TW201439190A - Liquid resin composition, flip chip implementation and manufacturing method thereof - Google Patents

Abstract

An object of this invention is to suppress bleeding of a liquid resin composition to an imaging surface of a semiconductor chip which is not coated with fluorine, so as to improve image quality of image elements of an image sensor module and the like. This invention provides a liquid resin composition, containing: (A) an epoxy resin, (B) a curing agent, and (C) a copolymer of dimethylaminopropyl acrylamide and butyl acrylate. The (B) component preferably is at least one selected from the group consisting of a phenolic-based curing agent, an amine-based curing agent, an acid anhydride-based curing agent and an imidazole-based curing agent.

Description

Liquid resin composition, flip chip mounting body and method of producing the same

The present invention relates to a semiconductor device mounting body, and more particularly to a flip chip mounting body, and more particularly to a liquid resin used for packaging a flip chip mounting body of an image sensor such as an image sensor module. A composition, a flip chip mounted body using the liquid resin composition, and a method of producing a flip chip mounted body.

In recent years, flip-chip bonding has been used as a mounting method of a semiconductor wafer, and it is possible to further increase the density and frequency of wiring of an electronic device. In general, the flip chip bonding method encapsulates the gap between the semiconductor wafer and the substrate with a liquid resin composition called an underfill material.

In the image sensor module which is one type of image element, a model using a flip chip structure for the purpose of thinning is also increasing. Fig. 1 is a diagram showing an example of a schematic view of a cross section of an image sensor module. The image sensor module 1 detects the light passing through the lens 8 (indicated by a broken line in the first drawing) by the microlens 4 and is detected by the photodiode 3.

Here, one of the problems of a semiconductor packaging material (underfill material) in which a gap between a semiconductor wafer such as a photodiode and a substrate is encapsulated is Bleeted. The overflow of the image sensor module refers to a liquid component in the semiconductor packaging material belonging to the liquid resin composition, and diffuses from the lower surface of the semiconductor wafer to the imaging surface (sensing surface) of the semiconductor wafer or the microlens. In the case of overflow, since the imaging surface or the microlens of the semiconductor wafer is contaminated, the image quality of the image sensor module is deteriorated, which is a fatal problem. Figure 2 is a schematic diagram showing the overflow of the image sensor module. In the manufacturing step of the image sensor module, the following steps are performed: after the substrate 12 used for the image sensor module is bonded to the pad 131 formed on the semiconductor wafer 13, the dispenser is used ( Dispenser 20, a step of filling the semiconductor package material 11 between the substrate 12 and the semiconductor wafer 13. At this time, when the liquid component in the semiconductor package material 11 bleeds out to cause the overflow 111, the imaging surface of the semiconductor wafer 13 or the microlens 14 is contaminated. In order to suppress this overflow, a method of applying a fluororesin to an imaging surface of a semiconductor wafer (Patent Document 1) is used, but there is a new problem that the image quality is lowered by applying fluorine.

Therefore, in recent years, in order to improve the image quality of the image sensor module, a method of applying fluorine to the image pickup surface of the semiconductor wafer is being reviewed. However, when an existing semiconductor package material is used for an imaging surface of a fluorine-free semiconductor wafer, overflow occurs as described above, which causes a problem.

On the other hand, in order to solve the problem of overflow of the substrate, for example, a liquid encapsulating resin composition containing a liquid polyoxynitride having a carboxyl group or an amine group has been reported (Patent Document 2), which contains a micronized rubber micropowder. Insulating paste (Patent Document 3), which contains an alkyl methacrylate copolymer, an inorganic filler surface-treated with a non-reactive organic bismuth compound, and a side filler of a modified polyoxyl resin (side-fill) Material) (Patent Documents 4, 5), but these documents are considered to inhibit the plasma The substrate to be processed (Patent Document 2) and the substrate (Patent Documents 3 to 5) which are not subjected to surface treatment such as plasma are overflowed, and there is a problem that the overflow of the image pickup surface of the semiconductor wafer to which fluorine is not applied cannot be suppressed.

