JP6549555B2 - Conductive adhesive and semiconductor device - Google Patents

Description

  BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a conductive adhesive, and more particularly to a conductive adhesive capable of connecting a metal that easily forms an oxide film with low resistance.

  A semiconductor device in which an electrode portion of a semiconductor element and a conductive portion of a substrate are bonded is used in a wide range, and a conductive adhesive or solder is used to bond the electrode portion of the semiconductor element to the conductive portion of the substrate. Is used. The conductive adhesive has an advantage of being able to be bonded at a lower temperature than soldering, but since the bulk resistance is higher than that of the solder, lowering of the resistance of the conductive adhesive is being studied.

  As a method of reducing the bulk resistance of the conductive adhesive, it is widely known to increase the filling of the conductive filler in the conductive adhesive. However, when the base of the conductive portion of the substrate is a metal (such as nickel, copper, or aluminum) which easily forms an oxide film on the outermost surface, if it is joined by a conductive adhesive, the corrosion of this metal causes a connection resistance value. As a result, the increase in the connection resistance value can not be prevented by the high filling of the conductive filler in the conductive adhesive.

  As a known technique for reducing the connection resistance value when using a conductive adhesive as described above, when bonding a metal that easily forms an oxide film with a conductive adhesive, the conductive adhesive is used. It is known to add 8-hydroxyquinoline as an anticorrosion agent in the agent.

  Known techniques for adding 8-hydroxyquinoline as a corrosion inhibitor in a conductive adhesive include (a) polymeric resin, (b) conductive filler, (c) anticorrosive, (d) optionally reactive Or a composition for use in a microelectronic device comprising a non-reactive diluent, (e) optionally an inert filler, and (f) optionally an adhesion promoter, wherein the corrosion inhibitor is 8-hydroxyquinoline (A) polymer resin, (b) conductive filler, (c) optionally reactive or non-reactive diluent, (d) optionally inert filler And (e) A composition for a microelectronic device, optionally comprising an adhesion promoter, wherein the composition is improved by the addition of an oxygen scavenger or a corrosion inhibitor or both. A composition for use in microelectronics devices, comprising (a) a thermosetting resin system comprising an admixture of at least one epoxy resin and an aliphatic amine, (b) a conductive filler, (c) Corrosion inhibitor, (d) curing agent or catalyst, (e) optionally, an organic solvent, and (f) optionally, one or more of the group consisting of an adhesion promoter, a phenolic resin, a flow additive and a rheology modifier U.S. Pat. No. 5,075,015, which includes a composition wherein the ratio of epoxide functional groups in the epoxy resin to amine functional groups in the aliphatic amine is greater than one.

JP 2002-348486 A JP, 2000-273317, A Japanese Patent Application Publication No. 2006-524286

  However, in the case of the conductive adhesive to which 8-hydroxyquinoline is added as the corrosion inhibitor as described above, the decrease in connection resistance is not sufficient, and a further decrease in connection resistance is desired.

  By adding morpholines (morpholine and a compound having a similar structure to morpholine) as a corrosion inhibitor, we can obtain a connection resistance value lower than that obtained with 8-hydroxyquinoline, and It has been found that a conductive adhesive having a long pot life can be obtained by the suppression of thickening during storage.

  The object of the present invention is to provide a conductive adhesive having a low connection resistance value by adding morpholines as a corrosion inhibitor, and having a long pot life by suppressing the thickening during storage. Do.

The present invention relates to a conductive adhesive and a semiconductor device in which the above problems are solved by having the following configuration.
[1] (A) Epoxy resin,
(B) amine curing agents and / or phenolic curing agents,
(C) morpholines reducing agent,
A conductive adhesive comprising: (D) a conductive filler, and (E) a silane coupling agent.
[2] Component (C) is morpholine, 2,6-dimethylmorpholine, 4- (3-hydroxypropyl) morpholine, 4-methylmorpholine, 4- (4-aminophenyl) morpholine, thiomorpholine and 1,1- The conductive adhesive according to the above [1], which is at least one selected from the group consisting of dioxothiomorpholine.
[3] The conductivity according to the above [1] or [2], wherein the component (C) is 0.05 to 1.00 parts by mass with respect to a total of 100 parts by mass of the components (A) to (E). adhesive.
[4] Component (D) is at least one powder selected from the group consisting of silver, nickel, copper, gold, palladium, platinum, tin, aluminum, silver-coated copper, silver-coated aluminum and silver-coated resin The conductive adhesive according to any one of the above [1] to [3].
[5] a substrate having a conductive portion, and a semiconductor element having an electrode portion,
The cured product of the conductive adhesive according to any one of the above [1] to [4], wherein the conductive portion of the substrate and the electrode portion of the semiconductor element are bonded.
[6] The semiconductor device according to the above [5], wherein the conductive portion of the substrate is nickel, aluminum or copper.

