JP2013253183A - Prior supply type liquid semiconductor-encapsulating resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a prior supply type encapsulating resin composition which is in a liquid state to achieve workability, easy handling and narrowing of a pitch, satisfactorily fills a space between a semiconductor chip and a substrate, is curable in a short time, and is capable of controlling a void between the semiconductor chip and the substrate.SOLUTION: A prior supply type liquid semiconductor-encapsulating resin composition contains: (A) at least one liquid epoxy resin selected from the group consisting of epoxy resins of liquid bisphenol A type, liquid bisphenol F type and liquid naphthalene type; (B) a curing agent; (C) a pre-gelling agent; and (D) a curing accelerator. The curing accelerator equivalent of the component (B) is 0.6-1.1 time of the epoxy equivalent of the component (A), and the component (C) is 6-11 pts mass based on 100 pts.mass of the total of the components (A), (B), (C) and (D).

Description

  The present invention relates to a pre-feed type liquid semiconductor encapsulating resin composition, and more particularly to a non-conductive underfill agent excellent in void reduction.

  In recent years, flip chip bonding has been used as a semiconductor chip mounting method that can cope with higher wiring density and higher frequency of electronic devices. Generally, in flip chip bonding, a gap between a semiconductor chip and a substrate is sealed with a material called underfill.

  Usually, in flip chip bonding, after bonding a semiconductor chip and a substrate by soldering or the like, a gap between the semiconductor chip and the substrate is filled with an underfill agent, which is a thermosetting semiconductor resin sealing composition (hereinafter, “ Called post-feed type). However, in recent years, first, after applying an underfill agent to a substrate and placing a semiconductor chip, curing the underfill agent and connecting the semiconductor chip and the substrate at the same time shortens the process and reduces the curing time. A pre-supplied flip chip bonding process that can be shortened and, as a result, can be manufactured at low cost and low energy has attracted attention. An encapsulant resin composition for this process (hereinafter referred to as “pre-supplied encapsulating resin composition”). ") Is growing. In the case of the post-feed type, in order to shorten the injection time when injecting the encapsulant resin composition, the temperature of the substrate or the like is usually raised to about 80 ° C., so that it does not cure at this injection temperature. Therefore, there is a trade-off between shortening the curing time of the semiconductor resin sealing composition.

  The pre-supplied encapsulating resin composition is liquid from the viewpoint of workability, ease of handling, and response to narrow pitch, that is, it has a low viscosity at room temperature, and is a short time (for example, within 5 seconds) Therefore, it is required to eliminate the void between the semiconductor chip and the substrate in a short time.

  For the purpose of low elasticity, toughness, etc., an epoxy resin, a predetermined phenoxy resin, an epoxy resin curing agent, and an epoxy resin composition liquid sealing material containing a phenoxy resin curing agent are disclosed (patents). Reference 1).

  However, it has been found that when the above epoxy resin composition is used in a pre-feed type process, there are the following problems. First, voids are generated between the semiconductor chip and the substrate. This may be due to the fact that the phenoxy resin is contained in a mass twice or more that of the epoxy resin, so that an organic solvent is required, and outgassing occurs due to the use of blocked isocyanate. Secondly, the curing rate is slow and productivity cannot be improved. Third, since the viscosity is high (see paragraph 0034), it is not possible to cope with narrow pitch.

JP-A-10-120761

  An object of the present invention is to solve the above problems. That is, the present invention is liquid for workability, ease of handling, and narrow pitch correspondence, has a good filling property between the semiconductor chip and the substrate, can be cured in a short time, and can be cured in a short time. An object of the present invention is to provide a pre-supplied encapsulant resin composition capable of suppressing voids between a chip and a substrate.