[Advanced technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Publication No. 2008-527419

[Patent Document 2] Japanese Laid-Open Patent Publication No. 2006-219575

[Patent Document 3] Japanese Laid-Open Patent Publication No. 05-174629

[Patent Document 4] Japanese Patent Laid-Open Publication No. 2005-36069

[Patent Document 5] Japanese Patent Laid-Open Publication No. 2005-105243

The present invention has an object of suppressing the overflow of a liquid resin composition on an image pickup surface of a semiconductor wafer not coated with fluorine for the purpose of improving the image quality of an image sensor such as an image sensor module. An object of the present invention is to provide a liquid resin composition which can suppress an overflow of an image pickup surface of a semiconductor wafer which is not coated with fluorine in order to improve the image quality of an image sensor such as an image sensor module.

When the inventors concentrated on the research, the liquid resin composition which does not overflow even on the imaging surface of the semiconductor wafer to which fluorine is not applied is developed by adding a specific additive to the liquid resin composition. The present invention relates to a liquid resin composition, a semiconductor packaging material, an image element sealing material, a flip chip mounting body, and a flip chip mounting body which solve the above problems by the following configuration. Production method.

[1] A liquid resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) a copolymer of dimethylaminopropyl acrylamide and butyl acrylate.

[2] The liquid resin composition according to the above [1], wherein the component (B) is selected from the group consisting of a phenolic curing agent, an amine curing agent, an acid anhydride curing agent, and an imidazole curing agent. At least one.

[3] The liquid resin composition according to the above [1], wherein the component (C) is 0.02 to 2.5 parts by mass based on 100 parts by mass of the liquid resin composition.

[4] The liquid resin composition according to the above [2], wherein the component (B) contains a phenolic curing agent, and the phenolic curing agent 1 is contained in 100 parts by mass of the liquid resin composition. Up to 50 parts by mass.

[5] A packaging material for a semiconductor, comprising the liquid resin composition according to [1] above.

[6] A packaging material for an image element, which is the packaging material for a semiconductor according to the above [5].

[7] A flip-chip mounting body comprising the cured product of the liquid resin composition according to the above [1].

[8] A method of producing a flip chip mount, which is packaged using the semiconductor package material according to the above [5].

According to the invention [1], it is possible to provide a liquid resin composition which can suppress the overflow of the image pickup surface of the semiconductor wafer to which fluorine is not applied.

According to the invention [5], it is possible to provide a packaging material for a semiconductor which can suppress overflow of an imaging surface of a semiconductor wafer to which fluorine is not applied. According to the invention [6], by making An image sensor such as an image sensor with improved image quality can be obtained by using an imaging surface of a semiconductor wafer to which fluorine is not applied.

According to the invention [7], it is possible to provide a flip chip mounted body in which an image pickup surface of a semiconductor wafer not coated with fluorine is used and overflow is suppressed. According to the invention [8], a flip chip mounted body encapsulated with the liquid resin composition for encapsulation of the invention [5] can be easily obtained.

1‧‧‧Image Sensor Module

2,12,22‧‧‧substrate

3, 13, 23‧‧‧ semiconductor wafer

31, 131, 231‧‧‧ pads

4, 14, 24‧‧‧ microlens

5‧‧‧ bracket

6‧‧‧ bracket adhesive

7‧‧‧IR filter

8‧‧‧ lens

9‧‧‧Lens tube

10, 11, 21‧‧ ‧ semiconductor packaging materials

111‧‧‧ overflow

20, 30‧‧ ‧ Dispenser

Fig. 1 is a view showing an example of a schematic view of a cross section of an image sensor module.

Figure 2 is a schematic diagram illustrating the overflow of the image sensor module.

Fig. 3 is a schematic view for explaining an example of use of the liquid resin composition of the present invention.