  According to the invention [1], a low connection resistance value can be obtained, and a conductive adhesive having a long pot life can be provided by the suppression of the thickening during storage.

  According to the invention [5], it is possible to obtain a highly reliable semiconductor device in which the connection resistance value between the electrode portion of the semiconductor element and the conductive portion of the substrate is small.

The conductive adhesive of the present invention is
(A) Epoxy resin,
(B) amine curing agents and / or phenolic curing agents,
(C) morpholines reducing agent,
(D) A conductive filler, and (E) a silane coupling agent.

  The component (A) imparts adhesiveness and curability to the conductive adhesive, and imparts durability and heat resistance to the conductive adhesive after curing. As component (A), liquid bisphenol A epoxy resin, liquid bisphenol F epoxy resin, liquid naphthalene epoxy resin, liquid aminophenol epoxy resin, liquid hydrogenated bisphenol epoxy resin, liquid alicyclic epoxy resin, liquid Examples include alcohol ether type epoxy resin, liquid cyclic aliphatic type epoxy resin, liquid fluorene type epoxy resin, liquid siloxane type epoxy resin and the like, liquid bisphenol A type epoxy resin, liquid bisphenol F type epoxy resin, liquid naphthalene type epoxy resin It is preferable from the viewpoints of adhesiveness, curability, durability, and heat resistance. Moreover, as for an epoxy equivalent, from a viewpoint of viscosity adjustment, 80-250 g / eq is preferable. Commercial products include Nippon Steel & Sumikin Chemical's bisphenol F-type epoxy resin (product name: YDF 8170), DIC's bisphenol A-type epoxy resin (product name: EXA-850CRP), Nippon Steel & Sumikin Chemical Co., bisphenol F-type epoxy resin (product name: YDF870GS) DIC's bisphenol A / bisphenol F mixed epoxy resin (product name: EXA 835LV), DIC's naphthalene type epoxy resin (product name: HP4032D), Mitsubishi Chemical's aminophenol epoxy resin (grade: JER630, JER630LSD), momentary performance Siloxane-based epoxy resin (product name: TSL 9906), 1,4-cyclohexanedimethanol diglycidyl ether (product name: ZX1658GS) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., and the like can be mentioned. The component (A) may be used alone or in combination of two or more.

  The component (B) cures the conductive adhesive. The amine-based curing agent as the component (B) is not particularly limited as long as it has one or more active hydrogens capable of undergoing an addition reaction with an epoxy group in the molecule. Aliphatic amine compounds such as diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, 4,4'-diamino-dicyclohexylmethane etc. as an amine curing agent; 4,4'- Aromatic amine compounds such as diaminodiphenylmethane and 2-methylaniline; imidazole compounds such as imidazole, 2-methylimidazole, 2-ethylimidazole and 2-isopropylimidazole; and imidazoline compounds such as imidazoline, 2-methylimidazoline and 2-ethylimidazoline Etc.

  When the amine curing agent of the component (B) is an imidazole compound, it is preferable that it is microencapsulated, and as the microencapsulated imidazole compound curing agent, an imidazole compound curing accelerator microencapsulated with a urethane resin or the like is used. The microencapsulated imidazole compound curing accelerator dispersed in a liquid epoxy resin such as liquid bisphenol A type is preferable from the viewpoint of storage stability, and is a point of workability, curing speed, storage stability More preferred. As the imidazole curing agent contained in the microencapsulated imidazole compound curing agent, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenylimidazole Phenyl-4-methylimidazole, 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)] ethyl-s-triazine, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4 And -methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo [1,2-a] benzimidazole and the like, and 2,4-diamino-6- [2'-methylimidazolyl- 1 ')] Ethyl-s-triazine, 2,4-diamino-6- [2'-unde Cure rate, etc., as imidazolyl- (1)]-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1 ')]-ethyl-s-triazine, etc. It is preferable from the viewpoint of workability and moisture resistance.