The present invention relates to a pre-feed type encapsulant resin composition that has solved the above problems by having the following configuration.
[1] (A) at least one liquid epoxy resin selected from the group consisting of a liquid bisphenol A type epoxy resin, a liquid bisphenol F type epoxy resin, and a liquid naphthalene type epoxy resin,
(B) a curing agent,
(C) contains a pregel agent, and (D) a curing accelerator,
The curing agent equivalent of the component (B) is 0.6 to 1.1 times the epoxy equivalent of the component (A), and the component (C) is the components (A), (B), and (C). And (D) component: 6 to 11 parts by mass with respect to 100 parts by mass, a pre-supplied liquid semiconductor encapsulating resin composition.
[2] The pre-feed type liquid semiconductor encapsulating resin composition according to [1], wherein the component (C) is a methyl methacrylate / butyl methacrylate copolymer.
[3] The pre-supplied liquid semiconductor encapsulating resin composition according to [1] or [2], further comprising (E) a filler.
[4] A semiconductor device having a flip-chip type semiconductor element encapsulated with the pre-supplied liquid semiconductor encapsulating resin composition according to any one of [1] to [3].

  According to the present invention [1], it is excellent in workability, handling ease, and narrow pitch reduction, can be cured in a short time, has a good filling property between a semiconductor chip and a substrate, and can be manufactured in a short time. -The pre-feed type liquid semiconductor sealing material resin composition which can suppress the void between board | substrates is obtained.

  According to the present invention [4], it is possible to provide a semiconductor device that can be manufactured at a low cost by a low-energy first-feed flip-chip bonding process.

The pre-supplied liquid semiconductor encapsulating resin composition (hereinafter referred to as encapsulating resin composition) of the present invention is a group consisting of (A) liquid bisphenol A type epoxy resin, liquid bisphenol F type epoxy resin and liquid naphthalene type epoxy resin. At least one liquid epoxy resin selected from
(B) a curing agent,
(C) contains a pregel agent, and (D) a curing accelerator,
The curing agent equivalent of the component (B) is 0.6 to 1.1 times the epoxy equivalent of the component (A), and the component (C) is the components (A), (B), and (C). And (D) component: 6 to 11 parts by mass with respect to 100 parts by mass.

  The component (A) is at least one liquid epoxy resin selected from the group consisting of liquid bisphenol A type epoxy resin, liquid bisphenol F type epoxy resin and liquid naphthalene type epoxy resin. Curability, heat resistance, and adhesiveness are imparted to the stopping resin composition, and durability is imparted to the cured sealing resin composition. In addition, when it is set as sealing resin composition, if a fluidity | liquidity can be maintained at room temperature, you may use together a liquid epoxy resin and a solid epoxy resin. The epoxy equivalent of the component (A) is preferably 80 to 250 g / eq from the viewpoint of adjusting the viscosity. Commercially available products include Nippon Steel Chemical's bisphenol A type epoxy resin (product names: YD-128, YD-825GS), Nippon Steel Chemical's bisphenol F type epoxy resin (product name: YDF870GS), DIC naphthalene type epoxy resin ( Product name: HP4032D) and the like.

  The component (B) only needs to have the curability of the component (A), and can be used in solid form as long as it can maintain fluidity at room temperature when used as a sealing resin composition. Examples of the component (B) include acid anhydrides, phenolic curing agents, carboxylic acid dihydrazide curing agents, and amine curing agents. From the viewpoint of the fluidity of the sealing resin composition and the connectivity between the semiconductor chip and the substrate, Acid anhydrides are preferred. Acid anhydrides include tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic acid anhydride, hydrogenated methylnadic acid anhydride, trialkyltetrahydrophthalic anhydride, Methylcyclohexene tetracarboxylic dianhydride, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic dianhydride, ethylene glycol bisanhydro trimellitate, glycerin bis (anhydro trimellitate) mono Substituted with acetate, dodecenyl succinic anhydride, aliphatic dibasic polyanhydride, chlorendic anhydride, methylbutenyl tetrahydrophthalic anhydride, alkylated tetrahydrophthalic anhydride, methyl hymic anhydride, alkenyl group Succinic anhydride was, glutaric anhydride and the like, methyl butenyl tetrahydrophthalic acid anhydride are preferred. Examples of the phenolic curing agent include phenol novolak and cresol novolak, and phenol novolak is preferable. Examples of the carboxylic acid dihydrazide curing agent include adipic acid dihydrazide, isophthalic acid dihydrazide, sebacic acid dihydrazide, dodecanoic acid dihydrazide, and adipic acid dihydrazide is preferable. Examples of amine-based curing agents include chain aliphatic amines, cycloaliphatic amines, aliphatic aromatic amines, aromatic amines, and the like, and aromatic amines are preferred. Commercially available products include acid anhydrides (grade: YH306, YH307) manufactured by Mitsubishi Chemical, 3 or 4-methyl-hexahydrophthalic anhydride (product name: HN-5500) manufactured by Hitachi Chemical, and adipic acid dihydrazide manufactured by Nippon Finechem (product name: ADH), Meiwa Kasei's phenolic curing agents (product names: MEH8000, MEH8005), Nippon Kayaku's amine curing agent (product name: Kayahard AA), and the like. (B) A component may be individual or may use 2 or more types together.