The liquid resin composition of the present invention contains (A) an epoxy resin, (B) a curing agent, and (C) a copolymer of dimethylaminopropyl acrylamide and butyl acrylate.

The component (A) imparts curability, heat resistance, and adhesion to the liquid resin composition, and imparts durability to the liquid resin composition after curing. Examples of the component (A) include bisphenol A type epoxy resin, brominated bisphenol A type epoxy resin, bisphenol F type epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin, and novolac (novolac). Type epoxy resin, aminophenol type epoxy resin, alicyclic epoxy resin, ether type or polyether type epoxy resin, epoxy resin containing ethylene oxide (oxirane ring), among them, bisphenol F Type epoxy resin, aminophenol type epoxy resin, bisphenol A type epoxy resin, naphthalene type epoxy resin, glass transition point from liquid resin composition, reflow resistance, and From the standpoint of moisture resistance, it is preferred. The epoxy equivalent of the component (A) is preferably from 80 to 250 g/eq from the viewpoint of viscosity adjustment. For the commercially available products, bisphenol F type epoxy resin (trade name: YDF8170, YDF870GS) manufactured by Nippon Steel Chemical Co., Ltd., and bisphenol A type epoxy resin manufactured by Nippon Steel Chemical Co., Ltd. (trade name: YD- 128, YD-825GS), a naphthalene type epoxy resin (trade name: HP4032D) manufactured by DIC, etc., but the component (A) is not limited to these products. The component (A) may be used singly or in combination of two or more.

The component (B) may have any ability to cure the component (A). When the liquid resin composition is prepared, the fluidity can be maintained at room temperature, and it can be used even in a solid form. Examples of the component (B) include a phenol-based curing agent, an acid anhydride-based curing agent, an amine-based curing agent, an imidazole-based curing agent, and a bismuth carboxylic acid curing agent, and are preferably selected from the group consisting of a phenolic curing agent and an amine curing agent. At least one of the group consisting of an acid anhydride-based curing agent and an imidazole-based curing agent. In addition, it is more preferable that it is a phenolic hardening|curing agent, and it is more preferable that it is an acid-acid-hardening agent from the viewpoint of the fluidity of a liquid resin composition, and the connection of a semiconductor wafer and a board|substrate. From the viewpoint of preservation stability, an imidazole-based hardener is more preferable.

The phenolic curing agent may, for example, be a phenol novolac or a cresol novolac, and is preferably a phenol novolak. In addition, since the curing speed of the phenol-based curing agent is slower than other curing agents such as an acid anhydride-based curing agent, an amine-based curing agent, and an imidazole-based curing agent, the curing rate of the liquid resin composition is achieved by using another curing agent. When it becomes too fast, a phenolic hardener can be used in combination to achieve the purpose of delaying the hardening speed of the liquid resin composition.

Examples of the acid anhydride include tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyl nadic anhydride, hydrogenated methyl nadic anhydride, and trialkyltetrahydrogen. Phthalic anhydride, methylcyclohexene tetracarboxylic acid Anhydride, phthalic anhydride, trimellitic anhydride, pyrogallic anhydride, diphenyl ketone tetracarboxylic dianhydride, ethylene glycol bistricarboxylic anhydride, glycerol bis(benzenetricarboxylic anhydride) monoacetate, twelve Alkenyl succinic anhydride, aliphatic dibasic acid polyanhydride, chlorendic anhydride, methylbutenyl tetrahydrophthalic anhydride, alkylated tetrahydrophthalic anhydride, methyl Himic anhydride The alkenyl substituted succinic anhydride, glutaric anhydride or the like is preferably methylbutenyltetrahydrophthalic anhydride.

The amine-based curing agent may, for example, be a chain aliphatic amine, a cyclic aliphatic amine, a fatty aromatic amine or an aromatic amine, and is preferably an aromatic amine. Examples of the bismuth carboxylate hardener include diammonium adipate, diammonium isophthalate, diterpene sebacate, dinonanoate, and the like, and preferably diammonium adipate.