  Examples of the phenolic curing agent of the component (B) include phenol novolak, cresol novolak and the like, and phenol novolak is preferable. In addition, since the phenolic curing agent has lower reactivity than the amine curing agent, the pot life can be extended. When it is desired to make the pot life of the conductive adhesive longer, a phenolic curing agent can be used in combination to extend the pot life of the conductive adhesive.

  Commercial products of component (B) include amine curing agents manufactured by Nippon Kayaku Co., Ltd. (product name: Kayahard A-A), adipic acid dihydrazide made by Nippon Finechem (product name: ADH), microencapsulated imidazole compound curing agents made by Asahi Kasei E-materials (Product name: Novacua HX3941HP, Novacua HX3088, Novacua HX3722), Ajinomoto Finetechno amine adduct type curing agent (product name: PN-40J), Meiwa Kasei Phenolic curing agent (product name: MEH8000, MEH8005), etc. The component B) is not limited to these product names. The component (B) may be used alone or in combination of two or more.

  The morpholines used for the reducing agent of the component (C) refer to morpholine and compounds having a morpholine structure. The component (C) can reduce the connection resistance value of the conductive adhesive after curing. As component (C), morpholine, 2,6-dimethylmorpholine, 4- (3-hydroxypropyl) morpholine, 4-methylmorpholine, 4- (4-aminophenyl) morpholine, thiomorpholine, 1,1-dioxo Thiomorpholine etc. are mentioned.

The connection resistance value can be reduced when the component (C) is at least one selected from the group consisting of morpholines represented by the following chemical formulas (1) to (7), which is preferable.
Morpholine represented by the chemical formula (1):

2,6-Dimethylmorpholine represented by the chemical formula (2):

4- (3-hydroxypropyl) morpholine represented by the chemical formula (3):

4-methylmorpholine represented by the chemical formula (4):

4- (4-aminophenyl) morpholine represented by the chemical formula (5):

Thiomorpholine represented by the chemical formula (6):

1,1-dioxothiomorpholine (thiomorpholine 1,1-dioxide) represented by the chemical formula (7):

  As the component (C), for example, a reagent commercially available from Wako Pure Chemical Industries, Ltd., Japan emulsifier, Tokyo Chemical Industry may be used. The component (C) may be used alone or in combination of two or more. In addition, since 8-hydroxyquinoline used in known techniques has a reducing power lower than that of morpholines, a large amount (for example, 2 of conductive adhesives) can be used to lower the connection resistance value of the conductive adhesives. However, if the conductive adhesive contains a large amount of 8-hydroxyquinoline, there is a problem that the adhesion of the conductive adhesive is reduced. On the other hand, the (C) morpholines reducing agent has a strong reducing power at high temperature, so that the connection resistance value of the conductive adhesive can be reduced by a small amount that does not reduce the adhesion of the conductive adhesive, There is a remarkable advantage that the conductive adhesive does not thicken, that is, the pot life can be extended since it does not react at normal temperature.

  The conductive filler of the component (D) need not be particularly limited, and as the component (D), silver, nickel, copper, gold, palladium, platinum, carbon black, bismuth, tin, bismuth-tin alloy, carbon Fibers, graphite, aluminum, indium tin oxide, silver coated copper, silver coated aluminum, metal coated glass spheres, silver coated fibers, silver coated resin, antimony doped tin oxide, and mixtures thereof. In the known art, the connection resistance value is that the component (D) is at least one powder selected from the group consisting of silver, nickel, copper, tin, aluminum, silver-coated copper, silver-coated aluminum and silver-coated resin The effect of the present invention is easily exhibited and is preferred. Examples of materials used for silver-coated fibers and silver-coated resins include acrylic resins, polyesters, and styrene resins. When the conductive portion of the substrate is a metal which is easily corroded such as nickel, aluminum or copper, the component (C) also acts as a corrosion inhibitor for the conductive portion of the substrate. The use of a metal having a small bulk resistance, such as gold, palladium, platinum, or the like can reduce the connection resistance, which is preferable. The average particle diameter of the component (D) is more preferably 0.1 to 50 μm from the viewpoint of workability and viscosity reduction. Here, the average particle diameter of the component (D) is a volume-based median diameter measured by a laser diffraction method. Further, the shape of the component (D) is more preferably scaly from the viewpoint of resistance reduction. Examples of commercially available products include silver powder manufactured by Dowa Electronics (product name: FA618) and silver powder manufactured by Mitsui Mining & Smelting Co. (product name: SL02). The component (D) may be used alone or in combination of two or more.