  (C) A component suppresses the void of a sealing resin composition. Further, it is preferable that the sealing resin composition is not left on the stage on which the semiconductor chip is mounted on the substrate for a long time and does not hinder the connection between the semiconductor chip and the substrate. In particular, it is more preferable that the sealing resin composition does not hinder the connection between the semiconductor chip and the substrate even after leaving the sealing resin composition at 60 ° C. or more for a long time. Here, the pregel agent is an organic substance that is solid at room temperature and has an action of increasing the viscosity of the sealing resin composition by swelling or dissolving in the epoxy resin matrix as the component (A) when heated. As component (C), methyl methacrylate / butyl methacrylate copolymer, methyl methacrylate / isobutyl methacrylate / butyl methacrylate copolymer, methyl methacrylate polymer, epoxy group-containing methyl methacrylate polymer, core-shell type Examples thereof include methyl methacrylate / butyl methacrylate copolymer, and methyl methacrylate / butyl methacrylate copolymer is preferable from the viewpoint of suppressing voids. Commercially available products include Gantsu Kasei methyl methacrylate / butyl methacrylate copolymer fine particles (product name: F303), Mitsubishi Rayon methyl methacrylate / isobutyl methacrylate / butyl methacrylate copolymer (product name: JF-001), Examples include methyl methacrylate polymer (product name: JF-003) manufactured by Mitsubishi Rayon. (C) A component may be individual or may use 2 or more types together.

  Storage stability and moderate curability are imparted by component (D). As component (D), a microencapsulated imidazole compound curing agent and an amine adduct type curing accelerator are used from the viewpoint of storage stability. Preferably, a microencapsulated imidazole compound curing agent dispersed in a liquid epoxy resin such as liquid bisphenol A type is more preferable from the viewpoint of workability, curing speed, and storage stability. Examples of imidazole curing agents include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2,4- Diamino-6- [2'-methylimidazolyl- (1 ')] ethyl-s-triazine, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2, 3-dihydro-1H-pyrrolo [1,2-a] benzimidazole can be mentioned, and 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)] ethyl-s-triazine, 2 , 4-Diamino-6- [2'-undecylimidazolyl- (1) -ethyl-s-triazine, 2, - diamino-6- [2'-ethyl-4'-methylimidazolyl- - (1 ')] - ethyl -s- triazine, and curing rate, workability, preferable from the viewpoint of moisture resistance. (D) Component commercial products include microencapsulated imidazole compound curing accelerators (product names: HX3722 and HX3932HP) manufactured by Asahi Kasei E-materials, amine adduct-type curing accelerators (product name: PN-40J) manufactured by Ajinomoto Fine Techno, and the like. Can be mentioned. Here, after compounding the components of the sealing resin composition, when the compound is filtered using a filter having a mesh size of 1 μm, it is preferable to use a component (D) having a particle size of less than 1 μm. (D) A component may be individual or may use 2 or more types together.

  The curing agent equivalent of the component (B) is 0.6 to 1.1 times the epoxy equivalent of the component (A), and if it is less than 0.6 times, the curing of the component (A) becomes insufficient or a void. Generation | occurrence | production and generation | occurrence | production of the delamination of the sealing resin composition after a reflow test will occur. On the other hand, even if the curing agent equivalent of the component (B) exceeds 1.1 times, void generation and delamination of the encapsulating resin composition after the reflow test occur. Here, the curing agent equivalent of the component (B) is, for example, an acid anhydride equivalent when the component (B) is an acid anhydride, a phenol equivalent when the component is a phenolic curing agent, and a hydrazide equivalent when the component is a carboxylic acid dihydrazide curing agent. is there.