In the imidazole-based curing agent, it is preferable to use a microencapsulated imidazole compound curing agent or an amine addition-hardening agent from the viewpoint of storage stability, from the viewpoints of workability, curing speed, and storage stability. Further, a microencapsulated imidazole compound hardener dispersed in a liquid epoxy resin such as liquid bisphenol A type is more preferable. Examples of the imidazole hardener include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methyl Imidazole, 2,4-diamino-6-[2'-methylimidazolyl-(1')]ethyl-s-three , 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a Benzimidazole and the like, wherein 2,4-diamino-6-[2'-methylimidazolyl-(1')]ethyl-s-three 2,4-Diamino-6-[2'-undecylimidazolyl-(1)-ethyl-s-three 2,4-Diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-three The system is preferred from the viewpoints of curing speed, workability, and moisture resistance.

(B) The phenolic curing agent (trade name: MEH8000, MEH8005) and the acid anhydride of Mitsubishi Chemical (grade: YH306, YH307), 3 or 4-methyl-hexahydrophthalic anhydride (trade name: HN-5500) manufactured by Hitachi Chemical Co., Ltd., amine-based hardener (trade name: KAYAHARD AA) manufactured by Nippon Kasei Co., Ltd., manufactured by Japan Finechem Diacid diacetate (trade name: ADH), Asahi Kasei E-Materials microencapsulated imidazole compound hardener (trade name: HX3722, HX3742, HX3932HP), Ajinomoto fine-techno amine and shape hardening The agent (trade name: PN-40J) or the like, but the component (B) is not limited to these products. Here, after the components of the liquid resin composition are blended, when the mixture is filtered using a filter having a mesh size of 1 μm, it is preferred to use the component (B) having a particle diameter of less than 1 μm. The component (B) may be used singly or in combination of two or more.

The component (C) improves the wettability of the liquid resin composition and suppresses the overflow of the liquid resin composition. (C) component is a dimethylaminopropyl propylene decylamine represented by the chemical formula (1)

Copolymer with butyl acrylate represented by formula (2):

The mass of dimethylaminopropyl acrylamide is preferably from 1 to 30, based on 100 parts by mass of the total of dimethylaminopropyl acrylamide and butyl acrylate. Quantities. Here, quantitative analysis of dimethylaminopropyl acrylamide and butyl acrylate was carried out by GPC and NMR.

Further, the component (C) is more preferably a weight average molecular weight of 10,000 to 30,000. Here, the weight average molecular weight is a value obtained by gel permeation chromatography (GPC) using a calibration curve according to standard polystyrene. The mechanism by which the component (C) suppresses the overflow of the liquid resin composition is still unclear, but it is presumed that the affinity with the imaging surface of the semiconductor wafer surface is lowered. The commercially available product of the component (C) may, for example, be a BYK-Chemie product (trade name: DISPERBYK112, DISPERBYK116), but the component (C) is not limited to these products.

In the encapsulating resin composition, the component (A) is preferably contained in an amount of 10 to 60 parts by mass, more preferably 15 to 55 parts by mass, per 100 parts by mass of the encapsulating resin composition.

In the encapsulating resin composition, the component (B) is preferably contained in an amount of 10 to 60 parts by mass, more preferably 10 to 55 parts by mass, per 100 parts by mass of the encapsulating resin composition. When the amount is less than 10 parts by mass, the curability is likely to be deteriorated due to a decrease in reactivity, and the moisture resistance reliability and migration resistance of the liquid resin composition after curing are likely to be deteriorated. When the amount is more than 60 parts by mass, the viscosity increasing ratio tends to become too large. It is high, and it is easy to generate voids or to increase ionic impurities, which makes the reliability easy to deteriorate. When a phenol-based curing agent is used for the purpose of retarding the curing rate of the liquid resin composition, the component (B) other than the phenol-based curing agent preferably contains 5 to 15 with respect to 100 parts by mass of the encapsulating resin composition. The phenolic curing agent preferably contains 1 to 5 parts by mass based on 100 parts by mass of the encapsulating resin composition.

