190A (en) | 2014-10-16 |
| JP2014156519A (en) | 2014-08-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7231821B2 (en) | Sealing resin composition, electronic component device, and method for manufacturing electronic component device | |
| JP2011168650A (en) | Epoxy resin composition | |
| JP2007023191A (en) | One-pack type epoxy resin composition | |
| JP6013906B2 (en) | Liquid epoxy resin composition | |
| JP7167912B2 (en) | Liquid encapsulating resin composition, electronic component device, and method for manufacturing electronic component device | |
| JP4176619B2 (en) | Flip chip mounting side fill material and semiconductor device | |
| JP6071612B2 (en) | Liquid resin composition, flip chip mounting body and method for producing the same | |
| JP5593259B2 (en) | Liquid epoxy resin composition | |
| JP2016117869A (en) | Resin composition for semiconductor adhesion and semiconductor device | |
| JP2009177003A (en) | Adhesive agent composition, semiconductor device and production method | |
| JP6549555B2 (en) | Conductive adhesive and semiconductor device | |
| JP5886051B2 (en) | Resin composition | |
| JP5723557B2 (en) | Epoxy resin composition | |
| JP5723665B2 (en) | Pre-feed type liquid semiconductor encapsulating resin composition | |
| JP2005350618A (en) | Liquefied epoxy resin composition and semiconductor device | |
| JP2013253183A (en) | Prior supply type liquid semiconductor-encapsulating resin composition | |
| JP5788765B2 (en) | Resin composition | |
| WO2016059980A1 (en) | Liquid epoxy resin composition | |
| JP6405209B2 (en) | Liquid encapsulant for copper bump and resin composition used therefor | |
| JP2013118276A (en) | Semiconductor device | |
| JP2013253195A (en) | Epoxy resin composition | |
| JP4906152B1 (en) | Liquid resin composition | |
| JP6935803B2 (en) | Manufacturing method of sealing resin composition, cured product, electronic component device and electronic component device | |
| JP2004292763A (en) | One-component epoxy resin composition | |
| JP2023036779A (en) | Sealing resin composition, electronic component device and method for producing electronic component device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14751594 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 14751594 Country of ref document: EP Kind code of ref document: A1 |