  Component (C) is a total of (A) component, (B) component, (C) component, and (D) component: 6 to 11 parts by mass with respect to 100 parts by mass, and less than 6 parts by mass, If the void suppression effect is not sufficient and exceeds 11 parts by mass, poor connection between the semiconductor chip and the substrate occurs, and the void suppression effect is not sufficient.

  The encapsulating resin composition preferably contains 3 to 6 parts by mass of component (D) with respect to 100 parts by mass of component (A), component (B), component (C) and component (D). It is more preferable to contain 4 to 5 parts by mass. When the amount is less than 3 parts by mass, the bonding property is likely to deteriorate due to a decrease in reactivity, and when the amount exceeds 6 parts by mass, the ionic impurities increase and the reliability is likely to deteriorate.

  It is preferable that the sealing resin composition further contains (E) a filler from the viewpoint of adjusting the elastic modulus and thermal expansion coefficient of the cured sealing resin composition. Examples of the component (E) include silica such as colloidal silica, hydrophobic silica, fine silica, and nano silica, acrylic beads, glass beads, urethane beads, bentonite, acetylene black, and ketjen black. Moreover, the average particle diameter of the filler as the component (E) (or the average maximum diameter when not granular) is not particularly limited, but it is 0.05 to 50 μm, and the filler is contained in the semiconductor resin sealant. It is preferable for uniform dispersion, and is preferable for reasons such as excellent injectability when a semiconductor sealing agent is used as an underfill. If it is less than 0.05 μm, the viscosity of the semiconductor resin encapsulant increases, and the fluidity may deteriorate when used as an underfill. If it exceeds 50 μm, it may be difficult to make the filler uniformly exist in the gap between the semiconductor chip and the substrate in the semiconductor resin sealant. (E) As for the average particle diameter of the filler as a component, it is more preferable that it is 0.1-30 micrometers, and it is further more preferable that it is 0.1-5 micrometers. Commercially available products include Admatex silica (product name: SO-E2, average particle size: 0.5 μm), Nippon Aerosil hydrophobic fumed silica (product name: R805, average particle size: 20 nm), Fuso Chemical Industries (Product name: SP03B, average particle size: 300 nm) and the like. Here, the average particle diameter of the component (E) is measured by a dynamic light scattering nanotrack particle size analyzer. (E) A component may be individual or may use 2 or more types together.

  (E) From a viewpoint of a linear expansion coefficient, Preferably it is 0.1-90 mass parts with respect to 100 mass parts sealing resin composition: More preferably, 10-65 mass parts is contained. When the content is 1 to 30 parts by mass, the linear expansion coefficient can be lowered, and deterioration of the filling property between the semiconductor chip and the substrate can be avoided.

  In the encapsulating resin composition, a coupling agent such as a silane coupling agent for adjusting adhesion, if necessary, rheology for adjusting coating suitability and flow suitability, as long as the object of the present invention is not impaired. Adjusting agent; coloring agent for coloring; filler, improving dispersibility of coloring agent, dispersing agent for preventing settling, anti-settling agent; flux agent that can be used when solder connection is required; Defoaming agent for surface preparation; surface condition adjustment for sealing resin composition, surface adjustment agent for wettability adjustment; elastomers for elastic modulus and stress adjustment; liquid as composition for adjustment of viscosity, toughness, etc. A solid resin that can be used within a range that can be maintained can be contained.

  The encapsulating resin composition is obtained, for example, by stirring, melting, mixing, and dispersing the components (A) to (D) and other additives simultaneously or separately, with heat treatment as necessary. be able to. The mixing, stirring, dispersing and the like devices are not particularly limited, and a raikai machine equipped with a stirring and heating device, a three-roll mill, a ball mill, a planetary mixer, a bead mill and the like can be used. . Moreover, you may use combining these apparatuses suitably.

  The sealing resin composition preferably has a viscosity at 25 ° C. of 0.5 to 200 Pa · s from the viewpoint of applicability, and more preferably 1.0 to 100 Pa · s. Here, the viscosity is measured with a viscometer manufactured by Toki Sangyo (model number: E type). Moreover, it is preferable from a viewpoint of the applicability after storage that the sealing resin composition is 1 to 2 times the thickening ratio after being left at room temperature for 24 hours.