The component (C) is preferably 0.001 to 5.0 parts by mass from the viewpoint of suppressing the overflow of the liquid resin composition, with respect to 100 parts by mass of the liquid resin composition. More preferably, it is 0.02 to 2.5 parts by mass, and more preferably 0.03 to 2.1 parts by mass. When it is 0.02 parts by mass or more, the overflow of the liquid resin composition is satisfactorily suppressed, and when it is 2.5 parts by mass or less, the pot life of the liquid resin composition is remarkably good.

When the (D) filler is contained in the liquid resin composition, it is preferable from the viewpoint of stress relaxation and adhesion at the time of heat cycle. Examples of the component (D) include cerium oxide such as colloidal silica, hydrophobic cerium oxide, and spherical cerium oxide, talc, and the like, and spherical cerium oxide from the viewpoint of fluidity at the time of coating. Better. The component (D) is more preferably cerium oxide having an average particle diameter of 0.01 to 20 μm, more preferably cerium oxide having an average particle diameter of 0.02 to 10 μm. The commercially available product includes spheroidal cerium oxide (trade name: SO-E2) manufactured by Admatechs, spherical cerium oxide (trade name: SE2300) manufactured by Admatechs, and cerium oxide filler (product name) manufactured by the electric chemical industry. : FB5SDX), calcium carbonate filler (trade name: CS 4NA) manufactured by Ube Materials, but the component (D) is not limited to these products. Here, the average particle diameter of the component (D) was measured by a dynamic light scattering type Nanotrac particle size analyzer. The component (D) may be used singly or in combination of two or more.

When the liquid resin composition contains the rubber additive of the component (E), it is preferable from the viewpoint of relaxing the stress of the resin composition, and the component (E) is acryl rubber or urethane rubber. , silicone rubber, butadiene rubber, etc. The component (E) can be used as a solid. The form is not particularly limited, and for example, a particulate form, a powder form, or a tablet shape can be used. When it is a particulate form, for example, the average particle diameter is 0.01 to 20 μm, preferably 0.02 to 10 μm, and more preferably 0.03 to 5 μm. The component (E) can be used in the form of a liquid at normal temperature, and examples thereof include polybutadiene having a low average molecular weight, butadiene/acrylonitrile copolymer, polyisoprene, and polycyclic ring. Poly(propylene oxide), polydiorganosiloxane. Further, the component (E) may be one having a terminal having a reaction with an epoxy group, and these may be either solid or liquid. For the commercially available products, CTBN1300, ATBN1300-16, CTBN1008-SP, Dow Corning Toray polyoxyethylene rubber powder (trade name: AY), and JSR rubber can be used. Powder (trade name: XER81) or the like, but the component (E) is not limited to these products. The component (E) may be used singly or in combination of two or more.

If the liquid resin composition contains a coupling agent belonging to the component (F), From the viewpoint of the adhesion of the liquid resin composition, the component (F) may, for example, be 3-glycidoxypropyltrimethoxydecane, 3-aminopropyltrimethoxydecane or vinyl. Trimethoxydecane, p-styryltrimethoxydecane, 3-methylpropenyloxypropylmethyltrimethoxydecane, 3-propenyloxypropyltrimethoxydecane, 3-ureidopropyl Triethoxy decane, 3-mercaptopropyltrimethoxydecane, bis(triethoxymethylpropyl)tetrasulfide, 3-isocyanatopropyltriethoxydecane, etc., among them, 3- Glycidoxypropyltrimethoxydecane and 3-aminopropyltrimethoxydecane are preferred from the viewpoint of the adhesion of the liquid resin composition. The commercially available products include KBM403, KBE903, KBE9103 and the like manufactured by Shin-Etsu Chemical Co., Ltd., but the component (F) is not limited to these products. The component (F) may be used singly or in combination of two or more.