  The coupling agent of component (E) improves the adhesion of the conductive adhesive. As component (E), 3-glycidoxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, vinyltrimethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyltrimethoxysilane, 3-acrylic Roxypropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, bis (triethoxysilylpropyl) tetrasulfide, 3-isocyanatopropyltriethoxysilane, etc., and 3-glycidoxypropyl Trimethoxysilane and 3-aminopropyltrimethoxysilane are preferable from the viewpoint of conductive adhesive adhesion. Commercially available products include, but are not limited to, silane coupling agents manufactured by Shin-Etsu Chemical Co., Ltd. (product names: KBM403, KBE903, KBE9103), silane coupling agents manufactured by Nichisho Co., Ltd. (product name: S510), etc. It is not limited to The component (E) may be used alone or in combination of two or more.

  The amount of the component (A) is preferably 6 to 24 parts by mass, and more preferably 8 to 21 parts by mass, with respect to a total of 100 parts by mass of the components (A) to (E).

  From the viewpoint of good reactivity and reliability, the component (B) is preferably 1 to 10 parts by mass, and 1 to 5 parts by mass with respect to 100 parts by mass in total of the components (A) to (E). If there is, it is more preferable.

  The component (C) is preferably 0.05 to 1.00 parts by mass and 0.1 to 0.8 parts by mass with respect to a total of 100 parts by mass of the components (A) to (E). More preferable. When the amount of the component (C) is less than 0.05 parts by mass with respect to 100 parts by mass of the conductive adhesive, the connection resistance tends to increase, while when it exceeds 1.00 parts by mass, the conductive adhesion The pot life of the agent tends to be short.

  Also, in the case of the cured product of the conductive adhesive, the component (C) is preferably 0.05 to 1.00 parts by mass with respect to 100 parts by mass in total of the components (A) to (E), It is more preferable that it is 0.1-0.8 mass parts. Here, in the case where the conductive adhesive does not contain a solvent (including the case where the solvent is volatilized from the conductive adhesive), the mass loss at the time of curing is as small as less than 1%. The content of the component (C) is the same as the content in the components (A) to (E) before curing. Here, quantitative analysis of the component (C) is performed by an ion chromatograph-mass spectrometer. In addition, the mass reduction at the time of hardening of the conductive adhesive in case the conductive adhesive contains a solvent is 3-5 mass%, for example.

  The component (D) is preferably 70 to 90 parts by mass with respect to a total of 100 parts by mass of the components (A) to (E) from the viewpoint of the electric resistance value of the conductive adhesive itself, and 74 to 86 parts It is more preferable that it is a part.

  Also, in the case of the cured product of the conductive adhesive, the component (D) is preferably 70 to 90 parts by mass with respect to 100 parts by mass in total of the components (A) to (E), and 74 to 86 parts It is more preferable that it is a part. Here, quantitative analysis of the component (D) is performed by mass spectrometry.

  The component (E) is preferably contained in an amount of 0.05 to 5 parts by mass, more preferably 0.1 to 2 parts by mass, based on 100 parts by mass of the components (A) to (E). Adhesiveness improves that it is 0.05 mass part or more, and foaming of a conductive adhesive is suppressed as it is 5 mass parts or less.

  The conductive adhesive of the present invention can further contain a boric acid compound from the viewpoint of improving the pot life. This boric acid compound is preferable in it being 0.03-0.06 mass part with respect to a total of 100 mass parts of (A)-(E) component. When the amount is less than 0.03 parts by mass, the pot life may be shortened, and when the amount is more than 0.06 parts by mass, the curability of the conductive adhesive may be deteriorated. Examples of commercially available boric acid compounds include boric acid (trade name: HBO, active ingredient: 99.5% or more) manufactured by Wako Pure Chemical Industries, Ltd., and triisopropyl borate from Tokyo Chemical Industry Co., Ltd. (trade name: TIPB).