  The sealing resin composition can be formed at a desired position on the substrate by a dispenser, printing or the like.

  Curing of the sealing resin composition is preferably performed at 180 to 260 ° C. for 1 to 10 seconds. In particular, curing within 5 seconds is preferable from the viewpoint of improving productivity.

  Thus, the pre-supplied liquid semiconductor encapsulating resin composition of the present invention is excellent in workability, ease of handling, and adaptability to narrow pitch, and can be cured in a short time, and can be cured in a short time. The voids in between can be suppressed. Therefore, it is possible to obtain a low-cost, low-energy first-supply type semiconductor device having a flip-chip type semiconductor element.

  The present invention will be described with reference to examples, but the present invention is not limited thereto. In the following examples, parts and% indicate parts by mass and mass% unless otherwise specified.

[Examples 1 to 13, Comparative Examples 1 to 5]
Sealing resin compositions were prepared with the formulations shown in Tables 1 to 3. Each of Examples 1 to 13 was a liquid resin composition, and was excellent in workability, ease of handling, and adaptability to narrow pitch. The epoxy resin contained in HX3932HP, which is an epoxy resin / microcapsule type accelerator, is a state where “liquid bisphenol F type epoxy / liquid bisphenol A type epoxy resin” is mixed in a mass ratio of “54/13”. Since the epoxy equivalent at 170 was 170 g / eq, when calculating “(B) component equivalent / (A) component equivalent”, “liquid bisphenol F type epoxy + liquid bisphenol A type epoxy resin” was 170 g / eq. Calculated.

[Evaluation of gel time]
The gel time of the resin composition is when the resin composition: 5 ± 1 mg is supplied on a hot plate heated to 150 ° C., and the stirring bar is lifted and pulled away while stirring in a circle at the tip of the needle. The time until stringing disappeared was measured with a stopwatch. The proper range of gel time is 10 to 100 seconds. Tables 1 to 3 show the measurement results.

[Fabrication of test piece mounted with semiconductor chip]
A semiconductor chip (Si chip) having a width: 7.3 mm, a length: 7.3 mm, and a height: 125 μm in which 544 bumps of 30 μm were formed at a pitch of 50 μm was prepared. The bumps are SnAg solder plated copper pillars. In addition, an FR-4 substrate having a thickness of 360 μm having electrodes corresponding to the bump pattern of the semiconductor chip was prepared. This substrate was placed on a stage at 60 ° C., and a sealing resin composition was applied onto the electrode of this substrate using a 23G needle dispenser, and then a flip chip bonder manufactured by Panasonic Factory Solutions (model number) Using FCB3), the temperature was raised from 160 ° C. to 260 ° C. in 2 seconds, and then the semiconductor chip was pressed under the conditions of 260 ° C. × 2 seconds, maintained at a load of 22 N, and an evaluation sample was produced. Thereafter, a heat treatment was performed at 150 ° C. for 1 hour to produce a test piece on which a semiconductor chip was mounted.

[Evaluation of mounting status]
<< SAT (Scanning Acoustic Tomograph) Test >>
A test piece (number of test pieces: 2) on which a semiconductor chip was mounted was observed with an ultrasonic flaw detector (model number: FCB3) manufactured by Panasonic Factory Solutions. It was observed whether a void was generated in the sealing resin composition under the semiconductor chip or whether the sealing resin composition was filled over the entire surface. The case where void was confirmed in the sealing resin composition was designated as void: “x”, and the case where the sealing resin composition was not filled on the entire surface was designated as filling: “x”. In the row of “Void” of “SAT” in Tables 1 to 3, [(number of test pieces in which the void was evaluated as “×”) / (number of test pieces: 2)] was added to “ [(Number of test pieces evaluated as “×” for filling) / (Number of test pieces: 2)] is shown in the “fill” row of “SAT”.