The component (D) is preferably contained in an amount of from 0.1 to 90 parts by mass, more preferably from 0.5 to 50 parts by mass, per 100 parts by mass of the liquid resin composition. When it is 0.1 to 90 parts by mass, it is possible to prevent deterioration of the injectability while suppressing an increase in the linear expansion coefficient.

The component (E) is preferably contained in an amount of from 0.1 to 30 parts by mass, more preferably from 0.5 to 25 parts by mass, still more preferably from 1 to 20 parts by mass, per 100 parts by mass of the liquid resin composition.

When the amount of the component (E) is 0.1 part by mass or more, the stress of the resin composition is moderated, and when it is 30 parts by mass or less, the moisture resistance reliability is not lowered.

The component (F) is preferably contained in an amount of from 0.05 to 15 parts by mass, more preferably from 0.1 to 10 parts by mass, per 100 parts by mass of the liquid resin composition. When the amount is 0.05 parts by mass or more, the adhesion is improved, and the moisture resistance reliability of the liquid resin composition after curing is changed to be good. When the amount is 15 parts by mass or less, the foaming of the liquid resin composition is suppressed.

In the liquid resin composition, a thixotropic agent for improving workability, a pigment such as carbon black, an ion-retaining agent, a dye, and a consumer may be further blended as needed within the scope of the object of the present invention. A foaming agent, a foam breaker, an antioxidant, other additives, and the like may further be formulated with a reactive diluent, an organic solvent, or the like. In particular, carbon black is preferably added in order to block the liquid resin composition for sealing after curing and to prevent malfunction of the semiconductor wafer. However, in the present invention, from the viewpoint of suppressing the overflow of the liquid resin composition, it is preferred to contain no organic solvent having a low boiling point.

The liquid resin composition of the present invention can be obtained by stirring, melting, mixing, and dispersing, for example, simultaneously or separately, the components (A) to (C) and other additives are heat-treated as needed. In particular, when the component (B) is in a solid state, if the resin is directly mixed, the viscosity of the resin is increased and the workability is remarkably deteriorated. Therefore, it is preferred to first liquefy by heating and then mix with the component (A). The apparatus for mixing, stirring, dispersing, etc. is not particularly limited, and a kneading machine equipped with a stirring and heating device, a three-roll mill, a ball mill, a planetary mixer, a bead mill, etc. can be used. . Further, these devices may be used in combination as appropriate.

The liquid resin composition of the present invention preferably has a viscosity of from 1 to 100 Pa‧s at a temperature of 25 °C. Here, the viscosity is a viscometer made by Brookfield. No.: DV-1).

The hardening of the liquid resin composition of the present invention is preferably carried out at 80 to 165 ° C for 1 to 150 minutes.

The liquid resin composition of the present invention is preferably used as a packaging material for a semiconductor, and more preferably used as an encapsulating material for an image element semiconductor.

Fig. 1 is a diagram showing an example of a schematic view of a cross section of an image sensor module. The image sensor module 1 detects the light passing through the lens 8 (indicated by a broken line in the first drawing) by the microlens 4 and is detected by the photodiode 3. Fig. 3 is a schematic view for explaining an example of use of the liquid resin composition of the present invention. After the substrate 22 used in the image sensor module is bonded to the pad 231 formed on the semiconductor wafer 23, the semiconductor package material 21 is filled between the substrate 22 and the semiconductor wafer 23 by using the dispenser 30. After the semiconductor package material 21 is filled, the substrate 22 and the semiconductor wafer 23 can be packaged by heat curing.

Here, examples of the substrate include an epoxy resin, a glass epoxy resin, and a polyimide resin, but are not limited thereto. A pad (bump) may be a solder alloy made of tin, lead, copper, tantalum, silver, zinc, indium, or the like. From the viewpoint of environmental problems, a lead-free solder alloy is preferable, but is not limited thereto. Wait.

As described above, in the liquid resin composition of the present invention, the flip chip mounted body in which the overflow is suppressed can be easily produced.