  In the conductive adhesive of the present invention, a leveling agent, a coloring agent, an ion trap agent, an antifoaming agent, a flame retardant, other additives and the like are further added as needed within a range not to impair the object of the present invention. be able to.

  The conductive adhesive of the present invention can be obtained, for example, by stirring, melting, mixing, and dispersing the components (A) to (E) and the other additives simultaneously or separately, with heat treatment as required. be able to. An apparatus for mixing, stirring, dispersing and the like is not particularly limited, but a lai-sea machine equipped with stirring and a heating device, a three-roll mill, a ball mill, a planetary mixer, a bead mill, etc. can be used. . Moreover, you may use combining these apparatuses suitably.

  It is preferable from the viewpoint of injectability that the conductive adhesive of the present invention has a viscosity of 10000 to 30000 mPa · s at a temperature of 25 ° C. Here, the viscosity is measured by a Brookfield RV RV viscometer.

  The conductive adhesive of the present invention is formed and applied to a desired position of an electronic component such as a conductive portion of a substrate or an electrode portion of a semiconductor element by dispenser, printing or the like.

  The curing of the conductive adhesive of the present invention is preferably 80 to 300 ° C.

  The conductive adhesive of the present invention is suitable as an adhesive for electronic parts such as the electrode part of a semiconductor element and the conductive part of a substrate.

[Semiconductor device]
A semiconductor device of the present invention includes a substrate having a conductive portion, and a semiconductor element having an electrode portion,
The conductive portion of the substrate and the electrode portion of the semiconductor element are bonded by the cured product of the conductive adhesive.

  In the semiconductor device, the conductive portion of the substrate is preferably nickel, aluminum or copper from the viewpoint of easily exhibiting the effect of the conductive adhesive. This is because nickel, aluminum or copper is likely to cause an increase in connection resistance due to metal corrosion in the known art.

  The semiconductor device of the present invention is highly reliable because the connection resistance value between the electrode portion of the semiconductor element and the conductive portion of the substrate is small.

  The present invention will be described by way of examples, but the present invention is not limited thereto. In the following examples, parts and% indicate parts by mass and% by mass unless otherwise specified.

[Preparation of sample for evaluation]
In the proportions shown in Table 1, DIC liquid epoxy resin (product name: EXA 835 LV) as component (A), Nichiseki silane coupling agent (product name: S510) as component (E), and silver as component (D) Powders and solvents Solvent naphtha (SW1800) manufactured by Maruzen Petrochemicals Co., Ltd .: 3.00 parts by mass (not shown in Table 1) and boric acid compounds for improving the pot life (Wako Pure Chemical Industries, product name: HBO) : 0.04 mass part (it does not describe in Table 1) was measured to the container, and was disperse | distributed with 3 roll mills.

  Next, the (C) morpholines reducing agent was added to the obtained dispersion, and the mixture was stirred by a rotation and revolution stirrer. Here, morpholine is usually in the form of liquid, so there is no need for roll dispersion. In addition, solid morpholines (for example, 4- (3-hydroxypropyl) morpholine, 4- (4-aminophenyl) morpholine, 1,1-dioxothiomorpholine) were dispersed by the above roll mill. Furthermore, a microcapsulated curing agent (product name: Novaca HX3722) manufactured by Asahi Kasei E-Materials, which is a mixture of the (A) component and the (B) component, was added and similarly stirred using a rotation-revolution type stirrer. Finally, the solvent naphtha is used to adjust the viscosity so that the viscosity is 10000 to 30000 mPa · s, and while stirring with a defoamer, the foam in the dispersion is completely removed, and the conductive adhesive is removed. Obtained.

  In Comparative Example 1, the component (C) was not used. In Comparative Example 2, 8-quinolinol was used in place of the component (C), and in Comparative Example 3, adipic acid was used in place of the component (C). In Comparative Example 4, an acid anhydride curing agent was used instead of the component (B).