<Surface polishing test>
The chip part of the test piece (number of test pieces: 2) on which the semiconductor chip was mounted was removed by polishing, and the solder resist opening was observed. The solder resist opening around the semiconductor chip and the void on the semiconductor chip mounting portion were observed with an optical microscope. In the solder resist opening, gold-plated copper wiring was formed with a wiring width of 30 μm and a wiring pitch of 50 μm. First, the presence or absence of voids in the test piece was observed. [(Number of test pieces in which voids were observed) / (Number of test pieces: 2)] is shown in the “void” row of “Surface polishing” in Tables 1 to 3. Specifically, observation was made with attention to voids at the opening of the solder resist around the semiconductor chip of the test piece, particularly voids straddling the wiring. In the row of “Void around the chip” of “Surface polishing” in Tables 1 to 3, [(number of test pieces in which voids were observed at the opening of the solder resist) / (number of test pieces: 2)] is shown. Similarly, the void of the semiconductor chip mounting part was confirmed. In the row of “Semiconductor chip mounting portion voids” of “Surface polishing” in Tables 1 to 3, [(number of test pieces with voids observed on semiconductor chip mounting portion) / (number of test pieces: 2)] Indicates.

[Reflow test]
A test piece (number of test pieces: 5) on which a semiconductor chip was mounted was observed with an ultrasonic flaw detector (model number: FCB3) manufactured by Panasonic Factory Solutions. Then, it was made to absorb moisture in a high temperature and high humidity layer (temperature: 30 ° C., humidity: 60% rh) for 196 hours. After moisture absorption, the reflow furnace having a maximum temperature of 260 ° C. was repeatedly passed three times, and the same image observation was performed again. A sample in which delamination of the encapsulating resin composition occurred after moisture absorption and reflow was designated as “x”. Tables 1 to 3 show the test results.

[Continuity test]
The resistance value between the resistance value measurement pads of the test piece on which the semiconductor chip was mounted was measured. The design value of the resistance between the resistance value measurement pads of the test piece with good connection between the semiconductor chip and the substrate was 42Ω. A resistance value between the resistance measurement pads of 50Ω or more was designated as “x”. Tables 1 to 3 show the test results.

  To summarize the test results, all of Examples 1 to 13 have a low viscosity suitable for the pre-feed type flip chip bonding process, the entire surface of the semiconductor chip is filled with the sealing resin composition, and can be cured in a short time. Met. In addition, no voids were confirmed in the solder resist opening around the semiconductor chip and in the semiconductor chip mounting portion. Furthermore, the results of the reflow test and the continuity test were also good. On the other hand, in Comparative Example 1 containing no component (C), voids were observed in the SAT test and the surface polishing. In Comparative Example 2 in which the amount of the curing agent equivalent of the component (B) was too small, voids were observed in the SAT test, and the results of the reflow test were also poor. In Comparative Example 3 in which the amount of the curing agent equivalent of the component (B) was too large, voids were observed in the SAT test and surface polishing, and the results of the reflow test were also poor. In Comparative Example 4 in which the content of the component (C) was too small, voids were observed by planar polishing. In Comparative Example 5 in which the content of the component (C) was too large, voids were observed by planar polishing, and the result of the continuity test was poor.

  As described above, the pre-feed type liquid semiconductor encapsulating resin composition of the present invention has a good filling property between the semiconductor chip and the substrate, can be cured in a short time, and has no voids in the encapsulating resin composition. Very useful for pre-supplied flip chip bonding processes.

Claims (4)

(A) at least one liquid epoxy resin selected from the group consisting of a liquid bisphenol A type epoxy resin, a liquid bisphenol F type epoxy resin, and a liquid naphthalene type epoxy resin,
(B) a curing agent,
(C) contains a pregel agent, and (D) a curing accelerator,
The curing agent equivalent of the component (B) is 0.6 to 1.1 times the epoxy equivalent of the component (A), and the component (C) is the components (A), (B), and (C). And (D) component: 6 to 11 parts by mass with respect to 100 parts by mass, a pre-supplied liquid semiconductor encapsulating resin composition.   The pre-feed type liquid semiconductor sealing resin composition according to claim 1, wherein the component (C) is a methyl methacrylate / butyl methacrylate copolymer.   The pre-feed type liquid semiconductor sealing resin composition according to claim 1 or 2, further comprising (E) a filler. The semiconductor device which has a flip chip type semiconductor element sealed using the pre-supplied liquid semiconductor sealing resin composition of any one of Claims 1-3.