[Examples]

Hereinafter, the present invention will be described based on examples, but the present invention is not limited to these examples. In the following examples, parts and % are by weight and % by weight unless otherwise specified.

[Examples 1 to 12, Comparative Examples 1 to 6]

The liquid resin composition was prepared by blending as shown in Tables 1 and 2.

[Measurement of overflow length]

The mirror-polished Si substrate was subjected to O ₂ plasma treatment (400 W, 5 minutes), and thereafter, placed in a desiccator for 2 to 24 hours. On the O ₂ plasma-treated Si substrate, the liquid resin composition filled in the syringe was 0.25 mg discharged from a 23 G needle, potted, and cured at 120 ° C for 30 minutes. After hardening, the length of the overflow was measured using an optical microscope. The results are shown in Tables 1 and 2.

[Measurement of shelf life]

The initial viscosity of the liquid resin composition for encapsulation of 5 g obtained in each of Examples 1 to 12 and Comparative Examples 1, 5 and 6 was measured at 25 ° C using a Brookfield viscosity meter (Model: DV-1). The viscosity change at 25 ° C of 5 g of the liquid resin composition for encapsulation after 24 hours at room temperature was measured by the same viscosity meter. (The viscosity after 24 hours is maintained) / (Initial viscosity) is less than 2 times and is marked as ○, 2 to 5 times is marked as △, and when it is more than 5 times, it is marked as ×. The results are shown in Tables 1 and 2.

As is apparent from Tables 1 and 2, the overflow lengths in Examples 1 to 12 were 10 μm or less, and in particular, the overflow lengths in Examples 1 to 6, 8 to 12 using the phenolic curing agent as the component (B) were 0 to 5 μm. And for better. Further, in Examples 1 to 12, the viscosity within 24 hours was increased to 5 times or less and the shelf life was good, and in Examples 2 to 12 in which the component (C) was in the range of 0.02 to 2.5 parts by mass, it was 24 hours. The viscosity within the rise was less than 2 times and the shelf life was significantly good. On the other hand, in Comparative Examples 1 to 6 which did not contain the component (C), the overflow length was 30 to 50 μm and was long.

As described above, since the liquid resin composition of the present invention suppresses spillage and has a long shelf life, it is suitable as a sealing material for a semiconductor element, and is particularly suitable. As a packaging material for a flip chip mount, it is also very suitable as a package material for a flip chip mount used for an image element.

The invention name of the present invention is a liquid resin composition, a flip chip mounting body, and a method for producing the same, and the patent application scope is a liquid resin composition, a semiconductor packaging material, an image component packaging material, a flip chip mounting body, and Its manufacturing method. However, the drawing of the present invention is a schematic diagram illustrating the structure of the image sensor module and the use of the liquid resin composition. These figures are not sufficient to represent the technical features of the present invention, so there is no representative representative figure in this case.

Claims (8)

A liquid resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) a copolymer of dimethylaminopropyl acrylamide and butyl acrylate. The liquid resin composition according to claim 1, wherein the component (B) is at least selected from the group consisting of a phenolic curing agent, an amine curing agent, an acid anhydride curing agent, and an imidazole curing agent. 1 species. The liquid resin composition according to the first aspect of the invention, wherein the component (C) is 0.02 to 2.5 parts by mass based on 100 parts by mass of the liquid resin composition. The liquid resin composition according to the second aspect of the invention, wherein the component (B) contains a phenolic curing agent, and the phenolic curing agent 1 to 100 parts by mass of the liquid resin composition 50 parts by mass. A packaging material for a semiconductor comprising the liquid resin composition according to claim 1 of the patent application. An encapsulating material for an image element, which is a packaging material for a semiconductor according to item 5 of the patent application. A flip chip mounting body comprising the cured product of the liquid resin composition according to claim 1 of the patent application. A method for manufacturing a flip chip mount is to be packaged using a semiconductor package material according to claim 5 of the patent application.