〔Evaluation method〕
<Measurement of connection resistance value>
A conductive adhesive was printed on a Ni-plated Cu lead frame (thickness: 200 μm), and a 3216 size AgPd edge electrode was mounted. After raising the temperature from room temperature to 80 ° C in 60 minutes and holding in an oven at 80 ° C for 60 minutes for curing, the resistance between the lead frame and the electrode is measured by the four-terminal method, and the connection resistance is measured. Obtained. The results are shown in Tables 1 and 2.

<Pot life>
The viscosity of the obtained conductive adhesive was measured at 10 rpm using a Brookfield RVT viscometer (using a No. 14 spindle). After measuring the initial viscosity, it was left for 24 hours in a 25 ° C./50% RH environment, the viscosity was measured again, and the viscosity increase rate was calculated. Here, the viscosity increase rate has the following formula:
Viscosity increase rate = [(viscosity after 24 hours)-(initial viscosity)] / (initial viscosity) x 100
Calculated with When the viscosity increase rate was less than 5%, "◎", 5-15% was "○", 15-20% was "Δ", and 20% or more was "X". Tables 1 and 2 show the measurement results.

<Comprehensive evaluation>
We made a comprehensive evaluation. When the connection resistance value is 3000 mΩ or less and the pot life is ◎ or 、, the comprehensive evaluation is "◎", the connection resistance value is 3000 mΩ or less, and the pot life is △, the comprehensive evaluation is "○ When the connection resistance value is 3000 mΩ or less and the pot life is x, the comprehensive evaluation is “Δ”, and when the connection resistance value is higher than 3000 mΩ, the comprehensive evaluation is “x”. Tables 1 and 2 show the measurement results.

  As understood from Tables 1 and 2, in all of Examples 1 to 15, the connection resistance value was as low as 3000 mΩ or less, the pot life was not bad, and the overall evaluation was also good. In particular, in Examples 1, 2, 6 to 8, and 15, the connection resistance value was low, the pot life was very good, and the overall evaluation was also very good. On the other hand, in Comparative Example 1 in which the component (C) was not used, the connection resistance value was very high and the comprehensive evaluation was also bad. In Comparative Example 2 in which 8-quinolinol was used instead of the component (C), the connection resistance value was high, and the comprehensive evaluation was also poor. In Comparative Example 3 in which adipic acid was used instead of the component (C), the connection resistance value was high, the pot life was short, and the overall evaluation was also poor. In Comparative Example 4 in which an acid anhydride curing agent was used instead of the component (B), the connection resistance value was high, and the comprehensive evaluation was also poor.

  As described above, the conductive adhesive of the present invention has a long pot life and can obtain low connection resistance after curing.

  The present invention is a conductive adhesive in which a low connection resistance value is obtained by adding morpholines as a corrosion inhibitor, and the pot life is long due to the suppression of thickening during storage, and in particular, it is possible to use a substrate It is very useful for adhesion between the conductive part and the electrode part of the semiconductor element.

Claims (5)

(A) Epoxy resin,
(B) amine curing agents and / or phenolic curing agents,
(C) morpholines reducing agent,
(D) The conductive filler, and (E) the silane coupling agent are contained, and the (C) component is 0.05 to 1.00 with respect to a total of 100 parts by mass of the (A) to (E) components. Conductive adhesive characterized in that it is part by mass .   Component (C) is morpholine, 2,6-dimethylmorpholine, 4- (3-hydroxypropyl) morpholine, 4-methylmorpholine, 4- (4-aminophenyl) morpholine, thiomorpholine and 1,1-dioxothio The conductive adhesive according to claim 1, which is at least one selected from the group consisting of morpholine. The component (D) is at least one powder selected from the group consisting of silver, nickel, copper, gold, palladium, platinum, tin, aluminum, silver-coated copper, silver-coated aluminum and silver-coated resin. The conductive adhesive according to 1 or 2 . A substrate having a conductive portion, and a semiconductor element having an electrode portion,
A semiconductor device according to any one of claims 1 to 3 , wherein the conductive portion of the substrate and the electrode portion of the semiconductor element are bonded. The semiconductor according to claim 4 , wherein the conductive portion of the substrate is nickel, aluminum or copper.